JP2009147281A - Method and apparatus for manufacturing light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device, by which a light-emitting device high in light converging performance can easily be manufactured. <P>SOLUTION: The method for manufacturing a light-emitting device includes: a first resin arrangement step of arranging a resin 10 so as to cover a light-emitting element 6 disposed on a surface of a substrate 5 and have a mountain-shaped cross section; a curing step of curing the resin 10; and a second resin arrangement steep of arranging a resin 11 on a surface of the resin 10 by stencil printing. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device manufacturing method and a light emitting device manufacturing apparatus.

  Some light-emitting devices have light-emitting elements such as light-emitting diodes (LEDs). In recent years, LEDs are used in displays such as television receivers, illuminators, traffic lights, flashlights, automobile tail lamps, and the like. Such a light emitting element is formed on the surface of the substrate and connected to an electric circuit. The light emitting element is covered with a resin or the like as a protective layer for protecting the light emitting element. As the protective layer, a light-transmitting resin is used, and is formed so as to emit light emitted from the light-emitting element to the outside.

  In manufacturing a light emitting device, a light emitting element is disposed on the surface of a substrate, and then a resin is disposed so as to cover the light emitting element. For example, Japanese Patent Application Laid-Open No. 2007-5722 discloses a method of disposing a resin that coats a light emitting element with a dispenser for each light emitting element.

In the resin sealing method using a dispenser, since the resin is arranged for each light emitting element, it takes time and the equipment becomes complicated. In recent years, stencil printing has been used as a method for sealing a light emitting element disposed on a substrate with a resin (see, for example, Japanese Patent No. 2851589). In the stencil printing method, a stencil having through holes corresponding to the positions of the light emitting elements on the substrate is used. The light emitting element can be sealed with the resin by disposing the light emitting element inside each through hole and disposing the resin inside the through hole.
JP 2007-5722 A Japanese Patent No. 2851589

  Light from the light emitting element is emitted to the outside through a resin covering the light emitting element. When the resin is arranged without forming a weir around the light emitting element, the cross-sectional shape of the resin becomes a mountain shape due to the surface tension of the resin. For example, the cross-sectional shape of the resin is parabolic. The light emitted from the light emitting element is refracted on the surface of the resin after passing through the inside of the resin and emitted to the outside. At this time, light is diffused depending on the shape of the surface of the resin. When light is diverged in multiple directions on the surface of the resin, the luminance when the light emitting device is viewed from the front is small. In other words, light is directed in many directions on the surface of the resin, and the directivity is reduced.

  In the above Japanese Patent Application Laid-Open No. 2007-5722, the optical semiconductor element is sealed with a resin, and a light emitting part for condensing the light and emitting it to the outside is disposed on the sealing resin. It is disclosed. It is disclosed that a lens part is formed in the light emitting part and light can be collected. However, in this light emitting device, it is necessary to manufacture the light emitting part as a separate part and to attach the light emitting part to the resin covering the optical semiconductor element. For this reason, there exists a problem that productivity is bad.

  It is an object of the present invention to provide a light emitting device manufacturing method and a light emitting device manufacturing apparatus that can easily manufacture a light emitting device with high light condensing properties.

  The method for manufacturing a light emitting device according to the present invention includes a first resin arranging step of arranging a first resin so as to cover a light emitting element arranged on a surface of a substrate so that a cross-sectional shape is a mountain shape, and curing to cure the first resin. And a second resin placement step of placing a second resin on the surface of the first resin by stencil printing.

  Preferably, in the above invention, the first resin disposing step includes a step of using the first stencil, and the second resin disposing step includes a first hole having a through hole having a size equal to or smaller than a through hole of the first stencil when viewed in plan. A step of using a two-hole plate. The second resin arrangement step includes a step of performing stencil printing by bringing the through hole of the second stencil plate into contact with the cured first resin.

  Preferably, in the above invention, the first resin arranging step includes a step of using the first stencil, and the second resin arranging step has a second stencil having a through hole larger than the through hole of the first stencil when viewed in plan. The process using is included.

  Preferably, in the above invention, the second resin arranging step includes a step of using a resin having the same main component as the first resin as the second resin.

  Preferably in the said invention, a 1st resin arrangement | positioning process includes the process of using resin in which an inorganic material is contained as 1st resin.

  In the above invention, preferably, particles having a higher refractive index than the first resin and the second resin are used as the inorganic material.

  Preferably, in the above invention, the second resin arranging step includes a step of using a resin having a refractive index smaller than that of the first resin as the second resin.

  Preferably, in the above invention, the second resin arranging step includes a step of using a resin having a higher hardness than the first resin as the second resin.

  The light-emitting element manufacturing apparatus of the present invention is a light-emitting device manufacturing apparatus that covers a light-emitting element disposed on a surface of a substrate with a resin. The light-emitting element manufacturing apparatus includes a first stencil. A first printing device that is covered with one resin; a curing device that cures the first resin; and a second printing device that includes a second stencil and that disposes the second resin outside the first resin by stencil printing with the second stencil. , A first printing device, a second printing device, and a control device for controlling the curing device. The curing device includes a transport device that transports the substrate from the first printing device to the second printing device. The first resin is cured while the substrate is transported from the first printing device to the second printing device by the transport device.

  Preferably, in the above invention, the second printing apparatus has a support device for supporting the substrate under the second stencil plate. The second stencil has a through hole that is not larger than the through hole of the first stencil when viewed in plan. The control device is formed so as to control the position of the second support device so that the first resin has a height at which the first resin comes into contact with the through hole of the second stencil plate.

