JP2009134897A - Organic light-emitting element and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic light-emitting element, along with its manufacturing method, for radiating Joule heat well that is generated at an organic light-emitting element. <P>SOLUTION: An organic light-emitting element 20 includes a substrate 1, an organic light-emitting layer 3 formed on the main surface of the substrate 1, a sealing plate 8 which joins with the substrate 1 at the outer peripheral part of he main surface of the substrate 1 to seal the organic light-emitting layer 3, and a heat conductive member 9 arranged between the substrate 1 and the sealing plate 8. The heat conductive member 9 is preferred to be arranged at least above the organic light-emitting layer 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an organic light emitting device and a manufacturing method thereof, and more particularly to an organic light emitting device with improved heat dissipation and a manufacturing method thereof.

  An organic EL (EL) element known as an organic light-emitting element is generally a current-driven light-emitting element, so that heat generated by electrical resistance inside the light-emitting element, so-called Joule heat, increases the temperature of the light-emitting element during light emission. It is known that this temperature rise accelerates the progress of the organic thin film degradation and electrode film peeling, and causes the life of the light emitting device and the performance to decrease.

  FIG. 12 shows an example of a conventional organic EL element structure. In the conventional organic EL device, the anode layer 202, the organic light emitting layer 203, and the cathode layer 204 laminated on the glass substrate 201 are bonded and sealed on the glass substrate 201 with a sealing plate 206 made of glass and a sealing material 207. In addition, the sealed internal space 208 is filled with an inert gas or the like. This prevents the organic light emitting layer 203 from touching moisture or moisture from the outside. The heat generated in the element is mainly conducted to the glass substrate 201 and radiated. However, since the heat conduction to the sealing plate 206 due to the convection of the inert gas is very small, and the heat conductivity of the organic light emitting layer 203 and the glass substrate 201 is also small, the device temperature is significantly increased.

In an organic EL device having the same configuration as described above, it is disclosed that a desiccant layer is provided on the inner surface of the sealing plate, and a thermally conductive spacer is provided between the cathode layer and the desiccant layer (for example, patents). Reference 1). Thereby, damage to the element due to contact with the desiccant layer or the like can be prevented, and heat dissipation from the sealing plate side can be improved. However, since the heat conductive spacer is made of a plurality of spherical metals and has a small contact area with the element and the desiccant layer, it is difficult to efficiently dissipate heat generated from the element.
JP 2004-047458 A

  An object of the present invention is to provide an organic light-emitting device that efficiently dissipates Joule heat generated in the organic light-emitting device and a method for manufacturing the same.

  According to one aspect of the present invention for achieving the above object, the organic light-emitting layer is bonded to the substrate at the outer periphery of the substrate, the organic light-emitting layer formed on the main surface of the substrate, and the organic light-emitting layer. An organic light emitting device comprising a sealing plate for sealing a layer, and a heat conductive member disposed between the substrate and the sealing plate is provided.

  According to one aspect of the present invention, a step of forming an organic light emitting layer on a substrate, a heat conductive member on a sealing plate, a plurality of rows in stripes at equal intervals, or a plurality of dots in equal intervals A method of manufacturing an organic light-emitting element, comprising: a step of applying; and a step of bonding the sealing plate to the substrate via the heat conductive member and bonding the heat conductive members to each other. Is provided.

  According to the organic light emitting device and the method for manufacturing the same of the present invention, the heat generated in the organic light emitting device can be efficiently conducted to the sealing plate and radiated well.

  Hereinafter, an organic light emitting device according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, differ from actual ones, and also include portions having different dimensional relationships and ratios between the drawings.

[First embodiment]
(Element structure)
As shown in FIG. 1, the organic light emitting device according to the first embodiment of the present invention includes a substrate 1, an organic light emitting layer 3 formed on the main surface of the substrate 1, and an outer periphery of the main surface of the substrate 1. And a sealing plate 8 that seals the organic light emitting layer 3 by bonding to the substrate 1 at a portion, and a heat conductive member 9 disposed between the substrate 1 and the sealing plate 8.

  According to the first embodiment, the organic light emitting element 20 has a so-called bottom emission structure in which light emitted from the organic light emitting layer 3 is extracted from the substrate 1 side.

