JP2009214475A - Manufacturing method of nozzle plate with liquid repellent resin layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a nozzle plate with a liquid repellent resin layer, in which the liquid repellent resin layer can be formed favorably accurately at the desired position of the nozzle plate. <P>SOLUTION: This manufacturing method is equipped with a nozzle hole covering process by forming a liquid repellent resin layer by lamination on the surface of the nozzle plate with nozzle holes and a process for removing the liquid repellent resin layer at the nozzle hole by self-alignment. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for producing a nozzle plate having nozzle holes for ejecting ink droplets, which is incorporated in an ink jet recording apparatus, and is a method for producing a nozzle plate with a liquid repellent resin layer that enables satisfactory droplet ejection. The present invention relates to a manufacturing method.

  As a method of ejecting ink droplets of an ink jet recording apparatus, there are a method using an electrostatic force as a driving unit, a method using a piezoelectric vibrator as a driving unit, a method using a heating element as a driving unit, and the like. .

  In order to eject droplets in a high-definition image, it is necessary to eject the droplets stably and straightly. To that end, the design of the ink flow path and the method of applying pressure to the ink are optimized. Needless to say, it is necessary to always keep a stable surface around the nozzle holes for ejecting ink. For this purpose, it is necessary to provide a liquid repellent resin layer so that ink does not adhere to and remain on the periphery of the nozzle holes on the ink ejection surface.

  As a method for forming the liquid repellent resin layer, a method in which the liquid repellent resin layer is directly applied to the nozzle plate by a spin coating method, a dipping method, or the like, or a positive type is formed on the discharge surface side of the nozzle plate. After applying the resist, the nozzle plate is used as a light-shielding plate, exposure is performed, the resist in the nozzle hole is decomposed, and then the resist in the nozzle hole is removed by development, and a liquid-repellent resin is applied to the nozzle plate surface. A technique for forming a layer has been introduced (for example, see Patent Document 1).

However, in these methods, it is difficult to stably apply a liquid repellent resin layer around the nozzle hole with a uniform film thickness. Also, in the method of exposing a positive resist, it is necessary to irradiate all the nozzle holes with light that is completely parallel in the direction penetrating the nozzle holes, and the position of the exposure optical axis. In order to obtain good parallel light over the entire surface, an expensive parallel light exposure machine is required. If there is a deviation from the direction of the nozzle hole, the resist pattern cannot be formed concentrically with the nozzle hole, or the shape becomes irregular, and the liquid repellent resin layer has a good shape along the outline of the nozzle hole. There was a problem that could not be formed.
JP 2007-216655 A

  An object of the present invention is to form a liquid repellent resin layer on a surface of a nozzle plate formed with nozzle holes for discharging droplets with good positional accuracy and without exposure or the like. It is to provide a method for producing a nozzle plate with a liquid repellent resin layer.

As a result of intensive studies to solve the above problems, the present inventors have
(1) A step of covering the nozzle holes by laminating a liquid repellent resin layer on the discharge surface side surface of the nozzle plate having nozzle holes for discharging droplets, and the liquid repellent resin layer of the nozzle holes by a wet process. The present inventors have found a method for producing a nozzle plate with a liquid repellent resin layer, which includes a step of removing by alignment.

(2) A method for producing a nozzle plate with a liquid-repellent resin layer, wherein the wet treatment includes a step of supplying the liquid-repellent resin layer removing liquid from the surface opposite to the surface on which the liquid-repellent resin layer is laminated. I found it.

(3) Further, the wet treatment is a step of further forming an electrodeposited resin layer on the liquid repellent resin layer other than the nozzle holes, and a liquid repellent resin layer removing liquid is supplied from the surface on which the electrodeposited resin layer is formed. A method for producing a nozzle plate with a liquid repellent resin layer including the steps was found.

(4) Also, a method for producing a nozzle plate with a liquid-repellent resin layer that includes a step of supplying the liquid-repellent resin layer removing liquid after the wet processing thins the liquid-repellent resin layer in the nozzle holes has been found. .

