JP2009158651A - Electronic part mounting equipment, and emergency stop method thereof - Google Patents

Electronic part mounting equipment, and emergency stop method thereof Download PDF

Info

Publication number
JP2009158651A
JP2009158651A JP2007333765A JP2007333765A JP2009158651A JP 2009158651 A JP2009158651 A JP 2009158651A JP 2007333765 A JP2007333765 A JP 2007333765A JP 2007333765 A JP2007333765 A JP 2007333765A JP 2009158651 A JP2009158651 A JP 2009158651A
Authority
JP
Japan
Prior art keywords
electronic component
component mounting
substrate
unit
emergency stop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007333765A
Other languages
Japanese (ja)
Other versions
JP4853473B2 (en
Inventor
Yuji Ogata
雄二 緒方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2007333765A priority Critical patent/JP4853473B2/en
Publication of JP2009158651A publication Critical patent/JP2009158651A/en
Application granted granted Critical
Publication of JP4853473B2 publication Critical patent/JP4853473B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic part mounting equipment which ensures safety of an operator by surely stopping the equipment when it should be stopped emergently, in an electronic part mounting line constituted by coupling a plurality of sets of electronic part mounting equipment in series, and to provide an emergency stop method of the electronic part mounting equipment. <P>SOLUTION: Even if the operator having accessed in order to cope with an abnormal operation occurring in equipment M* operates an emergency stop switch 4b in an operating portion 4(L) of adjoining equipment M(L) by mistake on an electronic part mounting line 1 constituted by coupling a plurality of sets of equipment M, a control section of the equipment M(L) delivers an emergency stop signal to the equipment M(L) to which an operation input is conducted and to the equipment M* adjoining the equipment M(L) through an operating section 4(L), thus stopping operation of the equipment M*. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、電子部品を基板に実装して実装基板を製造する電子部品実装ラインを構成する電子部品実装用装置および電子部品実装用装置の非常停止方法に関するものである。   The present invention relates to an electronic component mounting apparatus that constitutes an electronic component mounting line that manufactures a mounting board by mounting electronic components on a substrate, and an emergency stop method for the electronic component mounting apparatus.

電子部品を基板に実装して実装基板を製造する電子部品実装ラインはスクリーン印刷装置、電子部品搭載装置、検査装置などの複数の電子部品実装用装置を連結して一連の生産ラインとすることにより構成される。これらの電子部品実装用装置には、オペレータの作業上の安全を確保するための手段としての非常停止スイッチが設けられており、オペレータが動作異常を察知した場合など何らかの理由で非常停止スイッチを操作することにより、当該装置は即時に全ての動作を停止し、これによりオペレータへの危険を排除するようにしている(特許文献1参照)。この特許文献1に示す例においては、装置側面の中央部に配置された操作盤の近傍に、非常停止スイッチを操作方向を上向きにして配置するようにしている。
特開2002−111295号公報
An electronic component mounting line that manufactures a mounting board by mounting electronic components on a substrate is a series of production lines by connecting multiple electronic component mounting devices such as screen printing devices, electronic component mounting devices, and inspection devices. Composed. These electronic component mounting devices are equipped with an emergency stop switch as a means to ensure the safety of the operator's work. The operator operates the emergency stop switch for some reason, such as when the operator detects an abnormal operation. By doing so, the apparatus immediately stops all operations, thereby eliminating the danger to the operator (see Patent Document 1). In the example shown in Patent Document 1, an emergency stop switch is arranged in the vicinity of the operation panel arranged at the center of the side surface of the apparatus with the operation direction facing upward.
JP 2002-111295 A

近年電子機器の製造形態においては多品種少量生産が一般となり、設備構成においては面積生産性とフレキシビリティの向上を目的として、小型設備を多数連結して電子部品実装ラインを構成することにより、ライン毎の対応力を向上させる設備構成が増加している。しかしながら、上述のような小サイズ・薄型の単位装置を複数連結した構成の設備において、オペレータが各単位装置の操作を個別に実行する際には、同一構成の装置が多数連続して配列されていることに起因して、次のような問題が生じてきている。   In recent years, many kinds of small-quantity production has become common in the manufacturing form of electronic equipment, and in the equipment configuration, for the purpose of improving area productivity and flexibility, many small equipments are connected to form an electronic component mounting line. The equipment configuration that improves the ability to respond to each is increasing. However, in the equipment having a configuration in which a plurality of small-sized and thin unit devices are connected as described above, when an operator individually operates each unit device, a large number of devices having the same configuration are arranged in succession. As a result, the following problems have arisen.

