JP2009146328A - Device for mounting electronic part and method to read one-dimensional bar code - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for mounting electronic parts and a method for reading one-dimensional bar codes capable of reading the one-dimensional bar codes by a simplified and low-cost mechanism without restriction on paste position of the bar code. <P>SOLUTION: The device move a camera according to a set divided imaged pattern and repeatedly images the one-dimensional bar code to obtain first, second and third divided images G1, G2, G3 dividing the one-dimensional bar code, generates a single synthetic bar code image 15* of the one-dimensional bar code by synthesizing the acquired divided images G1, G2, G3, and reads the one-dimensional bar code information by scanning the synthetic bar code image 15*. This eliminates the need of the imaging means of wider angle and the dedicated reading device and enables the one-dimensional bar code to be read by the simplified mechanism at low-cost. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and a method for reading a one-dimensional barcode that reads a one-dimensional barcode applied in advance to a component holding unit that holds a substrate or an electronic component in the electronic component mounting apparatus.

In recent years, in the manufacturing industry, it has been required to ensure so-called traceability that enables individual product histories to be traced due to a requirement for product quality assurance. For example, in the field of electronic equipment manufacturing, it is required to identify a defective product by going back to the process so that the cause can be investigated when a defect is discovered after the post-process or product shipment. For this reason, identification information indicating the product type, production lot number, production date, etc. is displayed on the substrate flowing through the production line such as the electronic component production line and the electronic component mounting line and the wafer jig holding the electronic component. It is applied individually using an information code or the like. Each time these substrates or wafer jigs are carried into each device constituting the production line, the barcode is read. Such one-dimensional barcode reading is generally performed by a dedicated barcode reader using a laser sensor, and information is read by scanning the one-dimensional barcode with laser light (see Patent Document 1). In this patent document, a barcode reading head is mounted on a moving beam that moves above a component supply unit to read a barcode attached to a wafer jig.
Japanese Patent No. 3757900

  However, in reading barcodes shown in the above-mentioned patent documents, since it is necessary to provide a dedicated device, the increase in equipment cost is unavoidable, and the reading direction is defined by the mounting direction of the reading device. There were restrictions on the direction in which readable barcodes could be applied. As described above, in conventional electronic component mounting, it is difficult to read a one-dimensional barcode applied to a substrate, a wafer jig, or the like without restriction of a barcode application position by a simple and low-cost mechanism.

  SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electronic component mounting apparatus and a one-dimensional barcode reading method capable of reading a one-dimensional barcode with a simple and low-cost mechanism without restriction on the barcode application position. And

The electronic component mounting apparatus according to the present invention includes an imaging unit that images the substrate held by the substrate holding unit and / or the component holding unit that holds the electronic component in the component supply unit that supplies the electronic component, and the imaging unit An imaging moving unit that moves relative to a target, a recognition processing unit that recognizes image data acquired by the imaging unit, and an imaging field of view of the imaging unit that is applied in advance to the substrate and / or the component holding unit. A division for obtaining a divided image obtained by dividing the one-dimensional barcode into a plurality of images by imaging a one-dimensional barcode larger than the one-dimensional barcode by the imaging means a plurality of times while moving the imaging means by the imaging movement means. A barcode divided imaging pattern setting unit for setting an imaging pattern, the imaging unit and the imaging moving unit are connected to the divided imaging pattern. An image pickup control unit that controls the image based on the image, a barcode image synthesis unit that generates a single image of the one-dimensional barcode by synthesizing the divided images, and the 1 image from the synthesized single image. A barcode reading unit that reads information of a three-dimensional barcode, and the barcode divided imaging pattern setting unit is configured to perform the divided imaging so that end portions of two adjacent divided images overlap each other by a predetermined overlapping width. A pattern is set, and the barcode image synthesis unit performs pattern matching on a matching region set in the overlapping width range of the two adjacent divided images, thereby performing the two adjacent Align the divided images.

