JP5012328B2 - Image sensor position adjustment method - Google Patents

Description

The present invention relates to a position adjusting method of an imaging device.

As a position adjustment method when the image pickup device is assembled to the image pickup apparatus, a method of irradiating the image pickup device with a laser beam and adjusting the position of the image pickup surface with respect to the imaging surface according to the position and direction of the beam reflected on the image pickup surface Is known (Patent Document 1).

However, such a position adjustment method has a problem that the position of the image sensor cannot be accurately adjusted due to the influence of reflected light from a cover glass or a low-pass filter of the image sensor other than the image sensing surface.

JP-A 64-24583

An object of the present invention is to provide is to provide a positioning method that an imaging device can improve the positioning accuracy of the imaging device.

  The present invention solves the above problems by the following means. In addition, although the code | symbol corresponding to drawing which shows embodiment of this invention is attached | subjected and demonstrated, this code | symbol is only for making an understanding of this invention easy, and is not the meaning which limits this invention.

[1] In the position adjustment method according to the present invention, a predetermined number of imaging pixels (115) that receive a light beam and output a photoelectrically converted signal are arranged in a two-dimensional array on a predetermined plane. The image sensor includes a light receiving unit (1162, 1163) that receives a reference light beam (AB1, AB2) irradiated from a certain direction with respect to a plane, and an adjustment pixel (116) that outputs posture information of the image sensor. In the position adjustment method for adjusting the attitude of the image based on the attitude information output by the adjustment pixel ,
A diaphragm aperture (41) is installed at a first position (P1) on the optical axis (L) of the optical system that forms an image on the image sensor, and the reference light flux (AB1, AB2) through the diaphragm aperture. ) Is moved within the predetermined plane so that the posture information obtained by receiving light by the adjustment pixel is predetermined;
A diaphragm aperture (41a) is installed at a second position on the optical axis different from the first position (P1), and the reference luminous flux (AB3, AB4) via the diaphragm aperture is formed by the adjustment pixel. And rotating the image pickup element around the first position so that the posture information obtained by receiving light is predetermined .

In the position adjustment method, a pair of adjustment pixels (116e, 116f) are arranged at symmetrical positions in the array of image pickup pixels, and the ratio of posture information output from each of the pair of adjustment pixels is predetermined. As described above, the image sensor can be configured to have a step of moving in the normal direction (Y direction) of the image sensor.

  According to the present invention, it is possible to improve the position adjustment accuracy of the image sensor.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< First Embodiment >>
FIG. 1 is a block diagram showing a digital still camera 1 according to an embodiment of the present invention. The camera 1 according to this embodiment includes a camera body 10 and an interchangeable lens 20, and the camera body 10 and the interchangeable lens 20 can be mechanically attached and detached by a mount unit 30.

For convenience of explanation, as shown in the figure, the optical axis L direction when the camera 1 is in the normal posture is the Y axis, the axes orthogonal to the optical axis L are the X axis and the Z axis, and the X axis is the paper surface of the figure. An axis perpendicular to the Z axis is defined as the vertical direction in the figure. Unless otherwise specified, the Z-axis direction is also referred to as the up-down direction, the X-axis direction as the left-right direction, and the Y-axis direction as the optical axis direction.

  The camera body 10 includes an imaging element package 110, a body CPU 120, a liquid crystal display element 130 that constitutes a liquid crystal viewfinder, an eyepiece 140 for observing the liquid crystal display element 130, a liquid crystal display element driving circuit 150, and a photographing operation. And a memory card 160 for storing image signals. The image sensor package 110 is attached to the camera body 10 via a bracket 170 having a position adjustment mechanism.

The image sensor package 110 incorporates an image sensor 111 that is adjusted and arranged on the planned focal plane of the interchangeable lens 20. FIG. 2 is a cross-sectional view illustrating a structural example of the image sensor package 110. As shown in the figure, an image sensor 111 made of a semiconductor chip, such as a CCD image sensor or a CMOS image sensor, is attached to a ceramic substrate 112 having one end opened, and the opening is sealed with a cover glass 113. It has been stopped. One main surface 114 of the image sensor 111 shown in FIG. A more detailed structure of the image sensor package 110 will be described later.

The body CPU 120 is electrically connected to a lens CPU 250, which will be described later, through an electrical signal contact portion 310 provided in the mount unit 30, receives lens information from the lens CPU, and receives camera body information such as a defocus amount to the lens CPU 250. Send. In addition, the body CPU 120 reads out an image signal from the image sensor 102, performs predetermined information processing, and outputs it to the liquid crystal display element 130 and the memory card 160. The body CPU 120 controls the entire camera, such as correcting image signals and detecting the focus adjustment state and the aperture adjustment state of the interchangeable lens 20.

Also, a control signal is output from the body CPU 120 to the liquid crystal display element driving circuit 150, and the liquid crystal display element driving circuit 150 drives the liquid crystal display element 130 based on the control signal. As a result, the user can visually recognize the captured image through the eyepiece lens 140.

On the other hand, the interchangeable lens 20 includes a lens 210, a zooming lens 220, a focusing lens 230, a diaphragm 240, and a lens CPU 250.

The lens CPU 250 detects the states of the zooming lens 220, the focusing lens 230, and the diaphragm 240, and performs information communication with the body CPU 120 as necessary, while controlling the driving of the focusing lens 230 and the diaphragm. 240 drive control is executed.

Next, the image sensor 111 according to the present embodiment will be described.

FIG. 3 is a diagram schematically showing the arrangement of pixels on the image sensor 111 according to the present embodiment. The imaging device 111 of the present embodiment includes a green pixel G having a color filter in which a plurality of imaging pixels 115 are two-dimensionally arranged on the plane of the imaging surface 114 and transmits a green wavelength region, and a red wavelength region. The red pixel R having a color filter that transmits light and the blue pixel B having a color filter that transmits a blue wavelength region are arranged in a so-called Bayer Arrangement. That is, in four adjacent pixel groups 117 (dense square lattice arrangement), two green pixels are arranged on one diagonal line, and one red pixel and one blue pixel are arranged on the other diagonal line. The image sensor 111 is configured by repeatedly arranging the pixel group 117 in a two-dimensional manner on the imaging surface 114 of the image sensor 111 with the Bayer array pixel group 117 as a unit. The unit pixel group 117 may be arranged in a dense hexagonal lattice arrangement other than the dense square lattice shown in the figure.

FIG. 4A is an enlarged front view showing one imaging pixel 115. One imaging pixel 115 includes a microlens 1151, a photoelectric conversion unit 1152, and a color filter (not shown). As shown in the cross-sectional view of FIG. 7, the photoelectric conversion unit is formed on the surface of the semiconductor circuit substrate 1111 of the imaging element 111. 1152 is formed, and a microlens 1151 is formed on the surface. The photoelectric conversion unit 1152 is configured to receive an imaging light flux that passes through the exit pupil of the imaging optical system by the micro lens 1151.

