JP2009157394A - Pattern form and manufacturing method of pattern form - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a pattern form capable of forming high definition patterns of different surface characteristics on both surfaces by a simple method. <P>SOLUTION: This invention provides the pattern form provided with a base material and characteristic change layers formed on both sides of the base material, where characteristics are changed by the action of a photocatalyst accompanying energy irradiation, and a characteristic change pattern for which the characteristics of the characteristic change layers on both sides are changed is provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for producing a pattern forming body having a high-definition pattern on both sides, which can be used for various applications such as a color filter and a printed board.

  Conventionally, various methods for producing a pattern forming body for forming various patterns such as designs, images, characters, and circuits on a substrate have been produced.

  For example, when printing is described as an example, a lithographic printing plate used for lithographic printing, which is a kind of printing method, is a lithographic plate having a pattern composed of an oleophilic part that accepts ink and a part that does not accept printing ink. The lithographic printing plate is used to form an ink image to be printed on the lipophilic portion, and the formed image is transferred to paper or the like for printing. In such printing, a printing plate as a pattern forming body is produced by forming patterns such as characters and figures on the printing plate precursor as described above, and is used by being mounted on a printing press. Many printing plate precursors for offset printing, which are typical planographic printing plates, have been proposed.

  For example, a printing plate for offset printing is a method of exposing and developing through a mask on which a pattern is drawn on the printing plate precursor, a method of exposing directly by an electrophotographic method and making a plate directly on the printing plate precursor, etc. Can be produced. An electrophotographic offset printing plate precursor is provided with a photoconductive layer mainly composed of photoconductive particles such as zinc oxide and a binder resin on a conductive substrate, and this is exposed as a photoconductor by electrophotography. In this method, an offset original plate, that is, a pattern forming body is obtained by forming a highly lipophilic image on the surface of the photoreceptor and subsequently hydrophilizing the non-image portion by treatment with a desensitizing solution. The hydrophilic portion is immersed in water or the like to make it oleophobic, and the printing ink is received in the oleophilic image portion and transferred to paper or the like. However, in the pattern formation, various post-exposure treatments such as treatment with a desensitizing solution are required.

  In addition, as a method for forming a high-definition pattern, a photoresist layer coated on a substrate is subjected to pattern exposure, and after the exposure, the photoresist is developed, further etched, or a substance having functionality in the photoresist. There is known a method of manufacturing a pattern forming body by photolithography, such as directly forming a target pattern by exposing a photoresist using a photoresist.

  The formation of high-definition patterns by photolithography is used for the formation of colored patterns for color filters used in liquid crystal display devices, the formation of microlenses, the manufacture of fine electrical circuit boards, the manufacture of chromium masks used for pattern exposure, etc. However, depending on these methods, it is necessary to use a photoresist and develop with a liquid developer after exposure or to perform etching. In addition, when a functional substance is used as a photoresist, there is a problem that it deteriorates due to an alkali solution or the like used during development.

  A high-definition pattern such as a color filter is also formed by printing or the like, but the pattern formed by printing has problems such as positional accuracy, and it is difficult to form a high-precision pattern. .

  Here, when forming a high-definition pattern on both surfaces of the base material, it is necessary to perform the same process twice in any of the above methods. There was a problem of becoming enormous. In addition, when the photolithography method is used for a transparent substrate, if a photoresist is applied on both sides in advance, the photoresist layer is exposed on both sides by exposure, so the photoresist layer is formed simultaneously on both sides. However, it was necessary to form a photoresist layer on each side, and to perform exposure and development.

  On the other hand, as a method for forming a high-definition pattern, a method for producing a pattern forming body in which a substance that changes wettability by the action of a photocatalyst is formed on a substrate by a coating method, and a pattern is formed by performing energy irradiation Etc. have been studied by the present inventors (see, for example, Patent Document 1 and Patent Document 2).

  However, this method is a method of forming a pattern only on one side and not a pattern on both sides.

JP 2001-272774 A JP 2000-249821 A

  Therefore, it is desired to provide a manufacturing method of a pattern forming body capable of forming patterns with different high-definition surface characteristics on both sides by a simple method.

  The present invention has a base material and a property change layer that is formed on both surfaces of the base material and changes properties due to the action of a photocatalyst associated with energy irradiation, and the two property change layers formed on both surfaces are Provided is a pattern forming body characterized by having a characteristic change pattern in which the characteristics are changed.

  According to the present invention, since the property change layer is formed on both surfaces of the base material, the property change pattern having the property changed easily on both surfaces of the pattern forming body by the action of the photocatalyst accompanying energy irradiation. It can be formed and the characteristic change pattern can be different on both sides. Thereby, it is possible to obtain a pattern forming body in which various functional parts can be easily formed on both sides along the characteristic change pattern in which the characteristic is changed.

  In the above invention, the property change layer may be a wettability change layer in which the wettability changes so that the contact angle with the liquid is lowered by the action of a photocatalyst accompanying energy irradiation. As a result, the lyophilic region where the wettability has changed and the liquid repellent region where the wettability has not changed can be formed by the action of the photocatalyst accompanying the energy irradiation. This is because, for example, a pattern forming body in which the functional portion can be easily formed can be obtained by an inkjet method or the like.

  In this case, the wettability changing layer is preferably a layer containing fluoroalkylsilane. As a result, the wettability changing layer can be a uniform monomolecular film, the wettability of the wettability changing layer surface can be changed efficiently, and the lyophilic region of the wettability changing layer can be repelled. This is because the difference in wettability with the liquid region can be increased.

  In the present invention, the characteristic change layer may be a decomposition / removal layer that is decomposed and removed by the action of a photocatalyst accompanying energy irradiation. Thereby, unevenness can be formed on the surface by the action of the photocatalyst accompanying the energy irradiation, and a pattern forming body capable of easily forming a functional part using the unevenness can be obtained.

  In the present invention, the substrate may be transparent. In the present invention, by using a layer whose characteristics change due to the action of the photocatalyst, even when energy irradiation is performed using a photocatalyst on one side, the opposite characteristic changing layer may be affected. This is because different patterns can be formed.

  The present invention also includes a property change layer forming step of forming a property change layer whose properties change due to the action of a photocatalyst associated with energy irradiation on both surfaces of the substrate,

After disposing one surface of the property change layer, the photocatalyst containing layer containing the photocatalyst and the photocatalyst containing layer side substrate having the substrate with a gap so that the property change layer and the photocatalyst containing layer are 200 μm or less. , A first characteristic change pattern forming step of forming a first characteristic change pattern by irradiating energy and changing the characteristic of the characteristic change layer;
The property change layer on the surface opposite to the surface on which the first property change pattern is formed, the photocatalyst containing layer containing the photocatalyst, and the photocatalyst containing layer side substrate having the substrate, the property change layer and the photocatalyst containing layer A second characteristic change pattern forming step of forming a second characteristic change pattern in which the characteristics of the characteristic change layer are changed by irradiating energy after being arranged with a gap so as to be 200 μm or less;
There is provided a method for producing a patterned body characterized by comprising:

  According to the present invention, since the characteristic change layer is formed on both surfaces of the substrate by the characteristic change layer forming step, the photocatalyst is used in the first characteristic change pattern forming step and the second characteristic change pattern forming step. Due to the action of the photocatalyst containing layer in the containing layer, it is possible to form a characteristic change pattern having changed characteristics on both sides of the pattern forming body, and the pattern of the first characteristic change pattern and the second characteristic change pattern. Can be different.

  In the said invention, it is preferable that the said characteristic change layer formation process is performed by the dry method. This is because the characteristic change layer can be efficiently formed on both surfaces in a short time, and a uniform and thin layer can be obtained.

  In this case, the dry method is preferably a CVD method. This is because a dense and uniform layer such as a self-assembled monolayer can be formed.

  In the present invention, the substrate may be transparent. In the present invention, the characteristic change layer changes its characteristics due to the action of the photocatalyst. Therefore, when forming the characteristic change pattern, energy irradiation does not affect the opposite characteristic change layer. A target pattern can be formed with high definition. Further, depending on the energy irradiation method, the first characteristic change pattern and the second characteristic change pattern can be formed simultaneously.

  Moreover, this invention provides the functional element characterized by the functional part being formed on the characteristic change pattern of both surfaces of the pattern formation body mentioned above. According to the present invention, it is possible to easily form a functional part on both sides using the difference in characteristics of the characteristic change pattern and to obtain a functional element having a high-definition functional part. Because.

  According to the present invention, since the property change layer is formed on both surfaces of the base material, the property change pattern having the property changed easily on both surfaces of the pattern forming body by the action of the photocatalyst accompanying energy irradiation. It can be formed and the characteristic change pattern can be different on both sides. Thereby, it is possible to obtain a pattern forming body in which various functional parts can be easily formed on both sides along the characteristic change pattern in which the characteristic is changed.

It is a schematic sectional drawing which shows an example of the pattern formation body of this invention. It is process drawing which shows an example of the manufacturing method of the pattern formation body of this invention. It is a schematic sectional drawing which shows an example of the photocatalyst containing layer side board | substrate in this invention. It is a schematic sectional drawing which shows the other example of the photocatalyst containing layer side board | substrate in this invention. It is a schematic sectional drawing which shows the other example of the photocatalyst containing layer side board | substrate in this invention. It is process drawing which shows an example of the energy irradiation in the manufacturing method of the pattern formation body of this invention.

  The present invention relates to a pattern forming body having a high-definition pattern on both sides that can be used for various applications including a color filter and a printed circuit board, a method for manufacturing the pattern forming body, and a functional part using the pattern. It relates to a functional element in which is formed. Each will be described in detail below.

A. Pattern Forming Body First, the pattern forming body of the present invention will be described. The pattern forming body of the present invention has a base material and a property change layer that is formed on both surfaces of the base material and whose properties change due to the action of a photocatalyst accompanying energy irradiation. The characteristic change layer has a characteristic change pattern in which the characteristic has changed.

  For example, as shown in FIG. 1, the pattern forming body of the present invention has a base material 1 and a characteristic change layer 2 formed on both surfaces of the base material 1, and on the surface of the characteristic change layer 2. A characteristic change pattern 3 having different characteristics is formed.