  After the liquid repellent resin layer is formed on the discharge surface side surface of the nozzle plate having a nozzle hole for discharging droplets by laminating and covering the nozzle hole, the liquid repellent resin layer in the nozzle hole is self-aligned by wet processing. By including the step of removing, a liquid-repellent resin layer having a uniform film thickness can be formed very easily by using a film-like liquid-repellent resin layer that has been previously set to a predetermined film thickness. Further, by removing the liquid repellent resin layer in the nozzle holes by self-alignment, the liquid repellent resin layer can be easily and accurately formed along the nozzle holes of the nozzle plate without any means such as exposure. . In addition, in the wet processing, there is little stress applied to the nozzle plate, and the effect that the dimensional accuracy of the nozzle plate before and after the processing is kept good can be obtained.

  In addition, the wet treatment removes the liquid repellent resin layer from the nozzle holes by supplying the liquid repellent resin layer removing liquid from the surface opposite to the surface laminated with the liquid repellent resin layer of the present invention (2). A step, a step of further forming an electrodeposited resin layer on the liquid repellent resin layer other than the nozzle holes of the present invention (3), a step of supplying a liquid repellent resin layer removing liquid from the surface on which the electrodeposited resin layer is formed In the present invention (4), the step of supplying the liquid repellent resin layer removing liquid after thinning the liquid repellent resin layer of the nozzle hole includes a liquid repellent resin substantially uniformly within the surface of the nozzle plate. The layer can be removed.

  Hereinafter, the production method of the nozzle plate with a liquid repellent resin layer of the present invention will be described in detail. The present invention is not limited to the following examples unless it is contrary to the spirit of the present invention.

  The nozzle plate according to the present invention is formed by forming a plurality of nozzle holes for discharging droplets on a flat plate. As the material of the plate, a metal such as nickel or stainless steel or a semiconductor such as a silicon substrate is preferably used. Moreover, you may consist of a composite material also including a nonmetallic member. The thickness of the plate and the diameter of the nozzle hole are appropriately adjusted depending on the size of the droplet to be ejected, but the plate thickness is in the range of 10 μm to 1 mm, preferably 30 μm to 200 μm. The diameter of the nozzle hole is in the range of 0.1 μm to 200 μm, preferably in the range of 1 μm to 100 μm.

  In the method for producing a nozzle plate with a liquid repellent resin layer according to the present invention, the liquid repellent resin layer is formed on the nozzle plate in which the nozzle holes are formed by the method shown in FIG. That is, first, a nozzle plate 1 having a large number of nozzle holes 2 is prepared (FIG. 1A). Next, the liquid-repellent resin layer 3 formed in a sheet shape is laminated (FIG. 1B). Subsequently, the nozzle hole 2 portion of the liquid-repellent resin layer 3 is removed by self-alignment by wet processing without using a means by exposure (FIG. 1C).

  The lamination of the liquid repellent resin layer according to the present invention is a step of thermocompression bonding a liquid repellent resin layer sheet already formed into a sheet shape. Any method can be used as long as adhesion between the nozzle plate and the liquid-repellent resin layer is ensured, and the nozzle plate is not distorted by heat or pressure and can be laminated with a uniform film thickness. Preferably, the lamination is performed by a hot roll, and the temperature is 40 ° C. to 150 ° C., more preferably 60 ° C. to 120 ° C. In the case of laminating with a hot roll, the pressure is in the range of 1 N / cm to 100 N / cm, more preferably in the range of 2 N / cm to 50 N / cm, as linear pressure. This laminating step makes it possible to satisfactorily form a liquid repellent resin layer having a uniform film thickness on the nozzle plate having the nozzle holes.

  To remove by self-alignment according to the present invention means to remove the liquid repellent resin layer of the nozzle hole without using a means by exposure and without positioning. The nozzle holes of the laminated liquid-repellent resin layer are removed based on the opening shape of the nozzle holes of the nozzle plate having the nozzle holes. The wet treatment for removal includes at least a step of supplying a liquid repellent resin layer removing liquid. By using the wet treatment with the liquid repellent resin layer removing liquid, it is possible to remove the liquid repellent resin layer uniformly and with good productivity regardless of the thickness and size of the nozzle plate.

