JP2009148843A - Sheet-like component manufacturing device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet-like component manufacturing device dispensing with manual work for removing chips (removal of the chips), preventing damage on products (sheet-like components) caused by the manual work and preventing the lowering of the manufacturing efficiency. <P>SOLUTION: This sheet-like component manufacturing device superposes a material 106 on two layers of a material 102 and a material 104 which are fed from a first roller 12 and pass a conveyor 14, makes a cut therein by a cutting machine 20, conveys them to a first chip removal machine 22 and remove parts corresponding to through-holes as the chips. Sequentially, this device conveys them to a second chip removal device 42 to remove the unnecessary parts other than the parts corresponding to the through-holes as the chips. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a thin plate component manufacturing apparatus and a thin plate component manufacturing method for manufacturing a thin plate component in which two or three or more thin plates (or thin layers) are stacked.

  Techniques for punching a part of a thin plate material (a waste portion that becomes a waste residue) to form holes and the like are known in various industrial fields. Although the punched part is removed, a method of removing the part by knocking it off is known as this removal method (see, for example, Patent Document 1). Further, as a method for removing the residue, a method of removing the residue by pressing the residue from above is also known (see, for example, Patent Document 2).

Since the remaining portion from which the residue is removed becomes a product, any of the above-described removal methods may damage the product. Therefore, in order to prevent damage to the product, the waste portion may be manually removed.
Japanese Patent Laid-Open No. 11-267999 JP 2007-276037 A

  When removing the debris portion manually, the work efficiency is very poor when there are a plurality of debris portions. In addition, the product may be damaged even by manual work. In addition, in the case of a product in which two thin plates are adhered (or slightly adhered), there is a possibility that the two thin plates may be displaced when the waste portion is manually removed.

  In view of the above circumstances, the present invention eliminates the need for manual scrap removal (removal of the scrap portion), and is a thin plate that can prevent damage to products (thin plate-like parts) caused by manual work and decrease in production efficiency. An object of the present invention is to provide a component manufacturing apparatus and a thin plate component manufacturing method.

In order to achieve the above object, a thin plate-like component manufacturing apparatus according to the present invention includes a single lower layer thin plate in which a plurality of through holes are formed at a predetermined interval, and a single lower layer thin plate that is stacked at a predetermined interval. In the thin plate component manufacturing apparatus for manufacturing a thin plate component composed of a plurality of upper thin plates each formed with a through hole corresponding to the through hole,
(1) a laminating machine that superimposes a sheet for cutting underlay on the lower surface of two overlapping thin plates that are materials of the lower layer thin plate and the upper layer thin plate;
(2) A first cut is formed in a portion corresponding to the edge of the through hole in the two overlapping thin plates from the surface of the upper thin plate to the middle of the cutting underlay thin plate, and the two sheets A cutting machine for forming a second cut from the surface of the upper thin plate to the middle of the lower thin plate in a portion corresponding to the edge of the upper thin plate among the overlapping thin plates,
(3) After forming the first and second cuts with the cutting machine, separating the thin sheet for cutting underlay from the two overlapping thin plates, the through hole of the two overlapping thin plates A first scraper that removes a portion corresponding to
(4) After removing the portion corresponding to the through-hole with the first scraper, the two sheets overlap while applying tension to the thin sheet corresponding to the lower layer thin sheet among the two overlapping thin sheets. And a second scraper that winds and removes portions other than the upper thin plate and the lower thin plate among the thin plates.

here,
(5) The first waste removing machine includes a suction device that contacts the lower surface of the two overlapping thin plates and sucks and removes a portion corresponding to the through hole in the two overlapping thin plates. It may be.

further,
(6) The suction device may have an adjustment hole for adjusting the suction force.

Furthermore,
(7) The cut underlay thin plate separated when the portion corresponding to the through hole is removed by the first scraper is superposed on the lower surface of the lower layer thin plate after removing the portion corresponding to the through hole. A re-lamination machine may be provided.