  The method for reading a one-dimensional barcode of the present invention includes: an imaging unit that images the board held by the board holding unit and / or a component holding unit that holds the electronic component in the component supply unit; In an electronic component mounting apparatus comprising an imaging moving means for relative movement with respect to the image processing apparatus and a recognition processing section for recognizing image data acquired by the imaging means, it is applied in advance to the substrate and / or the component holding section. A method for reading a one-dimensional barcode, wherein a one-dimensional barcode is read, wherein the one-dimensional barcode is larger than the size of the imaging field of view of the imaging means, and the imaging means moves the imaging means while the imaging means moves the one-dimensional bar. A divided imaging path for acquiring a divided image obtained by imaging the code a plurality of times and dividing the one-dimensional barcode into a plurality of parts. A divided imaging pattern setting step for setting an image; a divided image acquiring step for acquiring a plurality of the divided images by controlling the imaging means and the imaging moving means according to the divided imaging pattern; and the divided images are synthesized. An image synthesizing step for generating a single image of the one-dimensional bar code, and an information reading step for reading the information of the one-dimensional bar code from the synthesized single image. In the step, the divided imaging pattern is set so that ends of two adjacent divided images overlap each other by a predetermined overlapping width, and in the image synthesis step, the two adjacent divided images By performing pattern matching on the matching area set in the overlap width range, the positions of the two adjacent divided images It performs fast-growing.

  According to the present invention, the image pickup means and the image pickup moving means are controlled according to the divided image pickup pattern to obtain a divided image obtained by dividing the one-dimensional barcode into a plurality of parts, and the obtained divided images are combined to obtain the one-dimensional barcode. By generating a single image and reading the information of the one-dimensional barcode from the combined single image, the one-dimensional bar can be obtained without requiring a large-field imaging means or a dedicated reading device. The code can be read at a low cost with a simple mechanism.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a plan sectional view of the electronic component mounting apparatus, FIG. 4 is an explanatory view of the attachment position of the one-dimensional barcode to be read in the electronic component mounting apparatus of one embodiment of the present invention, and FIG. 5 is one embodiment of the present invention. 6 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus according to the embodiment, FIG. 6 is a process flow diagram of the one-dimensional barcode reading method according to one embodiment of the present invention, and FIGS. It is explanatory drawing which shows the reading method of the one-dimensional barcode of one embodiment.

  First, the overall structure of an electronic component mounting apparatus as an electronic component mounting apparatus will be described with reference to FIG. 1, FIG. 2, and FIG. 2 shows an AA arrow view in FIG. 1, and FIG. 3 shows a BB arrow view in FIG. In FIG. 1, a component supply unit 2 is disposed on a base 1. As shown in FIGS. 2 and 3, the component supply unit 2 includes a jig holding unit 3, and the jig holding unit 3 detachably holds the wafer jig 4 on which the sheet 5 is mounted. The sheet 5 holds and holds a plurality of electronic components 6 on the upper surface. That is, the wafer jig 4 is a component holding unit that holds the electronic component 6 in the component supply unit 2.

As shown in FIG. 2, an ejector 8 is disposed below the sheet 5 held by the jig holding unit 3 so as to be horizontally movable by an ejector moving table 7. The ejector 8 has a function of promoting the peeling of the electronic component 6 from the sheet 5 when the electronic component 6 is picked up and taken out from the sheet 5 while contacting the lower surface of the sheet 5 with the upper surface. . The ejector moving table 7 includes an XY table mechanism, whereby the ejector 8 moves in the horizontal direction along the lower surface of the sheet 5.

  As shown in FIG. 3, a substrate holding unit 10 that holds a substrate 13 on which the electronic component 6 is mounted is disposed at a position away from the electronic component supply unit 2 in the Y direction on the upper surface of the base 1. A substrate carry-in conveyor 11 and a substrate carry-out conveyor 12 are arranged in series in the X direction on the upstream side and the downstream side of the substrate holding unit 10, respectively. The board carry-in conveyor 11 is disposed over the sub-base 1a connected to the base 1, and the adhesive supply unit 9 is provided on the sub-base 1a. The adhesive supply unit 9 applies a chip bonding adhesive to the substrate 13 carried into the substrate carry-in conveyor 11 from the upstream side. The substrate 13 after application of the adhesive is transferred to the substrate holding unit 10, where the mounted substrate 13 on which electronic components are mounted is carried out downstream by the substrate carry-out conveyor 12.

  In FIG. 1, the first Y-axis base 20A and the second Y-axis base 20B are arranged at both ends of the upper surface of the base 1 with the longitudinal direction facing the Y direction orthogonal to the substrate transport direction (X direction). It is installed. On the upper surfaces of the first Y-axis base 20A and the second Y-axis base 20B, a first direction guide 21 is disposed over substantially the entire length in the longitudinal direction (Y direction).