  A method for producing a nozzle plate with a liquid repellent resin layer of the present invention (2) will be described with reference to FIG. After forming a liquid repellent resin layer 3 and a masking layer (not shown) on the nozzle plate 1 having the nozzle holes 2 (FIG. 2A) on the discharge surface side of the nozzle plate by laminating (FIG. 2B) ), A liquid repellent resin layer removing liquid is supplied from the surface opposite to the discharge surface side in the direction indicated by the arrow to remove the liquid repellent resin layer 3 in the nozzle hole 2 on the discharge surface (FIG. 2C). )). At this time, since there is a masking layer on the surface opposite to the nozzle plate of the liquid repellent resin layer 3, the liquid repellent resin layer 3 other than the nozzle holes 2 is not removed by the liquid repellent resin layer removing liquid. Absent. Finally, the masking layer is removed to form a nozzle plate with a liquid repellent resin layer (FIG. 2D). The masking layer can be formed after laminating the liquid repellent resin layer 3, but it is previously formed integrally with the liquid repellent resin layer 3 and the liquid repellent resin layer 3 is thermocompression bonded to the nozzle plate 1 by lamination. This method is preferable from the viewpoint of productivity.

  The liquid repellent resin layer according to the present invention (2) is a resin having adhesion to the nozzle plate surface, chemical strength, and mechanical strength, and is repellent to the ejected ink droplets. The resin is not particularly limited as long as it has liquid properties and can be dissolved and removed by the liquid repellent resin layer removing liquid. Acrylic resin, epoxy resin, vinyl acetate resin, vinyl chloride resin, vinylidene chloride resin, vinyl acetal resin such as polyvinyl butyral, polystyrene, polyethylene, polypropylene and its chloride, polyester resin such as polyethylene terephthalate and polyethylene isophthalate, polyamide resin, Resins such as vinyl ester-modified alkyd resin, phenol resin, xylene resin, polyimide resin, gelatin, carboxymethyl cellulose and other cellulose ester derivatives can be used. In order to increase the liquid repellency, a silicone-based or fluorine-based resin can also be contained.

  In addition, when an alkaline aqueous solution is used as the liquid repellent resin layer removing liquid, the resin layer removing liquid can be dissolved and removed by using a resin having high solubility in the alkaline aqueous solution as the liquid repellent resin layer. . When an alkaline aqueous solution is used as the resin layer removing liquid, a resin having an acid value of 1 mgKOH / g or more, more preferably 10 mgKOH / g or more can be suitably used as the liquid repellent resin layer. In addition, the liquid repellent resin layer can be imparted with ultraviolet curability and heat curability in order to have durability and mechanical strength. If the liquid repellent resin layer remover is dissolved and removed, the treatment is performed with the liquid repellent resin layer remover, and then the treatment is performed by ultraviolet curing or heat curing, whereby the removal treatment process can be easily performed. In addition, durability can be improved.