  Preferably, in the above invention, the second printing apparatus has a support device for supporting the substrate under the second stencil plate. The second stencil has a through hole larger than the through hole of the first stencil when viewed in plan. The control device is formed to control the position of the support device so that the second stencil plate is at a height at which the second stencil comes into contact with the substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the light-emitting device which can manufacture a light-emitting device with high condensing property easily, and the manufacturing apparatus of a light-emitting device can be provided.

(Embodiment 1)
With reference to FIGS. 1 to 11, a method for manufacturing a light-emitting device and a device for manufacturing a light-emitting device in Embodiment 1 will be described.

  FIG. 1 is a first process diagram of a method for manufacturing a light emitting device according to the present embodiment. 1 to 8 and FIG. 10 are schematic cross-sectional views of a main part of a light emitting device manufacturing apparatus. The light-emitting device manufacturing apparatus in this embodiment is an apparatus for resin-sealing a light-emitting element arranged on the surface of a substrate.

  The light emitting device in this embodiment includes a light emitting element 6. As the light emitting element 6, for example, a semiconductor light emitting element can be adopted. As the semiconductor light emitting element, for example, a light emitting diode (LED), a semiconductor laser, or an infrared light emitting diode can be employed. The light emitting element is not limited to this form, and any element that emits light may be used. The light emitting element 6 in the present embodiment includes a wire 7 for obtaining electrical continuity with an electric circuit.

  The light emitting device manufacturing apparatus according to the present embodiment includes a support device for supporting a substrate 5 as an object to be processed. The support device includes a stage 24 as a mounting table for mounting the substrate 5. The stage 24 in the present embodiment is formed so that the substrate 5 can be fixed. The support device in the present embodiment includes a lifting device that lifts and lowers the stage 24. The lifting device is formed so as to move the stage 24 in the vertical direction. In addition, the light emitting device manufacturing apparatus in the present embodiment includes a control device that controls the support device.

  The light emitting device manufacturing apparatus in the present embodiment includes a stencil 1. The stencil 1 in the present embodiment is formed in a plate shape. The stencil 1 has a through hole 1a. The through hole 1 a is a hole that penetrates the stencil 1. The through holes 1a are formed at positions corresponding to the respective light emitting elements 6 arranged on the substrate 5 when viewed in plan. The stencil 1 in the form of the present embodiment includes a frame member 23. The frame member 23 is formed along the edge of the plate-like part in which the through hole 1a is formed.

  The through hole 1a in the present embodiment is formed so that the planar shape is circular. The through-hole 1a is formed so that the cross-sectional shape when cut along a plane perpendicular to the main surface of the stencil 1 is a square. In the present embodiment, the cross-sectional shape is a rectangle. The wall portion of the through hole 1 a is formed to be substantially perpendicular to the main surface of the stencil 1. Here, the main surface of the stencil indicates a surface where the area of the plate-like portion of the stencil is maximized. The through hole 1a is not limited to this form, and the wall portion of the through hole may be formed to be inclined with respect to the main surface of the stencil plate. For example, the through holes may be formed so that the cross-sectional shape when cut along a plane perpendicular to the main surface of the stencil is trapezoidal. The cross-sectional shape when cut along a plane perpendicular to the main surface of the stencil plate may be formed so as to have a tapered shape, and the diameter of the through-hole may be formed so as to decrease downward in the vertical direction.

  The light emitting device manufacturing apparatus according to the present embodiment includes squeegees 31 and 32 that supply the resin 10 into the through holes 1 a of the stencil 1. Each of the squeegees 31 and 32 is formed to be movable in a direction perpendicular to the main surface of the stencil 1. Each of the squeegees 31 and 32 is formed to be movable along the main surface of the stencil 1.

  The light emitting device manufacturing apparatus according to the present embodiment includes a vacuum container for making the inside into a vacuum state. Main components such as the stage 24, the stencil 1 and the squeegees 31 and 32 are disposed inside the vacuum vessel. The light emitting device manufacturing apparatus in this embodiment is formed so that resin can be arranged in a vacuum atmosphere.

  The light emitting device manufacturing apparatus in the present embodiment includes a pressure adjusting device that adjusts the pressure inside the vacuum vessel. The pressure adjusting device in the present embodiment includes a vacuum pump. The vacuum pump is connected to the vacuum vessel. The pressure adjusting device includes a return pressure valve for returning the pressure inside the vacuum vessel.

  Next, a method for manufacturing the light emitting device in the present embodiment will be described. The manufacturing method of a light-emitting device includes a step of resin-sealing each light-emitting element by supplying resin to a substrate on which the light-emitting element is arranged. In the present embodiment, first, a first resin arrangement step is performed in which a first resin is arranged so as to cover the light emitting elements arranged on the surface of the substrate. In the first resin placement step in the present embodiment, the first resin is placed by stencil printing.

  Referring to FIG. 1, stencil 1 is used as the first stencil in the first resin arrangement step. The substrate 5 is placed on the mounting surface of the stage 24. The substrate 5 is arranged such that each light emitting element 6 is positioned directly below the through hole 1a of the opposing stencil plate 1. The resin 10 as the first resin is supplied to a region outside the region where the through hole 1a is formed in the main surface of the stencil plate 1.

  The resin 10 in the present embodiment is a liquid having viscosity. As the resin 10, various resins such as a silicone resin, an epoxy resin, an acrylic resin, an epoxy-modified silicone resin, or a silicone-modified epoxy resin can be used.

  Next, the pressure regulator is driven to evacuate the inside of the vacuum vessel, thereby forming a vacuum atmosphere. By arranging the resin in a vacuum atmosphere, the air present inside the resin can be released to the outside, and bubbles can be prevented from remaining inside the resin. Next, the squeegee 31 is lowered as indicated by an arrow 61. The squeegee 31 contacts the resin 10.