  In the organic light emitting device 20, an anode layer 2, an organic light emitting layer 3, and a cathode layer 4 are sequentially laminated on a substrate 1. The anode layer 2 and the cathode layer 4 are insulated via an insulating layer 5, the anode layer 6 has an anode terminal 6 arranged by extending the anode layer 2, and the cathode layer 4 has a cathode layer 4 extended by the cathode layer 4. The cathode terminals 7 arranged in this manner are respectively formed.

  The sealing plate 8 has a heat conductive member 9 formed on the surface thereof, and is disposed in close contact with the surface of the cathode layer 4 via the heat conductive member 9, and at the outer peripheral portion of the substrate 1 via the sealing material 11. The organic light emitting layer 3 is sealed by bonding.

  The heat conductive member 9 is disposed at least above the organic light emitting layer 3.

  A groove 12 is formed in the remaining region of the sealing plate 8 in contact with the heat conductive member 9, and a desiccant 10 for absorbing moisture and moisture in the sealed internal space is formed at the bottom of the groove 12. Has been placed.

  Since the organic light emitting element 20 is configured to emit light from the substrate 1 side, the substrate 1 is a transparent substrate that transmits light, such as a glass substrate.

  Similarly, the anode layer 2 is also composed of a transparent electrode made of ITO (indium-tin oxide) having a thickness of about 150 to about 160 nm that can transmit light.

  In the organic light emitting layer 3, a hole transport layer, a light emitting portion, and an electron transport layer are sequentially laminated from the substrate 1 side.

  The hole transport layer is for smoothly transporting the holes injected from the anode layer 2 to the light emitting portion. For example, NPB (N, N-di (naphthalyl) -N, N— with a thickness of about 60 nm is used. Diphenyl-benzylidene).

The electron transport layer is for smoothly transporting electrons injected from the cathode layer 4 to the light emitting portion, and is made of, for example, Alq ₃ (aluminum quinolinol complex) having a thickness of about 35 nm.

The light-emitting portion is for emitting light by recombination of injected holes and electrons. For example, Alq ₃ having a thickness of about 30 nm doped with about 1% of a coumarin compound (C ₅₄₅ T) as a light-emitting species. Consists of.

  In addition, you may comprise the organic light emitting layer 3 using layers other than the said positive hole transport layer and an electron carrying layer, for example, a positive hole injection layer, an electron injection layer, etc.

  The cathode layer 4 is made of aluminum having a thickness of about 150 nm, for example.

  The sealing plate 8 protects the anode layer 2, the cathode layer 4, and the organic light emitting layer 3 and seals them. As the material of the sealing plate 8, glass, metal such as stainless steel (SUS) and copper, ceramic, or the like is used.

As will be described later, in the method in which the heat conductive member 9 is filled and cured at the time of manufacture, the organic light emitting element 20 may be warped or the electrode may be damaged due to a difference in thermal expansion coefficient from the glass used for the substrate 1. Therefore, the sealing plate 8 preferably has a linear expansion coefficient close to that of glass (8.5 × 10 ⁻⁶ / K).

  Moreover, since the sealing plate 8 has a function of radiating the heat transmitted from the heat conductive member 9 to the outside, it is desirable that the sealing plate 8 has a high thermal conductivity.

  The heat transfer member 9 is for transmitting Joule heat generated in the organic light emitting layer 3 to the sealing plate 8 side to dissipate heat. As the heat conductive member 9, it is preferable to use a resin such as a UV curable resin or an epoxy adhesive resin.

  When a UV curable resin or an epoxy adhesive resin is used, it is cured and used as a solid. However, since there is a volume shrinkage at the time of curing, the same problem as described above may occur. Accordingly, a material having high thixotropy (high viscosity) should be appropriately selected. Moreover, what hardens | cures simultaneously with the sealing material 11 at the time of hardening is good.

  Further, when glass is used for the sealing plate 8, any of the above materials may be used. However, when an opaque material is used for the sealing plate 8, a thermosetting or two-component mixed epoxy adhesive is used. Resin is used.

  The desiccant 10 can be used, for example, in the form of a tape or coated with calcium oxide, barium oxide or the like.

  The sealing material 11 uses UV curable resin, epoxy resin, or the like.

(Operating principle)
The operation principle of the organic light emitting device according to the first embodiment of the present invention is as follows.

