JP2009166392A - Metal mask plate and manufacturing method for metal mask plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal mask plate that is satisfactory in adhesion with a printed face. <P>SOLUTION: The metal mask plate 230 has a structure in which an emulsion layer 234 is added to the printing face side of a metal plate 232. The permeation areas 288 and 290 of the metal plate 232 have openings 236 and 238, respectively, which allow permeation of a viscous substance. The permeation areas 288 and 290 of the emulsion layer 234 also have openings 240 and 242, respectively, which allow permeation of the viscous substance. The position and the flat shape of the opening 240 are identical to those of the opening 236. The position and the flat shape of the opening 242 are identical to those of the opening 238. The emulsion layer 234 is made of a material softer than that of the metal plate 232. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a metal mask plate having good adhesion to a printing surface and a method for producing the metal mask plate.

  FIG. 36 is a schematic diagram of a conventional metal mask plate 902. FIG. 36 is a cross-sectional view of the metal mask plate 902.

  As shown in FIG. 36, the metal mask plate 902 has a structure in which an opening 906 that transmits a viscous substance is formed in a metal plate 904. The metal mask plate 902 transmits the viscous material supplied to the squeegee surface side from the opening 906 to the printing surface side, thereby printing a pattern of the viscous material having the same planar shape as the opening 906 on the printing surface.

  Note that Patent Document 1 describes a known literature invention related to the present invention. In the invention of Patent Document 1, an opening that transmits a viscous substance is formed in a plate material by laser processing.

JP 2007-152613 A

  However, in the conventional metal mask plate, the hard metal plate is in contact with the surface to be printed, so that there is a problem that the adhesion between the metal mask plate and the surface to be printed is not good, and the pattern of the viscous material tends to bleed.

  The present invention has been made to solve this problem, and an object of the present invention is to provide a metal mask plate having good adhesion to a printing surface.

  In order to solve the above-mentioned problems, the invention of claim 1 is a metal mask plate that transmits a viscous material supplied to the squeegee surface side to the printing surface side and prints a viscous material pattern on the printing surface, the viscous material And a metal layer that is added to the printing surface side of the metal plate and has an opening that transmits the viscous material and is softer than the metal plate.

  The invention of claim 2 is a method of manufacturing a metal mask plate, wherein the viscous material supplied to the squeegee surface side is transmitted to the printing surface side, and a pattern of the viscous material is printed on the printing surface. A step of adding a softer film than the metal plate to the printing surface side of the metal plate in which a transparent opening is formed, and (b) after the step (a), irradiating a laser beam from the squeegee surface side of the metal plate. Removing a portion of the film added to a transmission region that transmits a viscous substance with a laser beam using the metal plate as a shield.

  According to a third aspect of the present invention, in the method of manufacturing a metal mask plate according to the second aspect, the step (b) irradiates a laser beam that selectively removes the film without removing the metal plate.

  According to a fourth aspect of the present invention, in the method of manufacturing a metal mask plate according to the second or third aspect, the step (a) includes attaching the film having no fluidity to the printing surface side of the metal plate. wear.

  According to the first aspect of the present invention, the metal plate does not come into contact with the surface to be printed, and the softer layer than the metal plate comes into contact with the surface to be printed, so that the metal mask plate and the surface to be printed can be brought into close contact with each other. Bleeding of the material pattern can be suppressed.

  According to the second aspect of the present invention, the displacement between the position of the opening formed in the metal plate and the position of the opening formed in the film can be prevented, so that the dimensional accuracy of the metal mask plate can be improved.

  According to invention of Claim 3, it can prevent that a metal plate is damaged.

  According to the invention of claim 4, it is possible to prevent the opening from being filled.

<1 First Embodiment>
<1-1 Overall Structure of Piezoelectric / Electrostrictive Element 1>
FIG. 1 is a schematic diagram of a piezoelectric / electrostrictive element 1 according to a first embodiment of the present invention. FIG. 1 is a cross-sectional view of the piezoelectric / electrostrictive element 1. The piezoelectric / electrostrictive element 1 is an actuator employed in the head of an ink jet printer.