  FIG. 2 is a second process diagram of the method for manufacturing the light emitting device in the present embodiment. FIG. 3 is a third process diagram of the method for manufacturing the light emitting device in the present embodiment. FIG. 4 is a fourth process diagram of the method for manufacturing the light emitting device according to the present embodiment.

  Referring to FIG. 2, stage 24 is raised as indicated by arrow 53. The control device raises the stage 24 to a height at which the stencil 1 contacts the substrate 5 by controlling the support device. The light emitting element 6 is disposed inside the through hole 1 a of the stencil 1.

  With reference to FIG. 3 and FIG. 4, a liquid resin 10 is supplied into the through hole 1 a of the stencil 1. The squeegee 31 is moved along the main surface of the stencil 1 as indicated by an arrow 62. The squeegee 31 is moved from one end of the stencil 1 to the other end. By moving the squeegee 31, the resin 10 can be disposed inside the through hole 1a. The light emitting element 6 disposed on the surface of the substrate 5 is embedded with a resin 10.

  FIG. 5 is a fifth process diagram of the method for manufacturing the light-emitting device according to the present embodiment. The squeegee 31 is raised. On the other hand, the squeegee 32 is lowered to bring the squeegee 32 into contact with the resin 10. Next, as shown by the arrow 63, the squeegee 32 is moved from the other end of the stencil 1 to one end. In this way, the return-side squeegee is moved. By moving the squeegee 32, the excess portion of the resin 10 is removed.

  FIG. 6 is a sixth process diagram of the method for manufacturing the light-emitting device according to the present embodiment. When the movement of the squeegee 32 is completed, the control device controls the lifting device so as to lower the stage 24 as indicated by an arrow 54. Each light emitting element 6 is individually covered with a resin 10. The cross-sectional shape of the resin 10 covering the light emitting element 6 becomes a mountain shape due to the surface tension of the resin 10. In the present embodiment, the cross-sectional shape of the resin 10 is a parabolic shape. The resin 10 spreads due to the fluidity of the resin 10 and is larger than the through hole 1a when viewed in plan. When the lowering of the stage 24 is completed, the vacuum container is opened to the atmosphere.

  Next, the board | substrate 5 is taken out from a vacuum vessel, and the hardening process which hardens the resin 10 as 1st resin is performed. In the curing step, the first resin is cured until the shape of the first resin does not change. Alternatively, curing is performed until the first resin does not flow even when the substrate is tilted. In the present embodiment, the curing is performed by drying the resin 10 in a far-infrared furnace. The curing step is not limited to this form, and the first resin may be completely cured. The curing step is not limited to the drying method, and any curing method such as drying (pressurizing oven or the like) while applying pressure, far-infrared furnace, or irradiation with light such as ultraviolet rays can be employed.

  FIG. 7 is a seventh process diagram of the method for manufacturing the light emitting device according to the present embodiment. Next, the 2nd resin arrangement | positioning process which arrange | positions 2nd resin further on the surface of 1st resin is performed. In the second resin arrangement step in the present embodiment, the second resin is arranged by stencil printing.

  The substrate 5 on which the resin 10 as the first resin is cured is placed inside the vacuum container. The same stencil as the first stencil is used as the second stencil used in the second resin arrangement step of the present embodiment. The board | substrate 5 is arrange | positioned so that each resin 10 may be arrange | positioned directly under the through-hole 1a. A resin 11 as a second resin is supplied to the main surface of the stencil plate 1. In the present embodiment, the resin 11 as the second resin is the same resin as the resin 10 used in the first resin arrangement step. Also in the second resin, a viscous liquid resin is used. As the second resin, various resins such as a silicone resin, an epoxy resin, an acrylic resin, an epoxy-modified silicone resin, or a silicone-modified epoxy resin can be used.

  Next, a vacuum atmosphere is formed by evacuating the inside of the vacuum vessel. By arranging the resin in a vacuum atmosphere, it is possible to suppress the bubbles from remaining inside the resin 11. The squeegee 31 is lowered as indicated by an arrow 61. The squeegee 31 contacts the resin 11.

  Next, the control device raises the stage 24 as indicated by an arrow 53 by controlling the lifting device of the support device. Since the resin 10 is larger than the through-hole 1a of the stencil 1 when viewed in plan, the edge of the through-hole 1a comes into contact with the surface of the resin 10.

  The control device raises the stage 24 until the edge of the through-hole 1a contacts the resin 10. In the present embodiment, a position where the resin 10 abuts the through hole is set, and control is performed so that the stage 24 stops at a position lower than that in the first resin arrangement step. A gap is formed between the stencil 1 and the substrate 5. The control device is not limited to this configuration, and may be formed so as to stop the lifting device of the support device by detecting that the through hole is in contact with the surface of the resin.

  Next, as shown in the arrow 62, the resin 11 is arrange | positioned inside the through-hole 1a by moving the squeegees 31 and 32 similarly to the 1st resin arrangement | positioning process. A resin 11 is disposed on the upper side of the resin 10. The squeegees 31 and 32 are moved from one end of the stencil 1 to the other end.

  FIG. 8 is an eighth process diagram of the method for manufacturing the light-emitting device according to the present embodiment. Next, as in the first resin arrangement step, the squeegee 31 is raised and the squeegee 32 is lowered. In this state, as shown by the arrow 63, the return-side squeegee 32 is moved.

  FIG. 9 shows an enlarged schematic cross-sectional view of each light emitting element portion. The resin 11 is arranged in a state where the edge of the through hole 1a of the stencil 1 is in contact with the resin 10. The resin 11 is disposed on the upper side of the resin 10 in the through hole 1a.

