JP2009147175A - 発光装置及び車両用前照灯 - Google Patents

発光装置及び車両用前照灯 Download PDF

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Publication number
JP2009147175A
JP2009147175A JP2007323923A JP2007323923A JP2009147175A JP 2009147175 A JP2009147175 A JP 2009147175A JP 2007323923 A JP2007323923 A JP 2007323923A JP 2007323923 A JP2007323923 A JP 2007323923A JP 2009147175 A JP2009147175 A JP 2009147175A
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JP
Japan
Prior art keywords
light emitting
emitting device
emitting element
refrigerant
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007323923A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009147175A5 (enrdf_load_stackoverflow
Inventor
Akinori Shiraishi
晶紀 白石
Yuji Azuma
祐司 東
Osamu Kuboyama
治 久保山
Masanori Mizuno
正宣 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Shinko Electric Industries Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd, Shinko Electric Industries Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP2007323923A priority Critical patent/JP2009147175A/ja
Publication of JP2009147175A publication Critical patent/JP2009147175A/ja
Publication of JP2009147175A5 publication Critical patent/JP2009147175A5/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/46—Forced cooling using liquid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/60—Heating of lighting devices, e.g. for demisting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2007323923A 2007-12-14 2007-12-14 発光装置及び車両用前照灯 Pending JP2009147175A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007323923A JP2009147175A (ja) 2007-12-14 2007-12-14 発光装置及び車両用前照灯

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007323923A JP2009147175A (ja) 2007-12-14 2007-12-14 発光装置及び車両用前照灯

Publications (2)

Publication Number Publication Date
JP2009147175A true JP2009147175A (ja) 2009-07-02
JP2009147175A5 JP2009147175A5 (enrdf_load_stackoverflow) 2010-09-16

Family

ID=40917435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007323923A Pending JP2009147175A (ja) 2007-12-14 2007-12-14 発光装置及び車両用前照灯

Country Status (1)

Country Link
JP (1) JP2009147175A (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102207274A (zh) * 2010-03-31 2011-10-05 株式会社电装 用于机动车辆的头灯组件
DE102011006442A1 (de) 2010-03-31 2011-10-06 Denso Corporation Scheinwerfereinheit für ein Kraftfahrzeug
DE102011006725A1 (de) 2010-04-14 2011-10-20 Denso Corporation Scheinwerfereinheit
WO2014004899A1 (en) * 2012-06-27 2014-01-03 Flextronics Ap, Llc Relampable led structure
CN103574558A (zh) * 2012-07-20 2014-02-12 湖北凯美能源技术有限公司 一种led灯具冷却水控制系统
CN103644539A (zh) * 2013-12-13 2014-03-19 江苏晶和金江照明有限公司 一种高效led集成芯片捕鱼灯
CN105114919A (zh) * 2015-08-11 2015-12-02 电子科技大学 一种采用石蜡及水冷的散热装置
CN105351901A (zh) * 2015-12-12 2016-02-24 重庆信德电子有限公司 循环水式散热装置
CN106016148A (zh) * 2016-08-01 2016-10-12 苏州光景照明科技有限公司 一种新型led防爆灯
JP2017054669A (ja) * 2015-09-09 2017-03-16 岩崎電気株式会社 熱輸送装置、及び、照明器具
WO2017081999A1 (ja) * 2015-11-11 2017-05-18 Ｎｅｃライティング株式会社 ランプ
WO2021037814A1 (de) * 2019-08-28 2021-03-04 Marelli Automotive Lighting Reutlingen (Germany) GmbH Verbund aus einem kraftfahrzeugscheinwerfer und einem kühlmittelkreislauf eines kraftfahrzeugs
JP2023064595A (ja) * 2021-10-26 2023-05-11 ベジ 佐々木 電子装置及びヘッドライト

