JP2009162869A - Plasma display panel module and plasma display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide technique for PDP module layout and packaging capable of implementing efficient heat radiation performance balanced on a complete device basis in response to the provision of new panels. <P>SOLUTION: A PDP module 100 has a PDP 10 and circuit boards including drive circuit boards 50. The drive circuit boards 50 are laid out in parallel on the same plane as the PDP 10 and outside of the panel, so that the panel is separated from a heat radiation system. A chassis 30 is provided on the back of the PDP 10 to fix the panel, and the drive circuit boards 50 are mounted on, for example, the front of the chassis 30 extended beyond the panel. There are no circuit boards laid out in principal areas on the back of the PDP 10 and chassis 30 and the surfaces opposite to the drive circuit boards 50. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a technology of a module or a display device (plasma display device: PDP device) including a plasma display panel (PDP), and more particularly to heat dissipation (cooling), a mounting structure, and the like.

  A conventional PDP module includes a panel (PDP), a chassis, a circuit unit (circuit board), and the like (FIG. 25). The circuit portion includes a drive circuit (driver). There are various types of drive circuits corresponding to panel electrode types and drive contents. In a conventional PDP module, a circuit unit such as a drive circuit is arranged and mounted on the back side of the panel with a chassis interposed therebetween. For example, a panel, a chassis, a heat dissipation space, and a circuit board are arranged in this order from the front side. For example, a sustain driving circuit for sustaining the display electrodes is mounted on the outer peripheral portion on the rear side of the chassis. After the PDP module is manufactured at the factory, it is further assembled into the housing of the PDP device (set), thereby providing a set product.

As a prior art example, in the technique described in Japanese Patent Application Laid-Open No. 10-260641 (Patent Document 1), in a driver IC module for PDP, the driver IC is brought into contact with a chassis (metal reinforcing plate) to improve the heat dissipation of the driver IC. It is improving.
Japanese Patent Laid-Open No. 10-260641

  The arrangement and mounting structure of the PDP module is mainly adopted for the following reasons and background. In a panel having a conventional luminous efficiency level (conventional panel), the panel itself generates a lot of heat. In order to effectively radiate (cool) the conventional panel, for example, a space for radiating heat is required on the back side of the panel. Further, the layout of the circuit board in the space can minimize the volume of the PDP device (set).

  However, the above structure is insufficient in terms of heat dissipation performance in consideration of recent and future development directions related to panels and the like. The reason is as follows (FIG. 26). A newly developed high luminous efficiency panel or the like (new panel) has a higher luminous efficiency level than the conventional panel, and heat generation from the new panel itself is less than that of the conventional panel. Roughly speaking, the conventional panel has high power consumption, low reactive power, and high panel heat generation ratio, but the new panel has low power consumption, high reactive power, and low panel heat generation ratio. ing. Regarding the heat generation and heat dissipation performance of the PDP module as a whole, the heat generation of the conventional panel was dominant in the conventional module, but the heat generation of the circuit part was dominant in the new panel, The balance of heat generation changes.

  In the above change, when the arrangement and mounting structure of the conventional PDP module are similarly applied to the new panel, there is a problem that the heat dissipation performance is insufficient (unbalanced and inefficient). In the PDP module including the new panel, the magnitude of heat generated from the circuit unit (particularly the sustain drive circuit) becomes a problem due to the above change.

  In addition, in the above change, when the structure of the conventional PDP module is applied in the same manner, it is necessary to secure a large space for heat dissipation of the circuit unit, so the volume and thickness of the PDP device (set) can be increased. It becomes difficult to minimize.

  The present invention has been made in view of the above problems, and its main object is to provide a good balance in the entire apparatus (PDP module or PDP apparatus (set)) in response to the provision of a new panel or the like. It is to provide a technique such as an arrangement and a mounting structure capable of realizing efficient heat dissipation performance, and more desirably to provide a technique capable of minimizing the volume and thickness of the entire apparatus.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows. In order to achieve the above object, a typical embodiment of the present invention is a technology such as a PDP module or a PDP device (set) including a PDP (panel) and a circuit unit for driving control thereof. And having the following configuration.

  In the PDP module including the new panel (high luminous efficiency panel) and the like, the panel generates relatively low heat. Therefore, the heat radiation space (or other heat radiation means) provided on the back side of the panel (chassis) has been conventionally used. It is sufficient to secure a small capacity as compared with the PDP module structure. Alternatively, in the case of a panel with higher luminous efficiency, it is almost unnecessary to secure the space for heat dissipation and the heat dissipation means, and natural heat dissipation of the panel is sufficient. On the other hand, an arrangement and mounting structure of a PDP module or the like having an efficient heat dissipation function is provided against a relative increase in heat generation of a circuit unit (particularly a sustain drive circuit) due to an increase in reactive power due to a new panel or the like.

  In the PDP module of this embodiment, unlike a conventional PDP module, a panel (including electrodes, discharge space, display cell structure, etc.) and a circuit board such as a drive circuit board are arranged on a panel plane (a plane corresponding to a screen). Arrange and form (mount) in parallel on the same plane. The circuit board is arranged as little as possible on the back side of the panel.

  For example, this PDP module has a flat plate-like PDP and a circuit board including a drive circuit board for driving the electrode group of the panel. The drive circuit board is disposed in parallel to the outside of the panel on the same plane as the panel, thereby separating the panel and the heat dissipation system. On the back side of the panel, there is a chassis for fixing the panel, and the drive circuit board is provided on the front or back of the area outside the panel on the extension of the chassis (chassis having a larger area than the panel). The circuit board is mounted in the main area on the back side of the chassis, and the circuit board is arranged on the surface opposite to the drive circuit board on the extension of the chassis. It is characterized by not.

  For example, the PDP module has a first chassis for fixing the panel on the back side of the panel, and a second chassis or a heat dissipation board in an area outside the first chassis and the panel. The driving circuit board is mounted on the front surface or the back surface of the second chassis or the heat dissipation board, and the circuit board is not disposed in a main area on the back surface side of the first chassis, The circuit board is not disposed on the surface of the second chassis or the heat dissipation board opposite to the drive circuit board.

  The chassis is separated so as to be separated as a heat dissipation system (heat dissipation path). For example, the first and second chassis are physically connected via a low thermal conductivity material. Further, for example, the first and second chassis are physically separated through the air, and each is physically connected to the set housing.

