JP3122494U - Temperature control device - Google Patents
Temperature control device Download PDFInfo
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- JP3122494U JP3122494U JP2006002428U JP2006002428U JP3122494U JP 3122494 U JP3122494 U JP 3122494U JP 2006002428 U JP2006002428 U JP 2006002428U JP 2006002428 U JP2006002428 U JP 2006002428U JP 3122494 U JP3122494 U JP 3122494U
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Abstract
【課題】高精度に温度制御を行うとともに、制御性を高める。
【解決手段】チラー７では、温度制御対象装置１の目標温度よりも低い温度冷却液を送出し、温度制御対象装置１付近に取り付けたヒータ１０により、温度制御対象装置１のプレート部１ａの温度が一定になるように必要な分だけ冷却液を加熱する。チラー７から送出する冷却液の温度を、温度制御対象装置１の熱を十分冷却できる温度（目標温度より低い温度）にし、温度制御対象装置１近傍に設けたヒータ１０で、温度制御対象装置１のプレート部１ａの温度が一定になる温度に加熱する。チラー７単独で温度制御対象装置１の温度制御を行う場合に比べて、高精度な温度制御をヒータ１０で行える。
【選択図】図１Temperature control is performed with high accuracy and controllability is improved.
In a chiller 7, a temperature coolant lower than a target temperature of a temperature control target device 1 is sent out, and a temperature of a plate portion 1a of the temperature control target device 1 is detected by a heater 10 attached in the vicinity of the temperature control target device 1. The coolant is heated as much as necessary so that is constant. The temperature of the coolant sent from the chiller 7 is set to a temperature that can sufficiently cool the heat of the temperature control target device 1 (a temperature lower than the target temperature), and the heater 10 provided in the vicinity of the temperature control target device 1 The plate portion 1a is heated to a temperature at which the temperature is constant. Compared with the case where the temperature control of the temperature control target device 1 is performed by the chiller 7 alone, highly accurate temperature control can be performed by the heater 10.
[Selection] Figure 1
Description
本考案は、半導体製造装置などの製造装置の温度を一定に制御する機能を有する温度制御装置に関する。 The present invention relates to a temperature control device having a function of controlling a temperature of a manufacturing apparatus such as a semiconductor manufacturing apparatus to be constant.
従来から、例えば半導体製造装置などに一定温度の冷却液を供給するためにチラーを含む温度制御装置が採用されている。 2. Description of the Related Art Conventionally, a temperature control device including a chiller has been employed to supply a constant temperature coolant to, for example, a semiconductor manufacturing apparatus.
このような温度制御装置としては、種々提案されているが、温度制御対象から取り出した冷却液を再度所用温度まで冷却した後に温度制御を行いつつ温度制御対象に再供給するようにしている。温度制御には、ＰＩＤ制御などを行っており、温度を検出するためのセンサには白金測温体などの高精度のセンサを採用しているのが通例である。 As such a temperature control device, various proposals have been made. However, after cooling the coolant taken out from the temperature control target to the required temperature again, the temperature is controlled and then resupplied to the temperature control target. For temperature control, PID control or the like is performed, and a high-precision sensor such as a platinum temperature sensor is usually used as a sensor for detecting the temperature.
このような構成の温度制御装置を採用すれば、温度制御対象に供給される冷却液の温度を設定温度になるように制御することができるとされている。 If the temperature control device having such a configuration is employed, the temperature of the coolant supplied to the temperature control target can be controlled to be the set temperature.
しかしながら上述のような従来の温度制御装置では、応答性の良い温度制御を行うことが難しく、急激な負荷変動に対応できないことがあるという問題があった。 However, the conventional temperature control apparatus as described above has a problem that it is difficult to perform temperature control with good responsiveness and cannot cope with a sudden load fluctuation.
本考案はこのような従来の問題点にかんがみてなしたものである。 The present invention has been made in view of these conventional problems.
本考案の温度制御装置は、高精度に温度制御を行うことができるとともに、制御性を高めることができる。 The temperature control device of the present invention can perform temperature control with high accuracy and can improve controllability.
