JP2009162649A - Taping ic correspondent automatic x-ray inspection system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a taping IC correspondent automatic X-ray inspection system capable of continuously carrying out X-ray inspections of wrapped IC products in such the state that each IC product is wrapped by a tapelike wrapper, when carrying out an inspection of the IC product wrapped by the tapelike wrapper. <P>SOLUTION: The system includes: an inspection body which includes an X-ray irradiation section, an inspection section and photographing section; and an image processing device for determining whether an object to be inspected is good or bad. The inspection section includes a set reel in which taping ICs are reeled, and a reel for reeling them and an X-ray exposure part, wherein the taping ICs are fed forth automatically by using an automatic pitch feed means, and ICs in their automatic pitch-feed state are sequentially irradiated with X rays and sequentially photographed, and then a plurality of inspection images are inspected by comparing with a previously set reference image by using an inspecting/comparing means, and defect-marking information is output for an unacceptable product by using a marking means. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to an X-ray inspection system for inspecting whether a semiconductor such as an IC is a non-defective product or a defective product. In particular, a taping IC product wound on a reel is attached to a tape in a wound taping state. The present invention relates to an automatic X-ray inspection system corresponding to a taping IC, which enables X-ray inspection of an IC.

In recent years, as electronic parts such as semiconductors, resistors, and capacitors have been promoted into chips, efficiency can be improved in relation to mass production of these electronic parts, automatic insertion machines for their packages, and automatic pick-up machines when used. A technology for taping and packaging the chips has been increasingly demanded.

Thus, in this type of small electronic component taping package of chips, an embossed tape (carrier tape) having a recess for storing the electronic component, and the electronic component is stored in the recess of the embossed tape. There are some which are composed of a sealing tape (cover tape) for sealing the recess.
The edges of the embossed tape are provided with feed holes for convenient loading and unloading of these electronic components, and these taping packages are wound on a taping reel. In recent years, it has become common to be stored and transported.

Here, in order to automatically produce various electronic devices, it has been proposed to automatically mount chip-shaped electronic components on a circuit board. In order to facilitate handling of electronic components in the automatic mounting process of chip-shaped electronic components on this circuit board, individual chip-shaped electronic components are packaged in a tape-shaped package (conveyance body). Therefore, the taping package is used.
Then, automatic mounting is performed in which chip-shaped electronic components sequentially sent out in the form of a taping package are automatically mounted on a predetermined circuit board.

  Such a taping package used for automatic mounting of chip-shaped electronic components is, for example, a plastic carrier tape or chip having recesses for loading chip-shaped electronic components at regular intervals in the longitudinal direction of the tape. Perforations for loading electronic electronic parts are formed at regular intervals, for example, a bottom tape in which paper and a thermoplastic resin film are combined is heat-sealed to form a predetermined chip on a carrier tape paper sealed on one side of the perforations. In general, it is formed by coating a surface-shaped electronic component and then covering the upper portion with a surface film.

By the way, in the manufacture of semiconductor integrated circuits, nondestructive inspection of solder balls, pins, bonding wires, etc. is regarded as an extremely important matter in terms of quality control. However, it is said that visual inspection using images is already approaching its limit due to the recent improvement in integration. In recent years, therefore, attempts have been made to automate inspections using image processing technology.
For example, workpiece alignment, socket pin pitch and length measurement, BGA package solder ball inspection, etc. are performed by an automatic X-ray inspection system that applies image processing technology, a type of inspection software.

  For example, the bonding wire in the IC is a metal wire connecting the terminals of the chip and the lead frame, and may be wired three-dimensionally in the semiconductor package, for example. Therefore, the flow, deformation, and cutting of the wire mainly occur at the time of resin sealing, and it is the current situation that it has become one of the items that should be subjected to quality control as the wire becomes thinner.

However, although an X-ray inspection system that applies image processing technology for IC products already exists, an X-ray inspection system that applies image processing technology, which is inspection software for IC products packaged in a tape-like package, It does not exist, but usually, unwrapped tape is unwrapped, then IC chips packed in the tape are arranged on an inspection tray and inspected with an X-ray inspection system for normal IC products. .
JP 2003-222599 A

Thus, the present invention was devised to solve the above-described conventional problems, and when inspecting an IC product packaged in a tape-shaped package, the wound tape is unwound and then wrapped in the tape. Taping IC compatible automatic that enables X-ray inspection system for IC products that are continuously packaged in a tape-like package without arranging X-ray inspection chips on the inspection tray and performing X-ray inspection It is intended to provide an X-ray inspection system