  Due to the separation of the heat dissipation system, the chassis portion in which the circuit portion is arranged in parallel with the panel mainly takes charge of heat dissipation of the circuit portion. Therefore, the heat radiation performance of the circuit unit is improved as compared with a conventional PDP module (a configuration that is responsible for heat radiation at both front and rear sides in the same chassis). As a result, the heat dissipation performance of the panel and the circuit unit is balanced, and the heat dissipation efficiency of the present PDP module (or set) as a whole is higher than that of the conventional case. Further, along with the parallel arrangement structure and the like, minimization of the volume of the set and the like, in particular, a reduction in thickness is realized.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to a typical embodiment of the present invention, it is possible to realize an efficient heat dissipation performance with a good balance in the entire device (PDP module or PDP device (set)) in response to provision of a new panel or the like, and More desirably, the volume and thickness of the entire apparatus can be minimized.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted. For the sake of explanation, it has an x direction (horizontal direction (display line direction) in the panel screen), a y direction (vertical direction (display column direction) in the panel screen), and a z direction (panel thickness direction).

<Example of conventional technology>
A prior art example as a premise of the present embodiment will be briefly described with reference to FIGS. FIG. 25 schematically shows a cross-sectional configuration of a typical conventional PDP module. FIG. 26 shows an outline of characteristics related to the conventional panel and the new panel.

  A conventional PDP module 900 includes a panel (PDP) 910, a chassis 930, a drive circuit (drive circuit board) 950, a circuit board (control circuit board, etc.) 960, a flexible board (connector) 920, and the like. After the PDP module 900 is manufactured in a factory, it is further assembled into a housing (cover, etc.) of a PDP device (set). Thereby, a set product is provided. Note that the PDP device (set) refers to a device including a speaker and other parts, a housing of a predetermined design (outer shape), and the like according to various product models with a common PDP module as a center.

  In the conventional PDP module 900, circuit portions such as the drive circuit 950 are arranged and mounted on the back side of the panel 910 with the chassis 930 interposed therebetween. Specifically, the rear surface of the substantially flat plate-like panel 910 is fixed to the front side of the substantially flat plate-like chassis 930 by an adhesive sheet or the like, and a space 940 for heat dissipation is provided on the rear side of the chassis 930, for example. The circuit portion is mounted in the form of a circuit board 960 or the like.

  The circuit portion includes a control circuit (logic circuit), a drive circuit 950 (a plurality of drive circuits corresponding to electrodes and drive types), a power supply circuit, and the like. For example, a control circuit, a power supply circuit, and the like are mounted on a circuit board 960 corresponding to a main region including the center portion of the panel 910. The circuit unit disposed near the outer peripheral part on the rear side of the chassis 930 includes a drive circuit 950 such as a sustain drive circuit. Although the drive circuit 950 is illustrated as a substantially rectangular region, it may be formed via a heat dissipation space 940 as with the circuit board 960.

  Each drive circuit 950 and the end of the corresponding electrode (X electrode, Y electrode, address electrode, etc.) of panel 910 are electrically connected by a connecting portion such as a flexible substrate 920 (flexible printed circuit substrate or flexible cable). It is connected. Note that an IC (driver IC) that constitutes a drive circuit (driver) or the like may be mounted on the connection portion (for example, an address driver IC corresponding to the address drive circuit).

  In FIG. 26, the arrangement structure (mounting structure) of the conventional PDP module 900 is mainly adopted for the following reasons and background. In the conventional PDP module 900, the conventional panel (910) has a luminous efficiency level of, for example, less than 1.5 [lm / W], and the heat generation from the conventional panel is large. In order to effectively cool (dissipate heat) the conventional panel (910), it is necessary to secure a space (940) or the like on the back side of the panel (910). In addition, the layout of the circuit boards (950, 960) with respect to the space (940) portion and the back surface of the chassis (930) can minimize the volume of the PDP device (set).

  However, the above structure is insufficient in terms of cooling (heat dissipation) performance in consideration of recent and future development directions related to panels and the like. The reason is as follows. A newly developed high luminous efficiency panel or the like (new panel) has a luminous efficiency level higher than that of the conventional panel (910), for example, 1.5 [lm / W] or higher, and the new panel itself has generated heat. It is less than the panel (910). On the other hand, the reactive power of the new panel is increasing. In general, reactive power due to panel (cell) capacity or the like is generated with respect to power consumption required for driving the panel, that is, applying a driving voltage waveform to the electrode group. The ratio is reversed between the conventional panel (910) and the new panel.

  Generally speaking, the conventional panel (910) has high power consumption, low reactive power, and high panel heat generation ratio, but the new panel has low power consumption, high reactive power, and panel heat generation ratio. Is getting smaller. Regarding the heat generation and heat dissipation performance of the whole PDP module, the heat generation of the conventional panel (910) was dominant in the conventional module, but the heat generation of the circuit part was dominant in the new panel, The balance of heat generation from the panel and circuit section has changed.

  Regarding the heat dissipation, the conventional PDP module 900 is responsible for heat dissipation of the front and rear panels 910 and circuit portions (950, 960) by the same chassis 930.

  In the above change, if the structure of the conventional PDP module 900 (including the layout of the panel 910, circuit boards (950, 960), etc.) is similarly applied to the new panel, the heat dissipation performance is insufficient (balance) Is inefficient and inefficient). In the PDP module having the new panel, due to the above change, the amount of heat generated from the circuit unit, particularly the heat generated from the sustain drive circuit or the like becomes a problem.

  In particular, the sustain drive circuit (X electrode and Y electrode sustain drive circuit) generates a large amount of heat. For example, it is necessary to output about 200 V as a sustain drive voltage from the sustain drive circuit. In comparison, for example, an address drive circuit requires an output of about several tens of volts. The sustain drive circuit includes a circuit part (such as a voltage clamp circuit or a power recovery circuit) that swings the voltage, and the reactive power is the largest and heat generation is large in the part.

  In addition, in the above change, when the structure of the conventional PDP module is used, it becomes difficult to minimize the volume and thickness of the PDP device (set). Here, the volume of the PDP device (set) is, for example, the volume when the shape of the housing that accommodates the PDP module is considered to be a substantially box shape (planar plate shape with a predetermined thickness). The smaller the volume and thickness are, the more effective the product is in terms of size and thickness. Regarding the volume of the set, for example, in the conventional PDP module 900, since the circuit portion (950, 960) is provided on the rear side of the chassis 930, the thickness in the depth direction is large. Considering the case where a new panel is applied to the structure of the conventional PDP module 900, for example, in order to ensure the heat dissipation performance of the circuit portion (especially the drive circuit board 950) on the rear side of the chassis 930, for example, the thickness of the space in the depth direction It is necessary to secure a large amount. Further, when another high-performance heat dissipation means is provided, it is necessary to secure the thickness of that amount. As a result, the volume of the PDP device (set) becomes large.

  As described above, since the balance of heat generation in the PDP module changes between the conventional panel (910) and the new panel, the conventional arrangement structure is unbalanced and inefficient in terms of heat dissipation performance. This is not desirable because the volume and thickness of the set increase.

