WO2013011614A1 - Method for manufacturing film for film capacitor, film, and film capacitor - Google Patents

Method for manufacturing film for film capacitor, film, and film capacitor Download PDF

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Publication number
WO2013011614A1
WO2013011614A1 PCT/JP2012/003360 JP2012003360W WO2013011614A1 WO 2013011614 A1 WO2013011614 A1 WO 2013011614A1 JP 2012003360 W JP2012003360 W JP 2012003360W WO 2013011614 A1 WO2013011614 A1 WO 2013011614A1
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Prior art keywords
film
metal
vapor deposition
capacitor
film body
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PCT/JP2012/003360
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French (fr)
Japanese (ja)
Inventor
啓右 大塚
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ダイキン工業株式会社
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Publication of WO2013011614A1 publication Critical patent/WO2013011614A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/06—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00 with provision for removing metal surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Definitions

  • the present invention relates to a double-sided metallized film in which a metal film is formed on both sides, a film capacitor provided with this film, and a method for producing this film.
  • a film capacitor (metalized film capacitor) in which a metal film is deposited on a film surface to form a dielectric electrode.
  • This type of film capacitor is used in, for example, electronic equipment and electrical equipment, and has low loss and excellent reliability as compared with electrolytic capacitors. For this reason, metallized film capacitors are also used as smoothing capacitors for electronic circuits such as air conditioners and hybrid vehicles.
  • polypropylene (PP) or polyethylene terephthalate (PET) is stretched and thinned to a thickness of about several ⁇ m.
  • PP polypropylene
  • PET polyethylene terephthalate
  • a pinhole may be formed in the thickness direction of the film.
  • the film becomes an insulation defect portion, which may cause a decrease in the withstand voltage characteristic of the film capacitor, or may increase the frequency of quality defects at the time of product inspection, leading to a decrease in yield.
  • Patent Document 1 discloses a film manufacturing method capable of continuously removing the deposited metal in the insulation defect portion present in the film capacitor and improving the productivity.
  • a voltage is applied (pre-healing) between metal rolls that are in rolling contact with the front and back of the metallized film, so that insulation defects are generated by the electrical energy.
  • the vapor deposition metal of the part is melted and removed.
  • Patent Document 2 discloses that, in the production of a film on which a metal film of a film body is formed, by performing pre-healing while segmenting a metal film on one side, A technique for removing the peripheral metal film and pre-healing safely even in a double-sided metallized film is disclosed.
  • This invention is made
  • the objective is to be able to remove the metal of an insulation defect part, forming a metal film on both surfaces of the film for film capacitors by a comparatively simple process. It is to be.
  • the first invention is directed to a method for producing a film for a film capacitor.
  • the manufacturing method includes a first vapor deposition step in which a metal is deposited on one surface (22a) of the film body (22) to form a metal film (23), and a film body after the first vapor deposition step ( 22), a voltage is applied to the other surface (22b) to remove the metal film (23) around the insulation defect (30) existing in the film body (22); And a second vapor deposition step of forming a metal film (24) by vapor-depositing a metal on the other surface (22b) of the film body (22).
  • a metal film (23) is formed on one surface (22a) of the film body (22).
  • a voltage is applied to the other surface (22b) of the film body (22). Since the metal film (24) is not yet formed on the surface (22b), insulation to the surroundings is ensured even when a voltage is applied. As a result, the metal film (23) around the insulation defect (30) of the film body (22) can be removed safely and reliably.
  • a metal film (24) is formed on the other surface (22b) of the film body (22).
  • the removal portion of the metal film (23) is formed on one side of the film body (22) with the insulation defect portion (30) interposed therebetween. For this reason, in the film body (22), it is avoided that the metal films (23, 24) on both sides are short-circuited through the insulation defect portion (30).
  • the second invention is directed to a film for a film capacitor and is manufactured by the manufacturing method of the first invention.
  • the metal film (23, 24) is formed on both surfaces of the film body (22) by the manufacturing method of the first invention, and the metal film (23) around the insulation defect (30) is formed.
  • the removed film for a film capacitor is obtained. For this reason, in the film for film capacitors of the present invention, it is avoided that a short circuit occurs between the metal films (23, 24) on both sides through the insulation defect portion (30).
  • the third invention is directed to a film capacitor including a core (13) and a film for film capacitor (21) wound around the core (13).
  • the film capacitor is characterized in that the film capacitor film (21) is composed of the film capacitor film of the second invention.
  • a film capacitor having excellent insulation can be obtained by winding the film (21) of the second invention around the core (13).
  • the metal film (23) on one surface (22a) of the film body (22) after forming the metal film (23) on one surface (22a) of the film body (22), the other surface (22b) of the film body (22) (that is, the metal is not deposited)
  • the voltage is applied to the surface.
  • the metal film (23) around the insulation defect portion (30) can be reliably removed while preventing a high voltage from leaking to the winding portion of the film body (22) or the peripheral device.
  • the metal film (24) is formed on the other surface (22b) of the film body (22). In this state, since the metal film (23) around the insulation defect (30) has already been removed, insulation between the metal films (23, 24) on both sides of the film body (22) is ensured reliably. it can.
  • a film for a film capacitor can be obtained by a relatively simple manufacturing process and manufacturing apparatus through the first vapor deposition process, the removal process, and the second vapor deposition process.
  • the second invention it is possible to provide a highly reliable film (21) in which the influence of an insulation defect portion (30) such as a pinhole is suppressed.
  • the film capacitor which has a desired withstand voltage characteristic can be provided.
  • FIG. 1 is a longitudinal sectional view showing a schematic configuration of a film capacitor according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing a state in which two metallized films are overlaid.
  • FIG. 3 is a schematic configuration diagram of a film manufacturing apparatus according to an embodiment of the present invention, in which FIG. 3 (A) shows a first vapor deposition step, FIG. 3 (B) and FIG. 3 (C) show a pre-healing step, FIG. 3D shows the second vapor deposition step.
  • FIG. 4 is a cross-sectional view of a metallized film obtained by the film manufacturing method according to the present invention.
  • FIG. 3 (A) shows a first vapor deposition step
  • FIG. 3 (B) and FIG. 3 (C) show a pre-healing step
  • FIG. 3D shows the second vapor deposition step.
  • FIG. 4 is a cross-sectional view of a metallized film obtained by the film manufacturing method according to
  • FIG. 5 is a cross-sectional view of a metallized film obtained by the film manufacturing method according to the reference example.
  • FIG. 6 is a schematic configuration diagram of a film manufacturing apparatus according to Modification 1.
  • FIG. 7 is a schematic configuration diagram of a film manufacturing apparatus according to Modification 2.
  • the film capacitor (11) is used as a smoothing capacitor of a power supply circuit.
  • the film capacitor (11) includes a winding core (13), a capacitor element (20) wound around the winding core (13), and both axial ends of the capacitor element (20).
  • Insulation cover disposed so as to cover the outer peripheral surface of the capacitor element (20), and the metal terminal electrode (14) provided on each, the external terminal (16) electrically connected to each metallicon electrode (14), respectively (17).
  • the insulating cover (17), the capacitor element (20), the core (13), the metallicon electrode (14), and the external terminal (16) are sealed and covered with a sealing resin (18).
  • the winding core (13) is composed of a cylindrical resin member. In addition, you may provide a metal core part in the inside of this cylindrical winding core (13).
  • the metallicon electrode (14) is formed by spraying metal on the axial end of the capacitor element (20). The metallicon electrode (14) is electrically connected to the two metallized films (21, 21) exposed at the axial end of the capacitor element (20).
