JP2009035792A - Heat-treatment method and heat-treatment apparatus - Google Patents

Heat-treatment method and heat-treatment apparatus Download PDF

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JP2009035792A
JP2009035792A JP2007203023A JP2007203023A JP2009035792A JP 2009035792 A JP2009035792 A JP 2009035792A JP 2007203023 A JP2007203023 A JP 2007203023A JP 2007203023 A JP2007203023 A JP 2007203023A JP 2009035792 A JP2009035792 A JP 2009035792A
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heat treatment
temperature
heat
furnace
pallet
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Takayuki Ohashi
孝行 大橋
Tatsuya Masuda
達也 増田
Shunsuke Ota
俊介 太田
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Nissan Motor Co Ltd
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Nissan Motor Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-treatment apparatus with which the number of defective articles with the heat-treatment are made to the minimum limit even in the case of being the abnormality in the heat-treatment article, the quality of the article can be determined with the worst pallet unit. <P>SOLUTION: This apparatus is provided with; a heat-treatment pallet 2 for loading the heat-treatment articles 1; a heat-treatment furnace 3 for charging each heat-treatment pallet 2 into the furnace; a heating heater 4 arranged in the heat-treatment furnace 3; a temperature sensor 5 for directly measuring the temperature of the heat-treatment article 1 by coming into contact with this heat-treatment article 1; and a temperature controlling instrument 6 for controlling the heating temperature with the above heating heater 4 based on the detected temperature with the temperature sensor 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、熱処理部品を熱処理するための熱処理方法及び熱処理装置に関し、適切な熱処理温度で熱処理するための技術に関する。   The present invention relates to a heat treatment method and a heat treatment apparatus for heat treating a heat treated component, and relates to a technique for heat treatment at an appropriate heat treatment temperature.

例えば、強度等の機械的特性を改善するために、金属部品或いは鋳造部品を熱処理装置(熱処理炉)内に投入し、所定温度で加熱して熱処理することが行われている(例えば、特許文献1など参照)。   For example, in order to improve mechanical properties such as strength, metal parts or cast parts are placed in a heat treatment apparatus (heat treatment furnace) and heated at a predetermined temperature for heat treatment (for example, Patent Documents). 1 etc.).

これまでの熱処理時における温度制御は、予め設定した処理条件に対して熱処理炉内の雰囲気温度を測定し、その測定した雰囲気温度データを温度制御装置(温度調整器)にフィードバックし加熱することで温度制御している。
特開2003−301216号公報
The temperature control at the time of the conventional heat treatment is performed by measuring the atmospheric temperature in the heat treatment furnace with respect to preset processing conditions, and feeding the measured atmospheric temperature data back to the temperature control device (temperature regulator) for heating. The temperature is controlled.
JP 2003-301216 A

しかしながら、温度制御においては熱処理炉内の雰囲気温度を測定しているため、熱処理部品個々の熱処理状況(温度履歴)は不明である。そのため、熱処理部品に強度や伸び等の材料特性に異常があった場合、その特定品のみでなく大量のロット数で不良品(再処理品或いは処分品)の判断をすることになる。   However, in temperature control, since the atmospheric temperature in the heat treatment furnace is measured, the heat treatment status (temperature history) of each heat treated component is unknown. For this reason, when there is an abnormality in the material properties such as strength and elongation in the heat-treated parts, not only the specific product but also a large number of lots is judged as a defective product (reprocessed product or disposal product).

そこで、本発明は、熱処理による不良品の数を最小限にとどめ、熱処理部品に異常があった場合でも最悪パレット単位で製品の良否判断をすることのできる熱処理方法及び熱処理装置を提供する。   Therefore, the present invention provides a heat treatment method and a heat treatment apparatus capable of minimizing the number of defective products due to heat treatment and determining the quality of the product on a worst pallet basis even when there is an abnormality in the heat treated parts.