In addition, a method for manufacturing a thin plate-like component according to the present invention for achieving the above-described object includes a single lower layer thin plate in which a plurality of through holes are formed at a predetermined interval, and a single lower layer thin plate that is stacked at a predetermined interval. In the thin plate-like component manufacturing method for manufacturing a thin plate-like component comprising a plurality of upper layer thin plates each formed with a through hole corresponding to the through hole,
(8) A long work piece consisting of two overlapping thin plates that are the material of the lower layer thin plate and the upper layer thin plate, and a thin sheet for cutting underlay stacked on the lower surface of the thin plate is conveyed in a predetermined conveying direction. while doing,
(9) A first cut is formed from the surface of the upper thin plate to the middle of the thin sheet for cutting underlay in a portion corresponding to the edge of the through hole in the two overlapping thin plates, and the two sheets Forming a second cut from the surface of the upper thin plate to the middle of the lower thin plate in a portion corresponding to the edge of the upper thin plate of the overlapping thin plates,
(10) While separating the sheet for cutting underlay from the two overlapping thin plates, a portion corresponding to the through hole is removed from the two overlapping thin plates;
(11) Winding and removing portions other than the upper thin plate and the lower thin plate of the two overlapping thin plates while applying tension to the thin plate corresponding to the lower thin plate of the two overlapping thin plates. It is characterized by this.

here,
(12) When removing a portion corresponding to the through hole from the two overlapping thin plates, the suction plate is in contact with the lower surface of the two overlapping thin plates and corresponds to the through hole. The part may be removed by suction.

further,
(13) The cut underlay thin plate separated when the portion corresponding to the through hole is removed may be overlapped again on the lower surface of the lower layer thin plate after removing the portion corresponding to the through hole.

Furthermore,
(14) The thin plate-like component is composed of three or more thin plates, and the adhesive force between the layers may be weaker as the upper layer.

  The thin plate referred to in the present invention is a concept including not only a thin plate made of a resin but also a thin layer (thin layer) made of an adhesive. The term “thin” means within a range of about 0.01 mm to about 0.50 mm, but may be outside this range.

  According to the present invention, since the portion that becomes a residue (the portion corresponding to the through hole and the portion other than the upper thin plate among the thin plates on the two overlapping thin plates) is removed by the first and second waste removing machines, There is no need to manually remove scraps, and it is possible to prevent damage to products (thin plate-like parts) due to manual work and a decrease in production efficiency.

  INDUSTRIAL APPLICABILITY The present invention is realized in a thin plate-shaped component manufacturing apparatus that manufactures a thin plate-shaped component made of PET (polyethylene terephthalate) and having a substantially square thin plate (a thin layer made of a thermosetting adhesive) attached to a rectangular base liner. It was.

  With reference to FIGS. 1-6, the state of the thin plate-shaped component manufacturing apparatus of this invention and the workpiece (raw material) in each manufacturing process is demonstrated.

  FIG. 1 is a side view showing an example of a thin plate component manufacturing apparatus of the present invention. FIG. 2 is a perspective view showing a schematic configuration of a first scraper that removes a portion corresponding to the through hole. FIG. 3 is a perspective view showing a schematic configuration of a second scraper that removes unnecessary portions from the material. 4A is a plan view showing the state of the workpiece at the position “A” in FIG. 1, FIG. 4B is a cross-sectional view along line aa in FIG. 1A, and FIG. It is a top view which shows the state of the workpiece in the position of "B", (d) is bb sectional drawing of (c), (e) is the workpiece in the position of "C" of FIG. It is a top view which shows the state of this, (f) is cc sectional drawing of (e). 5A is a plan view showing the state of the workpiece at the position “D” in FIG. 1, FIG. 5B is a sectional view taken along the line dd in FIG. 1A, and FIG. It is a top view which shows the state of the workpiece in the position of "E", (d) is ee sectional drawing of (c), (e) is the workpiece in the position of "F" of FIG. It is a top view which shows the state of this, (f) is ff sectional drawing of (e). 6A is a plan view showing the state of the workpiece at the position “G” in FIG. 1, FIG. 6B is a sectional view taken along the line gg of FIG. 1A, and FIG. It is a top view which shows the state of the workpiece in the position of "H", (d) is hh sectional drawing of (c), (e) was loaded in the position of "I" of FIG. It is a top view which shows one product, (f) is ii sectional drawing of (e). In these drawings, the size (length) in the plan view and the size in the cross-sectional view do not coincide with each other for easy viewing, and the width and thickness of the workpiece are different from actual ones.

