JP2009221580A - Method of rotating bottom roller and shaft seal device in electrolytic copper foil plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bottom roller having suppressed wear or breaking of a copper foil and capable of increasing carrying rate in an electrolytic copper foil plating apparatus by freely moving the bottom roller with the carry of the copper foil to solve problems that the wear or the breaking of the copper foil occurs by involving of a liquid in the increase of the carrying rate in a driving system of moving the bottom roller at the same speed as the speed of the carry of the copper foil. <P>SOLUTION: It is required that the rotation resistance of the bottom roller is lowered utmost so as to move the bottom roller with the carry of the copper foil. An air bearing is used to support the weight of the bottom roller and in the shaft seal device for a treating liquid, a non-contact type shaft seal device having labyrinth structure with the supply of compressed air is used. The insulation from the treating liquid is secured by using a ceramic bearing for the bottom roller. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a bottom roller rotating method in a processing apparatus for continuously surface-treating electrolytic copper foil wound in a roll shape, and a shaft seal for sealing a processing liquid leaking from between the bottom roller rotating shaft and an outer ring portion. Relates to the device.

Conventionally, the rotation of the roller used for copper foil conveyance is driven to be the same as the copper foil conveyance, so that the force for copper foil conveyance is not biased to a part of the copper foil.

Generally, the bottom roller in the processing liquid is a contact-type seal on the rotating shaft so that the processing liquid does not leak to the outside. Further, although there is a shaft seal device that improves the sealing performance by using a labyrinth structure, a high rotational speed is required.

As described above, the apparatus for continuously surface-treating the electrolytic copper foil is made such that the roller is driven at the same speed as the copper foil so that the force applied to the copper foil for conveyance is dispersed. However, when the processing speed is increased, the bottom roller that has a sprocket or the like and is driven from the outside is in the processing liquid, so that sagging or pulsation of the copper foil occurs due to entrainment of the processing liquid, and the bottom roller and the copper foil Rubbing occurs between the two, and scratches and cuts of the copper foil occur.

The shaft seal device of the bottom roller rotary bearing portion is conventionally a contact type and has a large rotational resistance. However, since the driving force was applied from the outside, it was not necessary to worry about the rotational resistance so much. However, in the case of the present invention, it is necessary to suppress the rotational resistance as much as possible because the bottom roller is driven to convey the copper foil.

This invention is made | formed in view of such a point, The objective of the copper foil which occurs at the time of processing at high speed by performing a plating process to electrolytic copper foil, without driving a bottom roller. It is to reduce scratches and cuts.

  In order to achieve the above object, the present invention is based on the following (1) and (2).

The invention of (1) is a plating apparatus for continuously plating a copper foil manufactured by electrolytic deposition and wound up in a roll shape, and has a driving force for conveying the copper foil in the processing solution. An electrolytic copper foil plating apparatus comprising a bottom roller that does not. As a result, when the processing speed is increased, sagging or pulsation of the copper foil occurs due to the inclusion of the processing liquid in the bottom roller, and rubbing occurs between the bottom roller and the copper foil, resulting in scratching and cutting of the copper foil. The bottom roller moves along with the copper foil transport (follows) to reduce the scratches and cuts on the copper foil.

According to the invention of (2), in the shaft sealing device for the bottom roller rotating shaft, the receiving portion of the rotating shaft of the bottom roller has a ceramic structure,
A shaft seal device having a labyrinth structure on the outer ring portion that receives the rotation shaft of the bottom roller,
The shaft seal device of the electrolytic copper foil plating apparatus according to claim 1, further comprising a mechanism for supplying compressed air between the rotating shaft and the outer ring portion at the center of the outer ring portion of the labyrinth structure. The rotating shaft contact portion, which is the receiving portion of the rotating shaft of the bottom roller, has a ceramic structure, thereby increasing the dielectric strength effect between the treatment liquid and the bottom roller. And by supplying compressed air between the outer ring part having the labyrinth structure and the rotating shaft, the sealing action to push the liquid back into the liquid by the compressed air and the bearing and the outer ring part are brought into non-contact by sending the compressed air. Rotational resistance is reduced.

As described above, according to the invention of (1), when the processing speed is increased by moving the bottom roller in accordance with the conveyance of the copper foil, the scratches and cuts of the copper foil caused by the entrainment of the processing liquid are reduced. To do. Further, productivity can be improved by increasing the processing speed. In particular, it is effective for electrolytic copper foil plating treatment on ultrathin copper foil such as 9 μm which is easy to cut because it is thinner and has a higher added value.

According to the invention of (2), the effect exhibited by the invention of (1) is achieved, and the sealing performance is further improved. In addition, shaft wear due to non-contact can be reduced and insulation can be improved.

  Hereinafter, implementation of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic view of an electrolytic copper foil plating apparatus. 2 is a left half view of the AA arrow cross section in FIG. 1, and FIG. 3 is a front view and a side cross sectional view of the shaft seal device.

  As shown in FIG. 1, the copper foil main body 2 is pulled out as shown by an arrow 7 indicating the flow direction of the copper foil from the roll-shaped copper foil 1 wound in a roll shape before processing. Further, the copper foil main body 2 is wound around the upper roller 3 and passed, wound around the bottom roller 6 while being immersed in the processing liquid 5a filled in the processing liquid tank 4, and pulled up to be the next upper roller 3 Is passed through the next treatment liquid (5b, 5c). Finally, it winds around the upper roller 3 and passes through, and is wound on the roll-shaped copper foil 8 wound in the processed roll shape.

  In FIG. 1, three treatment liquid tanks 4 (treatment tanks) are arranged, and the treatment liquids therein are filled with 5a, 5b, and 5c. For example, 5a represents a pretreatment cleaning bath, 5b represents a plating bath, and 5c represents a post-treatment washing bath. The number of processing tanks (processing liquid tanks) 4 increases or decreases depending on the processing steps of the copper foil body 2.

