JP2009141791A - Method of manufacturing imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an imaging apparatus enabling a precise position adjustment of an image sensor quickly. <P>SOLUTION: There are first to fourth processes in the method of manufacturing the imaging apparatus for receiving a pair of luminous fluxes AB1, AB2 emitted from regions 341, 342, where the pupil of an optical system differs, and assembling the image sensor 111, where a focus detection pixel 116 for detecting the focus adjustment state of the optical system exists on an imaging surface 114, to a camera body 10. In the first process, an image pattern 300 is formed on a scheduled focal plane FP of the optical system. In the second process, imaging patterns 421, 422 corresponding to the imaging pattern 300 are acquired on an imaging surface 114. In the third process, amounts of defocus def0, def2, def3 to the scheduled focal plane FP of the imaging surface 114 are detected based on output from a focus detection pixel 116. In the fourth process, the position or posture of the image sensor 111 is adjusted based on the detected amounts of defocus. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an imaging device.

  A method of projecting a resolution chart to a plurality of locations on the imaging surface of the imaging device and adjusting the inclination of the imaging surface of the imaging device, that is, the tilt so that the resolution of the resolution chart image obtained by the imaging pixels is equal at the plurality of locations. Known (Patent Document 1).

JP-A-8-248465

  However, in this tilt adjustment method, since the resolution (contrast) of the resolution chart is detected by using the imaging pixels, only the deviation direction of the imaging surface from the reference plane can be detected, and it is within a predetermined adjustment error. Had to be adjusted several times, and there was a problem that adjustment took time.

  The problem to be solved by the present invention is to provide a method for manufacturing an imaging apparatus capable of performing high-accuracy position adjustment of an imaging element in a short time.

  The present invention solves the above problems by the following means. In addition, although the code | symbol corresponding to drawing which shows embodiment of this invention is attached | subjected and demonstrated, this code | symbol is only for making an understanding of this invention easy, and is not the meaning which limits this invention.

  The manufacturing method of the imaging device according to the present invention receives a pair of light beams (AB1, AB2) emitted from different regions (341, 342) of the pupil of the optical system, and detects the focus adjustment state of the optical system. An image pickup apparatus manufacturing method in which an image pickup element (111) having a pixel (116) on an image pickup surface (114) is assembled to an apparatus main body (10), and includes the following first to fourth steps.

  In the first step, a predetermined image pattern (300) is formed on the planned focal plane (FP) of the optical system. In the second step, an imaging pattern (421, 422) corresponding to the image pattern (300) is acquired on the imaging surface (114). In the third step, defocus amounts (def0, def2, def3) of the imaging plane (114) with respect to the planned focal plane (FP) are detected based on the output from the focus detection pixel (116). In the fourth step, the position or orientation of the image sensor (111) is adjusted based on the detected defocus amount.

  According to the present invention, highly accurate position adjustment of an image sensor can be performed in a short time.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< First Embodiment >>
As shown in FIG. 1, a digital still camera 1 according to this embodiment as an example of an imaging apparatus includes a camera body 10 and an interchangeable lens 20, and the camera body 10 and the interchangeable lens 20 are mechanically mounted by a mount unit 30. Can be attached and detached.

  For convenience of explanation, as shown in the figure, the optical axis L direction when the camera 1 is in the normal posture is defined as “Y axis”, and the axes orthogonal to the optical axis L are defined as “X axis” and “Z axis”. The axis is the axis perpendicular to the paper surface of the figure, and the Z axis is the vertical direction of the figure. Unless otherwise specified, the Z-axis direction is also referred to as “vertical direction”, the X-axis direction is also referred to as “left-right direction”, and the Y-axis direction is also referred to as “optical axis direction”.

  The camera body 10 includes an imaging element package 110, a body CPU 120, a liquid crystal display element 130 that constitutes a liquid crystal viewfinder, an eyepiece 140 for observing the liquid crystal display element 130, a liquid crystal display element driving circuit 150, and a photographing operation. And a memory card 160 for storing image signals.

  The body CPU 120 is electrically connected to a lens CPU 250, which will be described later, through an electrical signal contact portion 310 provided in the mount unit 30, receives lens information from the lens CPU 250, and receives camera body information such as a defocus amount to the lens CPU 250. Send. The body CPU 120 reads out an image signal from the image sensor 111, performs predetermined information processing, and outputs it to the liquid crystal display element 130 and the memory card 160. The body CPU 120 controls the entire camera, such as correcting image signals and detecting the focus adjustment state and the aperture adjustment state of the interchangeable lens 20.

  Also, a control signal is output from the body CPU 120 to the liquid crystal display element driving circuit 150, and the liquid crystal display element driving circuit 150 drives the liquid crystal display element 130 based on the control signal. As a result, the user can visually recognize the captured image through the eyepiece lens 140.

  On the other hand, the interchangeable lens 20 includes a lens 210, a zooming lens 220, a focusing lens 230, a diaphragm 240, and a lens CPU 250.

  The lens CPU 250 detects the states of the zooming lens 220, the focusing lens 230, and the diaphragm 240, and performs information communication with the body CPU 120 as necessary to control the driving of the focusing lens 230 and the diaphragm. 240 drive control is executed.

  The image sensor package 110 is attached to the camera body 10 via a bracket 170 having a position adjustment mechanism.

  As shown in FIG. 2, the image pickup device package 110 incorporates an image pickup device 111 that is adjusted and arranged on the planned focal plane of the interchangeable lens 20 (see FIG. 1). The image sensor 111 is configured by a CCD image sensor, a CMOS image sensor, or the like that is configured from a semiconductor chip. The image sensor 111 is attached to a ceramic substrate 112 having one end opened, and the opening is sealed with a cover glass 113. One main surface 114 of the image sensor 111 is an image pickup surface.

  As shown in FIGS. 3, 4A, and 4B, the image sensor 111 is disposed on the planned imaging plane of the interchangeable lens 20, and the position adjustment in the camera body 10 has been completed.

  The imaging element 111 includes a green pixel G having a color filter in which a plurality of imaging pixels 115 are two-dimensionally arranged on a plane of a rectangular imaging surface 114 (see FIG. 2) and transmit a green wavelength region; A red pixel R having a color filter that transmits a red wavelength region and a blue pixel B having a color filter that transmits a blue wavelength region are arranged in a so-called Bayer Arrangement. That is, in four adjacent pixel groups 117 (dense square lattice arrangement), two green pixels are arranged on one diagonal line, and one red pixel and one blue pixel are arranged on the other diagonal line. The image sensor 111 is configured by repeatedly arranging the pixel group 117 in a two-dimensional manner on the imaging surface 114 of the image sensor 111 with the Bayer array pixel group 117 as a unit. The unit pixel group 117 may be arranged in a dense hexagonal lattice arrangement other than the dense square lattice shown in the figure. Further, the configuration and arrangement of the color filters are not limited to this, and an arrangement of complementary color filters (green: G, yellow: Ye, magenta: Mg, cyan: Cy) can also be adopted.