本発明は、熱処理部品を搭載した熱処理パレットを熱処理炉内に投入し、熱処理温度を調節しながら加熱して熱処理部品を熱処理する熱処理方法において、前記熱処理部品の温度を直接計測するか、或いは、熱処理部品と同等の特性を有したダミー試料の温度を計測し、その計測した温度データを基にして温度調整を行うことを特徴とする。   The present invention is a heat treatment method in which a heat treatment pallet loaded with a heat treatment component is placed in a heat treatment furnace and heated while adjusting the heat treatment temperature to heat treat the heat treatment component, or the temperature of the heat treatment component is directly measured, or It is characterized in that the temperature of a dummy sample having characteristics equivalent to those of a heat-treated component is measured, and temperature adjustment is performed based on the measured temperature data.

本発明の熱処理装置は、熱処理部品を搭載させる熱処理パレットと、前記熱処理パレット毎炉内に投入させる熱処理炉と、前記熱処理炉内に設けられた加熱手段と、前記熱処理部品に接触してこの熱処理部品の温度を直接計測する温度検出手段と、前記温度検出手段で検出された温度に基づいて前記加熱手段による加熱温度を制御する温度制御手段と、を備えたことを特徴とする。   The heat treatment apparatus of the present invention includes a heat treatment pallet on which heat treatment parts are mounted, a heat treatment furnace to be put into each furnace of the heat treatment pallet, a heating means provided in the heat treatment furnace, and the heat treatment parts in contact with the heat treatment parts. The temperature detecting means for directly measuring the temperature of the component, and the temperature control means for controlling the heating temperature by the heating means based on the temperature detected by the temperature detecting means.

本発明の熱処理方法によれば、熱処理装置内の雰囲気温度を計測するのではなく、熱処理部品の温度を直接計測するか、或いは、熱処理部品と同等の特性を有したダミー試料の温度を計測し、その計測した温度データを基にして温度調整を行うため、熱処理部品個々の熱処理状況(温度履歴)に基づいて温度調整して熱処理を行うことができる。したがって、強度や伸び等の材料特性に異常があった場合、最悪でも熱処理パレット単位で製品の良否判断を行うことが可能となり、複数パレットでの製品良否判断を無くすことができる。   According to the heat treatment method of the present invention, instead of measuring the ambient temperature in the heat treatment apparatus, the temperature of the heat treatment part is directly measured, or the temperature of the dummy sample having the same characteristics as the heat treatment part is measured. Since the temperature adjustment is performed based on the measured temperature data, the heat treatment can be performed by adjusting the temperature based on the heat treatment status (temperature history) of each heat treatment component. Therefore, when there is an abnormality in material properties such as strength and elongation, it is possible to judge the quality of the product in units of heat treatment pallets at the worst, and it is possible to eliminate the quality judgment of the products in a plurality of pallets.

本発明の熱処理装置によれば、熱処理部品に接触してこの熱処理部品の温度を直接計測する温度検出手段を備えているので、熱処理部品個々の熱処理状況を把握することができ、当該熱処理部品の強度や伸び等の材料特性の異常を把握できる。   According to the heat treatment apparatus of the present invention, since the temperature detection means for directly measuring the temperature of the heat treatment part in contact with the heat treatment part is provided, it is possible to grasp the heat treatment state of each heat treatment part, Abnormal material properties such as strength and elongation can be grasped.

以下、本発明を適用した具体的な実施の形態について図面を参照しながら詳細に説明する。   Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings.