  According to the present invention, since the property change layer is formed on both surfaces of the base material, the property of the property change layer is easily formed on both surfaces of the pattern forming body by the action of the photocatalyst accompanying energy irradiation. A changed characteristic change pattern can be formed. In addition, according to the present invention, even if the substrate is transparent, the property changing layer does not change the property even if it is irradiated with energy unless the layer having the photocatalyst is arranged nearby. When energy is applied to one side, the pattern change body having different characteristic change patterns on both sides can be obtained without affecting the characteristic change layer on the opposite side. Thereby, it is possible to obtain a pattern forming body capable of forming a functional element having functional portions of different patterns on both surfaces by utilizing the characteristics of the characteristic change pattern.

  Hereinafter, each structure of the pattern formation body of this invention is demonstrated.

1. Characteristic Change Layer First, the characteristic change layer used in the pattern forming body of the present invention will be described. If the characteristic changing layer used in the pattern forming body of the present invention is a layer that is formed on both surfaces of the base material to be described later and the characteristic changes due to the action of the photocatalyst accompanying energy irradiation, the type of change in the characteristic, etc. It is not particularly limited.

  In the present invention, the property change layer is a wettability change layer in which the wettability changes so that the wettability is reduced by the action of the photocatalyst, and the property change layer is a decomposition removal layer that is decomposed and removed by the action of the photocatalyst. The two cases in some cases are particularly preferable from the viewpoint that the functional part can be easily formed on the pattern forming body. Hereinafter, the wettability changing layer and the decomposition removal layer will be described.

(Wettability change layer)
The wettability changing layer used in the present invention is not particularly limited as long as the wettability is changed so that the contact angle with the liquid is lowered by the action of the photocatalyst accompanying energy irradiation.

  In this way, by forming a wettability changing layer in which the wettability changes so that the contact angle with the liquid is reduced by energy irradiation, the area irradiated with energy on the surface of the wettability changing layer is made a lyophilic region, energy The unirradiated region can be a liquid repellent region, and the functional part can be easily formed on the pattern forming body by utilizing this difference in wettability.

  Here, the lyophilic region is a region having a small contact angle with the liquid, and refers to a region having good wettability with respect to the functional part forming coating liquid or the like that forms the functional part. The liquid repellent region is a region having a large contact angle with the liquid, and refers to a region having poor wettability with respect to the functional part forming coating liquid.

  The wettability changing layer preferably has a contact angle with a liquid of 40 mN / m of 50 ° or more, particularly 90 ° or more, in a portion not irradiated with energy, that is, a liquid repellent region. This is because the region where energy is not irradiated is a region where liquid repellency is required in the present invention, and therefore, when the contact angle with the liquid is small, the liquid repellency is not sufficient. This is because when the part forming coating solution is applied, the functional part forming coating solution may remain on the liquid repellent region, which is not preferable.

  In the wettability changing layer, the contact angle with a liquid of 40 mN / m is 49 ° or less, preferably 10 ° or less, in a portion irradiated with energy, that is, a lyophilic region. When the contact angle with the liquid in the energy-irradiated part, that is, the lyophilic region is high, for example, when the functional part forming coating liquid is applied, the functional part forming also in the lyophilic region This is because the coating liquid may be repelled and it may be difficult to pattern the functional part on the lyophilic region.

  In addition, the contact angle with the liquid here is measured using a contact angle measuring instrument (Kyowa Interface Science Co., Ltd. CA-Z type) with a liquid having various surface tensions (from the microsyringe to the liquid. 30 seconds after dropping), and the result was obtained or the result was graphed. In this measurement, as a liquid having various surface tensions, a wetting index standard solution manufactured by Pure Chemical Co., Ltd. was used.

  Further, when the wettability changing layer as described above is used in the present invention, fluorine is contained in the wettability changing layer, and the fluorine content on the surface of the wettability changing layer is more energy than the wettability changing layer. The wettability changing layer may be formed so as to be lower than that before energy irradiation by the action of the photocatalyst.

  In the wettability changing layer having such characteristics, a pattern composed of a portion having a small fluorine content can be easily formed by pattern irradiation with energy. Here, fluorine has an extremely low surface energy. Therefore, the surface of a substance containing a large amount of fluorine has a smaller critical surface tension. Therefore, the critical surface tension of the portion having a small fluorine content is larger than the critical surface tension of the surface of the portion having a large fluorine content. This means that the portion with a low fluorine content is a lyophilic region compared to the portion with a high fluorine content. Therefore, forming a pattern composed of a portion having a lower fluorine content than the surrounding surface forms a pattern of a lyophilic region in the liquid repellent region.

  Therefore, when such a wettability changing layer is used, a pattern of the lyophilic region can be easily formed in the lyophobic region by irradiating the pattern with energy. For example, a functional part-forming coating solution can be adhered only to the pattern part to easily form the functional part.

  As described above, the fluorine content contained in the wettability changing layer containing fluorine is the fluorine content in the lyophilic region having a low fluorine content formed by energy irradiation. When the fluorine content of the non-existing portion is 100, it is preferably 10 or less, preferably 5 or less, particularly preferably 1 or less.

  By setting it within such a range, it is possible to make a great difference in wettability between the energy irradiated portion and the unirradiated portion. Therefore, by applying, for example, a functional part forming coating liquid to such a wettability changing layer, it is possible to accurately form a functional part only in a lyophilic region having a reduced fluorine content. This is because a functional element can be obtained with high accuracy. This rate of decrease is based on weight.

  The fluorine content in such a wettability changing layer can be measured by various commonly used methods such as X-ray Photoelectron Spectroscopy, ESCA (Electron Spectroscopy for Chemical Analysis)), and any method capable of quantitatively measuring the amount of fluorine on the surface, such as X-ray fluorescence analysis and mass spectrometry.

  In the present invention, such a wettability changing layer is formed on both surfaces of a substrate to be described later, and is applied to one surface of the substrate by a known coating method such as spin coating, spray coating, roll coating, bead coating or the like. Although it may be applied one by one, in the present invention, it is preferable to use dip coating or a dry method. Thereby, a wettability change layer can be formed simultaneously on both surfaces of a base material, and a pattern formation body can be manufactured efficiently. Moreover, in this invention, it is preferable to form by a dry method especially. Here, the dry method is a method in which a metal, metal oxide, organic substance or the like is gasified to form a film on the surface of the substrate, and a uniform thin film can be formed in a short time compared to the dip coating method. Because. Specific examples of the dry method used for forming the wettability changing layer used in the present invention include a CVD method including a thermal CVD method and a plasma CVD method, or a vapor deposition method, a sputtering method, an ion plating method and the like. PVD method etc. are mentioned.

  In the present invention, among the above, a CVD method such as a plasma CVD method or a thermal CVD method is preferable. This is because the wettability changing layer can be a uniform and dense layer.

  In addition, the plasma CVD method can form a desired material at a low temperature (approximately −10 to 200 ° C.) that does not cause thermal damage to the polymer base material. Since there is an advantage that the kind and physical properties of the film to be obtained can be controlled by the film pressure and input power, there is little possibility of causing thermal damage to the substrate for pattern formation described later. This is because, for example, a polymer base material having low heat resistance can be used as the pattern forming body substrate, and a pattern forming body that can be used for various applications can be obtained.

  As a film formation method by plasma CVD of a specific wettability changing layer in the present invention, first, the temperature of the substrate for pattern formation at the time of film formation is within a range of -20 to 100 ° C, particularly -10 to 30 ° C. It is preferable to be within the range. Next, using any of the following materials as the source gas, the input power per unit area in the plasma generating means of the plasma CVD apparatus is set to a size that allows the organic thin film to be formed, and the film forming pressure is free from particles. The pressure is set within a range of high pressure (50 to 300 mTorr). Further, by forming a plasma confinement space such as a magnet and increasing its reactivity, the effect can be enhanced.

  Moreover, you may use a normal pressure plasma apparatus for formation of the wettability change layer in this invention. Thereby, since it can carry out by a normal pressure, it becomes possible to form a wettability change layer of a large area at low cost.

  Examples of the raw material gas for the wettability changing layer formed by the plasma CVD method of the present invention include a silicon compound having an organic chain. As a result, the region of the formed wettability changing layer that has not been irradiated with energy can be made a liquid repellent region by the organic chain, and the region that has been irradiated with the energy has an organic chain that is exposed to the action of the photocatalyst. It is because it can be set as the decomposed lyophilic region.

  Specific examples of these materials include hexamethyldisiloxane (HMDSO), 1,1,3,3-tetramethyldisiloxane (TMDSO), tetramethylsilane (TMS), and vinyltrimethoxysilane. , Vinyltrimethylsilane, tetramethoxysilane (TMOS), methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, tetraethoxysilane (TEOS), dimethyldiethoxysilane, methyldimethoxysilane, methyldiethoxysilane, hexamethyldisilazane Can be preferably used, and one or more conventionally known ones such as tetramethyldisiloxane and normal methyltrimethoxysilane can be used.

  In addition, when the wettability changing layer in the present invention is formed using a thermal CVD method, in the thermal CVD method, a material as a raw material is vaporized, and the material is fed so as to be uniform on the substrate, and then oxidized. Since reactions such as reduction and substitution are performed, for example, a self-assembled monolayer can be formed.

  Here, the self-assembled monomolecular film is an organic thin film that spontaneously forms a monomolecular film while organic molecules gather spontaneously at the solid / liquid or solid / gas interface to form an aggregate. It is. For example, when a substrate made of a specific material is exposed to a solution or vapor of an organic molecule having a high chemical affinity with the substrate material, the organic molecule chemically reacts and adsorbs on the substrate surface. If the organic molecule consists of two parts, a functional group with high chemical affinity and an alkyl group that does not cause a chemical reaction with the substrate at all, and the functional group with high affinity is at its end, the molecule Is adsorbed with the reactive end facing the substrate and the alkyl group or the like facing outward. For example, when alkyl groups are aggregated, the whole becomes stable, so that organic molecules spontaneously aggregate in the process of chemisorption. Since molecular adsorption requires a chemical reaction between the substrate and the terminal functional group, once the substrate surface is covered with organic molecules to form a monomolecular film, molecular adsorption does not occur thereafter. Absent. As a result, an organic monomolecular film in which molecules are closely gathered and aligned is formed.

  When the wettability changing layer is a self-assembled monolayer, in the characteristic change pattern forming step described later, for example, an alkyl group having water repellency existing on the surface of the wettability changing layer is substituted with a photocatalyst accompanying energy irradiation. By removing it by the action, the surface can be easily made hydrophilic, and the characteristic change pattern can be efficiently formed.