  • the external terminal (16) is electrically connected to the metallicon electrode (14) at a position corresponding to the core (13) at the base end. These external terminals (16) extend outward in the radial direction of the metallicon electrode (14), and their tips protrude outward from the sealing resin (18) and are connected to the substrate (26).
  • the insulating cover (17) is formed by rounding a sheet-like member made of a resin material along the outer peripheral surface of the cylindrical capacitor element (20) into a cylindrical shape.
  • the insulating cover (17) is provided so as to cover the entire capacitor element (20).
  • the insulating cover (17) is disposed so as to cover the outer peripheral side of the capacitor element (20).
  • the insulating cover (17) is not limited thereto, and the capacitor element (20) is sealed with a sealing resin. It may be configured to be directly sealed in (18).
  • the capacitor element (20) is formed by overlapping two metallized films (21, 21) constituting a film for a film capacitor in the thickness direction.
  • Each metal film (21) is formed on the film body (22), the first metal film (23) formed on one surface of the film body (22), and the other surface of the film body (22).
  • a second metal film (24) is made of an insulating polymer material such as polypropylene (PP), polyethylene terephthalate (PET), or polyvinylidene fluoride (PVDF). That is, the film body (22) is composed of a strip-shaped dielectric film.
  • PP polypropylene
  • PET polyethylene terephthalate
  • PVDF polyvinylidene fluoride
  • the film body (22) is often thinned by a stretching process, but the film body (22) is likely to have a pinhole, which is a factor of an insulation defect portion (30) described later in detail.
  • the first metal film (23) and the second metal film (24) are formed by depositing a metal such as aluminum on the surface of the film body (22).
  • the film manufacturing apparatus (40) of this embodiment has one vapor deposition machine (41) and one pre-healing machine (50) as shown in FIG.
  • the vapor deposition machine (41) includes an unwinding unit (42), a cooling feed unit (43), a vapor deposition unit (44), and a winding unit (45).
  • a wound film body (22) is set in the unwinding section (42).
  • the cooling feed section (43) feeds the film body (22) while cooling it.
  • a vapor deposition part (44) evaporates metal materials, such as aluminum, and vapor-deposits it on the surface of a film body (22).
  • the film body (22) is cooled by the cooling feed section (43) so as not to be deformed or melted by the high heat received from the deposited metal.
  • the film body (22) after the metal film (23, 24) is formed is wound up by the winding portion (45).
  • the pre-healing machine (50) includes a first metal roll part (51), a second metal roll part (52), and a power supply part (53).
  • the first metal roll part (51) and the second metal roll part (52) rotate so as to feed out the film body (22) in the length direction while sandwiching the film body (22).
  • the first metal roll part (51) is connected to the negative side of the power supply part (53).
  • a high negative voltage is applied to the first metal roll part (51).
  • the second metal roll part (52) is connected to the plus side of the power supply part (53).
  • the positive side of the power supply unit (53) is connected to ground (not shown).
  • negative high voltage is applied to the surface (22b) of the film body (22) where the metal film (23) is not formed out of both surfaces (22a, 22b) in the thickness direction. Is done.
  • a method for producing the metallized film (21) will be described with reference to FIG.
  • a 1st vapor deposition process, a prehealing process (removal process), and a 2nd vapor deposition process are performed in order.
  • the undeposited film body (22) is set in the unwinding portion (42), and this film body (22) is shown by the arrow in FIG. 3 (A). Sent in the direction indicated by.
  • vapor deposition metal such as aluminum adheres to one surface (22a) of the film body (22).
  • the deposited metal is cooled by the cooling feed section (43), whereby the first metal film (23) made of aluminum is sequentially formed on the surface of the film body (22).
  • the film body (22) in which the metal film (23) is formed only on one side is wound around the winding portion (45).
  • a pre-healing process is performed after the first vapor deposition process.
  • the film body (22) having the metal film (23) formed on only one side is in the length direction between the two metal roller portions (51, 52). Sent out.
  • a voltage is appropriately applied to the metal roller portions (51, 52) from the power source portion (53). This voltage application ON / OFF can be switched, for example, by appropriately detecting the insulation state of the film body (22).
  • a metal enters the pinhole (31) by the first vapor deposition step. Constitutes an insulation defect (30). In the pre-healing step, the insulation defect (30) and the metal film around it are removed.
  • the metal in the pinhole (31) is melted and removed by electric energy.
  • the metal film around the open end of the pinhole (31) is also melted and removed.
  • a removal portion (32) where the metal film does not exist is formed in a portion corresponding to the opening of the pinhole (31) (see FIG. 3C).
  • the film body (22) subjected to the pre-healing process as described above is wound up again by a winding unit (not shown).
  • the second vapor deposition step is performed after the pre-healing step.
  • the second metal film (24) is formed on the film body (22) on the side opposite to the first metal film (23).
  • a film body (22) in which a metal film (23) is formed on only one side is set in the unwinding portion (42). (22) is sent in the direction indicated by the arrow in FIG.
  • a vapor deposition metal such as aluminum adheres to the surface (22b).
  • the deposited metal is cooled by the cooling feed section (43), whereby the second metal film (24) made of aluminum is sequentially formed on the film body (22).
  • the film body (22) on which the metal films (23, 24) are formed on both sides is wound around the winding portion (45).
  • the metallized film (21) obtained as described above has a cross-sectional shape as shown in FIG.
  • the first metal film (23) obtained in the first vapor deposition step is formed on one surface (22a) of the film body (22).
  • a removal portion (32) is formed in a portion corresponding to the pinhole (31) by the pre-healing step.
  • the second metal film (24) obtained in the second vapor deposition step is formed on the other surface (22b) of the film body (22).
  • the vapor deposition metal in the second vapor deposition step may enter the pinhole (31), and the metal (35) may exist in the pinhole (31) (FIG. 4). See).
  • the first metal film (23) and the second metal film (24) are separated from each other via the removal portion (32). For this reason, in the metallized film (21) of this embodiment, insulation of both metal films (23, 24) is ensured.
  • FIG. 5 shows the metallized film (100) of the reference example.
  • This metallized film (100) is obtained by forming a metal film (102, 103) on both sides of a film body (101) and then performing a pre-healing process by taking some insulation measures.
  • a cut portion (105) corresponding to the pinhole (104) is formed for each metal film (102, 103). That is, in the metallized film (21) of the present embodiment, the removal portion (32) is formed only on the metal film (23) on one side, whereas in the metallized film (100) of the reference example, the metal on both sides is formed. Cut portions (105, 105) are formed in the membranes (102, 103), respectively.
  • the metallized film (21) can be easily manufactured through the first vapor deposition step, the pre-healing step, and the second vapor deposition step without performing the mask processing or the like as in the conventional example. Therefore, it is possible to simplify the manufacturing process and manufacturing equipment of the metallized film (21), and thus reduce the manufacturing cost.
  • the first metal film (23) and the second metal film (24) are separated via the removal portion (32).
  • the insulation of both metal films (23, 24) can be reliably ensured, and the reliability of the metallized film (21), and thus the film capacitor (11), can be ensured.
  • a pre-healing unit (60) is incorporated in a single-sided vapor deposition machine (41). That is, in the vapor deposition machine (41) shown in FIG. 6, a pre-healing unit similar to the pre-healing machine (50) of the above-described embodiment is disposed in a line between the evaporation unit (44) and the winding unit (45). (60) is provided.
  • the film body (22) after passing through the vapor deposition section (44) passes through the pre-healing section (60).
