JP2009137029A - Wood board and method of machining the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make use of existing knots while preventing them from falling out, and also to attain improvement in machining efficiency and reduction in cost by greatly facilitating the processing. <P>SOLUTION: In a wood board having knots F penetrating from one side Wa to the other side Wb, holes 1 striding over each knot F and a general intact area S other than the knots F are drilled in boundaries B inbetween on either the one side Wa or the other side Wb, with an adhesive 2 filled in the holes. As a result, the knots F and the general intact area S are bonded together with the adhesive, preventing the knots F from falling out through gaps which might be caused between the knots F and the general intact area S on account of dryness. Thus, the quality of a wood board W having knots F without knotholes is improved. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wood board material used for a building member and the like, and a wood board material processing method, and more particularly, to a wood board material having nodes exposed on the front and back surfaces and a wood board material processing method.

  In general, in a wood board material used for a building member or the like, a wood board material with nodes exposed on the front and back surfaces is usually used as an exterior material for a wall surface, an interior material such as a decorative board for interiors or a floor material. Nodes are mainly divided into “live” and “dead”, and “live” is formed when the branches are alive and connected to the tissues surrounding the nodes. Also say. In addition, the “dead node” is a state in which a withered branch is encased in the surrounding tissue, is not connected to the surrounding tissue, and generally the outer periphery is blackened.

In such wood board materials, when drying progresses, especially in “dead nodes”, there is no connection with surrounding tissues, so there is a gap at the boundary. It tends to occur and causes a decrease in quality.
Therefore, conventionally, for example, the following processing is performed.
(1) Buried wood This is a method of repairing a part of the surface of the board material by drilling, and forming an insertion hole in a portion of a node on one side or the other side of the wood board material. Cylindrical buried trees formed by cutting through the same type of wood are press-fitted through an adhesive, and then the surface is shaved to improve the quality so that the knots do not fall out. (See, for example, Japanese Utility Model Publication No. 2-313129 and Japanese Patent Application Laid-Open No. 2001-62805).
(2) Penetrating buried wood Cut out the joints of the board material completely, drill holes, and apply buried wood.
(3) Putty Repair by applying putty (bond for woodworking).

No. 2-313129 JP 2001-62805 A

By the way, in the above-mentioned conventional wood board material, the method of (1) and (2), in which a buried tree is press-fitted into the joint portion, improves the quality. Since it has to be prepared and press-fitted, there is a problem that the processing is extremely complicated and the cost is high. That is, the repair efficiency is poor and the shape becomes unnatural.
In addition, the repair of (3) using putty is effective at the stage where the dead node does not fall out, but if it falls off or part of it is missing, eventually the repair of (1) and (2) must be carried out. I must.
In other words, the conventional knot repairing method is basically the same, the cost is high due to the size of the knots or various shapes, and the essence of the tree and the natural beauty of the tree are not satisfied.
The present invention has been made in view of such problems, and makes use of an existing section to prevent the section from falling off, and makes the processing extremely easy to improve the processing efficiency and reduce the cost. An object of the present invention is to provide a wooden board material and a method for processing the wooden board material.

  In order to achieve such an object, the wood board material of the present invention is a wood board material having a node penetrating from one surface to the other surface. A hole straddling the node and the general part is formed at the boundary of the part, and the hole is filled with an adhesive.

Thereby, since the adhesive is filled in the hole formed at the boundary between the node and the general part, the node and the general part are coupled via the adhesive. Therefore, even if a gap is generated between the node and the general part due to drying and the node is about to fall off, the situation where the node falls off is prevented, and the quality is improved as a wood board material with a node without missing. In addition, since the original nodes of the wood board material can be expressed as they are, the natural form can be maintained and the quality in this respect can be improved.
In addition, since the hole between the node and the general part is simply drilled and filled with adhesive, machining is easier and machining efficiency and work efficiency are improved compared to conventional methods, resulting in significant cost reductions. Can be planned.

  And if needed, it is set as the structure which bore | pierced said hole at least with respect to the dead node among the said nodes, and filled this hole with the adhesive agent. Since processing is performed on a dead node that is likely to come off, the situation where the dead node falls off is reliably prevented, and the quality is improved as a wooden board material with a node that does not come off. It goes without saying that processing may also be performed on raw knots.