「第1の実施形態」
図1は第1の実施形態の熱処理装置を示す図である。熱処理装置は、熱処理がなされる被熱処理部品である熱処理部品1を搭載させる熱処理パレット2と、熱処理パレット2毎炉内に投入させる熱処理炉3と、熱処理炉3内に設けられた加熱手段である加熱ヒータ4と、熱処理部品1の温度を直接計測する温度検出手段である温度センサー5と、温度センサー5で検出された温度に基づいて加熱ヒータ4による加熱温度を制御する温度制御手段である温度制御装置(温度調節器)6と、を備えて構成されている。
“First Embodiment”
FIG. 1 is a diagram showing a heat treatment apparatus according to the first embodiment. The heat treatment apparatus is a heat treatment pallet 2 on which a heat treatment component 1 that is a heat treated component to be heat treated is mounted, a heat treatment furnace 3 to be put into each furnace of the heat treatment pallet 2, and a heating means provided in the heat treatment furnace 3. The heater 4, the temperature sensor 5 that is a temperature detection unit that directly measures the temperature of the heat treatment component 1, and the temperature that is a temperature control unit that controls the heating temperature by the heater 4 based on the temperature detected by the temperature sensor 5. And a control device (temperature controller) 6.

熱処理部品1は、例えば自動車部品であるアルミニウム合金などからなる金属部品や鋳造部品とされる。ここでは、熱処理部品1の一例を例示しただけで、前記した部品以外のものであっても構わない。   The heat-treated part 1 is a metal part or cast part made of, for example, an aluminum alloy that is an automobile part. Here, only an example of the heat-treated component 1 is illustrated, and other components than those described above may be used.

熱処理パレット2は、複数個の熱処理部品1を載せる役目をするもので、熱処理炉3内にパレット毎投入される。この熱処理パレット2に搭載された熱処理部品1は、熱処理炉3内の底面に設けられた処理品サポート台7によって支えられている。この実施形態では、熱処理部品1に形成された断面円弧状をなす凹部1Aに嵌合してこの熱処理部品1を支える支え部8を、前記処理品サポート台7に設けている。   The heat treatment pallet 2 serves to place a plurality of heat treatment components 1 and is put into the heat treatment furnace 3 for each pallet. The heat treatment component 1 mounted on the heat treatment pallet 2 is supported by a treatment product support base 7 provided on the bottom surface in the heat treatment furnace 3. In this embodiment, the treated product support base 7 is provided with a support portion 8 that fits into the recessed portion 1 </ b> A having a circular arc shape formed in the heat treated component 1 and supports the heat treated component 1.

熱処理炉3には、加熱ヒータ4と、炉内にエアーを供給して焼き入れを行うために使用するファン9と、が設けられている。加熱ヒータ4は、熱処理炉3の内壁面に設けられており、温度制御装置6により温度制御される。ファン9は、熱処理炉3の天井部に設けられており、熱処理部品1にエアーを吹き付けて焼き入れするのに使用される。   The heat treatment furnace 3 is provided with a heater 4 and a fan 9 used for quenching by supplying air into the furnace. The heater 4 is provided on the inner wall surface of the heat treatment furnace 3 and is temperature-controlled by the temperature control device 6. The fan 9 is provided on the ceiling portion of the heat treatment furnace 3 and is used for quenching by blowing air to the heat treatment component 1.

温度センサー5は、例えば熱電対からなる。かかる温度センサー5は、前記支え部8の先端に設けられており、熱処理部品1の凹部1Aに直接接触するようになっている。この温度センサー5で計測された熱処理部品1の温度は、温度制御装置6に逐次送られる。   The temperature sensor 5 is composed of, for example, a thermocouple. The temperature sensor 5 is provided at the tip of the support portion 8 and is in direct contact with the concave portion 1A of the heat treatment component 1. The temperature of the heat-treated component 1 measured by the temperature sensor 5 is sequentially sent to the temperature control device 6.

温度制御装置6は、前記温度センサー5で熱処理部品1の温度を直接計測した部品温度を計測し、その部品温度を履歴として記憶する。そして、この温度制御装置6は、その熱処理部品1の計測した温度データを基にして加熱ヒータ4を制御し温度制御する。   The temperature control device 6 measures the component temperature obtained by directly measuring the temperature of the heat-treated component 1 by the temperature sensor 5, and stores the component temperature as a history. The temperature control device 6 controls the temperature by controlling the heater 4 based on the temperature data measured by the heat treatment component 1.

