JP2009149961A - Method for adding function to vacuum heat-treatment furnace and treatment method in vacuum heat-treatment furnace - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable an article to be plasma-treated by adding a simple operation using an existing vacuum heat-treatment furnace. <P>SOLUTION: This method comprises the steps of: installing a work table 12 made from an electroconductive material in the inner part of a heat-treatment chamber 3 through a first insulating material 11; connecting an electrode 131 of an electric power unit 13 with the work table 12 by making the electrode penetrate the heat-treatment chamber 3 through a second insulating material 15; grounding the heat-treatment chamber 3; and installing a second control device 14 for generating plasma in the inner part of the heat-treatment chamber 3 by controlling at least the electric power unit 13 and a gas supply device 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for adding a function to a vacuum heat treatment furnace that heat-treats an object in a vacuum atmosphere and a treatment method in the vacuum heat treatment furnace.

2. Description of the Related Art Conventionally, there is known a vacuum heat treatment furnace that performs a so-called quenching process by subjecting an object such as a metal part to a heat treatment in a vacuum atmosphere and then performing a cooling process.
The vacuum heat treatment furnace is made of a conductive material and heat-treats an object accommodated therein, a vacuum pump that evacuates the inside of the heat-treatment chamber, and supplies a treatment gas such as a carburizing gas to the heat-treatment chamber. A gas supply device is provided, and the inside of the heat treatment chamber is evacuated by a vacuum pump, and the heat treatment of the object is performed in a state where the processing gas is supplied to the heat treatment chamber by the gas supply device.
Such vacuum heat treatment furnaces are already installed and operating in many factories.
JP 2005-29872 A

By the way, in recent years, there is a demand in a factory not only to quench the object but also to perform plasma treatment on the surface thereof.
However, when performing plasma processing on an object, it is necessary to install a plasma processing furnace in addition to a vacuum heat treatment furnace. For this reason, when performing a plasma process with respect to a target object, huge cost and time for installing a plasma processing furnace are needed.

  The present invention has been made in view of the above-described problems, and an object thereof is to enable plasma processing of an object in an existing vacuum heat treatment furnace by a simple additional operation.

  In order to achieve the above object, a method for adding a function to a vacuum heat treatment furnace according to the present invention includes a heat treatment chamber made of a conductive material and subjected to heat treatment on an object accommodated therein, and evacuating the inside of the heat treatment chamber. A function adding method to an existing vacuum heat treatment furnace comprising a vacuum pump, a gas supply device for supplying a processing gas to the heat treatment chamber, and at least a first control device for controlling the vacuum pump and the gas supply device. A step of installing a work base made of a conductive material through a first insulating material inside the heat treatment chamber, and passing the electrode of a power supply device through the heat treatment chamber through a second insulating material. A second step of generating plasma in the heat treatment chamber by controlling at least the power supply device and the gas supply device; Characterized by a step of installing the control device.

  According to the method for adding a function to the vacuum heat treatment furnace of the present invention having such characteristics, the work table made of a conductive material is installed inside the heat treatment chamber via the first insulating material, and the work table is connected to the second work table. The electrode of the power supply device penetrating the heat treatment chamber is connected via the insulating material, the heat treatment chamber is grounded, and further, a second control device for controlling at least the power supply device and the gas supply device is installed.

  Moreover, in the function addition method to the vacuum heat treatment furnace of the present invention, when the rail for guiding the object is already provided in the heat treatment chamber, the first insulating material is disposed on the rail. Adopting a configuration.

  Next, the processing method in the vacuum heat treatment furnace of the present invention includes a heat treatment chamber made of a conductive material and subjected to heat treatment for an object accommodated therein, a vacuum pump for evacuating the inside of the heat treatment chamber, and the heat treatment chamber. A processing method in a vacuum heat treatment furnace comprising a gas supply device for supplying a processing gas to the work gas, wherein a work table made of a conductive material is installed in the heat treatment chamber via a first insulating material, and the work table is mounted on the work table. The heat treatment chamber is evacuated by the vacuum pump, the plasma treatment gas is supplied to the heat treatment chamber by the gas supply device, the heat treatment chamber is grounded, and a voltage is applied to the work table. The plasma processing gas is generated by applying the plasma processing gas to generate plasma, and the target object is subjected to plasma processing.