In addition, the color filter of this embodiment is provided between the micro lens 1151 and the photoelectric conversion unit 1152, and the spectral sensitivities of the color filters of the green pixel G, the red pixel R, and the blue pixel B are shown in FIG. It is said to be as follows.

On the other hand, the adjustment pixel 116 is arranged instead of the green pixel G at the center position of the image sensor 111 of the present embodiment and at the position where the green pixel G having the highest arrangement density in the Bayer arrangement is arranged. Has been. When the adjustment pixel 116 is arranged at the position of the green pixel G having the highest arrangement density, the missing rate of the green pixel G is smaller than the missing rate when the adjustment pixels 116 are provided in the other pixels R and B. There is an advantage that it is possible to suppress the degree of deterioration of the image quality captured with the.

However, the adjustment pixel 116 may be provided at the position of the other pixels R and B. In addition to the center position of the image sensor 111, it can be provided in the vicinity thereof.

4B, the adjustment pixel 116 includes a micro lens 1161 and a pair of photoelectric conversion units 1162 and 1163. As shown in the cross-sectional view of FIG. 7, the semiconductor circuit substrate of the image sensor 111. Photoelectric conversion portions 1162 and 1163 are formed on the surface of 1111, and microlenses 1161 are formed on the surface. The pair of photoelectric conversion units 1162 and 1163 have the same size and are arranged vertically symmetrically with respect to the optical axis of the microlens 1161. The photoelectric conversion units 1162 and 1163 are shaped to receive a pair of adjustment light beams that pass through the exit pupil of the imaging optical system by the microlens 1161.

Note that the adjustment pixel 116 is not provided with a color filter, and its spectral characteristics are a combination of the spectral characteristics of a photodiode that performs photoelectric conversion and the spectral characteristics of an infrared cut filter (not shown). . FIG. 6 shows the spectral characteristics of the adjustment pixel 116. The relative sensitivity is a spectral characteristic obtained by adding the sensitivities of the blue pixel B, the green pixel G, and the red pixel R shown in FIG. 5, and the sensitivity appears. The light wavelength region is a region including the light wavelength regions of the sensitivity of the blue pixel B, the green pixel G, and the red pixel R shown in FIG.

FIG. 7 is a cross-sectional view of the imaging element 111 showing the adjustment pixel 116 and the imaging pixels 115 positioned above and below the adjustment pixel 116. The photoelectric conversion unit 1152 of the imaging pixel 115 receives the imaging light beam IB. One photoelectric conversion unit 1162 of the adjustment pixel 116 receives one adjustment light beam AB1, while the other photoelectric conversion unit 1163 of the adjustment pixel 116 is used for adjustment with respect to the optical axis of the microlens 1161. An adjustment light beam AB2 that is symmetrical with the light beam AB1 is received.

Next, a method for adjusting the position of the image sensor 111 will be described.

FIG. 8 is a perspective view showing the image pickup device package 110 of the present embodiment. When the image pickup device package 110 is assembled to the camera body 10, the center position is first adjusted. In the center position adjustment of the present embodiment, a laser beam coinciding with the photographing optical axis L is projected onto the image sensor 111, and this laser beam position is detected based on the pixel output of the image sensor 111. Then, in accordance with the detected laser beam position, the position of the image sensor package 110 is adjusted in the horizontal direction and the vertical direction shown in the figure within a plane orthogonal to the imaging optical axis L. In this way, the center of the image sensor 111 is made to coincide with the photographing optical axis L of the interchangeable lens 20.

The following position adjustment is the same, but the position adjustment of the image sensor 111 with respect to the camera body 10 is performed by adjusting the position adjustment mechanism of the bracket 170.

When the adjustment of the center position of the image sensor 111 is completed, the inclination of the image sensor 111 is adjusted next. This inclination is an inclination around the horizontal axis Ax orthogonal to the photographing optical axis L shown in FIG. An example of adjusting the inclination around the vertical axis Az orthogonal to the photographing optical axis L will be described later.

9A, the image sensor 111 is arranged on the planned focal plane FP of the camera body 10, and the center of the image sensor 111, that is, the position where the adjustment pixel 116 of this embodiment is provided coincides with the photographing optical axis L. The state after adjustment is shown. In this state, it is assumed that the imaging surface 114 of the imaging element 111 is inclined by an angle θ with respect to the planned focal plane FP.

When adjusting the tilt of the image sensor 111, a diaphragm cylinder 40 having an adjustment aperture 41 on the photographing optical axis L is attached to the front surface of the camera body 10, and illumination is performed from the left side of the figure toward the image sensor 111. Irradiate light.

The adjustment diaphragm opening 41 is a circular opening whose center is located on the photographing optical axis L, and the size of the circular diaphragm opening 41 is set smaller than the spread of the adjustment light beams AB1 and AB2. A diffuser plate 42 is attached to the aperture opening 41 so that the aperture aperture 41 is uniformly illuminated from the front, which is the left side of the drawing.

Here, as shown in FIG. 9A, when the imaging surface 114 of the image sensor 111 is inclined by the angle θ with respect to the planned focal plane FP, the upper adjustment light beam AB2 is the lower adjustment light beam. Compared with AB1, it is greatly limited by the aperture opening 41. FIG. 10A is a diagram showing the positional relationship between the aperture opening 41 and the adjustment light beams AB1 and AB2 in the plane where the aperture opening 41 is located, from the direction of the photographing optical axis L. The area of the adjustment light beam AB2 in the aperture opening 41 is as follows. This indicates that the area is smaller than the area of the adjustment light beam AB1.

Here, the magnitudes of the outputs of the pair of photoelectric conversion units 1162 and 1163 of the adjustment pixel 116 disposed at the center of the image sensor 111 are proportional to the areas of the adjustment light beams AB1 and AB2 in the aperture opening 41. Therefore, the output of the lower photoelectric conversion unit 1163 is smaller than the output of the upper photoelectric conversion unit 1162 at a value corresponding to the area ratio of the adjustment light beams AB1 and AB2.

By utilizing this, while detecting the outputs of the pair of photoelectric conversion units 1162 and 1163, the pair of outputs become equal or the ratio of the outputs of the pair of photoelectric conversion units 1162 and 1163 becomes 1. Next, the image sensor package 110 is tilted. Thereby, the inclination θ of the imaging surface 114 of the imaging element 111 with respect to the planned focal plane FP can be adjusted to zero.

Incidentally, FIG. 9B is a diagram showing a state after the inclination θ of the imaging surface 114 of the imaging element 111 with respect to the planned focal plane FP is adjusted to zero, and FIG. 10B is an adjustment with the aperture opening 41 in the state shown in FIG. 9B. It is a figure which shows the positional relationship with the light beam AB1, AB2 for an imaging | photography optical axis L direction. When the inclination θ of the imaging surface 114 of the image sensor 111 becomes zero as shown in FIG. 9B, the area of the adjustment light beam AB2 and the area of the adjustment light beam AB1 in the diaphragm aperture 41 become equal as shown in FIG. 10B.