本考案の請求項１に係る温度制御装置は、前記目的を達成するために、温度制御対象装置を冷却液により冷却するための冷却手段、該冷却手段から冷却液を取り出して所定温度に冷却して送出するチラーを有する温度制御装置において、前記チラーの冷却液出口と前記冷却手段の冷却液入口の間に前記冷却液の加熱手段を配し、該冷却手段への前記冷却液の入口に温度センサを配し、該温度センサが検知した前記冷却液温度を元に前記加熱手段による前記冷却液の加熱を行うことを特徴とする。 In order to achieve the above object, a temperature control device according to claim 1 of the present invention is a cooling means for cooling a temperature control target device with a cooling liquid, and the cooling liquid is taken out from the cooling means and cooled to a predetermined temperature. In the temperature control device having a chiller for feeding out, the cooling liquid heating means is disposed between the cooling liquid outlet of the chiller and the cooling liquid inlet of the cooling means, and the temperature of the cooling liquid inlet to the cooling means is set. A sensor is provided, and the coolant is heated by the heating means based on the coolant temperature detected by the temperature sensor.
本考案の請求項２に係る温度制御装置は、請求項１の温度制御装置において、前記チラーから送出する冷却液の温度を前記温度制御対象装置を冷却するための目標温度より低くし、前記チラーから送出された冷却液を前記加熱手段で加熱して温度上昇させることを特徴とする。 A temperature control device according to a second aspect of the present invention is the temperature control device according to the first aspect, wherein the temperature of the coolant sent from the chiller is lower than a target temperature for cooling the temperature control target device, and the chiller The cooling liquid delivered from is heated by the heating means to raise the temperature.
本考案の請求項３に係る温度制御装置は、請求項１又は２の温度制御装置において、前記加熱手段を前記冷却手段への冷却液の入口近傍に配したことを特徴とする。 A temperature control device according to a third aspect of the present invention is the temperature control device according to the first or second aspect, characterized in that the heating means is disposed in the vicinity of an inlet of a coolant to the cooling means.
本考案の請求項４に係る温度制御装置は、請求項１から３のいずれかの温度制御装置において、前記加熱手段が複数のヒータを直列に備えることを特徴とする。 A temperature control apparatus according to a fourth aspect of the present invention is the temperature control apparatus according to any one of the first to third aspects, wherein the heating means includes a plurality of heaters in series.
本考案の請求項５に係る温度制御装置は、請求項１から４のいずれかの温度制御装置において、前記冷却手段の前記冷却液出口近傍に前記温度制御対象装置を冷却した後の冷却液の温度を検出する温度センサを配したことを特徴とする。 A temperature control device according to a fifth aspect of the present invention is the temperature control device according to any one of the first to fourth aspects, wherein the coolant after the temperature control target device is cooled in the vicinity of the coolant outlet of the cooling means. A temperature sensor for detecting the temperature is provided.
本考案の請求項６に係る温度制御装置は、請求項４または５の温度制御装置において、前記加熱手段への前記冷却液の入口と出口とに冷却液の温度を検出する温度センサを配したことを特徴とする。 The temperature control device according to claim 6 of the present invention is the temperature control device according to claim 4 or 5, wherein temperature sensors for detecting the temperature of the coolant are arranged at the inlet and the outlet of the coolant to the heating means. It is characterized by that.
以下、本考案を実施するための最良の形態を図面に示す実施例を参照して説明する。 The best mode for carrying out the present invention will be described below with reference to embodiments shown in the drawings.
