JP2009167359A - Heat-dissipating resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-dissipating resin composition excellent in heat-dissipating property, thermal deformation resistance, toning property, glossiness, impact resistance and flexural strain characteristics, and to provide a molded article containing the same. <P>SOLUTION: The heat-dissipating resin composition comprises a polyarylene sulfide (A), polytetramethylene adipamide (B), and boron nitride (C), wherein the amounts of the components (A), (B) and (C) are 10 to 90 mass%, 5 to 70 mass%, and 5 to 85 mass% [the total amount of the components (A) to (C) is 100 mass%], respectively. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat-dissipating resin composition, and more specifically, a heat-dissipating resin composition suitable for forming an LED mounting substrate that constitutes a surface-mounting LED package and a reflector disposed on the LED mounting substrate. It relates to a thing and said each article.

  Conventionally, an LED element is used as a light source such as an indicator lamp because it is small in size, has a long life, and is excellent in power saving. In recent years, LED elements with higher luminance have been manufactured at a relatively low cost, and their use as light sources to replace fluorescent lamps and incandescent lamps has been studied. When applying to such a light source, in order to obtain a large illuminance, a plurality of LED elements are arranged on a surface mount type LED package, that is, a base substrate made of metal such as aluminum (LED mounting substrate), for example, A method of arranging a reflector that reflects light in a predetermined direction around each LED element is frequently used. However, since LED elements generate heat during light emission, in such a type of LED lighting device, a temperature increase during light emission of the LED elements leads to a decrease in luminance, a shortened life of the LED elements, and the like. Therefore, an LED lighting device having a structure in which a bare chip of an LED element is mounted on a base substrate made of a metal having high heat dissipation property and heat generated during light emission is diffused to the base substrate has been proposed (for example, Patent Document 1 and 2).

JP-A-62-149180 JP 2002-344031 A

  An object of the present invention is to provide a heat dissipation property and an electrical insulation property when the LED element emits light in any of the case where the LED mounting substrate and the reflector constituting the surface mounting type LED package are used. (Hereinafter referred to as “insulating”) and a heat dissipating resin composition excellent in heat resistance, and an LED mounting substrate and a reflector including the same.

  As a result of diligent research to solve the above-mentioned problems, the present inventors have made a LED mounting substrate using a composition containing a specific thermoplastic resin and a specific thermal conductive filler, and a reflector. In any case, it was found that the LED element was excellent in heat dissipation, insulation and heat resistance when emitting light, and the present invention was completed.

The present invention is shown below.
1. It contains polyarylene sulfide (A), polytetramethylene adipamide (B) and boron nitride (C), the proportion of component (A) is 10 to 90 mass%, and the proportion of component (B) is 5 to 70 mass%. %, The ratio of a component (C) is 5-85 mass% (however, the total amount of a component (A)-(C) is 100 mass%), The heat-radiating resin composition characterized by the above-mentioned.
2. 2. The heat-dissipating resin composition as described in 1 above, wherein 0.05 to 30 parts by mass of the colorant (D) is blended with respect to 100 parts by mass in total of the components (A) to (C).
3. Thermal conductivity is 2.0 (w / m · K) or higher, thermal deformation temperature is 260 (° C) or higher, thermal emissivity is 0.7 or higher, and Charpy impact strength is 2.0 (kJ / m ² ) or higher. 2. The heat dissipating resin composition as described in 1 above.
4). An LED mounting substrate comprising the heat-dissipating resin composition according to any one of 1 to 3 above.
5. A reflector comprising the heat-dissipating resin composition as described in any one of 1 to 3 above.
6). An LED mounting substrate comprising the reflector according to 5 above.
7). A molding material for surface mounting components, comprising the heat-dissipating resin composition according to any one of 1 to 3 above.

  According to the heat-dissipating resin composition of the present invention, it is excellent in moldability and impact resistance, and when it is used as an LED mounting substrate and as a reflector, the LED element emits light. Excellent heat dissipation, insulation and heat resistance. Therefore, the LED mounting substrate and the reflector including the heat-dissipating resin composition of the present invention are prevented from increasing in temperature due to heat generation when the LED element emits light, so that the luminance is not lowered. The life of the LED element can be extended.

  According to the LED mounting substrate of the present invention, the heat dissipation, insulation and heat resistance when the LED element emits light are excellent. According to the reflector of this invention, it is excellent in the heat dissipation, the insulation, heat resistance, and the reflectivity with respect to light when the LED element is light-emitting. And since the heat-radiating resin composition of the present invention is obtained as an integrally molded product in which the substrate and the reflector portion are in a continuous phase, it is excellent in productivity, and as a result, it is also excellent in productivity of the LED lighting device. .

  The present invention will be described in detail below.

<Heat-dissipating resin composition>
The heat-radiating resin composition of the present invention contains polyarylene sulfide (A), polytetramethylene adipamide (B), and boron nitride (C).

  The polyarylene sulfide used in the present invention is a polymer based on the structural formula [—Ar—S—] (where Ar is an arylene group, and S is sulfur). A typical example is a polymer containing a repeating unit represented by the following general formula (1), preferably 70 mol% or more, more preferably 80 mol% or more. If this repeating unit is less than 70 mol%, the original crystalline component characteristic of the crystalline polymer is small, and the mechanical strength may be insufficient.