  The pair of first direction guides 21 includes three beam members, a first beam member 31, a center beam member 30 and a second beam member 32, both ends of which are supported by the first direction guide 21. It is slidable in the direction. The center beam member 30 is horizontally moved in the Y direction along the first direction guide 21 by a center beam Y axis moving mechanism including a nut member 23b, a feed screw 23a and a Y axis motor 22. The first beam member 31 is horizontally moved in the Y direction along the first direction guide 21 by the first Y axis moving mechanism including the nut member 25b, the feed screw 25a, and the Y axis motor 24. Further, the second beam member 32 is horizontally moved in the Y direction along the first direction guide 21 by the second Y axis moving mechanism including the nut member 27 b, the feed screw 27 a and the Y axis motor 26.

  A mounting head 33 is mounted on the center beam member 30. The mounting head 33 is provided with a second direction guide 42 (see FIG. 2) by a center beam X-axis moving mechanism including a nut member 41b, a feed screw 41a, and an X-axis motor 40. ) To move in the X direction. The mounting head 33 takes out the electronic component 6 from the component supply unit 2 and transfers and mounts the electronic component 6 on the substrate 13 held by the substrate holding unit 10.

  A first camera 34 is mounted on the first beam member 31, and the first camera 34 is driven by a first X-axis moving mechanism including a nut member 44 b, a feed screw 44 a and an X-axis motor 43. It is guided by a second direction guide 45 (see FIG. 2) provided on the side surface of 31 and moves in the X direction. A second camera 35 is attached to the second beam member 32. The second camera 35 is guided to a second direction guide 48 (see FIG. 2) provided on the side surface of the second beam member 32 by a second X-axis moving mechanism including a nut member 47b, a feed screw 47a, and an X-axis motor 46. And move in the X direction.

By driving the first X-axis moving mechanism and the first Y-axis moving mechanism, the first camera 34 moves horizontally in the X direction and the Y direction. Accordingly, the first camera 34 can move above the substrate holding unit 10 for imaging the substrate 13 held by the substrate holding unit 10. Further, by driving the second X-axis moving mechanism and the second Y-axis moving mechanism, the second camera 35 moves horizontally in the X direction and the Y direction. As a result, the second camera 35 images the electronic component 6 held on the sheet 5 in the component supply unit 2 and the electronic component 6 in the component supply unit 2.
The wafer jig 4 that is a component holding unit for holding the image is imaged.

  Therefore, the first camera 34 and the second camera 35 are a wafer as a component holding unit that holds the electronic component 6 in the component supply unit 2 that supplies the substrate 13 and / or the electronic component 6 held by the substrate holding unit 10. It is an imaging means for imaging the jig 4. Then, the first X-axis moving mechanism and the first Y-axis moving mechanism for moving the first camera 34, and the second X-axis moving mechanism and the second Y-axis moving mechanism for moving the second camera 35 are configured to move the imaging unit with respect to the imaging target. Imaging moving means for relative movement. In the present embodiment, an example of the wafer jig 4 that holds the chip-shaped electronic component 6 as a component holding unit that holds the electronic component is shown, but a package component or the like is arranged in a predetermined arrangement as the component holding unit. An example using a tray for storing and holding may be used.

  As shown in FIG. 3, the third camera 17 is disposed within the moving range of the mounting head 33 by the mounting head moving mechanism between the electronic component supply unit 2 and the substrate holding unit 10. The third camera 17 is a line-type camera, and the mounting head 33 that picks up the electronic component 6 in the electronic component supply unit 2 is above the third camera 17 with the illumination unit 17 a disposed on the upper surface turned on. Is moved in the X direction, the electronic component 6 held by the nozzle 33a of the mounting head 33 is observed from below, and an image of the electronic component 6 is taken.

  Next, the recognition mark 13a and the one-dimensional barcode 15 formed on the substrate 13 will be described with reference to FIG. As shown in FIG. 4A, recognition marks 13a are provided at two opposing diagonal positions that form a pair on the substrate 13. By moving the first camera 34 above the substrate 13 conveyed by the substrate carry-in conveyor 11 and conveyed to the component mounting position, the first camera 34 recognizes images obtained by sequentially capturing the two recognition marks 13a. The position of the recognition mark 13a is recognized. In the component mounting operation on the substrate 13 by the mounting head 33, the electronic component 6 is mounted on the substrate 13 based on the position recognition result of the recognition mark 13 a and the position recognition result of the electronic component 6 by the first camera 34. Position correction is performed.