  As shown in FIG. 1, the piezoelectric / electrostrictive element 1 includes an electrode film 110, a piezoelectric / electrostrictive film 112, an electrode film 114, a piezoelectric / electrostrictive film 116, and an electrode on the thin portion 104 of the substrate 102. It has a stacked structure in which the films 118 are stacked in this order.

  Note that FIG. 1 shows a laminate 108 formed on the substrate 102 in which the electrode film 110, the piezoelectric / electrostrictive film 112, the electrode film 114, the piezoelectric / electrostrictive film 116, and the electrode film 118 are stacked. Although the case where the electrode film 114 of a layer is included inside is shown, the present invention is also applied to the case where the stacked body 108 includes two or more electrode films inside or the case where the stacked body 108 does not include the electrode film inside. can do. 1 shows the case where the laminate 108 is directly formed on the substrate 102, the laminate 108 may be indirectly formed on the substrate 102 via an inert layer. . Further, a plurality of piezoelectric / electrostrictive elements 1 can be regularly arranged and integrated at regular intervals.

<1-2 Bending vibration region 182>
In the piezoelectric / electrostrictive element 1, an electric field is applied to the piezoelectric / electrostrictive films 112 and 116 by applying a drive signal between the electrode films 110 and 118 serving as external electrodes and the electrode film 114 serving as internal electrodes. Then, the thin wall portion 104 and the laminated body 108 are bent and vibrated. Hereinafter, the region 182 where the bending vibration is excited is referred to as a “bending vibration region”.

  The planar shape of the thin portion 104, that is, the planar shape of the bending vibration region 182 is an elongated rectangle. Of course, the planar shape of the bending vibration region 182 is not limited to a rectangle, but may be an ellipse, a hexagon, or other shapes.

<1-3 Substrate 102>
The base body 102 supports the stacked body 108. The base 102 is a ceramic fired body obtained by firing a laminate of sheet-like molded bodies of ceramic powder.

The base 102 is made of an insulating material. Insulating materials include calcium oxide (CaO), magnesium oxide (MgO), yttrium oxide (Y ₂ O ₃ ), ytterbium oxide (Yb ₂ O ₃ ), cerium oxide (Ce ₂ O ₃ ) and other stabilizers. It is desirable to employ zirconium oxide (ZrO ₂ ), that is, stabilized zirconia or partially stabilized zirconia.

The base 102 has a cavity structure in which a central thin portion 104 is surrounded by a peripheral thick portion 106 and supported. By adopting a cavity structure and supporting the thin portion 104 with a small plate thickness by the thick portion 106 with a large plate thickness, the plate thickness of the thin portion 104 can be reduced while maintaining the mechanical strength of the base 102. Therefore, the rigidity of the thin portion 104 can be reduced, and the piezoelectric /
The amount of displacement of the electrostrictive element 1 can be increased. The thickness of the thin portion 104 is desirably 1 μm or more and 15 μm or less. This is because if it falls below this range, the thin-walled portion 104 tends to be damaged. Further, if the range is exceeded, the displacement amount of the piezoelectric / electrostrictive element 1 tends to decrease.

<1-4 Piezoelectric / Electrostrictive Films 112 and 116>
The piezoelectric / electrostrictive films 112 and 116 are ceramic fired bodies obtained by firing a film-shaped formed body of ceramic powder.

The piezoelectric / electrostrictive films 112 and 116 are made of a piezoelectric / electrostrictive material. As the piezoelectric / electrostrictive material, it is desirable to employ a lead (Pb) -based perovskite oxide. Among them, lead zirconate titanate (Pb (Zr _x Ti _1-x ) O ₃ ) or lead zirconate titanate and nickel niobate (Pb (Ni _1/3 Nb _2/3 ) O ₃ ), magnesium niobate It is desirable to employ a lead (Pb (Mg _1/3 Nb _2/3 ) O ₃ ) or other lead-based composite perovskite oxide as a main component.