  First, a constant voltage is applied between the anode layer 2 and the cathode layer 4 of the organic light emitting element 20 via the anode terminal 6 and the cathode terminal 7. Thereby, holes are injected from the anode layer 2 into the light emitting part through the hole transport layer, and electrons are injected from the cathode layer 4 into the light emitting part through the electron transport layer. Then, the holes and electrons injected into the light emitting portion recombine to emit light. The emitted light is emitted to the outside through the substrate 1.

(Production method)
2 to 5 are views for explaining a method of manufacturing the organic light emitting device according to the first embodiment of the present invention.

  The manufacturing method of the organic light emitting device according to the first embodiment of the present invention includes a step of forming the organic light emitting layer 3 on the substrate 1, a plurality of rows of heat conductive members 9 on the sealing plate 8 in a stripe shape. A step of applying a plurality of dots at equal intervals or in the form of dots, and a step of bonding the sealing plate 8 to the substrate 1 via the heat transfer member 9 and bonding the heat transfer members 9 together. And have. The heat conductive member 9 is preferably a UV curable resin, a thermosetting resin, or a room temperature curable resin.

  Below, a manufacturing process is explained in full detail.

(A) First, as shown in FIG. 2A, the anode layer 2 and the cathode terminal 7 on the substrate 1 are patterned and etched, and then the insulating layer 5 is formed between the anode layer 2 and the cathode terminal 7.

(B) Next, as shown in FIG. 2B, the organic light-emitting layer 3 is formed by sequentially forming a hole transport layer, a light-emitting portion, and an electron transport layer using a vacuum deposition apparatus.

(C) Next, as shown in FIG. 2C, the cathode layer 4 is formed.

(D) Next, as shown in FIG. 3A, grooves 12 are formed on the outer periphery of the sealing plate 8 by etching.

(E) Next, as shown in FIG. 3B, the desiccant 10 is applied to the bottom of the groove 12 with a powdery material such as calcium oxide dissolved in a solvent together with a resin as an adhesive. Further, it is formed by being cured by UV irradiation.

(F) Next, as shown in FIG.3 (c), the heat conductive member 9 and the sealing material 11 are apply | coated.

(G) Finally, as shown in FIG. 4, the sealing plate 8 is pressure-bonded to the substrate 1 and bonded and sealed to complete the organic light emitting device 20 shown in FIG.

(Method of applying heat conductive member)
As shown in FIGS. 5A and 5B, the heat transfer member 9 is applied to the heat transfer member 9 having a rod shape or a semi-cylindrical shape in parallel to each side of the heat transfer region 18 at equal intervals.

  For example, when the organic light emitting layer 3 has a square shape in plan view and a length of 6 mm × 6 mm, the bar has a width of about 0.2 to 0.4 mm and a height of 0.03 to 0.00 mm. It is about 4 mm. In the semi-cylindrical shape, the diameter is about 0.2 to 0.4 mm.

  The viscosity at the time of application is 10 to 100 Pa · s at 25 ° C. The application pressure is 0.1 to 0.5 MPa, and the application time is 1 to 3 seconds. The pressing pressure of the sealing plate 8 at the time of bonding is 10 to 30 kPa, and the bonding time is 600 to 800 seconds. The reduced pressure at the time of bonding is −50 to −30 kPa with respect to atmospheric pressure.

  Thus, as shown in FIG. 5 (c), each of the surfaces of the organic light emitting layer 3 on the substrate 1 facing the heat transfer region 18 of the sealing plate 8 is bonded to the surface of the organic light emitting layer 3 with the cathode layer 4 interposed therebetween. The heat conductive members 9 expand and spread by pressure bonding, and the heat conductive members 9 can be bonded to each other.

  In the application of the heat conductive member 9, when the heat conductive member 9 is applied in a lump over the entire application surface or irregularly applied, when the substrate 1 and the sealing plate 8 are bonded together, The gas is trapped and an air reservoir remains, causing a decrease in heat transfer.

  Therefore, by applying by the above-described application method, the substrate 1 and the sealing plate 8 can be bonded together while being well discharged without confining the gas existing between the heat conductive members 9, so that the occurrence of air accumulation is prevented. Can be prevented.

(Sealing material application method)
The sealing material 11 is applied to the outer periphery of the groove 12 in a rod-like or semi-cylindrical shape. For example, in the rod shape, the width is about 0.2 to 1.0 mm, and the height is about 0.03 to 0.8 mm. In the semi-cylindrical shape, the diameter is about 0.2 to 0.4 mm.