  The resin layer removing liquid according to the present invention (2) is a liquid that can dissolve or disperse the liquid repellent resin layer, and a liquid that matches the composition of the liquid repellent resin layer to be used. The liquid-repellent resin layer removing liquid removes the liquid-repellent resin layer in the nozzle hole to form a region where the liquid-repellent resin layer does not exist in the nozzle hole. Even if the resin layer removal liquid is a liquid that does not dissolve the masking layer, or a liquid that dissolves the masking layer, the masking layer swells or is shaped under the condition that the liquid repellent resin layer is dissolved by an appropriate amount. Use liquid that does not change. Also, a liquid repellent resin layer removing liquid that does not cause a shape change or the like is used for the nozzle plate. In general, an alkaline aqueous solution is usefully used. For example, an inorganic basic compound such as alkali metal silicate, alkali metal hydroxide, alkali metal phosphate or alkali metal carbonate, phosphoric acid or ammonium carbonate And an organic basic compound such as ethanolamine, ethylenediamine, propanediamine, triethylenetetramine and morpholine can be used. In order to control the solubility of these aqueous solutions in the liquid repellent resin layer, it is necessary to adjust the concentration, temperature, spray pressure and the like. The liquid repellent resin layer removing liquid can be supplied by any method as long as the liquid repellent resin layer removing liquid can be supplied to the liquid repellent resin layer through the nozzle holes from the surface opposite to the surface having the masking layer. It may be used. A dip treatment device, a double-sided shower spray device, a single-sided shower spray device, or the like can be used. The removal of the liquid repellent resin layer can be quickly stopped by washing with water or acid treatment following the treatment with the resin layer removing solution.

  Further, as described below, a combination of two kinds of liquid repellent resin layer removing liquids (liquid repellent resin layer removing liquid A and liquid repellent resin layer removing liquid B) is used. It is preferable to perform the step treatment to remove the liquid-repellent resin layer because variations due to the in-plane of the nozzle plate can be reduced.

  The liquid repellent resin layer removing liquid A contains at least one of inorganic alkali compounds selected from alkali metal carbonates, alkali metal phosphates, alkali metal hydroxides, and alkali metal silicates, and is inorganic. An aqueous solution having an alkaline compound content of 5 to 20% by mass is preferably used.

  In the treatment with the liquid repellent resin layer removing liquid A, the liquid repellent resin layer removing liquid A is supplied to form micelles of the liquid repellent resin layer components. As a result, the micelles of the formed liquid repellent resin layer components are insolubilized and are prevented from being dissolved and diffused in the liquid repellent resin layer removing liquid A. Next, the liquid repellent resin layer removing liquid B is supplied, and the micelles insolubilized by the treatment with the liquid repellent resin layer removing liquid A are redispersed and removed. It is preferable to remove the liquid repellent resin layer in this manner because a more uniform liquid repellent resin layer can be removed while suppressing variations in nozzle holes. The content of the inorganic alkaline compound in the liquid repellent resin layer removing liquid A is more preferably 7 to 20% by mass, and further preferably 10 to 20% by mass. If it is less than 5% by mass, the micelles are hardly insolubilized, and the micelles solubilized in the middle of the removal tend to dissolve and diffuse. Moreover, when it exceeds 20 mass%, precipitation will occur easily and it will be inferior to the temporal stability of a liquid, and workability | operativity. The pH of the liquid repellent resin layer removing liquid A is preferably in the range of 9-13. Further, a surfactant, an antifoaming agent and the like can be added as appropriate.

  As the liquid repellent resin layer removing liquid B, the insolubilized micelles generated by the treatment of the liquid repellent resin layer removing liquid A are dissolved and redispersed, and after the dissolution and redispersion, only the liquid repellent resin layer removing liquid B is used. In the treatment, any liquid can be used as long as the removal of the liquid repellent resin layer does not proceed or does not proceed easily. Preferably, water or an acid or alkaline aqueous solution having a pH in the range of 6 to 10 is preferably used.

  In the present invention, the treatment conditions (temperature, spray pressure, time) for removing the liquid repellent resin layer are appropriately adjusted according to the degree of micelle formation and dissolution diffusion of the liquid repellent resin layer. Specifically, processing temperature is 10-50 degreeC, More preferably, it is 15-40 degreeC, More preferably, it is 15-35 degreeC. The spray pressure is preferably 0.05 to 0.5 MPa, more preferably 0.1 to 0.3 MPa.