(Embodiment 1)
Based on the above, the PDP module according to Embodiment 1 of the present invention will be described with reference to FIGS. Specifically, the first embodiment has configurations 1A, 1B, 1C, and the like. The main feature of the first embodiment is that the panel and the circuit unit are arranged in parallel in the same chassis.

  As shown in FIG. 1, in the first embodiment, the panel 10 and the drive circuit (drive circuit board) 50 are arranged and formed in parallel on the same plane with respect to a single common chassis 30. 1 exemplifies a cross section in the x direction and the z direction, and the drive circuit 50 includes a sustain drive circuit board 51 (X sustain drive circuit (X electrode sustain drive circuit board)) 51-1, Y shown in FIG. This is a sustain drive circuit (Y electrode sustain drive circuit board) 51-2).

  Further, on the front side or the back side of the panel 10, a chip tube 90 used for exhausting and gas filling the internal space (discharge space) of the panel 10 is provided. The tip tube 90 is provided in a part (such as a corner) of the panel 10 and the vicinity of the outer periphery of the chassis 30. The tip tube 90 is in a sealed state in the product and has a convex shape with respect to the plane of the panel 10 or the like. Due to this convex shape, it is necessary to secure a predetermined arrangement space. If the tip tube 90 or the means conforming thereto is not convex with respect to the plane of the panel 10 or the like, the above-described space securing need not be considered.

  The same configuration can be adopted in the y-direction cross section. In that case, the drive circuit 50 is an address drive circuit or the like.

<1A>
FIG. 1 shows a cross section (schematic) of the PDP module 100 having the configuration 1A. The panel 10 is fixed to the chassis 30 with an adhesive sheet or the like. The drive circuit 50 is arranged on the front surface side of the chassis 30 as in the panel 10. The chassis 30 is a metal such as Al, a tempered glass plate, or a resin plate. In Embodiment 1A, the tip tube 90 is connected to the back side of the panel 10. In addition, the line of an outer frame is a case where the external shape of the PDP module 100 or the external shape of the set housing | casing of the outer side is considered as a substantially box shape. The chassis extension 35 is a portion (panel 10 outer frame region) of the chassis 30 that holds the panel 10 that extends outward in the conventional direction.

  FIG. 2 shows a plane (schematic) on the front side of the PDP module 100 having the configuration 1A. As the drive circuit 50, an X sustain drive circuit 51-1 corresponding to the X electrode group is disposed on the outer peripheral portion (chassis extension 35) of the chassis 30, which is the right region of the panel 10, and the left region ( A Y sustain drive circuit 51-2 corresponding to the Y electrode group is disposed in the chassis extension 35). In the panel 10, among the display electrode pairs parallel to the x direction, the X electrode is a sustaining electrode, and the Y electrode is a sustaining and scanning electrode. In addition, address electrodes parallel to the y direction are formed on the panel 10 and are connected to an address driving circuit (not shown).

  FIG. 3 is a configuration example of the panel 10 (similar to the prior art). The panel 10 is configured by a combination of a front substrate structure (first structure) 11 and a rear substrate structure (second structure) 12. A discharge space defined by the barrier rib structure is formed between the front and rear substrates. The board | substrate before and behind the outer peripheral part of the panel 10 is sealed by the sealing part 13. FIG. A region inside the sealing portion 13, particularly the display region 40, is exhausted through the tip tube 90 and filled with a discharge gas, thereby forming a discharge space. The display area 40 has a display cell structure, is associated with the screen, and is exposed to the outside on the front surface of the set housing. The non-display area 41 outside the display area 40 is not used for display and is covered with, for example, a set housing.

  Each electrode of the panel 10 is pulled out to the outer peripheral portion for connection with the drive circuit 50 side. For example, an X electrode group (represented by symbol X) is drawn out on the right side of the first structure 11 of the panel 10, and a Y electrode group (represented by symbol Y) is drawn out on the left side, and the lower or upper side of the second structure 12 Alternatively, an address electrode group (represented by symbol A) is drawn out to both. Corresponding to these, the X sustain driving circuit 51-1 and the Y sustain driving circuit 51-2 are arranged on the left and right sides of the panel 10, and the address driving circuit is arranged on the upper and lower sides of the panel.

  FIG. 4 shows a cross section (part) of a configuration example of connection between the panel 10 and the drive circuit 50 in the first embodiment. The panel 10 including the first structure 11 and the second structure 12 is provided on the front side of the chassis 30. The chassis extension 35 (or a second chassis 32 described later) has a drive circuit 50. The electrode end 20 of one electrode of the first structure 11 or the second structure 12 is drawn out at the outer periphery of the panel 10. The electrode end portion 20 and the drive circuit 50 are electrically connected (wired) by a connection portion (electrode-drive circuit connection portion) 120. The connection unit 120 is, for example, a flexible cable or a flexible printed circuit board module. The electrode end portion 20 and the end portion of the connection portion 120 are, for example, thermocompression bonded. The end of the drive circuit 50 and the other end of the connection unit 120 are connected by, for example, a connector. Since the panel 10 and the drive circuit 50 are arranged in parallel on the same plane, the arrangement shape of the connecting portion 120 therebetween is also planar.

  As an example of the configuration related to the connecting portion 120, the electrode end portion 20 of the display electrode (X electrode, Y electrode) group parallel to the x direction of the panel 10, the X and Y sustain drive circuits 51-1 and 51-2, Are connected by a flexible board module (a module comprising a flexible printed circuit board).

  27 and FIG. 28, since the X electrode side has a common electrode structure, the X sustain drive circuit 51-1 is eliminated by drawing it out to the lower side instead of the left and right sides, or by devising the circuit. Shape is possible.

<1B>
Similarly, FIG. 5 shows a cross section of the PDP module 100 having the configuration 1B. In the configuration 1 </ b> B, the drive circuit 50 is arranged on the opposite side of the panel 10 with respect to the plane of the chassis 30, that is, on the back side (chassis extension 35) of the chassis 30. The tip tube 90 is connected to the back side of the panel 10.

  Further, as in the modification shown in FIG. 29, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the common electrode structure described above.

<1C>
Similarly, FIG. 6 shows a cross section of the PDP module 100 having the configuration 1C. In the configuration 1 </ b> C, the tip tube 90 is connected to the front side of the panel 10. As in the configuration 1B, a configuration in which the drive circuit 50 is disposed on the rear side of the chassis 30 is also possible.

  In addition, as in the modification shown in FIG. 30, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the above-described common electrode structure.

  As described above, according to the first embodiment, the arrangement of the panel 10 and the drive circuit 50 is separated from the plane of the chassis 30, and only the drive circuit 50 needs to radiate heat in the chassis extension 35. The heat dissipation performance of the circuit 50 is enhanced, and the volume and thickness of the set can be minimized.