  As preferable film-forming conditions of the thermal CVD method in the present invention, the higher the heat resistance temperature of the pattern-forming body substrate described later, the better. However, it is preferably in the range of 50 ° C to 300 ° C.

  In the present invention, when the wettability changing layer is formed, preferred raw materials include fluoroalkyl silane, alkyl silane, thiol, etc. Among them, a layer containing fluoroalkyl silane is preferred. When the wettability changing layer is a layer containing a fluoroalkylsilane, it is possible to form the above-described self-assembled monolayer on the pattern forming substrate described later, and the energy unirradiated portion Because the liquid repellency can be increased by the action of the fluoroalkyl group present on the surface of the surface, it is possible to increase the difference in wettability between the lyophilic region and the liquid repellant region. is there.

  In addition, as a material used when the wettability changing layer as described above is formed by dip coating or the like, the characteristics of the wettability changing layer described above, that is, the wettability by the photocatalyst in the photocatalyst-containing layer facing by the energy irradiation. The material is not particularly limited as long as it has a main chain that hardly deteriorates or decomposes due to the action of a photocatalyst, and specific examples include organopolysiloxane. In the present invention, the organopolysiloxane is preferably an organopolysiloxane containing a fluoroalkyl group.

  Examples of such an organopolysiloxane include (1) an organopolysiloxane that exerts great strength by hydrolyzing and polycondensing chloro or alkoxysilane by sol-gel reaction or the like, and (2) water repellency and oil repellency. Mention may be made of organopolysiloxanes such as organopolysiloxanes crosslinked with excellent reactive silicones.

  In the case of (1) above, the general formula:

Y _n SiX _(4-n)
(Here, Y represents an alkyl group, a fluoroalkyl group, a vinyl group, an amino group, a phenyl group or an epoxy group, X represents an alkoxyl group, an acetyl group or a halogen. N is an integer from 0 to 3. )
It is preferable that it is the organopolysiloxane which is a 1 type, or 2 or more types of hydrolysis condensate or cohydrolysis condensate of the silicon compound shown by these. Here, the number of carbon atoms of the group represented by Y is preferably in the range of 1 to 20, and the alkoxy group represented by X is a methoxy group, an ethoxy group, a propoxy group, or a butoxy group. preferable.

  In particular, an organopolysiloxane containing a fluoroalkyl group can be preferably used, and specific examples thereof include one or two or more hydrolytic condensates and cohydrolytic condensates of the following fluoroalkylsilanes. In general, those known as fluorine-based silane coupling agents can be used.

_{CF 3 (CF 2) 3 CH} 2 CH 2 Si (OCH 3) 3;
_{CF 3 (CF 2) 5 CH} 2 CH 2 Si (OCH 3) 3;
_{CF 3 (CF 2) 7 CH} 2 CH 2 Si (OCH 3) 3;
_{CF 3 (CF 2) 9 CH} 2 CH 2 Si (OCH 3) 3;
(CF ₃ ) ₂ CF (CF ₂ ) ₄ CH ₂ CH ₂ Si (OCH ₃ ) ₃ ;
_{(CF 3) 2 CF (CF} 2) 6 CH 2 CH 2 Si (OCH 3) 3;
_{(CF 3) 2 CF (CF} 2) 8 CH 2 CH 2 Si (OCH 3) 3;
_{CF 3 (C 6 H 4)} C 2 H 4 Si (OCH 3) 3;
_{CF 3 (CF 2) 3 (} C 6 H 4) C 2 H 4 Si (OCH 3) 3;
_{CF 3 (CF 2) 5 (} C 6 H 4) C 2 H 4 Si (OCH 3) 3;
_{CF 3 (CF 2) 7 (} C 6 H 4) C 2 H 4 Si (OCH 3) 3;
_{CF 3 (CF 2) 3 CH} 2 CH 2 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 5 CH} 2 CH 2 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 7 CH} 2 CH 2 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 9 CH} 2 CH 2 SiCH 3 (OCH 3) 2;
_{(CF 3) 2 CF (CF} 2) 4 CH 2 CH 2 SiCH 3 (OCH 3) 2;
_{(CF 3) 2 CF (CF} 2) 6 CH 2 CH 2 Si CH 3 (OCH 3) 2;
_{(CF 3) 2 CF (CF} 2) 8 CH 2 CH 2 Si CH 3 (OCH 3) 2;
_{CF 3 (C 6 H 4)} C 2 H 4 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 3 (} C 6 H 4) C 2 H 4 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 5 (} C 6 H 4) C 2 H 4 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 7 (} C 6 H 4) C 2 H 4 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 3 CH} 2 CH 2 Si (OCH 2 CH 3) 3;
_{CF 3 (CF 2) 5 CH} 2 CH 2 Si (OCH 2 CH 3) 3;
_{CF 3 (CF 2) 7 CH} 2 CH 2 Si (OCH 2 CH 3) 3;
_{CF 3 (CF 2) 9 CH} 2 CH 2 Si (OCH 2 CH 3) 3; and _{CF 3 (CF 2) 7 SO} 2 N (C 2 H 5) C 2 H 4 CH 2 Si (OCH 3) 3.

  By using a polysiloxane containing a fluoroalkyl group as described above as a binder, the liquid repellency of the non-irradiated part of the wettability changing layer is greatly improved. For example, when a coating liquid for forming a functional part is applied over the entire surface In addition, it is possible to prevent the adhesion of the functional part forming coating liquid, and it is possible to attach the functional part forming coating liquid only to the lyophilic region that is the energy irradiation part.

  Examples of the reactive silicone (2) include compounds having a skeleton represented by the following general formula.

However, n is an integer of 2 or more, R ^1, R ² are each a substituted or unsubstituted alkyl having 1 to 10 carbon atoms, alkenyl, aryl or cyanoalkyl group, the total molar ratio of 40% or less Vinyl, phenyl and phenyl halide. Further, those in which R ¹ and R ² are methyl groups are preferable because the surface energy becomes the smallest, and the methyl groups are preferably 60% or more by molar ratio. In addition, the chain end or side chain has at least one reactive group such as a hydroxyl group in the molecular chain.

  Moreover, you may mix the stable organosilicone compound which does not carry out a crosslinking reaction like dimethylpolysiloxane with said organopolysiloxane.

  In the present invention, various materials such as organopolysiloxane can be used in the wettability changing layer as described above. However, as described above, it is possible to include fluorine in the wettability changing layer. It is effective for pattern formation. Therefore, it can be said that it is preferable that fluorine be contained in a material that is not easily deteriorated or decomposed by the action of the photocatalyst, specifically, that the organopolysiloxane material contains fluorine to form a wettability changing layer.

  The wettability changing layer in the present invention may further contain a surfactant. Specifically, hydrocarbons such as NIKKOL BL, BC, BO, BB series manufactured by Nikko Chemicals Co., Ltd., ZONYL FSN, FSO manufactured by DuPont, Surflon S-141, 145 manufactured by Asahi Glass Co., Ltd., Dainippon Megafac F-141, 144 manufactured by Ink Chemical Industry Co., Ltd., Footgent F-200, F251 manufactured by Neos Co., Ltd., Unidyne DS-401, 402 manufactured by Daikin Industries, Ltd., Fluorard FC-170 manufactured by 3M Co., Ltd. Fluorine-based or silicone-based nonionic surfactants such as 176, and cationic surfactants, anionic surfactants, and amphoteric surfactants can also be used.

  In addition to the above surfactants, the wettability changing layer includes polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, melamine resin, polycarbonate. , Polyvinyl chloride, Polyamide, Polyimide, Styrene butadiene rubber, Chloroprene rubber, Polypropylene, Polybutylene, Polystyrene, Polyvinyl acetate, Polyester, Polybutadiene, Polybenzimidazole, Polyacrylonitrile, Epichlorohydrin, Polysulfide, Polyisoprene, etc. Can be contained.

  Such a wettability changing layer is formed by preparing a coating liquid by dispersing the above-described components together with other additives in a solvent as required, and coating the coating liquid on both surfaces of the substrate. be able to. As the solvent to be used, alcohol-based organic solvents such as ethanol and isopropanol are preferable. In the case where an ultraviolet curable component is contained, the wettability changing layer can be formed by performing a curing treatment by irradiating ultraviolet rays.

  In the present invention, the thickness of the wettability changing layer is preferably 0.001 μm to 1 μm, particularly preferably in the range of 0.01 to 0.1 μm, from the relationship of the wettability change rate by the photocatalyst. is there.

  By using the wettability changing layer of the above-described component in the present invention, the action of the photocatalyst in the photocatalyst containing layer is used to oxidize, decompose, etc. the organic group that is a part of the above component, and It is possible to change the wettability to make it lyophilic and to make a large difference in wettability with the non-energy-irradiated part. Therefore, for example, even when the functional part forming coating liquid is applied over the entire surface, it is possible to attach the functional part forming coating liquid relatively easily only in the lyophilic region that is the energy irradiation part, It can be set as the pattern formation body which can manufacture a high-definition functional element at low cost.

  In addition, the wettability changing layer used in the present invention is not particularly limited as long as the wettability changing layer is changed by the action of the photocatalyst as described above. preferable. If the wettability changing layer does not contain a photocatalyst in this way, there is no need to worry about being affected over time when it is used as a conductive pattern formation body, and it should be used without problems over a long period of time. Because it is possible.

(Decomposition removal layer)
Next, the decomposition removal layer will be described. The decomposition / removal layer used in the present invention is particularly limited as long as the decomposition / removal layer of the portion irradiated with energy is decomposed and removed by the action of the photocatalyst in the photocatalyst-containing layer when irradiated with energy. is not.

  As described above, the decomposed / removed layer is decomposed and removed by the action of the photocatalyst, so that the pattern composed of the part with and without the decomposed / removed layer without performing the development process or the washing process, that is, the unevenness is formed. The pattern which has can be formed.

  This decomposition / removal layer is oxidatively decomposed and vaporized by the action of the photocatalyst by energy irradiation, and is therefore removed without any special post-treatment such as development / washing process. Depending on the material, a cleaning process or the like may be performed.