As described above, the direction of the inclination θ of the imaging surface 114 of the imaging element 111 with respect to the scheduled focal plane FP can be detected by the magnitude of the outputs of the pair of photoelectric conversion units 1162 and 1163 of the adjustment pixel 116. Similarly, the amount of inclination (angle θ) can be detected by the ratio of the outputs of the pair of photoelectric conversion units 1162 and 1163 of the adjustment pixel 116. Therefore, the inclination of the imaging surface 114 of the imaging element 111 around the horizontal axis Ax can be adjusted according to the output results of the pair of photoelectric conversion units 1162 and 1163 so as to match the planned focal plane FP.

When the output of the photoelectric conversion unit 1162 of the pair of photoelectric conversion units is Ia and the output of the photoelectric conversion unit 1163 is Ib, the direction of the inclination θ of the imaging surface 114 with respect to the planned focal plane FP is Ib / Ia> 1. 9 is the same direction as the inclination shown in FIG. 9A. When Ib / Ia <1, the inclination is opposite to that shown in FIG. 9A. When Ib / Ia = 1, the inclination θ = 0.

In addition, the inclination θ can be obtained by the equation θ = F (Ib / Ia) (where the function F is a function that converts Ib / Ia into θ and is obtained experimentally or theoretically). .

<< Other Embodiments of Imaging Device >>
FIG. 11 is a diagram illustrating an adjustment pixel 116a of an image sensor 111 according to another embodiment of the present invention, and corresponds to FIG. 4B of the above-described embodiment.

In the above-described embodiment, the adjustment pixel 116 having a pair of photoelectric conversion units 1162 and 1163 that are vertically symmetrical with respect to the photographing optical axis L is used, and the inclination around the horizontal axis Ax of the image sensor 111 shown in FIG. In this embodiment, as shown in FIG. 11, the adjustment pixel 116a having a pair of photoelectric conversion units 1164 and 1165 symmetrically with respect to the photographing optical axis L is used as shown in FIG. The inclination around the vertical axis Az of 111 is adjusted.

  The adjustment pixel 116a of the present embodiment includes a microlens 1161 and a pair of photoelectric conversion units 1164 and 1165. Similar to the cross-sectional view illustrated in FIG. 7, the photoelectric conversion unit is formed on the surface of the semiconductor circuit substrate 1111 of the image sensor 111. 1164 and 1165 are formed, and a microlens 1161 is formed on the surface. The pair of photoelectric conversion units 1164 and 1165 have the same size and are arranged symmetrically with respect to the optical axis L of the microlens 1161. The photoelectric conversion units 1164 and 1165 are configured to receive a pair of adjustment light beams that pass through the exit pupil of the imaging optical system by the micro lens 1161.

  The adjustment pixel 116a of the present embodiment can be arranged at the center position of the image sensor 111 in place of the above-described adjustment pixel 116 shown in FIG.

However, it is also possible to arrange the adjustment pixel 116 of the above-described embodiment at the center position of the image sensor 111 shown in FIG. 3 and arrange the adjustment pixel 116a of the present embodiment at a nearby position including the adjacent pixels. . Conversely, the adjustment pixel 116a of this embodiment may be arranged at the center position of the image sensor 111, and the adjustment pixel 116 of the above-described embodiment may be arranged at a neighboring position including the adjacent pixels.

  When adjusting the inclination around the vertical axis Az of the image sensor 111 using such an adjustment pixel 116a (see FIG. 9A), the image sensor is arranged on the planned focal plane FP of the camera body 10 as described above. 111, and the center of the image sensor 111, that is, the position where the adjustment pixel 116a of the present embodiment is provided is adjusted so as to coincide with the photographing optical axis L, and then the aperture cylinder mounted on the front surface of the camera body 10 The outputs of the photoelectric conversion units 1164 and 1165 by the adjustment light beams AB1 and AB2 are detected through the 40 adjustment apertures 41. The relationship between the outputs of the photoelectric conversion units 1164 and 1165 detected at this time and the inclination about the vertical axis Az is exactly the relationship between the output of the photoelectric conversion units 1162 and 1163 and the inclination about the horizontal axis Ax in the above-described embodiment. Be the same.

  That is, the direction of inclination around the vertical axis Az of the imaging surface 114 of the imaging element 111 with respect to the planned focal plane FP can be detected by the magnitude of the outputs of the pair of photoelectric conversion units 1164 and 1165 of the adjustment pixel 116a. Similarly, the amount of tilt (angle) can be detected by the ratio of the outputs of the pair of photoelectric conversion units 1164 and 1165 of the adjustment pixel 116a. Therefore, the inclination of the imaging surface 114 of the imaging element 111 around the vertical axis Az can be adjusted according to the output results of the pair of photoelectric conversion units 1164 and 1165 so as to match the planned focal plane FP.

  In the above-described embodiment, one adjustment pixel 116 or 116a is arranged at the center of the image sensor 111. However, a plurality of adjustment pixels 116 or 116a are arranged in a portion including the center of the image sensor 111, and a plurality of adjustment pixels 116 or 116a are arranged. It is also possible to adjust the inclination by averaging the output of the adjustment pixel 116 or 116a or applying a mathematical process equivalent thereto. By using the outputs of the plurality of adjustment pixels 116 or 116a, the accuracy of tilt adjustment can be further increased.

<< Embodiment of Image Sensor >>
FIG. 12 is a diagram schematically illustrating an arrangement of pixels on an image sensor 111 according to still another embodiment of the present invention.

The image sensor 111 according to the present embodiment includes a plurality of imaging pixels 115 arranged two-dimensionally on the plane of the imaging surface 114, and pixels G, R, and B having three primary color filters arranged in a Bayer array. is there. In the above-described embodiment, a pixel having a pair of photoelectric conversion units 1162, 1163 or 1164, 1165 is used as one adjustment pixel 116 or 116a. In the present embodiment, a pair of adjustment pixels. A device having photoelectric conversion units 1166 and 1167 paired with each of 116b and 116c is used.

13A and 13B are diagrams showing the adjustment pixels 116b and 116c of this embodiment, respectively. The adjustment pixel 116b illustrated in FIG. 13A includes a microlens 1161 and a photoelectric conversion unit 1166, and the photoelectric conversion unit 1166 is formed on the surface of the semiconductor circuit substrate 1111 of the image sensor 111 as in the cross-sectional view illustrated in FIG. The microlens 1161 is formed on the surface. The photoelectric conversion unit 1166 is disposed at the upper part of the vertically symmetrical position with respect to the optical axis of the micro lens 1161.