  According to the processing method in the vacuum heat treatment furnace of the present invention having such a feature, a work table made of a conductive material is installed inside the heat treatment chamber via the first insulating material, and an object is placed on the work table. The heat treatment chamber is evacuated and the plasma treatment gas is supplied to the heat treatment chamber, and the heat treatment chamber is installed and a voltage is applied to the work table to generate plasma. The plasma treatment is performed.

According to the method for adding a function to the vacuum heat treatment furnace of the present invention, the work table made of a conductive material is installed inside the heat treatment chamber via the first insulating material, and the work table is placed via the second insulating material. The electrode of the power supply device penetrating the heat treatment chamber is connected, the heat treatment chamber is grounded, and further, a second control device for controlling at least the power supply device and the gas supply device is installed.
By adding such a simple configuration, the heat treatment chamber is evacuated by a vacuum pump, plasma treatment gas is supplied to the heat treatment chamber by a gas supply device, and plasma is generated by applying a voltage to the work table. Therefore, it is possible to perform plasma processing on the object by placing the object on the work table. That is, by adding a simple configuration, a new function of plasma processing of an object can be added to the vacuum heat treatment furnace.
Therefore, according to the method for adding a function to the vacuum heat treatment furnace of the present invention, it is possible to perform the plasma treatment of the object in the existing vacuum heat treatment furnace by a simple additional operation.

Moreover, according to the processing method in the vacuum heat treatment furnace of the present invention, a work table made of a conductive material is installed inside the heat treatment chamber via the first insulating material, and an object is placed on the work table, and heat treatment is performed. The chamber is evacuated and a plasma processing gas is supplied to the heat treatment chamber. The heat treatment chamber is installed and a voltage is applied to the work table to generate plasma. Done.
In other words, with respect to an existing vacuum heat treatment furnace, a work table made of a conductive material is installed inside the heat treatment chamber via the first insulating material, and an object is placed on the work table, and heat treatment is performed by a vacuum pump. The chamber is evacuated and plasma treatment gas is supplied to the heat treatment chamber by the gas supply device, and the heat treatment chamber is grounded and a voltage is applied to the work table, and the plasma treatment is performed on the object in the existing vacuum heat treatment furnace. It becomes possible.
Therefore, according to the processing method in the vacuum heat treatment furnace of the present invention, it is possible to perform the plasma treatment of the object in the existing vacuum heat treatment furnace by a simple additional operation.

  Hereinafter, with reference to the drawings, an embodiment of a function addition method to a vacuum heat treatment furnace and a treatment method in a vacuum heat treatment furnace according to the present invention will be described. In the following drawings, the scale of each member is appropriately changed in order to make each member a recognizable size.

  1-3 is a figure which shows schematic structure of the vacuum heat processing furnace 1 before the new function called the plasma processing of the workpiece | work W which is a target object is added. 1 is a side sectional view of the vacuum heat treatment furnace 1, FIG. 2 is a front sectional view of the vacuum heat treatment furnace 1, and FIG. 3 is a block diagram showing a functional configuration of the vacuum heat treatment furnace 1.

  The vacuum heat treatment furnace 1 is a so-called batch-type vacuum heat treatment furnace that performs heat treatment and cooling treatment on the workpiece W (object) inside one heat treatment chamber, as shown in FIGS. A chamber 2, a heat treatment chamber 3, a vacuum pump 4, a gas supply device 5, and a main control device 6 (first control device) are provided.

In the chamber 2, the main body 21 is formed in a substantially cylindrical shape so that it can withstand the pressure even when the pressure state inside the chamber 2 changes, and the central axis of the main body 21 is horizontal. It is supported by a plurality of legs 22 so as to be. Moreover, the one side edge part of the chamber 2 is comprised as the clutch type door 23, and can be opened and closed.
And the chamber 2 comprised in this way is formed of the electroconductive material.