  As the masking layer, a resin or metal that is insoluble or hardly soluble in the liquid repellent resin layer removing liquid can be used. As the resin, acrylic resin, vinyl acetate resin, vinyl chloride resin, vinylidene chloride resin, vinyl acetal resin such as polyvinyl butyral, polystyrene, polyethylene, polypropylene and its chloride, polyester resin such as polyethylene terephthalate and polyethylene isophthalate, polyamide Resins such as resins, vinyl-modified alkyd resins, phenol resins, xylene resins, polyimide resins, gelatin, and cellulose ester derivatives such as carboxymethyl cellulose can be used. From the viewpoint of versatility, a polyester resin, a polyimide resin, or the like can be preferably used. Copper, aluminum, etc. can be used as a metal. As the masking layer, it is more preferable to use a resin rather than a metal in terms of simplicity and in-plane uniformity. If the masking layer is formed into a film shape and integrated with the liquid repellent resin layer on the nozzle plate, it is preferable because the liquid repellent resin layer and the masking layer can be formed easily and stably in the process. When an alkaline aqueous solution is used as the liquid repellent resin layer removal liquid, a resin having an acid value of the masking layer that is one-tenth or less, preferably one-hundredth or less of the acid value of the liquid-repellent resin layer is preferably used can do.

  As a method for integrally forming the liquid-repellent resin layer and the masking layer used in the present invention, it is preferable to form the liquid-repellent resin layer on the film-like support as the masking layer in advance, and then use a laminator. Lamination is performed on a nozzle plate having nozzle holes.

  A method for producing a nozzle plate with a liquid repellent resin layer of the present invention (3) is shown in FIG. After the liquid repellent resin layer 3 is formed on the nozzle plate 1 having the nozzle holes 2 (FIG. 3A) by lamination (FIG. 3B), the liquid repellent resin layer 3 other than the nozzle holes is further formed. An electrodeposited resin layer 32 is formed on the substrate (FIG. 3C). Next, the liquid repellent resin layer removing liquid is supplied in the direction indicated by the arrow to remove the liquid repellent resin layer 3 from the nozzle hole 2 (FIG. 3D). Subsequently, if necessary, the electrodeposition resin layer 32 is peeled and removed, and a liquid repellent resin layer can be formed. (FIG. 3 (e)).

  The electrodeposition resin layer according to the present invention (3) is formed as follows. A developing electrode is placed so as to face the nozzle plate laminated with the liquid repellent resin layer, and a liquid in which charged resin particles are dispersed is filled between the liquid repellent resin layer on the nozzle plate surface and the developing electrode. By applying an appropriate electric field between the developing electrode and the nozzle plate, the resin particles are electrodeposited to form an electrodeposited resin layer. The film thickness of the electrodeposition resin layer can be determined by controlling the electrodeposition conditions (charge and applied voltage of resin particles, treatment time, resin particle dispersion supply amount, etc.). The resin particles adhered by the electrodeposition method are fixed on the liquid-repellent resin layer by heating, pressure, light, solvent, etc. to become an electrodeposition resin layer. This electrodeposition resin layer is selected so as to be hardly soluble or insoluble in the liquid repellent resin layer removing liquid.

  When electrodeposition is performed on the nozzle plate laminated with the liquid repellent resin layer by electrophoresis, the resin particles receive a larger electric field toward the surface without the nozzle holes, and the liquid repellent resin in the nozzle holes. More resin particles than the layer surface adhere to the surface of the liquid repellent resin layer other than the nozzle holes. By properly adjusting the electrodeposition conditions, the amount of resin particles attached to the surface of the liquid repellent resin layer in the nozzle holes and the surface of the liquid repellent resin layer in the non-nozzle holes can be controlled, and the surface of the liquid repellent resin layer in the nozzle holes can be controlled. However, it is set so that a sufficient amount of resin particle adhesion can be obtained on the surface of the liquid repellent resin layer in the non-nozzle holes to completely cover the liquid repellent resin layer. That is, many resin particles adhere to portions other than the nozzle holes of the nozzle plate, thereby forming an electrodeposited resin layer. No alignment work is required and self-alignment is performed. As a result, by supplying the liquid repellent resin layer removing liquid, only the liquid repellent resin layer in the nozzle holes not covered by the electrodeposited resin layer is removed. After removing the liquid repellent resin layer from the nozzle holes, if necessary, the electrodeposition resin layer is removed to form a nozzle plate with a liquid repellent resin layer.