  In the vicinity of the recognition mark 13 a at one diagonal position of the substrate 13, a one-dimensional barcode 15 on which various information about the substrate 13 is recorded is pre-processed in advance by a method of attaching a barcode label or the like. Applied. The one-dimensional barcode 15 incorporates information related to the substrate 13 such as ID information for identifying the substrate as an individual and product information including the type and attribute of the substrate. Similar to the recognition mark 13a, the one-dimensional barcode 15 is captured as an image by being captured by the first camera 34, and various kinds of information described above are read by performing recognition processing on the image.

  FIG. 4B shows a one-dimensional barcode 15 </ b> A applied to the wafer jig 4 held by the component supply unit 2. Similarly, in this case, the one-dimensional barcode 15A is obtained by a method of attaching a barcode label to either the sheet 5 for attaching and holding the electronic component 6 or the ring-shaped wafer jig 4 on which the sheet 5 is stretched. Applied. The one-dimensional barcode 15A incorporates information related to the electronic component 6 such as ID information for identifying the wafer as an assembly of the electronic component 6 and product information including the type and attribute of the electronic component 6. Yes. Similarly, the one-dimensional barcode 15A is captured by the second camera 35 and captured as an image, and various kinds of information described above are read by performing recognition processing on the image.

The first camera 34 and the second camera 35 used for imaging the one-dimensional barcodes 15 and 15A are provided for the purpose of imaging the original recognition mark 13a and the individual electronic components 6 as targets. The imaging visual field size is a size that can completely include the recognition mark 13a and the individual electronic components 6. In contrast, the one-dimensional barcode 15, 15A
Is larger than the size of the recognition mark 13a or the individual electronic component 6, and the entire field of view of the barcode cannot be covered by the imaging field of view of the first camera 34 and the second camera 35 (see FIG. 7). Therefore, in the present embodiment, as will be described below, the one-dimensional barcodes 15 and 15A are imaged a plurality of times by the first camera 34 and the second camera 35, and the one-dimensional barcodes 15 and 15A are recorded. A single image of the one-dimensional barcode 15, 15A is obtained by acquiring the divided images and synthesizing the acquired divided images.

  Next, the configuration of the control system will be described with reference to FIG. Here, of the control functions of the electronic component mounting apparatus, only functions related to imaging and reading of the one-dimensional barcodes 15 and 15A are shown. In FIG. 5, a control unit 50 is an arithmetic device including a CPU, and performs control that controls each unit described below. The storage unit 51 is a storage device such as a hard disk, and stores control programs for various processes described below, and is applied in advance to the substrate 13 and the wafer jig 4 to be mounted with electronic components in advance. Board data and component data including data relating to the shape and size of the one-dimensional barcodes 15 and 15A are stored in advance.

  The barcode division imaging pattern setting unit 52 applies the one-dimensional barcodes 15 and 15A, which are applied in advance to the board and / or the component holding unit and have a size larger than the size of the imaging field of view of the first camera 34 and the second camera 35. A divided imaging pattern for obtaining the divided images divided into a plurality of images by the first camera 34 and the second camera 35 is set. These divided images are obtained by imaging the one-dimensional barcodes 15 and 15A a plurality of times by the first camera 34 and the second camera 35 while moving the first camera 34 and the second camera 35 by the imaging moving means. Obtained by Here, the barcode division imaging pattern setting unit 52 sets the division imaging pattern based on the size of the imaging field of view and the sizes of the one-dimensional barcodes 15 and 15A stored in the storage unit 51. Further, the barcode divided imaging pattern setting unit 52 sets the divided imaging patterns so that the ends of two adjacent divided images overlap each other by a predetermined overlap width.

  The barcode image synthesis unit 53 synthesizes the divided images of the one-dimensional barcodes 15 and 15A acquired by the first camera 34 and the second camera 35 to thereby generate a single one-dimensional barcode 15 and 15A. Generate an image. At this time, the barcode image composition unit 53 performs pattern matching on a matching region set within the overlapping width of two adjacent divided images, thereby aligning the two adjacent divided images. To do. For this pattern matching, a normalized correlation pattern matching technique is used.