  Moreover, it is preferable that the decomposition removal layer used for this invention not only forms an unevenness | corrugation, but this decomposition removal layer has a high contact angle with a liquid compared with the base material mentioned later. As a result, the decomposition / removal layer is decomposed and removed, and the region where the base material is exposed can be made a lyophilic region, and the region where the decomposition / removal layer remains can be made a liquid-repellent region, thereby forming various patterns. This is because it becomes possible.

  Here, the lyophilic region is a region having a small contact angle with the liquid, and refers to a region having good wettability with respect to the functional part forming coating liquid that forms the functional part. The liquid repellent region is a region having a large contact angle with the liquid, and refers to a region having poor wettability with respect to the functional part forming coating liquid.

  Further, the decomposition removal layer preferably has a contact angle with a liquid of 40 mN / m of 50 ° or more, particularly 90 ° or more. In the present invention, since the remaining characteristic change layer is a portion where liquid repellency is required, when the contact angle with the liquid is small, the liquid repellency is not sufficient. This is because when the functional part forming coating liquid to be formed is applied, there is a possibility that the functional part forming coating liquid may remain in the liquid repellent region where the functional part is not formed.

  In the present invention, the substrate described later preferably has a contact angle with a liquid of 40 mN / m of 49 ° or less, particularly 10 ° or less, in a portion where no energy is irradiated. In the present invention, since the substrate is a part that requires lyophilicity, for example, when the functional part forming coating solution is applied, the functional part forming coating solution is repelled even in the lyophilic region. This is because it may be difficult to pattern the functional portion. Here, the contact angle with the liquid is a value measured by the method described above.

  In this case, the substrate described later may be surface-treated so that the surface becomes lyophilic. Examples of the surface treatment so that the surface of the material is lyophilic include lyophilic surface treatment by plasma treatment using argon or water, and the lyophilic layer formed on the substrate is as follows: For example, a silica film obtained by a sol-gel method of tetraethoxysilane can be used.

  Specific examples of the film that can be used for the above-described decomposition removal layer include a film made of a fluorine-based or hydrocarbon-based resin having liquid repellency. These fluorine-based and hydrocarbon-based resins are not particularly limited as long as they have liquid repellency, and these resins are dissolved in a solvent, for example, a general composition such as a spin coating method. Although it may be a method of forming each side of the substrate by a film method, in the present invention, as in the case of the wettability changing layer described above, it may be formed by a dry method in terms of production efficiency and the like. To preferred.

When the decomposition removal layer is formed by the plasma CVD method, examples of the material used as the source gas include hydrocarbon materials and fluorine-containing organic materials. Specific examples of the hydrocarbon material include CH ₄ , C ₂ H ₂ , C ₂ H ₄ , and C ₃ H ₈ . Examples of the fluorine-containing organic material include CF ₄ , C ₂ F ₄ , C ₂ F ₆ , C ₃ F ₆ , C ₃ F ₈ , C ₅ F ₈ , PTFE (polytetrafluoroethylene), PVDF (polyvinylidene fluoro). Ethylene), PVF (polyvinyl fluoride), ETFE (ethylene / tetrafluoroethylene copolymer) and the like.

  When the decomposition / removal layer is formed by a thermal CVD method, examples of the raw material include ordinary resin monomers.

  Note that the film formation conditions of the plasma CVD method and the thermal CVD method, the film thickness of the decomposition removal layer, and the like are the same as those described in the wettability changing layer described above, and thus description thereof is omitted here.

  In addition, the decomposition removal layer may be formed by other methods such as a dip coating method, and by using a functional thin film, that is, a self-assembled monomolecular film, a Langmuir-Brocket film, an alternating adsorption film, etc. Such a film formation method may be used because it is possible to form a film without any film.

  Here, the self-assembled monomolecular film, the Langmuir-Brocket film, and the alternating adsorption film used in the present invention will be specifically described.

(Self-assembled monolayer)
Examples of materials capable of forming a self-assembled film used in the present invention include surfactant molecules such as fatty acids, organosilicon molecules such as alkyltrichlorosilanes and alkylalkoxides, and organic sulfur molecules such as alkanethiols, Examples thereof include organic phosphate molecules such as alkyl phosphates. The common commonality of the molecular structure is that there is a functional group that has a relatively long alkyl chain and that interacts with the substrate surface at one molecular end. The portion of the alkyl chain is a source of intermolecular force when molecules are packed two-dimensionally. However, the example shown here has the simplest structure, having a functional group such as an amino group or a carboxyl group at the other end of the molecule, an alkylene chain part having an oxyethylene chain, or a fluorocarbon chain. Self-assembled monolayers composed of various molecules such as those of complex type chains have been reported. There is also a composite type self-assembled monolayer composed of a plurality of molecular species. In addition, recently, a polymer having a plurality of functional groups (which may have one functional group) or a linear polymer (which may have a branched structure) as represented by dendrimers has been developed. One formed on the surface of the substrate (the latter is collectively referred to as a polymer brush) may be considered as a self-assembled monolayer. In the present invention, these are also included in the self-assembled monolayer.

(Langmuir-Blodgett membrane)
If the Langmuir-Blodgett film used in the present invention is formed on a substrate, there is no significant difference in form from the self-assembled monomolecular film described above. It can be said that the Langmuir-Blodgett film is characterized by its formation method and the advanced two-dimensional molecular packing properties (high orientation and high order). That is, in general, Langmuir-Blodgett film-forming molecules are first developed on the gas-liquid interface, and the developed film is condensed by the trough to change into a highly packed condensed film. In practice, this is transferred to a suitable substrate for use. It is possible to form a monomolecular film to a multilayer film of an arbitrary molecular layer by the method outlined here. Further, not only low molecules but also polymers and colloidal particles can be used as the film material. Recent examples of the application of various materials are described in detail in the review by Tokuharu Miyashita et al. “Prospects for Nanotechnology for the Creation of Soft Nanodevices” Polymer Vol. 50, September, 644-647 (2001).

(Alternate adsorption film)
Alternating adsorption film (Layer-by-Layer Self-Assembled Film) is generally laminated by adsorbing and bonding at least two materials with positive or negative functional groups sequentially onto the substrate. It is a film | membrane formed by doing. Since a material having a large number of functional groups has many advantages such as increased strength and durability of the membrane, recently, an ionic polymer (polymer electrolyte) is often used as a material. Further, particles having surface charges such as proteins, metals and oxides, so-called “colloid particles” are also frequently used as film-forming substances. More recently, membranes that actively utilize weaker interactions than ionic bonds such as hydrogen bonds, coordination bonds, and hydrophobic interactions have been reported. A relatively recent example of alternating adsorption films is slightly biased toward materials with electrostatic interaction as the driving force, but a review by Paula T. Hammond “Recent Explorations in Electrostatic Multilayer Thin Film Assembly” Current Opinion in Colloid & Interface Science, 4, 430-442 (2000). The alternate adsorption film can be described by taking the simplest process as an example, by repeating the adsorption-washing of a material having a positive (negative) charge-adsorption-washing of a material having a negative (positive) charge a predetermined number of times. It is a film to be formed. As with Langmuir-Blodgett membranes, no development-condensation-transfer operations are required. Further, as apparent from the difference in these production methods, the alternate adsorption film generally does not have a two-dimensional high orientation / high order like the Langmuir-Blodgett film. However, the alternate adsorption film and its manufacturing method have advantages over conventional film formation methods, such as the ability to easily form a dense film without defects and the ability to form even fine irregular surfaces, tube inner surfaces, and spherical surfaces. Have many.

  In addition, the thickness of the decomposition removal layer is not particularly limited as long as it is a thickness that can be decomposed and removed by the energy irradiated in the characteristic change pattern forming step described later. The specific film thickness varies greatly depending on the type of energy to be irradiated, the material of the decomposition removal layer, and the like, but is generally within the range of 0.001 μm to 1 μm, particularly 0.01 μm to 0.001. It is preferable to be within the range of 1 μm.

2. Substrate Next, the substrate used for the pattern forming body of the present invention will be described. In the present invention, characteristic change layers are formed on both surfaces of the substrate.

  The base material used in the present invention is appropriately selected according to the intended use of the finally obtained pattern formed body, for example, a resin laminate of a paper base, a resin of a glass cloth / glass nonwoven base Laminated plates, ceramics, metals, and the like can be used, and plate-like ones are preferable.

  In the present invention, the substrate can be transparent. In the photolithography method or the like, when the photoresist layer is formed on both sides, if the substrate is transparent, the photoresist layer is exposed simultaneously by exposure, so formation of the photoresist layer, exposure, Processing such as development had to be performed one side at a time. However, in the present invention, even if the base material is transparent, the characteristic change layer does not change its characteristic only by energy irradiation, and the photocatalyst is a layer containing a photocatalyst disposed in the vicinity of the surface of the characteristic change layer. Therefore, the characteristics of the characteristic change layer formed on the opposite surface across the base material and not including the photocatalyst containing layer are not changed. Thereby, the characteristic of the characteristic change layer can be changed on each side, and the target pattern can be formed on both sides.

  Further, since the base material is transparent, depending on the energy irradiation method and the like, it is possible to simultaneously change the characteristics of the characteristic change layers on both sides, and it is possible to simultaneously form different characteristic change patterns.

  Here, when simultaneously changing the characteristic change layers on both sides, the thickness of the base material is preferably in the range of 50 μm to 10000 μm.

  Further, in the present invention, when it is difficult to form the property change layer on the base material or when the adhesion between the base material and the property change layer is poor, the adhesion property is improved on the base material. An adhesion improving layer may be provided. Examples of such an adhesion improving layer include polyimide.

  The base material used in the present invention may be a member in which a required member, such as a black matrix in a color filter, is formed.

3. Characteristic Change Pattern Next, the characteristic change pattern of the present invention will be described. The characteristic change pattern of the present invention is a pattern in which the characteristic of the double-sided characteristic change layer formed on the substrate is changed by the action of the photocatalyst accompanying energy irradiation.

  In the present invention, this characteristic change pattern can be formed on the surface of the characteristic change layer by irradiating energy using a photocatalyst containing layer containing a photocatalyst and a photocatalyst containing layer side substrate having a substrate. it can.

  The action mechanism of the photocatalyst represented by titanium dioxide as described later in the photocatalyst containing layer is not necessarily clear, but the carrier generated by light irradiation reacts directly with a nearby compound, or oxygen, The reactive oxygen species generated in the presence of water is thought to change the chemical structure of organic matter. In the present invention, it is considered that this carrier acts on the compound in the property change layer disposed adjacent to the photocatalyst containing layer.