On the other hand, the adjustment pixel 116b shown in FIG. 13B also includes a microlens 1161 and a photoelectric conversion unit 1167, and, similar to the cross-sectional view shown in FIG. A conversion unit 1167 is built, and a microlens 1161 is formed on the surface thereof. The photoelectric conversion unit 1167 is arranged at the lower part of the vertically symmetrical position with respect to the optical axis of the micro lens 1161.

Then, as shown in FIG. 12, one adjustment pixel 116c is disposed at the center position of the imaging pixel 111, and the other adjustment pixel 116b is disposed on the upper side thereof, and passes through the exit pupil of the imaging optical system. Are received by the photoelectric conversion units 1166 and 1167 of the pair of adjustment pixels 116b and 116c, respectively.

Note that the arrangement of the pair of adjustment pixels 116b and 116c with respect to the imaging element 111 is not limited to that shown in FIG. 12, and one adjustment pixel 116b is arranged at the center position of the imaging pixel 111 and the other adjustment pixel. 116c can be placed next to it. Moreover, it is not limited to the center of the image pick-up element 111, It can also arrange in the center vicinity.

As described above, even when the pair of adjustment pixels 116b and 116c configured by different pixels are used, the horizontal axis Ax of the image pickup surface 114 of the image pickup device package 110 depends on the output result of the pair of photoelectric conversion units 1166 and 1167. Can be adjusted to coincide with the planned focal plane FP.

In addition to this, there is an advantage that the configuration of the output readout circuit from the pixels constituting the image sensor 111 is simplified.

Note that when the adjustment pixels obtained by rotating the adjustment pixels 116b and 116c shown in FIGS. 13A and 13B by 90 degrees in the same direction are provided in the vicinity of the center position of the image sensor 111 shown in FIG. 12, the pair of adjustment pixels In accordance with the output result of the photoelectric conversion unit, the inclination around the vertical axis Az of the imaging surface 114 of the imaging element 111 can be adjusted to coincide with the planned focal plane FP.

<< Embodiment of Image Sensor >>
FIG. 14 is a diagram schematically illustrating an arrangement of pixels on an image sensor 111 according to still another embodiment of the present invention.

The image sensor 111 according to the present embodiment includes a plurality of imaging pixels 115 arranged two-dimensionally on the plane of the imaging surface 114, and pixels G, R, and B having three primary color filters arranged in a Bayer array. is there. In the above-described embodiment, the adjustment pixel 116 or 116a is provided at or near the center of the image sensor 111. In the present embodiment, the adjustment pixel 116d is a peripheral edge of the area where the image pickup pixels 115 are arranged in a Bayer array. It is provided outside the part or area. In the figure, an example in which the adjustment pixel 116d is provided outside the array region of the imaging pixels 115 and below the center in the left-right direction of the imaging element 111 is shown.

The adjustment pixel 116d used here may be of any type shown in FIG. 4B, FIG. 11, or FIGS. 13A and 13B.

Next, an inclination adjustment method around the horizontal axis Ax of the image sensor 111 when the adjustment pixel 116d is provided at a position other than the center of the image sensor 111 and the vicinity of the center as in the present embodiment will be described.

FIG. 15A shows a state where the image sensor 111 is arranged on the planned focal plane FP of the camera body 10 and the center of the image sensor 111 is adjusted to coincide with the photographing optical axis L. In this state, it is assumed that the imaging surface 114 of the imaging element 111 is inclined by an angle θ with respect to the planned focal plane FP.

Here, when adjusting the tilt of the image pickup device 111, a diaphragm cylinder 40 having an adjustment stop opening 41 on the photographing optical axis L is attached to the front surface of the camera body 10, and the image pickup device 111 is attached to the image pickup device 111 from the left side of FIG. Although the illumination light is irradiated in the direction, the distance D between the imaging surface 114 of the imaging element 111 and the aperture opening 41 of the present embodiment is set as follows.

FIG. 15B is a diagram illustrating a state in which the inclination θ of the imaging surface 114 of the imaging element 111 with respect to the planned focal plane FP is adjusted to zero. In a state where the inclination θ is zero, the pair of photoelectric conversion units 1162 and 1163 of the adjustment pixel 116d receive the pair of adjustment light beams AB1 and AB2 that are equally divided by the aperture opening 41 along the optical axis L. The position of the aperture opening 41 is such a distance D.

That is, the distance D is such that the axis of symmetry AB0 of the adjustment light beams AB1 and AB2 intersects the optical axis L on the surface of the aperture opening 41. This distance D is determined in advance because it is uniquely determined by the position of the adjustment pixel 116d, the optical characteristics of the microlens 1161 of the adjustment pixel 116d, the relative positional relationship between the pair of photoelectric conversion units 1162 and 1163, and the like.

Then, as shown in FIG. 15A, an aperture cylinder body 40 having an adjustment aperture opening 41 having a distance D on the photographing optical axis L is mounted on the front surface of the camera body 10, and the image sensor 111 is viewed from the left side of FIG. Illuminate with illumination light. As shown in FIG. 15A, when the imaging surface 114 of the image sensor 111 is inclined by the angle θ with respect to the planned focal plane FP, the upper adjustment light beam AB2 in the adjustment light beam is compared with the lower adjustment light beam AB1. Therefore, it is greatly limited by the aperture opening 41.

The magnitudes of the outputs of the pair of photoelectric conversion units 1162 and 1163 of the adjustment pixel 116d disposed below the center of the image sensor 111 in the left-right direction are the adjustment light beams AB1 and AB2 in the aperture opening 41. Is proportional to the area. Therefore, the image sensor 111 is configured so that the outputs of the pair of photoelectric conversion units 1162 and 1163 are detected while the pair of outputs are equal or the ratio of the outputs of the pair of photoelectric conversion units 1162 and 1163 is 1. Tilt. Thereby, as shown in FIG. 15B, the inclination θ of the imaging surface 114 of the imaging element 111 with respect to the planned focal plane FP can be adjusted to zero.

Note that when adjusting the inclination of the image sensor 111 about the vertical axis Az, the adjustment pixel 116a shown in FIG. 11 is used.

If the adjustment pixels 116d are provided outside the region where the imaging pixels 115 are arranged as in the present embodiment, the entire imaging pixels 115 can be used for shooting, so that the quality of the captured image becomes higher. Even when the adjustment pixel 116d is provided in the peripheral portion of the area where the imaging pixels 115 are arranged, the imaging pixels 115 can be fully used in the main part of the captured image, so that the captured image quality is further improved. It will be.

<< Other Embodiments of Position Adjustment Method >>
In the embodiment shown in FIG. 9A and FIG. 9B, when adjusting the inclination θ of the imaging surface 114 of the image sensor 111, as a pre-processing, a laser beam that coincides with the imaging optical axis L is projected onto the image sensor 111. By detecting the position of the laser beam based on the pixel output of the image sensor 111, the center of the image sensor 111 was made to coincide with the photographing optical axis L. However, if the output of the adjustment pixel 116 of the present embodiment is used, the center position of the image sensor 111 can be aligned with the optical axis L without using a laser beam or the like.