  As shown in FIG. 5A, one imaging pixel 115 includes a micro lens 1151, a photoelectric conversion unit 1152, and a color filter (not shown). As shown in the cross-sectional view of FIG. A photoelectric conversion unit 1152 is formed on the surface of the semiconductor circuit substrate 1111 of the element 111, and a microlens 1151 is formed on the surface. The photoelectric conversion unit 1152 is configured to receive an imaging light beam passing through an exit pupil (for example, F1.0) of the imaging optical system by the microlens 1151 and receives the imaging light beam IB.

  Note that the color filter of this embodiment is provided between the microlens 1151 and the photoelectric conversion unit 1152, and the spectral sensitivities of the color filters of the green pixel G, red pixel R, and blue pixel B are shown in FIG. As shown.

  Returning to FIG. 3, FIG. 4A, and FIG. 4B, focus detection pixels 116 are arranged in place of the above-described imaging pixels 115 at the center of the imaging surface of the imaging element 111 and at five positions that are left-right symmetrical and up-down symmetrical from the center. A plurality of focus detection pixel rows 114a to 114e are provided.

  In the present embodiment, the focus detection pixel row 114a disposed at the center of the imaging surface 114, and a horizontal line La passing through the center of the imaging surface 114 and a vertical line Lb passing through the center of the imaging surface 114, and a distance D1 in the left-right direction. The focus detection pixel rows 114b and 114c that are spaced apart from each other are configured by arranging a plurality of focus detection pixels 116 in a horizontal row. Further, the focus detection pixel rows 114d and 114e arranged on the vertical line Lb passing through the center of the imaging surface 114 and separated from the horizontal line La passing through the center of the imaging surface 114 by a distance D2 in the vertical direction are a plurality of focus detections. Pixels 116 are arranged in a vertical row. The focus detection pixels 116 of this example are densely arranged without providing a gap at the positions of the green pixels G and blue pixels B of the imaging pixels 115 arranged in the Bayer array.

  Note that the positions of the focus detection pixel rows 114b and 114c shown in FIG. 3 are not limited to the positions shown in the figure, and may be any one location. The same applies to the positions of the focus detection pixel rows 114d and 114e. Either one can be provided. In actual focus detection, a desired focus detection pixel row can be selected by manual operation by the user from among a plurality of focus detection pixel rows 114a to 114e.

  As illustrated in FIG. 5B, the focus detection pixel 116 includes a micro lens 1161 and a pair of photoelectric conversion units 1162 and 1163. As illustrated in the cross-sectional view of FIG. 8B, the focus detection pixel 116 includes the imaging element 111. The photoelectric conversion portions 1162 and 1163 are formed on the surface of the semiconductor circuit substrate 1111 and the microlens 1161 is formed on the surface. The pair of photoelectric conversion units 1162 and 1163 have the same size and are symmetrical with respect to the optical axis of the micro lens 1161 in the focus detection pixel rows 114a, 114d, and 114e shown in FIG. 114b and 114c are arranged symmetrically in the vertical direction. The photoelectric conversion units 1162 and 1163 are configured to receive a pair of light beams that pass through a specific exit pupil (for example, F2.8) of the photographing optical system by the microlens 1161. That is, as shown in FIG. 8B, one photoelectric conversion unit 1162 of the focus detection pixel 116 receives one light beam AB1, while the other photoelectric conversion unit 1163 of the focus detection pixel 116 is an optical axis of the micro lens 1161. In contrast, a light beam AB2 that is symmetrical with the light beam AB1 is received.

  Note that the focus detection pixel 116 is not provided with a color filter, and its spectral characteristic is a total of the spectral characteristic of a photodiode that performs photoelectric conversion and the spectral characteristic of an infrared cut filter (not shown). . FIG. 7 shows the spectral characteristics of the focus detection pixel 116. The relative sensitivity is a spectral characteristic obtained by adding the sensitivities of the blue pixel B, the green pixel G, and the red pixel R shown in FIG. 6, and the sensitivity appears. The light wavelength region is a region including the light wavelength regions of the sensitivity of the blue pixel B, the green pixel G, and the red pixel R shown in FIG. However, it may be configured to include one of the same color filters as the imaging pixel 115, for example, a green filter.

  In addition, although the photoelectric conversion units 1162 and 1163 of the focus detection pixel 116 illustrated in FIG. 5B have a semicircular shape, the shape of the photoelectric conversion units 1162 and 1163 is not limited to this, and other shapes such as an elliptical shape, a rectangular shape, and the like. It can also be a shape or a polygonal shape. When the imaging element 111 has a focus detection pixel array including photoelectric conversion units having different shapes, the crosstalk rate corresponding to the shape of each photoelectric conversion unit is measured and stored, and crosstalk correction is performed. Crosstalk correction can be performed by switching the crosstalk rate according to the photoelectric conversion portion shape of the focus detection pixel.

  For example, focus detection pixels 116a and 116b shown in FIGS. 5C and 5D can be used instead of the focus detection pixels 116 shown in FIG. 5B.

  In the example shown in FIGS. 3 and 4B, the focus detection pixel 116 having a pair of photoelectric conversion units 1162 and 1163 is used, whereas in the example shown in FIGS. 5C and 5D, a pair of focus points is used. A pixel having photoelectric conversion units 1162a and 1162b paired with each of the detection pixels 116a and 116b is used.

  One focus detection pixel 116a includes a microlens 1161a and a photoelectric conversion unit 1162a, and the photoelectric conversion unit 1162a is formed on the surface of the semiconductor circuit substrate 1111 of the image sensor 111, as in the cross-sectional view illustrated in FIG. 8B. The micro lens 1161a is formed on the surface. The photoelectric conversion unit 1162a is disposed on the left side of a position symmetrical to the optical axis of the micro lens 1161a.