次に、上記構成の熱処理装置を使用した熱処理方法について説明する。   Next, a heat treatment method using the heat treatment apparatus having the above configuration will be described.

先ず、加熱ヒータ4を作動させて熱処理炉3を所定の処理温度に昇温させる。そして、熱処理炉3内の温度が所定の処理温度となった時点で、複数個の熱処理部品1を搭載した熱処理パレット2を熱処理炉3内に投入する。熱処理部品1は、処理品サポート台7に設けられた支え部8にその凹部1Aを嵌合させて支持されると共に、この支え部8の先端に設けられた温度センサー5と接触する。   First, the heater 4 is operated to raise the temperature of the heat treatment furnace 3 to a predetermined processing temperature. Then, when the temperature in the heat treatment furnace 3 reaches a predetermined treatment temperature, the heat treatment pallet 2 on which a plurality of heat treatment components 1 are mounted is put into the heat treatment furnace 3. The heat treatment component 1 is supported by fitting the concave portion 1 </ b> A to a support portion 8 provided on the processed product support base 7, and contacts the temperature sensor 5 provided at the tip of the support portion 8.

熱処理部品1が熱処理炉3内に投入されると、一時的に炉内の雰囲気温度は低下する。このときの熱処理部品1の温度は、温度センサー5で計測され、温度制御装置6へと送られる。温度制御装置6では、温度センサー5で計測した熱処理部品1の製品温度を基に適正な熱処理温度となるように加熱ヒータ4を制御して加熱指示する。これにより、熱処理炉3内は、適正な処理温度に保たれる。   When the heat treatment component 1 is put into the heat treatment furnace 3, the atmospheric temperature in the furnace temporarily decreases. The temperature of the heat treatment component 1 at this time is measured by the temperature sensor 5 and sent to the temperature control device 6. The temperature control device 6 instructs the heating by controlling the heater 4 so as to obtain an appropriate heat treatment temperature based on the product temperature of the heat treatment component 1 measured by the temperature sensor 5. Thereby, the inside of the heat treatment furnace 3 is maintained at an appropriate processing temperature.

温度センサー5は、熱処理を行っている最中は逐次、熱処理部品1の温度を計測している。そして、温度制御装置6は、その製品温度を記憶して温度履歴をとる。   The temperature sensor 5 sequentially measures the temperature of the heat-treated component 1 during the heat treatment. And the temperature control apparatus 6 memorize | stores the product temperature, and takes a temperature history.

熱処理作業者は、熱処理部品1そのものの正確な温度を前記温度履歴で確認しながらこの温度履歴に基づいて熱処理の可否を判断する。例えば、温度履歴を確認して熱処理温度が所定値から大幅に外れていた場合、このロットには異常(強度や伸びなどの材質特性に製品異常)があるか否かを判断する。異常があれば、この熱処理パレット2に搭載された熱処理部品1だけを検査する。つまり、連続して熱処理した複数のロットの熱処理部品1を多数検査する手間が省ける。   The heat treatment operator determines whether or not heat treatment can be performed based on the temperature history while confirming the accurate temperature of the heat treatment component 1 itself with the temperature history. For example, when the temperature history is confirmed and the heat treatment temperature is significantly deviated from a predetermined value, it is determined whether or not the lot has an abnormality (product abnormality in material properties such as strength and elongation). If there is an abnormality, only the heat treatment component 1 mounted on the heat treatment pallet 2 is inspected. That is, it is possible to save labor for inspecting a plurality of heat-treated parts 1 of a plurality of lots that have been continuously heat-treated.

「第2の実施形態」
図2は第2の実施形態の熱処理装置を示し、図3はダミー試料の要部拡大断面図である。
“Second Embodiment”
FIG. 2 shows a heat treatment apparatus according to the second embodiment, and FIG. 3 is an enlarged cross-sectional view of a main part of a dummy sample.