16A to 16C are diagrams for explaining a center position adjustment method using the adjustment pixel 116. FIG. 16A shows a state before adjustment, FIG. 16B shows a state during adjustment, and FIG. 16C shows a state after the adjustment. It is.

In the present embodiment, the position adjustment method will be described using an example in which the image pickup device package 110 having the image pickup device 111 shown in FIG. 3 is used, but the image pickup device package 110 having the image pickup device 111 shown in FIGS. Can be applied similarly.

Further, a method of aligning the center position in the vertical direction (Z-axis direction) of the image sensor package 110 using the image sensor 111 shown in FIG. 3 will be described. The center position in the left-right direction (X-axis direction) of the image sensor 111 is By providing the adjustment pixel 116 a shown in FIG. 11 in the image sensor 111, adjustment can be performed by the same method.

First, as shown in FIG. 16A, the imaging element 111 is arranged on the planned focal plane FP of the camera body 10, and the diaphragm cylinder 40 having the adjustment diaphragm aperture 41 on the photographing optical axis L is attached to the front surface of the camera body 10. The illumination light is irradiated from the left side of the figure toward the image sensor 111. In this state, it is assumed that the center of the image sensor 111 does not coincide with the photographing optical axis L, and the image pickup surface 114 of the image pickup element 111 is inclined by the angle θ with respect to the planned focal plane FP.

In this state, the outputs of the pair of photoelectric conversion units 1162 and 1163 of the adjustment pixel 116 by the pair of adjustment light beams AB1 and AB2 limited by the aperture opening 41 are detected. In the example shown in the figure, the adjustment light beam AB1 is greatly limited as compared with the adjustment light beam AB2, and accordingly, the output of the photoelectric conversion unit 1163 is larger than the output of the photoelectric conversion unit 1162 in correlation with this. Here, the image sensor package 110 is translated in the planned focal plane FP so that the output ratio of the photoelectric conversion units 1162 and 1163 becomes 1 (the output values are equal).

This state is shown in FIG. 16B. When the output ratio of the pair of photoelectric conversion units 1162 and 1163 becomes 1, the area ratio of the adjustment light beams AB1 and AB2 on the surface of the aperture opening 41 becomes 1. Thus, the symmetry axis AB0 of the adjustment light beams AB1 and AB2 intersects the photographing optical axis L on the surface of the aperture opening 41. Let this intersection be P1.

Next, the diaphragm cylinder 40 is removed from the camera body 10, and instead of this, as shown in FIG. 16C, an arbitrary position on the optical axis L different from the diaphragm aperture 41 (distance between the imaging surface 114 and the diaphragm aperture 41a). D2) is fitted with a diaphragm cylinder 40a having an adjustment diaphragm opening 41a. Similar to the diaphragm aperture 41, the diaphragm aperture 41a for adjustment is a circular aperture whose center is located on the photographing optical axis L. The size of the circular diaphragm aperture 41a is larger than the spread of the adjustment light beams AB3 and AB4. Is set too small. A diffuser plate 42a is attached to the aperture opening 41a, and thereby the aperture aperture 41a is uniformly illuminated from the front, which is the left side of FIG.

Then, as shown in FIG. 16C, the outputs of the pair of photoelectric conversion units 1162 and 1163 of the image sensor 111 are detected, and the point P1 is centered so that the output ratio of the pair becomes 1 (the output values are equal). Then, the imaging device package 110 is rotated with a radius of R1 within a plane orthogonal to the planned focal plane FP. The plane orthogonal to the planned focal plane FP is the drawing plane (the drawing itself in the drawing) including the photographing optical axis L.

As a result, the center of the image sensor 111 coincides with the center of the planned focal plane FP, and at the same time, the inclination θ of the image plane 114 of the image sensor 111 with respect to the planned focal plane FP becomes zero.

According to the present embodiment, since the center position of the image sensor 111 can be adjusted without using an irradiation device such as a laser beam, the position adjustment device can be further simplified.

When the above-described center position adjustment is performed using the image sensor 111 shown in FIG. 14, each of the distance D1 of the adjustment aperture opening 41 shown in FIG. 16A and the distance D2 of the adjustment aperture opening 41a shown in FIG. Can be obtained in advance.

<< Embodiment of Position Adjustment Method >>
In the embodiment described above, the inclination and the center position of the image sensor 111 with respect to the planned focal plane FP are adjusted. However, the position in the photographing optical axis L direction with respect to the planned focal plane FP can be adjusted using the adjustment pixels.

FIG. 17A is a diagram for explaining a method for adjusting the position of an image sensor package according to still another embodiment of the present invention, and FIG. 17B is a front view schematically showing the arrangement of pixels of the image sensor according to this embodiment. is there.

As shown in FIG. 17B, the imaging device 111 of the present embodiment includes pixels G, R, and B each having a plurality of imaging pixels 115 arranged two-dimensionally on the plane of the imaging surface 114 and having three primary color filters. Is a Bayer array. In this embodiment, a pair of adjustment pixels 116e and 116f are provided at the center in the left-right direction of the area where the imaging pixels 115 are arranged in the Bayer array and symmetrical in the vertical direction. In the figure, an example is shown in which a pair of adjustment pixels 116e and 116f are provided at the upper and lower edges of the image sensor 111 at the left and right centers.

The adjustment pixels 116e and 116f used here may be of any type shown in FIG. 4B, FIG. 13A, FIG. 13B, or FIG. However, when the adjustment pixel 116a shown in FIG. 11 is used, the positions of the adjustment pixels 116e and 116f are arranged at, for example, the center in the vertical direction of the image sensor 111 and symmetrical in the horizontal direction.

Next, a method for adjusting the position of the image sensor 111 in the optical axis L direction using the adjustment pixels 116e and 116f of the present embodiment will be described.

17A, the image sensor package 110 is attached to the camera body 10, the center of the image sensor 111 is made to coincide with the imaging optical axis L in advance, and the inclination of the imaging surface 114 of the image sensor 111 with respect to the planned focal plane FP is zero. Indicates the preprocessed state. In this state, it is assumed that the imaging surface 114 of the imaging element 111 is shifted from the planned focal plane FP by a distance d in the optical axis L direction.

Here, when adjusting the position of the image sensor 111 in the optical axis direction, an aperture cylinder body 40 having an adjustment aperture opening 41 on the imaging optical axis L is mounted on the front surface of the camera body 10, and from the left side of FIG. Illumination light is irradiated toward the image sensor 111. The distance D between the image pickup surface 114 of the image sensor 111 and the aperture opening 41 of the present embodiment is set as follows.