図１は本考案の温度制御装置を示すブロック図である。図中１は半導体製造装置等の温度制御対象装置であり、例えばチャンバ２内でプラズマを図示しないＳｉ基板に照射する等の処理を行う装置である。このチャンバ２の底部には、チャンバ２内を一定温度に制御するための冷却部３を備えており、内部には冷却液を通す流路４を備えている。なお図中１ａは、温度制御対象装置を半導体製造装置とした場合に用いる処理対象物搭載用のプレート部を示している。 FIG. 1 is a block diagram showing a temperature control device of the present invention. In the figure, reference numeral 1 denotes a temperature control target apparatus such as a semiconductor manufacturing apparatus, for example, an apparatus that performs processing such as irradiating a Si substrate (not shown) in the chamber 2. A cooling unit 3 for controlling the inside of the chamber 2 to a constant temperature is provided at the bottom of the chamber 2, and a flow path 4 through which a cooling liquid is passed is provided. In addition, 1a in the figure has shown the plate part for process target object mounting used when a temperature control object apparatus is a semiconductor manufacturing apparatus.
なお上述の装置は半導体製造装置であればクリーンルーム内に備えられるので、いかに説明する諸装置とは階を異にする等の配置が採用される。 Since the above-described apparatus is provided in a clean room as long as it is a semiconductor manufacturing apparatus, an arrangement such as a different floor is adopted from various apparatuses described below.
冷却部３の出口に接続する配管５の冷却部３出口近傍には温度センサ６が設けてあり、検出した温度を配管５の先側に配したチラー７へ送出している。配管５のチラー７への入口には、やはり温度センサ８を配してある。ただし、この温度センサ８は設けなくても良い。 A temperature sensor 6 is provided in the vicinity of the outlet of the cooling unit 3 of the pipe 5 connected to the outlet of the cooling unit 3, and the detected temperature is sent to a chiller 7 disposed on the front side of the pipe 5. A temperature sensor 8 is also arranged at the inlet of the pipe 5 to the chiller 7. However, this temperature sensor 8 may not be provided.
チラー７には、例えば水冷式インバータで２馬力程度のものなど種々のものを用いるが、もちろん制御対象である温度制御対象装置１の仕様に合わせたものを採用する。 As the chiller 7, for example, various types such as a water-cooled inverter having about 2 horsepower are used. Of course, a chiller 7 adapted to the specification of the temperature control target device 1 that is a control target is adopted.
このチラーから冷却液を送出する配管９の冷却液出口と冷却部３の冷却液入口の間には、冷却液の加熱手段となるヒータ１０を配してある。このヒータ１０は、２個のヒータ１０ａ、１０ｂを直列に配設して備えている。またチラー７側のヒータ１０ａへの冷却液の入口と、冷却部３側の出口とにそれぞれ温度センサ１１、１２を配し、これら温度センサ１１、１２が検知した冷却液温度を元にヒータ１０ａ、１０ｂによる冷却液の加熱制御を行って最適温度の冷却液を冷却部３へ供給できるようにしてある。なお本考案ではヒータ１０ａ、１０ｂの個数、配置形態は図示の例には限定されない。 Between the cooling liquid outlet of the pipe 9 for sending the cooling liquid from the chiller and the cooling liquid inlet of the cooling unit 3, a heater 10 serving as a heating means for the cooling liquid is disposed. The heater 10 includes two heaters 10a and 10b arranged in series. Further, temperature sensors 11 and 12 are respectively arranged at the inlet of the coolant to the heater 10a on the chiller 7 side and the outlet on the side of the cooling unit 3, and the heater 10a is based on the coolant temperature detected by the temperature sensors 11 and 12. The cooling liquid is controlled to be heated by 10b so that the cooling liquid having the optimum temperature can be supplied to the cooling unit 3. In the present invention, the number and arrangement of the heaters 10a and 10b are not limited to the illustrated example.
本実施例の制御方法の特徴について説明する。
まずチラー７では、温度制御対象装置１の目標温度よりも低い温度（具体的には適宜実験等により定めればよい）の冷却液を送出し、温度制御対象装置１付近に取り付けたヒータ１０により、温度制御対象装置１のプレート部１ａの温度が一定になるように必要な分だけ冷却液を加熱する。具体的な温度と加熱料は実験等により決定すれば良い。
The features of the control method of this embodiment will be described.