The automatic X-ray inspection system for taping IC according to the present invention is as follows.
An X-ray irradiation unit that irradiates an X-ray toward the object to be inspected, an inspection unit that is inspected by irradiating the object to be inspected with X-rays, and an image of the object to be inspected in the inspection unit irradiated with the X-ray An inspection device main body comprising a photographing unit with a digital camera for photographing;
An image processing apparatus that captures image information of an object to be inspected imaged by the imaging unit and compares the reference image acquired in advance with the quality of the object to be inspected.
Have
The inspection section includes a set reel on which a taping IC as an object to be inspected is wound, a winding reel for the taping IC, and an X-ray irradiated section provided between the set reel and the winding reel. Having
The taping IC is automatically sent out by an automatic pitch feed means for setting the interval length between a plurality of ICs attached to the taping IC and the number of ICs to be inspected, and measuring the automatic pitch feed of the taping IC based on the set values. Done,
The automatic pitch-fed IC is irradiated with X-rays sequentially at the X-ray irradiated part, and the irradiated images are sequentially picked up by the photographing part and set in advance with a plurality of inspection images photographed sequentially. The reference image is compared and inspected by the inspection and comparison means,
Defect marking information is output by the marking means for products that fail inspection.
It is characterized by this.

If it is an automatic X-ray inspection system for taping ICs according to the present invention,
When inspecting an IC product packaged in a tape-shaped package, the wound tape is unwound, and then the IC chips packaged in the tape are arranged on an inspection tray, and the X-ray inspection is performed without performing the X-ray inspection. It is possible to perform an X-ray inspection of an IC product that is continuously packaged while being packaged.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
As shown in FIG. 1, an automatic X-ray inspection system corresponding to a taping IC according to the present invention includes an inspection apparatus main body 1 for X-ray inspection of an inspection object, and inspection image information of the inspection object, and a reference image acquired in advance. Compared with the image processing apparatus 24, the image processing apparatus 24 that determines the quality of the object to be inspected and the computer 16 that controls the operations of the inspection apparatus main body 1 and the image processing apparatus 24 are provided.

The configuration of the inspection apparatus main body 1 will be described with reference to FIGS. 4 and 5. First, the X-ray irradiation unit 2 that is installed at a lower position and emits X-rays upward is installed at an intermediate position. An inspection unit 3 that inspects an object to be inspected by irradiating X-rays from below, and an imaging unit by a digital camera that is installed at an upper position and shoots an image of the object to be inspected in X-rays irradiated 4.

Here, the configuration of the inspection unit 3 will be described with reference to FIGS. 4 and 5. First, the inspection unit 3 has a set reel 6 on which a taping IC 5 is wound on the left side in FIGS. 4 and 5. On the right side, there is provided a take-up reel 7 for running the taping IC 5 taken up on the set reel 6 and taking it up again.
Between the set reel 6 and the take-up reel 7, a pair of drive sprockets 8 and 8 are provided for feeding the taping IC 5 to the take-up reel side. As is understood from FIGS. 4 and 5, the pair of drive sprockets 8, 8 are arranged at a predetermined interval at a substantially central portion of the inspection unit 3. The predetermined interval is an X-ray irradiated portion 19 through which X-rays from the X-ray irradiation portion 2 described later are transmitted.

Reference numerals 9 and 10 denote a movable tension roller and a fixed tension roller provided to give a predetermined tension to the taping IC 5 that moves in the tape longitudinal direction between the set reel 6 and the take-up reel 7.
A tension control unit 11 is connected to the movable tension rollers 9 and 9 so as to detect the tape tension of the set taping IC 5 and move and control the movable rollers 9 and 9 to give an optimum tension. Has been.

Here, a plurality of ICs 12 are packaged and attached to the taping IC 5 at a predetermined interval in the longitudinal direction of the wound tape. In the apparatus 1 according to the present invention, the packaged IC 12 is packaged. The inspection unit 3 is sequentially irradiated with X-rays as it is and attached to the tape, so that product inspection can be performed continuously.

The use state of the taping IC-compatible automatic X-ray inspection apparatus 1 according to the present invention will now be described with reference to the flowchart of FIG. 8 and the like. First, the set reel 6 around which the taping IC 5 is wound is shown in FIGS. Then, it is set on the left reel holding portion 13. Next, the take-up reel 7 is set on the right reel holding portion 14, and the tip of the taping IC 5 is taken up on the take-up reel 7.

In the inspection unit 3, the taping IC 5 is arranged between the movable tension rollers 9, 9 and the fixed tension rollers 10, 10 as shown in FIGS. It shall be configured.
The diameter of the set reel 6 around which the taping IC 5 is wound varies depending on the type of the taping IC 5. There are products of a type with a large diameter and types with a relatively small diameter, and various types exist depending on the type of tape IC product. Thus, the apparatus 1 of the present invention is configured such that it can be set and inspected even with set reels 6 of various diameters that are actually commercially available.