  In the application of the sealing material 11, the air pool is generated when the gas is confined in the heat transfer member 9, while the sealing material 11 is broken or deformed by the gas pressure due to the compression of the internal gas at the time of bonding. Air pass occurs.

  Since the air path causes a sealing failure, it is desirable to bond them under a low pressure of 1 to 20 kPa in order to prevent this.

  According to the organic light emitting device and the method for manufacturing the same according to the first embodiment of the present invention, the heat conductive member 9 is disposed between the organic light emitting layer 3 and the sealing plate 8, and thus generated in the organic light emitting device 20. Heat can be dissipated well.

  Thereby, the temperature rise by the Joule heat of the organic light emitting element 20 can be prevented, and the deterioration of the performance and lifetime of the organic light emitting element 20 can be suppressed.

  Moreover, since it becomes possible to cool directly from the surface of the sealing plate 8, the heat dissipation effect can be further enhanced.

  According to the organic light emitting device and the method for manufacturing the same according to the first embodiment of the present invention, the heat conductive member 9 is applied on the sealing plate 8 in stripes at equal intervals. Can be reduced. Thereby, the favorable heat dissipation performance of the organic light emitting element 20 is securable.

  In addition, since the heat conductive member 9 is applied at equal intervals, the impact force applied to the organic light emitting element 20 can be dispersed after bonding.

[Second Embodiment]
As shown in FIG. 6, the organic light emitting device according to the second embodiment of the present invention includes a substrate 1, an organic light emitting layer 3 formed on the main surface of the substrate 1, and an outer periphery of the main surface of the substrate 1. A sealing plate 8 that is bonded to the substrate 1 to seal the organic light emitting layer 3 and a heat conductive member 9 disposed between the substrate 1 and the sealing plate 8. A metal layer 13 disposed between the plates 8 is further provided. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  Examples of the material of the metal layer 13 include aluminum, chromium, nickel, and alloys thereof.

  The manufacturing method of the organic light emitting device according to the second embodiment is different from the manufacturing method in the first embodiment in the method of forming the metal layer 13, and the other is the same as in the first embodiment. Because of this, duplicate explanation is omitted.

  In the method for manufacturing an organic light emitting device according to the second embodiment, the organic light emitting device 20A can be manufactured by forming the metal layer 13 on the surface of the heat conductive member 9 by sputtering or the like.

  According to the organic light emitting device and the manufacturing method thereof according to the second embodiment of the present invention, the heat generated in the organic light emitting device 20A by disposing the metal layer 13 between the sealing plate 8 and the heat conductive member 9. Can be efficiently transmitted from the heat conductive member 9 to the sealing plate 8 and can be radiated well.

[Third embodiment]
As shown in FIG. 1, the organic light emitting device according to the third embodiment of the present invention includes a substrate 1, an organic light emitting layer 3 formed on the main surface of the substrate 1, and an outer periphery of the main surface of the substrate 1. And a sealing plate 8 that seals the organic light emitting layer 3 by bonding to the substrate 1 at a portion, and a heat conductive member 9 disposed between the substrate 1 and the sealing plate 8. It consists of a permeable member. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  According to the third embodiment, the organic light emitting element 20 has a so-called top emission structure in which light emitted from the organic light emitting layer 3 is extracted from the sealing plate 8 side.

  In the organic light emitting device according to the third embodiment, since the light is emitted from the sealing plate 8 side, a transparent substrate such as a glass substrate that transmits light is used as the sealing plate 8. .

  Similarly, a transparent electrode made of ITO (indium-tin oxide) having a thickness of about 150 to about 160 nm that can transmit light is used for the cathode layer 4.

  The anode layer 2 is made of a metal film such as aluminum.

  Examples of the material of the heat conductive member 9 include a thermosetting or room temperature curing epoxy resin, a casting urethane resin, and the like that can transmit light.

  Since the manufacturing method of the organic light emitting element according to the third embodiment is the same as the manufacturing method according to the first embodiment except that the material used for the substrate 1 and the like is different, the description thereof is omitted.

  According to the organic light emitting device and the manufacturing method thereof according to the third embodiment of the present invention, the heat generated in the organic light emitting device 20 can be radiated well.