  The planar shape of the piezoelectric / electrostrictive films 112 and 116 is an elongated rectangle. The piezoelectric / electrostrictive films 112 and 116 increase in thickness from the center toward the ends of the electrode films 110, 114, and 118, and from the ends of the electrode films 110, 114, and 118 The film thickness distribution is such that the film thickness decreases toward the ends of the electrostrictive films 112 and 116. Employing such a film thickness distribution increases the film thickness of the piezoelectric / electrostrictive films 112 and 116 at the ends of the electrode films 110, 114, and 118, so that dielectric breakdown can be prevented and bending 1 Since the film thickness of the piezoelectric / electrostrictive films 112 and 116 is reduced and the rigidity of the piezoelectric / electrostrictive films 112 and 116 is lowered in the next mode, the displacement amount of the piezoelectric / electrostrictive element 1 can be increased. it can.

<1-5 Electrode films 110, 114, 118>
The electrode films 110, 114, and 118 are made of a conductive material. As the conductive material constituting the electrode films 110 and 114, it is desirable to employ platinum (Pt) or palladium (Pd) or an alloy containing these as main components. However, as long as co-firing with the piezoelectric / electrostrictive films 112 and 116 is possible, the electrode films 110 and 114 may be made of other conductive materials. As the conductive material constituting the electrode film 118, it is desirable to employ gold (Au) or an alloy containing this as a main component.

  The electrode film 110 and the electrode film 114 are opposed to each other with the piezoelectric / electrostrictive film 112 interposed therebetween, and the electrode film 114 and the electrode film 118 are opposed to each other with the piezoelectric / electrostrictive film 116 interposed therebetween. The electrode film 110 and the electrode film 118 are electrically connected. Accordingly, when a drive signal is applied between the electrode films 110 and 118 serving as external electrodes and the electrode film 114 serving as internal electrodes, the piezoelectric / electrostrictive films 112 and 116 are expanded and contracted, and the flexural vibration region 182 is flexibly vibrated. Can be made.

<1-6 Manufacturing Method of Piezoelectric / Electrostrictive Element 1>
FIG. 2 is a flowchart for explaining a method for manufacturing the piezoelectric / electrostrictive element 1.

  As shown in FIG. 2, in manufacturing the piezoelectric / electrostrictive element 1, first, the base 102 is manufactured (step S101).

  Subsequently, the laminated body 108 is formed on the thin portion 104 of the base body 102 (steps S102 to S109).

  In forming the laminated body 108, first, a conductive paste is applied to the upper surface of the thin portion 104 by a screen printing method (step S102), and the obtained coating film is baked integrally with the substrate 102 (step S103). Thereby, the electrode film 110 integrated with the base body 102 can be formed.

  Subsequently, a piezoelectric / electrostrictive paste, a conductive paste, and a piezoelectric / electrostrictive paste are sequentially applied to the upper surface of the electrode film 110 by a screen printing method (steps S104 to S106), and the obtained coating film is applied to the substrate 102 and Baking is performed integrally with the electrode film 110 (step S107). Thereby, the piezoelectric / electrostrictive film 112, the electrode film 114, and the piezoelectric / electrostrictive film 116 integrated with the base 102 and the electrode film 110 can be formed.

  Thereafter, a conductive paste is applied to the upper surface of the piezoelectric / electrostrictive film 116 by screen printing (step S108), and the obtained coating film is applied to the base 102, the electrode film 110, the piezoelectric / electrostrictive film 112, and the electrode film. 114 and the piezoelectric / electrostrictive film 116 are integrally fired (step S109). Thereby, the electrode film 118 integrated with the substrate 102, the electrode film 110, the piezoelectric / electrostrictive film 112, the electrode film 114, and the piezoelectric / electrostrictive film 116 can be formed.

  Finally, the piezoelectric / electrostrictive element 1 can be obtained by applying a voltage between the electrode films 110 and 118 and the electrode film 114 to perform polarization treatment (step S110).

  Here, the conductive paste is a fluid viscous material prepared by kneading a powder of a conductive material, an organic solvent, a dispersant, and a binder. The piezoelectric / electrostrictive paste is a fluid viscous material prepared by kneading a piezoelectric / electrostrictive material powder, an organic solvent, a dispersant and a binder. The piezoelectric / electrostrictive material powder is a calcined raw material powder obtained by calcining and pulverizing a mixture of raw material powders of constituent elements of the piezoelectric / electrostrictive material.