First, in the chiller 7, a coolant having a temperature lower than the target temperature of the temperature control target device 1 (specifically, it may be determined appropriately by experiment or the like) is sent out, and the heater 10 attached in the vicinity of the temperature control target device 1 is used. The coolant is heated by a necessary amount so that the temperature of the plate portion 1a of the temperature control target device 1 becomes constant. The specific temperature and heating fee may be determined by experiments or the like.
そして、チラー７から送出する冷却液の温度を、温度制御対象装置１の熱を十分冷却できる温度（目標温度より低い温度）にし、温度制御対象装置１近傍に設けたヒータ１０で、温度制御対象装置１のプレート部１ａの温度が一定になる温度に加熱する。 Then, the temperature of the coolant delivered from the chiller 7 is set to a temperature that can sufficiently cool the heat of the temperature control target device 1 (a temperature lower than the target temperature), and the temperature control target is set by the heater 10 provided near the temperature control target device 1. The temperature of the plate part 1a of the apparatus 1 is heated to a constant temperature.
チラー７単独で温度制御対象装置１の温度制御を行う場合に比べて、高精度な温度制御をヒータ１０で行えるため、温度制御対象装置１の温度変化に迅速に対応できるシステムとなる。 Compared with the case where the temperature control of the temperature control target apparatus 1 is performed by the chiller 7 alone, the heater 10 can perform the temperature control with high accuracy, so that the system can quickly cope with the temperature change of the temperature control target apparatus 1.
もちろん、温度センサ１１、１２の検出値はチラー７側へフィードバックし、またチラー７の図示せぬ制御装置（一般的なマイコン等を使用可能である）からはヒータ１０ａ、１０ｂを制御するための制御信号が給電器１３へ送られ、ヒータ１０ａ、１０ｂのオン、オフを制御する。なお図中１４はブレーカである。 Of course, the detected values of the temperature sensors 11 and 12 are fed back to the chiller 7 side, and a control device (not shown) of the chiller 7 (a general microcomputer or the like can be used) is used to control the heaters 10a and 10b. A control signal is sent to the power feeder 13 to control on and off of the heaters 10a and 10b. In the figure, 14 is a breaker.
またなお、図では冷却液の循環ポンプ、駆動モータ等の図示は省略してある。 In addition, illustration of a circulating pump for cooling liquid, a drive motor, etc. is omitted in the figure.
１ 温度制御対象装置
１ａ 処理対象物搭載用のプレート部
２ チャンバ
３ 冷却部
４ 流路
５ 配管
６ 温度センサ
７ チラー
８ 温度センサ
９ 配管
１０、１０ａ、１０ｂ ヒータ
１１、１２ 温度センサ
１３ 給電器
１４ ブレーカ
DESCRIPTION OF SYMBOLS 1 Temperature control object apparatus 1a Plate part for process target object mounting 2 Chamber 3 Cooling part 4 Flow path 5 Piping 6 Temperature sensor 7 Chiller 8 Temperature sensor 9 Piping 10, 10a, 10b Heater 11, 12 Temperature sensor 13 Feeder 14 Breaker
Claims (6)
6. The temperature control apparatus according to claim 4, wherein a temperature sensor for detecting a temperature of the coolant is arranged at an inlet and an outlet of the coolant to the heating unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006002428U JP3122494U (en) | 2006-04-03 | 2006-04-03 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006002428U JP3122494U (en) | 2006-04-03 | 2006-04-03 | Temperature control device |
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| Publication Number | Publication Date |
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| JP3122494U true JP3122494U (en) | 2006-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2006002428U Expired - Lifetime JP3122494U (en) | 2006-04-03 | 2006-04-03 | Temperature control device |
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| Country | Link |
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| JP (1) | JP3122494U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016023831A (en) * | 2014-07-17 | 2016-02-08 | ダイキン工業株式会社 | Temperature adjustment device |
-
2006
- 2006-04-03 JP JP2006002428U patent/JP3122494U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016023831A (en) * | 2014-07-17 | 2016-02-08 | ダイキン工業株式会社 | Temperature adjustment device |
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