(In the formula, R ¹ is a substituent selected from hydrogen, an alkyl group having 6 or less carbon atoms, an alkoxy group, a phenyl group, a carboxyl group or a metal salt thereof, a nitro group, and a halogen atom such as fluorine, chlorine and bromine. Yes, m is an integer of 0 to 4. n represents the average degree of polymerization and is in the range of 20 to 100.)

  In the present invention, as the polyarylene sulfide, a copolymer can be used in addition to the homopolymer. Examples of copolymer structural units include m-phenylene sulfide units, o-phenylene sulfide units, p, p'-diphenylene ketone sulfide units, p, p'-diphenylenesulfone sulfide units, p, p'-diphenylene. Examples thereof include a sulfide unit, p, p′-diphenylenemethylene sulfide unit, p, p′-diphenylenecumenyl sulfide unit, and naphthyl sulfide unit. The content of these structural units is preferably 30 mol% or less, more preferably 20 mol% or less.

  The crystallization temperature of polyarylene sulfide is not particularly limited, and the molecular structure may be any of linear type, semi-linear type, and branched type. In the present invention, those having a linear molecular structure are preferable because the effects of the present invention are remarkably exhibited. Polyarylene sulfide can be produced by a known polymerization method, but is preferably produced by a continuous polymerization method using lithium sulfide.

  Nylon 4 and 6 used in the present invention include polytetramethylene adipamide obtained from tetramethylene diamine and adipic acid and a copolyamide having polytetramethylene adipamide units as main components. Furthermore, other polyamides may be included as a mixing component as long as the characteristics of nylon 4 and 6 are not impaired. The copolymer component is not particularly limited, and a known amide-forming component can be used. Representative examples of copolymer components include amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminoundecanoic acid and paraaminomethylbenzoic acid, lactams such as ε-caprolactam and ω-lauryllactam, hexamethylenediamine, un Decamethylenediamine, dodecamethylenediamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, metaxylylenediamine, paraxylylenediamine, 1,3-bis (amino Methyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane, bis (3-methyl-4-aminocyclohexyl) methane, 2,2- Bis (4-aminocyclohexyl) propane, 2,2-bis (aminopros B) Diamines such as piperazine and aminoethylpiperazine and adipic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid Examples thereof include dicarboxylic acids such as 5-sodium sulfoisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid, and diglycolic acid.

  Moreover, the manufacturing method of nylon 4 and 6 used by this invention is arbitrary. For example, the methods disclosed in JP-A-56-149430, JP-A-56-149431, JP-A-58-83029, JP-A-61-43631, etc. A prepolymer with a low content is produced under specific conditions and then solid-phase polymerized in a steam atmosphere to prepare high viscosity nylons 4 and 6 or in a polar organic solvent such as 2-pyrrolidone or N-methylpyrrolidone. There is a method to get it by heating with. The degree of polymerization of nylon 4 and 6 is not particularly limited, but nylon 46 having a relative viscosity in the range of 2.0 to 6.0 at 25 g and 96% sulfuric acid at 1 g / dl is preferably used.

The boron nitride used in the present invention includes a plurality of c-BN (zinc blende structure), w-BN (wurtzite structure), h-BN (hexagonal crystal structure), r-BN (rhombohedral crystal structure), etc. The stable structure of is known. In the present invention, any boron nitride can be used, but hexagonal boron nitride is preferred. By using hexagonal structure boron nitride, the wear of the molding machine and the mold used for obtaining the molded product can be reduced.
Hexagonal boron nitride has a layered crystal structure, and the shape thereof is a flat plate (scale-like). In boron nitride having this layered structure, the thermal conductivity in the direction parallel to the layer (a-axis direction) is said to be about 30 times that in the direction perpendicular to the layer (c-axis direction).

  The shape of the boron nitride is not particularly limited, and can be spherical, linear (fibrous), flat (scale-like), curved, etc. ) Use of a scaly product is preferable because a molded product having excellent thermal conductivity can be obtained and the mechanical properties can be improved. Scale-like boron nitride is excellent in insulation, and since boron nitride itself is excellent in whiteness, it is easy to obtain a molded product with high whiteness, excellent in reflection characteristics with respect to light, and a reflector part. In any case where the LED mounting substrate is provided, the reflection characteristics with respect to light when the LED element emits light are also excellent.

Boron nitride preferably has a volume average particle diameter of 2 to 100 μm as measured by a laser diffraction method, more preferably 3 to 50 μm, and still more preferably 5 to 30 μm. The specific surface area is preferably 8 m ² / g or less, more preferably 4 m ² / g. Further, the particle diameter D10 when the cumulative volume obtained by measuring the particle size distribution is 10% is preferably 7 μm or less, more preferably 6 μm or less, and the particle diameter D90 when 90% is 30 μm or more. Preferably, it is 35 μm or more. Moreover, it is preferable that the value of ratio D90 / D10 of D10 and D90 is 3-15, More preferably, it is 5-10.
Further, the aspect ratio of boron nitride is preferably 3 or more, more preferably 4 or more, and further preferably 5 to 10. The purity is preferably 98% or more, more preferably 99% or more. The tap density is preferably 0.5 g / cm ³ or more, more preferably 0.7 g / cm ³ or more. The L value is preferably 93 or more.
By setting it as these ranges, the molded article excellent in heat dissipation, heat conductivity, and the reflective characteristic with respect to light can be obtained. Further, boron nitride having different particle diameters may be used in combination within the above range. Further, boron nitride is preferably dispersed rather than agglomerated type in which primary particles are aggregated.

