JP2009215570A - Copper alloy sheet superior in dicing workability for use in qfn package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a dicing workability of a copper alloy sheet for use in a QFN package, which requires to be dice-worked. <P>SOLUTION: The copper alloy sheet comprises: 0.01 to 0.50 mass% Fe, 0.01 to 0.20 mass% P, and the balance Cu with unavoidable impurities; and has a micro-Vickers hardness of 150 or more, a uniform elongation of 5% or less, and a local elongation of 10% or less. The copper alloy sheet can further includes a predetermined amount of one or more elements among Sn, Zn, Co, Cr, Mn, Mg, Al, Ag, B, Be, In, Si, Ti, and Zr, as needed. Then, the length (d) of a burr 5 caused by a drag of a lead in a dicing working step becomes shorter, and an abrasion of a blade 6 for dicing is reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component such as a semiconductor device, and more particularly to a copper alloy plate for a QFN package that requires dicing.

As semiconductor devices, QFN packages are increasing in place of packages having external leads represented by QFP and packages such as CSP and BGA which are lead frameless.
This is because not only the existing QFP production line can be utilized, but also the mounting area can be reduced as much as BGA, and as thin as CSP. Further, since it has a metal lead frame, the productivity is high, and there is no low package reliability like BGA. Furthermore, since a heat spreader can be provided on the back surface, it is not necessary to separately attach a heat sink like BGA and CSP from the surface of heat dissipation, and the cost can be reduced.

  In this QFN package, in order to increase the production efficiency of the package assembly, the lead frame pattern is arranged in a matrix (eg, vertical and horizontal 5 × 5, 10 × 10, etc.), after chip mounting and wire bonding process Molding is performed in a state where the package is packaged at the time of resin molding, and dicing is performed at the final stage (see Patent Documents 1 to 3). This dicing was originally used to cut the Si chip from the wafer by cutting with an ultra-thin blade with diamond powder, but the package (1) Example: It is used as a method of separating vertical and horizontal 5 × 5, 10 × 10) into individual pieces.

In the assembly of the QFN package having this dicing process, the external lead is cut by a blade at the time of the dicing process, so that the lead frame material is required to have excellent dicing workability.
Problems that arise in the dicing process are burrs of external leads (referred to as lead drag burrs) that are cut by the blade and wear of the blade itself. If the lead burr generated when cutting is large, soldering cannot be performed stably when the package is mounted on the board, which not only hinders the productivity of the mounting process but also reduces the reliability of the mounting board itself. Let In addition, when the blade wear is large, not only the dressing frequency of the blade is increased, but also the dimensional change of the package to be detached is caused, and not only the productivity is lowered but also the yield of the product itself is lowered. Accordingly, there is a demand for a lead frame material for QFN that minimizes the occurrence of lead drag burrs and minimizes blade wear.

  As the lead frame material for QFN, copper, copper alloy and Cu—Ni alloy which are well-known as conventional lead frame materials for QFP are used (see Patent Documents 2 and 3). Of these, as the copper alloy, CDA194 alloy (Cu -2.3 mass% Fe-0.03 mass% P-0.13 mass% Zn). However, since the CDA194 alloy cannot sufficiently suppress the generation of lead drag burrs and blade wear, a lead frame material having further excellent dicing workability is required.

JP 2003-347494 A JP 2003-124420 A JP 2007-123327 A

  The present invention has been made to meet such a demand, and an object thereof is to provide a lead frame material excellent in dicing workability, which is suitable as a copper alloy plate for a QFN package requiring dicing.

The copper alloy plate for a QFN package according to the present invention comprises Fe: 0.01 to 0.50 mass%, P: 0.01 to 0.20 mass%, the balance Cu and unavoidable impurities, and has a micro Vickers hardness of 150. As described above, the uniform elongation is 5% or less and the local elongation is 10% or less.
This copper alloy further includes (1) Sn: 0.005 to 5 mass%, (2) Zn: 0.005 to 3.0 mass%, and (3) one or two of Co, Cr, Mn, and Mg. 0.2% by mass or less in total of species or more, (4) Al, Ag, B, Be, In, Si, Ti, Z, or a total of 0.1% by mass or less of one or more types, (1) to (4) can be contained alone or in combination of (1) to (4) as appropriate.