この熱処理装置は、第1の実施形態の熱処理装置と基本的な構成は同一であるが、熱処理部品1と同等の特性を有したダミー試料の温度を計測する点が相違する。以下、重複構成部位の説明は省略し、相違点のみ説明するものとする。   This heat treatment apparatus has the same basic configuration as the heat treatment apparatus of the first embodiment, but differs in that the temperature of a dummy sample having the same characteristics as the heat treatment component 1 is measured. Hereinafter, the description of the overlapping components will be omitted, and only the differences will be described.

この熱処理装置では、第1の実施形態で処理品サポート台7に設けた支え部8を無くし、熱処理部品1をその処理品サポート台7の上に直接置く。そして、熱処理パレット2には、ダミー試料10を設ける。   In this heat treatment apparatus, the support portion 8 provided on the processed product support base 7 in the first embodiment is eliminated, and the heat treated component 1 is directly placed on the processed product support base 7. A dummy sample 10 is provided on the heat treatment pallet 2.

ダミー試料10は、熱処理部品1と同等の材料特性を有している。このダミー試料10には、圧縮空気などの冷却媒体が流れる冷却回路11と、温度調節用のフィン12と、温度センサー5と、が設けられている。   The dummy sample 10 has material characteristics equivalent to those of the heat-treated component 1. The dummy sample 10 is provided with a cooling circuit 11 through which a cooling medium such as compressed air flows, a fin 12 for temperature adjustment, and a temperature sensor 5.

冷却回路11は、ダミー試料10内に冷却媒体が循環するように内部空間通路として形成されている。この冷却回路11の出口には、ダミー試料10と冷却媒体圧送機13とを連結させるコネクタ14が設けられている。なお、冷却媒体圧送機13は、熱処理炉3の外に配置される。   The cooling circuit 11 is formed as an internal space passage so that the cooling medium circulates in the dummy sample 10. A connector 14 for connecting the dummy sample 10 and the cooling medium pump 13 is provided at the outlet of the cooling circuit 11. Note that the cooling medium pump 13 is disposed outside the heat treatment furnace 3.

フィン12は、ダミー試料10の外周面に設けられており、温度調節を効率良くする。   The fins 12 are provided on the outer peripheral surface of the dummy sample 10 and make temperature adjustment efficient.

温度センサー5は、ダミー試料10のほぼ中心部に設けられており、当該ダミー試料10の温度を検出する。   The temperature sensor 5 is provided almost at the center of the dummy sample 10 and detects the temperature of the dummy sample 10.

次に、上記構成の熱処理装置を使用した熱処理方法について説明する。図4は、第2の実施形態の熱処理方法のフローチャートである。先ず、ステップS1の処理で事前準備をする。すなわち、事前トライアルにて熱処理部品1に温度センサーを取り付け、品質が良好となる熱処理条件(温度履歴)を記憶する。そして、この結果から昇温及び降温曲線を図5に示すように作成する。   Next, a heat treatment method using the heat treatment apparatus having the above configuration will be described. FIG. 4 is a flowchart of the heat treatment method according to the second embodiment. First, preparations are made in advance in the process of step S1. That is, a temperature sensor is attached to the heat-treated component 1 in a preliminary trial, and heat treatment conditions (temperature history) that improve the quality are stored. And from this result, the temperature rise and temperature fall curves are created as shown in FIG.

図5中、液体処理とあるのは、凝固時に晶出した非平衡相を高温で固溶化させ、その後水冷することによって常温で組成が均一な固溶体を得る熱処理であり、エアー焼き入れとあるのは、ファン9を回転させて熱処理部品1を冷却する焼き入れ処理であり、時効処理とあるのは、比較的低い温度を保持させて中間析出相による析出硬化を起こさせる処理である。   In FIG. 5, the liquid treatment is a heat treatment in which a non-equilibrium phase crystallized during solidification is solidified at a high temperature and then cooled with water to obtain a solid solution having a uniform composition at room temperature, which is air quenching. Is a quenching process in which the heat treatment component 1 is cooled by rotating the fan 9, and the aging process is a process in which a relatively low temperature is maintained and precipitation hardening is caused by an intermediate precipitation phase.