すなわち、オペレータが各装置を個別に操作する際には、操作対象となる装置を特定しさらに当該装置の対応した操作パネルを特定した上で必要な操作入力を行う必要がある。ところが同一構成の装置が前述のように短い連結ピッチで密に配列されている場合には、表示パネルや操作パネルが設けられた操作部も同一ピッチで等間隔に配列されていることから、操作対象となる単位装置にアクセスしたオペレータが、本来操作すべき操作部と隣接装置に付属する操作部とを錯誤によって取り違える事態がしばしば生じる。このような錯誤は、操作部が装置の中心位置から一方向側へ偏った位置に配置され、その操作部に隣接して他装置が位置している構成の実装ラインにおいて特に生じやすい。そしてこのような錯誤が生じると、本来非常停止すべき装置が停止せずに、オペレータの安全が確保されない結果となる。   That is, when an operator operates each device individually, it is necessary to specify a device to be operated and specify an operation panel corresponding to the device, and then perform necessary operation input. However, when the devices having the same configuration are densely arranged with a short connection pitch as described above, the operation units provided with the display panel and the operation panel are also arranged at equal intervals at the same pitch. There often occurs a situation where an operator who has accessed a target unit device mistakes an operation unit to be originally operated and an operation unit attached to an adjacent device by mistake. Such an error is particularly likely to occur in a mounting line in which the operation unit is arranged at a position deviated from the center position of the device in one direction, and another device is located adjacent to the operation unit. When such an error occurs, the device that should originally stop emergency does not stop, and the safety of the operator is not ensured.

そこで本発明は、複数の電子部品実装用装置を直列に連結して構成された電子部品実装ラインにおいて、本来非常停止すべき装置を確実に停止させてオペレータの安全を確保することができる電子部品実装用装置および電子部品実装用装置の非常停止方法を提供することを目的とする。   Accordingly, the present invention is an electronic component mounting line configured by connecting a plurality of electronic component mounting devices in series, and can ensure the safety of the operator by reliably stopping the device that should be urgently stopped. It is an object of the present invention to provide an emergency stop method for a mounting apparatus and an electronic component mounting apparatus.

本発明の電子部品実装用装置は、複数台を連結することにより電子部品を基板に実装して実装基板を製造する電子部品実装ラインを構成する電子部品実装用装置であって、前記電子部品実装ラインの上流側から下流側に配設された搬送路を構成し前記基板を搬送する基板搬送部と、前記基板搬送部によって搬送された基板を対象として電子部品実装用の作業を実行する作業動作部と、前記作業動作部を制御する制御部と、基板搬送方向に沿った
装置側面において当該装置の基板搬送方向についての中心位置から一方向側へ偏った位置に配置され、オペレータが前記制御部への操作入力を行う操作部と、前記操作部に設けられ当該装置の前記基板搬送部および前記作業動作部による動作を即時に停止させるべくオペレータが操作入力を行う非常停止スイッチと、前記非常停止スイッチの操作入力があったならば、前記操作入力があった当該電子部品実装用装置とともに前記操作部を夾んで前記一方向側に隣接する電子部品実装用装置を非常停止させるための制御処理を行う装置停止制御処理部とを備えた。
An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that constitutes an electronic component mounting line for manufacturing a mounting substrate by mounting electronic components on a substrate by connecting a plurality of units. A substrate transport unit that transports the substrate by configuring a transport path disposed from the upstream side to the downstream side of the line, and a work operation for performing an electronic component mounting operation on the substrate transported by the substrate transport unit And a control unit that controls the work operation unit, and a side surface of the apparatus along the substrate transport direction is disposed at a position deviated from a center position in the substrate transport direction of the apparatus toward one direction, and the operator An operation unit for performing an operation input to the device, and an operator performing an operation input to immediately stop the operation of the substrate transport unit and the work operation unit of the apparatus provided in the operation unit If there is an operation input of the stop switch and the emergency stop switch, the electronic component mounting apparatus adjacent to the one-direction side with the operation unit held together with the electronic component mounting apparatus with the operation input And an apparatus stop control processing unit that performs a control process for stopping.

本発明の電子部品実装用装置の非常停止方法は、複数の電子部品実装用装置を連結して構成され電子部品を基板に実装して実装基板を製造する電子部品実装ラインにおいて前記電子部品実装用装置を非常停止させる電子部品実装用装置の非常停止方法であって、前記電子部品実装用装置は、前記電子部品実装ラインの上流側から下流側に配設された搬送路を構成し前記基板を搬送する基板搬送部と、前記基板搬送部によって搬送された基板を対象として電子部品実装用の作業を実行する作業動作部と、前記作業動作部を制御する制御部と、基板搬送方向に沿った装置側面において当該装置の基板搬送方向についての中心位置から一方向側へ偏った位置に配置され、オペレータが前記制御部への操作入力を行う操作部と、前記操作部に設けられ当該装置の前記基板搬送部および前記作業動作部による動作を即時に停止させるべくオペレータが操作入力を行う非常停止スイッチとを備え、前記非常停止スイッチの操作入力があったならば、前記操作入力があった当該電子部品実装用装置とともに前記操作部を夾んで前記一方向側に隣接する電子部品実装用装置を非常停止させるための制御処理を行う。   An emergency stop method for an electronic component mounting apparatus according to the present invention is an electronic component mounting line in an electronic component mounting line configured by connecting a plurality of electronic component mounting apparatuses and mounting the electronic component on a substrate to manufacture a mounting substrate. An emergency stop method for an electronic component mounting apparatus for emergency stopping the apparatus, wherein the electronic component mounting apparatus constitutes a transport path disposed from the upstream side to the downstream side of the electronic component mounting line, and A substrate transport unit that transports, a work operation unit that performs an operation for mounting electronic components on the substrate transported by the substrate transport unit, a control unit that controls the work operation unit, and a substrate transport direction Arranged on the side of the apparatus at a position deviated from the center position in the substrate transport direction of the apparatus toward one direction, and an operator inputs an operation input to the control unit, and is provided in the operation unit An emergency stop switch for an operator to input an operation to immediately stop the operations of the substrate transfer unit and the work operation unit of the apparatus. If there is an operation input of the emergency stop switch, the operation input is The control processing for carrying out the emergency stop of the electronic component mounting apparatus adjacent to the one-direction side with the operation unit held together with the electronic component mounting apparatus.