  As shown in FIGS. 6 (e) and 6 (f), the thin plate component manufacturing apparatus 10 has four substantially upper (approximately) square upper thin plates 112 stacked at equal intervals on a rectangular lower thin plate 114 (attached). And an apparatus for manufacturing a thin plate-like component 100 (product) in which a through hole 100a is formed in the central portion of each upper thin plate 112 and the lower thin plate 114 therebelow. In the thin plate component manufacturing apparatus 10, each material is sent in the directions of arrows D1 to D8 for each material. In this thin plate component manufacturing apparatus 10, the material 102 (see FIG. 4 and the like) that becomes the upper layer thin plate 112, the material 104 that becomes the lower layer thin plate 114, and the material 106 that becomes the underlay when cutting (the thin plate for cutting underlay according to the present invention) 3 types of materials are used. The material 102 is a layer made of a thermosetting adhesive, and the material 104 is attached to the back surface thereof by semi-curing the material 102. The material 102 may be, for example, a hot melt adhesive, a silicon adhesive, a pressure sensitive adhesive, a self-adsorption adhesive, or an acrylic adhesive. The thin plate-like material 106 serves as an underlay when the materials 102 and 104 are cut to form cuts. The material 104 and the material 106 are made of PET (polyethylene terephthalate). For example, PE (polyethylene), PP (polypropylene), PS (polystyrene), PPS (polyphenylene sulfide), or PC (polycarbonate) may be used instead of PET. Moreover, the thickness of the upper layer thin plate 102 is about 0.010 to 0.300 mm, the thickness of the lower layer thin plate 104 is about 0.025 to 0.188 mm, and the thickness of the material 106 for the underlay is It is about 0.025 to 0.188 mm.

  The two-layer material in which the material 102 and the material 104 are in close contact with each other is wound around the first roller 12 in a roll shape, and is sent out (conveyed) in the direction of the arrow D1 by the conveying device 14. As shown in FIGS. 4A and 4B, the material 102 and the material 104 immediately after being sent out from the first roller 12 and passing through the transporter 14 are in a state in which two thin plates of the same size overlap each other. (State at position A in FIG. 1). A second roller 16 around which the material 106 is wound is disposed downstream of the transport device 14 in the feeding direction (arrow D1 direction). As shown in FIGS. 4C and 4D, the material 106 is a thin plate having the same size as the materials 102 and 104 (the state at position B in FIG. 1). The material 106 fed from the second roller 16 in the direction of the arrow D3 is brought into close contact with the back surface (lower surface) of the material 104 by the laminating machine 18. The material immediately after passing through the laminating machine 18 is a thin plate-like workpiece having three layers of the material 102, the material 104, and the material 106 in this order from the top. The three-layer thin plate-shaped workpiece is sent to the cutting machine 20.

  In the cutting machine 20, a cut is formed in a three-layer workpiece by a cutting blade (not shown). There are two types of cuts, and as shown in FIGS. 4 (e) and 4 (f) (state of position C in FIG. 1), the cuts for through-holes corresponding to the edges corresponding to the edges of the through-holes 100a of the thin plate-like component 100 20a, and a cut 20c for an upper thin plate edge corresponding to a portion corresponding to the edge of the upper thin plate 112 of the thin plate-like component 100. The cut 20a is an example of a first cut referred to in the present invention, and the cut 20c is an example of a second cut referred to in the present invention. Each of the cuts 20a and 20c is formed by cutting from the surface of the material 102 (from above) with a cutting blade. Here, when viewed in a plan view as shown in FIG. 4 (e), the cut 20a and the cut 20c are substantially square, and depending on the shape of the thin plate-like component 100 (depending on the purpose of the product), a circle or an ellipse. Various shapes such as shapes and polygons are conceivable.

  As shown in FIG. 4 (f), the cut 20 a is formed from the surface of the material 102 to the middle of the material 106, and the cut 20 c is formed from the surface of the material 102 to the middle of the material 104. Of the materials 102 and 104, a portion (inner region) surrounded by a square cut 20a becomes a residue, and a portion (region) surrounded by the cut 20a as shown in FIGS. 5B and 6F. ) Becomes the through hole 100 a of the thin plate-like component 100. Of the material 102, a portion surrounded by the cut 20a and the cut 20c (a portion outside the cut 20a and inside the cut 20c) is not a scum and is an upper layer thin plate 112 (see FIG. 6 (f)), and the lower layer thin plate 114 is present on the back surface of the upper layer thin plate 112. The portion of the material 102 outside the cut 20c is a portion where there is no upper layer thin plate 112 but only the lower layer thin plate 114.