  The barcode reading unit 54 reads information of the one-dimensional barcodes 15 and 15A from a single image of the synthesized one-dimensional barcode 15. The mechanism driving unit 55 is an imaging moving unit that moves the first camera 34 and the second camera 35, that is, a first X-axis moving mechanism and a first Y-axis moving mechanism that move the first camera 34, and the second camera 35. The second X-axis moving mechanism and the second Y-axis moving mechanism for moving the X-axis are driven.

  The control unit 50 controls the mechanism driving unit 55, the first camera 34, and the second camera 35 based on the divided imaging pattern set by the barcode divided imaging pattern setting unit 52, whereby the first camera 34, the second camera 35 moves above the substrate 13 and the wafer jig 4, and images the one-dimensional barcodes 15 and 15A a plurality of times to obtain a plurality of divided images. Therefore, the control unit 50 functions as an imaging control unit that controls the imaging unit and the imaging moving unit based on the divided imaging pattern. The recognition processing unit 56 performs recognition processing on the image data acquired by the first camera 34, the second camera 35, and the third camera 17. Thereby, the position recognition of the recognition mark 13a and the electronic component 6 is performed.

Next, a method for reading a one-dimensional barcode in an electronic component mounting apparatus used in an electronic component mounting line for mounting electronic components on a substrate will be described along the flow of FIG. 6 with reference to FIGS. . Here, processing is shown in the case of reading a one-dimensional barcode 15 that is applied in advance to the substrate 13 and whose size is larger than the size of the imaging field of view of the first camera 34 that is the imaging means. A similar process is executed when the second camera 35 reads a one-dimensional barcode 15A previously applied to the wafer jig 4 held in the component supply unit 2.

  In FIG. 6, first, the substrate 13 is carried from the upstream device to the substrate carry-in conveyor 11 (ST1), and the substrate data of the substrate 13 is read from the storage unit 51, whereby the one-dimensional bar applied to the substrate 13 is read. Data including the size of the code 15 is read. Next, the one-dimensional barcode 15 is divided in accordance with the size of the imaging field of view of the first camera 34 (ST2). That is, a divided-segment imaging pattern for acquiring a segmented image obtained by segmenting the one-dimensional barcode 15 into a plurality by the first camera 34 while moving the first camera 34 by the imaging movement means 52 is set (divided imaging pattern setting step).

  Here, as shown in FIG. 7A, the one-dimensional barcode 15 having the length L is divided and imaged by the imaging field V of the field size a in the longitudinal direction. Inside the imaging field of view V, a divided region R for dividing the one-dimensional barcode 15 is set with a region size b in the longitudinal direction. In this divided imaging pattern setting step, when determining a divided pattern, first, the number of divisions that can completely cover the length L by obtaining a plurality of divided regions R adjacent to each other is obtained. Here, the length dimension L can be covered by adjoining three divided areas R of the area dimension b.

  Next, the position of the imaging visual field V is determined based on the number of divisions. That is, as shown in FIGS. 7B, 7C, and 7D, the position of the imaging visual field V is sequentially determined so that the edge lines of the adjacent divided regions R overlap and are adjacent to each other, and the imaging visual field at this time Are obtained as barcode imaging positions P1, P2, and P3, respectively. At this time, the adjacent imaging fields of view V are in a positional relationship where they overlap each other by the overlap width D. That is, in the setting of the divided imaging pattern, the divided imaging pattern is set so that the ends of two adjacent divided images overlap each other by a predetermined overlap width. As will be described later, the range of the overlap width D includes an area to be subjected to pattern matching when the divided images are connected to create a composite image.

  Subsequently, the divided image of the one-dimensional barcode 15 is acquired by controlling the first camera 34 and the imaging moving means for moving the first camera 34 by the control unit 50 according to the set divided imaging pattern ( Split image acquisition process). That is, as shown in FIG. 8A, first, the representative point of the imaging visual field V is moved to the barcode imaging position P1 of the first division (ST3), and the first camera 34 sets the range of the first division. The first divided image G1 is acquired by imaging (ST4).