  Thereby, in the present invention, even when the base material is transparent, for example, when energy irradiation is performed using the photocatalyst-containing layer side substrate on one side of the property change layer, The characteristic change layer formed on the back side of the material is not affected by the photocatalyst, and the characteristic of only the single side property change layer can be changed. It can be formed.

  The photocatalyst-containing layer side substrate will be described in detail in “B. Method for producing pattern forming body” to be described later, and will not be described here.

4). Next, the pattern forming body of the present invention will be described. The pattern forming body of the present invention has the above-described base material and the characteristic change layers formed on both sides thereof, and the characteristic change pattern is formed on the characteristic change layers on both sides. .
According to the present invention, it is possible to form various functional portions on the characteristic change pattern by utilizing the difference in characteristics of the characteristic change pattern, so that various functional elements can be formed. It can be a formed body.

  Here, the characteristic change pattern in the present invention may be the same pattern or a different pattern on both surfaces of the pattern forming body.

B. Next, the manufacturing method of the pattern formation body of this invention is demonstrated. The method for producing a patterned product of the present invention comprises a property changing layer forming step of forming a property changing layer whose properties change due to the action of a photocatalyst accompanying energy irradiation on one side of the substrate, and one surface of the property changing layer, A photocatalyst-containing layer containing a photocatalyst and a photocatalyst-containing layer side substrate having a substrate are arranged with a gap so that the characteristic change layer and the photocatalyst-containing layer are 200 μm or less, and then irradiated with energy, A first characteristic change pattern forming step for forming a first characteristic change pattern in which the characteristic of the change layer has changed, a characteristic change layer on a surface opposite to the surface on which the first characteristic change pattern is formed, and a photocatalyst After arranging the photocatalyst containing layer and the photocatalyst containing layer side substrate having a base with a gap so that the characteristic change layer and the photocatalyst containing layer are 200 μm or less, And a second characteristic change pattern forming step of forming a second characteristic change pattern in which the characteristic of the characteristic change layer is changed.

  In the method for producing a pattern formed body of the present invention, for example, as shown in FIG. 2, first, a characteristic change layer forming step (FIG. 2A) for forming the characteristic change layer 2 on both surfaces of the substrate 1 is performed. Next, a photocatalyst containing layer side substrate 6 having a base 4 and a photocatalyst containing layer 5 containing a photocatalyst formed on the base 4 is prepared, and the photocatalyst containing layer 5 and one side of the characteristic change layer 2 are Are arranged with a predetermined gap, and irradiation with energy 8 is performed using, for example, a photomask 7 or the like (FIG. 2B) to form a first characteristic change pattern 3 in which the characteristic of the characteristic change layer 2 is changed. A first characteristic change pattern forming step is performed (FIG. 2C). Next, in the same manner as described above, the photocatalyst containing layer in the photocatalyst containing layer side substrate 6 having the characteristic changing layer 2 on the surface opposite to the surface on which the first characteristic changing pattern 3 is formed, and the base 4 and the photocatalyst containing layer 5 is provided. The layer 5 is arranged with a predetermined gap, and energy 8 is irradiated using a photomask 7 or the like (FIG. 2D), and a second characteristic change pattern 3 ′ in which the characteristic of the characteristic change layer 2 is changed is obtained. A second characteristic change pattern forming step is formed (FIG. 2E).

  Here, the first characteristic change pattern formation step and the second characteristic change pattern formation step are performed simultaneously depending on the structure of the photocatalyst-containing layer side substrate, as will be described later in “3. Others”. Also good.

  According to the present invention, since the characteristic change layer is formed on both surfaces of the substrate by the characteristic change layer forming step, the photocatalyst is used in the first characteristic change pattern forming step and the second characteristic change pattern forming step. Due to the action of the photocatalyst containing layer in the containing layer, it is possible to form a characteristic change pattern having changed characteristics on both surfaces of the pattern forming body. In addition, according to the present invention, even when the base material is transparent, the property change layer changes its properties due to the action of the photocatalyst in the photocatalyst containing layer disposed in the vicinity, so that one side is irradiated with energy. In this case, it is possible to obtain a pattern-formed body having different characteristic change patterns on both sides without affecting the characteristic change layer on the opposite side.

  Hereinafter, each process of the manufacturing method of the pattern formation body of this invention is demonstrated.

1. Characteristic Change Layer Formation Step First, the property change layer formation step in the method for producing a pattern forming body of the present invention will be described. The characteristic change layer forming step in the method for producing a pattern formed body of the present invention is a step of forming a characteristic change layer whose characteristics change due to the action of a photocatalyst accompanying energy irradiation on both surfaces of the substrate.

  In the present invention, as long as the characteristic change layer can be formed on both surfaces of the base material, the forming method and the like are not particularly limited. For example, a method of forming each surface by a general method may be used. However, in the present invention, it is preferably formed by a dip coating method or a dry method. This is because the characteristic change layer can be formed on both sides simultaneously, which is preferable from the standpoint of manufacturing efficiency.

  In the present invention, the dry method is preferable among the above. This is because a uniform and thin layer can be formed on both surfaces in a short time, which is preferable in terms of manufacturing efficiency. Specific examples of the dry method used in the present invention include a CVD method including a thermal CVD method and a plasma CVD method, or a PVD method including a vapor deposition method, a sputtering method, an ion plating method, etc. It is preferable to use a plasma CVD method or a CVD method including a thermal CVD method. This is because the characteristic change layer can be a uniform and dense layer.

  About the formation method and material of the characteristic change layer in this process, the kind of the base material, etc., since they are the same as those described in the section of the characteristic change layer and the base material of “A. Description of is omitted.

2. First Characteristic Change Pattern Formation Step Next, the first property change pattern formation step in the method for producing a pattern forming body of the present invention will be described. The first characteristic change pattern forming step in the method for producing a pattern forming body of the present invention includes a photocatalyst containing layer having a photocatalyst-containing layer and a substrate, one side of the characteristic change layer formed by the above-described characteristic change layer forming step A layer-side substrate is disposed with a gap so that the characteristic change layer and the photocatalyst-containing layer are 200 μm or less, and then irradiated with energy, and a first characteristic change pattern in which the characteristic of the characteristic change layer changes is obtained. It is a process of forming. Hereinafter, each structure of this process is demonstrated.

(Photocatalyst containing layer side substrate)
First, the photocatalyst containing layer side substrate used in this step will be described. The photocatalyst-containing layer side substrate used in this step has a photocatalyst-containing layer containing a photocatalyst and a substrate. Usually, the substrate and the photocatalyst-containing layer are formed on the substrate. This photocatalyst containing layer side substrate may have a photocatalyst containing layer side light shielding part, a primer layer, etc. formed in the shape of a pattern, for example. Hereinafter, each structure of the photocatalyst containing layer side board | substrate used for this process is demonstrated.

a. Photocatalyst containing layer First, the photocatalyst containing layer used for a photocatalyst containing layer side board | substrate is demonstrated. The photocatalyst-containing layer used in the present invention is not particularly limited as long as the photocatalyst in the photocatalyst-containing layer changes the characteristics of the adjacent characteristic change layer, and is composed of a photocatalyst and a binder. It may be a film formed with a single photocatalyst. Further, the surface characteristics may be particularly lyophilic or lyophobic.

  The photocatalyst-containing layer used in the present invention may be formed on the entire surface of the substrate 4 as shown in FIG. 2, for example, but for example, as shown in FIG. The containing layer 5 may be formed on the pattern.

  By forming the photocatalyst-containing layer in a pattern like this, as will be described in the energy irradiation described later, when the photocatalyst-containing layer is irradiated with energy while being arranged at a predetermined interval from the characteristic change layer, It is not necessary to perform pattern irradiation using a mask or the like, and by irradiating the entire surface, it is possible to form a pattern whose characteristics on the characteristic change layer have changed.

  The patterning method of the photocatalyst processing layer is not particularly limited, but can be performed by, for example, a photolithography method.

  In addition, since the characteristics of only the portion on the characteristic change layer facing the photocatalyst containing layer actually changes, the energy irradiation direction is such that the portion where the photocatalyst containing layer and the characteristic change layer face is irradiated with energy. As long as it is applied, the irradiation may be performed from any direction, and the irradiation energy is not particularly limited to parallel light such as parallel light. Also, as described in “3. Others” described later, two photocatalyst-containing layer side substrates having such a photocatalyst-containing layer are prepared, arranged on both surfaces of the characteristic change layer, and irradiated with energy. Thus, the first characteristic change pattern and the second characteristic change pattern can be formed simultaneously.

Examples of the photocatalyst used in the present invention include titanium dioxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), strontium titanate (SrTiO ₃ ), tungsten oxide (WO ₃ ), which are known as photo semiconductors. Bismuth oxide (Bi ₂ O ₃ ) and iron oxide (Fe ₂ O ₃ ) can be mentioned, and one or a mixture of two or more selected from these can be used.

  In the present invention, titanium dioxide is particularly preferably used because it has a high band gap energy, is chemically stable, has no toxicity, and is easily available. Titanium dioxide includes an anatase type and a rutile type, and both can be used in the present invention, but anatase type titanium dioxide is preferred. Anatase type titanium dioxide has an excitation wavelength of 380 nm or less.

  Examples of such anatase type titanium dioxide include hydrochloric acid peptizer type anatase type titania sol (STS-02 manufactured by Ishihara Sangyo Co., Ltd. (average particle size 7 nm), ST-K01 manufactured by Ishihara Sangyo Co., Ltd.), nitric acid solution An anatase type titania sol (TA-15 manufactured by Nissan Chemical Co., Ltd. (average particle size 12 nm)) and the like can be mentioned.

  The smaller the particle size of the photocatalyst, the more effective the photocatalytic reaction occurs. The average particle size is preferably 50 nm or less, and the photocatalyst of 20 nm or less is particularly preferable.

  The photocatalyst-containing layer in the present invention may be formed by a photocatalyst alone as described above, or may be formed by mixing with a binder.

  In the case of a photocatalyst-containing layer composed only of a photocatalyst, the efficiency with respect to the change in characteristics on the characteristic change layer is improved, which is advantageous in terms of cost such as shortening the processing time. On the other hand, in the case of a photocatalyst-containing layer comprising a photocatalyst and a binder, there is an advantage that the formation of the photocatalyst-containing layer is easy.