  FIG. 10 is a ninth process diagram of the method for manufacturing the light emitting device according to the present embodiment. Next, the control device drives the lifting device of the support device to lower the stage 24 as indicated by an arrow 54. The stencil 1 is separated from the resin 10.

  Next, a curing step for completely curing the resin 10 and the resin 11 is performed. In the present embodiment, curing is performed by drying the resins 10 and 11 using an oven dryer. In this curing step, any method for completely curing the resin can be employed.

  FIG. 11 is an enlarged schematic cross-sectional view of each light emitting element when the second resin is disposed on the upper side of the first resin. In the present embodiment, when the substrate 5 is separated from the stencil plate 1 in the second resin placement step, the resin 10 and the resin 11 attract each other. In other words, the resin 11 is pulled by the resin 10. For this reason, it is suppressed that resin 11 flows toward the side. As a result, the shape of the surface of the resin 11 can be made closer to a hemispherical shape than the shape of the surface of the resin 10. The cross-sectional shape of the resin 10 is a parabolic shape, but the surface of the resin 11 can be made close to a semicircular shape. Therefore, the resins 10 and 11 serve as a condensing lens, and as indicated by an arrow 69, the light emitted from the light emitting element 6 can be condensed toward the front.

  In the present embodiment, it is not necessary to separately arrange lens components for condensing light after disposing the resin, and a light-emitting device with high light condensing property can be easily manufactured. A resin layer having a resin surface shape close to a hemispherical shape can be easily formed. In particular, it is useful for a light-emitting device that preferably has a high light collecting property, such as a traffic light, a flashlight, or an automobile tail lamp.

  In the second resin arranging step, the light emitting device can be manufactured with high productivity by arranging the resin by stencil printing. In the present embodiment, the same first stencil plate used in the first resin arrangement step and second stencil plate used in the second resin arrangement step are used. With this method, the configuration of the light emitting device manufacturing apparatus can be simplified.

  In the present embodiment, the first resin in the first resin arrangement step and the second resin in the second resin arrangement step use the same resin. By this method, the wettability of both the first resin and the second resin can be made the same, and it can be made close to a hemispherical shape effectively. Alternatively, by using a resin having the same main component as the first resin and the second resin, the resin can be effectively brought close to a hemispherical shape.

  In the present embodiment, the first resin and the second resin are the same resin, but the present invention is not limited to this, and different resins may be used.

  In the second resin arranging step, a resin having higher hardness than the first resin can be used as the second resin. For example, a soft resin such as a silicone resin may be employed as the first resin, and a hard epoxy resin having a higher hardness than the first resin may be employed as the second resin. By adopting this method, partial repair can be easily performed even if a defect is found after the first resin and the second resin are arranged in each of the plurality of optical elements.

  When an optical element such as a light emitting element or a light receiving element is covered only with a soft resin, an internal optical element or a wire may be damaged when a finger or the like comes into contact therewith. Alternatively, when the optical element is covered only with a hard resin, it is difficult to remove the resin because the entire resin is hard. As a result, it becomes difficult to repair individual optical elements. On the other hand, for example, a plurality of light emitting elements are arranged in a matrix on the surface of the substrate, a soft first resin is arranged for each light emitting element, and then a hard second resin is arranged in a thin film. Even when a defect of one light-emitting element is found after the second resin is arranged, the hard second resin can be easily broken, and the soft first resin can be easily removed to cause a defective light-emitting element. Can be repaired. Moreover, by disposing the second resin harder than the first resin on the surface of the first resin, it is possible to relieve internal stress and suppress the occurrence of cracks in the resin.

  In addition, a resin containing an inorganic material can be used as the first resin. For example, an LED that emits blue light is used as the light emitting element. As the first resin, a resin containing a phosphor as an inorganic material is used. As the phosphor, YAG (yttrium, aluminum, garnet) phosphor, TAG (terbium, aluminum, garnet) phosphor, SIALON (sialon: nitride obtained by mixing silicon, aluminum, oxygen and nitrogen) phosphor, or the like is used. be able to. As the second resin, a light-transmitting resin that does not contain an inorganic material is used. By this method, it is possible to provide a white light emitting device by converting the wavelength of part of the light emitted from the blue light emitting diode. Further, by arranging the second resin having translucency, the optical element can be made larger.

  Moreover, as an inorganic material contained in the first resin, particles having a higher refractive index than those of the first resin and the second resin can be used. For example, a high refractive index inorganic material such as zirconium oxide or titanium oxide can be employed as the inorganic material. As an inorganic material having a high refractive index, kneading particles having a large diameter results in whitening, and the transparency of the entire resin is completely lost. For this reason, it is preferable to use fine particles as the inorganic material. As the fine particles, for example, the diameter is preferably 10 μm or less. Furthermore, fine particles having a diameter of 1 μm or less are preferred. By this method, the refractive index of the inner resin layer can be increased, and the refractive index of the outer resin layer can be decreased. In the outermost resin, the refractive index of the resin can be close to the refractive index of air, and the internal reflection of light can be reduced. As a result, the light extraction efficiency can be increased.

  The device in which the refractive index of the second resin is reduced is not limited to this form, and a resin having a refractive index smaller than that of the first resin may be used as the second resin. For example, a resin having a high refractive index of 1.6 may be used as the first resin, and a resin having a low refractive index of 1.4 may be used as the second resin.

  In the present embodiment, the first resin placement step and the second resin placement step are performed in a vacuum atmosphere. However, the present invention is not limited to this mode, and the first resin placement step may be performed at normal pressure. Or you may perform a 2nd resin arrangement | positioning process by a normal pressure.