  • the insulation defect portion (30) and the surrounding metal are removed in the same manner as in the above embodiment.
  • the film body (22) subjected to the pre-healing process as described above is wound around the winding unit (45), and then the second vapor deposition step is performed in the same manner as in the first embodiment.
  • the film manufacturing apparatus (40) can be simplified by incorporating the pre-healing unit (60) into the single-sided vapor deposition machine (41).
  • a pre-healing unit (60) is incorporated in a double-sided vapor deposition machine (70). That is, in the vapor deposition machine (70), the unwinding portion (42), the first cooling feed portion (43a), the first vapor deposition portion (44a), the pre-healing portion ( 60), the 2nd cooling feed part (43b), the 2nd vapor deposition part (44b), and the winding-up part (45) are provided.
  • the first vapor deposition step is performed, and the first metal film (23) is formed on one surface (22a) of the film body (22).
  • the pre-healing part (60) the pre-healing process is performed, and the insulating defect part (30) and the surrounding metal are removed.
  • the second vapor deposition section (44b) the second vapor deposition step is performed, and the second metal film (24) is formed on the other surface (22b) of the film body (22).
  • the film manufacturing apparatus (40) can be further simplified by incorporating the pre-healing unit (60) into the double-sided vapor deposition apparatus (70).
  • a high voltage with a negative potential is applied to the non-deposition side surface (22b) of the film body (22), but a high voltage with a positive potential is not deposited on the film body (22). You may apply to the side surface (22b).
  • the present invention is useful for a film, a film capacitor provided with the film, and a method for producing the film.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

This manufacturing method for a film for a film capacitor is provided with: a first vapor deposition step for vapor deposition of metal on one surface (22a) of a film body (22) and formation of a metal film (23); an elimination step for applying a voltage to the other surface (22b) of the film body (22) and eliminating the metal film (23) around an insulating defect part (30) present in the film body (22) after the first vapor deposition step; and a second vapor deposition step for vapor deposition of metal on the other surface (22b) of the film body (22) and forming a metal film (24) after the elimination step.

Description

フィルムコンデンサ用のフィルムの製造方法、フィルム、及びフィルムコンデンサFilm manufacturing method for film capacitor, film, and film capacitor
　本発明は、両面に金属膜が形成される両面金属化フィルムと、このフィルムを備えたフィルムコンデンサと、このフィルムの製造方法に関するものである。 The present invention relates to a double-sided metallized film in which a metal film is formed on both sides, a film capacitor provided with this film, and a method for producing this film.
　従来より、フィルム表面に金属膜を蒸着して誘電体の電極とするフィルムコンデンサ（金属化フィルムコンデンサ）が知られている。この種のフィルムコンデンサは、例えば電子機器や電気機器に利用され、電解コンデンサと比較すると低損失であり信頼性にも優れている。このため、金属化フィルムコンデンサは、例えば空調機やハイブリッド自動車等の電子回路の平滑コンデンサとしても利用されている。 Conventionally, a film capacitor (metalized film capacitor) is known in which a metal film is deposited on a film surface to form a dielectric electrode. This type of film capacitor is used in, for example, electronic equipment and electrical equipment, and has low loss and excellent reliability as compared with electrolytic capacitors. For this reason, metallized film capacitors are also used as smoothing capacitors for electronic circuits such as air conditioners and hybrid vehicles.
　ところで、この種のフィルムコンデンサ用のフィルム材料は、ポリプロピレン（ＰＰ）やポリエチレンテレフタラート（ＰＥＴ）を延伸して厚さ数μｍ程度に薄膜化したものが使われるが、延伸による薄膜化工程において、フィルムの厚さ方向にピンホールが形成されることがある。このピンホールはフィルムが絶縁欠陥部となり、フィルムコンデンサの耐電圧特性の低下を招いたり、製品検査時における品質不良の頻度が多くなって歩留まりの悪化を招いたりすることがあった。 By the way, as the film material for this type of film capacitor, polypropylene (PP) or polyethylene terephthalate (PET) is stretched and thinned to a thickness of about several μm. In the thinning process by stretching, A pinhole may be formed in the thickness direction of the film. In the pinhole, the film becomes an insulation defect portion, which may cause a decrease in the withstand voltage characteristic of the film capacitor, or may increase the frequency of quality defects at the time of product inspection, leading to a decrease in yield.
　上記課題を解決する方法として、特許文献１では、フィルムコンデンサに存在する絶縁欠陥部の蒸着金属を連続的に除去し、生産性を向上することができるフィルムの製造方法が開示されている。この製造方法では、１枚の連続な金属化フィルムを連続して巻き取りながら、金属化フィルムの表裏に転接する金属ロール間に電圧を印加（プレヒーリング）することで、その電気エネルギーにより絶縁欠陥部の蒸着金属を溶融除去するようにしている。 As a method for solving the above problem, Patent Document 1 discloses a film manufacturing method capable of continuously removing the deposited metal in the insulation defect portion present in the film capacitor and improving the productivity. In this manufacturing method, while continuously winding one continuous metallized film, a voltage is applied (pre-healing) between metal rolls that are in rolling contact with the front and back of the metallized film, so that insulation defects are generated by the electrical energy. The vapor deposition metal of the part is melted and removed.
　しかしながら、従来のプレヒーリング方法では、両面に金属膜が形成された両面金属化フィルムに対してプレヒーリングを行うことは困難であった。両面蒸着フィルムでは、金属膜に電圧を印加したときに、作業者がフィルムコンデンサの端部に触れていた場合には、長さ方向に連続する金属膜を導通して金属膜全体に電圧が印加された状態となるため、安全性が損なわれる可能性があるためである。 However, with the conventional pre-healing method, it is difficult to perform pre-healing on a double-sided metallized film having a metal film formed on both sides. In a double-sided vapor-deposited film, when a voltage is applied to the metal film, if the operator touches the end of the film capacitor, the metal film continuous in the length direction is conducted and the voltage is applied to the entire metal film. This is because there is a possibility that the safety may be impaired.
　このような課題を解決する手段として、特許文献２には、フィルム体の金属膜が形成されるフィルムの製造時において、片側の金属膜をセグメント化しつつプレヒーリングを行うことで、絶縁欠陥部の周辺の金属膜を除去し、両面金属化フィルムにおいても安全にプレヒーリングを行う技術が開示されている。 As means for solving such a problem, Patent Document 2 discloses that, in the production of a film on which a metal film of a film body is formed, by performing pre-healing while segmenting a metal film on one side, A technique for removing the peripheral metal film and pre-healing safely even in a double-sided metallized film is disclosed.
特開平３－７９０１７号公報JP-A-3-79017 特開２０１０－１０２５８号公報JP 2010-10258 A
　両面に金属膜を形成するフィルムにおいて、従来技術によるプレヒーリングを行うためには、例えば特許文献２のように、例えば金属膜をセグメント化する場合、セグメント化のための処理（例えばマスク処理）が必要となる。また、金属膜が確実にセグメント化されているか（即ち、周囲の金属膜との絶縁が確保されているか）を検査する工程も必要となる。このため、製造設備や製造工程の複雑化を招き、製造コストが増大してしまうという問題があった。 In order to perform pre-healing according to the prior art in a film on which metal films are formed on both sides, for example, when segmenting a metal film, for example, as in Patent Document 2, segmentation processing (for example, mask processing) is performed. Necessary. In addition, a step of inspecting whether the metal film is surely segmented (that is, whether insulation with the surrounding metal film is ensured) is required. For this reason, there has been a problem in that the manufacturing equipment and the manufacturing process are complicated and the manufacturing cost increases.