(Embodiment 2)
Next, the PDP module according to the second embodiment of the present invention will be described with reference to FIGS. In detail, the second embodiment has configurations 2A, 2B, and the like. The main feature of the second embodiment is that a part of the entire circuit portion is arranged on the back side of the panel 10 and the chassis 30.

<2A>
FIG. 7 shows a cross section of the PDP module 100 having the configuration 2A. In the configuration 2A, in addition to the configuration 1A, a partial circuit (partial circuit board) 150 is arranged and formed on the back side of the chassis 30.

  The partial circuit 150 is a predetermined circuit excluding the drive circuit 50 (for example, the sustain drive circuit 51) disposed on the front side, for example, a scan drive circuit board or an address drive circuit board (data relay board) among all circuit units. Etc.). The partial circuit 150 is arranged on the back side of the panel 10 and in a part near the outer periphery.

  In FIG. 7, the partial circuit 150 is disposed at a position corresponding to the left and right sides of the panel 10, but is not limited thereto, and can be disposed at a suitable position on the rear side of the chassis 30. For example, it may be arranged on the back side of the chassis extension 35 (in this case, the heat dissipation performance of the drive circuit 50 is slightly reduced).

  The second embodiment is effective in the following cases, for example. The circuit is arranged according to the heat radiation performance required for each circuit among all the circuits. A circuit that requires high heat dissipation performance, for example, the sustain drive circuit 51 that generates the largest amount of heat is disposed in the chassis extension 35, and a circuit that requires lower heat dissipation performance, such as a scan drive circuit or an address drive circuit, is provided. , And arranged as a partial circuit 150 on the back side. Since the panel 10 and the rear surface side of the chassis 30 are more vacant than the prior art except for some circuits 150, the heat dissipation efficiency is sufficiently satisfied.

  In addition, as in the modification shown in FIG. 31, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the above-described common electrode structure.

<2B>
FIG. 8 shows a cross section of the PDP module 100 having the configuration 2B. In the configuration 2B, in addition to the configuration 1B, a partial circuit 150 is arranged and formed on the back side of the chassis 30. Further, the partial circuit 150 and the drive circuit 50 are connected as necessary.

  Further, as in the modification shown in FIG. 32, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the common electrode structure described above.

  As described above, according to the second embodiment, it is not always necessary to arrange all the circuit portions in the chassis extension portion 35, and it is easy to minimize the volume of the set while balancing the heat radiation of the entire device.

(Embodiment 3)
Next, the PDP module according to the third embodiment of the present invention will be described with reference to FIGS. In detail, the third embodiment has configurations 3A, 3B, and the like. The main feature of the third embodiment is that a part of the entire circuit portion is directly attached (directly mounted) to the panel 10 (front side).

<3A>
FIG. 9 shows a cross section of the PDP module 100 having the configuration 3A. In the configuration 3A, in addition to the configuration 1A, a partial circuit (panel direct-attached partial circuit) 160 is directly attached in the vicinity of the outer peripheral portion on the front side of the panel 10.

  Similar to the partial circuit 150, the partial circuit 160 is a predetermined circuit excluding the drive circuit 50, such as a scan drive circuit board or an address drive circuit board. The partial circuit 160 is connected to the display electrode ends on the left and right sides of the panel 10, for example, and is also connected to the drive circuit 50 side.

  Further, as in the modification shown in FIG. 33, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the above-described common electrode structure.

<3B>
FIG. 10 shows a cross section of the PDP module 100 having the configuration 3B. In the configuration 3B, in addition to the configuration 1B, a partial circuit 160 is directly attached in the vicinity of the outer peripheral portion of the panel 10.

  Further, as in the modification shown in FIG. 34, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the above-described common electrode structure.

  According to the third embodiment, as in the second embodiment, it is easy to minimize the volume of the set while balancing the heat radiation of the entire apparatus.

(Embodiment 4)
Next, the PDP module according to the fourth embodiment of the present invention will be described with reference to FIGS. In detail, the fourth embodiment has configurations 4A, 4B, 4C, 4D, and the like. The main feature of the fourth embodiment is that the chassis 30 is separated on the panel 10 side and the drive circuit 50 side according to the heat dissipation system.

<4A>
FIG. 11 shows a cross section of the PDP module 100 having the configuration 4A. In the configuration 4A, the chassis 30 is separated based on the configuration 1A. The panel 10 side is fixed to the front side of the first chassis (panel chassis portion) 31 with an adhesive sheet or the like, and the drive circuit 50 side is fixed (mounted) to the front side of the second chassis (drive circuit chassis portion) 32. ) The drive circuit 50 is, for example, a sustain drive circuit 51 as described above. The separation of the chassis 30 is intended to separate the heat radiation system (heat radiation path), in other words, the heat conduction effect. That is, because the chassis 30 is not integral and extended, the heat radiation of the panel 10 (and the first chassis 31) and the heat radiation of the drive circuit 50 (and the second chassis 32) are separated. The first chassis 31 is responsible for heat dissipation of the panel 10 (new panel or the like), and the second chassis 32 is responsible for heat dissipation of the drive circuit 50.

  In this example, the positions of the panel 10 and the drive circuit 50 and the positions of the first chassis 31 and the second chassis 32 are slightly shifted in the z direction as compared with the above-described embodiment (specifically, the drive circuit). 50 and the second chassis 32 are slightly moved in the rear direction). By this arrangement adjustment, the entire PDP module 100 is more planar and the volume of the set is minimized. Although the chassis 30 is separated, the panel 10 and the circuit unit are electrically connected.

  Further, as in the modification shown in FIG. 35, the X sustain driving circuit 51-1 side can be drawn out to the lower side instead of the left and right sides by the above-described common electrode structure.

<4B>
FIG. 12 shows a cross section of the PDP module 100 having the configuration 4B. In the configuration 4B, the drive circuit 50 is disposed on the back side of the second chassis 32 on the basis of the configuration 1B, contrary to the panel 10.

  Further, as in the modification shown in FIG. 36, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the above-described common electrode structure.

<4C>
FIG. 13A shows a plan configuration example of the PDP module 100 having the configuration 4C, and FIG. 13B shows a cross-sectional configuration example. In the configuration 4C, based on the configurations 4A and 4B, the first chassis 31 and the second chassis 32 are physically connected and fixed by the connection portion (inter-chassis connection portion) 130. Further, the connection portion 130 is made of a low thermal conductivity material (for example, an organic resin or a component including the same) corresponding to the above-described heat dissipation system separation. In this example, two connecting portions 130 are disposed on the same plane of the panel 10 and between the chassis (31, 32).