[Fourth embodiment]
As shown in FIG. 1, the organic light emitting device according to the fourth embodiment of the present invention includes a substrate 1, an organic light emitting layer 3 formed on the main surface of the substrate 1, and an outer periphery of the main surface of the substrate 1. A sealing plate 8 that seals the organic light emitting layer 3 by bonding to the substrate 1 at a portion, and a heat conductive member 9 disposed between the substrate 1 and the sealing plate 8. Since it has the structure similar to the structure of the organic light emitting element in the form, the description is omitted.

  The manufacturing method of the organic light emitting device according to the fourth embodiment is different from the manufacturing method according to the first embodiment in the method of applying the heat conductive member 9, and the others are the same as in the first embodiment. Therefore, redundant description is omitted.

  In the manufacturing method of the organic light emitting element according to the fourth embodiment, FIG. 7 is a plan view of the sealing plate 8 in a state before being bonded to the substrate 1. In the fourth embodiment, as shown in FIG. 7, the heat conductive member 9 is formed by coating with an application pattern in an array arrangement.

  The shape of each heat transfer member 9 is not particularly limited, and can take various shapes such as a substantially hemispherical shape, a substantially cylindrical shape, and a substantially prismatic shape, but is preferably substantially hemispherical. The diameter of the hemisphere is about 0.2 to 0.4 mm, and the shortest distance between adjacent hemispheres is about 0.2 to 0.6 mm.

  Thereby, when the board | substrate 1 and the sealing board 8 are bonded together, since it can discharge | emit favorably without confining the gas which exists between the heat conductive members 9, heat conductive members 9 comrades do not produce an air reservoir. Can be glued.

 According to the organic light emitting device and the method for manufacturing the same according to the fourth embodiment of the present invention, good heat dissipation performance of the organic light emitting device 20 can be ensured.

[Fifth embodiment]
As shown in FIG. 1, an organic light emitting device according to a fifth embodiment of the present invention includes a substrate 1, an organic light emitting layer 3 formed on the main surface of the substrate 1, and an outer periphery of the main surface of the substrate 1. A sealing plate 8 that seals the organic light emitting layer 3 by bonding to the substrate 1 at a portion, and a heat conductive member 9 disposed between the substrate 1 and the sealing plate 8. Since it has the structure similar to the structure of the organic light emitting element in the form, the description is omitted.

 The manufacturing method of the organic light emitting device according to the fifth embodiment is the same as the first embodiment except that the method of applying the heat conductive member 9 is different from the manufacturing method in the first embodiment. Because of this, duplicate explanation is omitted.

  In the method for manufacturing an organic light emitting device according to the fifth embodiment, FIG. 8 is a plan view of the sealing plate 8 before being bonded to the substrate 1. In the fifth embodiment, as shown in FIG. 8, the heat conductive member 9 is formed by coating with a coating pattern having a plover-like arrangement.

  The shape of each heat transfer member 9 is not particularly limited, and can take various shapes such as a substantially hemispherical shape, a substantially cylindrical shape, and a substantially prismatic shape, but is preferably substantially hemispherical. The diameter of the hemisphere is about 0.2 to 0.4 mm, and the pitch between hemispheres (the distance between the center points of adjacent hemispheres) is usually 0.8 to 1.2 mm.

  Thereby, when the board | substrate 1 and the sealing board 8 are bonded together, since it can discharge | emit favorably without confining the gas which exists between the heat conductive members 9, heat conductive members 9 comrades do not produce an air reservoir. Can be glued.

  According to the organic light emitting device and the method for manufacturing the same according to the fifth embodiment of the present invention, good heat dissipation performance of the organic light emitting device 20 can be ensured.

[Sixth embodiment]
As shown in FIG. 9, the organic light emitting device according to the sixth embodiment of the present invention includes a substrate 1, an organic light emitting layer 3 formed on the main surface of the substrate 1, and an outer periphery of the main surface of the substrate 1. A sealing plate 8 for sealing the organic light emitting layer 3 by bonding to the substrate 1 at the portion, and a heat conductive member 9 disposed between the substrate 1 and the sealing plate 8, and sealing with the sealing plate 8 A plurality of organic light emitting layers 3 are arranged on the substrate 1. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  In the method for manufacturing an organic light emitting device according to the sixth embodiment of the present invention, the method for forming the plurality of organic light emitting layers 3 on the substrate 1 and the method for forming the heat conductive member 9 are the same as those in the first embodiment. Since this is different from the manufacturing method and the others are the same as those in the first embodiment, a duplicate description is omitted.