  Then, the presence / absence of the next division is confirmed (ST5). If the next division is present, the process returns to (ST3) and the same processing is executed for the next division. As shown in FIGS. 8B and 8C, N The representative point of the imaging field of view V is moved to the barcode imaging positions P2, P3 of the division (second division, third division), and the second divided image G2, the third divided image G3 are sequentially acquired. Then, in (ST5), it is confirmed that there is no next division, and the divided image acquisition step is ended. Next, image composition processing of the one-dimensional barcode 15 is executed (ST6). That is, a single image of the one-dimensional barcode 15 is generated by combining the plurality of divided images acquired in this way by the barcode image combining unit 53 (image combining step). In the image synthesizing process shown in the present embodiment, the above overlapping width D is overlapped and pattern matching is performed, so that the alignment between the divided images is performed with high accuracy.

  That is, as shown in FIG. 9A, first, the matching processing region r1 is set including the edge line at the right end of the divided region R1 in the first divided image G1, and set in the second divided image G2. The matching reference region r2 is set including the edge line at the left end of the divided region R2. Here, the matching processing region r1 and the matching reference region r2 are matching regions that are set for pattern matching that is intended to detect misalignment errors between two divided regions R1 and R2 that are originally adjacent to each other. The matching processing region r1 is a processing region that is a target of matching processing, and the matching reference region r2 is a region that is used as a template that is referred to in the matching processing. That is, in this image composition step, the adjacent two divided images are aligned by performing pattern matching on the matching region set in the overlapping width range of the two adjacent divided images.

  The pattern matching performed here uses a normalized correlation pattern matching technique. That is, in the matching processing region r1 and the matching reference region r2, the average brightness of the entire image in these regions is obtained, and after normalizing by subtracting the average brightness from the brightness of each pixel constituting these regions, the matching processing region The position where the pattern of r1 and the matching reference region r2 most closely matches is searched. In the example shown in the present embodiment, a search covering about ± 3 pixels may be performed, and the number of matchings may be about seven. As a result, it is possible to minimize the influence of variations in illumination state and noise during imaging, and to ensure stable matching accuracy. Data for alignment of divided images, that is, two adjacent divided regions The positional deviation correction amount when connecting R1 and R2 can be obtained with high accuracy.

  Next, the same processing as the processing shown in FIG. 8A is executed for the second divided image G2 and the third divided image G3. Thereby, data for alignment between the divided image G1 and the second divided image G2 and data for alignment between the second divided image G2 and the third divided image G3 are acquired. Then, using these alignment data, as shown in FIG. 9B, the divided image G1, the second divided image G2, and the third divided image G3 are aligned to obtain a single composite barcode image 15. Process to generate *. As a result, it is possible to synthesize images with high accuracy by eliminating errors caused by position errors during imaging as much as possible. Then, the information of the one-dimensional barcode 15 is read by the barcode reading unit 54 from the single combined barcode image 15 * synthesized in this way (ST7) (information reading step).

  As described above, in the present embodiment, a divided imaging pattern for acquiring a plurality of divided images by imaging a one-dimensional barcode having a size larger than the size of the imaging field of view of the imaging unit a plurality of times is set. A single image of a one-dimensional barcode is generated by combining a plurality of divided images acquired by controlling the imaging unit and the imaging moving unit according to the divided imaging pattern. This makes it possible to read a one-dimensional barcode at a low cost with a simple mechanism without requiring a large-field imaging means or a dedicated imaging means.

  Further, in the present embodiment, the one-dimensional barcodes 15 and 15A are imaged by the first camera 34 and the second camera 35 that are movable in the X direction and the Y direction. There is no restriction on the barcode attaching direction in the jig 4. That is, in the conventional technique for reading a one-dimensional bar code by a dedicated reading device using a laser scanner, it is necessary to stick the bar code in a certain direction defined by the arrangement direction of the reading device. In this embodiment, there is an advantage that a barcode can be attached in any direction.

In the present embodiment, the one-dimensional barcodes 15 and 15A are applied to both the substrate 13 and the wafer jig 4, respectively. However, the one-dimensional bar is applied to either the substrate 13 or the wafer jig 4. The code 15 or the one-dimensional barcode 15A may be applied. In the present embodiment, an example of an electronic component mounting apparatus in which the electronic component 6 is taken out from the component holding unit (wafer jig 4) and mounted on the substrate 13 as an electronic component mounting apparatus is shown. The present invention is not limited, and any apparatus that works on either a component holding unit or a substrate to which a one-dimensional barcode is applied is an application target of the present invention. That is, in the electronic component mounting field, the present invention can also be applied to a component take-out device that takes out an electronic component from a component holding unit, an inspection device that performs various inspections on a substrate, and the like.