　本発明は、かかる点に鑑みてなされたものであり、その目的は、比較的簡素な工程により、フィルムコンデンサ用フィルムの両面に金属膜を形成しつつ、絶縁欠陥部の金属を除去できるようにすることである。 This invention is made | formed in view of this point, The objective is to be able to remove the metal of an insulation defect part, forming a metal film on both surfaces of the film for film capacitors by a comparatively simple process. It is to be.
　第１の発明は、フィルムコンデンサ用のフィルムの製造方法を対象とする。そして、この製造方法は、フィルム体（22）の一方の面（22a）に金属を蒸着して金属膜（23）を形成する第１蒸着工程と、前記第１蒸着工程の後のフィルム体（22）の他方の面（22b）に電圧を印加し、該フィルム体（22）に存在する絶縁欠陥部（30）周辺の金属膜（23）を除去する除去工程と、前記除去工程の後のフィルム体（22）の他方の面（22b）に金属を蒸着して金属膜（24）を形成する第２蒸着工程とを備えていることを特徴とする。 The first invention is directed to a method for producing a film for a film capacitor. The manufacturing method includes a first vapor deposition step in which a metal is deposited on one surface (22a) of the film body (22) to form a metal film (23), and a film body after the first vapor deposition step ( 22), a voltage is applied to the other surface (22b) to remove the metal film (23) around the insulation defect (30) existing in the film body (22); And a second vapor deposition step of forming a metal film (24) by vapor-depositing a metal on the other surface (22b) of the film body (22).
　第１の発明では、まず、第１蒸着工程において、フィルム体（22）の一方の面（22a）に金属膜（23）が形成される。次いで、除去工程において、フィルム体（22）の他方の面（22b）に電圧が印加される。この面（22b）には、未だ金属膜（24）が形成されていないため、電圧を印加しても周囲への絶縁が確保される。その結果、フィルム体（22）の絶縁欠陥部（30）の周辺の金属膜（23）を安全且つ確実に除去できる。次いで、第２蒸着工程において、フィルム体（22）の他方の面（22b）に金属膜（24）が形成される。 In the first invention, first, in the first vapor deposition step, a metal film (23) is formed on one surface (22a) of the film body (22). Next, in the removing step, a voltage is applied to the other surface (22b) of the film body (22). Since the metal film (24) is not yet formed on the surface (22b), insulation to the surroundings is ensured even when a voltage is applied. As a result, the metal film (23) around the insulation defect (30) of the film body (22) can be removed safely and reliably. Next, in the second vapor deposition step, a metal film (24) is formed on the other surface (22b) of the film body (22).
　以上のようにして得られたフィルムコンデンサ用フィルムでは、絶縁欠陥部（30）を挟んでフィルム体（22）の片側に金属膜（23）の除去部が形成される。このため、フィルム体（22）では、両側の金属膜（23,24）が絶縁欠陥部（30）を通じて短絡してしまうことが回避される。 In the film for a film capacitor obtained as described above, the removal portion of the metal film (23) is formed on one side of the film body (22) with the insulation defect portion (30) interposed therebetween. For this reason, in the film body (22), it is avoided that the metal films (23, 24) on both sides are short-circuited through the insulation defect portion (30).
　第２の発明は、フィルムコンデンサ用フィルムを対象とし、第１の発明の製造方法によって製造されたことを特徴とする。 The second invention is directed to a film for a film capacitor and is manufactured by the manufacturing method of the first invention.
　第２の発明では、第１の発明の製造方法によって、フィルム体（22）の両面に金属膜（23,24）が形成され、且つ絶縁欠陥部（30）の周囲の金属膜（23）が除去されたフィルムコンデンサ用フィルムが得られる。このため、本発明のフィルムコンデンサ用フィルムでは、絶縁欠陥部（30）を通じて両側の金属膜（23,24）の間で短絡が生じることが回避される。 In the second invention, the metal film (23, 24) is formed on both surfaces of the film body (22) by the manufacturing method of the first invention, and the metal film (23) around the insulation defect (30) is formed. The removed film for a film capacitor is obtained. For this reason, in the film for film capacitors of the present invention, it is avoided that a short circuit occurs between the metal films (23, 24) on both sides through the insulation defect portion (30).
　第３の発明は、巻芯（13）と、該巻芯（13）に巻回されるフィルムコンデンサ用フィルム（21）とを備えたフィルムコンデンサを対象とする。そして、このフィルムコンデンサは、前記フィルムコンデンサ用フィルム（21）が、第２の発明のフィルムコンデンサ用フィルムで構成されていることを特徴とする。 The third invention is directed to a film capacitor including a core (13) and a film for film capacitor (21) wound around the core (13). The film capacitor is characterized in that the film capacitor film (21) is composed of the film capacitor film of the second invention.
　第３の発明では、第２の発明のフィルム（21）が巻芯（13）に巻回されることで、絶縁性に優れたフィルムコンデンサが得られる。 In the third invention, a film capacitor having excellent insulation can be obtained by winding the film (21) of the second invention around the core (13).
　本発明によれば、フィルム体（22）の一方の面（22a）に金属膜（23）を形成した後、このフィルム体（22）の他方の面（22b）（即ち、金属が未蒸着となっている面）に電圧を印加している。このため、例えば高電圧が、フィルム体（22）の巻き部やその周辺の機器等に漏れることを防止しつつ、絶縁欠陥部（30）周辺の金属膜（23）を確実に除去できる。 According to the present invention, after forming the metal film (23) on one surface (22a) of the film body (22), the other surface (22b) of the film body (22) (that is, the metal is not deposited) The voltage is applied to the surface. For this reason, for example, the metal film (23) around the insulation defect portion (30) can be reliably removed while preventing a high voltage from leaking to the winding portion of the film body (22) or the peripheral device.
　また、本発明によれば、除去工程の後、フィルム体（22）の他方の面（22b）に金属膜（24）を形成している。この状態では、絶縁欠陥部（30）の周辺の金属膜（23）が既に除去されているため、フィルム体（22）の両側の金属膜（23,24）の間での絶縁も確実に確保できる。 Further, according to the present invention, after the removing step, the metal film (24) is formed on the other surface (22b) of the film body (22). In this state, since the metal film (23) around the insulation defect (30) has already been removed, insulation between the metal films (23, 24) on both sides of the film body (22) is ensured reliably. it can.
　以上のように、本発明では、第１蒸着工程、除去工程、及び第２蒸着工程を経ることで、比較的簡素な製造工程、及び製造装置によって、フィルムコンデンサ用フィルムを得ることができる。 As described above, in the present invention, a film for a film capacitor can be obtained by a relatively simple manufacturing process and manufacturing apparatus through the first vapor deposition process, the removal process, and the second vapor deposition process.
　第２の発明では、ピンホール等の絶縁欠陥部（30）の影響を抑えた信頼性の高いフィルム（21）を提供することができる。第３の発明では、所望の耐電圧特性を有するフィルムコンデンサを提供することができる。 In the second invention, it is possible to provide a highly reliable film (21) in which the influence of an insulation defect portion (30) such as a pinhole is suppressed. In 3rd invention, the film capacitor which has a desired withstand voltage characteristic can be provided.