そして、記録した温度条件と同等の温度特性がとれるダミー試料10を作製する。   Then, a dummy sample 10 having a temperature characteristic equivalent to the recorded temperature condition is produced.

次に、ステップS2の熱処理を実施する。この熱処理工程では、重複する工程説明は省略するものとし、第1の実施形態と異なる工程のみを説明する。熱処理パレット2に複数個の熱処理部品1を搭載した他に、ダミー試料10も搭載する。熱処理時には、ダミー試料10の温度を温度センサー5で計測し、その計測した温度データを温度制御装置6が加熱ヒータ4にフィードバックして、炉内雰囲気温度を調整する。ステップS3の処理では、熱処理の可否判断を行う。温度制御装置6で記憶したダミー試料10の温度履歴を見て熱処理の可否判断を行う。   Next, the heat treatment in step S2 is performed. In this heat treatment process, the overlapping process description is omitted, and only the process different from the first embodiment will be described. In addition to mounting a plurality of heat treatment components 1 on the heat treatment pallet 2, a dummy sample 10 is also mounted. At the time of heat treatment, the temperature of the dummy sample 10 is measured by the temperature sensor 5, and the temperature control device 6 feeds back the measured temperature data to the heater 4 to adjust the furnace atmosphere temperature. In step S3, it is determined whether heat treatment is possible. Whether or not heat treatment is possible is determined by looking at the temperature history of the dummy sample 10 stored in the temperature control device 6.

第2の実施形態では、熱処理部品1と同等の特性(昇温及び降温特性など)を有したダミー試料10の温度を計測しているので、熱処理部品1の温度を直接計測したのと同様に、熱処理部品そのものの正確な温度を管理することができる。したがって、この熱処理方法及び熱処理装置によれば、強度や伸びなどの材質特性に製品異常があった場合、熱処理パレット2に搭載された熱処理部品1だけを検査するだけで済み、複数のロットの熱処理部品1を検査する手間を省くことができる。   In the second embodiment, the temperature of the dummy sample 10 having characteristics (such as temperature rise and temperature fall characteristics) equivalent to those of the heat treatment component 1 is measured, so that the temperature of the heat treatment component 1 is directly measured. The exact temperature of the heat-treated component itself can be managed. Therefore, according to this heat treatment method and heat treatment apparatus, when there is a product abnormality in material properties such as strength and elongation, only the heat treatment component 1 mounted on the heat treatment pallet 2 needs to be inspected. The trouble of inspecting the component 1 can be saved.

図1は第1の実施形態の熱処理装置を示す図である。FIG. 1 is a diagram showing a heat treatment apparatus according to the first embodiment. 図2は第2の実施形態の熱処理装置を示す図である。FIG. 2 is a view showing a heat treatment apparatus according to the second embodiment. 図3はダミー試料の要部拡大断面図である。FIG. 3 is an enlarged cross-sectional view of the main part of the dummy sample. 図4は第2の実施形態の熱処理方法のフローチャートである。FIG. 4 is a flowchart of the heat treatment method of the second embodiment. 図5は熱処理前の事前トライアルで求めた温度曲線を示す図である。FIG. 5 is a diagram showing a temperature curve obtained by a preliminary trial before heat treatment.