  Further, as in the modification shown in FIG. 37, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the above-described common electrode structure.

<4D>
FIG. 14 shows a planar configuration example of the PDP module 100 having the configuration 4D. In the configuration 4D, based on the PDP module 100 of the configuration 4A, the first chassis 31 and the second chassis 32 are physically connected and fixed to the housing 200 of the PDP device (set) 300, respectively. Between the first chassis 31 and the second chassis 32, air is interposed.

  In addition, the shape of the housing | casing 200 has shown the case where it is simply box-shaped, and the connection components etc. are abbreviate | omitting illustration. Needless to say, the shape can be designed in a predetermined manner, for example, a shape in which the volume or thickness of the set 300 can be made as small as possible by using a space where nothing is arranged as a recess.

  Further, as in the modification shown in FIG. 38, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the above-described common electrode structure.

  According to the fourth embodiment, since the heat radiation system is clearly separated by the panel 10 and the drive circuit 50 by separating the chassis 30, the heat radiation performance can be easily controlled. In addition, the form which combined Embodiment 2 and 3 with Embodiment 4 is also possible similarly.

(Embodiment 5)
Next, the PDP module according to the fifth embodiment of the present invention will be described with reference to FIGS. In detail, the fifth embodiment has configurations 5A, 5B, and the like. The main feature of the fifth embodiment is that the panel 10 is directly assembled (fixed) to the housing 200 of the set 300, and there is no chassis for fixing the panel 10 (first chassis 31).

<5A>
FIG. 15 shows a cross section of the PDP module 100 having the configuration 5A. In the configuration 5A, the first chassis 31 is removed based on the configuration 4A, and the back side of the panel 10 is a space. The drive circuit 50 side is fixed to, for example, the front side of the second chassis 32 as described above. The reason why the chassis is not provided on the back side of the panel 10 is intended for the case where the natural heat dissipation of the panel 10 itself is sufficient as the heat dissipation system of the panel 10 (new panel or the like).

  In addition, FIG. 16A shows a planar configuration example of a PDP device (set) 300 including the PDP module 100 having the configuration 5A, and FIG. 16B shows a cross-sectional configuration example. 15 shows an example in which the panel 10 (and the drive circuit 50 and the like) of the PDP module 100 of FIG. 15 is directly attached to the housing 200 of the PDP device (set) 300 in order to fix the position.

  The back side of the panel 10 is fixed to the inner surface on the back side of the housing 200, the upper and lower surfaces, and the like by a predetermined means. In addition, the second chassis 32 (or a heat dissipating board or the like) that holds the drive circuit 50 is fixed to the inner surface on the back side, the upper and lower surfaces, the side surfaces, and the like of the housing 200 by a predetermined means.

  Further, as in the modification shown in FIGS. 39 and 40, the X sustain drive circuit 51-1 side can be drawn out to the lower side instead of the left and right sides by the above-described common electrode structure.

<5B>
FIG. 17A shows a cross section of the PDP module 100 having the configuration 5B. In the configuration 5B, the first chassis 31 is removed based on the configuration 4B, and the back side of the panel 10 is a space. The drive circuit 50 side is fixed to, for example, the back side of the second chassis 32 as described above.

  FIG. 17B shows a cross-sectional configuration example of a PDP apparatus (set) 300 including the PDP module 100 having the configuration 5B. As in the configuration 5A, the panel 10 (and the drive circuit 50 and the like) are directly attached to the casing 200 of the set 300. The second chassis 32 that holds the drive circuit 50 is fixed to the inner surface of the housing 200 on the front side.

  Further, as in the modification shown in FIG. 41, the X sustain drive circuit 51-1 side can be drawn out to the lower side instead of the left and right sides by the above-described common electrode structure.

  According to the fifth embodiment, further space saving and low cost can be realized by reducing the chassis on the back side of the panel 10.

(Embodiment 6)
A PDP module according to the sixth embodiment of the present invention will be described with reference to FIGS. The sixth embodiment has configurations 6A, 6B, and the like. The main feature of the sixth embodiment is that not only the sustain drive circuit 51 as in the first embodiment but also various circuits such as an address drive circuit, a control circuit, and a power supply circuit are parallel to the panel 10 in the same plane. It is a structure to be arranged. In other words, the circuit disposed on the back side of the panel 10 and the chassis 30 is eliminated as much as possible.

<6A>
FIG. 18 shows a planar configuration example of a set 300 including the PDP module 100 having the configuration 6A. In the configuration 6A, various circuits and the like are arranged in parallel on the same plane of the panel 10 based on the configuration 4D and the like. That is, an address drive circuit (address drive circuit board) 53 and a second chassis 32 (address drive circuit chassis portion) holding the address drive circuit (address drive circuit board) 53 are disposed in the lower (lower side) region of the panel 10. The address drive circuit 53 includes a data relay board and the like. Various circuits are arranged on the front side or the back side with respect to the second chassis 32 as described above.

  Further, in a corner area with respect to the plane of the panel 10, that is, in a lower area of the sustain drive circuit 51 (51-1, 51-2), the substrate of the control circuit (logic circuit) 60, the power supply unit 70, and the like. Has been placed. The control circuit 60 controls each drive circuit and the like. The power supply unit 70 supplies power to each circuit unit such as each drive circuit and the control circuit 60 based on an external power supply input.

  Each chassis (31, 32), control circuit 60, power supply unit 70, and the like are fixed to the housing 200 of the set 300. In addition, the chassis (31, 32) is not limited to being separated, and an integral form is also possible.

  Further, as in the modification shown in FIG. 42, the X sustain drive circuit 51-1 side can be drawn out to the lower side instead of the left and right sides by the above-described common electrode structure.

<6B>
FIG. 19 shows a planar configuration example of a set 300 including the PDP module 100 having the configuration 6B. The configuration 6B is a configuration in which a power circuit system (most part except the power connection board) is further arranged outside the housing 200 based on the configuration 6A.

  Instead of the power supply unit 70, a power supply connection board 71 is disposed in a corner area with respect to the plane of the panel 10. An external power supply (power supply device) 72 is connected to the power supply connection board 71 through a power supply line 74, and the power supply 72 is connected to an AC input 73. Based on the AC input 73, the power source 72 supplies DC power to the power connection board 71, and further, power is supplied from the power connection board 71 to each circuit unit.

  Further, as in the modification shown in FIG. 43, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the common electrode structure described above.

  According to the sixth embodiment, the heat dissipation performance of each circuit unit can be satisfied, and the entire set 300 can be thinned.