  In the present invention, the blending ratio of polyarylene sulfide (A), polytetramethylene adipamide (B) and boron nitride (C) is as follows. That is, the ratio of the component (A) is 10 to 90% by mass, the ratio of the component (B) is 5 to 70% by mass, and the ratio of the component (C) is 5 to 85% by mass (provided that the components (A) to (C) ) Is 100% by mass). When the proportion of the component (A) is less than the above range, the heat resistance decreases and the color tone deteriorates, and when it exceeds the above range, the impact strength decreases. When the proportion of the component (B) is less than the above range, the impact strength is lowered, and when it exceeds the above range, the hygroscopicity is increased, and the blister resistance and the color tone are deteriorated. When the ratio of a component (C) is less than said range, heat conductivity falls and heat dissipation performance is inferior. The proportion of component (A) is preferably 10 to 65 mass%, the proportion of component (B) is preferably 5 to 50 mass%, and the proportion of component (C) is preferably 30 to 80 mass%.

  The heat-dissipating resin composition of the present invention may contain an additive depending on the purpose and application. These additives include fillers, heat stabilizers, antioxidants, UV inhibitors, anti-aging agents, antistatic agents, plasticizers, lubricants, flame retardants, mold release agents, antibacterial agents, colorants, crystal nucleating agents. , Flow modifiers, impact modifiers and the like. In addition, when using the heat-radiating resin composition of the present invention for the formation of a reflector and the formation of a substrate for LED mounting having a reflector portion, an additive is selected so that the composition can maintain a white color. It is preferable to do. Moreover, when using the heat dissipation resin composition of this invention for formation of the board | substrate for LED mounting which is not provided with a reflector part, it may be colored with the additive.

Examples of the filler include talc, mica, clay, wollastonite, silica, calcium carbonate, glass fiber, glass beads, glass balloon, milled fiber, glass flake, aramid fiber, polyarylate fiber, and the like. These can also be used in combination of two or more.
Content of the said filler is 3-30 mass parts normally, when the sum total of the said component (A)-(C) is 100 mass parts.

Examples of the heat stabilizer include phosphites, hindered phenols, thioethers, and the like. These can also be used in combination of two or more.
Content of the said heat stabilizer is 0.1-5 mass parts normally, when the sum total of the said component (A)-(C) is 100 mass parts.

Examples of the antioxidant include hindered amines, hydroquinones, hindered phenols, and sulfur-containing compounds. These can also be used in combination of two or more.
Content of the said antioxidant is 0.1-5 mass parts normally, when the sum total of the said component (A)-(C) is 100 mass parts.

Examples of the ultraviolet absorber include benzophenones, benzotriazoles, salicylic acid esters, metal complex salts and the like. These can also be used in combination of two or more.
Content of the said ultraviolet absorber is 0.05-5 mass parts normally, when the sum total of the said component (A)-(C) is 100 mass parts.

Examples of the anti-aging agent include naphthylamine compounds, diphenylamine compounds, p-phenylenediamine compounds, quinoline compounds, hydroquinone derivative compounds, monophenol compounds, bisphenol compounds, trisphenol compounds, polyphenol compounds. Thiobisphenol compound, hindered phenol compound, phosphite compound, imidazole compound, nickel dithiocarbamate salt compound, phosphate compound and the like. These can also be used in combination of two or more.
Content of the said anti-aging agent is 0.1-5 mass parts normally, when the sum total of the said na component (A)-(C) is 100 mass parts.

Examples of the plasticizer include phthalates such as dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diisobutyl phthalate, dioctyl phthalate, butyl octyl phthalate, di- (2-ethylhexyl) phthalate, diisooctyl phthalate, and diisodecyl phthalate; dimethyl adipate , Diisobutyl adipate, di- (2-ethylhexyl) adipate, diisooctyl adipate, diisodecyl adipate, octyl decyl adipate, di- (2-ethylhexyl) azelate, diisooctyl azelate, diisobutyl azelate, dibutyl sebacate, di- Fatty acid esters such as (2-ethylhexyl) sebacate, diisooctyl sebacate; trimellitic acid isodecyl ester, trimellitic acid octy Esters, trimellitic acid esters such as trimellitic acid n-octyl ester, trimellitic acid isononyl ester; di- (2-ethylhexyl) fumarate, diethylene glycol monooleate, glyceryl monoricinolate, trilauryl phosphate, tristearyl phosphate , Tri- (2-ethylhexyl) phosphate, epoxidized soybean oil, polyether ester and the like. These can also be used in combination of two or more.
Content of the said plasticizer is 0.1-15 mass parts normally, when the sum total of the said component (A)-(C) is 100 mass parts.