<1-7 Method for Forming Piezoelectric / Electrostrictive Film 112>
3 to 5 are schematic diagrams for explaining a method of forming the piezoelectric / electrostrictive film 112. 3 to 5 are cross-sectional views of the piezoelectric / electrostrictive film 112 being formed. The piezoelectric / electrostrictive film 116 can be formed by the same formation method as the piezoelectric / electrostrictive film 112.

  In forming the piezoelectric / electrostrictive film 112, first, as shown in FIG. 3, a piezoelectric / electrostrictive paste coating film 202 is formed on the upper surface of the electrode film 110. The coating film 202 is formed by screen printing a piezoelectric / electrostrictive paste. At this time, screen printing may be performed only once, or screen printing may be repeated twice or more.

  Subsequently, as shown in FIG. 4, a piezoelectric / electrostrictive paste coating film 204 is further formed on the substantially flat upper surface of the coating film 202. The coating film 204 is formed along the end of the coating film 202. The coating film 204 is also formed by screen printing a piezoelectric / electrostrictive paste. At this time, screen printing may be performed only once, or screen printing may be repeated twice or more.

  When the coating films 202 and 204 formed in this manner are baked, as shown in FIG. 5, the coating film 202 and the coating film 204 are integrated, and the piezoelectric / electrostrictive film having the above-described film thickness distribution is obtained. 112 can be formed.

<1-8 Structure of the metal mask plates 210 and 230>
6 to 8 are schematic views of a metal mask plate 210 used for forming the coating film 202. FIG. 6 is a plan view of the metal mask plate 210, FIG. 7 is a cross-sectional view of the metal mask plate 210 along AA in FIG. 6, and FIG. 8 is a cross-section of the metal mask plate 210 along BB in FIG. It is a figure.

  As shown in FIGS. 6 to 8, the metal mask plate 210 has a structure in which an emulsion layer 214 is added to the printing surface side of the metal plate 212. An opening 216 that transmits a viscous material is formed in the transmission region 282 of the metal plate 212, and an opening 218 that transmits the viscous material is also formed in the transmission region 282 of the emulsion layer 214. The position and planar shape of the opening 218 are the same as the opening 216. Therefore, when the piezoelectric / electrostrictive paste is supplied to the squeegee surface of the metal mask plate 210 and the squeegee is run while applying pressure to the squeegee surface, the piezoelectric / electrostrictive paste supplied to the squeegee surface side is opened 216,218. The pattern of the piezoelectric / electrostrictive paste that passes through the printing surface side and has the same planar shape as the openings 216 and 218 can be printed on the printing surface on the printing surface side.

  The emulsion layer 214 is added to a non-transmissive region 284 that does not transmit viscous materials. For this reason, when the coating film 202 is screen-printed using the metal mask plate 210, the metal plate 212 is not in contact with the surface to be printed, and the emulsion layer 214 softer than the metal plate 212 is in contact with the surface to be printed. The plate 210 and the printing surface can be brought into close contact with each other, and bleeding of the piezoelectric / electrostrictive paste pattern can be suppressed.

  9 to 11 are schematic views of a metal mask plate 230 used for forming the coating film 204. FIG. 9 is a plan view of the metal mask plate 230, FIG. 10 is a cross-sectional view of the metal mask plate 230 taken along the line CC of FIG. 9, and FIG. 11 is a cross-sectional view of the metal mask plate 230 taken along the line DD of FIG. It is a figure.

  As shown in FIGS. 9 to 11, the metal mask plate 230 has a structure in which an emulsion layer 234 is added to the printing surface side of the metal plate 232. In the transmission regions 288 and 290 of the metal plate 232, openings 236 and 238 that transmit viscous materials are formed, respectively, and also in the transmission regions 288 and 290 of the emulsion layer 234, openings 240 and 242 that transmit viscous materials, respectively. Is formed. The position and planar shape of the opening 240 are the same as those of the opening 236, and the position and planar shape of the opening 242 are the same as those of the opening 238. Therefore, when the piezoelectric / electrostrictive paste is supplied to the squeegee surface of the metal mask plate 230 and the squeegee is run while applying pressure to the squeegee surface, the piezoelectric / electrostrictive paste supplied to the squeegee surface side is opened to the openings 236, 240. And a pattern of a piezoelectric / electrostrictive paste that is transmitted from the openings 238 and 242 to the printing surface side and has the same planar shape as the openings 236 and 240 and the openings 238 and 242 may be printed on the printing surface on the printing surface side. it can.