That is, in a state in which the positional deviation amount d of the imaging surface 114 of the imaging element 111 with respect to the planned focal plane FP is adjusted to zero, the pair of photoelectric conversion units 1162 and 1163 of the adjustment pixel 116e are moved along the optical axis L by the aperture opening 41. The distance D is such that a pair of adjustment light beams AB1 and AB2 that are equally divided are received. That is, the distance D is such that the axis of symmetry AB0-1 of the adjustment light beams AB1 and AB2 intersects the optical axis L on the surface of the aperture opening 41. Similarly, the distance D is such that the pair of photoelectric conversion units 1162 and 1163 of the adjustment pixel 116f receive the pair of adjustment light beams AB3 and AB4 that are equally divided by the aperture opening 41 along the optical axis L. . That is, the distance D is such that the symmetry axis AB0-2 of the adjustment light beams AB3 and AB4 intersects the optical axis L on the surface of the aperture opening 41.

This distance D is uniquely determined by the positions of the adjustment pixels 116e and 116f, the optical characteristics of the micro lenses 1161 of the adjustment pixels 116e and 116f, the relative positional relationship between the pair of photoelectric conversion units 1162 and 1163, and the like. Find in advance.

Then, as shown in FIG. 17A, a diaphragm cylinder 40 having an adjustment diaphragm aperture 41 with a distance D is mounted on the front surface of the camera body 10 on the photographing optical axis L, and is directed from the left side of FIG. Illuminate with illumination light.

Imaging is performed such that the output ratio of the adjustment pixel 116e from the pair of photoelectric conversion units 1162 and 1163 is 1 and / or the output ratio of the adjustment pixel 116f from the pair of photoelectric conversion units 1162 and 1163 is 1. The element package 110 is moved in any direction of the optical axis L. Thereby, the position of the imaging surface 114 of the imaging element 111 with respect to the plan focal plane FP can be adjusted to zero.

It is also possible to arrange only one of the adjustment pixels 116e and 116f and adjust the position of the image sensor 111 in the optical axis L direction in the same procedure.

<< Embodiment of Image Sensor and Position Adjustment Method >>
By the way, in the above-described embodiment, when the position is adjusted so that the imaging surface 114 of the imaging element 111 coincides with the planned focal plane FP of the imaging optical system, the adjustment pixel 116 is a pair of adjustment light beams AB1 that are symmetric about the optical axis L. , AB2 is described on the assumption that light is received.

However, due to a manufacturing error of the image sensor 111, an angle error ΔQ may occur between the symmetry axis AB0 and the optical axis L of the adjustment light beams AB1 and AB2, as shown in FIG. Therefore, the angle error ΔQ can be measured in advance for each image sensor, and the influence of the measured angle error ΔQ can be corrected when the above-described position adjustment is performed.

For example, when the inclination of the imaging surface 114 of the image sensor 111 is adjusted, an inclination angle corresponding to the output ratio of the adjustment pixel 116 is obtained by the procedure described above, and imaging is performed so that this inclination is not zero but an angle error ΔQ. The inclination of the imaging surface 114 of the element package 111 is adjusted. As a result, the imaging surface 114 can be made to coincide with the planned focal plane FP with higher accuracy.

Such an angle error ΔQ of the imaging surface 114 or the like is high when measured with respect to the surface of the imaging device 111 before the packaging process of the imaging device package 110, for example, in the state of a semiconductor wafer or in the state of a semiconductor chip obtained by dicing it. It can be measured with high accuracy. For example, a pair of output ratios corresponding to the pair of adjustment light beams AB1 and AB2 passing through the aperture opening 41 with the same configuration as that shown in FIGS. 9A and 9B with the surface of the image sensor 111 pressed against the reference plane. Ib / Ia can be measured, and angle data corresponding to this output ratio can be used as the angle error ΔQ.

Further, the data of the angle error ΔQ obtained in this way can be stored in the image sensor 111 itself. FIG. 19 is an enlarged view of the image sensor 111. The image sensor 111 according to the present embodiment includes an image pickup circuit in which the image pickup pixel 115 and the adjustment pixel 116 described above and a drive circuit for driving the image pickup pixel 115 are built. 117 and a non-volatile memory 118 such as an EEPROM, and the non-volatile memory 118 stores the angle error ΔQ.

As a result, when position adjustment is performed as the image sensor 111, the angle error ΔQ inherent to the image sensor 111 can be read out, so that there is no need to separately perform an angle error pairing operation, and the management is easy. Therefore, there is no risk of using an angle error of another image sensor.

Note that the error stored in the nonvolatile memory 118 may be an error with respect to the design value of the adjustment pixel 116 instead of the error ΔQ.

<< Embodiment of Position Adjustment Method >>
In the above description, when the image pickup surface 114 of the image pickup device 111 is accurately positioned on the planned focal plane FP, the pair of adjustment light beams AB1, which pass through a region symmetric with respect to the optical axis L on the predetermined plane. AB2 is assumed to be received by the adjustment pixel 116.

However, it is also possible to adjust the position of the image sensor using a pair of adjustment light beams that pass through a region symmetric with respect to a position other than the optical axis L at the specified position. In this case, a diaphragm cylinder having a diaphragm aperture that is symmetric with respect to the specified position is used, and the pair of outputs of the adjustment pixels corresponding to the pair of adjustment light beams are equal to the planned focal plane. Adjust the imaging surface.

<< Embodiment of Image Sensor >>
In the above description, the adjustment pixels 116 and 116 a to 116 f provided in the image sensor 111 are used for position adjustment when the image sensor package 110 is assembled to the camera body 10. However, this adjustment pixel can also be used as a focus detection pixel when used as the digital still camera 1.

FIG. 20 is a front view schematically showing a pixel arrangement of an image sensor 111 according to still another embodiment of the present invention, and FIG. 21 is an enlarged front view showing the XXI portion of FIG. In FIG. 20, the display of pixels as in FIG. 21 is omitted for convenience.

The imaging pixel 111 of the present embodiment includes a green pixel G having a color filter in which a plurality of imaging pixels 115 are two-dimensionally arranged on a plane constituting the imaging surface 114 and transmits a green wavelength region, and a red pixel A red pixel R having a color filter that transmits a wavelength region and a blue pixel B having a color filter that transmits a blue wavelength region are arranged in a so-called Bayer array.

Further, adjustment pixel rows 116 </ b> A to 116 </ b> E in which a plurality of the adjustment pixels 116 described above are arranged in parallel are arranged on a plane constituting the imaging surface 114. An adjustment pixel column 116A is arranged in a region including the center of the image sensor 111, adjustment pixel columns 116B and 116C are arranged in the upper and lower regions, and adjustment pixel columns 116D and 116E are arranged in the left and right regions. One pixel column is formed by arranging a plurality of adjustment pixels 116 in one column as shown in FIG.

For the plurality of adjustment pixel rows 116A to 116E, a desired pixel row can be selected, for example, by a user's manual operation, and the focus adjustment state of the imaging optical system is detected by the selected adjustment pixel row.

Next, a so-called pupil division phase difference detection method for adjusting the focus based on the outputs of the adjustment pixel rows 116A to 116E described above will be described.