The heat treatment chamber 3 heats and cools the workpiece W therein.
The side wall 31 on the clutch door 23 side of the heat treatment chamber 3 is detachable and connected to the inside of the clutch door 23. The side wall 31 is detached by opening the clutch door 23, and the workpiece W can be carried into or out of the heat treatment chamber 3. When the clutch door 23 is closed, the heat treatment chamber 3 is in a state where the side wall portion 31 is attached, and the heat treatment chamber 3 is closed.
Further, the ceiling portion 32 and the floor portion 33 of the heat treatment chamber 3 are set in a lattice shape so that a cooling gas described later can pass therethrough.
The heat treatment chamber 3 is formed of a conductive material, and is supported by being divided into the upper and lower parts of the chamber 2 and being fixed to the chamber 2 by a partition plate 7 also formed of the conductive material (see FIG. 2).

In addition, a placement table 34 for placing the workpiece W is disposed inside the heat treatment chamber 3, and a plurality of rails 35 for facilitating the loading and unloading of the workpiece W are installed on the placement table 34. Has been.
Furthermore, a heater 36 for heat-treating the workpiece W, a thermometer 37 for measuring the internal temperature of the heat treatment chamber 3, and a pressure gauge 38 for measuring the internal pressure of the heat treatment chamber 3 are installed in the heat treatment chamber 3. ing. The heater 36, the thermometer 37, and the pressure gauge 38 are electrically connected to the main controller 6 installed outside the chamber 2 by wiring (not shown) (see FIG. 3).

The vacuum pump 4 is connected to the main body 21 of the chamber 2, and evacuates the interior of the heat treatment chamber 3 by evacuating the interior of the chamber 2.
The vacuum pump 4 is electrically connected to the main controller 6 as shown in FIG. 3 and is controlled by the main controller 6.

The gas supply device 5 supplies a processing gas such as a carburizing gas to the heat treatment chamber 3 through a supply pipe 51 inserted into the heat treatment chamber 3.
The gas supply device 5 is electrically connected to the main controller 6 as shown in FIG. 3 and is controlled by the main controller 6.

The main controller 6 controls the entire operation of the vacuum heat treatment furnace 1 in an integrated manner. As described above, the heater 36, the thermometer 37, the pressure gauge 38, the vacuum pump 4 and the gas supply device 5 are electrically connected. Connected.
Then, the main controller 6 determines the heater 36, the vacuum pump 4, and the gas supply device based on the program for heat treatment of the workpiece W stored in advance, the input signal from the thermometer 37 and the input signal from the pressure gauge 38. 5 is controlled.

A heat exchanger 8 and a fan 9 are installed inside the chamber 2, and the cooling gas supplied during the cooling process of the workpiece W is cooled by the heat exchanger 8 and circulated by the fan 9. It is configured as follows.
The heat exchanger 8 and the fan 9 are also electrically connected to the main controller 6 (not shown in FIG. 3) and controlled by the main controller 6.

In the vacuum heat treatment furnace 1 configured as described above, the heat treatment and the cooling treatment are performed in a state where the workpiece W is placed in the heat treatment chamber 3 under the control of the main controller 6. Quenching is performed.
Specifically, the main controller 6 evacuates the interior of the chamber 2 and the heat treatment chamber 3 with the vacuum pump 4, and then causes the heater 36 to generate heat and introduces carburizing gas or the like from the gas supply device 5 into the heat treatment chamber 3. By supplying, heat treatment is performed.
After such heat treatment, the main control device 6 supplies the cooling gas from the gas supply device 5 to the heat treatment chamber 3 and cools the cooling gas by the heat exchanger 8, and further circulates the cooling gas by the fan 9. As a result, the workpiece W is cooled.
The main controller 6 manages the temperature and pressure of the heat treatment chamber 3 based on input signals from the thermometer 37 and the pressure gauge 38 when performing the heating process and the cooling process.