(Embodiment 7)
Next, a PDP module according to Embodiment 7 of the present invention will be described with reference to FIGS. The seventh embodiment has configurations 7A, 7B, 7C, and the like. The main feature of the seventh embodiment is that the electrode ends and the flexible substrate are arranged in parallel on the same plane as the panel 10 and the drive circuit 50 as the configuration of the connection portion between the electrode group of the panel 10 and the drive circuit 50. It is a structure to be arranged.

<7A>
FIG. 20 shows a planar configuration example (a plane viewed from the back side of the panel 10) of the set 300 including the PDP module 100 having the configuration 7A. In the configuration 7A, based on the same configuration as the configurations 6A and 5A, various electrode groups of the panel 10 (new panel or the like) are formed on substantially the same plane. That is, for example, the display electrode (X, Y) group in the x direction and the address electrode (A) group in the y direction are formed on the front substrate structure 11 side (inside) which is the display surface side. The electrode ends of these electrode groups are also drawn out on the same plane of the front substrate structure 11. As shown in the drawing, for example, an electrode end 22 of the Y electrode and an electrode end 23 of the address electrode (A) are drawn out on the side of the front substrate structure 11 on the same plane. These electrode end portions (22, 23) are connected to corresponding drive circuits (51-2, 53) by connection portions 120 such as a flexible substrate 121, respectively. The arrangement of each flexible substrate 121 is also on the same plane.

<7B>
FIG. 21 shows a planar configuration example (a plane viewed from the back side of the panel 10) of the set 300 including the PDP module 100 having the configuration 7B. In the configuration 7B, the various electrode groups of the panel 10 are formed on different planes with respect to the configuration 7A. That is, for example, a display electrode (X, Y) group in the x direction is formed on the front substrate structure 11 side (inside) which is the display surface side, and an address electrode in the y direction is formed on the back substrate structure 12 side (inside). (A) A group is formed. As shown in the drawing, for example, the electrode end 22 of the Y electrode is drawn out to the side of the plane of the front substrate structure 11, and the electrode end 23 of the address electrode (A) is drawn out to the side of the plane of the back substrate structure 12. It is.

  As shown by a, the electrode end portion 23 of the address electrode (A) on the back substrate structure 12 side is formed on the back surface side of the back substrate structure 12 shown in the figure. Therefore, in the connection portion 120 such as the flexible substrate 121 that connects the electrode end portion 23 and the address drive circuit 53, it is necessary to wrap around one end of the connection portion 120 toward the back surface side and connect (crimp) the electrode end portion 23 to the electrode end portion 23. .

  In the configuration 7A, the formation planes of the electrode groups are substantially the same, and in the configuration 7B, they are different (on the back side). In the case of the configuration 7A, the connection configuration between the electrode end portion 20 and the drive circuit 50 is simplified. Therefore, operations such as assembly of the PDP module 100 to the casing 200 of the set 300 are easy. For example, after fixing the panel 10 and the like to the housing 200, the connection of the flexible substrate 121 and the like can be performed on the same plane from the back side of the apparatus, which is advantageous in improving work efficiency.

<7C>
FIG. 22 shows a planar configuration example (a plane viewed from the back side of the panel 10) of the set 300 including the PDP module 100 having the configuration 7C. In the configuration 7C, based on the same configuration as the configuration 7A and the like, a part such as the speaker 80 is further installed between the drive circuit board 50 (the second chassis 32). As shown in the figure, the speaker 80 is fixed to the housing 200 and is not connected (not stacked) to the drive circuit board 50 and the second chassis 32. In order not to interfere with each other, for example, the area of the drive circuit board 50 and the second chassis 32 has a shape obtained by removing the speaker 80 arrangement area from a basic shape such as a rectangle.

  According to the seventh embodiment, the flatness including the connection configuration between the panel 10 and the drive circuit 50 can be ensured, and the set 300 can be reduced in thickness. In addition, depending on the form, effects such as improvement in the degree of freedom for incorporating the module into the set and improvement in manufacturing / working efficiency can be obtained.

(Embodiment 8)
Next, the PDP module according to the eighth embodiment of the present invention will be described with reference to FIGS. The eighth embodiment has configurations 8A and 8B. The main feature of the eighth embodiment is a configuration in which another cooling means or cooling mechanism is further provided on the housing 200 side in addition to the configuration of the heat radiation system separation described above.

<8A>
FIG. 23 shows a cross-sectional configuration example of a set 300 including the PDP module 100 having the configuration 8A. In the configuration 8A, the casing 200 has a casing structure (shape) in which cooling of the panel 10 and cooling of the drive circuit 50 are separated based on the same configuration as the configuration 5A. The internal space of the housing 200 corresponds to the configuration of the heat radiation system separation on the panel 10 (which may include the first chassis 31) side and the drive circuit 50 (and the second chassis 32) side, A partition or the like is provided. In addition, the housing 200 is provided with several cooling ports 170 on the front side (outer peripheral portion) of the panel 10 (for example, a total of three at the left, right, and center positions with respect to the horizontal side). The housing 200 is provided with a cooling port 170 on the front side of the drive circuit 50.

  The panel 10 is radiated (cooled) from both the back side of the housing 200 (the first chassis 31) side and the cooling port 170 on the front side. The drive circuit 50 is radiated (cooled) from both sides of the second chassis 32 and the cooling port 170 on the front side. In addition, the cooling port 170 may be provided on the side surface or flat surface of the housing 200.

  Further, as in the modification shown in FIG. 44, the X sustain drive circuit 51-1 side can be drawn out to the lower side instead of the left and right sides by the common electrode structure described above.

<8B>
FIG. 24 shows a cross-sectional configuration example of a set 300 including the PDP module 100 having the configuration 8B. In the configuration 8B, a cooling fan 180 is provided in the housing 200 as a cooling unit on the drive circuit 50 side as compared with the configuration 8A. The cooling fan 180 is, for example, an axial fan. The drive circuit 50 is actively air-cooled by the operation of the cooling fan 180 on the front side. The panel 10 (new panel etc.) side has no cooling device, and only natural air cooling is sufficient.

  Further, as in the modification shown in FIG. 45, the X sustain drive circuit 51-1 side can be pulled out to the lower side instead of the left and right sides by the above-described common electrode structure.

  According to the eighth embodiment, since the heat dissipation system is clearly separated by the panel 10 and the drive circuit 50 by the further cooling means or mechanism, it is easier to control the heat dissipation performance.

<Comparison with prior art examples>
This embodiment is compared with a prior art example. In the technique of Patent Document 1, the driver IC chip is TAB mounted on a polyimide-based flexible substrate having low thermal conductivity, so that it is difficult to dissipate heat. This is a means for effectively dissipating heat from the chip.