図１は、本発明の実施形態に係るフィルムコンデンサの概略構成を示す縦断面図である。FIG. 1 is a longitudinal sectional view showing a schematic configuration of a film capacitor according to an embodiment of the present invention. 図２は、２枚の金属化フィルムを重ね合わせた状態を示す断面図である。FIG. 2 is a cross-sectional view showing a state in which two metallized films are overlaid. 図３は、本発明の実施形態に係るフィルム製造装置の概略構成図であり、図３(Ａ)は第１蒸着工程を、図３(Ｂ)及び図３(Ｃ)はプレヒーリング工程を、図３(Ｄ)は第２蒸着工程をそれぞれ示すものである。FIG. 3 is a schematic configuration diagram of a film manufacturing apparatus according to an embodiment of the present invention, in which FIG. 3 (A) shows a first vapor deposition step, FIG. 3 (B) and FIG. 3 (C) show a pre-healing step, FIG. 3D shows the second vapor deposition step. 図４は、本発明に係るフィルムの製造方法で得られた金属化フィルムの断面図である。FIG. 4 is a cross-sectional view of a metallized film obtained by the film manufacturing method according to the present invention. 図５は、参考例に係るフィルムの製造方法で得られた金属化フィルムの断面図である。FIG. 5 is a cross-sectional view of a metallized film obtained by the film manufacturing method according to the reference example. 図６は、変形例１に係るフィルム製造装置の概略構成図である。FIG. 6 is a schematic configuration diagram of a film manufacturing apparatus according to Modification 1. 図７は、変形例２に係るフィルム製造装置の概略構成図である。FIG. 7 is a schematic configuration diagram of a film manufacturing apparatus according to Modification 2.
　以下、本発明の実施形態を図面に基づいて説明する。なお、以下の好ましい実施形態の説明は、本質的に例示に過ぎず、本発明、その適用物或いはその用途を制限することを意図するものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that the following description of the preferred embodiment is merely illustrative in nature and is not intended to limit the present invention, its application, or its use.
　　－全体構成－
　本実施形態に係るフィルムコンデンサ（11）は、電源供給回路の平滑コンデンサ等に用いられる。図１に示すように、フィルムコンデンサ（11）は、巻芯（13）と、該巻芯（13）に巻回されるコンデンサ素子（20）と、該コンデンサ素子（20）の軸方向両端部にそれぞれ設けられるメタリコン電極（14）と、各メタリコン電極（14）にそれぞれ電気的に接続される外部端子（16）と、コンデンサ素子（20）の外周面を覆うように配設される絶縁カバー（17）とを備えている。絶縁カバー（17）、コンデンサ素子（20）、巻芯（13）、メタリコン電極（14）、及び外部端子（16）は、封止樹脂（18）によって封止されて覆われる。 -overall structure-
The film capacitor (11) according to this embodiment is used as a smoothing capacitor of a power supply circuit. As shown in FIG. 1, the film capacitor (11) includes a winding core (13), a capacitor element (20) wound around the winding core (13), and both axial ends of the capacitor element (20). Insulation cover disposed so as to cover the outer peripheral surface of the capacitor element (20), and the metal terminal electrode (14) provided on each, the external terminal (16) electrically connected to each metallicon electrode (14), respectively (17). The insulating cover (17), the capacitor element (20), the core (13), the metallicon electrode (14), and the external terminal (16) are sealed and covered with a sealing resin (18).
　巻芯（13）は、円筒状の樹脂部材で構成されている。なお、この円筒状の巻芯（13）の内部に金属製の芯部を設けてもよい。メタリコン電極（14）は、コンデンサ素子（20）の軸方向端部に金属を溶射することによって形成される。メタリコン電極（14）は、コンデンサ素子（20）の軸方向端部に露出する２つの金属化フィルム（21,21）と電気的に導通する。 The winding core (13) is composed of a cylindrical resin member. In addition, you may provide a metal core part in the inside of this cylindrical winding core (13). The metallicon electrode (14) is formed by spraying metal on the axial end of the capacitor element (20). The metallicon electrode (14) is electrically connected to the two metallized films (21, 21) exposed at the axial end of the capacitor element (20).
　外部端子（16）は、その基端部が巻芯（13）に対応する位置で、メタリコン電極（14）と電気的に接続している。これらの外部端子（16）は、メタリコン電極（14）の径方向外方に向かって延び、その先端部が封止樹脂（18）から外方に突出して基板（26）に接続している。 The external terminal (16) is electrically connected to the metallicon electrode (14) at a position corresponding to the core (13) at the base end. These external terminals (16) extend outward in the radial direction of the metallicon electrode (14), and their tips protrude outward from the sealing resin (18) and are connected to the substrate (26).
　絶縁カバー（17）は、樹脂材料からなるシート状の部材を、円筒状のコンデンサ素子（20）の外周面に沿うように丸めて円筒状にしたものである。この絶縁カバー（17）は、コンデンサ素子（20）全体を覆うように設けられている。なお、コンデンサ素子（20）の外周側を覆うように絶縁カバー（17）を配設しているが、この限りではなく、絶縁カバー（17）がなく、該コンデンサ素子（20）を封止樹脂（18）で直接、封止するような構成であってもよい。 The insulating cover (17) is formed by rounding a sheet-like member made of a resin material along the outer peripheral surface of the cylindrical capacitor element (20) into a cylindrical shape. The insulating cover (17) is provided so as to cover the entire capacitor element (20). The insulating cover (17) is disposed so as to cover the outer peripheral side of the capacitor element (20). However, the insulating cover (17) is not limited thereto, and the capacitor element (20) is sealed with a sealing resin. It may be configured to be directly sealed in (18).
　図２に示すように、コンデンサ素子（20）は、フィルムコンデンサ用フィルムを構成する２枚の金属化フィルム（21,21）が厚さ方向に重ね合わされて構成される。各金属フィルム（21）は、フィルム体（22）と、該フィルム体（22）の一方の面に形成される第１金属膜（23）と、フィルム体（22）の他方の面に形成される第２金属膜（24）とを有する。フィルム体（22）は、ポリプロピレン（ＰＰ）、ポリエチレンテレフタラート（ＰＥＴ）、ポリフッ化ビニリデン （ＰＶＤＦ）等の絶縁性の高分子材料で構成される。つまり、フィルム体（22）は、帯状の誘電体フィルムで構成される。このフィルム体（22）は、延伸処理によって薄膜化されることが多いが、フィルム体（22）では、詳細は後述する絶縁欠陥部（30）の一要因となる、ピンホールができ易くなる。第１金属膜（23）と第２金属膜（24）とは、フィルム体（22）の表面にアルミニウム等の金属を蒸着させて形成される。 As shown in FIG. 2, the capacitor element (20) is formed by overlapping two metallized films (21, 21) constituting a film for a film capacitor in the thickness direction. Each metal film (21) is formed on the film body (22), the first metal film (23) formed on one surface of the film body (22), and the other surface of the film body (22). And a second metal film (24). The film body (22) is made of an insulating polymer material such as polypropylene (PP), polyethylene terephthalate (PET), or polyvinylidene fluoride (PVDF). That is, the film body (22) is composed of a strip-shaped dielectric film. The film body (22) is often thinned by a stretching process, but the film body (22) is likely to have a pinhole, which is a factor of an insulation defect portion (30) described later in detail. The first metal film (23) and the second metal film (24) are formed by depositing a metal such as aluminum on the surface of the film body (22).
　－金属化フィルムの製造装置－
　次いで、金属化フィルム（21）の製造装置（40）について説明する。 -Metallized film production equipment-
Next, the manufacturing apparatus (40) for the metallized film (21) will be described.
　本実施形態のフィルム製造装置（40）は、図３に示すように、１つの蒸着機（41）と、１つのプレヒーリング機（50）とを有している。 The film manufacturing apparatus (40) of this embodiment has one vapor deposition machine (41) and one pre-healing machine (50) as shown in FIG.
