JP2009164409A - Heating element mountable component, metal body, and attaching structure of heating element mountable component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve highly efficient thermal control, and also to achieve highly efficient electrical conduction as well as convenient and easy manufacture. <P>SOLUTION: A plurality of deformable protrusions 16 are provided on the back side of a base plate 10 with a semiconductor device 12 mounted thereon and the protrusions 16 are connected onto a heat sink 18 by pressure bonding to attach the heat sink 18 through thermal connection. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a thermal control configuration of a heating element such as a semiconductor element that constitutes various electronic components.

  Generally, in a semiconductor device, a semiconductor element that constitutes an electronic component that is a heating element is accommodated in a semiconductor package that is a component that can be mounted with a heating element, and a connection terminal for external connection projects from the peripheral wall of the semiconductor package. It is installed. Such a semiconductor package is used after its connection terminals for external connection are electrically connected to the circuit of the printed wiring board. With this use, when the temperature of the semiconductor device rises due to the heat generated by the semiconductor device, the performance of the semiconductor package decreases.Therefore, there is a method for keeping the temperature at an allowable value by exhausting the generated heat to the outside. It is taken.

Therefore, various cooling structures have been developed in semiconductor packages for efficiently exhausting the heat associated with the driving and controlling the temperature of the semiconductor element to an allowable value. As such a cooling structure, there has been proposed a structure that enables high-efficiency heat transfer by, for example, mounting and arranging a package base on a radiator with a graphite sheet having excellent heat conduction efficiency interposed therebetween. (For example, refer to Patent Document 1). Further, there is a configuration in which a heat dissipating grease is applied between the package base and the heat dissipating member instead of the graphite sheet.
JP 2004-288949 A

  However, in the above-described semiconductor package configuration, it is possible to improve the efficiency of heat conduction because the package base is assembled and arranged with a graphite sheet interposed or a heat dissipating grease. There is a problem that the graphite sheet and the heat dissipating grease become an obstacle to electrical continuity, leading to a decrease in electrical performance. In addition, there is a problem in that the work is troublesome because it is necessary to assemble the graphite sheet and the heat dissipating grease as these separate members at the time of assembly.

  The present invention has been made in view of the above circumstances, so that highly efficient thermal control can be realized, highly efficient electrical conduction can be realized, and simple and easy manufacturing can be realized. It is an object of the present invention to provide a mounting structure for a heat generating element mountable component, a metal body and a heat generating element mountable component.

  According to the present invention, a heating element mountable component on which a heating element can be mounted is configured by providing a plurality of deformable protrusions on at least a part of a mounting surface that is mounted by being thermally coupled to a mounted body.

  According to the above configuration, when the mounting surface is attached to the mounted body, the plurality of protrusions are directly pressed against the mounted body to be deformed and contacted, so that the contact state with the mounted body is closely set. Attached. Therefore, the number of parts can be reduced, and the heat resistance can be reduced without being affected by the processing accuracy and flatness accuracy (warp, etc.) of the mounting surface, and highly efficient heat conduction characteristics are realized, and Highly efficient electrical continuity with the mounted body can be obtained, and the highly efficient electrical performance of the heating element can be ensured.

  Further, according to the present invention, the metal body is configured by providing a plurality of deformable protrusions on at least a part of the mounting surface to which the heating element mountable component on which the heating element can be mounted is thermally coupled.

  According to the above configuration, when a component that can mount a heating element is attached to the mounting surface, a plurality of protrusions can be directly pressed against the component that can be mounted on the heating element to be deformed and contacted, thereby mounting the heating element. The state of contact with the parts is assembled closely. Therefore, the number of parts can be reduced, and the heat resistance can be reduced without being affected by the processing accuracy (warp, etc.) of the mounting surface. High-efficiency electrical continuity with possible components can be obtained, and high-efficiency electrical performance of the heating element can be ensured.

  In addition, the mounting structure of the heating element mountable component of the present invention includes a heating element mountable component on which the heating element can be mounted, and a mounted body to which the heating element mountable component is thermally coupled and mounted. A plurality of deformable protrusions are provided on at least a part of at least one mounting surface of the heating element mountable component and the mounted body.

  According to the above configuration, when the mounting surface of the component that can be mounted on the heating element is attached to the mounting surface of the mounted body, the plurality of protrusions provided on either one are directly pressed against the other mounting surface. By being deformed and brought into contact with each other, the mutual contact state is closely assembled. Therefore, the number of parts can be reduced, and the heat resistance can be reduced without affecting the processing accuracy (warp, etc.) of the mounting surfaces of each other. Thus, it is possible to obtain a highly efficient electrical continuity and to ensure a highly efficient electrical performance of the heating element.

  As described above, according to the present invention, high efficiency heat control can be realized, high efficiency electrical continuity can be realized, and simple and easy production can be realized. It is possible to provide a mounting structure for a body mountable component, a metal body, and a heating element mountable component.