本発明によれば、操作部に設けられた非常停止スイッチの操作入力があったならば、操作入力があった当該電子部品実装用装置とともに操作部を夾んで隣接する電子部品実装用装置を非常停止させるための制御処理を行うことにより、オペレータが操作部を取り違う錯誤が生じた場合にあっても、本来非常停止すべき装置を確実に停止させてオペレータの安全を確保することができる。   According to the present invention, if there is an operation input of the emergency stop switch provided in the operation unit, the electronic component mounting device adjacent to the operation unit together with the electronic component mounting device with the operation input is By performing the control process for stopping, even if the operator makes a mistake in changing the operation unit, it is possible to surely stop the device that should originally stop and ensure the safety of the operator.

次に本発明の実施の形態を図面を参照して説明する。図1は本発明の一実施の形態の電子部品実装ラインの斜視図、図2は本発明の一実施の形態の電子部品実装ラインを構成する電子部品搭載装置の平面図、図3は本発明の一実施の形態の電子部品実装ラインを構成する電子部品搭載装置の斜視図、図4は本発明の一実施の形態の電子部品実装ラインの制御系の構成を示すブロック図、図5は本発明の一実施の形態の電子部品搭載装置の非常停止方法を示す説明図である。   Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting line according to an embodiment of the present invention, FIG. 2 is a plan view of an electronic component mounting apparatus constituting the electronic component mounting line according to an embodiment of the present invention, and FIG. FIG. 4 is a block diagram showing the configuration of a control system for an electronic component mounting line according to an embodiment of the present invention, and FIG. It is explanatory drawing which shows the emergency stop method of the electronic component mounting apparatus of one embodiment of invention.

まず図1を参照して、複数台の電子部品実装用装置である電子部品搭載装置を連結して構成される電子部品実装ライン1について説明する。電子部品実装ライン1は、複数の電子部品搭載装置(以下、単に「装置」と略称する。)M1,M2,M3,M4,M5,M6を直列に連結して構成されており、基板に電子部品を実装して実装基板を製造する機能を有するものである。電子部品実装ライン1には、上流側(矢印a)から実装対象の基板が供給され、最上流に位置する装置M1に搬入された基板は、電子部品実装ライン1内をX方向(基板搬送方向)に順次搬送される。搬入された基板は、各装置による部品搭載作業の対象となり、部品搭載作業後の基板はさらに下流側(矢印b)に搬出される。   First, an electronic component mounting line 1 configured by connecting a plurality of electronic component mounting apparatuses, which are electronic component mounting apparatuses, will be described with reference to FIG. The electronic component mounting line 1 is configured by connecting a plurality of electronic component mounting devices (hereinafter simply referred to as “devices”) M1, M2, M3, M4, M5, and M6 in series, and an electronic component is mounted on the substrate. It has a function of mounting a component and manufacturing a mounting board. A board to be mounted is supplied to the electronic component mounting line 1 from the upstream side (arrow a), and the board carried into the apparatus M1 located at the uppermost stream passes through the electronic component mounting line 1 in the X direction (board transport direction). ) Sequentially. The board that has been loaded becomes a target of component mounting work by each device, and the board after the component mounting work is carried further downstream (arrow b).

次に、装置M1〜装置M6の構造について、図2、図3を参照して説明する。図2において、基台10上にはX方向に基板搬送部8が配設されている。基板搬送部8は電子部品実装ライン1の上流側から下流側に配設された搬送路を構成し、上流側装置から搬入され当該装置による搭載作業動作の対象となる基板9は、基板搬送部8によって当該装置内に
おいて上流側から下流側へ搬送され、部品搭載作業位置に位置決め保持される。
Next, the structures of the devices M1 to M6 will be described with reference to FIGS. In FIG. 2, a substrate transport unit 8 is disposed on the base 10 in the X direction. The substrate transport unit 8 constitutes a transport path disposed from the upstream side to the downstream side of the electronic component mounting line 1, and the substrate 9 that is loaded from the upstream device and is the target of the mounting work operation by the device is the substrate transport unit. 8 is transported from the upstream side to the downstream side in the apparatus and positioned and held at the component mounting work position.

基板搬送部8の両側には部品供給部11が設けられており、部品供給部11には複数のテープフィーダ12が装着されている。基台10のX方向の一端部にはリニア駆動機構を備えたY軸移動テーブル13がY方向に水平に配設されており、Y軸移動テーブル13には同様にリニア駆動機構を備えたX軸移動テーブル14が結合されている。それぞれのX軸移動テーブル14には、搭載ヘッド15がX方向に移動自在に装着されている。   Component supply units 11 are provided on both sides of the substrate transport unit 8, and a plurality of tape feeders 12 are mounted on the component supply unit 11. A Y-axis moving table 13 provided with a linear drive mechanism is disposed horizontally in the Y direction at one end of the base 10 in the X direction, and the Y-axis moving table 13 is similarly provided with an X having a linear drive mechanism. An axis moving table 14 is coupled. A mounting head 15 is mounted on each X-axis moving table 14 so as to be movable in the X direction.