Examples of the lubricant include fatty acid ester, hydrocarbon resin, paraffin, higher fatty acid, oxy fatty acid, fatty acid amide, alkylene bis fatty acid amide, aliphatic ketone, fatty acid lower alcohol ester, fatty acid polyhydric alcohol ester, fatty acid polyglycol ester, aliphatic Examples include alcohol, polyhydric alcohol, polyglycol, polyglycerol, metal soap, silicone, and modified silicone. These can also be used in combination of two or more.
Content of the said lubricant is 0.1-5 mass parts normally, when the sum total of the said component (A)-(C) is 100 mass parts.

Examples of the flame retardant include organic flame retardants, inorganic flame retardants, and reactive flame retardants. These can also be used in combination of two or more.
Organic flame retardants include brominated epoxy compounds, brominated alkyltriazine compounds, brominated bisphenol epoxy resins, brominated bisphenol phenoxy resins, brominated bisphenol polycarbonate resins, brominated polystyrene resins, brominated crosslinked polystyrene resins Halogenated flame retardants such as brominated bisphenol cyanurate resin, brominated polyphenylene ether, decabromodiphenyl oxide, tetrabromobisphenol A and oligomers thereof; trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, tripentyl phosphate, toki Hexyl phosphate, tricyclohexyl phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate Phosphate esters such as phosphate, cresyl diphenyl phosphate, dicresyl phenyl phosphate, dimethyl ethyl phosphate, methyl dibutyl phosphate, ethyl dipropyl phosphate, hydroxyphenyl diphenyl phosphate, compounds modified with these substituents, various condensed types Phosphorus ester compounds, phosphorus flame retardants such as phosphazene derivatives containing phosphorus element and nitrogen element; polytetrafluoroethylene, guanidine salts, silicone compounds, phosphazene compounds, and the like. These can also be used in combination of two or more.

Examples of the inorganic flame retardant include aluminum hydroxide, antimony oxide, magnesium hydroxide, zinc borate, zirconium compound, molybdenum compound, and zinc stannate. These can also be used in combination of two or more.
Reactive flame retardants include tetrabromobisphenol A, dibromophenol glycidyl ether, brominated aromatic triazine, tribromophenol, tetrabromophthalate, tetrachlorophthalic anhydride, dibromoneopentyl glycol, poly (pentabromobenzyl polyacrylate) , Chlorendic acid (hett acid), chlorendic anhydride (hett acid anhydride), brominated phenol glycidyl ether, dibromocresyl glycidyl ether and the like. These can also be used in combination of two or more.

Content of the said flame retardant is 5-30 mass parts normally, when the sum total of the said component (A)-(C) is 100 mass parts, Preferably it is 5-20 mass parts.
In addition, when making a heat dissipation resin composition of this invention contain a flame retardant, it is preferable to use a flame retardant adjuvant. As this flame retardant auxiliary, antimony trioxide, antimony tetroxide, antimony pentoxide, sodium antimonate, antimony tartrate, antimony compounds, zinc borate, barium metaborate, hydrated alumina, zirconium oxide, Examples include ammonium polyphosphate and tin oxide. These can also be used in combination of two or more.

Examples of the antibacterial agents include zeolite antibacterial agents such as silver zeolite and silver-zinc zeolite, silica gel antibacterial agents such as complexed silver-silica gel, glass antibacterial agents, calcium phosphate antibacterial agents, and zirconium phosphate antibacterial agents. Silicate antibacterial agents such as silver-magnesium aluminate, titanium oxide antibacterial agents, ceramic antibacterial agents, whisker antibacterial agents, etc .; formaldehyde releasing agents, halogenated aromatic compounds, road Organic antibacterial agents such as propargyl derivatives, thiocyanato compounds, isothiazolinone derivatives, trihalomethylthio compounds, quaternary ammonium salts, biguanide compounds, aldehydes, phenols, pyridine oxide, carbanilide, diphenyl ether, carboxylic acid, organometallic compounds; inorganic and organic Hybrid antibacterial agent; natural anti Agent, and the like. These can also be used in combination of two or more.
Content of the said antibacterial agent is 0.05-5 mass parts normally, when the sum total of the said component (A)-(C) is 100 mass parts.

As the colorant, any of inorganic pigments, organic pigments, and dyes may be used. Moreover, you may use combining these.
The content of the colorant is usually 0.05 to 30 parts by mass, preferably 0.1 to 15 parts by mass, and more preferably 0 when the total of the components (A) to (C) is 100 parts by mass. .1 to 10 parts by mass.
Examples of the impact modifier include graft rubber.

<Method for producing composition>
The heat-dissipating resin composition of the present invention can be produced by supplying the raw material components weighed so as to have the above predetermined content to an extruder, a Banbury mixer, a kneader, a roll, a feeder ruder, and kneading. it can. The method for supplying the raw material components is not particularly limited, and the respective components may be mixed and kneaded in a lump, or may be kneaded in multiple stages and divided.
The kneading temperature is usually 280 to 350 ° C., although it is selected depending on the types of nylon 4 and 6 and the content of the heat conductive filler.

<Properties of composition>
In the heat-dissipating resin composition of the present invention, the boron nitride is uniformly dispersed using the polyarylene sulfide and nylon 4, 6 as a matrix. Therefore, the molded article containing the heat-dissipating resin composition of the present invention is excellent in heat dissipation, heat resistance, insulation and blister resistance.