  Next, a method of adding a function of performing plasma processing on the workpiece W to the vacuum heat treatment furnace 1 (method for adding a function to the vacuum heat treatment furnace of the present invention) and a method of performing plasma processing in the vacuum heat treatment furnace 1 (The processing method in the vacuum heat treatment furnace of the present invention) will be described with reference to FIGS.

  4 to 6 are diagrams showing a schematic configuration of a vacuum heat treatment furnace 1 (hereinafter referred to as a function-added vacuum heat treatment furnace 10) to which a function of performing a plasma treatment on the workpiece W is added. 3 is a side sectional view of the function-added vacuum heat treatment furnace 10, FIG. 2 is a front sectional view of the function-added vacuum heat treatment furnace 10, and FIG. 3 is a block diagram showing a functional configuration of the function-added vacuum heat treatment furnace 10. is there.

  As shown in these drawings, the function-added vacuum heat treatment furnace 10 is different from the vacuum heat treatment furnace 1 in that an insulating material 11 (first insulating material), a work table 12, a power supply device 13, and a sub-control device. 14 (second control device) is added as a new configuration.

  The insulating material 11 is made of an insulating material such as ceramics, and a plurality of the insulating materials 11 are arranged on the rail 35 of the heat treatment chamber 3. The work table 12 is made of a conductive material and is housed inside the heat treatment chamber 3 via a plurality of insulating materials 11. That is, the work table 12 is electrically insulated from the heat treatment chamber 3 and the chamber 2 by being housed inside the heat treatment chamber 3 through the insulating material 11.

The power supply device 13 is installed integrally with the sub-control device 14 outside the chamber 2, and is electrically connected to the work table 12 via the electrode 131. The power supply device 13 is electrically connected to the sub-control device 14 (see FIG. 6), and applies a voltage to the work table 12 under the control of the sub-control device 14.
Further, the electrode 131 of the power supply device 13 is connected to the work table 12 through the flange 24 connected to the chamber 2 and the wall portion of the heat treatment chamber 3. Note that an insulating material 15 formed of an insulating material such as ceramics is disposed between the electrode 131 and the chamber 2 and between the electrode 131 and the heat treatment chamber 3, and the electrode 131, the chamber 2, and the heat treatment chamber are disposed. 3 is electrically insulated.

The sub-control device 14 stores a program for performing plasma processing on the workpiece W, is directly connected to the power supply device 13, and is connected to the heater 36, the thermometer 37, the pressure gauge 38, and the vacuum via the main control device 6. The pump 4 and the gas supply device 5 are indirectly connected.
Then, the sub-control device 14 performs plasma processing on the workpiece W by controlling the power supply device 13 and the gas supply device 5.

  In the function-added vacuum heat treatment furnace 10, a chamber 2 and a heat treatment chamber 3 are installed, and a plasma processing gas can be supplied from the gas supply device 5 into the heat treatment chamber 3.

The function-added vacuum heat treatment furnace 10 having such a configuration includes, for example, a work table installation process (step S1), an electrode connection process (step S2), and a sub-control device installation process shown in the flowchart of FIG. It is formed by adding the above configuration to the vacuum heat treatment furnace 1 through (Step S3).
Specifically, in the work table setting step (step S1), a plurality of insulating materials 11 are arranged on the rails 35 of the heat treatment chamber 3 by fitting, and the work table 12 is set on these insulating materials 11.
Then, in the electrode connecting step (step S2), the electrode 131 of the power supply device 13 is connected to the work table 12 through the insulating material 15 through the chamber 2 and the heat treatment chamber 3.
Thereafter, in the sub control device installation step (step S3), the sub control device 14 for generating plasma is installed inside the heat treatment chamber 3 by controlling the power supply device 13 and the gas supply device 5.

The function-added vacuum heat treatment furnace 10 is formed through the simple steps shown in FIG.
When plasma processing is performed in the vacuum heat treatment furnace 1, the vacuum heat treatment furnace 1 is used as a function-added vacuum heat treatment furnace 10 in the step shown in FIG. 4 evacuates the heat treatment chamber 3, supplies a plasma processing gas to the heat treatment chamber 3 by the gas supply device 5, and supplies a voltage (negative electrode) to the work table 12 by the power supply device 13 with the chamber 2 and the heat treatment chamber 3 grounded. Is applied to excite the plasma processing gas to generate plasma, and the surface treatment of the workpiece W is performed with this plasma.