搭載ヘッド15は複数(ここでは8個)の単位搭載ヘッド16を備えた多連型ヘッドであり、それぞれの単位搭載ヘッド16は、下端部に装着された吸着ノズル(図示省略)によって電子部品を吸着して保持する。Y軸移動テーブル13、X軸移動テーブル14はヘッド移動機構を構成し、このヘッド移動機構を駆動することにより、搭載ヘッド15はX方向、Y方向に移動し、これにより、各単位搭載ヘッド16は部品供給部11のテープフィーダ12から電子部品を取り出して、基板搬送部8に位置決めされた基板9に実装する。   The mounting head 15 is a multiple-type head including a plurality of (8 in this case) unit mounting heads 16, and each unit mounting head 16 has an electronic component mounted by a suction nozzle (not shown) mounted at the lower end. Adsorb and hold. The Y-axis moving table 13 and the X-axis moving table 14 constitute a head moving mechanism, and by driving the head moving mechanism, the mounting head 15 moves in the X direction and the Y direction. Takes out an electronic component from the tape feeder 12 of the component supply unit 11 and mounts it on the substrate 9 positioned in the substrate transfer unit 8.

したがって、Y軸移動テーブル13、X軸移動テーブル14および搭載ヘッド15は、電子部品を保持した搭載ヘッド15をヘッド移動機構によって移動させることにより電子部品を基板9に実装する実装部20(すなわち電子部品実装用装置としての各装置M1〜M6において、基板搬送部8によって搬送された基板9を対象として電子部品実装用の作業を実行する作業動作部)となっている。部品供給部11と基板搬送部8との間には部品認識カメラ18が配設されており、部品供給部11から電子部品を取り出した搭載ヘッド15が部品認識カメラ18の上方を移動する際に、部品認識カメラ18は搭載ヘッド15に保持された状態の電子部品を撮像する。   Accordingly, the Y-axis moving table 13, the X-axis moving table 14, and the mounting head 15 are mounted on the substrate 9 by mounting the electronic component on the substrate 9 by moving the mounting head 15 holding the electronic component by the head moving mechanism (that is, electronic In each of the devices M1 to M6 as the component mounting device, a work operation unit that performs an electronic component mounting operation on the substrate 9 transported by the substrate transport unit 8 is provided. A component recognition camera 18 is disposed between the component supply unit 11 and the board transport unit 8, and when the mounting head 15 that has taken out an electronic component from the component supply unit 11 moves above the component recognition camera 18. The component recognition camera 18 images the electronic component held by the mounting head 15.

搭載ヘッド15には、X軸移動テーブル14の下面側に位置して一体的に移動する基板認識カメラ17が装着されている。搭載ヘッド15が移動することにより、基板認識カメラ17は基板搬送部3に位置決めされた基板9の上方に移動し、基板9を撮像して認識する。搭載ヘッド15による基板9への電子部品の搭載動作においては、部品認識カメラ18による電子部品の認識結果と、基板認識カメラ17による基板認識結果とを加味して搭載位置補正が行われる。   Mounted on the mounting head 15 is a substrate recognition camera 17 that is located on the lower surface side of the X-axis moving table 14 and moves integrally therewith. As the mounting head 15 moves, the substrate recognition camera 17 moves above the substrate 9 positioned in the substrate transport unit 3 and images and recognizes the substrate 9. In the mounting operation of the electronic component on the board 9 by the mounting head 15, the mounting position correction is performed in consideration of the recognition result of the electronic component by the component recognition camera 18 and the board recognition result by the board recognition camera 17.

図3(a)に示すように、各装置の上面および4方の側面はカバー部材2によって閉囲されている。各装置において基板搬送方向(X方向)の上流側および下流側の各側面を覆うカバー部材2には、基板搬送部8の上流側および下流側の端部に位置して、それぞれ基板9が通過するための開口部3が設けられている。また装置天井面に設けられたカバー部材2の上側には、報知用のシグナルタワー6が配置されている。ここではシグナルタワー6は起倒式構造となっており、自己の属する装置側に倒れた姿勢で装着使用される。これにより、同一構成の装置を短い連結ピッチで密に配列している場合においても、シグナルタワー6の作動時にオペレータが当該シグナルタワー6の属する装置を取り違えることが無い。   As shown in FIG. 3A, the upper surface and the four side surfaces of each device are enclosed by a cover member 2. In each apparatus, the cover member 2 that covers the upstream and downstream side surfaces in the substrate transport direction (X direction) is positioned at the upstream and downstream ends of the substrate transport unit 8, and the substrate 9 passes therethrough. An opening 3 is provided for this purpose. A signal tower 6 for notification is arranged on the upper side of the cover member 2 provided on the ceiling surface of the apparatus. Here, the signal tower 6 has a tilting structure, and is mounted and used in a posture in which the signal tower 6 is tilted to the device side to which the signal tower 6 belongs. Thereby, even when the devices having the same configuration are densely arranged with a short connection pitch, the operator does not mistake the device to which the signal tower 6 belongs when the signal tower 6 is operated.