  In the heat-dissipating resin composition of the present invention, the deflection temperature under load (load 1.80 MPa) according to ISO75 is usually 200 ° C. or higher, preferably 230 to 280 ° C., more preferably 240 to 280 ° C. When this temperature is less than 200 ° C., deformation in the reflow soldering process tends to occur.

  The thermal conductivity at 25 ° C. is usually 2.0 W / (m · K) or more, preferably 3.0 to 10.0 W / (m · K), more preferably 3.0 to 6.0 W. / (M · K). If the said heat conductivity is the said range, it will be excellent in the physical property balance of heat dissipation and mechanical strength. When the thermal conductivity is less than 2.0 W / (m · K), the heat dissipation tends to be inferior. In addition, the said heat conductivity is the value measured with respect to the flow direction of the composition when a molded article is manufactured, and a measuring method is demonstrated in [Example] mentioned later.

  Further, the thermal emissivity is usually 0.7 or more, preferably 0.75 or more, more preferably 0.8 or more. If the thermal emissivity is less than 0.7, the heat dissipation is not sufficient. A method for measuring the thermal emissivity will be described later in [Example].

  Furthermore, the light reflectance is usually 80% or more, preferably 85 to 99%, more preferably 90 to 980%. The higher the light reflectance, the better the reflection characteristics of light from the LED element. The method for measuring the light reflectance will be described in the examples described later.

Regarding the insulating property of the heat-dissipating resin composition, the surface specific resistance (insulating index, the higher the value, the better the insulating property) of the molded product containing the heat-dissipating resin composition of the present invention is usually 1 × 10 ¹³ Ω or more. Preferably, it is 1 × 10 ¹⁴ Ω or more. Within this range, the insulation is excellent.
Dielectric breakdown refers to a phenomenon in which, when the voltage applied to an insulator exceeds a certain limit, the insulator is electrically broken and loses its insulating properties to cause a current to flow. The voltage at this time is called a dielectric breakdown voltage. As the insulator, one having a high dielectric breakdown strength is preferable. The dielectric breakdown voltage is preferably 10 kV / mm or more.

Since the heat-dissipating resin composition of the present invention has the excellent properties as described above, it is suitable for forming an LED mounting substrate or a reflector disposed on the LED mounting substrate.
Examples of the surface mount component include the LED mounting substrate and the reflector described above.

<Molded product>
The board | substrate for LED mounting of this invention consists of the heat-radiating resin composition of the said invention, It is characterized by the above-mentioned. Moreover, the reflector of this invention consists of the heat-radiating resin composition of the said invention, It is characterized by the above-mentioned.
The board | substrate for LED mounting and reflector of this invention are the components of a surface mount type LED package, and can be demonstrated using the schematic sectional drawing (FIGS. 1-3) in the case of the form of wire bonding mounting.

  1 and 2 includes an LED mounting substrate 11a, a reflector 12, an LED element 13, an electrode 14, a lead wire 15 connecting the LED element 13 and the electrode 14, and a transparent seal. A stop (or gap) 16 and a lens 17 are provided.

<LED mounting board>
The shape of the LED mounting substrate of the present invention is usually a flat plate shape such as a square or a circle. The cross-sectional shape may be uniformly flat, and the surface on which the LED element is disposed may be provided with a concave portion, a convex portion, a through hole, or the like according to the purpose, application, or the like. For example, according to FIG. 1, a concave portion is provided on one surface of the substrate 11a, and the LED element 13 is disposed on the bottom surface of the concave portion.
Further, a groove or the like may be provided on the surface of the substrate 11a where the LED element 13 is not provided in order to improve heat dissipation by increasing the surface area.

The LED mounting substrate of the present invention may be a large substrate that can include a plurality of LED elements, but may be a small substrate that can include one LED element. Therefore, the size of the LED mounting substrate of the present invention is selected according to the purpose, application, and the like.
The thickness of the LED mounting substrate of the present invention (thickness of a portion not provided with a concave portion, a convex portion, etc.) is selected according to the purpose, application, and the like.

  The surface-mount type LED package 1 of FIGS. 1 and 2 is a mode in which an LED mounting substrate 11a and a reflector 12 that reflects light in a predetermined direction around a light emitting LED element 13 are separately prepared and arranged. However, the embodiment shown in FIG. 3 may be adopted. That is, the surface-mounted LED package 1 of FIG. 3 includes an LED mounting substrate 11b having a reflector portion 12b, an LED element 13, an electrode 14, a lead wire 15 connecting the LED element 13 and the electrode 14, and a transparent seal. In this embodiment, a stop (or gap) 16 and a lens 17 are provided. In addition, about the shape of the reflector part 12b, it is the same as that of the reflector 12 in FIG.1 and FIG.2, and it demonstrates in the below-mentioned "2-2. Reflector."

  As is apparent from FIG. 3, the LED mounting substrate of the present invention is an LED mounting substrate in which the LED mounting substrate 11a and the reflector 12 shown in FIG. 1 are in a continuous phase (an LED mounting substrate including a reflector portion 12b). ) 11b. If it is the board | substrate 11b for LED mounting provided with this reflector part, compared with the conventional manufacturing method, a surface mount type LED package can be obtained with a small number of parts and a small manufacturing process, and it is excellent in a performance surface and a cost surface. That is, in FIG. 5 which is an example of the conventional surface mount type LED package 3, an insulating base 18 for arranging LED elements is laminated on a metal substrate 11 c such as metal aluminum, and the LED element 13 is placed on the base 18. After the disposition, it was manufactured by disposing a reflector 12 containing polyphthalamide or the like around the LED element 13. However, according to the LED mounting substrate 11b, unlike a metal that requires processing, the heat-dissipating resin composition of the present invention can easily form a predetermined shape, and there is no need to provide an insulating base 18. Also, there is no need to provide a reflector.