  If necessary, the relationship between the depth D of the hole and the plate thickness T is D <T, and the hole is made non-penetrating. Since the hole is made non-penetrating, the hole is not exposed on either one of the one side and the other side. Therefore, if a wooden board is used so that the side where the hole is not exposed becomes the surface, Since the original nodes of the board can be expressed as they are, the natural form can be maintained and the quality can be improved reliably.

  Further, in order to achieve the above object, the wood board material processing method of the present invention is a wood board material processing method having a node penetrating from one surface to the other surface. A drying step of drying the ground wood board material, and the node and the general part at the boundary between the node and the general part other than the node on one side and the other side of the dried wood board material A drilling process for drilling a straddling hole and an adhesive filling process for filling the drilled hole with an adhesive are provided.

  As a result, in the processed wood board material, the adhesive is filled in the hole formed at the boundary between the node and the general part in the same manner as described above, so that the node and the general part are coupled via the adhesive. The Therefore, even if a gap is generated between the node and the general part due to drying and the node is about to fall off, the situation where the node falls off is prevented, and the quality is improved as a wood board material with a node without missing. In addition, since the original nodes of the wood board material can be expressed as they are, the natural form can be maintained and the quality in this respect can be improved.

  In addition, in machining, since the hole between the node and the general part is simply drilled and filled with adhesive, machining is easier and machining efficiency and work efficiency can be improved compared to conventional methods. Cost reduction. In particular, since the hole is drilled and filled with the adhesive after the drying process, after the adhesive is hardened, it is difficult for the nodes to shrink due to further drying, so that the situation where the adhesion is easily peeled is prevented, The joint between the node and the general part can be further strengthened, and the situation where the node falls off can be surely prevented.

  In addition, if necessary, after the adhesive filled in the adhesive filling step is cured, a secondary processing step of cutting and finishing at least the surface of the wood board material is performed. Since the surface is finished after the adhesive is cured, it is possible to prevent the node from dropping off during the surface finishing, and to reliably perform the surface finishing. In addition, as secondary processing, for example, an interior material that can be successively connected by processing a ridge on one side edge of a wood board material and processing a ridge on which the ridge is fitted on the other side edge. In some cases, the secondary processing is preferably performed after the adhesive is cured. The situation where the node falls off is prevented, and the secondary processing can be surely performed.

  Further, if necessary, in the drilling step, the hole is drilled in at least the dead node among the nodes of the wood board material. Since processing is performed on a dead node that is likely to come off, the situation where the dead node falls off is reliably prevented, and the quality is improved as a wooden board material with a node that does not come off. It goes without saying that processing may also be performed on raw knots.

  Furthermore, if necessary, in the drilling step, the relationship between the depth D of the hole and the plate thickness T is D <T, and the hole is not penetrated. Since the hole is made non-penetrating, the hole is not exposed on either one of the one side and the other side. Therefore, if a wooden board is used so that the side where the hole is not exposed becomes the surface, Since the original nodes of the board can be expressed as they are, the natural form can be maintained and the quality can be improved reliably.

According to the present invention, since the adhesive is filled in the hole formed at the boundary between the node and the general part, the node and the general part are coupled via the adhesive, and therefore, the node and the general part are connected by drying. Even if a gap is generated between the two and the node is about to fall off, it is possible to prevent the node from dropping off, and to improve the quality as a wooden board material having a node without missing. In addition, since the original nodes of the wood board material can be expressed as they are, the natural form can be maintained and the quality can be improved in this respect as well.
In addition, since the hole between the node and the general part is simply drilled and filled with adhesive, machining is easier and machining efficiency and work efficiency can be improved compared to conventional methods. You can go down.
As a result, according to the present invention, it is useful for eliminating gaps and increasing demand for wood interior materials and the like.

Hereinafter, based on an accompanying drawing, a wood board material concerning an embodiment of the invention and a processing method of a wood board material using this wood board material are explained in detail.
As shown in FIG. 1, the wood board material W according to the embodiment of the present invention has a node F penetrating from one surface Wa to the other surface Wb. The material of the wood board material W can be applied to general coniferous trees including pine wood such as red pine, larch, todomatsu and pine, cypress and cedar, or general hardwood. As described above, as the node F, there are mainly a “living node Fa” and a “dead node Fb”.