　蒸着機（41）は、巻き出し部（42）、冷却送り部（43）、蒸着部（44）、及び巻き取り部（45）を備えている。巻き出し部（42）には、巻回された状態のフィルム体（22）がセットされる。冷却送り部（43）は、フィルム体（22）を冷却しながら送り出す。蒸着部（44）は、アルミニウム等の金属材料を蒸発させて、フィルム体（22）の表面に蒸着させる。フィルム体（22）は、蒸着金属から受ける高熱で変形・溶融しないように、冷却送り部（43）によって冷却される。巻き取り部（45）によって、金属膜（23,24）が形成された後のフィルム体（22）が巻き取られる。 The vapor deposition machine (41) includes an unwinding unit (42), a cooling feed unit (43), a vapor deposition unit (44), and a winding unit (45). A wound film body (22) is set in the unwinding section (42). The cooling feed section (43) feeds the film body (22) while cooling it. A vapor deposition part (44) evaporates metal materials, such as aluminum, and vapor-deposits it on the surface of a film body (22). The film body (22) is cooled by the cooling feed section (43) so as not to be deformed or melted by the high heat received from the deposited metal. The film body (22) after the metal film (23, 24) is formed is wound up by the winding portion (45).
　プレヒーリング機（50）は、第１金属ロール部（51）と、第２金属ロール部（52）と、電源部（53）とを備えている。第１金属ロール部（51）と第２金属ロール部（52）とは、フィルム体（22）を挟み込みながら、該フィルム体（22）を長さ方向に送り出すように回転する。第１金属ロール部（51）は、電源部（53）のマイナス側と接続している。第１金属ロール部（51）には、高圧のマイナスの電圧が印加される。第２金属ロール部（52）は、電源部（53）のプラス側に接続されている。電源部（53）のプラス側は、アース（図示省略）に接続されている。プレヒーリング機（50）では、フィルム体（22）の厚さ方向の両面（22a,22b）のうち金属膜（23）が形成されていない方の面（22b）に、マイナスの高電圧が印加される。 The pre-healing machine (50) includes a first metal roll part (51), a second metal roll part (52), and a power supply part (53). The first metal roll part (51) and the second metal roll part (52) rotate so as to feed out the film body (22) in the length direction while sandwiching the film body (22). The first metal roll part (51) is connected to the negative side of the power supply part (53). A high negative voltage is applied to the first metal roll part (51). The second metal roll part (52) is connected to the plus side of the power supply part (53). The positive side of the power supply unit (53) is connected to ground (not shown). In the pre-healing machine (50), negative high voltage is applied to the surface (22b) of the film body (22) where the metal film (23) is not formed out of both surfaces (22a, 22b) in the thickness direction. Is done.
　　－金属化フィルムの製造方法－
　次いで、金属化フィルム（21）の製造方法について、図３を参照しながら説明する。金属化フィルム（21）の製造方法では、第１蒸着工程、プレヒーリング工程（除去工程）、第２蒸着工程が順に行われる。 -Manufacturing method of metallized film-
Next, a method for producing the metallized film (21) will be described with reference to FIG. In the manufacturing method of a metallized film (21), a 1st vapor deposition process, a prehealing process (removal process), and a 2nd vapor deposition process are performed in order.
　図３(Ａ)に示すように、第１蒸着工程では、巻き出し部（42）に未蒸着状態のフィルム体（22）がセットされ、このフィルム体（22）が図３(Ａ)の矢印で示す方向に送り出される。フィルム体（22）が蒸着部（44）を通過すると、アルミニウム等の蒸着金属がフィルム体（22）の一方の面（22a）に付着する。この蒸着金属が冷却送り部（43）によって冷却されることで、フィルム体（22）の表面にアルミニウムから成る第１金属膜（23）が順次形成されていく。以上のようにして、片側のみに金属膜（23）が形成されたフィルム体（22）は、巻き取り部（45）に巻き取られていく。 As shown in FIG. 3 (A), in the first vapor deposition step, the undeposited film body (22) is set in the unwinding portion (42), and this film body (22) is shown by the arrow in FIG. 3 (A). Sent in the direction indicated by. When the film body (22) passes through the vapor deposition section (44), vapor deposition metal such as aluminum adheres to one surface (22a) of the film body (22). The deposited metal is cooled by the cooling feed section (43), whereby the first metal film (23) made of aluminum is sequentially formed on the surface of the film body (22). As described above, the film body (22) in which the metal film (23) is formed only on one side is wound around the winding portion (45).
　第１蒸着工程の後には、プレヒーリング工程が行われる。図３(Ｂ)に示すように、プレヒーリング工程では、片側のみに金属膜（23）が形成されたフィルム体（22）が、２つの金属ローラ部（51,52）の間で長さ方向に送り出される。金属ローラ部（51,52）には、電源部（53）から電圧が適宜印加される。この電圧の印加のＯＮ／ＯＦＦは、例えばフィルム体（22）の絶縁状態を適宜検出することで、切り換えられる。 A pre-healing process is performed after the first vapor deposition process. As shown in FIG. 3 (B), in the pre-healing step, the film body (22) having the metal film (23) formed on only one side is in the length direction between the two metal roller portions (51, 52). Sent out. A voltage is appropriately applied to the metal roller portions (51, 52) from the power source portion (53). This voltage application ON / OFF can be switched, for example, by appropriately detecting the insulation state of the film body (22).
　例えば図３(Ｂ)に示すように、フィルム体（22）にピンホール（31）が形成される場合、前記第１蒸着工程によって、このピンホール（31）内にまで金属が入り込み、この金属が絶縁欠陥部（30）を構成する。プレヒーリング工程では、この絶縁欠陥部（30）、及びその周辺の金属膜が除去される。 For example, as shown in FIG. 3 (B), when a pinhole (31) is formed in the film body (22), a metal enters the pinhole (31) by the first vapor deposition step. Constitutes an insulation defect (30). In the pre-healing step, the insulation defect (30) and the metal film around it are removed.
　具体的に、図３(Ｂ)の状態で、第１金属ロール部（51）にマイナスの高電圧が印加されると、ピンホール（31）内の金属が電気エネルギーによって溶融して除去される。同時に、第１金属膜（23）では、ピンホール（31）の開口端の周囲の金属膜も溶融して除去される。その結果、第１金属膜（23）には、ピンホール（31）の開口部に対応する部位に、金属膜が存在しない除去部（32）が形成される（図３(Ｃ)を参照）。以上のようにしてプレヒーリング処理が行われたフィルム体（22）は、巻き取り部（図示省略）によって再び巻き取られる。 Specifically, when a negative high voltage is applied to the first metal roll part (51) in the state of FIG. 3B, the metal in the pinhole (31) is melted and removed by electric energy. . At the same time, in the first metal film (23), the metal film around the open end of the pinhole (31) is also melted and removed. As a result, in the first metal film (23), a removal portion (32) where the metal film does not exist is formed in a portion corresponding to the opening of the pinhole (31) (see FIG. 3C). . The film body (22) subjected to the pre-healing process as described above is wound up again by a winding unit (not shown).