  In the present embodiment, the through holes of the first stencil plate and the through holes of the second stencil plate have the same shape and the same size, but are not limited to this form, and the size of the through hole of the second stencil plate is The first hole plate may be smaller than the through hole. When the planar shapes are compared, the size may be such that the through holes of the second stencil are included inside the through holes of the first stencil. Moreover, the planar shape of the through hole of the stencil plate is not limited to a circle, and any shape can be adopted.

  In the present embodiment, the first resin placement step performs resin placement by stencil printing using a stencil. However, the first resin placement step is not limited to this form, and the first resin placement step has an angle-shaped cross section by any method. A first resin can be disposed. For example, you may arrange | position 1st resin with a dispenser.

  In the present embodiment, light emitting elements are arranged on the surface of the substrate by COB (Chip on Board). Any substrate can be used as the substrate on which the optical element is disposed. As the substrate, for example, a glass epoxy substrate (FR-4), a glass composite substrate (CEM-3), a ceramic substrate, a metal core substrate, or a BT resin substrate can be employed. Alternatively, the substrate may be a plate-like portion formed on the lead frame.

  In this embodiment, a lump of resin is arranged for one light emitting element, but the present invention is not limited to this, and a plurality of light emitting elements may be sealed with a lump of resin. Moreover, in this Embodiment, it has the double resin structure which arrange | positions 2nd resin on the upper side of 1st resin, but it is not restricted to this form, Repeating stencil printing, the resin structure of 3 or more layers May be formed.

(Embodiment 2)
With reference to FIG. 12 to FIG. 14, a method for manufacturing a light emitting device and a device for manufacturing the light emitting device in Embodiment 2 will be described.

  FIG. 12 is an enlarged schematic cross-sectional view of a portion of the light emitting element when performing the second resin arrangement step in the present embodiment. In the method for manufacturing the light emitting device according to the present embodiment, the second stencil plate having a through hole larger than the through hole of the first stencil plate used in the first resin placement step is used in the second resin placement step. In the second resin arrangement step in the present embodiment, a stencil 2 as a second stencil is used. The stencil 2 has a through hole 2a.

  FIG. 13 shows an enlarged schematic plan view of a through hole portion of the second stencil plate in the present embodiment. The through hole 2a has a circular planar shape. The through hole 2a is formed so as to be larger than the size of the through hole 1a of the first stencil when viewed in plan. The through-hole 2a has such a size that the through-hole 1a of the stencil 1 is included in the through-hole 2a when viewed in plan. Furthermore, the through hole 2a in the present embodiment is formed to be larger than the resin 10 as the first resin arranged. That is, when viewed in a plan view, the through hole 2a has such a size that the resin 10 is contained therein.

  In the present embodiment, the thickness of the second stencil plate is formed to be the same as the thickness of the first stencil plate. However, the thickness is not limited to this, and the second stencil plate is thicker than the first stencil plate. It may be formed.

  Referring to FIG. 12, in the second resin arrangement step in the present embodiment, stencil 2 and substrate 5 are brought into contact by raising the stage. The control device controls the support device so as to stop the rising of the stage at a position where the edge of the through hole 2 a of the stencil 2 contacts the substrate 5. A resin 10 is disposed inside the stencil plate 2. In this state, by performing the second resin arrangement step, the resin 11 as the second resin is arranged inside the through hole 2a. Thereafter, the stencil 2 is pulled away from the substrate 5 by lowering the stage. The resin 11 can be disposed on the surface of the resin 10.

  Also in the manufacturing method and manufacturing apparatus in the present embodiment, a resin close to a hemispherical shape can be easily formed.

  Next, the results of an effect confirmation test using the method for manufacturing a light emitting device in this embodiment will be described. In the effect confirmation test, the light emitting device in which the second resin was arranged in addition to the first resin was compared with the light emitting device manufactured only with the first resin.

  In the effect confirmation test, one light emitting element was formed on one substrate, and resin was arranged. In the effect confirmation test, “VS9301” (silicone resin, viscosity: 40 Pa · s) manufactured by Sanyu Rec Co., Ltd. was used as the first resin and the second resin. As the first stencil plate, a stencil plate having a plate-like portion having a thickness of 1.0 mm, a circular shape in plan view and including a through hole having a diameter of 2.6 mm was used. As the second stencil plate, a stencil plate having a plate-like portion having a thickness of 1.5 mm, a circular shape in plan view and including a through hole having a diameter of 4.0 mm was used.

  In the effect confirmation test, the resin was arranged on 10 substrates. Moreover, the thing which hardened | cured 1st resin after having arrange | positioned 1st resin and the thing which arrange | positioned and hardened 2nd resin further on the surface of 1st resin were compared. In the test in which only the first resin was arranged, the test was performed using the second stencil plate. The first resin and the second resin were cured by drying in a pressure oven.

  Regarding the manufactured light emitting device, the height of the resin was measured with a micrometer. Further, the spread of the resin (the maximum value of the diameter of the resin when viewed in plan) was measured with a magnifying microscope. Table 1 shows the results of the effect confirmation test. Table 1 shows the results for each substrate.

表１から、第１樹脂のみを配置した発光装置と、第１樹脂に加えて第２樹脂を配置した発光装置を比較すると、第２樹脂が配置された発光装置は、樹脂の高さが高く、また、樹脂の広がりが小さくなっていることが分かる。このように、第１樹脂に加えて第２樹脂を配置することにより、樹脂の形状が半球形状に近づいていることが分かる。

From Table 1, when comparing a light emitting device in which only the first resin is arranged and a light emitting device in which the second resin is arranged in addition to the first resin, the light emitting device in which the second resin is arranged has a high resin height. It can also be seen that the spread of the resin is reduced. Thus, it can be seen that by arranging the second resin in addition to the first resin, the shape of the resin approaches a hemispherical shape.