  On the other hand, the other focus detection pixel 116b also includes a microlens 1161b and a photoelectric conversion unit 1162b, and a photoelectric conversion unit is formed on the surface of the semiconductor circuit substrate 1111 of the image sensor 111 as in the cross-sectional view illustrated in FIG. 8B. 1162b is built in and a micro lens 1161b is formed on the surface thereof. The photoelectric conversion unit 1162b is arranged on the right side of a position symmetrical to the optical axis of the micro lens 1161b.

  Then, as shown in FIG. 5C, the pair of focus detection pixels 116 a and 116 b are arranged in a line on the left and right from the center of the image sensor 111. The photoelectric conversion units 1162a and 1162b convert a pair of light beams that pass through a specific exit pupil (for example, F2.8) of the photographing optical system by the micro lenses 1161a and 1161b, respectively, to the photoelectric conversions of the pair of focus detection pixels 116a and 116b. Light is received by the units 1162a and 1162b. The photoelectric conversion unit 1162a of the focus detection pixel 116a receives the light beam AB1, and the photoelectric conversion unit 1162b of the focus detection pixel 116b receives the light beam AB2.

  As described above, even when a pair of focus detection pixels 116a and 116b configured by different pixels is used, an image shift amount by a pupil division phase difference detection method described later is based on the output results of the pair of photoelectric conversion units 1162a and 1162b. Can be detected. In addition to this, there is an advantage that the configuration of the output readout circuit from the pixels constituting the image sensor 111 is simplified.

《Pupil phase difference detection method》
Next, a so-called pupil division phase difference detection method for adjusting the focus based on the output of the focus detection pixel 116 described above will be described.

  In FIG. 9, the focus detection pixel 116-1 arranged on the photographing optical axis L and the focus detection pixel 116-2 adjacent thereto are irradiated from the distance measurement pupils 341 and 342 of the exit pupil 34. 1, AB 1-1, AB 2-1, and AB 2-2 are received. However, for other focus detection pixels, the pair of photoelectric conversion units receive a pair of light beams emitted from the pair of distance measurement pupils 341 and 342. Here, the exit pupil 34 is an image set at a position D in front of the microlens 1161 of the focus detection pixel 116 disposed on the planned focal plane of the interchangeable lens 20 (see FIG. 1). The distance D is a value uniquely determined according to the curvature and refractive index of the microlens, the distance between the microlens and the photoelectric conversion unit, and the distance D is referred to as a distance measurement pupil distance. The distance measurement pupils 341 and 342 are images of the photoelectric conversion units 1162 and 1163 projected by the micro lens 1161 of the focus detection pixel 116.

  In the figure, the arrangement direction of the focus detection pixels 116-1 and 116-2 coincides with the arrangement direction of the pair of distance measuring pupils 341 and 342.

  Microlenses 1161-1 and 1161-2 of the focus detection pixel 116 are disposed in the vicinity of the planned focal plane of the interchangeable lens 20, and are disposed behind the microlens 1161-1 disposed on the optical axis L. The shape of the pair of photoelectric conversion units 1162-1 and 1163-1 is projected onto the exit pupil 34 separated by the distance measurement pupil distance D, and the projection shape forms the distance measurement pupils 341 and 342.

  Similarly, the shape of the pair of photoelectric conversion units 1162-2 and 1163-2 disposed behind the microlens 1161-2 arranged away from the optical axis L is separated by the distance measurement pupil distance D. Projected onto the exit pupil 34, the projection shape forms distance measuring pupils 341 and 342.

  That is, the projection of each focus detection pixel 116 on the exit pupil 34 at the distance measurement pupil distance D so that the projection shapes (distance measurement pupils 341 and 342) of the photoelectric conversion units 1162 and 1163 of the focus detection pixels 116 match. The direction is determined.

  The photoelectric conversion unit 1162-1 of the focus detection pixel 116-1 is placed on the microlens 1161-1 by one focus detection light beam AB1-1 that passes through one distance measuring pupil 341 and travels toward the microlens 1161-1. A signal corresponding to the intensity of the formed image is output. In contrast, the photoelectric conversion unit 1163-1 is an image formed on the microlens 1161-1 by the other focus detection light beam AB2-1 that passes through the other distance measuring pupil 342 and travels toward the microlens 1161-1. A signal corresponding to the intensity of the signal is output.

  Similarly, the photoelectric conversion unit 1162-2 of the focus detection pixel 116-2 passes through one distance measuring pupil 341 and is focused on the microlens 1161-2 by one focus detection light beam AB1-2 that goes to the microlens 1161-2. A signal corresponding to the intensity of the image formed is output. On the other hand, the photoelectric conversion unit 1163-2 is an image formed on the microlens 1161-2 by the other focus detection light beam AB <b> 2-2 that passes through the other distance measuring pupil 342 and travels toward the microlens 1161-2. A signal corresponding to the intensity of the signal is output.

  A plurality of the above-described focus detection pixels 116 are arranged in a straight line as shown in FIG. 4A, and the outputs of the pair of photoelectric conversion units 1162 and 1163 of each focus detection pixel 116 are respectively transmitted to the distance measurement pupil 341 and the distance measurement pupil 342. Are collected into output groups corresponding to the data, the data on the intensity distribution of a pair of images formed on the focus detection pixel array by the focus detection light beams AB1 and AB2 passing through the distance measurement pupil 341 and the distance measurement pupil 342, respectively, is obtained. . By applying an image shift detection calculation process such as a correlation calculation process or a phase difference detection process to the intensity distribution data, an image shift amount by a so-called pupil division phase difference detection method can be detected.

  Then, a conversion calculation is performed on the obtained image shift amount according to the center-of-gravity interval of the pair of distance measuring pupils, thereby obtaining a current focal plane with respect to the planned focal plane (the focal point corresponding to the position of the microlens array on the planned focal plane). The deviation of the focal plane at the detection position, that is, the defocus amount can be obtained.

<Operation example of camera>
Next, an operation example of the digital still camera 1 according to the present embodiment will be described.

  As shown in FIG. 10, first, in step S100, it is confirmed that the power source of the camera 1 of the present embodiment is turned on, and then the process proceeds to step S110 to read out image data of the image sensor 111 to the body CPU 120. The image data is subjected to a thinning process and the like, and then the current photographed image is displayed on the liquid crystal display element 130 via the liquid crystal display element driving circuit 150.

  In step S130, a pair of data is read from the focus detection pixels 116 provided in the focus detection pixel rows 116a to 116e set in the image sensor 111. In this case, when a specific focus detection pixel row is selected by a user's manual operation, only data from the focus detection pixel of the focus detection pixel row is read out.