  The wood board material W according to the embodiment of the present invention has at least a dead node Fb (in the embodiment, of the nodes F) on any one of the one surface Wa and the other surface Wb (one surface Wa in the embodiment). For the dead node Fb only), a hole 1 spanning the node F and the general part S is formed at the boundary B of the general part S other than the node F and the node F, and the hole 1 is filled with the adhesive 2. Further, as shown in FIG. 4B, the relationship between the depth D of the hole 1 and the plate thickness T is D <T, and the hole 1 is not penetrated.

  Next, a method for processing the wood board material W according to the embodiment of the present invention will be described. The basic structure of this processing method includes a sawing step (1) for grinding a raw wood board into a required size wood board material, a drying step (2) for drying the wood board material W that has been cut out, and a dry wood board material W. A drilling step (3) for drilling a hole 1 straddling the node F and the general part S at the boundary B of the general part S other than the node F and the node F on either the surface Wa or the other surface Wb; Adhesive filling step (4) for filling the hole 1 with the adhesive 2 and a secondary processing step (5) for cutting and finishing at least the surface of the wood board W after the adhesive 2 filled in the adhesive filling step is cured. ). Hereinafter, each step will be described.

(1) Sawmill process As shown in FIGS. 2 (1) and 4 (a), a known wood sawing machine or the like is used to grind a rectangular wood board W from a log, which is a raw wood, for example. The wood board W is generally referred to as a raw material (a knotted material). In the node F, the “live node Fa” is integrated with the general part S, and in the “dead node Fb”, the general part S is also included. It is in close contact.

(2) Drying step As shown in FIG. 2 (2), the wood board material W that has been ground and sawn is dried by, for example, natural drying or artificial drying. As the drying progresses, the moisture of the wood board W decreases and the joint F contracts. In particular, in the “dead node Fb”, a gap is likely to be formed between the general part S, but the frictional resistance is reduced. For this reason, it generally does not fall off easily unless an impact is applied. However, it is desirable to be careful during transportation so that the node F does not fall off.

(3) Drilling step As shown in FIGS. 2 (3) and 4 (b), on one surface Wa and the other surface Wb of the dried wood board W, in the embodiment, on one surface Wa. The hole 1 straddling the node F and the general part S is drilled at the boundary B of the general part S other than the node F and the node F. The drilling of the hole 1 is performed by, for example, an electric drill 10 that is manually operated. The electric drill 10 is provided with a stopper 11 that defines the depth of the hole. In this drilling step, the hole 1 is drilled at least in the dead node Fb among the nodes F of the wood board material W. Since the “liver Fa” is integrated with the general part S even after drying, it is not particularly necessary to provide the hole 1. Hole processing may be performed on the “live section Fa”.
In this drilling step, as shown in FIG. 4B, the relationship between the depth D of the hole 1 and the plate thickness T is D <T, and the hole 1 is not penetrated. For example, in a wood board material W of T = 12 mm, a hole 1 having a diameter of 4 mm and a depth D = 8 mm is formed, for example. It is desirable to form a plurality of holes 1 at a required interval. Depending on the state of the node F, the number of holes 1 may be one.

(4) Adhesive Filling Step As shown in FIGS. 3 (4) and 4 (c), the adhesive 2 is filled into the bored hole 1. As the adhesive 2, for example, an appropriate adhesive such as a vinyl acetate adhesive for woodworking is used. In the embodiment, Shinko Bond TV-2RL (manufactured by Oshika Corporation) was used. As a result, the adhesive 2 is filled in the hole 1 formed at the boundary B between the node F and the general part S, so that the node F and the general part S are coupled via the adhesive 2. Therefore, even if a gap is generated between the node F and the general part S due to drying and the node F is about to fall off, the situation where the node F falls off is prevented.

(5) Secondary processing step As shown in FIG. 1 and FIG. 3 (5), after the adhesive 2 filled in the adhesive filling step is cured, at least the surface of the wood board W is cut and finished. This is done using a known automatic lathe. Since the surface is finished after the adhesive 2 is cured, the situation in which the node F falls off during the surface finishing can be prevented, and the surface finishing can be surely performed. In addition, a situation in which a failure occurs due to the node F falling off the grid is also prevented. As the secondary processing, for example, it is possible to process the ridges 3 on one side edge of the wood board W and process the ridges 4 on which the ridges 3 are fitted on the other side edge, so that the interior can be sequentially arranged. In some cases, the material may be finished, but such secondary processing is preferably performed after the adhesive 2 is cured. The situation where the node F falls off is prevented, and the secondary processing can be reliably performed.

