JP2009143992A5 - - Google Patents

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Publication number
JP2009143992A5
JP2009143992A5 JP2007320245A JP2007320245A JP2009143992A5 JP 2009143992 A5 JP2009143992 A5 JP 2009143992A5 JP 2007320245 A JP2007320245 A JP 2007320245A JP 2007320245 A JP2007320245 A JP 2007320245A JP 2009143992 A5 JP2009143992 A5 JP 2009143992A5
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JP
Japan
Prior art keywords
base material
bonding
bonding film
joining
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007320245A
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English (en)
Japanese (ja)
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JP2009143992A (ja
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Priority to JP2007320245A priority Critical patent/JP2009143992A/ja
Priority claimed from JP2007320245A external-priority patent/JP2009143992A/ja
Publication of JP2009143992A publication Critical patent/JP2009143992A/ja
Publication of JP2009143992A5 publication Critical patent/JP2009143992A5/ja
Withdrawn legal-status Critical Current

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JP2007320245A 2007-12-11 2007-12-11 接合方法および接合体 Withdrawn JP2009143992A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007320245A JP2009143992A (ja) 2007-12-11 2007-12-11 接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007320245A JP2009143992A (ja) 2007-12-11 2007-12-11 接合方法および接合体

Publications (2)

Publication Number Publication Date
JP2009143992A JP2009143992A (ja) 2009-07-02
JP2009143992A5 true JP2009143992A5 (cg-RX-API-DMAC7.html) 2011-01-27

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ID=40914991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007320245A Withdrawn JP2009143992A (ja) 2007-12-11 2007-12-11 接合方法および接合体

Country Status (1)

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JP (1) JP2009143992A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5645068B2 (ja) * 2009-12-09 2014-12-24 三菱レイヨン株式会社 透明樹脂板平面の積層接着方法
KR20120120241A (ko) 2010-01-19 2012-11-01 고쿠리츠다이가쿠호진 토쿄고교 다이가꾸 경질 실리콘 수지의 접착 방법, 미세 구조를 갖는 기판의 접합 방법 및 해당 접합 방법을 이용한 마이크로 유체 디바이스의 제조 방법
JP5516954B2 (ja) * 2010-01-19 2014-06-11 国立大学法人東京工業大学 微細構造を有する基板の接合方法および当該接合方法を利用したマイクロ流体デバイスの製造方法

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