  In the present embodiment, when performing plasma processing on the workpiece W, the main control device 6 controls the vacuum pump 4 and the sub-control device 14 controls the power supply device 13 and the gas supply device 5. The sub-control device 14 is not directly connected to the gas supply device 5 and controls the gas supply device 5 via the main control device 6.

Here, with reference to FIG. 8, the concrete control timing of the vacuum pump 4, the power supply device 13, and the gas supply apparatus 5 in a plasma process is demonstrated.
In FIG. 8, A is a graph showing the pressure change with time in the chamber 2 (heat treatment chamber 3), and B is a graph showing the temperature of the workpiece W.

  As shown in this figure, first, the vacuum pump 4 is operated by the main controller 6 to reduce the pressure in the chamber 2 (heat treatment chamber 3) to the first set pressure P1 stored in advance in the sub-controller 14. Note that the pressure in the chamber 2 is acquired by the main controller 6 via a pressure gauge 38 disposed in the heat treatment chamber 3.

  When the pressure in the chamber 2 is reduced to the first set pressure P1, the sub-control device 14 controls the gas supply device 5 via the main control device 6 so that the sub-control device 14 stores in advance. A plasma processing gas is supplied into the heat treatment chamber 3 until a set pressure P2 of 2 is reached.

When the pressure in the heat treatment chamber 3 reaches the second set pressure P2 in this manner, the sub control device 14 controls the power supply device 13 to apply a negative voltage to the work table 12.
As a result, the temperature of the workpiece W rises and the plasma processing gas inside the heat treatment chamber 3 is excited to generate plasma, and the surface treatment of the workpiece W is performed by the plasma.
Then, the sub control device 14 controls the power supply device 13 so that the temperature of the workpiece W is maintained at a preset temperature T stored in advance. Note that the temperature of the workpiece W is acquired by the main controller 6 through a thermometer 37 disposed inside the heat treatment chamber 3.

Subsequently, after confirming that the processing time stored in advance has elapsed, the sub-control device 14 cuts off the voltage of the power supply device 13. As a result, the plasma disappears and the workpiece W is cooled. The sub-control device 14 maintains the pressure in the heat treatment chamber 3 at the second set pressure P2 until the workpiece W is cooled.
When the workpiece W is cooled, the clamp-type door 23 of the chamber 2 is opened, and the workpiece W is taken out from the heat treatment chamber 3.

  Specifically, the surface of the workpiece W can be nitrided by using a nitriding gas such as ammonia as the plasma processing gas.

According to the method for adding the function of performing plasma processing on the workpiece W to the vacuum heat treatment furnace 1 of the present embodiment as described above (function addition method to the vacuum heat treatment furnace of the present invention), the work table 12 made of a conductive material is provided. The electrode 131 of the power supply device 13 that is installed inside the heat treatment chamber 3 through the insulating material 11 and penetrates the heat treatment chamber 3 through the insulating material 15 is connected to the work table 12, and the heat treatment chamber 3 is grounded. Furthermore, a sub-control device 14 that controls at least the power supply device 13 and the gas supply device 5 is installed.
Then, by adding such a simple configuration, the heat treatment chamber 3 is evacuated by the vacuum pump 4, the plasma treatment gas is supplied to the heat treatment chamber 3 by the gas supply device 5, and a voltage is applied to the work table 12. Since plasma can be generated by this, it is possible to perform plasma processing on the workpiece W by placing an object on the workpiece table 12. That is, by adding a simple configuration, a new function of plasma processing of the workpiece W can be added to the vacuum heat treatment furnace 1.
Therefore, according to the method of adding the function of performing the plasma processing on the workpiece W to the vacuum heat treatment furnace 1 of the present embodiment, the target can be used in the existing vacuum heat treatment furnace 1 by a simple additional operation without installing a separate plasma processing furnace. It becomes possible to perform plasma processing of objects.