  Hereinafter, a heating element mountable component, a metal body, and a mounting structure thereof according to an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a case where a heat generator mountable component according to an embodiment of the present invention is applied to a semiconductor package. A base plate 10 is formed in a rectangular shape, for example, and forms an element accommodating portion on the upper surface thereof. A frame 11 is provided integrally.

  A semiconductor element 12 is mounted in the frame 11 on the base plate 10 as shown in FIG. 2, and a lid 13 is attached on the frame 11. Then, external connection terminals 14 electrically connected to the semiconductor element 12 are provided on both side walls of the frame 11 facing each other so as to be externally connectable.

  The base plate 10, the frame body 11, and the lid body 13 are made of a metal material having excellent thermal conductivity such as copper. Of these, a protrusion 15 is provided at the substantially central portion of the mounting surface of the base plate 10, for example, at the substantially central portion thereof corresponding to the mounting portion of the semiconductor element 12 (see FIGS. 3 and 4). A plurality of deformable plate-like protrusions 16 having substantially the same dimensions as the short sides across the protrusions 15 are arranged in parallel and integrally formed. The plurality of protrusions 16 are formed, for example, inclined in the reverse direction with the protrusion 15 interposed therebetween, and do not become thermal resistance to the base plate 10.

  The plurality of protrusions 16 have a thickness dimension of, for example, about several tens to several hundreds μm, a height dimension of, for example, about 0.1 mm to 1 mm, and are inclined, for example, in the reverse direction with the protrusion 15 interposed therebetween. Is formed. The protrusion 15 is set such that the height of the protrusion 15 is deformable. The plurality of protrusions 16 may be provided inclined in the same direction, or may be selectively provided in a plurality of different directions, or may be provided without being inclined.

  The base plate 10 is provided with mounting recesses 17 at both ends thereof. The mounting recess 17 is formed by inserting a screw member (not shown) through a screw member (not shown) while the back surface of the base plate 10 is placed on a heat sink 18 called a heat sink, which is a metal body constituting the mounted body (see FIG. 2). By screwing a member (not shown) to the heat radiating plate 18, the base plate 10 is thermally coupled to and attached to the heat radiating plate 18.

  With the above configuration, when the base plate 10 is mounted on the heat radiating plate 18 using the screw member (not shown), the plurality of protrusions 16 are directly pressed onto the heat radiating plate 18 to be deformed and contacted. At the same time, the projection 15 is directly pressed against the heat radiating plate 18 and is thermally coupled and attached. The protrusion 15 directly conducts heat from the semiconductor element 12 mounted on the base plate 10 to the heat radiating plate 18. At the same time, heat from the semiconductor element 12 thermally conducted to the base plate 10 is conducted to the heat radiating plate 18 via the closely contacting protrusions 16, and the heat is radiated to control the semiconductor element 12.

  As described above, the semiconductor package is provided with a plurality of deformable protrusions 16 on the back surface of the base plate 10 on which the semiconductor element 12 is mounted, and the protrusions 16 are pressed against the heat radiating plate 18 to thermally contact the heat radiating plate 18. Combined to install.

  According to this, when the base plate 10 is attached to the heat radiating plate 18, the plurality of protrusions 16 are directly pressed against the heat radiating plate 18 to be deformed and brought into contact with each other. Attached. As a result, the number of parts can be reduced, and the mounting arrangement with reduced thermal resistance can be realized without being affected by the processing accuracy (warp, etc.) of the back surface of the base plate 10 and the mounting surface of the heat sink 18. Efficient heat conduction characteristics can be obtained. Thereby, simple and easy manufacture including assembly work can be realized.

  Moreover, according to this, highly efficient electrical continuity between the back surface of the base plate 10 and the mounting surface of the heat sink 18 can be obtained, and the highly efficient electrical performance of the semiconductor element 12 can be ensured. it can.

  In addition, the present invention is not limited to the above-described embodiment, but may be configured to form the protrusions 16a to 16f shown in FIGS. 5 to 10 on the base plate 10, for example, and the same effective effect is expected. Is done. However, in the embodiment shown in FIGS. 5 to 10, the same parts as those in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the embodiment of FIG. 5, a plurality of plate-like protrusions 16 a shorter than the short side are integrally formed by a predetermined width in the long side direction at a part of the back surface of the base plate 10, for example, a central portion in the central portion. It is comprised so that it may do.

  In the embodiment of FIG. 6, a plurality of plate-like protrusions 16 b having substantially the same dimensions as the short sides are provided at a predetermined interval in the long side direction at a part of the back surface of the base plate 10, for example, at the center. It is configured to be integrally formed by a predetermined width.

  In the embodiment of FIG. 7, a plurality of plate-like protrusions 16 c having substantially the same dimensions as the short sides are integrally formed on the entire back surface, which is the mounting surface of the base plate 10, with a predetermined interval in the long side direction. It is comprised so that it may do.

  In the embodiment of FIG. 8, a plurality of plate-like protrusions 16d having substantially the same dimensions as the long sides are integrally formed on the entire back surface, which is the mounting surface of the base plate 10, with a predetermined interval in the short side direction. It is comprised so that it may do.