  By using the copper alloy plate according to the present invention as a lead frame material of a QFN package, the occurrence of burrs (lead dragging burrs) of external leads is reduced in the dicing process of QFN package assembly, and blade wear required for dicing The amount can be reduced, and the productivity of the QFN package, the yield of the product, and the reliability of the product can be improved.

First, characteristics required for improving the dicing workability of the copper alloy plate according to the present invention will be described.
The copper alloy plate according to the present invention has a micro Vickers hardness (hereinafter referred to as MHv) of 150 or more. If the MHv is less than 150, not only the strength of the copper alloy plate is insufficient, but also the hardness is low, so that the blade abrasive grains (diamond grains) bite into the copper alloy material during dicing, and the amount of scraped material And lead drag burrs larger than that tend to occur. From the viewpoint of suppressing the occurrence of lead drag burrs, the MHv is more preferably 160 or more. Although an upper limit is not defined, an MHv of 300 or less is generally obtained by the composition of the present invention and the production method described later.

  The copper alloy sheet according to the present invention has a uniform elongation of 5% or less and a local elongation of 10% or less. If the uniform elongation exceeds 5%, the ductility of the material is too high, and the material scraped out by the blade is difficult to break (elongates), and therefore, a large lead drag burr is likely to occur. From the viewpoint of suppressing the occurrence of lead drag burrs, the uniform elongation is more preferably 4% or less. When the local elongation exceeds 10%, the ductility of the material is too large, and the material scraped out by the blade is difficult to break, so that a large lead drag burr is likely to occur. From the viewpoint of suppressing the occurrence of lead drag burrs, the local elongation is more preferably 6% or less. Although a lower limit is not defined, a uniform elongation of 0.5% or more and a local elongation of 2% or more can be obtained by the composition of the present invention and the production method described later.

The MHv, uniform elongation, and local elongation of the copper alloy plate also affect the blade wear. If the MHv is too low, the blade abrasive grains bite into the copper alloy material, and the uniform elongation and local elongation are too large. Since the scraped material is difficult to break, the scraping resistance of the material increases and the blade tends to wear out. Also from the viewpoint of suppressing blade wear, the MHv is 150 or more, preferably 160 or more, the uniform elongation is 5% or less, desirably 4% or less, and the local elongation is 10% or less, desirably 6% or less.
The uniform elongation refers to the elongation until the maximum load is reached in the tensile test, and the local elongation refers to the elongation from the time when the maximum load is reached to the break.

Next, the components of the copper alloy according to the present invention will be described.
The copper alloy which concerns on this invention contains Fe: 0.01-0.50 mass% and P: 0.01-0.20 mass% as an essential component.
Fe precipitates as Fe or a Fe-P compound, and improves the strength and heat resistance of the copper alloy plate. When the Fe content is less than 0.01% by mass, the amount of precipitation is small, the strength is insufficient, and the occurrence of burrs during dicing increases. On the other hand, when the Fe content exceeds 0.5% by mass, the electrical conductivity decreases, and Fe or Fe—P coarse crystallized particles are generated, and the blade consumption required for dicing increases. Therefore, the Fe content is 0.01 to 0.50 mass%, preferably 0.05 to 0.45 mass%.

  P has a deoxidizing effect and forms Fe and Fe—P compounds to improve strength and heat resistance. When the P content is less than 0.01% by mass, the amount of precipitation of the compound is small, the strength is insufficient, and the occurrence of burrs during dicing is increased. On the other hand, when the P content exceeds 0.2% by mass, the electrical conductivity is lowered, and hot workability is lowered, and Fe-P coarse crystallized particles are generated, and the amount of blade consumption required for dicing. Becomes larger. Therefore, the content of P is set to 0.01 to 0.20 mass%, desirably 0.02 to 0.15 mass%.