　プレヒーリング工程の後には、第２蒸着工程が行われる。第２蒸着工程では、フィルム体（22）において、第１金属膜（23）と逆側に第２金属膜（24）が形成される。具体的に、図３(Ｄ)に示すように、第２蒸着工程では、巻き出し部（42）に片面のみ金属膜（23）が形成されたフィルム体（22）がセットされ、このフィルム体（22）が図３(Ｄ)の矢印で示す方向に送り出される。フィルム体（22）のうち未蒸着側の面（22b）が蒸着部（44）を通過すると、この面（22b）にアルミニウム等の蒸着金属が付着する。この蒸着金属が冷却送り部（43）によって冷却されることで、フィルム体（22）にアルミニウムから成る第２金属膜（24）が順次形成されていく。以上のようにして、両側に金属膜（23,24）が形成されたフィルム体（22）は、巻き取り部（45）に巻き取られていく。 The second vapor deposition step is performed after the pre-healing step. In the second vapor deposition step, the second metal film (24) is formed on the film body (22) on the side opposite to the first metal film (23). Specifically, as shown in FIG. 3D, in the second vapor deposition step, a film body (22) in which a metal film (23) is formed on only one side is set in the unwinding portion (42). (22) is sent in the direction indicated by the arrow in FIG. When the surface (22b) on the non-deposition side of the film body (22) passes through the vapor deposition part (44), a vapor deposition metal such as aluminum adheres to the surface (22b). The deposited metal is cooled by the cooling feed section (43), whereby the second metal film (24) made of aluminum is sequentially formed on the film body (22). As described above, the film body (22) on which the metal films (23, 24) are formed on both sides is wound around the winding portion (45).
　以上のようにして得られた金属化フィルム（21）は、図４に示すような断面形状となる。金属化フィルム（21）では、フィルム体（22）の一方の面（22a）に第１蒸着工程で得られた第１金属膜（23）が形成される。第１金属膜（23）には、前記プレヒーリング工程によって、ピンホール（31）に対応する部位に除去部（32）が形成される。金属化フィルム（21）では、フィルム体（22）の他方の面（22b）に第２蒸着工程で得られた第２金属膜（24）が形成される。また、フィルム体（22）では、第２蒸着工程時の蒸着金属がピンホール（31）の内部にまで入り込み、ピンホール（31）の内部に金属（35）が存在することがある（図４を参照）。しかしながら、金属化フィルム（21）では、第１金属膜（23）と第２金属膜（24）とが除去部（32）を介して互いに離間することになる。このため、本実施形態の金属化フィルム（21）では、両者の金属膜（23,24）の絶縁が確保される。 The metallized film (21) obtained as described above has a cross-sectional shape as shown in FIG. In the metallized film (21), the first metal film (23) obtained in the first vapor deposition step is formed on one surface (22a) of the film body (22). In the first metal film (23), a removal portion (32) is formed in a portion corresponding to the pinhole (31) by the pre-healing step. In the metallized film (21), the second metal film (24) obtained in the second vapor deposition step is formed on the other surface (22b) of the film body (22). In the film body (22), the vapor deposition metal in the second vapor deposition step may enter the pinhole (31), and the metal (35) may exist in the pinhole (31) (FIG. 4). See). However, in the metallized film (21), the first metal film (23) and the second metal film (24) are separated from each other via the removal portion (32). For this reason, in the metallized film (21) of this embodiment, insulation of both metal films (23, 24) is ensured.
　なお、図５は、参考例の金属化フィルム（100）を示したものである。この金属化フィルム（100）は、フィルム体（101）の両側にそれぞれ金属膜（102,103）を形成した後、何らかの絶縁対策を講じてプレヒーリング処理を行ったものである。この金属化フィルム（100）では、各金属膜（102,103）について、それぞれピンホール（104）に対応する切除部（105）が形成される。即ち、本実施形態の金属化フィルム（21）では、片側の金属膜（23）のみに除去部（32）が形成されるのに対し、参考例の金属化フィルム（100）では、両側の金属膜（102,103）にそれぞれ切除部（105,105）が形成される。 FIG. 5 shows the metallized film (100) of the reference example. This metallized film (100) is obtained by forming a metal film (102, 103) on both sides of a film body (101) and then performing a pre-healing process by taking some insulation measures. In the metallized film (100), a cut portion (105) corresponding to the pinhole (104) is formed for each metal film (102, 103). That is, in the metallized film (21) of the present embodiment, the removal portion (32) is formed only on the metal film (23) on one side, whereas in the metallized film (100) of the reference example, the metal on both sides is formed. Cut portions (105, 105) are formed in the membranes (102, 103), respectively.
　　－実施形態の効果－
　上記実施形態では、フィルム体（22）の片側に金属膜（23）を形成した後、反対側の面に高電圧を印加してプレヒーリング処理を行うようにしている。図３(Ｂ)に示すように、フィルム体（22）の未蒸着面に高電圧を印加したとしても、その周囲に電圧が流れることがない。従って、フィルム体（22）の巻き取り部位や、その周辺機器に対する絶縁を十分に確保できる。 -Effect of the embodiment-
In the above embodiment, after the metal film (23) is formed on one side of the film body (22), a high voltage is applied to the opposite surface to perform the pre-healing process. As shown in FIG. 3B, even if a high voltage is applied to the non-deposited surface of the film body (22), no voltage flows around it. Therefore, sufficient insulation can be ensured for the winding portion of the film body (22) and its peripheral devices.
　また、上記実施形態では、従来例のようなマスク処理等を行う必要がなく、第１蒸着工程、プレヒーリング工程、第２蒸着工程を経て、容易に金属化フィルム（21）を製造できる。従って、金属化フィルム（21）の製造工程や製造設備の簡素化を図ることができ、ひいては製造コストを低減できる。 In the above embodiment, the metallized film (21) can be easily manufactured through the first vapor deposition step, the pre-healing step, and the second vapor deposition step without performing the mask processing or the like as in the conventional example. Therefore, it is possible to simplify the manufacturing process and manufacturing equipment of the metallized film (21), and thus reduce the manufacturing cost.
　しかも、上記実施形態で得られた金属化フィルム（21）では、第１金属膜（23）と第２金属膜（24）とが除去部（32）を介して離間する。その結果、両者の金属膜（23,24）の絶縁を確実に確保でき、金属化フィルム（21）、ひいてはフィルムコンデンサ（11）の信頼性を確保できる。 Moreover, in the metallized film (21) obtained in the above embodiment, the first metal film (23) and the second metal film (24) are separated via the removal portion (32). As a result, the insulation of both metal films (23, 24) can be reliably ensured, and the reliability of the metallized film (21), and thus the film capacitor (11), can be ensured.
　　〈実施形態の変形例〉
　上述した実施形態については、以下のような構成としてもよい。 <Modification of Embodiment>
About embodiment mentioned above, it is good also as following structures.
　　－変形例１－
　図６に示す変形例１のフィルム製造装置（40）は、片面式の蒸着機（41）にプレヒーリング部（60）が組み込まれている。即ち、図６に示す蒸着機（41）には、蒸発部（44）と巻き取り部（45）との間のラインに、上記実施形態のプレヒーリング機（50）と同様の、プレヒーリング部（60）が設けられている。変形例１の蒸着機（41）では、蒸着部（44）を通過した後のフィルム体（22）が、プレヒーリング部（60）を通過する。その結果、上記実施形態と同様にして、絶縁欠陥部（30）及びその周囲の金属が除去される。以上のようにして、プレヒーリング処理が行われたフィルム体（22）は、巻き取り部（45）に巻回され、その後、実施形態１と同様にして、第２蒸着工程が行われる。 -Modification 1-
In the film manufacturing apparatus (40) of Modification 1 shown in FIG. 6, a pre-healing unit (60) is incorporated in a single-sided vapor deposition machine (41). That is, in the vapor deposition machine (41) shown in FIG. 6, a pre-healing unit similar to the pre-healing machine (50) of the above-described embodiment is disposed in a line between the evaporation unit (44) and the winding unit (45). (60) is provided. In the vapor deposition machine (41) of Modification 1, the film body (22) after passing through the vapor deposition section (44) passes through the pre-healing section (60). As a result, the insulation defect portion (30) and the surrounding metal are removed in the same manner as in the above embodiment. The film body (22) subjected to the pre-healing process as described above is wound around the winding unit (45), and then the second vapor deposition step is performed in the same manner as in the first embodiment.