  On the other hand, in the present embodiment, as described above, the reactive power of the new panel (high luminous efficiency panel) is large, and in particular, the heat generation of the circuit unit such as the sustain drive circuit 51 is large. The main object is to realize efficient heat dissipation in the entire PDP module 100 or the set 300 in consideration of the balance of heat dissipation performance between the panel 10 and the circuit unit such as the sustain drive circuit 51.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, the chassis 30 (or heat dissipation board) of the PDP device is transmissive or semi-transmissive, and displays an image passing therethrough.

  For example, a metal mesh or a metal foil is provided on the back surface of the panel 10 of the PDP module.

  The present invention is applicable to a PDP device.

It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 1 (Configuration 1A) of the present invention. It is a figure which shows the planar structure of the PDP module of Embodiment 1 (Configuration 1A) of the present invention. It is a figure which shows the structural example of PDP in the PDP module of Embodiment 1 (Structure 1A) of this invention. It is a figure which shows the cross section of the structural example of the connection of the panel electrode edge part and drive circuit in the PDP module of Embodiment 1 (Structure 1A) of this invention. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 1 (configuration 1B) of the present invention. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 1 (configuration 1C) of the present invention. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 2 (Structure 2A) of this invention. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 2 (Structure 2B) of this invention. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 3 (Structure 3A) of this invention. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 3 (Structure 3B) of this invention. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 4 (Structure 4A) of this invention. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 4 (Structure 4B) of this invention. It is a figure which shows the structure of the PDP module of Embodiment 4 (structure 4C) of this invention, (a) is a plane structural example, (b) shows the cross section of the structural example of the connection of a panel electrode and a drive circuit. . It is a figure which shows the structure of the PDP module and PDP apparatus set of Embodiment 4 (structure 4D) of this invention, (a) shows the example of a plane structure, (b) shows the example of a cross-sectional structure. It is a figure which shows the cross-sectional structure of the PDP module of Embodiment 5 (Structure 5A) of this invention. It is a figure which shows the structure of the PDP apparatus set of Embodiment 5 (structure 5A) of this invention, (a) shows a plane structural example, (b) shows a cross-sectional structural example. It is a figure which shows the structure of the PDP module and PDP apparatus set of Embodiment 5 (structure 5B) of this invention, (a) is a cross-sectional structural example of a PDP module, (b) is a cross-sectional structural example of a PDP apparatus set. Show. It is a figure which shows the planar structure of the PDP apparatus set of Embodiment 6 (Structure 6A) of this invention. It is a figure which shows the planar structure of the PDP apparatus set of Embodiment 6 (Structure 6B) of this invention. It is a figure which shows the structural example of the plane structure of the PDP apparatus set of Embodiment 7 (structure 7A) of this invention, especially the connection of a panel electrode and a drive circuit. It is a figure which shows the structural example of the planar structure of the PDP apparatus set of Embodiment 7 (structure 7B) of this invention, especially the connection of a panel electrode and a drive circuit. It is a figure which shows the planar structure of the PDP apparatus set of Embodiment 7 (structure 7C) of this invention, especially the example of arrangement | positioning structure of a speaker. It is a figure which shows the cross-sectional structure of the PDP apparatus set of Embodiment 8 (structure 8A) of this invention. It is a figure which shows the cross-sectional structure of the PDP apparatus set of Embodiment 8 (structure 8B) of this invention. It is a figure which shows the example of a cross-sectional structure of the PDP module of a prior art example. It is a figure which shows the comparison of the characteristic of the conventional panel and new panel in the PDP module of a prior art example. It is a figure which shows the cross-sectional structure of the modification (form which X drive circuit is mounted below) of the structure 1A. It is a figure which shows the planar structure of the modification (form which X drive circuit is mounted below) of the structure 1A. It is a figure which shows the cross-sectional structure of the modification (form which the X drive circuit is mounted below) of the structure 1B. It is a figure which shows the cross-sectional structure of the modification (form which X drive circuit is mounted below) of the structure 1C. It is a figure which shows the cross-sectional structure of the modification (form which the X drive circuit is mounted below) of the structure 2A. It is a figure which shows the cross-sectional structure of the modification (form which X drive circuit is mounted below) of the structure 2B. It is a figure which shows the cross-sectional structure of the modification (form which the X drive circuit is mounted below) of the structure 3A. It is a figure which shows the cross-sectional structure of the modification (form which X drive circuit is mounted below) of the structure 3B. It is a figure which shows the cross-sectional structure of the modification (form which the X drive circuit is mounted below) of the structure 4A. It is a figure which shows the cross-sectional structure of the modification (form which X drive circuit is mounted below) of the structure 4B. It is a figure which shows the planar structure of the modification (form which X drive circuit is mounted below) of the structure 4C. (A), (b) is a figure which shows the structure of the plane and cross section of the modification (form which X drive circuit is mounted below) of the structure 4D. It is a figure which shows the cross-sectional structure of the modification (form which X drive circuit is mounted below) of the structure 5A. (A), (b) is a figure which shows the structure of the plane and cross section of the modification (form which X drive circuit is mounted below) of the structure 5A. (A), (b) is a figure which shows the cross-sectional structure of the modification (form which X drive circuit is mounted below) of the structure 5B. It is a figure which shows the planar structure of the modification (form which X drive circuit is mounted below) of the structure 6A. It is a figure which shows the planar structure of the modification (form which X drive circuit is mounted below) of the structure 6B. It is a figure which shows the planar structure of the modification (form which X drive circuit is mounted below) of the structure 8A. It is a figure which shows the planar structure of the modification (form which X drive circuit is mounted below) of the structure 8B.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10,910 ... PDP (panel), 11 ... Front substrate structure (1st structure), 12 ... Back substrate structure (2nd structure), 13 ... Sealing part, 20 ... Electrode edge part, 30,930 ... Chassis, 31 ... First chassis, 32 ... Second chassis, 35 ... Chassis extension, 40 ... Display area, 41 ... Non-display area, 50, 950 ... Drive circuit (drive circuit board), 51 ... Sustain drive Circuit (sustain drive circuit board), 51-1 ... X sustain drive circuit (X electrode sustain drive circuit board), 51-2 ... Y sustain drive circuit (Y electrode sustain drive circuit board), 60 ... Control circuit (logic circuit) , 70 ... Power supply unit, 71 ... Power supply connection board, 72 ... Power supply, 73 ... AC input, 74 ... Power supply line, 80 ... Speaker, 90 ... Chip tube, 100, 900 ... PDP module, 1 DESCRIPTION OF SYMBOLS 0 ... Connection part (electrode-drive circuit connection part), 130 ... Connection part (inter-chassis connection part), 140 ... Electrode edge part, 150 ... Partial circuit, 160 ... Partial circuit (panel direct attachment partial circuit), 170 ... Cooling port, 180 ... Cooling fan, 200 ... Housing (set housing), 300 ... PDP device (set), 920 ... Connection part (flexible substrate), 940 ... Space, 960 ... Circuit board.