In addition to Fe and P, the copper alloy according to the present invention includes one or more of (1) Sn, (2) Zn, (3) Co, Cr, Mn, and Mg, if necessary. ) Any one or two or more of Al, Ag, B, Be, In, Si, Ti, and Zr may be used alone or as appropriate as an accessory component.
Sn contributes to improving the strength of the copper alloy and has the effect of improving dicing workability. However, when the Sn content is less than 0.005% by mass, the strength is not improved and the dicing processability is not improved. On the other hand, when Sn content exceeds 5 mass%, the fall of electrical conductivity will be caused. Therefore, the Sn content is in the range of 0.005 to 5.0 mass%, preferably 0.01 to 4.5 mass%.
Zn has the effect of improving the heat resistance of the solder and tin plating required for the lead frame. However, when the Zn content is 0.005% by mass or less, these effects are small. Conversely, when the Zn content exceeds 3% by mass, the conductivity of the lead frame material is adversely affected. Therefore, the Zn content is in the range of 0.005 to 3% by mass, preferably 0.01 to 2.5% by mass. The lead frame material preferably has a conductivity of 20% IACS or higher.

 Co, Cr, Mn, and Mg are precipitated as a compound with P to improve strength and heat resistance and improve dicing workability. However, if the total of one type or two or more types exceeds 0.2% by mass, coarse crystal precipitates are generated, the amount of blade wear required for dicing processing increases, and depending on the components (Mn, Mg) Since solder wettability is lowered, the amount of Co, Cr, Mn, and Mg added is 0.2% by mass or less in total of one or more.

  Al, Ag, B, Be, In, Si, Ti, and Zr are precipitated by solid solution, alone or in combination with other components, thereby improving strength and improving dicing workability. However, if the total of one type or two or more types exceeds 0.1% by mass, solder wettability is reduced and the cost is increased. Therefore, Al, Ag, B, Be, In, Si, Ti, Zr The total amount of one or two or more is 0.1 mass% or less.

  In addition, O easily reacts with P, and when it exceeds 100 ppm, the formation of precipitates is insufficient, and the strength and dicing workability are lowered, or the wettability is lowered. Therefore, desirably 100 ppm or less, more desirably 50 ppm or less. And If H exceeds 5 ppm, it is combined with O to form water vapor, which causes blowhole defects during casting and leads to product defects. Therefore, it is preferably 5 ppm or less, more preferably 3 ppm or less. If S exceeds 100 ppm, cracking occurs during hot rolling, making it difficult to produce a product. Therefore, S is desirably 100 ppm or less, and more desirably 50 ppm or less.

  The copper alloy plate according to the present invention homogenizes the ingot, hot-rolls and then rapidly cools, then cold-rolls and anneals, repeats cold-rolling and annealing as necessary, and further finishes. It can manufacture by performing low temperature annealing as a final process after cold rolling. In order to give the characteristics that the micro Vickers hardness is 150 or more, the uniform elongation is 5% or less, and the local elongation is 10% or less, the average grain size of recrystallized grains is 50 μm or less or not recrystallized in all annealing processes. Furthermore, it is desirable that the processing rate of finish cold rolling be 40% or more. At the time of annealing, Fe or Fe-P compounds are precipitated, and the strength and heat resistance of the copper alloy plate are improved. In order to ensure MHv150 or more in the final product, the annealing conditions may be selected within a range of 200 ° C. to 600 ° C. × 0.5 to 10 hours. The low-temperature annealing conditions are preferably selected so that the MHv after annealing is in the range of 65% to 95% with respect to the MHv before annealing.