However, the take-up reel 7 must have the same diameter as that of the set reel 6 diameter.
Next, in order to place the IC 12 packaged on the tape on the appropriate X-ray irradiated portion 19, it is moved in the longitudinal direction of the tape by, for example, a manual operation, moved to a predetermined appropriate inspection site, and set.

After that, the interval (pitch length) between the plurality of ICs 12 packaged on the tape is measured, the number of the plurality of ICs 12 to be measured is counted, and those numerical values are operated from the operation panel, so that the computer 16 has a keyboard or the like. This is input from the input unit 21. Then, the automatic pitch feeding means 29 provided in the control unit 20 on the computer 16 side controls the tape driving from the numerical values and moves the tape with the inputted pitch length, and the automatic inspection for the inputted number of pieces. Will be performed.

From the above state, the operation panel 25 is operated to execute the automatic inspection process. Then, in the control state described above, for example, a drive motor provided on the take-up reel 7 side is driven, and automatic inspection of the taping IC 5 is started.
When the IC 12 packaged on the tape moves to the appropriate X-ray irradiated part 8, X-rays are transmitted from below the X-ray irradiation part 2, and the transmitted image is taken by the photographing part 4 which is a digital camera. Is done.

Here, as can be understood from FIG. 6, a display unit 28 composed of, for example, a liquid crystal display or the like is attached to the inspection apparatus body 1, and the display unit 28 is a good product for the IC 12 in advance. A reference image 26 is recorded, stored and displayed in advance.
Then, the reference image 26 and a plurality of inspection images 27 photographed by the digital camera 4 are sequentially compared, and a predetermined comparison is performed by an inspection comparing means 30 configured by an image processing device 24 and a control unit 20 in the computer 16 described later. Image processing determination is performed, and it is configured to be able to instantaneously determine whether the product is normal or defective. The state of the determination can be confirmed on the display unit 28 in real time.

By the way, although there are various methods for the determination, an example is an inspection method for comparatively determining the bonding wire position of the IC 12 or the interval between the bonding wires.
The image by the digital camera 4 is composed of a large number of pixels (pixels). For example, by measuring the number of pixels proportional to the bonding wire position of the IC 12 or the interval between the bonding wires, for example, the position comparison or interval of the bonding wires is performed. Comparisons can be made easily. In the apparatus 1 according to the present invention, for example, about eight inspection locations are set on the reference image 26, and comparison inspection with the inspection image can be performed by the inspection comparison means 30 in the computer 16.

Then, it is possible to set and store inspection images 27 of more than 1,000 product types (IC12) in a storage unit constituted by a hard disk or the like in the computer 16 of the inspection apparatus main body 1, and store these data. It can also be saved on a CF card.
In addition, as described above, the inspection apparatus body 1 can inspect the tape IC 5 with respect to the set reel 6 having a wide variety of reel diameters, and also can determine the pitch size and the number of inspection of the plurality of ICs 12 packaged at intervals. It is configured so that it can be set in advance, and upon receiving such setting, automatic pitch feeding means 29 configured by the control unit 20 in the computer 16 can execute automatic reel feeding and automatic inspection.

  Here, when it is determined by the image determination that the inspection image is a defective product, this is automatically marked on the tape by the marking unit 17 provided in the vicinity, and the IC 12 is recognized as a defective product. Will be. A series of operations of the marking unit 17 is controlled by the marking means 31 in the computer 16 and is configured to be continuously performed in conjunction with the automatic inspection.

By the way, the inspection apparatus main body 1 is not only capable of inspecting only the taping IC 5, but is also an apparatus capable of automatically inspecting a plurality of ICs 12 installed on the tray 18 as shown in the flow of FIG. .
That is, as can be understood from FIG. 5, a tray 18 is provided in front of the inspection unit 3 of the apparatus 1, and the tray 18 can be moved vertically and horizontally, that is, in the X-axis direction and the Y-axis direction. Has been.

Therefore, the tray 18 is moved in the X-axis direction and the Y-axis direction by a preset moving distance, and a plurality of ICs 12 installed on the tray 18 can be automatically and continuously inspected.
That is, the vertical and horizontal pitch lengths of a plurality of ICs 12... Installed on the tray 18 are measured, the number arranged in the vertical and horizontal directions is counted, and these numerical values are operated from the operation panel 25 to input the input unit of the computer 16. 21 is input. Then, the control unit 20 on the computer 16 side controls the driving of the tray 18 in the vertical and horizontal directions, that is, in the X-axis direction and the Y-axis direction, based on these numerical values, and in the vertical and horizontal directions, that is, in the X-axis direction and the input pitch length. While moving in the Y-axis direction, the inspection for the number of input is performed.