  In such processing of the wood board material W, since the boundary B between the node F and the general part S is simply drilled and filled with the adhesive 2, the processing is easier and the processing efficiency is easier than before. Work efficiency can be improved, and the cost can be greatly reduced. In particular, since the hole 1 is drilled and filled with the adhesive 2 after the drying process, after the adhesive 2 is cured, the node F is not easily reduced by further drying, and therefore, the adhesion is easily peeled off. Is prevented, and the connection between the node F and the general part S can be further strengthened, and the situation in which the node F falls off can be reliably prevented.

In the wood board material W according to the present embodiment processed in this way, as shown in FIGS. 1 and 4C, the hole 1 formed at the boundary B between the node F and the general part S is formed. Since the adhesive 2 is filled, the node F and the general part S are coupled via the adhesive 2. Therefore, even if a gap occurs between the node F and the general part S due to drying and the node F is about to fall off, the situation of the node F falling off is prevented, and the quality of the wood board material W with the node F without missing is improved. Be made. Moreover, since the original node F which the wooden board | plate material W has can be expressed as it is, a natural form can be hold | maintained and the quality in this respect can also be improved.
In particular, since processing is performed on the dead node Fb that is likely to come off, the situation where the dead node Fb falls off is reliably prevented, and the quality of the wood board material W having the node F without missing is improved. It goes without saying that processing may also be performed on the raw node Fa.

  Furthermore, since the hole 1 is made non-penetrating, the hole 1 is not exposed on any one surface (the other surface Wb in the embodiment) of the one surface Wa and the other surface Wb. If the wood board material W is used so that the side where the 1 is not exposed (the other side Wb) becomes the surface, the original node F possessed by the wood board material W can be expressed as it is, so that the natural form can be maintained and the quality can be reliably ensured. Is improved.

  In the above embodiment, the size, depth, number, and the like of the hole 1 are not limited to the above, and may be appropriately changed according to the state of the node F. Of course, various uses of the wood board material W according to the embodiment of the present invention may be used.

It is a perspective view which shows the wood board material which concerns on embodiment of this invention. It is process drawing which shows the processing method of the wooden board material which concerns on embodiment of this invention. It is process drawing which shows the processing method of the wooden board material which concerns on embodiment of this invention. It is process drawing which shows the processing method of the wooden board material which concerns on embodiment of this invention, (a) is the top view (a-1) which shows the state before a process, sectional drawing (a-2), (b) Plan view (b-1) and sectional view (b-2), (c) showing the state of drilling, (c-1) Plan view (c-1) and sectional view (c-2) showing the state filled with adhesive, It is.

Explanation of symbols

W Wood board material Wa One side Wb The other side F Node Fa Raw node Fb Dead node S General part B Boundary 1 Hole D Depth T Plate thickness 2 Adhesive 3 Convex strip 4 Convex strip (1) Saw mill (2) Drying step (2) 3) Drilling process (4) Adhesive filling process (5) Secondary processing process

Claims (7)

In a wood board material having a node penetrating from one side to the other side,
A tree characterized in that a hole straddling the node and the general part is drilled at a boundary between the node and a general part other than the node on either one side or the other side, and the hole is filled with an adhesive. Board material.   2. The wood board material according to claim 1, wherein the hole is formed in at least the dead node among the nodes, and the hole is filled with an adhesive.   The wood board material according to claim 1 or 2, wherein a relation between the depth D of the hole and the thickness T is D <T, and the hole is not penetrated. In the processing method of the wood board material having a node penetrating from one side to the other side,
A sawing process in which raw wood is ground into a required size wood board material, a drying process for drying the sawn wood board material, a node on one side and the other side of the dried wood board material and the other nodes A wood board material comprising: a drilling step of drilling a hole straddling the node and the general portion at the boundary of the general portion; and an adhesive filling step of filling the hole with the adhesive Processing method.   5. The method for processing a wood board material according to claim 4, wherein after the adhesive filled in the adhesive filling process is hardened, a secondary processing process is performed in which at least the surface of the wood board material is scraped and finished.   6. The method for processing a wood board material according to claim 4 or 5, wherein, in the drilling step, the hole is drilled at least in a dead node among the nodes of the wood board material.   The wood board material according to any one of claims 4 to 6, wherein in the drilling step, the relationship between the depth D of the hole and the plate thickness T is D <T, and the hole is not penetrated. Processing method.

Images