FIG. 22 is a cross-sectional view taken along the line XXII-XXII in FIG. 21, and the adjustment pixel 116-1 arranged on the photographing optical axis L and the adjustment pixel 116-2 adjacent thereto are formed by the exit pupil 260. The light beams AB1-1, AB2-1, AB2-1 and AB2-2 irradiated from the distance measuring pupils 261 and 262 are received. However, for the other adjustment pixels, the pair of photoelectric conversion units receive a pair of light beams emitted from the pair of distance measurement pupils 261 and 262.

Here, the exit pupil 260 is an image set at a position D3 in front of the microlens 1161 of the adjustment pixel 116 disposed on the planned focal plane of the interchangeable lens 20. The distance D3 is a value uniquely determined according to the curvature and refractive index of the microlens, the distance between the microlens and the photoelectric conversion unit, and the distance D3 is referred to as a distance measurement pupil distance. The distance measuring pupils 261 and 262 are images of the photoelectric conversion units 1162 and 1163 projected by the microlens 1161 of the adjustment pixel 116.

In the figure, the arrangement direction of the adjustment pixels 116-1 and 116-2 coincides with the arrangement direction of the pair of distance measuring pupils 261 and 262.

The microlenses 1161-1 and 1161-2 of the adjustment pixel 116 are disposed in the vicinity of the planned focal plane of the interchangeable lens 20, and are disposed behind the microlens 1161-1 disposed on the optical axis L. The shape of the pair of photoelectric conversion units 1162-1 and 1163-1 is projected onto the exit pupil 206 separated by the distance measuring pupil distance D3, and the projected shape forms the distance measuring pupils 261 and 262.

Similarly, the shape of the pair of photoelectric conversion units 1162-2 and 1163-2 disposed behind the microlens 1161-2 disposed away from the optical axis L is separated by the distance measuring pupil distance D3. The projected image is projected onto the exit pupil 206, and the projection shape forms distance measuring pupils 261 and 262.

That is, on the exit pupil 260 at the distance measurement pupil distance D3, the projection direction of each pixel 116 is such that the projection shapes (distance measurement pupils 261 and 262) of the photoelectric conversion units 1162 and 1163 of the respective adjustment pixels 116 match. It has been decided.

Note that the photoelectric conversion unit 1162-1 of the adjustment pixel 116-1 is placed on the microlens 1161-1 by one focus detection light beam AB1-1 that passes through one distance measuring pupil 261 and goes to the microlens 1161-1. A signal corresponding to the intensity of the formed image is output. On the other hand, the photoelectric conversion unit 1163-1 is an image formed on the microlens 1161-1 by the other focus detection light beam AB2-1 that passes through the other ranging pupil 262 and travels toward the microlens 1161-1. A signal corresponding to the intensity of the signal is output.

Similarly, the photoelectric conversion unit 1162-2 of the adjustment pixel 116-2 passes through one distance measuring pupil 261 and is focused on the microlens 1161-2 by one focus detection light beam AB1-2 that is directed to the microlens 1161-2. A signal corresponding to the intensity of the image formed is output. On the other hand, the photoelectric conversion unit 1163-2 is an image formed on the microlens 1161-2 by the other focus detection light beam AB <b> 2-2 that passes through the other distance measuring pupil 262 and travels toward the microlens 1161-2. A signal corresponding to the intensity of the signal is output.

A plurality of the above adjustment pixels 116 are arranged in a straight line as shown in FIG. 21, and the outputs of the pair of photoelectric conversion units 1162 and 1163 of each adjustment pixel 116 are respectively output from the distance measurement pupil 261 and the distance measurement pupil 262. Are collected into output groups corresponding to the above, data relating to the intensity distribution of a pair of images formed on the adjustment pixel array by the focus detection light beams AB1 and AB2 passing through the distance measuring pupil 261 and the distance measuring pupil 262, respectively, can be obtained. . By applying an image shift detection calculation process such as a correlation calculation process or a phase difference detection process to the intensity distribution data, an image shift amount by a so-called pupil division phase difference detection method can be detected.

Then, a conversion calculation is performed on the obtained image shift amount according to the center-of-gravity interval of the pair of distance measuring pupils, thereby obtaining a current focal plane with respect to the planned focal plane (the focal point corresponding to the position of the microlens array on the planned focal plane) The deviation of the focal plane at the detection position, that is, the defocus amount can be obtained.

An operation example of the camera 1 according to the present embodiment including the above-described focus adjustment state detection step will be described. FIG. 23 is a flowchart showing an operation example of the digital still camera 1 of the present embodiment.

First, when the camera 1 is turned on in step S100, exposure control of the image sensor 111 is executed in step S110.

Next, in step S120, data is read from the imaging pixel 115 and the adjustment pixel 116, and the image data of the imaging pixel 115 is displayed on the liquid crystal display element 130. It should be noted that which adjustment pixel row 116A to 116E is selected for focus detection is set in advance by the user or the like.

Next, the output of the adjustment pixel 116 is read based on the pair of image data corresponding to the adjustment pixel rows 116A to 116E set in step S130, and the image shift amount is calculated by the pupil division phase difference detection method described above. Further, the defocus amount of the optical system is calculated.

Next, in step S140, it is determined whether or not the calculated absolute value of the defocus amount is within a predetermined value, that is, whether or not it is in the vicinity of the in-focus position.

If the result of the determination in step S140 is that the current position of the focusing lens 230 is in the vicinity of the in-focus position, the process proceeds to step S160 and waits for a shutter relay operation by the user.

On the other hand, as a result of the determination in step S140, when the current position of the focusing lens 230 is away from the in-focus position by a predetermined value or more, the calculated defocus amount is sent to the lens CPU 250, and the focusing lens 230 is sent. After driving, the process returns to step S100, and the operations of steps S100 to S140 are repeated.

Although not shown, when the result of determination in step S140 is that focus detection is impossible, a scan drive command is sent to the lens CPU 250 to drive the focusing lens 230 between the infinite end and the closest end. Thereafter, the process returns to step S100, and the operations of steps S100 to S140 are repeated again.

When the shutter relays input by the user is confirmed in step S160, exposure control of the image sensor 111 is executed in step S170, and image data of the image pickup pixel 115 and the adjustment pixel 116 are read.

In step S180, the pixel data at each pixel position in the adjustment pixel rows 116A to 116E is interpolated based on the image data of the adjustment pixel 116 and the image data of the surrounding imaging pixels 115. This is because the adjustment pixel 116 is a pixel not provided with a color filter, and thus image data cannot be used as it is.

Finally, after storing the image data of the imaging pixel 115 and the interpolated image data in the memory card 160, the process returns to step S100 and the above operations are repeated.

In the present embodiment, the adjustment pixel 116 used at the time of assembling the image pickup device package 110 can also be used as a focus detection pixel, so that it is not necessary to provide a separate dedicated adjustment pixel 116 in the image pickup device 111.