  In the present embodiment, the planar shape of the through hole 2a of the stencil plate 2 used in the second resin arranging step is circular, but is not limited to this form, and any shape can be adopted. Further, the planar shape of the through hole of the first stencil plate and the planar shape of the through hole of the second stencil plate may be different.

  FIG. 14 shows an enlarged schematic plan view of a through hole portion of another second stencil plate in the present embodiment. The stencil 3 as another second stencil has a through hole 3a. The through hole 3a is formed in an octagonal plan shape. The through hole 3a is formed to be larger than the through hole of the first stencil plate. The through-hole 3a has a size capable of containing the resin 10 as the first resin when viewed in plan. Thus, a through hole having an arbitrary polygonal shape can be employed.

Other configurations, functions, methods, and effects are the same as those in the first embodiment, and thus description thereof will not be repeated here.
(Embodiment 3)
With reference to FIG. 15 to FIG. 23, a light emitting device manufacturing apparatus and a light emitting device manufacturing method according to Embodiment 3 will be described. The light-emitting device manufacturing apparatus in this embodiment is an apparatus that continuously disposes resin on a substrate. 15 to 23 are schematic cross-sectional views of the light emitting device manufacturing apparatus according to the present embodiment.

  FIG. 15 is a first process explanatory diagram of the method for manufacturing the light emitting device according to the present embodiment. The light emitting device manufacturing apparatus according to the present embodiment includes a printing apparatus 41 as a first printing apparatus. The printing apparatus 41 includes squeegees 31 and 32. The printing apparatus 41 includes a stencil 1 as a first stencil. The printing device 41 includes a support device for supporting the substrate below the stencil 1. The support device includes a stage 24 for placing the substrate on the surface, and an elevating device 25 for elevating the stage 24.

  The printing apparatus 41 includes a vacuum container 48. The vacuum vessel 48 is connected to a pressure adjusting device (not shown). The vacuum vessel 48 has openable and closable doors 41a and 41b for carrying in and out the substrate. The open / close door 41 a is disposed on the side where the substrate 5 is carried in, and the open / close door 41 b is disposed on the side where the substrate 5 is carried out.

  The light emitting device manufacturing apparatus in the present embodiment has a carry-in device 46 for carrying the substrate 5 into the printing device 41. The carry-in device 46 is formed so that the substrate 5 can be carried into the printing device 41 by a belt conveyor.

  The light emitting device manufacturing apparatus according to the present embodiment includes a printing device 42 as a second printing device. The printing device 42 has the same configuration as the printing device 41. The vacuum container 48 of the printing apparatus 42 includes open / close doors 42a and 42b. The open / close door 42a is formed on the side where the substrate 5 is carried in, and the open / close door 42b is arranged on the side where the substrate is carried out. In the present embodiment, the printing device 42 includes the stencil 1 as the second stencil. The second stencil plate in the present embodiment is the same as the first stencil plate of the first printing apparatus.

  The light emitting device manufacturing apparatus in the present embodiment includes an unloading device 47 for unloading the substrate 5. The carry-out device 47 is formed so that the substrate 5 can be carried out from the printing device 42 by a belt conveyor.

  The light emitting device manufacturing apparatus in the present embodiment includes a far infrared furnace 44 as a curing device for curing the first resin disposed in the printing device 41. The far infrared furnace 44 is disposed between the printing device 41 and the printing device 42.

  The light emitting device manufacturing apparatus according to the present embodiment includes a transport device 43 that transports the substrate 5 from the printing device 41 to the printing device 42. The transfer device 43 is formed to transfer the substrate 5 by a belt conveyor. The transport device 43 is formed so that the substrate 5 can be transported from the opening / closing door 41 b of the printing device 41 toward the opening / closing door 42 a of the printing device 42.

  The transport device 43 in the present embodiment is disposed inside the far infrared furnace 44. At the same time when the substrate 5 is transported from the printing device 41 to the printing device 42, the first resin is dried so that the first resin can be cured. The light-emitting device manufacturing apparatus in the present embodiment includes a control device that controls the printing device 41, the printing device 42, the far-infrared furnace 44, and the transport device 43.

  Next, a method for manufacturing a light-emitting device using the light-emitting device manufacturing apparatus in the present embodiment will be described. The printing method in the present embodiment is the same as the printing method in the first embodiment. The same stencil is used in the first resin placement step and the second resin placement step.

  Referring to FIG. 15, the opening / closing door 41a of the printing apparatus 41 is opened. As indicated by an arrow 55, the substrate 5 is carried into the printing device 41 by the carry-in device 46.

  FIG. 16 is a second process explanatory diagram of the method for manufacturing the light emitting device according to the present embodiment. The vacuum container 48 is sealed by closing the open / close door 41a. By driving the pressure adjusting device, the inside of the printing device 41 is evacuated. When the control device drives the lifting device 25, the stage 24 is raised. The control device controls the stage 24 to stop at a height at which the substrate 5 contacts the stencil 1. The first resin is disposed on the surface of the substrate 5 by reciprocating the squeegees 31 and 32. After this, the vacuum vessel is returned to normal pressure by an open valve.

  FIG. 17 is a third process explanatory diagram of the method for manufacturing the light emitting device according to the present embodiment. Next, the open / close door 41 b of the printing apparatus 41 is opened, and the substrate 5 is moved to the transport apparatus 43 as indicated by an arrow 56.