  The emulsion layer 234 is added to a non-transmissive region 286 that does not transmit viscous materials. For this reason, when the coating film 204 is screen-printed using the metal mask plate 230, the metal plate 232 is not in contact with the printing surface, and the emulsion layer 234 that is softer than the metal plate 232 is in contact with the printing surface. The plate 230 and the printing surface can be brought into close contact with each other, and the bleeding of the piezoelectric / electrostrictive paste pattern can be suppressed.

  The metal plates 212 and 232 are stainless steel plates. However, this does not prevent the use of materials other than stainless steel. For example, a nickel plate can be employed.

  The emulsion layers 214 and 234 are emulsion (emulsion) films. However, this does not prevent the use of materials other than emulsions. That is, if the emulsion layers 214 and 138 are made of a material softer than the metal plates 212 and 136, for example, a resin, it can serve as a cushion for improving adhesion to the printing surface.

<1-9 Manufacturing Method (Plate Making Method) of Metal Mask Plate 230>
12 to 16 are schematic diagrams for explaining a method of manufacturing the metal mask plate 230. 12-16 is sectional drawing of the metal mask plate 230 in the middle of manufacture. The metal mask plate 210 can be manufactured by the same manufacturing method as the metal mask plate 230.

  In manufacturing the metal mask plate 230, first, the excimer laser beam 254 is irradiated on the stainless steel plate 252 (FIG. 12), and the piercing areas 288 and 290 of the plate 252 are opened through the squeegee surface side and the printing surface side. 236 and 238 are formed to obtain the metal plate 232 (FIG. 13). Forming the openings 236 and 238 by excimer laser processing in this way has an advantage that the accuracy of the positions and planar shapes of the openings 236 and 238 can be improved. This means that the openings 236 are formed by etching. , 238 is not prevented. Moreover, you may produce the metal plate 232 in which the opening 236,238 was formed by additive methods, such as electroforming.

  Subsequently, an emulsion film 256 covering the printing surface side of the metal plate 232 is attached to the printing surface side of the metal plate 232 by attaching an emulsion film 256 having a substantially uniform film thickness to the printing surface side of the metal plate 232 and softer than the metal plate 232. 256 is added (FIG. 14). As described above, when the emulsion film 256 is added by pasting the non-flowable emulsion film 256, the emulsion having fluidity flows into the openings 236 and 238 and the openings 236 and 238 are filled. There is an advantage that can be prevented. However, this does not prevent the formation of the emulsion film 256 by losing the fluidity after the emulsion having fluidity is applied.

  Subsequently, excimer laser light 258 is irradiated from the squeegee surface side of the metal plate 232 (FIG. 15), and excimer laser light is formed by using the metal plate 232 as a shield for the portions of the emulsion film 256 formed in the transmission regions 288 and 290. Removal at 258 forms openings 240, 242 (FIG. 16). In this excimer laser processing, an excimer laser beam having an intensity capable of selectively removing the emulsion film 256 without removing the metal plate 232 is irradiated. In other words, in this excimer laser processing, the metal film 232 is used as a shield and is formed on the metal plate 232 by utilizing the property that the emulsion film 256 is more easily removed by the excimer laser beam 258 than the metal plate 232. The planar shape of the openings 236 and 238 is transferred to the emulsion film 256. It is not essential to use the excimer laser beam 258 as the laser beam, but a carbon dioxide laser beam, a YAG (Yttrium Aluminum Garnet) laser beam, or other laser beam may be used.

  Through these steps, the emulsion film 260 remaining without being removed becomes the emulsion layer 234, and the metal mask plate 230 shown in FIGS. 9 to 11 can be obtained.