各装置のY方向の側面、すなわち基板搬送方向(X方向)に沿った装置側面は、オペレータが当該装置の操作を行う操作面となっており、操作面には各種の操作スイッチが設けられた操作部4および液晶パネルなどの表示パネルを備えた表示盤5が配設されている。操作面側には、カバー部材2の一部を開閉自在としたカバー扉2aが、カバー部材2で閉囲された実装部20(作業動作部)の動作エリアに、保守点検などの目的でオペレータがアクセスするために設けられている。カバー扉2aの開が扉開閉検知用のマイクロスイッチ7によって検出された状態では、以下に説明する制御系のインターロック機能により、当該装置の動作が停止する。   The side surface in the Y direction of each device, that is, the device side surface along the substrate transport direction (X direction) is an operation surface on which the operator operates the device, and various operation switches are provided on the operation surface. A display panel 5 having a display panel such as an operation unit 4 and a liquid crystal panel is provided. On the operation surface side, a cover door 2a in which a part of the cover member 2 can be freely opened and closed is provided in the operation area of the mounting portion 20 (work operation portion) enclosed by the cover member 2 for the purpose of maintenance and inspection. Is provided for access. In the state in which the opening of the cover door 2a is detected by the door open / close detection micro switch 7, the operation of the apparatus is stopped by the interlock function of the control system described below.

ここで、操作部4および表示盤5はカバー扉2aに隣接して配置されており、装置側面において当該装置の基板搬送方向についての中心位置(図3(b)に示す中心線CL参照)から、一方向側(ここでは下流側)へ偏った位置に配置された形態となっている。操作部4には、オペレータが操作入力を行うための操作スイッチ4aとともに、非常停止スイッチ4bが設けられている。非常停止スイッチ4bは、オペレータが装置動作を監視して何らかの異常を感知した場合において、当該装置の基板搬送部8および実装部20(作業動作部)による動作を即時に停止させるべく、オペレータが操作入力を行うために設けられている。   Here, the operation unit 4 and the display panel 5 are disposed adjacent to the cover door 2a, and from the center position in the substrate transport direction of the apparatus on the side of the apparatus (see the center line CL shown in FIG. 3B). , It is arranged in a position that is biased toward one direction (downstream here). The operation unit 4 is provided with an emergency stop switch 4b as well as an operation switch 4a for an operator to input an operation. The emergency stop switch 4b is operated by the operator in order to immediately stop the operation of the substrate transport unit 8 and the mounting unit 20 (work operation unit) of the device when the operator monitors the device operation and senses any abnormality. It is provided for input.

次に図4を参照して、制御系の構成を説明する。なお装置M1〜M6は同一構成であり、ここでは装置M1,M2のみを図示している。各装置の制御系は、基板搬送部8、部品供給部11、認識部19、実装部20、通信部21、制御部22、操作入力部23を備えている。基板搬送部8は当該装置内における基板搬送・位置決め動作を実行する。部品供給部11はテープフィーダ12によって電子部品を実装部20に対して供給する。認識部19は、基板認識カメラ17、部品認識カメラ18による撮像結果を認識処理することにより、基板9の位置認識や搭載ヘッド15に保持された電子部品の認識を行う。通信部21は当該装置と電子部品実装ラインを構成する他装置やホストコンピュータとしての上位システム30との間でデータ授受を行う。制御部22は、当該装置の各部の制御処理を実行する。操作入力部23は、操作部4に配置された操作スイッチ4aや非常停止スイッチ4bからの入力処理を行う。   Next, the configuration of the control system will be described with reference to FIG. The devices M1 to M6 have the same configuration, and only the devices M1 and M2 are illustrated here. The control system of each apparatus includes a substrate transport unit 8, a component supply unit 11, a recognition unit 19, a mounting unit 20, a communication unit 21, a control unit 22, and an operation input unit 23. The substrate transfer unit 8 executes a substrate transfer / positioning operation in the apparatus. The component supply unit 11 supplies electronic components to the mounting unit 20 by the tape feeder 12. The recognition unit 19 recognizes the position of the substrate 9 and the electronic component held by the mounting head 15 by performing recognition processing on the imaging results obtained by the substrate recognition camera 17 and the component recognition camera 18. The communication unit 21 exchanges data between the apparatus and other apparatuses constituting the electronic component mounting line and the host system 30 as a host computer. The control unit 22 executes control processing for each unit of the apparatus. The operation input unit 23 performs input processing from the operation switch 4 a and the emergency stop switch 4 b arranged in the operation unit 4.