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296212A (ja) * 2003-03-26 2004-10-21 Toyoda Gosei Co Ltd 車両用ｌｅｄ灯具
JP2005026574A (ja) * 2003-07-04 2005-01-27 Toshiba Corp 配線基板
JP2005079065A (ja) * 2003-09-03 2005-03-24 Seiko Epson Corp 光源装置、光源装置の製造方法、投射型表示装置
JP2005221640A (ja) * 2004-02-04 2005-08-18 Seiko Epson Corp 光源装置及びプロジェクタ
JP2006140084A (ja) * 2004-11-15 2006-06-01 Koito Mfg Co Ltd 車両用灯具
WO2006114726A2 (en) * 2005-04-27 2006-11-02 Koninklijke Philips Electronics N.V. A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device
JP2007081234A (ja) * 2005-09-15 2007-03-29 Toyoda Gosei Co Ltd 照明装置
WO2007044577A1 (en) * 2005-10-13 2007-04-19 Intel Corporation Integrated micro-channels for 3d through silicon architectures
WO2007096938A1 (ja) * 2006-02-20 2007-08-30 Towa Denki Seisakusyo Co., Ltd. 集魚灯、集魚灯装置およびその冷却方法
JP2007273369A (ja) * 2006-03-31 2007-10-18 Stanley Electric Co Ltd 車両用灯具
JP2007303757A (ja) * 2006-05-12 2007-11-22 Seiko Epson Corp 熱交換器、光源装置及びプロジェクタ
JP2007324275A (ja) * 2006-05-31 2007-12-13 Toyoda Gosei Co Ltd 発光装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296212A (ja) * 2003-03-26 2004-10-21 Toyoda Gosei Co Ltd 車両用ｌｅｄ灯具
JP2005026574A (ja) * 2003-07-04 2005-01-27 Toshiba Corp 配線基板
JP2005079065A (ja) * 2003-09-03 2005-03-24 Seiko Epson Corp 光源装置、光源装置の製造方法、投射型表示装置
JP2005221640A (ja) * 2004-02-04 2005-08-18 Seiko Epson Corp 光源装置及びプロジェクタ
JP2006140084A (ja) * 2004-11-15 2006-06-01 Koito Mfg Co Ltd 車両用灯具
WO2006114726A2 (en) * 2005-04-27 2006-11-02 Koninklijke Philips Electronics N.V. A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device
JP2007081234A (ja) * 2005-09-15 2007-03-29 Toyoda Gosei Co Ltd 照明装置
WO2007044577A1 (en) * 2005-10-13 2007-04-19 Intel Corporation Integrated micro-channels for 3d through silicon architectures
JP2009512215A (ja) * 2005-10-13 2009-03-19 インテル・コーポレーション ３ｄ貫通シリコンアーキテクチャのための集積マイクロチャネル
WO2007096938A1 (ja) * 2006-02-20 2007-08-30 Towa Denki Seisakusyo Co., Ltd. 集魚灯、集魚灯装置およびその冷却方法
JP2007273369A (ja) * 2006-03-31 2007-10-18 Stanley Electric Co Ltd 車両用灯具
JP2007303757A (ja) * 2006-05-12 2007-11-22 Seiko Epson Corp 熱交換器、光源装置及びプロジェクタ
JP2007324275A (ja) * 2006-05-31 2007-12-13 Toyoda Gosei Co Ltd 発光装置

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102207274A (zh) * 2010-03-31 2011-10-05 株式会社电装 用于机动车辆的头灯组件
DE102011006442A1 (de) 2010-03-31 2011-10-06 Denso Corporation Scheinwerfereinheit für ein Kraftfahrzeug
DE102011006440A1 (de) 2010-03-31 2011-10-06 Denso Corporation Scheinwerfereinheit für ein Kraftfahrzeug
US8382353B2 (en) 2010-03-31 2013-02-26 Nippon Soken, Inc. Headlamp assembly for motor vehicle
US8678631B2 (en) 2010-03-31 2014-03-25 Denso Corporation Vehicle headlamp assembly with convection airflow controlling plate
DE102011006725A1 (de) 2010-04-14 2011-10-20 Denso Corporation Scheinwerfereinheit
US8508133B2 (en) 2010-04-14 2013-08-13 Denso Corporation Headlamp assembly
WO2014004899A1 (en) * 2012-06-27 2014-01-03 Flextronics Ap, Llc Relampable led structure
CN103574558A (zh) * 2012-07-20 2014-02-12 湖北凯美能源技术有限公司 一种led灯具冷却水控制系统
CN103644539A (zh) * 2013-12-13 2014-03-19 江苏晶和金江照明有限公司 一种高效led集成芯片捕鱼灯
CN105114919A (zh) * 2015-08-11 2015-12-02 电子科技大学 一种采用石蜡及水冷的散热装置
CN105114919B (zh) * 2015-08-11 2018-02-13 电子科技大学 一种采用石蜡及水冷的散热装置
JP2017054669A (ja) * 2015-09-09 2017-03-16 岩崎電気株式会社 熱輸送装置、及び、照明器具
WO2017081999A1 (ja) * 2015-11-11 2017-05-18 Ｎｅｃライティング株式会社 ランプ
JPWO2017081999A1 (ja) * 2015-11-11 2018-08-30 Ｎｅｃライティング株式会社 ランプ
US10627057B2 (en) 2015-11-11 2020-04-21 HotaluX, Ltd. Lamp
CN105351901A (zh) * 2015-12-12 2016-02-24 重庆信德电子有限公司 循环水式散热装置
CN105351901B (zh) * 2015-12-12 2018-10-16 重庆信德电子有限公司 循环水式散热装置
CN106016148A (zh) * 2016-08-01 2016-10-12 苏州光景照明科技有限公司 一种新型led防爆灯
WO2021037814A1 (de) * 2019-08-28 2021-03-04 Marelli Automotive Lighting Reutlingen (Germany) GmbH Verbund aus einem kraftfahrzeugscheinwerfer und einem kühlmittelkreislauf eines kraftfahrzeugs
JP2023064595A (ja) * 2021-10-26 2023-05-11 ベジ 佐々木 電子装置及びヘッドライト

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