  The three layers of materials 102, 104, and 106 (materials to be processed) on which the cuts 20a and 20c are formed as described above are conveyed to the first waste removal machine 22 that removes the portion surrounded by the cut 20a (feeding). ). The first scraper 22 is arranged in a region indicated by a two-dot chain line 22 in FIG. 1, and the material 106 is separated (separated) from the other materials 102 and 104, and the cut 20 a of the materials 102 and 104 is separated. The part surrounded by is removed. As shown in FIG. 2, the material 106 is separated from the three layers of materials 102, 104, and 106 that have passed through the cutting machine 20 after passing through the first separation roller 24. In order to separate the material 106 in this way, the second separation roller 26 is disposed almost directly below the first separation roller 24, and the third separation roller 28 is disposed substantially parallel to the second separation roller 26. , Only the material 106 passes through the second separation roller 26 and the third separation roller 28 (conveyed in the direction of arrow E1, arrow E2, and arrow E3). As a result, the material 106 that has passed through the first separation roller 24 is sent almost directly below to reach the second separation roller 26, and thereafter, the material 106 is sent below the materials 102 and 104 substantially in parallel to the third separation roller 26. The roller 28 is reached.

  Above the third separation roller 28 (almost directly above), there is a re-stacking roller 30 for re-stacking the separated materials 106 on the back surface of the material 104 and re-stacking the materials 102, 104, 106 into three layers. Has been placed. The materials 102 and 104 separated from the material 106 pass through the first separation roller 24, then pass through a suction box 34 to be described later, and reach the re-stack roller 30 from the upstream side in the direction of arrow D4. On the other hand, the material 106 separated after passing through the first separation roller 24 is sent in the direction of the arrow E1 (direction orthogonal to the direction of the arrow D4), and the feed direction is changed by the second separation roller 26 to change the direction of the arrow E2 (arrow In the direction substantially parallel to the direction D4), and the feed direction is changed once again by the third separation roller 28 and sent in the direction of arrow E3 (a direction perpendicular to the direction of arrow D4). After the material 106 reaches the re-stacking roller 30, it is superimposed on the materials 102 and 104 sent from the upstream side in the direction of arrow D4. A pair of re-stacking conveyance rollers 32 for feeding the materials 102, 104, and 106 stacked again in the direction of arrow D4 are disposed downstream of the re-stacking roller 30 in the feeding direction (arrow D4 direction). By making the materials 102, 104, and 106 into three layers, the materials 102, 104 and the material 106 can be simultaneously fed in the direction of the arrow D4 by the same distance, and can be stably conveyed straight in the direction of the arrow D4. it can. The re-stacking roller 30 and the pair of re-stacking transport rollers 32 constitute an example of a re-stacking machine according to the present invention.

  In the space surrounded by the first separation roller 24, the second separation roller 26, the third separation roller 28, and the re-stacking roller 30, the portion surrounded by the square cut 20 a among the materials 102 and 104 is sucked. A suction box 34 is arranged. On the upper surface 34a of the suction box 34, an opening (not shown) having substantially the same area as the portion surrounded by the cut 20a is formed. An adjustment hole 34b for adjusting the suction force is formed on the side surface of the suction box 34. The adjustment hole 34b is configured so that the width (opening area) of the hole can be changed as appropriate. Yes. The suction force is weakened by widening the adjustment hole 34b, and the suction force is strengthened by narrowing the adjustment hole 34b.

  One end of a suction hose 36 is connected (connected) to the suction box 34, and the other end of the suction hose 36 is connected to a commercial vacuum cleaner (not shown). The suction box 34 is hermetically sealed except for the opening and the adjustment hole 34b, and sucks from the opening by operating a business cleaner. The two layers of materials 102 and 104 are sent while being in contact with the upper surface 34a of the suction box 34, and when the part surrounded by the cut 20a is positioned above the opening, this part is sucked and becomes debris, A through hole 100a is formed. The above-described suction box 34, suction hose 36, business cleaner, and the like constitute an example of the suction device according to the present invention.