  In step S140, an image shift detection calculation process (correlation calculation process) is performed based on the read pair of image data to calculate an image shift amount, and the image shift amount is converted into a defocus amount. Here, an example of image shift detection calculation processing (correlation calculation processing) based on the read pair of image data will be briefly described.

  In the pair of images detected by the focus detection pixel 116, the distance measurement pupils 341 and 342 may be blocked by the aperture opening 240 of the interchangeable lens 20, and the light quantity balance may be lost. Therefore, in the present embodiment, a correlation calculation of a type capable of maintaining the image shift detection accuracy is performed with respect to the loss of light amount balance.

  First, a pair of image data sequences read from the focus detection pixel sequence are A11 to A1M and A21 to A2M (M is the number of data), the following correlation calculation formula (Formula 1) is performed, and the correlation amount C (k) is calculated. Calculate.

[Expression 1] C (k) = Σ | A1 _n · A2 _{n + 1 + k−} A2 _{n + k} · A1 _{n + 1} |
In Equation 1, the Σ operation indicates a cumulative operation (sum operation) with respect to n, and the range of n is a range in which data of A1 _n , A1 _{n + 1} , A2 _{n + k} , A2 _{n + 1 + k} exists according to the image shift amount k. Limited. Further, the image shift amount k is an integer, and is a relative shift amount with the data interval of the data string as a unit.

  As shown in FIG. 11A, the calculation result of Equation 1 shows that the correlation amount C (k) is minimal (small) in the shift amount with high correlation between a pair of data (k = kj = 2 in FIG. 11A). The higher the degree of correlation).

  Next, the shift amount x that gives the minimum value C (x) with respect to the continuous correlation amount is obtained by using the three-point interpolation method according to Equations 2 to 5.

[Formula 2] x = kj + D / SLOP
[Formula 3] C (x) = C (kj) − | D |
[Equation 4] D = {C (kj-1) -C (kj + 1)} / 2
[Expression 5] SLOP = MAX {C (kj + 1) -C (kj), C (kj-1) -C (kj)}
Then, whether or not the shift amount x calculated by Expression 2 is reliable is determined as follows.

  As shown in FIG. 11B, when the degree of correlation between a pair of data is low, the minimum value C (x) of the interpolated correlation amount increases. Therefore, when C (x) is equal to or greater than a predetermined threshold value, it is determined that the reliability of the calculated shift amount is low, and the calculated shift amount x is canceled.

  Alternatively, in order to normalize C (x) with the contrast of data, when the value obtained by dividing C (x) by SLOP that is proportional to the contrast is equal to or greater than a predetermined value, the reliability of the calculated shift amount Is determined to be low, and the calculated shift amount x is canceled.

  Alternatively, when SLOP that is proportional to the contrast is equal to or less than a predetermined value, it is determined that the subject has low contrast and the reliability of the calculated shift amount is low, and the calculated shift amount x is canceled.

  Further, as shown in FIG. 11C, when the correlation between the pair of data is low and there is no drop in the correlation amount C (k) between the shift ranges kmin to kmax, the minimum value C (x) is obtained. In such a case, it is determined that the focus cannot be detected.

  The correlation calculation formula is not limited to Formula 1 described above, and other known correlation formulas can also be used.

  When it is determined that the calculated shift amount x is reliable, the image shift amount shft is obtained by the following formula 6.

[Expression 6] shft = PY · x
Here, in Equation 6, PY is a detection pitch (a pitch of focus detection pixels).

  Finally, the defocus amount def is obtained by multiplying the image shift amount shft calculated by Expression 6 by a predetermined conversion coefficient k.

[Expression 7] def = k · shft
Note that the conversion coefficient k is an opening angle that allows the center of gravity of the pair of distance measurement pupils 341 and 342 in FIG. 9 (for example, for the focus detection pixel 116-2, the center of gravity of the pair of distance measurement pupils 341 and 342 and the focus detection pixel). Dependent on the angle θ formed by a line connecting the photoelectric conversion units 1162-2 and 1163-2 of 116-2, there is a general relationship k = 1 / (2 * Tan (θ / 2)).

  Returning to step S140 in FIG. 10, it is determined whether or not the absolute value of the defocus amount calculated in step S130 is within a predetermined value. When the absolute value of the defocus amount is within the predetermined value, it is assumed that the in-focus state is obtained, and the process jumps to step S150 and proceeds to step S160. When the defocus amount is not within the predetermined value, the process proceeds to step S150, a drive signal is sent from the body CPU 120 to the lens drive motor (not shown) via the lens CPU 250, and the focusing lens 230 is moved to the in-focus position. . At the same time, the subject distance linked to the focusing position of the focusing lens 230 is displayed on a distance display (not shown).

  If it is determined in step S140 that focus detection is impossible, the process proceeds to step S150, where a scan drive command is transmitted to the lens CPU 250, and the focusing lens 230 of the interchangeable lens 20 is moved from the infinite end to the closest end. After in-scan scanning, the in-focus position is searched, and then the process returns to step S100 to repeat the above operation.

  In step S160, it is determined whether or not a release button (not shown) provided on the camera body 10 has been pressed. When the release button is not pressed, the process returns to step S100 and the processes of steps S100 to S160 are repeated.

  If it is detected in step S160 that the release button has been pressed, the process proceeds to step S170, an aperture adjustment command is transmitted to the lens CPU 250, and the aperture value of the aperture 240 of the interchangeable lens 20 is controlled by the user or automatically set control. Set to F value. After the aperture control is completed, image data is read from the imaging pixel 115 and all focus detection pixels 116 of the imaging element 111.

  Here, since the read image data of the focus detection pixels 116 is black and white data, in step S180, the pixel data in which the focus detection pixels 116 of the focus detection pixel rows 116a to 116e are located are detected as the focus data. Pixel interpolation is performed based on the image data of the imaging pixels 115 around the pixel 116. Thereby, the color image data at the positions of the focus detection pixel rows 116a to 116e can be obtained.

  Finally, in step S190, the image data of the imaging pixel 115 and the interpolated image data are stored in the memory card 160. At this time, the obtained image data can be thinned and displayed on the liquid crystal display element 130. After the data is saved, the process returns to step S110 to repeat the above operation.

<< Image sensor position adjustment method >>
Next, an example of a method (position adjustment method of the image sensor 111) for assembling the image sensor package 110 to the camera body 10 (see FIG. 1) will be described.