  In the above production method, after annealing (or even once when annealing multiple times), if the average grain size of recrystallized grains exceeds 50 μm, the material itself is too soft and it is difficult to ensure MHv150 or more in the final product. Similarly, when the finish rolling rate is less than 40%, it is difficult to secure MHv 150 or more in the final product. Furthermore, in the low-temperature annealing of the final process, ductility is restored by setting the MHv after low-temperature annealing to be in the range of 65% to 95% with respect to the MHv before annealing. At this time, if the MHv is less than 65%, There is a possibility that the values of uniform elongation and local elongation become too large, and MHv may decrease too much. If it exceeds 95%, reduction of plate distortion and internal stress becomes insufficient, and flatness required for the lead frame is obtained. There is a risk of not being able to.

  No. shown in Table 1. A copper alloy having a composition of 1 to 18 was melted under a charcoal coating in the air in a small electric furnace to produce an ingot having a thickness of 50 mm, a width of 80 mm, and a length of 180 mm. After chamfering the front and back surfaces of the ingot by 5 mm each, hot rolling was performed at 950 ° C. to obtain a plate material having a thickness of 12 mmt, and the front and back surfaces of the plate material were each chamfered by about 1 mm. In addition, No. No. 17 has many blow holes in the ingot. Since No. 18 produced hot rolling cracks, the processes after hot rolling were cancelled.

About these board | plate materials, after performing cold rolling, annealing was performed and plate | board thickness was 0.15 mmt by finish cold rolling. Annealing was performed within the range of 200 ° C. to 600 ° C. × 0.5 to 10 hours, and the average grain size of the recrystallized grains after annealing was selected to be 50 μm or less, or a condition where no recrystallization was performed. Further, the plate thickness before annealing was set so that the processing rate of finish cold rolling was 20% or more (the processing rate of finish cold rolling is shown in Table 1).
The plate material after finish cold rolling was subjected to low temperature annealing in the range of about 20 to 300 seconds. The annealing conditions at this time were selected so that the hardness after low-temperature annealing was 65% to 95% with respect to the hardness before finishing low-temperature annealing for any plate material.

  No. obtained in the above process. Samples were taken from 1 to 16 plate materials and used for measurement tests of each characteristic of micro Vickers hardness (MHv), uniform elongation, local elongation, drag burr length, blade wear, conductivity, and solder wettability. did. The measurement results are shown in Table 2. The procedure of each test is as follows.

<Hardness measurement>
Based on JISZ2244, a Vickers hardness test was performed at a load of 4.9 N, and a micro Vickers hardness (MHv) was measured.
<Measurement of uniform elongation and local elongation>
A JIS No. 5 test piece was taken from each plate so that the longitudinal direction was the rolling direction, and a tensile test was performed to measure uniform elongation and local elongation, respectively.

<Conductivity measurement>
The conductivity was measured based on JISH0505. In addition, electrical conductivity 40% IACS or more was evaluated as the pass.
<Solder wetting evaluation>
A strip-shaped test piece was collected from each plate material, a weakly active flux was applied, and the solder wetting time was measured with a Menicos graph tester. As the solder, Sn-3 mass% Ag-0.5 mass% Cu maintained at 260 ± 5 ° C. was used. The case where the solder wetting time was less than 2 seconds was evaluated as pass (◯), and the case where it was 2 seconds or more was evaluated as reject (x).

<Lead drag burr length measurement>
After the plate material is fabricated by etching on the test frame shown in FIG. 1 (sign 1 is given to the test frame and sign 2 is given to the etched part), it is resin-molded into the test package shown in FIG. 3 is given). Next, after curing at 175 ° C. for about 8 hours, the surface oxide film was removed by pickling to obtain a sample for dicing evaluation.
A dicing test was performed on the sample using a diamond-bonded resin bond blade (surface abrasive roughness # 360) and an electroformed bond blade (surface abrasive roughness # 400).
The dicing cut position can cut eight leads (provided with reference numeral 4 in FIG. 1) in a direction perpendicular to the resin-molded lead having a width of 0.25 mm (a direction perpendicular to the longitudinal direction of the frame). The position was cut at two locations per package. The cutting position and direction are indicated by arrows in FIG. The maximum length of lead drag burrs in the plate width direction generated by cutting for each lead was measured, and the average value was taken as the measured value. In the evaluation, a lead dragging burr length of less than 60 μm was accepted.
As shown in FIG. 3, the lead dragging burr 5 is obtained by extending the material scraped by the blade 6 in the plate width direction (arrow direction), and the burr length d is shown in FIG.