  As shown in FIGS. 5A and 5B, the three layers of materials 102, 104, and 106 (in the state of the D position in FIG. 1) that have passed through the pair of re-stacking conveyance rollers 32 are formed with through holes 100a. It is the state that was done. Of the three layers of materials 102, 104, and 106 in this state, only the material 106 is fed in the direction of the arrow D6 and is taken up by the take-up roller 40. As shown in FIGS. 5E and 5F, the cut 20a remains in the material 106 wound around the winding roller 40 (in the state of the F position in FIG. 1). On the other hand, the remaining material 102, 104 is sent in the direction of arrow D5 and reaches the second scraper 42. The state before reaching the second scraper 42 (the state at the E position in FIG. 1) is a state in which the two layers of materials 102 and 104 overlap as shown in FIGS. 5 (c) and 5 (d). A through hole 100a is formed at the same position of both. The second scraper 42 is disposed in a region indicated by a two-dot chain line 42 in FIG. 1, and the second scraper 42 removes a portion of the material 102 outside the cut 20c.

  The second scraper 42 includes a scraper roller 44, a pair of first tension rollers 46 and a pair of second tension rollers 48 for applying tension to the material 104. The two layers of materials 102 and 104 from which the material 106 has been separated after passing through the first scraper 22 are fed in the direction of arrow D8 while being sandwiched between the pair of first tension rollers 46. Immediately after the two layers of the materials 102 and 104 pass through the pair of first tension rollers 46, the portion of the material 102 outside the cut 20 c (outside the cut 20 c) is taken up by the second scraper 42. The debris removed by the second debris remover 42 is as shown in FIGS. 6C and 6D (in the H position in FIG. 1).

  As a result of scrap removal by the second scraper 42 as described above, it passes through the pair of first tension rollers 46 and reaches the pair of second tension rollers 48 as shown in FIGS. A plurality of products 100 (upper layer thin plate 112 and lower layer thin plate 114) shown in FIG. 1 are continuous (in a state of a G position in FIG. 1). The material 102 typified by a thermosetting adhesive is fused to the material 104, but the rotational speed of the pair of first tension rollers 46 is slightly slower than the rotational speed of the pair of second tension rollers 48. As a result, an appropriate tension is applied to the material 104 existing between these rollers 46 and 48, so that the portion of the material 102 outside the cut 20 c is peeled off from the material 104 and wound around the scraping roller 44. .

  After a plurality of continuous products 100 pass through the second tension roller 48, the separation line 20 d (shown in FIG. 6A) is cut by the sheet cutter 50. As a result, the products 100 shown in FIGS. 6E and 6F are sequentially stacked on the stocker 52.

  As described above, according to the thin plate-shaped component manufacturing apparatus 10, since the portion that becomes a residue is continuously removed by the first residue removing machine 22 and the second residue removing machine 42, it is necessary to manually remove the residue. In addition, it is possible to prevent damage to the product 100 due to manual work and a decrease in production efficiency.

  In the above example, the product 100 is made of two (two layers) laminated thin plates, but three or more (three layers or more) can be applied. In this case, there is a condition in the adhesive strength of each layer, and in order not to cause a problem in the second scraper 42, for example, when there are three layers, the adhesive strength between the upper layer and the middle layer is weaker than the adhesive strength between the middle layer and the lower layer. It is a condition.

FIG. 1 is a side view showing an example of a thin plate component manufacturing apparatus of the present invention. It is a perspective view which shows schematic structure of the 1st waste removal machine which removes the part corresponded to a through-hole. It is a perspective view which shows schematic structure of the 2nd waste removal machine which removes an unnecessary part from a raw material. 4A is a plan view showing the state of the workpiece at the position “A” in FIG. 1, FIG. 4B is a cross-sectional view along line aa in FIG. 1A, and FIG. It is a top view which shows the state of the workpiece in the position of "B", (d) is bb sectional drawing of (c), (e) is the workpiece in the position of "C" of FIG. It is a top view which shows the state of this, (f) is cc sectional drawing of (e). (A) is a top view which shows the state of the to-be-processed material in the position of "D" of FIG. 1, (b) is dd sectional drawing of (a), (c) is "E" of FIG. 2 is a plan view showing the state of the workpiece at the position “”, (d) is a sectional view taken along the line ee of (c), and (e) is the state of the workpiece at the position “F” in FIG. (F) is a ff cross-sectional view of (e). (A) is a top view which shows the state of the workpiece in the position of "G" of FIG. 1, (b) is gg sectional drawing of (a), (c) is "H" of FIG. Is a plan view showing the state of the work piece at the position "", (d) is a cross-sectional view taken along the line hh of (c), and (e) is one sheet loaded at the position "I" in FIG. It is a top view which shows a product, (f) is ii sectional drawing of (e).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Thin plate-shaped component manufacturing apparatus 18 Laminating machine 20 Cutting machine 20a, 20c Cut line 22 1st waste removal machine 32 Restacking conveyance roller 34 Suction box 36 Suction hose 42 2nd waste removal machine 100 Product 102, 104, 106 Material 100a Through-hole 112 Upper layer thin plate 114 Lower layer thin plate