<Reflector (reflector part)>
The reflector 12 of the present invention may be used in combination with the LED mounting substrate 11a of the present invention, or may be used in combination with an LED mounting substrate made of other materials.
The reflector 12 of the present invention and the reflector portion 12b in the LED mounting substrate 11b mainly have an action of reflecting light from the LED element 13 toward the lens 17 on the inner surface thereof.

  These shapes generally conform to the shape of the end portion (joint portion) of the lens 17 and are usually cylindrical shapes such as a square shape, a circular shape, and an oval shape. 1 and 2, the reflector 12 is a cylindrical body. In FIG. 1, the end 122 (right side of the drawing) of the reflector 12 is in contact with the LED mounting substrate 11a. The end 121 (left side of the drawing) of the reflector 12 is in contact with and fixed to the side surface of the LED mounting substrate 11a. On the other hand, in FIG. 2, all end surfaces of the reflector 12 are in contact with and fixed to the surface of the LED mounting substrate 11a. In addition, in order to improve the directivity of the light from the LED element 13, the inner surface of the reflector 12 of this invention and the reflector part 12b in the said board | substrate 11b for LED mounting may be expanded upward in the taper shape ( (See FIG. 2).

  Further, the reflector 12 of the present invention and the reflector portion 12b in the LED mounting substrate 11b can be used as a lens holder when the end portion on the lens 17 side is processed into a shape corresponding to the shape of the lens 17. Can function.

  The reflector 12 of the present invention and the reflector portion 12b in the LED mounting substrate 11b may include a concave portion, a convex portion, a through-hole, and the like depending on the purpose and application. For example, according to FIG. 1, the reflector 121 includes a through hole, and the electrode 14 is disposed through the through hole.

  Moreover, when the reflector 12 of the present invention and the reflector portion 12b of the LED mounting substrate 11b have a high degree of whiteness, the LED element substrate 11b has a high reflectance with respect to the light emitted from the LED element. Although a characteristic can be obtained, in order to obtain a higher reflection characteristic, a light reflection layer may be formed on the inner wall surface. The thickness of the light reflecting layer is preferably 25 μm or less, more preferably 20 μm or less, and still more preferably 15 μm or less, from the viewpoint of reducing thermal resistance.

<Surface mount LED package>
By using the LED mounting substrate and the reflector of the present invention, a surface mounting type LED package in a wire bonding mounting form as shown in FIGS. 1 to 3 can be easily obtained.
The LED element 13 emits radiant light (generally UV or blue light in a white light LED), for example, an active layer made of AlGaAs, AlGaInP, GaP or GaN sandwiched between n-type and p-type cladding layers. A semiconductor chip (light emitter) having a double heterostructure, for example, has a hexahedral shape with a side length of about 0.5 mm. As described above, when not in the form of wire bonding mounting, the lead wire 15 is not used and the chip is flip-chip mounted on the wiring pattern disposed near the LED element 13 via the bump. be able to.
The electrode 14 is a connection terminal for supplying a drive voltage, and is disposed through the reflector 12 of the present invention or a through hole provided in the reflector portion 12b of the LED mounting substrate 11b.
The lead wire 15 electrically connects the LED element 13 and the electrode 14. When the lead wire 15 has the transparent sealing portion 16, the lead wire 15 is embedded in the transparent sealing portion 16.
The lens 17 is usually made of resin, can have various structures depending on the purpose, application, etc., and may be colored.

Moreover, the code | symbol 16 in FIGS. 1-3 may be a transparent sealing part, and may be a space | gap part as needed. Usually, it is a transparent sealing part filled with a material that provides translucency and insulation. In wire bonding mounting, force applied by direct contact with the lead wire 15 and vibration, impact, etc. applied indirectly Accordingly, it is possible to prevent an electrical failure caused by the lead wire 15 being disconnected, disconnected, or short-circuited from the connection portion with the LED element 13 and / or the connection portion with the electrode 14. At the same time, the LED element 13 can be protected from moisture, dust, etc., and the reliability can be maintained over a long period of time.
Examples of the main component of the light-transmitting and insulating material include silicone resins, acrylic resins, epoxy resins, and polycarbonate resins. These can also be used in combination of two or more. In addition, the said transparent sealing part may also contain the inorganic type and / or organic type fluorescent substance which converts the wavelength of the light emitted from the LED element into a predetermined wavelength as needed.

Below, an example of the manufacturing method of the surface mounting type LED package (FIG. 1) of a wire bonding mounting form is demonstrated.
First, the heat-dissipating resin composition of the present invention is formed into a plate-like LED mounting substrate 11a having a concave portion and a cylindrical electrode by injection molding using a mold having a cavity space having a predetermined shape. The reflector 12 having a through hole in which 14 can be inserted from the inner surface to the outer surface is formed. Thereafter, separately prepared LED elements 13, electrodes 14 and lead wires are fixed to the LED mounting substrate 11a and the reflector 12 with an adhesive or a bonding member. Next, a transparent sealant composition containing a silicone-based resin or the like is placed in the recess formed by the LED mounting substrate 11 a and the reflector 12, and cured by drying or the like to form the transparent sealing portion 16. Then, the lens 17 is arrange | positioned on the transparent sealing part 16, and the surface mount type LED package shown in FIG. 1 is obtained.