  As shown in FIG. 12, in this embodiment, first, an adjustment lens 301 different from the interchangeable lens 20 (see FIG. 1) is prepared. As the adjustment lens 301, various aberrations are corrected with high accuracy so that the uniformity of the formed image surface is high, that is, the difference between the image surface position in the center of the screen and the peripheral image surface or the same image height. The one designed and manufactured so that the difference in image plane position is extremely small is used.

  In this embodiment, an adjustment image pattern 300 is also prepared together with the adjustment lens 301. The adjustment image pattern 300 has an image pattern in which the horizontal first line pattern 321 and the vertical second line pattern 322 intersect on the optical axis L1 of the adjustment lens 301. It arrange | positions so that it may correspond to a surface perpendicular | vertical with respect to the optical axis L1. The adjustment image pattern 300 is irradiated with light rays by an illumination unit (not shown) and projected. Note that the image pattern 300 is not limited to a configuration having one horizontal line pattern 321 and one vertical line pattern 322, and may be, for example, a lattice pattern / radial pattern / concentric pattern.

  In this embodiment, the image sensor package 110 before position adjustment is incorporated in the camera body 10 via a bracket 170 having a position adjustment mechanism. The bracket 170 is a well-known mechanical position adjustment mechanism including a screw and a spring (movement in the direction of the optical axis, movement / rotation in a plane orthogonal to the optical axis, tilt of the surface around the optical axis, etc.) The position of the image sensor package 110 is adjusted based on the mechanical control of the position adjustment device 302.

  The position adjustment device 302 detects the positional deviation amount of the imaging surface 114 of the imaging element 111 with respect to the planned focal plane FP based on the output data of the imaging pixel 115 and the focus detection pixel 116 of the imaging element 111, and based on the detected positional deviation amount. The bracket 170 is mechanically controlled (control of screw feed amount, etc.), and the position of the image pickup device package 110 is adjusted so that the image pickup surface 114 of the image pickup device 111 coincides with the planned focal plane FP. Note that the spectral characteristic of the illumination light may be a narrow band in order to reduce errors due to chromatic aberration.

  Note that the planned focal plane FP is a film plane in the case of a silver salt camera, and a plane that is optically equivalent to the imaging plane 114 of the imaging element 111 in the case of a digital camera. It exists at a predetermined position where a light beam incident through a photographing optical system (imaging optical system) of the lens barrel is imaged as a subject image.

  For example, as shown in FIGS. 13A and 13B, the bracket 170 used in the present embodiment includes a movable portion 172 to which the imaging element package 110 is fixed, and a fixed portion 173 disposed behind the movable portion 172. If the surface on which the image pickup device package 110 is fixed is a “main surface”, the image pickup device package 110 is disposed on the main surface of the movable portion 172 in the example illustrated in FIGS. 13A and 13B. A recess 172 a is formed on the back surface of the movable portion 172.

  At a position corresponding to the concave portion 172a of the fixing portion 173, a protruding member 174 that is rotatably engaged with the concave portion 172a is inserted. By rotating the projection member 174, the projection 174 is engaged with the recess 172a of the movable portion 172, and by further rotating the projection member 174, the movable portion 172 can be moved back and forth. A fixing member 175 different from the protruding member 174 is inserted into the fixing portion 173. The fixed member 175 holds the movable portion 172 from behind the fixed portion 173 via the spring 176.

  Two position adjusting members 177a and 177b are inserted into the fixing portion 173. In the present embodiment, the first position adjustment member 177a is disposed in a horizontal direction from a position corresponding to the concave portion 172a of the fixed portion 173, and the movable portion 172 is moved from behind the fixed portion 173 against the spring 176. Hold. In the present embodiment, the second position adjusting member 177b is arranged in a vertical direction from a position corresponding to the concave portion 172a of the fixed portion 173, and the movable portion 172 is moved from behind the fixed portion 173 against the spring 176. Hold.

  In the present embodiment, the image pickup device package 110 fixed to the movable portion 172 by these position adjusting members 177a and 177b is configured to be able to adjust the tilt (inclination) in the optical axis direction. A fixed member 175 is arranged in a triangle formed by 172a and position adjusting members 177a and 177b, and the movable portion 172 is biased toward the fixed portion 173 by a spring 176.

  In the following description, a case where the position adjustment of the image sensor package 110 is performed using such a bracket 170 will be exemplified.

  Returning to FIG. 12, first, the adjustment lens 301 is attached to the camera body 10 via the mount portion 30 (see FIG. 1). Next, the adjustment image pattern 300 is arranged at a predetermined distance from the adjustment lens 301 attached to the camera body 10. When a light beam is irradiated from behind the adjustment image pattern 300 by illumination means (not shown), the image pattern is imaged on the planned focal plane FP behind the adjustment lens 301 by a predetermined distance. Hereinafter, the operation will be described with reference to the operation flow of the position adjustment device 302 shown in FIG.

  As shown in FIG. 14, when the adjustment is started in step S200, as shown in FIG. 15, an image (imaging pattern) of the adjustment image pattern 300 is formed on the planned focal plane FP. The horizontal line pattern image 421 and the vertical line pattern image 422 intersect at the center 410 (intersection with the optical axis L1) of the focal plane FP. At this time, focus detection pixel rows 114a to 114e are arranged on the imaging surface 114, and the center 130 of the imaging surface 114 and the center 410 of the planned focal plane FP do not coincide with each other. The vertical direction does not coincide with the horizontal / vertical direction of the planned focal plane FP.

  Therefore, in the present embodiment, first, the center 130 of the imaging surface 114 is matched with the center 410 of the planned focal plane FP (first step). Specifically, returning to FIG. 14, in step S210, the image data of the imaging pixel 115 near the center of the imaging surface 114 is read, and the position of the intersection of the horizontal line pattern image 421 and the vertical line pattern image 422 is read. A deviation amount (horizontal direction and vertical direction) between (center 410 of the planned focal plane) and center 130 of the imaging surface 114 is calculated. Then, the image pickup device package 110 is moved in a plane orthogonal to the optical axis L1 according to the deviation amount, so that the center 130 of the image pickup surface 114 coincides with the center 410 of the planned focal plane FP as shown in FIG. .

  Next, in the present embodiment, the horizontal / vertical direction of the imaging surface 114 is matched with the horizontal / vertical direction of the planned focal plane FP (second step). Specifically, returning to FIG. 14, in step S220, the image data of the imaging pixel 115 is read, the inclination angle between the horizontal line pattern image 421 and the imaging pixel 115 in the row direction, and the vertical line pattern image 422. And an inclination angle between the imaging pixel 115 and the column direction. Then, the image pickup device package 110 is rotated around the optical axis in a plane orthogonal to the optical axis L1 in accordance with the average inclination angle thereof, so that the horizontal / vertical direction of the image pickup surface 114 is changed as shown in FIG. Match the horizontal / vertical direction of the planned focal plane FP.