Here, the schematic configuration of the apparatus 1 according to the present invention is configured as shown in FIG.
Reference numeral 20 denotes a control unit of the computer 16. Reference numeral 21 denotes an input unit such as an operation switch. Accordingly, the control unit 20 performs various control operations by the input operation of the input unit 21.
For example, reference numeral 22 denotes an adjustment mechanism for the vertical, horizontal, and vertical directions of the tray 18 described above, and the adjustment mechanism 22 is controlled by the control unit 20.

Reference numeral 23 denotes a reel motor, and rotation control of the reel motor 23, that is, control of the automatic feed pitch and the number of inspections is performed by an automatic pitch feed means 29 constituted by the control unit 20.

Reference numeral 17 denotes a marking portion for marking a corresponding tape portion when it is recognized as a defective product after inspection, and the operation of the marking portion 17 is also controlled by the marking means 31 configured by the control portion 20.
Next, reference numeral 24 denotes an image processing device, and the image processing device 24 sequentially compares the inspection images 27 sequentially taken from the photographing unit 4 by the digital camera with the reference image 28 to control whether or not it is a normal product. It is inspected by the inspection / comparing means 30 configured by the unit 20.

It is explanatory drawing (the 1) explaining schematic structure of the automatic X-ray inspection system corresponding to taping IC by this invention. It is explanatory drawing (the 2) explaining schematic structure of the automatic X-ray inspection system corresponding to taping IC by this invention. It is explanatory drawing (the 3) explaining schematic structure of the automatic X-ray inspection system corresponding to taping IC by this invention. It is explanatory drawing (the 1) explaining the structure of the inspection apparatus main body in the automatic X-ray inspection system corresponding to taping IC by this invention. It is explanatory drawing (the 2) explaining the structure of the test | inspection apparatus main body in the taping IC corresponding | compatible automatic X-ray inspection system by this invention. It is explanatory drawing (the 3) explaining schematic structure of the automatic X-ray inspection system corresponding to taping IC by this invention. It is explanatory drawing explaining the display part of the inspection apparatus main body in the automatic X-ray inspection system corresponding to taping IC by this invention. It is a flowchart (the 1) explaining operation | movement of the taping IC corresponding | compatible automatic X-ray inspection system by this invention by this invention. It is a flowchart (the 2) explaining operation | movement of the taping IC corresponding | compatible automatic X-ray inspection system by this invention. It is a block diagram explaining the structure of the automatic X-ray inspection apparatus corresponding to taping IC by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection apparatus main body 2 X-ray irradiation part 3 Inspection part 4 Imaging part 5 Taping IC
6 set reel 7 take-up reel 8 drive sprocket 9 movable tension roller 10 fixed tension roller 11 tension control unit 12 IC
13 Left reel holding part 14 Right reel holding part 16 Computer 17 Marking part 18 Tray 19 X-ray irradiated part 20 Control box 21 Input part 22 Adjustment mechanism 23 Motor for reel 24 Image processing device 25 Operation panel 26 Reference image 27 Inspection image 28 Display unit 29 Automatic pitch feed means 30 Inspection comparison means 31 Marking means

Claims (1)

An X-ray irradiation unit that irradiates an X-ray toward the object to be inspected, an inspection unit that is inspected by irradiating the object to be inspected with X-rays, and an image of the object to be inspected in the inspection unit irradiated with the X-ray An inspection device main body comprising a photographing unit with a digital camera for photographing;
An image processing apparatus that captures image information of an object to be inspected imaged by the imaging unit and compares the reference image acquired in advance with the quality of the object to be inspected.
Have
The inspection section includes a set reel on which a taping IC as an object to be inspected is wound, a winding reel for the taping IC, and an X-ray irradiated section provided between the set reel and the winding reel. Having
The taping IC is automatically sent out by an automatic pitch feed means for setting the interval length between a plurality of ICs attached to the taping IC and the number of ICs to be inspected, and measuring the automatic pitch feed of the taping IC based on the set values. Done,
The automatic pitch-fed IC is irradiated with X-rays sequentially at the X-ray irradiated part, and the irradiated images are sequentially picked up by the photographing part and set in advance with a plurality of inspection images photographed sequentially. The reference image is compared and inspected by the inspection and comparison means,
Defect marking information is output by the marking means for products that fail inspection.
This is an automatic X-ray inspection system for taping ICs.

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