符号の説明Explanation of symbols

1…熱処理部品
2…熱処理パレット
3…熱処理炉
4…加熱ヒータ(加熱手段)
5…温度センサー(温度検出手段)
6…温度制御装置(温度制御手段)
7…処理品サポート台
8…支え部
10…ダミー試料
11…冷却回路
12…フィン
13…冷却媒体圧送機
DESCRIPTION OF SYMBOLS 1 ... Heat processing part 2 ... Heat processing pallet 3 ... Heat processing furnace 4 ... Heater (heating means)
5. Temperature sensor (temperature detection means)
6 ... Temperature control device (temperature control means)
7 ... Processed product support stand 8 ... Supporting part 10 ... Dummy sample 11 ... Cooling circuit 12 ... Fin 13 ... Cooling medium pump

Claims (4)

熱処理部品を搭載した熱処理パレットを熱処理炉内に投入し、熱処理温度を調節しながら加熱して熱処理部品を熱処理する熱処理方法において、
前記熱処理部品の温度を直接計測するか、或いは、熱処理部品と同等の特性を有したダミー試料の温度を計測し、その計測した温度データを基にして温度調整を行う
ことを特徴とする熱処理方法。
In a heat treatment method in which a heat treatment pallet loaded with heat treatment parts is put into a heat treatment furnace and heated while adjusting the heat treatment temperature, the heat treatment parts are heat treated.
A heat treatment method characterized by directly measuring the temperature of the heat treated part or measuring the temperature of a dummy sample having characteristics equivalent to those of the heat treated part and adjusting the temperature based on the measured temperature data .
熱処理部品を搭載させる熱処理パレットと、
前記熱処理パレット毎炉内に投入させる熱処理炉と、
前記熱処理炉内に設けられた加熱手段と、
前記熱処理部品に接触してこの熱処理部品の温度を直接計測する温度検出手段と、
前記温度検出手段で検出された温度に基づいて前記加熱手段による加熱温度を制御する温度制御手段と、を備えた
ことを特徴とする熱処理装置。
A heat treatment pallet on which heat treatment parts are mounted;
A heat treatment furnace to be put into each furnace of the heat treatment pallet;
Heating means provided in the heat treatment furnace;
Temperature detecting means for directly measuring the temperature of the heat-treated component in contact with the heat-treated component;
And a temperature control means for controlling a heating temperature by the heating means based on the temperature detected by the temperature detection means.
熱処理部品を搭載させる熱処理パレットと、
前記熱処理パレット毎炉内に投入させる熱処理炉と、
前記熱処理炉内に設けられた加熱手段と、
前記熱処理パレットに搭載されると共に前記熱処理部品と同等の特性を有したダミー試料と、
前記ダミー試料の温度を計測する温度検出手段と、
前記温度検出手段で検出されたダミー試料の温度に基づいて前記加熱手段による加熱温度を制御する温度制御手段と、を備えた
ことを特徴とする熱処理装置。
A heat treatment pallet on which heat treatment parts are mounted;
A heat treatment furnace to be put into each furnace of the heat treatment pallet;
Heating means provided in the heat treatment furnace;
A dummy sample mounted on the heat treatment pallet and having the same characteristics as the heat treatment component;
Temperature detection means for measuring the temperature of the dummy sample;
And a temperature control means for controlling the heating temperature by the heating means based on the temperature of the dummy sample detected by the temperature detection means.
請求項3に記載の熱処理装置であって、
前記ダミー試料には、冷却媒体が流れる冷却回路と、温度調節用のフィンと、が設けられた
ことを特徴とする熱処理装置。
The heat treatment apparatus according to claim 3,
The dummy sample is provided with a cooling circuit through which a cooling medium flows and a fin for temperature adjustment.
JP2007203023A 2007-08-03 2007-08-03 Heat-treatment method and heat-treatment apparatus Pending JP2009035792A (en)

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Application Number Priority Date Filing Date Title
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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112012001031T5 (en) 2011-02-28 2013-11-28 Ihi Corporation Apparatus and method for measuring the temperature of a heat treated workpiece

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112012001031T5 (en) 2011-02-28 2013-11-28 Ihi Corporation Apparatus and method for measuring the temperature of a heat treated workpiece
US9377360B2 (en) 2011-02-28 2016-06-28 Ihi Corporation Device and method for measuring temperature of heat-treated workpiece

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