  According to such a method of manufacturing the metal mask plate 230, it is possible to prevent a shift between the positions of the openings 236 and 238 formed in the metal plate 232 and the positions of the openings 240 and 242 formed in the emulsion layer 234. The dimensional accuracy of the metal mask plate 230 can be improved. That is, when the metal plate 232 and the emulsion layer 234 are separately patterned using photolithography or the like, the dimensional accuracy of the metal mask plate 230 is reduced due to the displacement of the patterning positions of the metal plate 232 and the emulsion layer 234. However, according to such a manufacturing method, the dimensional accuracy of the metal mask plate 230 can be improved.

<2 Second Embodiment>
In the second embodiment, a method for forming the piezoelectric / electrostrictive film 112 in place of the method for forming the piezoelectric / electrostrictive film 112 according to the first embodiment and a metal mask plate used for forming the piezoelectric / electrostrictive film 112 are described. 330.

<2-1 Method for Forming Piezoelectric / Electrostrictive Film 112>
17 to 19 are schematic views for explaining a method for forming the piezoelectric / electrostrictive film 112. 17 to 19 are cross-sectional views of the piezoelectric / electrostrictive film 112 being formed.

  In forming the piezoelectric / electrostrictive film 112, first, as shown in FIG. 17, a piezoelectric / electrostrictive paste coating film 302 is formed on the upper surface of the electrode film 110. The coating film 302 is formed by screen printing a piezoelectric / electrostrictive paste. At this time, screen printing may be performed only once, or screen printing may be repeated twice or more.

  Subsequently, as shown in FIG. 18, a piezoelectric / electrostrictive paste coating film 304 is further formed on the top surface of the coating film 302. The coating film 304 is formed along the end of the coating film 302. The coating film 304 is also formed by screen printing a piezoelectric / electrostrictive paste. At this time, screen printing may be performed only once, or screen printing may be repeated twice or more.

  When the coating films 302 and 304 formed in this manner are baked, as shown in FIG. 19, the bulge on the upper surface of the coating film 302 is depressed and the coating film 302 and the coating film 304 are integrated. A piezoelectric / electrostrictive film 112 having a film thickness distribution can be formed.

  In addition, the central portion of the coating film 302 may be raised due to the number of repeated screen printings or other reasons.

<2-2 Structure of the metal mask plate 330>
20 to 22 are schematic views of a metal mask plate 330 used for forming the coating film 304. 20 is a plan view of the metal mask plate 330, FIG. 21 is a cross-sectional view of the metal mask plate 330 along GG in FIG. 20, and FIG. 22 is a cross-section of the metal mask plate 330 along H-H in FIG. It is a figure. The coating film 302 can be formed using the metal mask plate 210 shown in FIGS.

  As shown in FIGS. 20 to 22, the metal mask plate 330 has a structure in which an emulsion layer 334 is added to the printing surface side of the metal plate 332. In the transmission regions 388 and 390 of the metal plate 332, openings 336 and 338 that transmit viscous materials are formed, respectively, and the transmission regions 388 and 390 and the non-transmission regions 386 of the emulsion layer 334 also have openings that transmit viscous materials. 340 is formed. Therefore, when the piezoelectric / electrostrictive paste is supplied to the squeegee surface of the metal mask plate 330 and the squeegee is run while applying pressure to the squeegee surface, the piezoelectric / electrostrictive paste supplied to the squeegee surface side is opened 336,340. The pattern of the piezoelectric / electrostrictive paste that is transmitted through the openings 338 and 340 to the printing surface side and has the same planar shape as the openings 336 and 338 can be printed on the printing surface on the printing surface side.

  The thickness of the metal plate 332 differs between the metal plate 344 having a frame-like planar shape and the metal plate 346 having a rectangular planar shape, and the metal plate facing the central portion where the printing surface is raised. The plate | board thickness of 346 is thinner than the metal plate 344 which opposes the non-center part which the to-be-printed surface does not protrude. Thus, by using the metal mask plate 330 including the metal plate 332 whose layer thickness varies according to the unevenness of the printing surface, the piezoelectric / electrostrictive body is formed in the gap between the metal mask plate 330 and the printing surface. Since the paste can be prevented from flowing out, the bleeding of the piezoelectric / electrostrictive paste pattern can be suppressed.