  Examples of a method for forming a photocatalyst-containing layer composed only of a photocatalyst include a method using a vacuum film forming method such as a sputtering method, a CVD method, or a vacuum deposition method. By forming the photocatalyst-containing layer by a vacuum film-forming method, it is possible to obtain a photocatalyst-containing layer that is a uniform film and contains only the photocatalyst, which can uniformly change the characteristics on the characteristic change layer. Since it is possible and consists only of a photocatalyst, it is possible to change the characteristics on the characteristic change layer more efficiently than in the case of using a binder.

  In addition, as another example of a method for forming a photocatalyst-containing layer comprising only a photocatalyst, for example, when the photocatalyst is titanium dioxide, a method of forming amorphous titania on a substrate and then changing the phase to crystalline titania by firing. Etc. As the amorphous titania used here, for example, hydrolysis, dehydration condensation, tetraethoxytitanium, tetraisopropoxytitanium, tetra-n-propoxytitanium, tetrabutoxytitanium, titanium inorganic salts such as titanium tetrachloride and titanium sulfate, An organic titanium compound such as tetramethoxytitanium can be obtained by hydrolysis and dehydration condensation in the presence of an acid. Next, it can be modified to anatase titania by baking at 400 ° C. to 500 ° C. and modified to rutile type titania by baking at 600 ° C. to 700 ° C.

  Moreover, when using a binder, what has the high bond energy that the main frame | skeleton of a binder is not decomposed | disassembled by photoexcitation of said photocatalyst is preferable, for example, organopolysiloxane etc. can be mentioned.

  When organopolysiloxane is used as a binder in this way, the photocatalyst-containing layer is prepared by dispersing the photocatalyst and the binder organopolysiloxane in a solvent together with other additives as necessary. It can be formed by applying this coating solution on a substrate. As the solvent to be used, alcohol-based organic solvents such as ethanol and isopropanol are preferable. The coating can be performed by a known coating method such as spin coating, spray coating, dip coating, roll coating or bead coating. When an ultraviolet curable component is contained as the binder, the photocatalyst-containing layer can be formed by irradiating ultraviolet rays and performing a curing treatment.

An amorphous silica precursor can be used as the binder. This amorphous silica precursor is represented by the general formula SiX _4, X is a halogen, a methoxy group, an ethoxy group or a silicon compound an acetyl group or the like, and silanol or average molecular weight of 3,000 or less, their hydrolysates Polysiloxane is preferred.

  Specific examples include tetraethoxysilane, tetraisopropoxysilane, tetra-n-propoxysilane, tetrabutoxysilane, and tetramethoxysilane. In this case, the amorphous silica precursor and the photocatalyst particles are uniformly dispersed in a non-aqueous solvent, and hydrolyzed with moisture in the air on the substrate to form silanol, and then at room temperature. A photocatalyst-containing layer can be formed by dehydration-condensation polymerization. If dehydration condensation polymerization of silanol is carried out at 100 ° C. or higher, the degree of polymerization of silanol increases and the strength of the film surface can be improved. Moreover, these binders can be used individually or in mixture of 2 or more types.

  When the binder is used, the content of the photocatalyst in the photocatalyst containing layer can be set in the range of 5 to 60% by weight, preferably 20 to 40% by weight. The thickness of the photocatalyst containing layer is preferably in the range of 0.05 to 10 μm.

  In addition to the photocatalyst and the binder, the photocatalyst containing layer can contain a surfactant. Specifically, hydrocarbons such as NIKKOL BL, BC, BO, BB series manufactured by Nikko Chemicals Co., Ltd., ZONYL FSN, FSO manufactured by DuPont, Surflon S-141, 145 manufactured by Asahi Glass Co., Ltd., Dainippon Megafac F-141, 144 manufactured by Ink Chemical Industry Co., Ltd., Footgent F-200, F251 manufactured by Neos Co., Ltd., Unidyne DS-401, 402 manufactured by Daikin Industries, Ltd., Fluorard FC-170 manufactured by 3M Co., Ltd. Fluorine-based or silicone-based nonionic surfactants such as 176, and cationic surfactants, anionic surfactants, and amphoteric surfactants can also be used.

  In addition to the above surfactants, the photocatalyst-containing layer includes polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, melamine resin, polycarbonate, Polyvinyl chloride, polyamide, polyimide, styrene butadiene rubber, chloroprene rubber, polypropylene, polybutylene, polystyrene, polyvinyl acetate, polyester, polybutadiene, polybenzimidazole, polyacrylonitrile, epichlorohydrin, polysulfide, polyisoprene, oligomers, polymers, etc. It can be included.

b. Substrate Next, the substrate used for the photocatalyst-containing layer side substrate will be described. In the present invention, as shown in FIG. 2, the photocatalyst-containing layer side substrate has at least a base 4 and a photocatalyst-containing layer 5 formed on the base 4. At this time, the material constituting the substrate to be used is appropriately selected depending on the energy irradiation direction to be described later and whether the pattern forming body to be obtained requires transparency.

  The substrate used in the present invention may be a flexible substrate such as a resin film, or may be a non-flexible substrate such as a glass substrate. This is appropriately selected depending on the energy irradiation method.

  In order to improve the adhesion between the substrate surface and the photocatalyst containing layer, an anchor layer may be formed on the substrate. Examples of such an anchor layer include silane-based and titanium-based coupling agents.

c. Photocatalyst containing layer side light-shielding part As the photocatalyst containing layer side light shielding part used for this invention, you may use what the photocatalyst containing layer side light shielding part formed in pattern shape was formed. Thus, by using the photocatalyst containing layer side substrate having the photocatalyst containing layer side light-shielding portion, it is not necessary to use a photomask or perform drawing irradiation with laser light when irradiating energy. Therefore, since alignment between the photocatalyst-containing layer side substrate and the photomask is not necessary, it is possible to use a simple process, and an expensive apparatus necessary for drawing irradiation is also unnecessary, so that the cost is reduced. Has the advantage of being advantageous.

  The photocatalyst-containing layer side substrate having such a photocatalyst-containing layer side light-shielding part can have the following two modes depending on the formation position of the photocatalyst-containing layer side light-shielding part.

  For example, as shown in FIG. 4, for example, a photocatalyst containing layer side light shielding portion 9 is formed on a substrate 4, and a photocatalyst containing layer 5 is formed on the photocatalyst containing layer side light shielding portion 9. It is an aspect to make. For example, as shown in FIG. 5, the photocatalyst containing layer 5 is formed on the substrate 4 and the photocatalyst containing layer side light-shielding portion 9 is formed thereon to form a photocatalyst containing layer side substrate.

  In any aspect, compared to the case of using a photomask, the photocatalyst-containing layer side light-shielding portion is arranged in the vicinity of the arrangement portion of the photocatalyst-containing layer and the characteristic change layer. Since the influence of energy scattering can be reduced, energy pattern irradiation can be performed very accurately.

  Here, in the present invention, when the photocatalyst containing layer side light shielding portion 9 is formed on the photocatalyst containing layer 5 as shown in FIG. 5, the photocatalyst containing layer and the characteristic change layer are placed at predetermined positions. When arranging, the photocatalyst containing layer side light shielding part is used as a spacer for keeping the gap constant by making the film thickness of the photocatalyst containing layer side light shielding part coincide with the width of the gap. Has the advantage of being able to.

  That is, when the photocatalyst containing layer and the characteristic change layer are arranged facing each other with a predetermined gap therebetween, the photocatalyst containing layer side light-shielding portion and the characteristic change layer are arranged in close contact with each other. Then, it becomes possible to make the predetermined gap accurate, and by irradiating energy in this state, the characteristic change layer of the part where the characteristic change layer and the light shielding part are in contact does not change in characteristics, This makes it possible to form the characteristic change pattern with high accuracy. At this time, the energy irradiation direction is not limited to the above-mentioned substrate side, and may be, for example, from the side surface of the substrate. In this case, as will be described later in “3. Others”, two photocatalyst-containing layer side substrates are prepared, arranged on both sides of the characteristic change layer, and irradiated with energy from both sides of the substrate. Thus, the first characteristic change pattern and the second characteristic change pattern can be formed simultaneously.

  The method for forming such a photocatalyst-containing layer side light-shielding part is not particularly limited, and is appropriately selected according to the characteristics of the formation surface of the photocatalyst-containing layer side light-shielding part, the shielding property against the required energy, and the like. Used.

  For example, it may be formed by forming a metal thin film of chromium or the like having a thickness of about 1000 to 2000 mm by a sputtering method, a vacuum deposition method, or the like, and patterning the thin film. As this patterning method, a normal patterning method such as sputtering can be used.

  Alternatively, a method may be used in which a layer containing light-shielding particles such as carbon fine particles, metal oxides, inorganic pigments, and organic pigments in a resin binder is formed in a pattern. As the resin binder to be used, polyimide resin, acrylic resin, epoxy resin, polyacrylamide, polyvinyl alcohol, gelatin, casein, cellulose, or a mixture of one or more kinds, photosensitive resin, or O / A W emulsion type resin composition, for example, an emulsion of a reactive silicone can be used. The thickness of such a resin light-shielding portion can be set within a range of 0.5 to 10 μm. As a method for patterning the resin light-shielding portion, a generally used method such as a photolithography method or a printing method can be used.

  In the above description, the two positions of the photocatalyst containing layer side light shielding portion between the substrate and the photocatalyst containing layer and the surface of the photocatalyst containing layer have been described as the formation position of the photocatalyst containing layer side. It is also possible to adopt a mode in which the photocatalyst-containing layer side light shielding portion is formed on the surface that is not provided. In this aspect, for example, a case where the photomask is brought into close contact with the surface so as to be detachable can be considered, and it can be preferably used when the characteristic change pattern is changed in a small lot.

d. Next, the primer layer used for the photocatalyst containing layer side substrate of the present invention will be described. In the present invention, when the photocatalyst-containing layer side light-shielding portion is formed in a pattern on the substrate as described above, and the photocatalyst-containing layer is formed on the photocatalyst-containing layer side substrate, the photocatalyst-containing layer side substrate is used. A primer layer may be formed between the side light shielding part and the photocatalyst containing layer.