<Blade wear amount>
Using the sample for dicing evaluation, the resin bond blade and the electroformed bond blade perform dicing processing for 2 frames (2 lines per package) and 18 lines for 9 packages per frame, for a total of 5 frames. went. The reduced diameter from the blade diameter φ = 54 mm before dicing was measured as the amount of blade wear. In all cases, blade wear of less than 70 μm was accepted.

  As shown in Table 2, the composition has the composition defined in the present invention, and the values of MHv, uniform elongation and local elongation all satisfy the definition of the present invention. 1 to 10 have a lead drag burr length of 60 μm or less for both the resin bond blade and the electroformed bond blade, and a blade wear amount of less than 70 μm for both the resin bond blade and the electroformed bond blade. Also has excellent dicing processability. In particular, all values of MHv, uniform elongation and local elongation are within the desirable range. 3-10 dicing processability is excellent. Compositionally, No. containing Sn and other subcomponents. 5 to 10 have improved hardness and excellent dicing workability.

On the other hand, any of the values of MHv, uniform elongation and local elongation deviate from the definition of the present invention. Nos. 11 and 13 to 16 have a lead drag burr length exceeding 60 μm for both the resin bond blade and the electroformed bond blade, and a blade wear amount exceeding 70 μm for the resin bond blade, resulting in poor dicing workability.
In addition, when the Fe content is excessive, no. No. 12 is a No. 12 resin resin blade having a large blade wear, low electrical conductivity, and excessive Co and Mg contents. No. 17 is a No. 17 resin resin blade having a large blade wear, poor solder wettability, and excessive Al and Ti contents. No. 18 and O content is excessive. No. 19 has poor solder wettability.

It is a top view of the copper alloy frame after the etching used for the Example of this invention. It is the top view (a) and side view (b) of the copper alloy frame after resin molding similarly. It is a schematic diagram explaining the lead dragging burr measured in the example.

Explanation of symbols

1 Test frame 2 Etching site 3 Mold resin 4 Frame lead 5 Drag burr 6 Blade

Claims (6)

Fe: 0.01 to 0.50 mass%, P: 0.01 to 0.20 mass%, remaining Cu and inevitable impurities, micro Vickers hardness is 150 or more, uniform elongation is 5% or less, and local A copper alloy plate for a QFN package excellent in dicing workability, characterized by having an elongation of 10% or less. Furthermore, Sn: 0.005-5.0 mass% is included, The copper alloy plate for QFN packages excellent in the dicing workability described in Claim 1 characterized by the above-mentioned. Furthermore, Zn: 0.005-3.0 mass% is contained, The copper alloy plate for QFN packages excellent in the dicing workability described in Claim 1 or 2. Furthermore, it is excellent in the dicing workability characterized by including 1 type (s) or 2 or more types among Co, Cr, Mn, Mg in total 0.2 mass% or less. Copper alloy plate for QFN package. Furthermore, 0.1 mass% or less is included in total including 1 type, or 2 or more types among Al, Ag, B, Be, In, Si, Ti, and Zr, characterized by the above-mentioned. Copper alloy plate for QFN package with excellent dicing workability. The copper alloy plate for a QFN package having excellent dicing workability according to any one of claims 1 to 5, wherein O: 100 ppm or less, H: 5 ppm or less, and S: 100 ppm or less.

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