  Further, in the embodiment of FIG. 9, a plurality of plate-like protrusions 16e having a predetermined inclination angle are integrally formed at a predetermined interval on the entire back surface, which is the mounting surface of the base plate 10. is there.

  Further, in the embodiment of FIG. 10, a plurality of protrusions 16 f having a predetermined dimension are arranged in a line substantially parallel to the short side on the entire back surface as the mounting surface of the base plate 10. Are integrally formed with a predetermined interval.

  Note that the shape of the protrusion formed on the mounting surface side of the base plate 10 is not limited to the above shape, and can be configured in various arrangement shapes using various shapes such as a thread shape and a hair shape. It is. And you may comprise so that it may arrange | position in combination with the said projection part 15 using these various projection shapes.

  Moreover, although the said embodiment demonstrated the case where it comprised so that the processus | protrusion 16,16a-16f and the projection part 15 might be selectively provided in the back surface of the baseplate 10, and it attached to the heat sink 18, it does not restrict to this, For example, similar projections and projections may be selectively provided on the component mounting surface side of the heat radiating plate 18 so as to be thermally coupled to the base plate 10 for mounting. Further, the protrusions and the protrusions may be selectively provided on the component mounting surfaces of both the base plate 10 and the heat radiating plate 18 so that the protrusions and the protrusions are attached in a thermally coupled manner.

  Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

It is the perspective view which showed the external appearance structure of the semiconductor package to which the heat generating body mountable component which concerns on one embodiment of this invention was applied. FIG. 2 is a cross-sectional view showing a part of the mounting structure of FIG. FIG. 2 is a cross-sectional view taken along a line AA in FIG. 1. It is the top view which showed the back surface of the base plate of FIG. It is the top view which took out and showed the principal part of the components which can mount the heat generating body which concerns on other embodiment of this invention. It is the top view which took out and showed the principal part of the components which can mount the heat generating body which concerns on other embodiment of this invention. It is the top view which took out and showed the principal part of the components which can mount the heat generating body which concerns on other embodiment of this invention. It is the top view which took out and showed the principal part of the components which can mount the heat generating body which concerns on other embodiment of this invention. It is the top view which took out and showed the principal part of the components which can mount the heat generating body which concerns on other embodiment of this invention. It is the top view which took out and showed the principal part of the components which can mount the heat generating body which concerns on other embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Base plate, 11 ... Frame, 12 ... Semiconductor element, 13 ... Cover, 14 ... Connection terminal for external connection, 15 ... Projection part, 16, 16a, 16b, 16c, 16d, 16e, 16f ... Projection.

Claims (18)

A heating element mountable component on which a heating element can be mounted,
A heating element mountable part, wherein a plurality of deformable protrusions are provided on at least a part of a mounting surface that is thermally coupled to a mounted body.   The heating element mountable component according to claim 1, wherein the mounting surface is provided with a protrusion that is in contact with the mounted body.   The heating element mountable component according to claim 1, wherein the plurality of protrusions are formed in a plate shape arranged substantially in parallel.   The heating element mountable component according to claim 1, wherein the plurality of protrusions are provided to be inclined in one direction.   The heating element mountable component according to any one of claims 1 to 3, wherein the plurality of protrusions are selectively inclined in different directions.   The heating element mountable component according to any one of claims 1 to 5, wherein the heating element is a semiconductor element.   A metal body characterized in that a plurality of deformable protrusions are provided on at least a part of a mounting surface to which a heating element mountable component on which a heating element can be mounted is thermally coupled.   The metal body according to claim 7, wherein the attachment surface is provided with a protrusion that is in contact with a rear surface side of a heating element mounting portion of the heating element mountable component.   The metal body according to claim 7 or 8, wherein the plurality of protrusions are formed in a plate shape arranged substantially in parallel.   The metal body according to claim 7, wherein the plurality of protrusions are provided to be inclined in one direction.   The metal body according to claim 7, wherein the plurality of protrusions are provided to be selectively inclined in different directions.   The metal body according to claim 7, wherein the heating element is a semiconductor element. Components that can be mounted with a heating element,
A mounted body to which this heat generating body mountable part is thermally coupled and mounted;
And a heating element mountable component mounting structure, wherein a plurality of deformable protrusions are provided on at least a part of the mounting surface of at least one of the heat generator mountable component and the mounted body.   14. The mounting structure for a heating element mountable component according to claim 13, wherein the mounting surface is provided with a protrusion that comes into contact with the other mounting surface of the component to be mounted with the heating element and the mounted body. .   15. The mounting structure for a heat generator mountable component according to claim 13 or 14, wherein the plurality of protrusions are formed in a plate shape arranged substantially in parallel.   16. The mounting structure for a heat generator mountable component according to claim 13, wherein the plurality of protrusions are provided to be inclined in one direction.   The heating element mountable component mounting structure according to any one of claims 13 to 15, wherein the plurality of protrusions are selectively inclined in different directions.   18. The structure for mounting a heat generator mountable component according to claim 13, wherein the heat generator is a semiconductor element.

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