  The function and function of this primer layer are not always clear, but by forming a primer layer between the photocatalyst-containing layer side light-shielding part and the photocatalyst-containing layer, the primer layer is characterized by the characteristics of the layer that changes the characteristics of the photocatalyst. Impurities from the openings existing between the photocatalyst containing layer side light shielding part and the photocatalyst containing layer side light shielding part, which are factors that hinder the change, in particular, residues generated when patterning the photocatalyst containing layer side light shielding part, metal, metal It is considered that it has a function of preventing diffusion of impurities such as ions. Therefore, by forming the primer layer, the characteristic change process proceeds with high sensitivity, and as a result, a high-resolution pattern can be obtained.

  In the present invention, the primer layer prevents impurities existing in not only the photocatalyst containing layer side light shielding part but also the opening formed between the photocatalyst containing layer side light shielding parts from affecting the action of the photocatalyst. The primer layer is preferably formed over the entire surface of the photocatalyst containing layer side light shielding portion including the opening.

  The primer layer in the present invention is not particularly limited as long as the primer layer is formed so that the photocatalyst containing layer side light-shielding portion of the photocatalyst containing layer side substrate is not in contact with the photocatalyst containing layer.

The material constituting the primer layer is not particularly limited, but an inorganic material that is not easily decomposed by the action of the photocatalyst is preferable. Specific examples include amorphous silica. When such amorphous silica is used, the precursor of the amorphous silica is represented by the general formula SiX ₄ and X is a silicon compound such as halogen, methoxy group, ethoxy group, or acetyl group, Silanol which is a hydrolyzate thereof or polysiloxane having an average molecular weight of 3000 or less is preferable.

  The thickness of the primer layer is preferably in the range of 0.001 μm to 1 μm, particularly preferably in the range of 0.001 μm to 0.1 μm.

(Energy irradiation)
Next, energy irradiation in this step will be described. In this step, the characteristic changing layer and the photocatalyst containing layer in the photocatalyst containing layer side substrate are arranged with a predetermined gap and irradiated with energy from a predetermined direction, whereby the characteristic changing layer has a characteristic. A changed first characteristic change pattern can be formed. At this time, the property change layer changes its properties due to the action of the photocatalyst in the photocatalyst containing layer arranged in the vicinity. Therefore, the property change layer on the opposite side across the base material has the property due to energy irradiation. Thus, only the first characteristic change pattern can be formed without changing.

  The above arrangement means a state where the action of the photocatalyst substantially extends to the surface of the property change layer, and in addition to a state where the photocatalyst is actually in contact, a predetermined interval is provided. Thus, the photocatalyst-containing layer and the characteristic change layer are arranged. This gap is preferably 200 μm or less.

  In the present invention, the gap has a very good pattern accuracy, a high photocatalyst sensitivity, and therefore a good property change efficiency of the property change layer, particularly in the range of 0.2 μm to 10 μm, preferably It is preferable to be within a range of 1 μm to 5 μm. Such a gap range is particularly effective for a small-area characteristic change layer capable of controlling the gap with high accuracy.

  On the other hand, when processing a characteristic change layer having a large area of, for example, 300 mm × 300 mm, a fine gap as described above is formed between the photocatalyst containing layer side substrate and the characteristic change layer without contact. It is extremely difficult to do. Therefore, when the characteristic change layer has a relatively large area, the gap is preferably in the range of 10 to 100 μm, particularly in the range of 50 to 75 μm. By setting the gap within such a range, there is no problem of pattern accuracy deterioration such as blurring of the pattern or problems such as deterioration of photocatalyst sensitivity and deterioration of efficiency of characteristic change. This is because there is an effect that unevenness does not occur in the characteristic change on the layer.

  Thus, when irradiating energy on the characteristic change layer having a relatively large area, the setting of the gap in the positioning device between the photocatalyst containing layer side substrate and the characteristic change layer in the energy irradiation device is within the range of 10 μm to 200 μm, In particular, it is preferable to set within a range of 25 μm to 75 μm. By setting the set value within such a range, it is possible to arrange the photocatalyst-containing layer side substrate and the characteristic change layer without contact with each other without causing a significant decrease in pattern accuracy and a significant deterioration in the sensitivity of the photocatalyst. Because it becomes possible.

  Thus, by disposing the photocatalyst-containing layer and the property change layer surface at a predetermined interval, oxygen, water, and active oxygen species generated by the photocatalytic action are easily desorbed. That is, when the interval between the photocatalyst containing layer and the characteristic change layer is narrower than the above range, it is difficult to desorb the active oxygen species, and as a result, there is a possibility that the characteristic change rate may be slowed. Absent. In addition, it is not preferable that the active oxygen species generated are difficult to reach the characteristic change layer, and in this case as well, the speed of the characteristic change may be reduced.

  In the present invention, such an arrangement state only needs to be maintained at least during energy irradiation.

  An example of a method for uniformly forming such an extremely narrow gap and arranging the photocatalyst-containing layer and the characteristic change layer is a method using a spacer. By using the spacer in this way, a uniform gap can be formed, and the portion in contact with the spacer is not affected by the photocatalyst action on the surface of the property change layer. By having a pattern similar to the change pattern, a predetermined characteristic change pattern can be formed on the characteristic change layer. Also, by using such a spacer, the active oxygen species generated by the action of the photocatalyst reaches the surface of the characteristic change layer at a high concentration without diffusing, and thus a high-definition characteristic change pattern is efficiently formed. be able to.

  In the present invention, such an arrangement state of the photocatalyst-containing layer side substrate only needs to be maintained at least during the energy irradiation.

3. Second Characteristic Change Pattern Formation Step Next, in the present invention, a second characteristic change pattern formation step is performed. The second characteristic change pattern forming step of the present invention includes a characteristic change layer on a surface opposite to the surface on which the first characteristic change pattern is formed by the first characteristic change pattern forming step, and the photocatalyst-containing layer side substrate described above. This is a step of forming a second characteristic change pattern in which the characteristics of the characteristic change layer are changed by irradiating energy after arranging the photocatalyst containing layer with a predetermined gap. Thereby, it is possible to obtain a pattern forming body in which a characteristic change pattern having a characteristic change is formed on both surfaces. The pattern of the second characteristic change pattern is appropriately selected according to the purpose of the pattern forming body, and may be a pattern different from the first characteristic change pattern or the same pattern.

  Here, since the photocatalyst-containing layer side substrate used in this step, energy irradiation, and the like are the same as those in the first characteristic change pattern forming step described above, description thereof is omitted here.

3. Others In the present invention, the first characteristic change pattern forming step and the second characteristic change pattern step described above can be performed simultaneously. As a method for simultaneously performing the first characteristic change pattern forming step and the second characteristic change pattern forming step, for example, as shown in FIG. 6, first, a base 4 and a photocatalyst-containing layer formed on the surface of the base 4 5 and 5 ′ are prepared. Between the photocatalyst containing layer side substrates 6 and 6 ′ and the characteristic change layers 2 and 2 ′ formed on both surfaces of the transparent base material 1, the spacers 10 are arranged in close contact with each other, The energy 8 is irradiated from the side (FIG. 6A). As a result, it is possible to change the characteristics of the characteristic change layers 2 and 2 ′ only in the portion where the spacer 10 is not in contact, and the first characteristic change pattern 3 and the second characteristic change pattern 3 ′ can be formed simultaneously. (FIG. 6B). In this case, the irradiation of energy is not limited to the side surface, and may be performed from one side or both sides, but in the present invention, it is preferable to perform from both sides in terms of sensitivity and the like.

  Such a spacer has small holes in a pattern that changes the characteristics of the characteristic change layer, and the thickness of the mask is preferably 2 mm or less, more preferably 100 μm or less. In the present invention, the mask determines the distance between the photocatalyst-containing layer and the wettability changing layer. Therefore, when the thickness of the mask is thicker than the above value, the generated active oxygen species are in the characteristic changing layer. This is because it may become difficult to reach and slow down the characteristic change. The lower limit of the mask thickness is 1 μm. This is because it is difficult to form a high-definition mask when the mask thickness is thinner than the above value.

  Further, the shape, size, etc. of the small holes formed in the mask of the present invention are appropriately selected according to the pattern of the target pattern forming body.

  Here, the mask used in the present invention is not particularly limited as long as the material or the like is not capable of transmitting the active oxygen species generated by the action of the photocatalyst by energy irradiation, and is transparent or opaque. It may also be flexible.

  Specific examples of the mask material used in the present invention include metals, inorganic substances such as glass and ceramics, and organic substances such as plastics. Among these, metals are preferred. In the present invention, since the mask is made of a metal, it is possible to easily form small holes in a pattern that changes the characteristics of the characteristic change layer, and to have strength that can be used repeatedly. Because I have it. A shadow mask or the like can also be used.

Here, the method for forming the small holes in the mask depends on the material of the mask and is not particularly limited, and examples thereof include an etching method.
In addition, as described above, when the photocatalyst containing layer of the photocatalyst containing layer side substrate is formed in a pattern, the characteristics of only the portion on the characteristic changing layer facing the photocatalyst containing layer change. The first characteristic change pattern and the second characteristic change pattern can be formed simultaneously by disposing the photocatalyst-containing layer side substrate on the characteristic change layers on both sides without using a shadow mask or the like.

  Furthermore, even when the photocatalyst containing layer side light-shielding part is formed on the photocatalyst containing layer, the photocatalyst containing layer side light shielding part is adhered to the double-sided characteristic change layer using the photocatalyst containing layer side light shielding part in the same manner as the spacer. By disposing them, the first characteristic change pattern and the second characteristic change pattern can be formed simultaneously.

  In addition, since the energy etc. which are used in this case are the same as the energy irradiation in the first characteristic change pattern forming step described above, the description here is omitted.

C. Functional Element Next, the functional element of the present invention will be described. The functional element of the present invention is characterized in that a functional part is formed on the characteristic change patterns on both sides of the pattern forming body described above.

  According to the present invention, since the functional part is formed along the pattern of the above-described pattern formed body, the high-definition functional part can be formed on both sides.