In the above-described embodiment, the adjustment pixel 116 is not provided with a color filter, but a color filter of the color of the imaging pixel 115 corresponding to the position where the adjustment pixel 116 is disposed may be provided. In this case, the output of the adjustment pixel 116 can be used as it is as image data without performing an interpolation calculation.

1 is a block diagram illustrating a digital still camera according to an embodiment of the present invention. It is sectional drawing which shows the image pick-up element package which concerns on embodiment of this invention. It is a front view showing typically the arrangement of the pixels of the image sensor according to the embodiment of the present invention. It is a front view which expands and shows one of the imaging pixels shown in FIG. FIG. 4 is an enlarged front view showing one of the adjustment pixels shown in FIG. 3. It is a spectral characteristic figure which shows the relative sensitivity with respect to the wavelength of each of the three imaging pixels shown in FIG. It is a spectral characteristic figure which shows the relative sensitivity with respect to the wavelength of the pixel for adjustment shown in FIG. FIG. 4 is a cross-sectional view of an imaging device showing one adjustment pixel shown in FIG. 3 and two imaging pixels adjacent vertically. It is a perspective view which shows the image pick-up element package which concerns on embodiment of this invention. It is a figure which shows the state before position adjustment for demonstrating the position adjustment method of the image pick-up element package which concerns on embodiment of this invention. It is a figure which shows the state after position adjustment for demonstrating the position adjustment method of the image pick-up element package which concerns on embodiment of this invention. FIG. 9B is a diagram showing the positional relationship between the aperture opening and the adjustment light beam in the plane where the aperture opening is located in the state shown in FIG. FIG. 9B is a diagram showing the positional relationship between the aperture opening and the adjustment light beam in the plane where the aperture opening is located in the state shown in FIG. It is a front view which shows the pixel for adjustment of the image pick-up element package which concerns on other embodiment of this invention. It is a front view which shows typically the arrangement | sequence of the pixel on the image pick-up element which concerns on other embodiment of this invention. It is a front view which expands and shows the one adjustment pixel of FIG. It is a front view which expands and shows the other adjustment pixel of FIG. It is a front view which shows typically the arrangement | sequence of the pixel on the image pick-up element which concerns on further another embodiment of this invention. It is a figure which shows the state before position adjustment for demonstrating the position adjustment method of the image pick-up element package which concerns on embodiment shown in FIG. It is a figure which shows the state after the position adjustment for demonstrating the position adjustment method of the image pick-up element package which concerns on embodiment shown in FIG. It is a figure which shows the state before position adjustment for demonstrating the position adjustment method of the image pick-up element package which concerns on further another embodiment of this invention. It is a figure which shows the state in the middle of position adjustment for demonstrating the position adjustment method of the image pick-up element package which concerns on other embodiment of this invention. It is a figure which shows the state after position adjustment for demonstrating the position adjustment method of the image pick-up element package which concerns on further another embodiment of this invention. It is a figure for demonstrating the position adjustment method of the image pick-up element package which concerns on other embodiment of this invention. It is a front view which shows typically the arrangement | sequence of the pixel of the image pick-up element based on embodiment of FIG. 17A. It is a figure for demonstrating the angle error of the image pick-up element which concerns on other embodiment of this invention. It is an enlarged plan view showing an image sensor according to still another embodiment of the present invention. It is a front view which shows typically the pixel arrangement | sequence of the image pick-up element which concerns on further another embodiment of this invention. It is a front view which expands and shows the XXI part of FIG. It is sectional drawing which follows the XXII-XXII line | wire of FIG. It is a flowchart which shows the operation example of the digital still camera which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Digital still camera; 10 ... Camera body; 20 ... Interchangeable lens 110 ... Imaging device package; 111 ... Imaging device; 114 ... Imaging surface 115 ... Imaging pixel; 116, 116a-116f ... Adjustment pixel 1161 ... Micro lens; ˜1167 ... Photoelectric conversion unit 230 ... Focusing lens L ... Optical axis; FP ... Planned focal plane

Claims (10)

A light receiving unit that receives a reference light beam irradiated from a predetermined direction to the predetermined plane is provided on an imaging element in which a plurality of imaging pixels that receive a light beam and output a photoelectrically converted signal are arranged two-dimensionally on a predetermined plane. And a position adjusting method for adjusting the posture of the image sensor based on the posture information output by the adjustment pixel, and an adjustment pixel that outputs posture information of the image sensor .
The posture obtained by installing a stop aperture at a first position on the optical axis of an optical system that forms an image on the image sensor, and receiving the reference light flux through the stop aperture by the adjustment pixel. Moving the image sensor within the predetermined plane so that information is predetermined;
An aperture opening is installed at a second position on the optical axis different from the first position, and the posture information obtained by receiving the reference light flux through the aperture opening with the adjustment pixel is predetermined. And a step of rotating the image sensor about the first position. The position adjustment method according to claim 1,
A pair of the adjustment pixels are arranged at symmetrical positions in the array of the imaging pixels,
A position adjustment method comprising a step of moving the image sensor in a normal direction of the image sensor so that a ratio of the posture information output by each of the pair of adjustment pixels is predetermined. In the position adjustment method according to claim 1 or 2 ,
The position adjustment method , wherein the adjustment pixels are arranged outside an area where the imaging pixels are arranged. In the position adjustment method according to claim 1 or 2 ,
The position adjustment method , wherein the adjustment pixel is disposed substantially at the center of an area where the imaging pixels are arranged. In the position adjustment method according to claim 1 or 2 ,
The position adjustment method , wherein the adjustment pixels are arranged in a peripheral portion of an area where the imaging pixels are arranged. In the position adjustment method according to any one of claims 1 to 5 ,
The position adjustment method , wherein the adjustment pixel includes a pair of photoelectric conversion units as the light receiving unit. In the position adjustment method according to any one of claims 1 to 5 ,
The adjustment pixel includes a first adjustment pixel having a first photoelectric conversion unit and a second adjustment pixel having a second photoelectric conversion unit paired with the first photoelectric conversion unit. The position adjustment method characterized by this. In the position adjustment method according to any one of claims 1 to 7 ,
A position adjustment method , further comprising storage means for storing an error in the posture information when the image sensor is positioned with respect to the reference light beam. In the position adjustment method according to any one of claims 1 to 8 ,
A plurality of the imaging pixels having different spectral sensitivity characteristics are arranged according to a predetermined arrangement,
The position adjustment method , wherein the adjustment pixel is arranged at a position corresponding to an imaging pixel having the highest spectral density characteristic in the array. In the position adjustment method according to any one of claims 1 to 9,
The imaging device includes a photoelectric conversion unit that receives light from different regions of the pupil of the optical system, and includes a focus detection pixel that detects a focus detection state of the optical system,
The position adjustment method characterized in that output information of the focus detection pixel is used as the posture information.

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