  In the state of FIG. 17, the imaging surface 114 and the planned focal plane FP are in a state where the center and the horizontal / vertical direction coincide with each other in a plane perpendicular to the optical axis L1, and the horizontal line pattern image 421 is the focus detection pixel row 114a. To 114c, and the vertical line pattern image 422 is superimposed on the focus detection areas 114a, 114d, and 114e. However, in the direction of the optical axis L1, as shown in FIG. 18, the center 130 of the imaging surface 114 and the center 410 of the planned focal plane FP are separated by a defocus amount def0.

  Therefore, in the present embodiment, next, in the direction of the optical axis L1, the positions of the center 130 of the imaging surface 114 and the center 410 of the planned focal plane FP are matched (third step). Specifically, returning to FIG. 14, in step S230, the data of the focus detection pixel 116 of the focus detection pixel row 114a at the center of the imaging surface 114 is read, and the screen center 130 is used by using the image shift detection calculation process described above. The defocus amount def0 at is calculated. Then, the image pickup device package 110 is moved in the direction of the optical axis L1 in accordance with the defocus amount def0, and as shown in FIG. 19, in the direction of the optical axis L1, the center 130 of the image pickup surface 114 and the planned focal plane FP The positions of the centers 410 are matched.

Next, in the present embodiment, the horizontal inclinations of the imaging surface 114 and the planned focal plane FP are matched (fourth step). Specifically, returning to FIG. 14, in step S240, the data of the focus detection pixels 116 of the focus detection pixel rows 114b and 114c spaced apart from the center of the imaging surface 114 in the horizontal direction is read out, and the image shift detection calculation process described above is performed. The defocus amount def2 at the intersection 132 between the focus detection pixel row 114b and the horizontal line pattern image 421, and the defocus amount def3 at the intersection 133 between the focus detection pixel row 114c and the horizontal line pattern image 421. Is calculated. Then, the tilt angle θh in the horizontal direction with respect to the planned focal plane FP is calculated based on the defocus amounts def2 and def3. If the distance h from the center of the screen to the points 132 and 133 is used, θh = cos ⁻¹ ((def2 + def3) / (2 × h)). According to the tilt angle θh, the image sensor package 110 is horizontally adjusted (inclined) around the center 130 of the image pickup surface 114 of the image pickup device 111, and as shown in FIG. 20, the image pickup surface 114 and the planned focal plane FP Match the horizontal slope of.

  Next, in the present embodiment, the vertical inclinations of the imaging surface 114 and the planned focal plane FP are matched (fifth step). Specifically, returning to FIG. 14, in step S250, the vertical tilt adjustment is performed in the same manner as the horizontal tilt adjustment. Data of the focus detection pixels 116 of the focus detection pixel rows 114d and 114e that are vertically separated from the center of the imaging surface 114 is read, and a line pattern image in the vertical direction with respect to the focus detection pixel row 114d using the image shift detection calculation process described above. The defocus amount at the intersection of 422 and the defocus amount at the intersection of the focus detection pixel array 114e and the line pattern image 422 in the vertical direction are calculated. Then, the tilt angle in the vertical direction with respect to the planned focal plane FP is calculated based on the defocus amount. In accordance with the tilt angle, the image pickup package 110 is tilt-adjusted (tilt adjustment) in the vertical direction around the center 130 of the image pickup surface 114 of the image sensor 111 so that the vertical inclinations of the image pickup surface 114 and the planned focal plane FP coincide. .

  Then, when the imaging surface 114 of the imaging element 111 matches the planned focal plane FP, the position adjustment process is terminated (step S260).

  In this embodiment, in order to further reduce the adjustment error, the adjustment steps from step 210 to step 250 may be repeated a plurality of times.

  According to this embodiment, the center 130 of the imaging plane 114 of the imaging device 111 is made to coincide with the center 410 of the planned focal plane FP of the optical system (first step), and then the horizontal and vertical directions of the planned focal plane FP of the optical system. The horizontal and vertical directions of the imaging surface 114 of the image sensor 111 are aligned with each other (second step), and then the optical axis directions of the center 410 of the planned focal plane FP of the optical system and the center 130 of the imaging surface 114 of the image sensor 111 Are aligned (third step), and then the horizontal tilt of the imaging surface 114 of the imaging element 111 is matched with the planned focal plane FP of the optical system (fourth step), and finally the optical system is scheduled. The inclination in the vertical direction of the focal plane FP and the imaging surface 114 of the imaging element 111 is matched (fifth step). For this reason, deviations and inclinations other than the deviation direction of the imaging surface of the imaging device from the reference plane (scheduled focal plane) of the optical system are detected and predetermined steps are executed, so that the imaging device package 110, that is, the imaging device 111 High-accuracy position adjustment can be performed efficiently in a short time.

<< Second Embodiment >>
In the first embodiment, the adjustment is finished by matching the imaging surface 114 of the imaging element 111 with the planned focal plane FP. However, in the present embodiment, after the imaging surface 114 and the planned focal plane FP are matched in step S250 of FIG. 14, information on manufacturing errors of the focus detection pixels 116 is measured, and the measured error information is used as the camera body 10. The data may be written in a storage means (memory card 160 in FIG. 1) incorporated in the memory.

  In the present embodiment, after step S250 in FIG. 14 is completed, instead of the adjustment lens 301, an aperture cylinder body 40 having an adjustment aperture opening 41 on the photographic optical axis L is provided on the camera body 10 as shown in FIG. Attach to the front. The diaphragm cylinder 40 is installed so that the distance between the adjustment aperture 41 and the planned focal plane FP becomes the distance measuring pupil distance D. Then, illumination light is irradiated toward the image sensor 111 from the left side of FIG.

  As shown in FIGS. 5B, 8B, and 9, in the first embodiment described above, the focus detection pixel 116 has a structure in which the shape of the pair of photoelectric conversion units 1162 and 1163 is projected forward by the microlens 1161. Yes. For example, when the positional relationship between the optical axis of the microlens 1161 and the centers of the pair of photoelectric conversion units 1162 and 1163 deviates from the design value during manufacturing, the centers of the distance measuring pupils 341 and 342 in FIG. Accordingly, the distance measurement pupils 341 and 342 do not have a symmetrical positional relationship with respect to the optical axis L. In such a state, the distance measurement pupils 341 and 342 may be asymmetrically vignetted due to the aperture opening of the interchangeable lens 20, and the focus detection accuracy may be reduced.