  The electronic component mounting apparatus and the one-dimensional barcode reading method of the present invention can read barcodes with a simple mechanism at a low cost without requiring a large-field imaging means or a dedicated imaging means. It can be used for various devices in the electronic component mounting field such as an electronic component mounting device.

The top view of the electronic component mounting apparatus of one embodiment of this invention 1 is a side sectional view of an electronic component mounting apparatus according to an embodiment of the present invention. Plan sectional drawing of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the sticking position of the one-dimensional barcode used as reading object in the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention Process flow diagram of one-dimensional barcode reading method of one embodiment of the present invention Explanatory drawing which shows the reading method of the one-dimensional barcode of one embodiment of this invention Explanatory drawing which shows the reading method of the one-dimensional barcode of one embodiment of this invention Explanatory drawing which shows the reading method of the one-dimensional barcode of one embodiment of this invention

Explanation of symbols

2 Component supply unit 4 Wafer jig 6 Electronic component 10 Substrate holding unit 13 Substrate 15, 15A One-dimensional barcode 34 First camera 35 Second camera V Imaging field of view R Divided region G1 First divided image G2 Second divided image G3 Third divided image r1 matching processing area r2 matching reference area

Claims (4)

An image pickup means for picking up an image of a component holding section for holding the electronic component in a component supply section for supplying a substrate and / or an electronic component held by the substrate holding section, and an image pickup moving means for moving the image pickup means relative to an image pickup target A recognition processing unit that performs recognition processing on the image data acquired by the imaging unit;
A one-dimensional barcode, which is applied in advance to the substrate and / or the component holding unit and has a size larger than the size of the imaging field of view of the imaging unit, is imaged a plurality of times by the imaging unit while the imaging unit is moved by the imaging moving unit. A barcode division imaging pattern setting unit for setting a division imaging pattern for obtaining a divided image obtained by dividing the one-dimensional barcode into a plurality of images,
An imaging control unit that controls the imaging unit and the imaging moving unit based on the divided imaging pattern; a barcode image synthesis unit that generates a single image of the one-dimensional barcode by synthesizing the divided images; A barcode reader that reads information of the one-dimensional barcode from the synthesized single image,
The barcode divided imaging pattern setting unit sets the divided imaging pattern so that end portions of two adjacent divided images overlap each other by a predetermined overlap width,
The barcode image combining unit performs pattern matching on a matching region set in the overlap width range of the two adjacent divided images, thereby aligning the two adjacent divided images. An electronic component mounting apparatus characterized by:   2. The electronic component mounting apparatus according to claim 1, wherein the barcode image synthesis unit uses a normalized correlation pattern matching technique for the pattern matching. An imaging means for imaging the board held by the board holding section and / or a component holding section for holding the electronic component in the component supply section; an imaging moving means for moving the imaging means relative to an imaging target; In an electronic component mounting apparatus including a recognition processing unit that performs recognition processing on image data acquired by an imaging unit, a size that is applied in advance to the substrate and / or the component holding unit is larger than a size of an imaging field of view of the imaging unit. A method of reading a one-dimensional barcode that reads a large one-dimensional barcode,
While the image pickup means is moved by the image pickup moving means, the image pickup means picks up the one-dimensional barcode a plurality of times and sets a divided image pickup pattern for obtaining a divided image obtained by dividing the one-dimensional barcode into a plurality of pieces. A divided imaging pattern setting step;
A divided image acquisition step of acquiring a plurality of the divided images by controlling the imaging unit and the imaging moving unit according to the divided imaging pattern, and a single image of the one-dimensional barcode by combining the divided images And an information reading step of reading information of the one-dimensional barcode from the single image thus combined,
In the divided imaging pattern setting step, the divided imaging pattern is set so that end portions of two adjacent divided images overlap each other by a predetermined overlapping width,
In the image composition step, the adjacent two divided images are aligned by performing pattern matching on a matching region set in the overlapping width range of the two adjacent divided images. A method for reading a one-dimensional bar code.   4. The one-dimensional barcode reading method according to claim 3, wherein a normalization correlation pattern matching technique is used for the pattern matching in the image synthesis step.

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