  FIG. 18 is a fourth process explanatory diagram of the method for manufacturing the light emitting device according to the present embodiment. As indicated by an arrow 57, the transport device 43 transports the substrate 5 from the printing device 41 toward the printing device 42. The transfer device 42 in the present embodiment is disposed inside the far infrared furnace 44. For this reason, the first resin can be cured while the substrate 5 is being transported. In the present embodiment, the first resin is cured by heating in the far infrared furnace 44. By opening the opening / closing door 41 a of the printing apparatus 41, the next substrate 5 is arranged inside the printing apparatus 41.

  FIG. 19 is an explanatory diagram of a fifth step of the method for manufacturing the light emitting device in this embodiment. Next, the substrate 5 is transported by the transport device 43 and, at the same time, the first resin of another substrate 5 is disposed in the printing device 41.

  FIG. 20 shows a sixth step explanatory diagram of the method for manufacturing the light emitting device in the present embodiment. Thus, simultaneously with the conveyance of the substrate 5 by the conveyance device 43, the first resin is continuously arranged in the printing device 41. The control device adjusts the speed of the transport device 43 so that the first resin is cured to the set hardness before the substrate 5 moves from the printing device 41 to the printing device 42. Alternatively, the control device adjusts the output of the far infrared furnace 44. The transport device 43 may be controlled so as to transport the substrate 5 continuously. Or you may control so that the board | substrate 5 may be conveyed intermittently.

  The first resin of the substrate 5 is cured to the hardness set when it arrives at the printing device 42. Next, the opening / closing door 42a of the printing apparatus 42 is opened. The substrate 5 transported by the transport device 43 is carried into the printing device 42.

  FIG. 21 is an explanatory diagram of a seventh step of the method for manufacturing the light emitting device in this embodiment. A substrate 5 is disposed inside the printing device 42. In the printing apparatus 41, another new substrate 5 is carried in. In the present embodiment, the loading of the substrate 5 by the printing device 41 and the loading of the substrate 5 by the printing device 42 are performed almost simultaneously.

  FIG. 22 illustrates an eighth step explanatory diagram of the method for manufacturing the light emitting device according to the present embodiment. The doors 41a and 41b of the printing apparatus 41 are closed. The opening / closing door 42a of the printing apparatus 42 is closed. In each printing apparatus 41 and 42, the inside of the vacuum vessel 48 is evacuated.

  Stencil printing is performed by the printing devices 41 and 42. In the present embodiment, the first printing device 41 and the second printing device 42 perform stencil printing in substantially the same time. In the printing apparatus 42, at least a part of the first resin is disposed inside the through hole of the stencil 1 by raising the stage 24. The control device controls the position of the stage 24 in the printing device 42 such that the first resin comes to a height at which the first resin comes into contact with the through holes of the second stencil plate. In the present embodiment, the control device controls the lifting device 25 so as to raise the stage 24 to a preset height. In the present embodiment, stencil printing is performed in the printing device 42 in a state where the edge of the through hole is in contact with the surface of the first resin.

  FIG. 23 is an explanatory diagram of a ninth step of the method for manufacturing the light emitting device in this embodiment. The stencil printing in the printing device 41 and the stencil printing in the printing device 42 are finished at substantially the same time. Opening / closing doors 41a and 41b of the printing apparatus 41 are opened. Opening and closing doors 42a and 42b of the printing apparatus 42 are opened. In this state, in the printing apparatus 41, the substrate 5 on which the arrangement of the first resin is completed is unloaded and a new substrate 5 is loaded. In the printing device 42, the substrate 5 on which the second resin is arranged is unloaded by the unloading device 47, and the next substrate 5 is unloaded by the transfer device 43.

  The substrates 5 that have been unloaded after the printing of the printing device 42 are collected, for example, in a rack that can accommodate a plurality of substrates 5. Curing is performed.

  As described above, the light emitting device manufacturing apparatus according to the present embodiment is formed so that printing in the printing apparatuses 41 and 42 is performed almost simultaneously. That is, the printing in the printing apparatus 41 and the printing in the printing apparatus 42 are synchronized. Further, the loading and unloading of the substrate 5 in the printing apparatus 41 and the loading and unloading of the substrate 5 in the printing apparatus 42 are performed almost simultaneously, and are synchronized. These synchronizations are performed by the control device. Furthermore, the control device controls the far-infrared furnace 44 and the transport device 43 so as to adjust the curing of the first resin. In the light emitting device manufacturing apparatus in the present embodiment, the first resin and the second resin can be continuously arranged. A light-emitting device having a high light collecting property can be manufactured continuously.

  The second stencil disposed in the printing device 42 of the present embodiment is the same as the first stencil disposed in the printing device 41, but is not limited to this form, and the second stencil disposed in the printing device 42. The two stencil plates may be different from the first stencil plate arranged in the printing apparatus 41.

  For example, as shown in the second embodiment, the size of the through hole of the second stencil plate disposed in the printing device 42 may be larger than the size of the through hole of the first stencil plate. I do not care. Alternatively, the size of the through hole of the second stencil plate may be formed so as to accommodate the first resin. In this case, the control device controls the support device so as to raise the stage to a height at which the substrate and the stencil come into contact with each other in the second printing device.

  The apparatus for manufacturing an optical device in the present embodiment transports a substrate by a belt conveyor, but is not limited to this form, and can transport a substrate by an arbitrary device.

  Other configurations, operations, methods, and effects are the same as those in the first or second embodiment, and thus description thereof will not be repeated here.

  The embodiments described above are illustrative rather than limiting the present invention. Moreover, in each figure, the same code | symbol is attached | subjected to the same part or an equivalent part.