さらに制御部22は、以下に説明する非常停止処理を実行する。この非常停止処理について図5を参照して説明する。何らかの原因により装置M*に動作異常が生じ、当該装置に備えられた異常検知機能によって検知されると、シグナルタワー6が点灯してその旨報知する。シグナルタワー6による報知を感知したオペレータは当該装置M*にアクセスし、非常停止の処置が必要と判断した場合には、操作部4に設けられた非常停止スイッチ4bの操作を行う。このとき本来ならば、異常の発生元である装置M*の操作部4*にアクセスして非常停止スイッチ4bを操作すべきところ、何らかの理由でオペレータの判断に錯誤を生じ、装置M*の下流側(図5においては左側)に隣接する装置M(L)の操作部4(L)にアクセスして、非常停止スイッチ4bを誤操作してしまう事態が生じる場合がある。このような錯誤による誤操作は、装置M(L)の操作部4(L)が装置M*に直に隣接していることによって生じる。   Furthermore, the control part 22 performs the emergency stop process demonstrated below. This emergency stop process will be described with reference to FIG. When an operation abnormality occurs in the apparatus M * for some reason and is detected by the abnormality detection function provided in the apparatus, the signal tower 6 is turned on to notify that effect. The operator who has detected the notification by the signal tower 6 accesses the apparatus M * and operates the emergency stop switch 4b provided in the operation unit 4 when it is determined that an emergency stop treatment is necessary. At this time, if the emergency stop switch 4b should be operated by accessing the operation unit 4 * of the apparatus M * that is the source of the abnormality, an error may occur in the operator's judgment for some reason, and the downstream of the apparatus M *. There may be a situation in which the emergency stop switch 4b is erroneously operated by accessing the operation unit 4 (L) of the device M (L) adjacent to the side (left side in FIG. 5). Such an erroneous operation due to an error occurs when the operation unit 4 (L) of the device M (L) is directly adjacent to the device M *.

本実施の形態に示す電子部品搭載装置では、オペレータのこのような錯誤による誤操作を予め想定し、制御部22によって次のような非常停止処理を行うようにしている。すなわちオペレータが錯誤によってアクセスして非常停止スイッチ4bの操作を行った装置M(L)においては、その操作入力は操作入力部23を介して制御部22に伝達される。このとき、制御部22は自己が属する当該装置の基板搬送部8や実装部20の動作を即座に停止させる非常停止処理を実行するとともに、当該装置において操作部4(L)が中心位置から偏って配置されている一方向側(図3(b)、図5に示す例では右方向側)に、操作部4(L)を挟んで隣接する装置M*を非常停止させるための制御処理を併せて行う。   In the electronic component mounting apparatus shown in the present embodiment, an operator's erroneous operation due to such an error is assumed in advance, and the following emergency stop process is performed by the control unit 22. In other words, in the device M (L) in which the operator has accessed by mistake and operated the emergency stop switch 4 b, the operation input is transmitted to the control unit 22 via the operation input unit 23. At this time, the control unit 22 executes an emergency stop process that immediately stops the operation of the substrate transport unit 8 and the mounting unit 20 of the device to which the control unit 22 belongs, and the operation unit 4 (L) is biased from the center position in the device. Control processing for emergency stop of the adjacent device M * with the operation unit 4 (L) sandwiched between the one direction side (FIG. 3B and the right direction side in the example shown in FIG. 5). Perform together.

すなわち制御部22は、当該装置の通信部21を介して隣接する装置M*へ非常停止信号を送信する。この非常停止信号は、装置M*の通信部21を介して装置M*の制御部22に伝達され、制御部22は装置M*の基板搬送部8や実装部20の動作を停止させるための処理を行う。これにより、動作異常を生じて非常停止が必要とされる装置M*は直ちに動作を停止する。したがって、オペレータは左側に隣接する装置M(L)に錯誤によりアクセスするという誤った行動・操作を実行しているにも拘わらず、装置M*の動作を停止させるという操作目的が達成され、オペレータの安全が確保される。   That is, the control unit 22 transmits an emergency stop signal to the adjacent device M * via the communication unit 21 of the device. The emergency stop signal is transmitted to the control unit 22 of the apparatus M * via the communication unit 21 of the apparatus M *, and the control unit 22 is used to stop the operation of the substrate transfer unit 8 and the mounting unit 20 of the apparatus M *. Process. As a result, the device M * that causes an abnormal operation and requires an emergency stop immediately stops its operation. Therefore, the operation purpose of stopping the operation of the device M * is achieved despite the fact that the operator is performing an erroneous action / operation of accessing the device M (L) adjacent to the left side by mistake. Safety is ensured.

換言すれば、本実施の形態に示す各装置M1〜M6おいては、制御部22は非常停止スイッチ4bの操作入力があったならば、操作入力があった当該装置とともに、操作部4を夾んで前述の一方向側に隣接する装置を非常停止させるための制御処理を行う装置停止制御処理部として機能している。そして本実施の形態に示す電子部品実装用装置の非常停止方法においては、非常停止スイッチ4bの操作入力があったならば、操作入力があった当該電子部品実装用装置とともに、操作部4を夾んで前述の一方向側に隣接する電子部品実装用装置を非常停止させるための制御処理を制御部22によって行う形態となっている。   In other words, in each of the devices M1 to M6 shown in the present embodiment, if there is an operation input of the emergency stop switch 4b, the control unit 22 switches the operation unit 4 together with the device having the operation input. In this case, it functions as a device stop control processing unit that performs control processing for emergency stop of the device adjacent to the one direction. In the emergency stop method for the electronic component mounting apparatus shown in the present embodiment, if there is an operation input of the emergency stop switch 4b, the operation unit 4 is moved together with the electronic component mounting apparatus having the operation input. The control unit 22 performs control processing for emergency stopping the electronic component mounting apparatus adjacent to the one direction side.