<LED lighting device>
Using the surface mount LED package having the LED mounting substrate of the present invention, the surface mount LED package having the reflector of the present invention, or the surface mount LED package having the LED mounting substrate having the reflector portion of the present invention. Thus, an LED lighting device can be obtained. FIG. 4 shows a schematic cross-sectional view of an LED lighting device using the surface-mount type LED package of FIG.

  The LED lighting device 2 of FIG. 4 is an aspect including two surface-mount LED packages, the surface-mount LED package of FIG. 1, the electrodes 14 constituting the package, and a bias voltage for causing the LED elements to emit light. A wiring pattern 22 for connecting an application power source (not shown) and a lighting device substrate 21 including the wiring pattern 22 are provided. Furthermore, you may provide the housing for covering these surface mount type LED packages and the board | substrate 21 for illuminating devices.

  Although the structure of the board | substrate 21 for illuminating devices is not specifically limited, For example, as FIG. 4, it is set as the 2 layer type | mold of the board | substrate 211 (preferably resin-made heat sink) and the board | substrate 212 (preferably resin-made heat sink). The substrate 211 may include a wiring pattern. In FIG. 4, since the surface-mount LED package (of FIG. 1) includes the LED mounting substrate 11a having excellent heat dissipation and insulation, the LED mounting substrate 11a in the substrate 211 and the substrate 212 is provided. The part below is opened as a through hole.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to such examples as long as the gist of the present invention is not exceeded. In the following, parts and% are Unless otherwise specified, it is based on mass.

  The raw material components of the compositions used in the following examples and comparative examples are shown.

(1) Polyarylene sulfide (PPS): “Fortron PPS 0220A9” manufactured by Polyplastics
(2) Nylon 4, 6 (PA46): “STANYL TS300” manufactured by DSM (relative viscosity of 3.0 with 96% sulfuric acid 1 g / dl)
(3) Boron nitride: “Denkaboron nitride powder SGP” manufactured by Denki Kagaku Kogyo Co., Ltd. (hexagonal structure, average particle size 18.0 μm, specific surface area 2 m ^{2 /} g, D10 = 5.4 μm, D90 = 41.6 μm, D90 / D10 = 7.7)
(4) Titanium oxide (colorant): “Taipeke PF691” manufactured by Ishihara Sangyo Co., Ltd.

Examples 1-4 and Comparative Examples 1-2:
A resin component and a thermally conductive filler (boron nitride) and the like are put in a mixer at a ratio shown in Tables 1 and 2 and mixed for 5 minutes, and then an extruder (“BT-40-S2-30-L type”, plastic engineering). Using a weakly kneaded type screw and melt-kneading extrusion at a screw rotation speed of 100 rpm and a cylinder temperature of 310 ° C. to obtain pellets (heat dissipating resin composition).

  The test regarding the following evaluation items was done using the pellet obtained above. The results are shown in Tables 1 and 2.

(1) Thermal emissivity:
Using a pellet made of a heat-dissipating resin composition, a test piece having a size of 150 × 150 × 3 mm was prepared by injection molding (mold temperature: 120 ° C.), and a thermo spot sensor (“TSS-5X type”, Japan sensor) Was used, and was measured at an ambient temperature of 25 ° C. by a reflection energy measurement method using infrared detection.

(2) Thermal conductivity (unit: W / (m · K)):
Using pellets made of a heat-dissipating resin composition, the melt was injected from below a mold (mold temperature: 120 ° C.) having a cavity space with a diameter of 10 mm and a length of 50 mm, and a diameter of 10 mm and a length of 50 mm. A cylindrical body was prepared. Then, it cut out so that it might become a disk with a thickness of 1.5 mm in the substantially central part, and this was made into the test piece (diameter 10mm and thickness 1.5mm). In order to measure the thermal conductivity with respect to the flow direction of the heat-dissipating resin composition, a probe is applied to each of the upper and lower surfaces of the test piece, and a laser flash method thermal constant measuring device (“TR-7000R type”). , Manufactured by ULVAC-RIKO) and measured at 25 ° C.

(3) Deflection temperature under load:
Measured according to ISO 75 (load 1.80 MPa).

(4) Blister resistance:
A sample formed by injection molding with outer dimensions of 127 mm in length × 12.7 mm in width × 0.8 mm in thickness is immersed in water at 23 ° C. for 24 hours, and the test specimen after immersion is fixed to a glass epoxy substrate having a thickness of 1.6 mm. The tabletop type far-red light is set so that the temperature of the preheating part is 150 ± 3 ° C., the passage time is 120 seconds, the maximum temperature of the reflow part is 230 ± 2 ° C., and the passage time is 60 seconds. Using an external reflow furnace, the presence or absence of blisters after passing through the reflow furnace was observed with the naked eye and evaluated according to the following criteria. “No change” was marked with “◯”, and “blowing, deformation, discoloration” was marked with “x”.