  Therefore, in order to measure such an error, in this embodiment, the diaphragm cylinder 40 having the adjustment diaphragm opening 41 shown in FIG. 21 is attached to the camera body 10.

  A diffuser plate 42 is attached to the aperture opening 41, thereby illuminating the aperture opening 41 uniformly from the front, which is the left side of FIG. In such a state, the outputs of the pair of photoelectric conversion units 1162 and 1163 cause a level difference according to the degree of asymmetric vignetting of the distance measurement pupils 341 and 342.

  If the relationship between the degree of asymmetric vignetting of the distance measuring pupils 341 and 342 and the output level difference between the pair of photoelectric conversion units 1162 and 1163 is measured in advance, the measured output level of the pair of photoelectric conversion units 1162 and 1163 is measured. Based on the difference, the degree of asymmetric vignetting of the distance measurement pupils 341 and 342 can be detected. The degree of asymmetric vignetting can be quantified as, for example, the distance measuring pupil distance Da. Here, the distance measurement pupil distance Da is a distance at which the pair of distance measurement pupils 341 and 342 are symmetrical with respect to the optical axis L.

  In the manufacturing process of the image sensor 111, the variation in the projection direction of the distance measuring pupil is substantially constant in the same image sensor 111.

  Therefore, in the present embodiment, after the imaging surface 114 of the image sensor 111 and the planned focal plane FP are matched by adjustment (after step S250 in FIG. 14), the vignetting measurement having the above-described adjustment aperture opening 41 is used. The aperture cylinder 40 is attached to the camera body 10, the output levels of the pair of photoelectric conversion units 1162 and 1163 are measured, and the distance measurement pupil distance Da is calculated based on the measurement result and written to the memory card 160.

  The manufacturing error information stored in the memory card 160 is read and used at the time of focus detection. For example, before the image shift detection of Formula 1 is performed on the output data of the pair of photoelectric conversion units 1162 and 1163, the level of the output data of the pair of photoelectric conversion units 1162 and 1163 is adjusted according to the manufacturing error information. Can do. In addition, there is an advantage that the calculation accuracy of the defocus amount can be improved by correcting the conversion coefficient k of Expression 7 according to the manufacturing error information.

<< Other Embodiments >>
Note that the arrangement of the focus detection pixel rows 114a to 114e shown in FIG. 3 is not limited to the illustrated positions, and the focus detection pixel rows can be arranged in a diagonal direction or other positions. At that time, the set of focus detection pixel rows located symmetrically with respect to the center of the screen is used for the position adjustment of the image sensor 111 described above, so that a defocus amount detection error, an error due to decentration of the optical system, and the like Can be reduced.

  In the above-described embodiment, the camera system (digital still camera or film still camera) using the interchangeable lens 20 is described. However, the photographing lens (not shown) is integrated with the camera body 10 and the image sensor 111. It can also be applied to systems (digital still cameras, film still cameras, video cameras, etc.). When the present invention is applied to a system in which the photographing lens is integrated with the camera body 10, the photographing lens itself is used for position adjustment of the image sensor 111 instead of the adjustment lens 301 of FIG. At the time of adjustment, the photographing lens is fixed at a predetermined subject distance position, and the adjustment image pattern 300 is disposed on the optical axis of the subject distance.

  Furthermore, the present invention can be applied to a small camera module built in a mobile phone or the like, a surveillance camera, a visual recognition device for a robot, or the like, and can also be applied to a focus detection device other than a camera, a distance measuring device, or a stereo distance measuring device. .

FIG. 1 is a block diagram showing a digital still camera according to the present embodiment. FIG. 2 is a cross-sectional view showing an example of the structure of an image pickup device package mounted on the digital still camera shown in FIG. FIG. 3 is a front view showing the focus detection position on the imaging surface of the imaging device included in the imaging device package of FIG. FIG. 4A is a front view schematically showing an array of focus detection pixels by enlarging the IVA portion of FIG. FIG. 4B is a front view schematically showing an array of focus detection pixels by enlarging the IVB portion of FIG. 3. FIG. 5A is an enlarged front view showing one of the imaging pixels shown in FIG. 4A. FIG. 5B is an enlarged front view showing one of the focus detection pixels shown in FIG. 4A. FIG. 5C is a front view schematically showing an arrangement of other focus detection pixels corresponding to FIG. 4A. FIG. 5D is an enlarged front view of the VD portion of FIG. 5C. FIG. 6 is a spectral characteristic diagram showing the relative sensitivity with respect to the wavelength of each of the three imaging pixels shown in FIG. 4A. FIG. 7 is a spectral characteristic diagram showing the relative sensitivity with respect to the wavelength of the focus detection pixel shown in FIG. 4A. FIG. 8A is an enlarged cross-sectional view showing one of the imaging pixels shown in FIG. 4A. FIG. 8B is an enlarged cross-sectional view showing one of the focus detection pixels shown in FIG. 4A. 9 is a cross-sectional view taken along line IX-IX in FIG. 4A. FIG. 10 is a flowchart showing an operation example of the digital still camera according to the present embodiment. FIG. 11A to FIG. 11C are graphs for explaining the focus detection calculation (defocus amount calculation) procedure of the camera of FIG. FIG. 12 is a configuration diagram at the time of position adjustment of the image sensor package according to the present embodiment. FIG. 13A is a main cross-sectional view showing a configuration example of the bracket of FIG. FIG. 13B is a front view of the bracket of FIG. 13A. FIG. 14 is a flowchart for explaining the operation of the position adjustment apparatus of FIG. FIG. 15 is a diagram showing a positional relationship in a plane orthogonal to the optical axis of the imaging surface and the planned focal plane of the imaging device in the initial state of adjustment. FIG. 16 is a diagram showing a positional relationship in a plane orthogonal to the optical axis of the imaging surface and the planned focal plane of the imaging device in the first adjustment stage. FIG. 17 is a diagram showing a positional relationship in the plane orthogonal to the optical axis of the imaging surface and the planned focal plane of the imaging device in the second adjustment stage. FIG. 18 is a diagram showing the state of FIG. 17 in a horizontal section including the optical axis. FIG. 19 is a diagram showing a positional relationship in the optical axis direction between the imaging surface of the image sensor and the planned focal plane in the third adjustment stage. FIG. 20 is a diagram showing a positional relationship in a plane orthogonal to the optical axis of the imaging surface and the planned focal plane of the imaging device in the final adjustment stage. FIG. 21 is a diagram for explaining a method of adjusting the position of the image sensor package according to the present embodiment.