なお本実施の形態に示す例では、電子部品実装用装置の例として、基板に電子部品を実装する部品搭載動作を行う電子部品搭載装置を示したが、電子部品実装ラインを構成して部品実装用の作業動作を実行する装置であれば、基板に電子部品接合用の半田を印刷する半田印刷装置や、基板の検査を行う検査装置などにも、本発明を適用することができる。   In the example shown in the present embodiment, an electronic component mounting apparatus that performs a component mounting operation for mounting an electronic component on a substrate is shown as an example of an electronic component mounting apparatus. The present invention can also be applied to a solder printing device that prints electronic component joining solder on a substrate, an inspection device that inspects a substrate, and the like.

本発明の電子部品実装用装置および電子部品実装用装置の非常停止方法は、小サイズ・薄型の単位装置を連結した構成の設備においてオペレータの安全を確実に確保することができるという効果を有し、複数装置を連結して構成された電子部品実装ラインにおいて有用である。   The electronic component mounting apparatus and the electronic component mounting apparatus emergency stop method according to the present invention have the effect that the safety of the operator can be reliably ensured in equipment having a configuration in which small and thin unit devices are connected. This is useful in an electronic component mounting line configured by connecting a plurality of devices.

本発明の一実施の形態の電子部品実装ラインの斜視図The perspective view of the electronic component mounting line of one embodiment of this invention 本発明の一実施の形態の電子部品実装ラインを構成する電子部品搭載装置の平面図The top view of the electronic component mounting apparatus which comprises the electronic component mounting line of one embodiment of this invention 本発明の一実施の形態の電子部品実装ラインを構成する電子部品搭載装置の斜視図The perspective view of the electronic component mounting apparatus which comprises the electronic component mounting line of one embodiment of this invention 本発明の一実施の形態の電子部品実装ラインの制御系の構成を示すブロック図The block diagram which shows the structure of the control system of the electronic component mounting line of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置の非常停止方法を示す説明図Explanatory drawing which shows the emergency stop method of the electronic component mounting apparatus of one embodiment of this invention

符号の説明Explanation of symbols

1 電子部品実装ライン
4 操作部
4b 非常停止スイッチ
5 表示盤
6 シグナルタワー
8 基板搬送部
9 基板
11 部品供給部
13 Y軸移動テーブル
14 X軸移動テーブル
15 搭載ヘッド
M1〜M6,M* 電子部品搭載装置
DESCRIPTION OF SYMBOLS 1 Electronic component mounting line 4 Operation part 4b Emergency stop switch 5 Display panel 6 Signal tower 8 Substrate conveyance part 9 Substrate 11 Component supply part 13 Y-axis movement table 14 X-axis movement table 15 Mounting head M1-M6, M * Electronic component mounting apparatus

Claims (2)

複数台を連結することにより電子部品を基板に実装して実装基板を製造する電子部品実装ラインを構成する電子部品実装用装置であって、
前記電子部品実装ラインの上流側から下流側に配設された搬送路を構成し前記基板を搬送する基板搬送部と、前記基板搬送部によって搬送された基板を対象として電子部品実装用の作業を実行する作業動作部と、前記作業動作部を制御する制御部と、
基板搬送方向に沿った装置側面において当該装置の基板搬送方向についての中心位置から一方向側へ偏った位置に配置され、オペレータが前記制御部への操作入力を行う操作部と、前記操作部に設けられ当該装置の前記基板搬送部および前記作業動作部による動作を即時に停止させるべくオペレータが操作入力を行う非常停止スイッチと、
前記非常停止スイッチの操作入力があったならば、前記操作入力があった当該電子部品実装用装置とともに前記操作部を夾んで前記一方向側に隣接する電子部品実装用装置を非常停止させるための制御処理を行う装置停止制御処理部とを備えたことを特徴とする電子部品実装用装置。
An electronic component mounting apparatus constituting an electronic component mounting line for manufacturing a mounting substrate by mounting electronic components on a substrate by connecting a plurality of units,
An electronic component mounting operation is carried out on a substrate transport unit configured to form a transport path disposed from the upstream side to the downstream side of the electronic component mounting line and transporting the substrate, and the substrate transported by the substrate transport unit. A work operation unit to execute, a control unit to control the work operation unit,
An operation unit disposed on a side surface of the apparatus along the substrate conveyance direction is deviated from the center position in the substrate conveyance direction of the apparatus toward one direction, and an operator inputs an operation input to the control unit, and the operation unit An emergency stop switch for an operator to input an operation to immediately stop the operation by the substrate transport unit and the work operation unit of the apparatus provided;
If there is an operation input of the emergency stop switch, the electronic component mounting apparatus adjacent to the one-direction side is emergency-stopped while holding the operation unit together with the electronic component mounting apparatus having the operation input. An electronic component mounting apparatus comprising: an apparatus stop control processing unit that performs control processing.
複数の電子部品実装用装置を連結して構成され電子部品を基板に実装して実装基板を製造する電子部品実装ラインにおいて前記電子部品実装用装置を非常停止させる電子部品実装用装置の非常停止方法であって、
前記電子部品実装用装置は、前記電子部品実装ラインの上流側から下流側に配設された搬送路を構成し前記基板を搬送する基板搬送部と、前記基板搬送部によって搬送された基板を対象として電子部品実装用の作業を実行する作業動作部と、前記作業動作部を制御する制御部と、基板搬送方向に沿った装置側面において当該装置の基板搬送方向についての中心位置から一方向側へ偏った位置に配置され、オペレータが前記制御部への操作入力を行う操作部と、前記操作部に設けられ当該装置の前記基板搬送部および前記作業動作部による動作を即時に停止させるべくオペレータが操作入力を行う非常停止スイッチとを備え、
前記非常停止スイッチの操作入力があったならば、前記操作入力があった当該電子部品実装用装置とともに前記操作部を夾んで前記一方向側に隣接する電子部品実装用装置を非常停止させるための制御処理を行うことを特徴とする電子部品実装用装置の非常停止方法。
An emergency stop method for an electronic component mounting apparatus that makes an emergency stop of the electronic component mounting apparatus in an electronic component mounting line configured to connect a plurality of electronic component mounting apparatuses and mount the electronic components on a substrate to manufacture a mounting substrate Because
The electronic component mounting apparatus includes a substrate transport unit configured to form a transport path disposed from an upstream side to a downstream side of the electronic component mounting line and transporting the substrate, and a substrate transported by the substrate transport unit. A work operation unit for performing work for mounting electronic components, a control unit for controlling the work operation unit, and a side surface of the apparatus along the substrate conveyance direction from the center position in the substrate conveyance direction of the apparatus to one direction side An operator is arranged at a biased position, and an operator inputs an operation input to the control unit, and an operator is provided in the operation unit to immediately stop the operation of the substrate transfer unit and the work operation unit of the apparatus. With an emergency stop switch for operation input,
If there is an operation input of the emergency stop switch, the electronic component mounting apparatus adjacent to the one-direction side is emergency-stopped while holding the operation unit together with the electronic component mounting apparatus having the operation input. An emergency stop method for an electronic component mounting apparatus, characterized by performing control processing.
JP2007333765A 2007-12-26 2007-12-26 Electronic component mounting apparatus and emergency stop method for electronic component mounting apparatus Active JP4853473B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007333765A JP4853473B2 (en) 2007-12-26 2007-12-26 Electronic component mounting apparatus and emergency stop method for electronic component mounting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007333765A JP4853473B2 (en) 2007-12-26 2007-12-26 Electronic component mounting apparatus and emergency stop method for electronic component mounting apparatus