  The electrodeposition resin layer according to the present invention uses a resin that is insoluble in the liquid repellent resin layer removing solution and can be electrodeposited. As the component of the electrodeposition resin layer, for example, a wet toner resin used for electrophotography can be used. The components of the wet toner resin used for electrophotography include resin particles dispersed in an electrically insulating liquid. Specific examples of the resin particles include acrylic resin, vinyl acetate resin, vinyl chloride resin, chloride chloride. Vinylidene resins, vinyl acetal resins such as polyvinyl butyral, polystyrene, polyethylene, polypropylene and their chlorides, polyester resins such as polyethylene terephthalate and polyethylene isophthalate, polyamide resins, vinyl-modified alkyd resins, cellulose, cellulose ester derivatives such as carboxymethyl cellulose Etc. The particles can contain a charge control agent and can be controlled to form an appropriate electrodeposition resin layer under desired electrodeposition conditions. Further, when the electrodeposition resin layer is not finally removed, it is preferable that the electrodeposition resin layer also has liquid repellency. A liquid repellent component such as silicone or fluorine dispersed particles may be added as an electrodeposition component, or a liquid repellent component may be added to the resin particles.

  The liquid-repellent resin layer and the liquid-repellent resin layer removing liquid according to the present invention (3) can be used as long as the electrodeposition resin layer is formed and the liquid-repellent resin layer is removed as described above. Any liquid repellent resin layer and liquid repellent resin layer removing liquid among those used in the present invention (2) can be used.

  A method for producing a nozzle plate with a liquid repellent resin layer of the present invention (4) is shown in FIG. After forming the liquid repellent resin layer 3 on the nozzle plate 1 having the nozzle holes 2 (FIG. 4A) by lamination (FIG. 4B), the liquid repellent resin layer 3 in the nozzle holes 2 is thinned. (FIG. 4C). Next, the liquid repellent resin layer removing liquid is supplied in the direction indicated by the arrow (FIG. 4D), and the liquid repellent resin layer 3 in the nozzle hole 2 is removed, so that the nozzle plate with the liquid repellent resin layer is formed. Is obtained (FIG. 4 (e)). Thinning of the liquid repellent resin layer can be performed by heat treatment, pressurization, or reduced pressure treatment, and the treatment is performed to reduce the film thickness of the liquid repellent resin layer in the nozzle hole. In the case of heat treatment, depending on the type of the liquid repellent resin layer, the treatment is performed at 40 ° C. or higher and 150 ° C. or lower, more preferably 60 ° C. or higher and 120 ° C. or lower. By reducing the film thickness of the liquid repellent resin layer 3 in the nozzle hole 2 and then performing treatment with the liquid repellent resin layer removing liquid, the liquid repellent resin layer 3 in the nozzle hole 2 can be removed. In addition, when thinning by heat treatment, lamination is also performed on the opposite surface, the air in the nozzle hole is sealed, and the liquid repellent resin layer of the nozzle hole is formed by utilizing the thermal expansion of the air. It can also be made thin. The liquid-repellent resin layer removing liquid can be supplied from either side as long as the liquid-repellent resin layer in the nozzle holes is satisfactorily removed.

  The liquid-repellent resin layer and the liquid-repellent resin layer removing liquid according to the present invention (4) can be used as long as the liquid-repellent resin layer is thinned and the liquid-repellent resin layer is removed well. Any liquid repellent resin layer and liquid repellent resin layer removing liquid among those used in 2) can be used.

  Examples of the present invention will be described below.

Example 1
As a nozzle plate having a cross section shown in FIG. 2 (a), a nickel plate having a plate thickness of 40 [mu] m and having nozzle holes formed by punching was prepared. The burr was removed by polishing. In addition, a coating liquid obtained by adding a fluororesin dispersion as a liquid repellent component to the components shown in Table 1 is applied to a polyester film functioning as a masking layer to form a liquid repellent resin layer forming film (of the liquid repellent resin layer). A film thickness of 10 μm and a masking layer film thickness of 25 μm) were produced. This liquid repellent resin layer forming film was thermocompression bonded to the nozzle plate on the ejection surface side of the nozzle plate using a laminator to form a liquid repellent resin layer and a masking layer.