  In the method for manufacturing an organic light emitting device according to the sixth embodiment of the present invention, the organic light emitting layer 3 is patterned and etched, and then an insulating layer 5 is formed between the organic light emitting layers 3 to thereby form the organic light emitting layer 3. Can be arranged on the substrate 1.

  In the method for manufacturing an organic light emitting device according to the sixth embodiment of the present invention, FIG. 10 is a plan view of the sealing plate 8 before being bonded to the substrate 1. As shown in FIG. 10, the heat conductive member 9 is formed by being applied in a spot shape to each of the heat transfer regions 18 of the sealing plate 8 corresponding to the respective organic light emitting layers 3 when bonded.

  The shape of each heat transfer member 9 is not particularly limited, and can take various shapes such as a substantially hemispherical shape, a substantially cylindrical shape, and a substantially prismatic shape, but is preferably substantially hemispherical. For example, when the organic light emitting layer 3 has a square shape in plan view, a length of 5 mm × 5 mm, and a pitch between adjacent organic light emitting layers 3 of 6 mm, the diameter of the hemisphere is about 2 to 3 mm. The shortest distance between the two hemispheres is about 2 mm or less.

  The sealing material 11 is applied to the outer peripheral portion of the groove 12 so that the heat conductive member 9 can be bonded to the substrate 1 and sealed when bonded. The shape at the time of application | coating should have a rod shape or a semi-columnar shape. For example, in the rod shape, the width is about 0.2 to 1.0 mm, and the height is about 0.03 to 0.8 mm. In the semi-cylindrical shape, the diameter is about 0.2 to 0.4 mm.

  Thereby, when the board | substrate 1 and the sealing board 8 are bonded together, each spot-like heat conductive member 9 can be covered without producing an air pool on each organic light emitting layer 3. FIG.

  Further, since the heat transfer members 9 can be bonded to each other while leaving an air pool in the non-heat generation region between the organic light emitting layers 3, the gas pressure due to the compression is relieved at the time of pasting, and the sealing material 11 Air path generation can be suppressed.

  According to the organic light emitting device and the manufacturing method thereof according to the sixth embodiment of the present invention, it is possible to ensure good heat dissipation performance of the organic light emitting device 20B and to improve the reliability.

[Seventh embodiment]
As shown in FIG. 11, the organic light emitting device according to the seventh embodiment of the present invention includes a substrate 1, an organic light emitting layer 3 formed on the main surface of the substrate 1, and an outer periphery of the main surface of the substrate 1. A sealing plate 8 for sealing the organic light emitting layer 3 by bonding to the substrate 1 at the portion, and a heat conductive member 9 disposed between the substrate 1 and the sealing plate 8. An inert liquid such as an inert liquid or a silicone-based inert liquid. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  The heat conductive member 9 fills the entire internal space sealed by the substrate 1 and the sealing plate 8.

  The desiccant 10 may be used by dispersing and mixing powdered calcium oxide, barium oxide or the like in the heat transfer member 9.

  The manufacturing method of the organic light emitting element according to the seventh embodiment of the present invention is different from the method of forming the heat conductive member 9 in the first embodiment in that the method of forming the heat conductive member 9 is different. Since this is the same as that of the first embodiment, redundant description is omitted.

  In the method for manufacturing an organic light emitting element according to the seventh embodiment of the present invention, the organic light emitting element 20C is formed by forming the anode layer 2, the organic light emitting layer 3 and the cathode layer 4 on the substrate 1 and then applying the sealing material 11 thereto. It is formed on the substrate 1 side. Subsequently, the heat conductive member 9 is apply | coated to the board | substrate 1 side surface, and it can manufacture by bonding the sealing board 8 under pressure reduction.

  In addition, when pasting under reduced pressure, if the pressure is too low, the evaporation becomes significant. Therefore, it is preferable to set the pressure appropriately according to the inert liquid to be used.

  According to the organic light emitting device and the manufacturing method thereof according to the seventh embodiment of the present invention, the heat generated in the organic light emitting device 20C can be radiated well.

[Other embodiments]
The present invention has been described in detail with the first to seventh embodiments described above. However, for those skilled in the art, the present invention is limited to the first to seventh embodiments described in this specification. Obviously it is not. The present invention can be implemented as modifications and changes without departing from the spirit and scope of the present invention defined by the description of the scope of claims. Therefore, the description of the present specification is for illustrative purposes and does not have any limiting meaning to the present invention. Hereinafter, modified embodiments in which the above-described first to seventh embodiments are partially modified will be described.