In addition, according to the method for performing plasma processing in the vacuum heat treatment furnace 1 of the present embodiment (processing method in the vacuum heat treatment furnace of the present invention), a work table made of a conductive material through the insulating material 11 inside the heat treatment chamber 3. 12 is installed, the workpiece W is placed on the work table 12, the heat treatment chamber 3 is evacuated, the plasma treatment gas is supplied to the heat treatment chamber 3, the heat treatment chamber 3 is installed, and a voltage is applied to the work table 12. Is applied to generate plasma, and the plasma is applied to the workpiece W by the plasma.
That is, with respect to the existing vacuum heat treatment furnace 1, a work table 12 made of a conductive material is installed inside the heat treatment chamber 3 via the insulating material 11, and a work W is placed on the work table 12, and a vacuum pump The vacuum processing chamber 3 is evacuated by 4 and a plasma processing gas is supplied to the heat processing chamber 3 by the gas supply device 5. The heat processing chamber 3 is grounded and a voltage is applied to the work table 12. 1, it is possible to perform plasma processing on the object.
Therefore, according to the processing method in the vacuum heat treatment furnace of the present invention, it is possible to perform the plasma treatment of the workpiece W in the existing vacuum heat treatment furnace 1 by a simple additional operation without installing a separate plasma processing furnace.

  As mentioned above, although preferred embodiment of this invention was described referring drawings, this invention is not limited to the said embodiment. Various shapes, combinations, and the like of the constituent members shown in the above-described embodiments are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above embodiment, the vacuum heat treatment furnace 1 is described as a batch type vacuum heat treatment furnace.
However, the present invention is not limited to this, and can be applied to a continuous vacuum heat treatment furnace.

Moreover, in the said embodiment, nitriding gas was mentioned and demonstrated as plasma processing gas supplied from the gas supply apparatus 5 in plasma processing.
However, the present invention is not limited to this, and other plasma processing gases can be used.

In the above embodiment, the sub-control device 14 is electrically connected to the main control device 6, and the vacuum heat treatment furnace 1 (function-added vacuum heat treatment furnace) is used by the sub-control device 14 and the main control device 6 during the plasma processing. The configuration for controlling 10) has been described.
However, the present invention is not limited to this. For example, a part of the functions of the main controller 6 (for example, control of the vacuum pump 4, the function of acquiring the internal temperature of the heat treatment chamber 3 from the thermometer 37, and By providing the sub-control device 14 with the function of acquiring the internal pressure of the heat treatment chamber 3 from the pressure gauge 38 in advance and directly connecting the sub-control device 14 to various devices without going through the main control device 6, The vacuum heat treatment furnace 1 (function-added vacuum heat treatment furnace 10) can be controlled only by the sub-control device 14 during the plasma treatment.

Moreover, in the said embodiment, the insulating material 11 was arrange | positioned on the rail 35 of the heat processing chamber 3, and the structure which mounts the workpiece base 12 on this insulating material 11 was demonstrated.
However, the present invention is not limited to this, and the insulating material 11 may be assembled in the heat treatment chamber 3 and the work table 12 may be disposed on the assembled insulating material 11.

In the above embodiment, the insulating material 15 is disposed between the electrode 131 and the chamber 2 and between the electrode 131 and the heat treatment chamber 3, so that the electrode 131, the chamber 2, and the heat treatment chamber 3 are separated. Insulation is secured.
However, the present invention is not limited to this, and the electrode 131 is wrapped with the insulating material 15 in advance, and the electrode 131 wrapped with the insulating material 15 is inserted into the chamber 2 and the heat treatment chamber 3, thereby Insulation with the chamber 2 and the heat treatment chamber 3 may be ensured.

  Moreover, in the said embodiment, although the internal environment of the heat processing chamber 3 in a plasma process is acquired using the thermometer 37 and the pressure gauge 38 which were installed previously, this invention is not limited to this, A separate thermometer and pressure gauge may be installed, and the internal environment of the heat treatment chamber 3 in the plasma processing may be acquired using the thermometer and pressure gauge.