  Next, the liquid-repellent resin layer was removed using a combination of two kinds of liquid-repellent resin layer removing liquids, the liquid-repellent resin layer-removing liquid A and the liquid-repellent resin-layer removing liquid B. . Using 10% by weight sodium carbonate aqueous solution (25 ° C.) as the liquid repellent resin layer removing liquid A, after applying a shower spray from the surface opposite to the discharge surface side of the nozzle plate for 30 seconds, the liquid repellent resin layer Water was applied as a removing liquid B by shower spray to remove the liquid repellent resin layer in the nozzle holes. Thereafter, the masking layer was removed.

Next, after ultraviolet irradiation (5 J / cm ² ), heat treatment was performed at 150 ° C. for 30 minutes in a drying furnace to improve durability.

  When the periphery of the nozzle hole was observed with an optical microscope, the liquid repellent resin layer around the nozzle hole was well removed along the shape of the nozzle hole on the entire surface of the nozzle plate, and between the nozzle hole and the liquid repellent resin layer. The nozzle plate with a good liquid repellent resin layer was obtained.

(Example 2)
As a nozzle plate, a stainless plate having a thickness of 30 μm was punched to form nozzle holes to obtain a nozzle plate. The burr was removed by polishing. Using a laminator on the discharge surface side of the nozzle plate, a liquid repellent resin layer was formed in the same manner as in Example 1, and then the masking layer was removed.

  Next, using a wet toner for electrophotography in which positively charged resin particles are dispersed, a bias voltage of +200 V is applied to perform electrodeposition coating on the surface of the liquid-repellent resin layer on the ejection surface side, and the nozzle holes of the nozzle plate The other part of the liquid-repellent resin layer was covered with a toner particle layer. Next, the toner particles were fixed by heating at 70 ° C. for 2 minutes to form an electrodeposition resin layer (thickness 1 μm).

Subsequently, the liquid repellent resin layer in the nozzle holes was removed by supplying a 1% by mass sodium carbonate aqueous solution as a resin layer removing solution by shower spray from the discharge surface side of the nozzle plate. Next, after ultraviolet irradiation (5 J / cm ² ), heat treatment was performed at 150 ° C. for 30 minutes in a drying furnace to improve durability.

  When the periphery of the nozzle hole was observed with an optical microscope, the liquid repellent resin layer around the nozzle hole was well removed along the shape of the nozzle hole on the entire surface of the nozzle plate, and between the nozzle hole and the liquid repellent resin layer. The nozzle plate with a good liquid repellent resin layer was obtained.

(Example 3)
A stainless steel plate of SUS304 having a thickness of 0.2 mm was used, and a photosensitive plating resist layer having a thickness of 50 μm was formed on the surface. By performing pattern exposure and development processing, a plating resist pattern corresponding to the shape of the nozzle hole was formed on the surface of the base substrate. The base substrate on which this plating resist pattern was formed was immersed in a nickel sulfamate plating bath and electroplated under the conditions of 2 A / dm ² and a bath temperature of 45 ° C. to form a nickel layer having a thickness of 40 μm. Thereafter, the plating resist pattern was removed, the nickel layer was peeled from the base substrate, and a nozzle plate having nozzle holes formed thereon was produced.

  A film for forming a liquid repellent resin layer was thermocompression bonded to the discharge surface side of the nozzle plate in the same manner as in Example 1 using a laminator. However, the thickness of the liquid repellent resin layer at this time was 25 μm. A film for forming a liquid repellent resin layer was also thermocompression bonded to the surface opposite to the discharge surface side of the nozzle plate. However, the thickness of the liquid repellent resin layer of this film was 5 μm.