(5) Charpy impact strength (unit: kJ / m ² ):
Notched data was measured according to ISO179.

(6) Surface resistivity (unit: Ω):
Using a pellet made of a heat-dissipating resin composition, a circular test piece having a diameter of 200 mm and a thickness of 2 mm was produced by injection molding (mold temperature: 120 ° C.), and a high resistance meter (“4339B type”, Agilent) Measured using Technologies).

(7) Light reflectance:
Using the test piece of (2) above, the reflectance with respect to ultraviolet rays (wavelength 460 nm) was measured with an ultraviolet-visible near-infrared spectrophotometer (“V-670 type” manufactured by JASCO Corporation) at an incident angle of 60 degrees.

(8) Water absorption rate:
An increase in weight was measured after an absolutely dry sample molded to 50 mm in diameter and 3.2 mm in thickness by injection molding was immersed in 23 ° C. water for 24 hours.

(9) Dielectric breakdown characteristics:
Using pellets made of a heat-dissipating resin composition, a test piece having a size of 100 × 100 × 1 mm was prepared by injection molding (mold temperature: 120 ° C.), and kept in a constant temperature and humidity chamber at 23 ° C. and a relative humidity of 62%. It was adjusted for 48 hours and measured according to ASTM D149.

    From Tables 1 and 2, the following is clear. That is, since the amount of PA46 used in Comparative Example 1 is less than the range of the present invention, the balance between thermal conductivity and impact resistance is poor. In Comparative Example 2, since the amount of boron nitride used is less than the range of the present invention, the thermal emissivity and thermal conductivity are low, and the heat dissipation is inferior. On the other hand, Examples 1-4 are excellent in the balance of heat conductivity and impact resistance, and heat dissipation, and have high heat emissivity and heat conductivity.

Test Example 1:
Using the heat-dissipating resin composition of Example 1, a circular silicone rubber heater (diameter 40 mm) 5 was placed at the center of the surface of the test piece 4 produced in (9) above, and an applied voltage of 10 V and A constant current was passed under the condition of a watt density of 0.5 W / cm ² and heating was performed (see FIG. 6). The temperature at the center position was measured after 10 minutes and found to be 55 ° C. At the same time, the temperature was measured at the position of “X” in the upper left in FIG. On the other hand, when the heat dissipation resin composition of Comparative Example 2 was used in the same manner as described above, the temperature at the center position was 71 ° C. and the temperature at the “X” position was 25 ° C. From this result, it is clear that the heat-dissipating resin composition of the present invention is excellent in heat dissipation.

  As described above, the heat-dissipating resin composition of the present invention is a constituent member of an LED lighting device and is suitable for forming a member that requires heat dissipation, insulation, or heat resistance. Therefore, it is suitable for LED mounting substrates, reflectors and the like.

It is the schematic which shows an example of the cross-sectional structure of a surface mount type LED package provided with the board | substrate for LED mounting of this invention, and a reflector. It is the schematic which shows the other example of the cross-section of a surface mount type LED package provided with the board | substrate for LED mounting of this invention, and a reflector. It is the schematic which shows the other example of the cross-section of a surface mount type LED package provided with the board | substrate for LED mounting (LED mounting board provided with a reflector part) of this invention. It is the schematic which shows an example of the cross-section of an LED illuminating device provided with a surface mount type LED package. It is the schematic which shows an example of the cross-section of the conventional surface mount type LED package. 10 is an explanatory diagram showing a test method in Test Example 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Surface mount type LED package 11a; LED mounting board | substrate 11b; LED mounting board | substrate 11c provided with a reflector part: Metal LED mounting board | substrate 12; Reflector 12b; Reflector part 13; LED element 14; Electrode 15; Lead wire 16 ; Transparent sealing part (or void part)
DESCRIPTION OF SYMBOLS 17; Lens 18; Insulation base 2; LED illuminating device 21; Board | substrate 22 for illuminating devices; Wiring pattern 3; Conventional surface mount type LED package 4; Test piece for heat dissipation evaluation 5; Silicone rubber heater

Claims (7)

  It contains polyarylene sulfide (A), polytetramethylene adipamide (B) and boron nitride (C), the proportion of component (A) is 10 to 90 mass%, and the proportion of component (B) is 5 to 70 mass%. %, The ratio of a component (C) is 5-85 mass% (however, the total amount of a component (A)-(C) is 100 mass%), The heat-radiating resin composition characterized by the above-mentioned.   The heat-radiating resin composition according to claim 1, wherein 0.05 to 30 parts by mass of the colorant (D) is blended with 100 parts by mass of the total of components (A) to (C). Thermal conductivity is 2.0 (w / m · K) or higher, thermal deformation temperature is 260 (° C.) or higher, thermal emissivity is 0.7 or higher, and Charpy impact strength is 2.0 (kJ / m ² ) or higher. The heat-radiating resin composition according to claim 1.   An LED mounting substrate comprising the heat dissipating resin composition according to any one of claims 1 to 3.   A reflector comprising the heat dissipating resin composition according to claim 1.   An LED mounting board comprising the reflector according to claim 5.   A molding material for surface mount components, comprising the heat dissipating resin composition according to any one of claims 1 to 3.

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