In the above embodiment, the heat treatment chamber 3 is formed of a conductive material and is grounded via the chamber 2 and the partition plate 7, that is, the vacuum in which the step of grounding the heat treatment chamber in the present invention has already been completed. The heat treatment furnace 1 has been described. However, the present invention is not limited to this, and can be applied to a vacuum heat treatment furnace in which the heat treatment chamber is formed of a non-conductive material.
In such a case, as a step of grounding the heat treatment chamber of the present invention, it is necessary to perform a step of imparting conductivity to the heat treatment chamber, for example, by attaching a conductive plate to the inner wall of the heat treatment chamber.

It is the sectional side view which showed schematic structure of the vacuum heat processing furnace to which a function is added by the function addition method to the vacuum heat processing furnace of this invention. It is the front sectional view showing the schematic structure of the vacuum heat treatment furnace to which a function is added by the function addition method to the vacuum heat treatment furnace of the present invention. It is a functional block diagram which shows the function structure of the vacuum heat processing furnace to which a function is added by the function addition method to the vacuum heat processing furnace of this invention. It is the sectional side view which showed schematic structure of the function addition type vacuum heat processing furnace to which the function was added by the function addition method to the vacuum heat processing furnace of this invention. It is the front sectional view showing the schematic structure of the function addition type vacuum heat treatment furnace to which the function was added by the function addition method to the vacuum heat treatment furnace of the present invention. It is a block diagram which shows the function structure of the function addition type vacuum heat processing furnace to which the function was added by the function addition method to the vacuum heat processing furnace of this invention. It is a flowchart which shows the function addition method to the vacuum heat processing furnace of this invention. It is explanatory drawing for demonstrating the plasma processing by the function addition type vacuum heat processing furnace to which the function was added by the function addition method to the vacuum heat processing furnace of this invention.

Explanation of symbols

  1 ... Vacuum heat treatment furnace, 2 ... Chamber, 3 ... Heat treatment chamber, 4 ... Vacuum pump, 5 ... Gas supply device, 6 ... Main control device (first control device), 10 ... Addition of functions Mold vacuum heat treatment furnace, 11... Insulating material (first insulating material), 12... Work table, 13... Power supply device, 131. ... Insulating material (second insulating material), W ... Workpiece (object)

Claims (3)

A heat treatment chamber made of a conductive material and subjected to heat treatment on an object accommodated therein, a vacuum pump for evacuating the inside of the heat treatment chamber, a gas supply device for supplying a processing gas to the heat treatment chamber, and at least the vacuum A function adding method to an existing vacuum heat treatment furnace comprising a pump and a first control device for controlling the gas supply device,
Installing a work table made of a conductive material through a first insulating material inside the heat treatment chamber;
Connecting the electrode of the power supply device to the work table through the heat treatment chamber through a second insulating material;
Grounding the heat treatment chamber;
And a step of installing a second control device for generating plasma inside the heat treatment chamber by controlling at least the power supply device and the gas supply device.   The function of the vacuum heat treatment furnace according to claim 1, wherein when a rail for guiding the object is already installed in the heat treatment chamber, the first insulating material is disposed on the rail. Append method. A vacuum heat treatment comprising a heat treatment chamber made of a conductive material and subjected to heat treatment on an object accommodated therein, a vacuum pump for evacuating the heat treatment chamber, and a gas supply device for supplying a treatment gas to the heat treatment chamber A processing method in a furnace,
Installing a work table made of a conductive material through a first insulating material inside the heat treatment chamber and placing the object on the work table;
Evacuating the heat treatment chamber by the vacuum pump and supplying a plasma processing gas to the heat treatment chamber by the gas supply device;
A process in a vacuum heat treatment furnace characterized in that the plasma treatment gas is generated by exciting the plasma treatment gas by grounding the heat treatment chamber and applying a voltage to the work table, thereby performing plasma treatment on the object. Method.

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