  Next, after leaving at room temperature 25 ° C., the liquid repellent resin layer is softened by raising the temperature to 80 ° C., and at the same time, the air in the nozzle holes is expanded, and the thickness of the liquid repellent resin layer in the nozzle holes is increased. Thinned. Subsequently, the masking layers on both sides were removed. When the thickness of the liquid repellent resin layer on the ejection surface side of the nozzle hole was measured, it was as thin as 3 μm.

Next, a liquid repellent resin layer removing liquid was supplied from both sides, and the entire liquid repellent resin layer on the side opposite to the discharge surface and the liquid repellent resin layer in the nozzle holes on the discharge surface side were removed. The thickness of the liquid repellent resin layer on the ejection surface side other than the nozzle holes was 20 μm. Next, after ultraviolet irradiation (5 J / cm ² ), heat treatment was performed at 150 ° C. for 30 minutes in a drying furnace to improve durability.

  When the periphery of the nozzle hole was observed with an optical microscope, the liquid repellent resin layer around the nozzle hole was well removed along the shape of the nozzle hole, and there was also a displacement between the nozzle hole and the liquid repellent resin layer. A good nozzle plate with a liquid repellent resin layer was obtained without being seen.

(Comparative example)
A positive photosensitive coating material mixed with a liquid repellent was applied to the discharge surface side of the same nozzle plate as used in Example 1 to form a positive photosensitive liquid repellent resin layer. Thereafter, an exposure process was performed from the side opposite to the ejection surface, and then a development process was performed to remove the liquid repellent resin layer in the nozzle holes.

  When the periphery of the nozzle hole was observed with an optical microscope, several portions of the liquid-repellent resin layer around the nozzle hole were found near the end of the nozzle plate where they were shifted from the outline of the nozzle hole. Further, when a positive photosensitive paint was applied, the film thickness around the nozzle holes was not uniform, and a good liquid repellent resin layer could not be formed.

  The method for producing a nozzle plate with a liquid repellent resin layer of the present invention can be used for producing nozzle holes of various liquid ejection devices that eject various liquid materials. As the liquid material, it can be used for discharging various functional liquids such as a coloring material, an insulating coating liquid, and a conductive coating liquid according to the purpose.

Explanatory drawing which shows the process of the manufacturing method of the nozzle plate with a liquid repellent resin layer of this invention (1). Explanatory drawing which shows the process of the manufacturing method of the nozzle plate with a liquid repellent resin layer of this invention (2). Explanatory drawing which shows the process of the manufacturing method of the nozzle plate with a liquid repellent resin layer of this invention (3). Explanatory drawing which shows the process of the manufacturing method of the nozzle plate with a liquid repellent resin layer of this invention (4).

Explanation of symbols

1 Nozzle plate 2 Nozzle hole 3 Liquid repellent resin layer 32 Electrodeposition resin layer

Claims (4)

  A process of forming a liquid-repellent resin layer on the discharge surface side surface of the nozzle plate that has nozzle holes for discharging droplets to cover the nozzle holes, and removing the liquid-repellent resin layer in the nozzle holes by self-alignment by wet processing The manufacturing method of the nozzle plate with a liquid repellent resin layer characterized by including the process to perform.   The method for producing a nozzle plate with a liquid repellent resin layer according to claim 1, wherein the wet treatment includes a step of supplying a liquid repellent resin layer removing liquid from a surface opposite to the surface on which the liquid repellent resin layer is laminated.   The wet processing includes a step of further forming an electrodeposited resin layer on the liquid repellent resin layer other than the nozzle holes, and a step of supplying a liquid repellent resin layer removing liquid from the surface on which the electrodeposited resin layer is formed. 2. A method for producing a nozzle plate with a liquid repellent resin layer according to 1.   The method for producing a nozzle plate with a liquid-repellent resin layer according to claim 1, wherein the wet treatment includes a step of supplying the liquid-repellent resin layer removing liquid after thinning the liquid-repellent resin layer in the nozzle holes.

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