　以上のように、変形例１では、片面式の蒸着機（41）にプレヒーリング部（60）を組み込むことで、フィルム製造装置（40）の簡素化を図ることができる。 As described above, in Modification 1, the film manufacturing apparatus (40) can be simplified by incorporating the pre-healing unit (60) into the single-sided vapor deposition machine (41).
　　－変形例２－
　図７に示す変形例２のフィルム製造装置（40）は、両面式の蒸着機（70）にプレヒーリング部（60）が組み込まれている。即ち、蒸着機（70）には、巻き出し方向から巻き取り方向に向かって順に、巻き出し部（42）、第１冷却送り部（43a）、第１蒸着部（44a）、プレヒーリング部（60）、第２冷却送り部（43b）、第２蒸着部（44b）、巻き取り部（45）が設けられている。 -Modification 2-
In the film manufacturing apparatus (40) of Modification 2 shown in FIG. 7, a pre-healing unit (60) is incorporated in a double-sided vapor deposition machine (70). That is, in the vapor deposition machine (70), the unwinding portion (42), the first cooling feed portion (43a), the first vapor deposition portion (44a), the pre-healing portion ( 60), the 2nd cooling feed part (43b), the 2nd vapor deposition part (44b), and the winding-up part (45) are provided.
　第１蒸着部（44a）では、前記第１蒸着工程が行われ、フィルム体（22）の一方の面（22a）に第１金属膜（23）が形成される。その後、プレヒーリング部（60）では、前記プレヒーリング工程が行われ、絶縁欠陥部（30）、及びその周囲の金属が除去される。その後、第２蒸着部（44b）では、前記第２蒸着工程が行われ、フィルム体（22）の他方の面（22b）に第２金属膜（24）が形成される。 In the first vapor deposition section (44a), the first vapor deposition step is performed, and the first metal film (23) is formed on one surface (22a) of the film body (22). Thereafter, in the pre-healing part (60), the pre-healing process is performed, and the insulating defect part (30) and the surrounding metal are removed. Thereafter, in the second vapor deposition section (44b), the second vapor deposition step is performed, and the second metal film (24) is formed on the other surface (22b) of the film body (22).
　以上のように、変形例２では、両面式の蒸着機（70）にプレヒーリング部（60）を組み込むことで、フィルム製造装置（40）の更なる簡素化を図ることができる。 As described above, in Modification 2, the film manufacturing apparatus (40) can be further simplified by incorporating the pre-healing unit (60) into the double-sided vapor deposition apparatus (70).
　　－その他の実施形態－
　上記実施形態のプレヒーリング工程では、マイナス電位の高電圧をフィルム体（22）の未蒸着側の面（22b）に印加しているが、プラス電位の高電圧をフィルム体（22）の未蒸着側の面（22b）に印加してもよい。 -Other embodiments-
In the pre-healing step of the above embodiment, a high voltage with a negative potential is applied to the non-deposition side surface (22b) of the film body (22), but a high voltage with a positive potential is not deposited on the film body (22). You may apply to the side surface (22b).
　以上説明したように、本発明は、フィルムと、このフィルムを備えたフィルムコンデンサと、このフィルムの製造方法について有用である。 As described above, the present invention is useful for a film, a film capacitor provided with the film, and a method for producing the film.
13　　巻芯
21　　金属化フィルム（フィルムコンデンサ用フィルム）
22　　フィルム体
23　　第１金属膜
24　　第２金属膜
30　　絶縁欠陥部 13 roll core
21 Metallized film (film for film capacitor)
22 Film body
23 First metal film
24 Second metal film
30 Insulation defect

Claims (3)

  1. 　フィルム体（22）の一方の面（22a）に金属を蒸着して金属膜（23）を形成する第１蒸着工程と、
    　前記第１蒸着工程の後のフィルム体（22）の他方の面（22b）に電圧を印加し、該フィルム体（22）に存在する絶縁欠陥部（30）周辺の金属膜（23）を除去する除去工程と、
    　前記除去工程の後のフィルム体（22）の他方の面（22b）に金属を蒸着して金属膜（24）を形成する第２蒸着工程と
    　を備えていることを特徴とするフィルムコンデンサ用フィルムの製造方法。     A first vapor deposition step of depositing a metal on one surface (22a) of the film body (22) to form a metal film (23);
    A voltage is applied to the other surface (22b) of the film body (22) after the first vapor deposition step to remove the metal film (23) around the insulation defect (30) existing in the film body (22). Removing step to perform,
    And a second vapor deposition step of forming a metal film (24) by vapor-depositing a metal on the other surface (22b) of the film body (22) after the removing step. Manufacturing method.
  2. 　フィルムコンデンサ用フィルムであって、
    　請求項１に記載のフィルムコンデンサ用フィルムの製造方法によって製造されたことを特徴とするフィルムコンデンサ用フィルム。     A film capacitor film,
    A film for a film capacitor manufactured by the method for manufacturing a film for a film capacitor according to claim 1.
  3. 　巻芯（13）と、該巻芯（13）に巻回されるフィルムコンデンサ用フィルム（21）とを備えたフィルムコンデンサであって、
    　前記フィルムコンデンサ用フィルム（21）は、請求項２に記載のフィルムコンデンサ用フィルムで構成されていることを特徴とするフィルムコンデンサ。     A film capacitor comprising a core (13) and a film capacitor film (21) wound around the core (13),
    The film capacitor film (21) is composed of the film capacitor film according to claim 2.
PCT/JP2012/003360 2011-07-20 2012-05-23 Method for manufacturing film for film capacitor, film, and film capacitor WO2013011614A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2884509A1 (en) * 2013-12-16 2015-06-17 Siemens Aktiengesellschaft Removing faults from a self-healing film capacitor

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Publication number Priority date Publication date Assignee Title
JPH0379017A (en) * 1989-08-22 1991-04-04 Matsushita Electric Ind Co Ltd Manufacture of metallized film capacitor
JP2004095606A (en) * 2002-08-29 2004-03-25 Matsushita Electric Ind Co Ltd Method of manufacturing metallized film capacitor, and metallized film capacitor manufactured by the same
JP2010010258A (en) * 2008-06-25 2010-01-14 Daikin Ind Ltd Preheeling apparatus and method of manufacturing film capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0379017A (en) * 1989-08-22 1991-04-04 Matsushita Electric Ind Co Ltd Manufacture of metallized film capacitor
JP2004095606A (en) * 2002-08-29 2004-03-25 Matsushita Electric Ind Co Ltd Method of manufacturing metallized film capacitor, and metallized film capacitor manufactured by the same
JP2010010258A (en) * 2008-06-25 2010-01-14 Daikin Ind Ltd Preheeling apparatus and method of manufacturing film capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2884509A1 (en) * 2013-12-16 2015-06-17 Siemens Aktiengesellschaft Removing faults from a self-healing film capacitor
US9666367B2 (en) 2013-12-16 2017-05-30 Siemens Aktiengesellschaft Removing faults from a self-healing film capacitor

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