  The emulsion layer 334 is formed in a non-transmissive region 387 occupying a part of the non-transmissive region 386, 387 that does not transmit viscous materials. For this reason, when the coating film 304 is screen-printed using the metal mask plate 330, the metal plate 344 is not in contact with the surface to be printed, and the emulsion layer 334 softer than the metal plate 344 is in contact with the surface to be printed. The plate 330 and the printing surface can be brought into close contact with each other, and bleeding of the piezoelectric / electrostrictive paste pattern can be further suppressed.

  The metal plate 332 is a stainless steel plate. However, this does not prevent the use of materials other than stainless steel. For example, a nickel plate can be employed.

  The emulsion layer 334 is an emulsion film. However, this does not prevent the use of materials other than emulsions. That is, if the emulsion layer 334 is made of a material softer than the metal plate 332, for example, a resin, it can serve as a cushion for improving the adhesion to the printing surface.

<2-3 Manufacturing Method (Plate Making Method) of Metal Mask Plate 330>
23 to 35 are schematic views for explaining a method of manufacturing the metal mask plate 330. FIG. 23 to 35 are cross-sectional views of the metal mask plate 330 being manufactured.

  In manufacturing the metal mask plate 330, first, a resist film 362 that covers the printing surface side of the plate material 352 is formed on the printing surface side of the plate material 352 by applying a photosensitive resist solution to the printing surface side of the stainless steel plate material 352. Form (FIG. 23).

  Subsequently, a photomask 364 that shields the transmissive regions 388 and 390 and the non-transmissive region 386 is placed on the printing surface side of the resist film 362, and the resist film 362 is irradiated with light 366 through the photomask 364 (FIG. 24). ) The resist film 368 formed in the non-transmissive region 387 is selectively exposed to cure the resist film 368 (FIG. 25). Then, the resist film 370 formed in the transmission regions 388 and 390 and the non-transmission region 386 is removed by development to expose the transmission regions 388 and 390 and the non-transmission region 386 of the plate 352 (FIG. 26).

  Subsequently, using the resist film 368 that has not been removed as an etching mask, the transmissive area 388, 390 and the non-transmissive area 386 of the plate material 352 are etched so that the squeegee surface side and the printing surface side do not penetrate. While reducing the thickness, the resist film 368 that has finished its role as a mask is removed (FIG. 27).

  Then, excimer laser light 372 is irradiated to the plate material 352 from the squeegee surface side (FIG. 28), and openings 336 and 338 penetrating the squeegee surface side and the printing surface side are formed in the transmission regions 388 and 390 of the plate material 352, A metal plate 332 is obtained (FIG. 29).

  Next, a photosensitive emulsion film 356 having a substantially uniform film thickness and softer than the metal plate 332 is attached to the printing surface side of the metal plate 332, so that the printing surface side of the metal plate 332 is placed on the printing surface side of the metal plate 332. A covering emulsion film 356 is added (FIG. 30).

  Subsequently, a photomask 374 that shields the region 392 including the non-transmissive region 386 is placed on the printing surface side of the emulsion film 356, and the emulsion film 356 is irradiated with light 376 through the photomask 374 (FIG. 31). The emulsion film 378 added to the area other than the area 392 is selectively exposed to cure the emulsion film 378 (FIG. 32).

  Subsequently, the emulsion film 380 added to the region 392 is removed by development (FIG. 33). The emulsion film 380 is removed in this way because the emulsion film added to the non-transmissive region 386 is shielded by the metal plate 332 and cannot be removed by the excimer laser beam 358 described later. It is necessary. Here, it is desirable that the photomask 374 not only shield the non-transmissive region 386 but also shield the region 392 including the transmissive regions 388 and 390 adjacent to the non-transmissive region 386. Thereby, even if the position of the photomask 374 is slightly shifted, it is possible to prevent the emulsion film formed in the non-transmissive region 386 from being removed without being removed.