Incidentally, the copper foil main body 2 has a width of about 1,350 mm and a thickness of 9 μm to 70 μm. The conveyance speed of copper foil processing is about 50 m / min. As described above, the number of treatment liquid tanks varies depending on the treatment content of the copper foil. The inside of the treatment liquid is a strong acid such as copper sulfate or sulfuric acid, or can be changed by a necessary treatment.

In FIG. 2, the bottom roller 6 and the ceramic bearing 11c are fixed by a collar 30 and rotate integrally. Further, liquid leakage from the gap between the bottom roller 6 and the ceramic bearing 11c is prevented by the O-ring. The ceramic bearings 11 a and 11 b are fixed to the bottom roller 6 by a ceramic bearing holder 31. The bottom roller 6 and the coating film 16 are also fixed and rotate integrally.

The treatment liquid tank 4 fixes the shaft seal device main body 21 via a shaft seal device holder 28 and a shaft seal device cover 29. In the meantime, the treatment liquid is fixed so as not to leak. The processing liquid tank 4 is fixed to the base 32.

The bottom roller 6 is made of SUS316L having excellent chemical resistance and has a weight of about 150 kg. The weight is supported by the air bearing body 20 except for the buoyancy. In the air bearing body 20, the sintered body 9 is made by powder sintering or the like, and has countless fine continuous pores. The weight of the shaft is supported by ejecting the compressed air supplied from the first compressed air inlet 10 from the countless fine continuous pores of the sintered body 9 to the ceramic bearing 11a. Similarly, the ejection in the axial direction is suppressed by jetting to the ceramic bearing 11b. Since the gap between the sintered body 9 and the ceramic bearing 11 a needs to be uniform, the air bearing body 20 moves in accordance with the axial direction of the bottom roller 6 by the sliding action between the spherical bearing 27 and the spherical outer ring metal 26. It has become. The air bearing 20 is supported by a spherical bearing 27, a spherical outer ring metal 26, a bearing holder 25, and a bearing stand 24, and is fixed to the base 32. Although FIG. 2 shows the left half, the right side is also made symmetrical.

The portion of the bottom roller 6 in contact with the processing liquid is covered with a coating 16 and ceramic bearings 11 (11a, 11b, 11c) in order to electrically insulate. The coating 16 is made of nylon 11 and has a thickness of about 1 mm. The seal member 15 is made of silicon rubber having excellent chemical resistance and flexibility. The seal member housing 14 is made of hard Viton rubber having excellent heat resistance and chemical resistance.

The copper foil is brought into contact with the copper foil contact portion 17 of the bottom roller 6.

The compressed air that has entered from the second compressed air inlet 12 goes around the entire circumference of the shaft seal device main body 21 via the shaft seal device holder 28, and is supplied to the seal member through the seal member housing 14. A gap is formed between the ceramic bearing 11c and the seal member 15 by the action of the compressed air. As a result, the rotational resistance is reduced, and the second compressed air flows in the direction of liquid (inside the treatment tank 4) due to the form of the labyrinth structure. Sealing performance can be obtained by this action.

As shown in FIG. 3, the shaft seal device holder 28 first enters the compressed air inlet 12. Compressed air rotates around the entire circumference of the seal member housing 14 by the shaft seal device holder 28, passes through the air passage 15 a of the seal member 15, and passes through the serrated air passage (air passage) 15 b to the outer surface portion of the ceramic bearing 11. It is in the form of a labyrinth structure to be supplied. That is, a gap is formed between the ceramic bearing 11 c and the seal member 15 by the action of compressed air. As a result, the rotational resistance is reduced, and the second compressed air flows in the direction of liquid (inside the treatment tank 4) due to the form of the labyrinth structure. Sealing performance can be obtained by this action.

And the compressed air supplied to the 1st compressed air inlet 10 and the 2nd compressed air inlet 12 is sent by the compressor, respectively. Each is compressed air adjusted to the required pressure.

The present invention can be used in the field of processing copper foil used for semiconductor substrates and the like.

It is the schematic of an electrolytic copper foil plating processing apparatus. It is a figure of the left half of the AA arrow cross section in FIG. It is the front view and side view of a shaft seal device.

Explanation of symbols

1 Rolled copper foil wound into a roll before treatment
2 Copper foil body 3 Upper roller 4 Treatment liquid tank 5 Treatment liquid 6 Bottom roller 7 Flow of copper foil 8 Rolled copper foil 9 wound into a treated roll 9 Sintered body 10 First compressed air inlet 11 Ceramic bearing 12 Second compressed air inlet 14 Seal member housing 15 Seal member 16 Coating 17 Copper foil contact portion 20 Air bearing 21 Shaft seal device body 24 Bearing stand 25 Bearing holder 26 Spherical outer ring metal 27 Spherical bearing 28 Shaft seal device holder 29 Shaft seal device cover 30 Color 31 Ceramic bearing holder 32 Base

Claims (2)

  In a plating apparatus for continuously plating copper foil manufactured by electrolytic deposition and wound up in a roll shape, a bottom roller having no driving force for transporting copper foil is provided in the processing solution. An electrolytic copper foil plating apparatus characterized by the above. In the shaft seal device of the rotating shaft of the bottom roller, a shaft sealing device in which the receiving portion of the rotating shaft of the bottom roller has a ceramic structure and the outer ring portion that receives the rotating shaft of the bottom roller has a labyrinth structure, A shaft seal device having a mechanism for supplying compressed air between the rotating shaft and the outer ring portion at the center of the outer ring portion of the labyrinth structure.

Images