Claims (8)

A single lower layer thin plate in which a plurality of through holes are formed at a predetermined interval, and a plurality of upper layers each formed with a through hole that overlaps the single lower layer thin plate at a predetermined interval and matches the through hole In a thin plate component manufacturing apparatus for manufacturing a thin plate component having a thin plate,
A laminating machine for stacking a sheet for cutting underlay on the lower surface of two overlapping thin plates that are the material of the lower layer thin plate and the upper layer thin plate;
A first cut is formed in a portion corresponding to the edge of the through hole in the two overlapping thin plates from the surface of the upper thin plate to the middle of the cutting underlay thin plate, and the two overlapping thin plates A cutting machine that forms a second cut from the surface of the upper thin plate to the middle of the lower thin plate in a portion corresponding to the edge of the upper thin plate,
After the first and second cuts are formed by the cutting machine, the cutting underlay thin plate is separated from the two overlapping thin plates, and corresponds to the through hole of the two overlapping thin plates. A first scraper for removing the part;
After removing the portion corresponding to the through-hole with the first debris remover, while applying tension to the thin plate corresponding to the lower layer thin plate among the two overlapping thin plates, A thin plate component manufacturing apparatus comprising a second scraper that winds and removes portions other than the upper thin plate and the lower thin plate. The first debris removal machine includes a suction device that contacts a lower surface of the two overlapped thin plates and sucks and removes a portion corresponding to the through hole in the two overlapped thin plates. The apparatus for manufacturing a thin plate component according to claim 1, wherein The thin plate-shaped component manufacturing apparatus according to claim 2, wherein the suction device has an adjustment hole for adjusting a suction force. A re-lamination machine for removing the portion corresponding to the through hole from the thin sheet for cutting underlay separated when the portion corresponding to the through hole is removed by the first scraper, and then restacking the lower layer thin plate on the lower surface The thin plate component manufacturing apparatus according to claim 1, 2, or 3. A single lower layer thin plate in which a plurality of through holes are formed at a predetermined interval, and a plurality of upper layers each formed with a through hole that overlaps the single lower layer thin plate at a predetermined interval and matches the through hole In a thin plate component manufacturing method for manufacturing a thin plate component having a thin plate,
While conveying a long work piece consisting of two overlapping thin plates that are the material of the lower layer thin plate and the upper layer thin plate, and a thin sheet for cutting underlay stacked on the lower surface of the thin plate in a predetermined conveying direction,
A first cut is formed in the portion corresponding to the edge of the through hole in the two overlapping thin plates from the surface of the upper thin plate to the middle of the cutting underlay thin plate, and the two overlapping thin plates In the portion corresponding to the edge of the upper thin plate, a second cut is formed from the surface of the upper thin plate to the middle of the lower thin plate,
While separating the thin sheet for cutting underlay from the two overlapping thin plates, the portion corresponding to the through hole is removed from the two overlapping thin plates,
While applying tension to the thin plate corresponding to the lower layer thin plate of the two overlapping thin plates, the portions other than the upper thin plate and the lower thin plate of the two overlapping thin plates are wound up and removed. A thin plate-like component manufacturing method. When removing the portion corresponding to the through hole from the two overlapping thin plates, the portion corresponding to the through hole is sucked in a state where the suction device is in contact with the lower surface of the two overlapping thin plates. 6. The method of manufacturing a thin plate-like component according to claim 5, wherein the thin plate-like component is removed. The thin sheet for cutting underlay separated when the portion corresponding to the through hole is removed is overlapped again on the lower surface of the lower layer thin plate after removing the portion corresponding to the through hole. 2. A method for producing a thin plate-like component according to 1. The thin plate-like component according to any one of claims 5 to 7, wherein the thin plate-like component is composed of three or more thin plates, and an adhesive force between the layers is weaker as an upper layer. Parts manufacturing method.

Images