Publications (2)

Publication Number Publication Date
JP2009158651A true JP2009158651A (en) 2009-07-16
JP4853473B2 JP4853473B2 (en) 2012-01-11

Family

ID=40962364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007333765A Active JP4853473B2 (en) 2007-12-26 2007-12-26 Electronic component mounting apparatus and emergency stop method for electronic component mounting apparatus

Country Status (1)

Country Link
JP (1) JP4853473B2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111295A (en) * 2000-09-26 2002-04-12 Matsushita Electric Ind Co Ltd Apparatus for mounting electronic component
JP2003174296A (en) * 2001-07-27 2003-06-20 Matsushita Electric Ind Co Ltd Electronic part mounting device and mounted board manufacturing system
JP2007027167A (en) * 2005-07-12 2007-02-01 Yamagata Casio Co Ltd Emergency stopping method of component mounting apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111295A (en) * 2000-09-26 2002-04-12 Matsushita Electric Ind Co Ltd Apparatus for mounting electronic component
JP2003174296A (en) * 2001-07-27 2003-06-20 Matsushita Electric Ind Co Ltd Electronic part mounting device and mounted board manufacturing system
JP2007027167A (en) * 2005-07-12 2007-02-01 Yamagata Casio Co Ltd Emergency stopping method of component mounting apparatus

Also Published As

Publication number Publication date
JP4853473B2 (en) 2012-01-11

Similar Documents

Publication Publication Date Title
JP4831061B2 (en) Electronic component mounting apparatus and emergency stop method for electronic component mounting apparatus
JP4803152B2 (en) Electronic component mounting system and operation instruction method in electronic component mounting system
JP5440486B2 (en) Component mounting apparatus and model switching method in component mounting apparatus
JP5536470B2 (en) Screen printing device
US9706695B2 (en) Electronic component mounting system and electronic component mounting method
JP2015185546A (en) Electronic part mounting system and electronic part mounting method
JP5870863B2 (en) Board inspection equipment
WO2018142532A1 (en) Production management device
JP2008311393A (en) Processing apparatus for substrate
JP6694778B2 (en) Screen printer
EP3043629B1 (en) Data processing device to be used by substrate working machine, and substrate working system having same
JP2013214588A (en) Electronic component mounting system
JP4853473B2 (en) Electronic component mounting apparatus and emergency stop method for electronic component mounting apparatus
JP4301873B2 (en) Substrate work machine support device
JP5310665B2 (en) Component mounting system and substrate transfer method in component mounting system
JP4952476B2 (en) Electronic component mounting system
JP4752651B2 (en) FA equipment
JP2010021248A (en) Component image capturing device and component image capturing method
WO2015056313A1 (en) Work machine
JP2012069544A (en) Electronic component mounting device and electronic component mounting work execution method
JP2003060399A (en) Method for managing circuit board working apparatus and management system
JP4865460B2 (en) Electronic component mounting equipment
JP2009038148A (en) Board conveying device
JP2008258382A (en) Assembling method of printed circuit board, and program for making mounting program
JP2011223045A (en) Electronic component mounting system and electronic component mounting apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091125

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20091214

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110927

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111010

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141104

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 4853473

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141104

Year of fee payment: 3