  Here, the term “functionality” means optical (light selective absorption, reflectivity, polarization, light selective transmission, nonlinear optical property, luminescence such as fluorescence or phosphorescence, photochromic property, etc.), magnetic (hard magnetism, soft magnetism, etc.). , Non-magnetic, magnetically permeable, etc.), electrical / electronic (conductive, insulating, piezoelectric, pyroelectric, dielectric, etc.), chemical (adsorptive, desorbable, catalytic, water-absorbing, ionic conductivity) , Redox, electrochemical properties, electrochromic, etc.), mechanical (wear resistance, etc.), thermal (heat transfer, heat insulation, infrared radiation, etc.), biofunctional (biocompatibility, antithrombotic, etc.) ) Means various functions.

  The functional part forming composition for forming the functional part used in the present invention varies greatly depending on the function of the functional element, the method of forming the functional element, etc. as described above. A composition not diluted with a solvent typified by a mold monomer or the like, a liquid composition diluted with a solvent, or the like can be used. Moreover, as a functional part formation composition, since a pattern can be formed in a short time, so that a viscosity is low, it is especially preferable. However, in the case of a liquid composition diluted with a solvent, it is desirable that the solvent has low volatility because an increase in viscosity and a change in surface tension occur due to volatilization of the solvent during pattern formation.

  The composition for forming a functional part used in the present invention may be a functional part by being attached to the lyophilic region or the like and disposed on the lyophilic region. Then, it may be treated with a medicine, or may be a functional part after being treated with ultraviolet rays, heat, or the like. In this case, as a binder of the composition for forming a functional part, when a component that is effective with ultraviolet rays, heat, electron beam, or the like is contained, the functional part can be quickly formed by performing a curing treatment. preferable.

  In the present invention, the functional part forming step for forming the functional part includes a coating means such as dip coating, roll coating, blade coating, and spin coating, a method using an inkjet, an electric field jet, a dispenser, and the like. It is preferable to use means such as nozzle discharge means. This is because by using these methods, the functional portion can be formed uniformly and with high definition.

  The functional element of the present invention has, for example, a color filter with a black matrix in which a pixel part is formed on one side as a functional part and a black matrix is formed on the opposite side, or a pixel part on one side as a functional part. And a color filter with a lens in which a lens is formed on the opposite surface, and a conductive pattern in which metal wiring is formed on both surfaces as a functional part.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described in more detail through examples.

[Example 1]
1. Formation of Photocatalyst Containing Layer Side Substrate 5 g of trimethoxymethylsilane (GE Toshiba Silicone Co., Ltd., TSL8113) and 2.5 g of 0.5 N hydrochloric acid were mixed and stirred for 8 hours. This was diluted 10 times with isopropyl alcohol to obtain an anchor layer composition.

  The anchor layer composition is applied onto a 100 μm line & space photomask substrate by a spin coater and dried at 150 ° C. for 10 minutes to form a transparent anchor layer (thickness 0.2 μm). did.

  Next, 30 g of isopropyl alcohol, 3 g of trimethoxymethylsilane (manufactured by GE Toshiba Silicone Co., Ltd., TSL8113) and 20 g of ST-K03 (manufactured by Ishihara Sangyo Co., Ltd.), which is a photocatalytic inorganic coating agent, are mixed at 100 ° C. Stir for 20 minutes. This was diluted 3 times with isopropyl alcohol to obtain a composition for a photocatalyst-containing layer.

  A transparent photocatalyst-containing layer (thickness 0.15 μm) is obtained by applying the composition for a photocatalyst-containing layer onto a photomask substrate on which an anchor layer is formed using a spin coater and performing a drying treatment at 150 ° C. for 10 minutes. Formed.

2. Formation of decomposition / removal layer 2 g of Iupilon Z400 (manufactured by Mitsubishi Gas Chemical), whose main component is polycarbonate, was dissolved in 30 g of dichloromethane and 70 g of 112 trichloroethane to obtain a composition for the decomposition layer removal layer.

  The said composition for decomposition | disassembly removal layers was apply | coated with the dip coater on the glass substrate, and the transparent decomposition removal layer (thickness 0.2 micrometer) was formed by performing the drying process for 60 minutes at 100 degreeC.

3. First Pattern Formation Step After the photocatalyst-containing layer side substrate was opposed to the first surface of the decomposition and removal layer, exposure was performed for 200 seconds at an illuminance of 40 mW / cm ² from the photomask side with an ultrahigh pressure mercury lamp (wavelength 365 nm). Thereby, the energy irradiation part of the decomposition removal layer on the first surface was decomposed and removed.

  Next, the light-shielding layer composition was applied as a functional part using a dip coater and then cured to form a light-shielding layer in the region where the decomposition removal layer on the first surface was decomposed and removed.

4). Second Pattern Formation Step After the photocatalyst-containing layer side substrate was opposed to the second surface of the decomposition removal layer, exposure was performed for 200 seconds at an illuminance of 40 mW / cm ² from the photomask side with an ultrahigh pressure mercury lamp (wavelength 365 nm). Thereby, the energy irradiation part of the decomposition removal layer on the second surface was decomposed and removed.

  Next, a colored layer composition was applied as a functional part by an inkjet method, and then cured to obtain a color filter in which a colored layer was formed in a region where the decomposition and removal layer on the second surface was decomposed and removed. .

[Example 2]
1. Formation of Photocatalyst Containing Layer Side Substrate 5 g of trimethoxymethylsilane (GE Toshiba Silicone Co., Ltd., TSL8113) and 2.5 g of 0.5 N hydrochloric acid were mixed and stirred for 8 hours. This was diluted 10 times with isopropyl alcohol to obtain an anchor layer composition.

  The anchor layer composition is applied onto a 100 μm line & space photomask substrate by a spin coater and dried at 150 ° C. for 10 minutes to form a transparent anchor layer (thickness 0.2 μm). did.

  Next, 30 g of isopropyl alcohol, 3 g of trimethoxymethylsilane (manufactured by GE Toshiba Silicone Co., Ltd., TSL8113) and 20 g of ST-K03 (manufactured by Ishihara Sangyo Co., Ltd.), which is a photocatalytic inorganic coating agent, are mixed at 100 ° C. Stir for 20 minutes. This was diluted 3 times with isopropyl alcohol to obtain a composition for a photocatalyst-containing layer.

  A transparent photocatalyst-containing layer (thickness 0.15 μm) is obtained by applying the composition for a photocatalyst-containing layer onto a photomask substrate on which an anchor layer is formed using a spin coater and performing a drying treatment at 150 ° C. for 10 minutes. Formed.

2. Formation of wettability changing layer A 5% IPA solution of MF-160E (trade name, manufactured by Tochem Products Co., Ltd.), which is mainly composed of fluoroalkylsilane, is prepared and heated to 240 ° C. on a glass substrate. A transparent wettability changing layer (thickness 0.1 μm) was formed by adhesion.

3. First Pattern Formation Step The photocatalyst-containing layer side substrate was made to face the first surface of the wettability changing layer, and then exposed from the photomask side with an ultrahigh pressure mercury lamp (wavelength 365 nm) at an illuminance of 40 mW / cm ² for 100 seconds. Thereby, the energy irradiation part of the said wettability change layer of the 1st surface became a lyophilic region.

  Next, the light shielding layer composition was applied as a functional part by a dip coater and then cured to form a light shielding layer on the lyophilic region on the first surface.

4). Second Pattern Formation Step After the photocatalyst-containing layer side substrate was opposed to the second surface of the wettability changing layer, exposure was performed for 100 seconds at an illuminance of 40 mW / cm ² from the photomask side with an ultrahigh pressure mercury lamp (wavelength 365 nm). Thereby, the energy irradiation part of the said wettability change layer of the 2nd surface became a lyophilic area | region.

  Next, a colored layer composition was applied as a functional part by an ink jet method and then cured to form a colored layer in the lyophilic region on the second surface to obtain a color filter.

DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Characteristic change layer 3 ... Characteristic change pattern 4 ... Base | substrate 5 ... Photocatalyst containing layer 6 ... Photocatalyst containing layer side board | substrate 7 ... Photomask 8 ... Energy 9 ... Photocatalyst containing layer side light shielding part

Claims (11)

A base material and a property change layer formed on both sides of the base material, the property change layer of which the property is changed by the action of a photocatalyst associated with energy irradiation. A pattern forming body having a changed characteristic change pattern. The pattern forming body according to claim 1, wherein the characteristic change layer is a decomposition removal layer that is decomposed and removed by the action of a photocatalyst accompanying energy irradiation. The pattern forming body according to claim 1, wherein the substrate is transparent. A property change layer forming step for forming a property change layer whose properties change due to the action of a photocatalyst accompanying energy irradiation on both surfaces of the substrate
After disposing one surface of the property change layer, a photocatalyst containing layer containing a photocatalyst, and a photocatalyst containing layer side substrate having a substrate with a gap so that the property change layer and the photocatalyst containing layer are 200 μm or less. Irradiating energy to form a first characteristic change pattern in which a characteristic of the characteristic change layer is changed, and a first characteristic change pattern forming step;
The property change layer on the surface opposite to the surface on which the first property change pattern is formed, the photocatalyst containing layer containing the photocatalyst and the photocatalyst containing layer side substrate having the substrate, the property change layer and the photocatalyst containing layer A second characteristic change pattern forming step of forming a second characteristic change pattern in which the characteristics of the characteristic change layer are changed by irradiating energy after being arranged with a gap so as to be 200 μm or less;
A method for producing a pattern-formed body, comprising: 5. The pattern forming body according to claim 4, wherein the characteristic change layer forming step is a step of forming a decomposition removal layer that is decomposed and removed by the action of a photocatalyst accompanying energy irradiation as the characteristic change layer. Manufacturing method. 6. The method of manufacturing a pattern forming body according to claim 4, wherein the characteristic change layer forming step is performed by a dry method. The method for producing a pattern forming body according to claim 6, wherein the dry method is a CVD method. The said base material is transparent, The manufacturing method of the pattern formation body in any one of Claim 4 to 7 characterized by the above-mentioned. A functional element, wherein a functional part is formed on a characteristic change pattern on both sides of the pattern forming body according to any one of claims 1 to 3. The pattern forming body according to any one of claims 1 to 3, wherein the pixel portion is formed on the characteristic change pattern on one side and the light shielding portion is formed on the characteristic change pattern on the opposite side. A color filter characterized by that. The pattern forming body according to any one of claims 1 to 3, wherein the pixel portion is formed on the characteristic change pattern on one side and the lens is formed on the characteristic change pattern on the opposite side. A color filter characterized by

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