  Then, excimer laser light 358 is irradiated from the squeegee surface side of the metal plate 332 (FIG. 34), and the portions formed in the transmission regions 388 and 390 of the emulsion film 378 are excimer laser light 358 using the metal plate 332 as a shield. This is removed to form an opening 340 (FIG. 35). In this excimer laser processing, an excimer laser beam having an intensity capable of selectively removing only the emulsion film 378 without removing the metal plate 332 is irradiated.

  Through these steps, the emulsion film 380 remaining without being removed becomes the emulsion layer 334, and the metal mask plate 330 shown in FIGS. 20 to 22 can be obtained.

<3 other>
In the above description, the metal mask plates 210, 230, and 330 used when applying the piezoelectric / electrostrictive paste have been described. However, a viscous substance other than the piezoelectric / electrostrictive paste, such as a conductive paste, is applied. The metal mask plate used in this case and a method for manufacturing the same are also included in the present invention.

  The above description is illustrative in all aspects, and the present invention is not limited thereto. It is understood that countless variations that are not illustrated can be envisaged without departing from the scope of the present invention. In particular, it is naturally planned to combine the techniques described in the first embodiment and the second embodiment.

It is sectional drawing of a piezoelectric / electrostrictive element. It is a flowchart explaining the manufacturing method of a piezoelectric / electrostrictive element. It is sectional drawing explaining the formation method of a piezoelectric / electrostrictive film. It is sectional drawing explaining the formation method of a piezoelectric / electrostrictive film. It is sectional drawing explaining the formation method of a piezoelectric / electrostrictive film. It is a top view of a metal mask plate. It is sectional drawing of the metal mask plate in alignment with AA of FIG. It is sectional drawing of the metal mask plate in alignment with BB of FIG. It is a top view of a metal mask plate. FIG. 10 is a cross-sectional view of the metal mask plate taken along CC in FIG. 9. FIG. 10 is a cross-sectional view of the metal mask plate taken along DD in FIG. 9. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the formation method of a piezoelectric / electrostrictive film. It is sectional drawing explaining the formation method of a piezoelectric / electrostrictive film. It is sectional drawing explaining the formation method of a piezoelectric / electrostrictive film. It is a top view of a metal mask plate. FIG. 21 is a cross-sectional view of the metal mask plate taken along GG in FIG. 20. It is sectional drawing of the metal mask plate in alignment with HH of FIG. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing explaining the manufacturing method of a metal mask plate. It is sectional drawing of the conventional metal mask plate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Piezoelectric / electrostrictive element 102 Base | substrate 112,116 Piezoelectric / electrostrictive body film | membrane 110,114,118 Electrode film | membrane 202,204,302,304 Coating film 210,230,330 Metal mask plate 212,232,332 Metal plate 214, 234,334 Emulsion layer

Claims (4)

A metal mask plate that transmits the viscous material supplied to the squeegee surface side to the printing surface side and prints a pattern of the viscous material on the printing surface,
A metal plate having an opening through which a viscous material passes;
A layer that is added to the printing surface side of the metal plate and has an opening that transmits a viscous material, and a layer softer than the metal plate;
Metal mask version with. A method for producing a metal mask plate, wherein the viscous material supplied to the squeegee surface side is transmitted to the printing surface side and a pattern of the viscous material is printed on the printing surface,
(a) adding a softer film than the metal plate to the printing surface side of the metal plate in which an opening that transmits the viscous material is formed;
(b) After the step (a), a laser beam is irradiated from the squeegee surface side of the metal plate, and a portion of the film added to a transmission region that transmits a viscous substance is used as a shield for the metal plate. Removing with light;
A method for producing a metal mask plate comprising: In the manufacturing method of the metal mask plate of Claim 2,
The step (b)
A method for producing a metal mask plate, wherein the metal plate is irradiated with laser light for selectively removing the film without removing the metal plate. In the manufacturing method of the metal mask plate of Claim 2 or Claim 3,
The step (a)
The manufacturing method of the metal mask plate which affixes the said film | membrane which does not have fluidity | liquidity on the printing surface side of the said metal plate.

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