Explanation of symbols

1. Digital still camera (imaging device)
DESCRIPTION OF SYMBOLS 10 ... Camera body 20 ... Interchangeable lens 110 ... Image pick-up element package 170 ... Bracket (position adjustment mechanism)
172 ... Movable part; 172a ... Recessed part; 173 ... Fixed part; 174 ... Projection member 175 ... Fixed member; 176 ... Spring; 177a, 177b ... Position adjusting member 111 ... Imaging element 1111 ... Semiconductor circuit board; 114 ... Imaging surface 114a to 114e: Focus detection pixel row; 115 ... Imaging pixel 1151 ... Micro lens; 1152 ... Photoelectric conversion unit 116, 116a, 116b ... Focus detection pixel 1161, 1161a, 1161b ... Micro lens 1162, 1163, 1162a, 1162b ... Photoelectric conversion unit 300 ... Adjustment image pattern; 301 ... Adjustment lens; 302 ... Position adjustment device 40 ... Aperture cylinder; 41 ... Adjustment aperture opening; 42 ... Diffusion plate FP ... Focal focal plane; L, L1 ... Optical axis

Claims (11)

A method of manufacturing an imaging apparatus in which an imaging device having a focus detection pixel on an imaging surface for receiving a pair of light beams emitted from different regions of the pupil of an optical system and detecting a focus adjustment state of the optical system is mounted on the apparatus body. There,
A first step of forming a predetermined image pattern on a predetermined focal plane of the optical system;
A second step of acquiring an imaging pattern corresponding to the image pattern on the imaging surface;
A third step of detecting a defocus amount of the imaging plane with respect to the planned focal plane based on an output from the focus detection pixel;
And a fourth step of adjusting the position or orientation of the image sensor based on the detected defocus amount. It is a manufacturing method of the imaging device according to claim 1,
In the third step, an amount of deviation of the imaging pattern output from the focus detection pixel with respect to the image pattern is detected, and the defocus amount is detected based on the amount of deviation. Production method. It is a manufacturing method of the imaging device according to claim 1 or 2,
In the fourth step, the image pickup device is moved in the direction of the optical axis of the optical system based on the defocus amount. It is a manufacturing method of the imaging device given in any 1 paragraph of Claims 1-3,
In the fourth step, an inclination of the imaging surface of the imaging element with respect to the optical axis of the optical system is adjusted based on the defocus amount. It is a manufacturing method of the imaging device given in any 1 paragraph of Claims 1-4,
In the second step, an image signal is acquired from the image sensor,
In the fourth step, based on the image signal, the image sensor is moved within a first surface orthogonal to the optical axis of the optical system to adjust the position of the image sensor within the first surface. A method for manufacturing an imaging device. It is a manufacturing method of the imaging device according to claim 5,
In the fourth step, based on the image signal, the image pickup device is rotated within the first surface, and the horizontal or vertical posture of the image pickup device within the first surface is adjusted. A method for manufacturing an imaging device. It is a manufacturing method of the imaging device given in any 1 paragraph of Claims 1-6,
The image pickup device includes the focus detection pixels at at least three positions of a first position of the image pickup surface and second and third positions separated from the first position in different directions. Manufacturing method of imaging apparatus. A first focus detection pixel disposed at the center of the imaging surface, a pair of second focus detection pixels disposed symmetrically apart from the center of the imaging surface in the horizontal direction, and a vertical from the center of the imaging surface An image pickup apparatus manufacturing method in which an image pickup element having a pair of third focus detection pixels arranged symmetrically apart in a direction is assembled to an apparatus body,
Of the imaging pattern corresponding to the image pattern formed on the planned focal plane of the optical system acquired on the imaging plane, the imaging data near the center of the imaging plane is read from the imaging pixel, and A first deviation amount of the center of the imaging surface with respect to the center is calculated, and based on the first deviation amount, the imaging element is moved within a first surface orthogonal to the optical axis of the optical system, and the imaging surface A first step of adjusting the center position;
Image data of the imaging surface is read from the imaging pixels, and an inclination angle of the imaging surface with respect to the planned focal plane is calculated. Based on the inclination angle, the imaging element is moved along the optical axis within the first surface. A second step of rotating around and adjusting a horizontal and vertical position of the imaging surface;
The imaging data in the vicinity of the center of the imaging plane in the direction of the optical axis is read from the first focus detection pixel, and a second deviation amount of the center of the imaging plane with respect to the center of the planned focal plane is calculated. A third step of adjusting the shift in the optical axis direction between the center of the imaging plane and the center of the planned focal plane by moving the imaging element in the direction of the optical axis based on the two deviation amounts;
The image data of the imaging surface is read from the second focus detection pixel, a third deviation amount of the imaging surface with respect to the planned focal plane is calculated, and the schedule of the imaging surface is calculated based on the third deviation amount. A horizontal tilt angle with respect to the focal plane is calculated, and based on the horizontal tilt angle, the image sensor is rotated in the horizontal direction around the center of the imaging plane, and the horizontal tilt between the imaging plane and the planned focal plane is calculated. A fourth step to adjust;
The image data of the imaging surface is read from the third focus detection pixel, a fourth deviation amount of the imaging surface with respect to the planned focal plane is calculated, and the scheduled of the imaging surface is calculated based on the fourth deviation amount. A vertical tilt angle with respect to the focal plane is calculated, and based on the vertical tilt angle, the imaging device is rotated in the vertical direction around the center of the imaging plane, and the vertical tilt between the imaging plane and the planned focal plane is calculated. And a fifth step of adjusting the imaging device. It is a manufacturing method of the imaging device according to claim 8,
The imaging device includes the focus detection pixel including a pair of photoelectric conversion units as a light receiving unit behind a microlens. It is a manufacturing method of the imaging device according to claim 8,
The imaging element includes a first focus detection pixel including a first photoelectric conversion unit as a light receiving unit behind a first microlens, and a first photoelectric conversion unit behind a second microlens. And a second focus detection pixel provided with a second photoelectric conversion unit paired with the focus detection pixel. It is a manufacturing method of the imaging device given in any 1 paragraph of Claims 1-10,
In the image pattern, the first line pattern extending in the horizontal direction and the second line pattern extending in the vertical direction intersect on the optical axis of the optical system.

Images