Claims (21)

A flat plate-shaped plasma display panel, and a circuit board including a drive circuit board for driving the electrode group of the panel,
The drive circuit board is one in which the panel and the heat dissipation system are separated,
On the back side of the panel, there is a chassis for fixing the panel,
The drive circuit board is mounted on the front surface or the back surface of the outer region of the panel on the extension of the chassis,
The plasma display panel module, wherein the circuit board is not disposed on a region on the back side of the chassis and on a surface opposite to the drive circuit board on an extension of the chassis. A flat plate-shaped plasma display panel, and a circuit board including a drive circuit board for driving the electrode group of the panel,
The drive circuit board is arranged in parallel to the outside area of the panel in the same plane as the panel to separate the panel and the heat dissipation system,
On the back side of the panel, there is a chassis for fixing the panel,
The drive circuit board is mounted on the front surface or the back surface of the outer region of the panel on the extension of the chassis,
The plasma display panel module, wherein the circuit board is not disposed on a region on the back side of the chassis and on a surface opposite to the drive circuit board on an extension of the chassis. A flat plate-shaped plasma display panel, and a circuit board including a drive circuit board for driving the electrode group of the panel,
The drive circuit board is arranged in parallel to the outside area of the panel in the same plane as the panel to separate the panel and the heat dissipation system,
The back side of the panel has a first chassis for fixing the panel,
A second chassis or a heat dissipation board is provided in a region outside the first chassis and the panel, and the driving circuit board is mounted on a front surface or a back surface of the second chassis or the heat dissipation board,
The plasma display panel, wherein the circuit board is not disposed on a region on the back side of the first chassis and a surface of the second chassis or the heat dissipation board opposite to the drive circuit board. module. A flat plate-shaped plasma display panel, and a circuit board including a drive circuit board for driving the electrode group of the panel,
The drive circuit board is arranged in parallel to the outside area of the panel in the same plane as the panel to separate the panel and the heat dissipation system,
The back side of the panel is assembled to the casing of the plasma display device,
The drive circuit board is mounted on a front surface or a back surface of a chassis or a heat dissipation board provided in a region outside the panel,
The plasma display panel module, wherein the circuit board is not disposed in a region on the back side of the panel and a surface of the chassis or the heat dissipation board opposite to the driving circuit board. In the plasma display panel module according to any one of claims 1 to 4,
The drive circuit board has a sustain drive circuit board for sustain driving the display electrode group parallel to the first direction of the panel;
The sustain driving circuit board is arranged in parallel to at least one outer side of the left side and the right side of the panel in the same plane as the panel, and the heat dissipation system is separated from the panel. Plasma display panel module. In the plasma display panel module according to any one of claims 1 to 5,
The drive circuit board includes an address drive circuit board for address driving address electrode groups parallel to the second direction of the panel;
The address driving circuit board is arranged in parallel to the outside of both the lower side and / or the upper side of the panel on the same plane as the panel, and the heat dissipation system is separated from the panel. Plasma display panel module. In the plasma display panel module according to any one of claims 1 to 6,
A plasma display panel module, wherein a control circuit for controlling the driving circuit board is arranged in parallel with an area outside the panel on the same plane as the panel. In the plasma display panel module according to any one of claims 1 to 7,
A plasma display panel module, wherein a power supply unit for supplying power to the circuit board is arranged in parallel with an area outside the panel on the same plane as the panel. In the plasma display panel module according to any one of claims 1 to 7,
A power connection board for supplying power to the circuit board is arranged in parallel with the outside of the panel in the same plane as the panel,
A plasma display panel module, wherein a power supply device connected to an AC input and connected to the power connection board is disposed outside a module including the panel and the chassis. The plasma display panel module according to claim 1 or 2,
A plasma display panel module, wherein a scan drive circuit or an address drive circuit, which is a partial circuit of all circuit portions, is disposed on an outer peripheral portion on the back side of the panel. In the plasma display panel module according to any one of claims 1 to 4,
A plasma display panel module, wherein a scan drive circuit or an address drive circuit, which is a partial circuit of all circuit portions, is formed directly on the outer peripheral portion on the front side of the panel. In the plasma display panel module according to any one of claims 1 to 4,
In the panel, all electrodes are formed on the substrate structure on the display surface side through the discharge space, and end portions of the electrodes are drawn out on the same plane,
An end of the electrode of the panel and the drive circuit board are connected in a planar manner by a connecting portion. The plasma display panel module according to claim 3, wherein
The plasma display panel module, wherein the first chassis and the second chassis or the heat dissipation substrate are physically connected via a low thermal conductivity material. The plasma display panel module according to claim 3, wherein
The plasma display panel module, wherein the first chassis and the second chassis or the heat dissipation board are not physically connected but are directly fixed to a casing of the plasma display device. A flat plate-shaped plasma display panel, a circuit board including a driving circuit board for driving an electrode group of the panel, and a housing for housing them,
The drive circuit board is one in which a heat dissipation system is separated from the panel arranged in parallel in the region outside the panel in the same plane as the panel,
The back side of the panel is attached to the housing via the first chassis that fixes the panel or directly,
A second chassis or heat dissipation board on which the drive circuit board is mounted is provided in a region outside the panel, and the drive circuit board is mounted on the front surface or the back surface of the second chassis or heat dissipation board,
The circuit board is not disposed on the area on the back side of the panel and the surface of the second chassis or the heat dissipation board opposite to the drive circuit board,
The inside of the housing has a structure including a partition that separates a space between the panel side and the drive circuit board side. The plasma display device according to claim 15, wherein
A plasma display device, wherein a cooling port is provided in at least a part of a front surface side, an upper and lower surface side, or a side surface side of the drive circuit board in the housing. The plasma display device according to claim 15, wherein
A plasma display device, wherein a cooling fan device is provided on at least a part of a front surface side, an upper and lower surface side, or a side surface side of the drive circuit board in the housing. In the plasma display panel module according to any one of claims 1 to 4,
A plasma display panel module, wherein the chassis or a heat dissipation board provided in place of the chassis uses tempered glass, a resin plate, or a molded product thereof. The plasma display device according to claim 15, wherein
A plasma display device, wherein the chassis or a heat dissipation substrate provided in place of the chassis uses tempered glass, a resin plate, or a molded product thereof. The plasma display device according to claim 15, wherein
The plasma display apparatus, wherein the chassis or a heat dissipation board provided in place of the chassis has transparency or semi-transparency and displays an image therethrough. The plasma display panel module according to claim 4, wherein
A plasma display panel module, wherein a metal mesh or a metal foil is provided on the back surface of the panel.

Images