FIG. 6 is a first process diagram of the method for manufacturing the light emitting device in the first embodiment. FIG. 6 is a second process diagram of the method for manufacturing the light emitting device in the first embodiment. FIG. 4 is a third process diagram of the method for manufacturing the light emitting device in the first embodiment. FIG. 6 is a fourth process diagram of the method for manufacturing the light emitting device in the first embodiment. FIG. 6 is a fifth process diagram of the method for manufacturing the light emitting device in the first embodiment. FIG. 10 is a sixth process diagram of the method for manufacturing the light emitting device in the first embodiment. FIG. 10 is a seventh process diagram of the method for manufacturing the light emitting device in the first embodiment. FIG. 10 is an eighth process diagram of the method for manufacturing the light emitting device in the first embodiment. FIG. 12 is an enlarged schematic cross-sectional view of a light emitting element portion in an eighth step of the method for manufacturing the light emitting device in the first embodiment. It is a 9th process drawing of the manufacturing method of the light emitting device in an embodiment. 1 is a schematic cross-sectional view of a light emitting device manufactured in Embodiment 1. FIG. 6 is a schematic cross-sectional view of a portion of a light emitting element in a second resin arrangement step in Embodiment 2. FIG. 6 is an enlarged schematic plan view of a second stencil according to Embodiment 2. FIG. FIG. 10 is an enlarged schematic plan view of another second stencil according to the second embodiment. FIG. 10 is a first process diagram of a method for manufacturing a light-emitting device in Embodiment 3. FIG. 10 is a second process diagram of the method for manufacturing the light emitting device in the third embodiment. FIG. 10 is a third process diagram of the method for manufacturing the light emitting device in the third embodiment. FIG. 12 is a fourth process diagram of the method for manufacturing the light emitting device in the third embodiment. FIG. 10 is a fifth process diagram of the method for manufacturing the light emitting device in the third embodiment. FIG. 10 is a sixth process diagram of the method for manufacturing the light emitting device in the third embodiment. FIG. 10 is a seventh process diagram of the method for manufacturing the light emitting device in the third embodiment. FIG. 10 is an eighth process diagram of the method for manufacturing the light emitting device in the third embodiment. FIG. 12 is a ninth process diagram of the method for manufacturing the light emitting device in the third embodiment.

Explanation of symbols

1, 2, 3 Stencil 1a, 2a, 3a Through-hole 5 Substrate 6 Light-emitting element 7 Wire 10, 11 Resin 23 Frame member 24 Stage 25 Lifting device 31, 32 Squeegee 41, 42 Printing device 41a, 41b, 42a, 42b Open / close door 43 Conveying device 44 Far-infrared furnace 46 Loading device 47 Unloading device 48 Vacuum vessel 53, 54 Arrow 61-63, 69 Arrow

Claims (11)

A first resin disposing step of covering the light emitting elements disposed on the surface of the substrate and disposing the first resin so that the cross-sectional shape is a mountain shape;
A curing step of curing the first resin;
And a second resin arrangement step of arranging a second resin on the surface of the first resin by stencil printing. The first resin arranging step includes a step of using a first stencil,
The second resin disposing step includes a step of using a second stencil having a through hole having a size equal to or smaller than the size of the through hole of the first stencil when viewed in plan,
2. The method for manufacturing a light emitting device according to claim 1, wherein the second resin arranging step includes a step of performing stencil printing by bringing the through hole of the second stencil plate into contact with the cured first resin. The first resin arranging step includes a step of using a first stencil,
2. The method for manufacturing a light emitting device according to claim 1, wherein the second resin arranging step includes a step of using a second stencil having a through hole larger than the through hole of the first stencil when viewed in plan.   The light emitting device manufacturing method according to claim 1, wherein the second resin arranging step includes a step of using a resin having the same main component as the first resin as the second resin.   The light emitting device manufacturing method according to claim 1, wherein the first resin arranging step includes a step of using a resin containing an inorganic material as the first resin.   The method for manufacturing a light-emitting device according to claim 5, wherein particles having a higher refractive index than the first resin and the second resin are used as the inorganic material.   The method for manufacturing a light emitting device according to claim 1, wherein the second resin arranging step includes a step of using a resin having a refractive index smaller than that of the first resin as the second resin.   The method for manufacturing a light emitting device according to claim 1, wherein the second resin arranging step includes a step of using a resin having a hardness higher than that of the first resin as the second resin. A light-emitting device manufacturing apparatus that covers a light-emitting element disposed on a surface of a substrate with a resin,
A first printing apparatus including a first stencil, and covering the light emitting element with a first resin by stencil printing with the first stencil;
A curing device for curing the first resin;
A second printing apparatus that includes a second stencil, and disposes a second resin outside the first resin by stencil printing with the second stencil;
A control device for controlling the first printing device, the second printing device and the curing device;
The curing device includes a transport device that transports the substrate from the first printing device to the second printing device,
An apparatus for manufacturing a light emitting device, wherein the first resin is cured while the substrate is transported from the first printing device to the second printing device by the transport device. The second printing apparatus has a support device for supporting the substrate on the lower side of the second stencil plate,
The second stencil has a through hole having a size equal to or smaller than the through hole of the first stencil when viewed in plan,
The light emitting device according to claim 9, wherein the control device is configured to control a position of the second support device so that the first resin comes to a height at which the first resin comes into contact with a through hole of the second stencil plate. Equipment manufacturing equipment. The second printing apparatus has a support device for supporting the substrate on the lower side of the second stencil plate,
The second stencil has a through hole larger than the through hole of the first stencil when viewed in plan,
The light emitting device manufacturing apparatus according to claim 9, wherein the control device is configured to control a position of the support device such that the second stencil plate is at a height at which the second stencil comes into contact with the substrate.

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