  For example, it is possible to change dimensions such as the thickness of each layer and the constituent materials.

  In the organic light emitting device according to the first embodiment described above, the heat conductive member 9 is made of a resin such as a UV curable resin or an epoxy-based adhesive resin. May be added. Thereby, the thermal conductivity and reinforcement of a heat conductive member can further be improved.

  In the organic light emitting device according to the third embodiment described above, the configuration in which the anode layer 2 is disposed on the substrate 1 side of the organic light emitting layer 3 and the cathode layer 4 is disposed on the sealing plate 8 side has been described. It is good also as a structure which has arrange | positioned the cathode layer in the board | substrate side of the organic light emitting layer, and the anode layer in the sealing board side. In this case, a metal film such as aluminum can be used for the cathode layer, and ITO can be used for the anode layer. Even in this configuration, the same effects as those of the first embodiment described above can be obtained.

1 is a schematic cross-sectional structure diagram of an organic light-emitting element according to a first embodiment of the present invention. It is explanatory drawing of the manufacturing method of the organic light emitting element which concerns on the 1st Embodiment of this invention, Comprising: (a) The process of forming the anode layer 2 and the cathode terminal 7 on the board | substrate 1, and also forming the insulating layer 5 FIG. 4B is a process diagram for forming the organic light emitting layer 3, and FIG. It is explanatory drawing of the manufacturing method of the organic light emitting element which concerns on the 1st Embodiment of this invention, Comprising: (a) Process drawing which forms the groove | channel 12 in the sealing board 8, (b) Process which forms the desiccant 10 FIG. 4C is a process diagram for forming the heat conductive member 9 and the sealing material 11. The figure explaining 1 process of the manufacturing process in the manufacturing method of the organic light emitting element which concerns on the 1st Embodiment of this invention. It is explanatory drawing of the manufacturing method of the organic light emitting element which concerns on the 1st Embodiment of this invention, Comprising: (a) The top view of the sealing board 8 in the state before bonding with the board | substrate 1, (b) (a). Sectional drawing of the II line of (c) The top view of the board | substrate 1 of the state before bonding with the sealing board 8. FIG. The typical cross-section figure of the organic light emitting element which concerns on the 2nd Embodiment of this invention. The figure explaining 1 process of the manufacturing process in the manufacturing method of the organic light emitting element which concerns on the 4th Embodiment of this invention. The figure explaining 1 process of the manufacturing process in the manufacturing method of the organic light emitting element which concerns on the 5th Embodiment of this invention. The typical cross-section figure of the organic light emitting element which concerns on the 6th Embodiment of this invention. The figure explaining 1 process of the manufacturing process in the manufacturing method of the organic light emitting element which concerns on the 6th Embodiment of this invention. The typical cross-section figure of the organic light emitting element which concerns on the 7th Embodiment of this invention. The typical cross-section figure of the conventional organic light emitting element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Anode layer 3 ... Organic light emitting layer 4 ... Cathode layer 5 ... Insulating layer 8 ... Sealing plate 9 ... Heat transfer member 20 ... Organic light emission element

Claims (7)

A substrate,
An organic light emitting layer formed on the main surface of the substrate;
A sealing plate for sealing the organic light emitting layer by bonding to the substrate at the outer peripheral portion of the main surface;
An organic light-emitting device comprising: a heat conductive member disposed between the substrate and the sealing plate.   The organic light emitting device according to claim 1, wherein the heat transfer member is disposed at least above the organic light emitting layer.   3. The organic light emitting device according to claim 1, wherein a groove is formed in a remaining region of the sealing plate in contact with the heat conductive member, and a desiccant is disposed at the bottom of the groove.   The organic light-emitting element according to claim 1, wherein the substrate is a substrate capable of transmitting light.   The organic light-emitting device according to claim 1, further comprising a metal layer disposed between the heat conductive member and the sealing plate.   The organic light-emitting element according to claim 1, wherein the sealing plate is made of a member that can transmit light. Forming an organic light emitting layer on the substrate;
A step of applying a heat conductive member on a sealing plate, a plurality of rows in a stripe form at equal intervals, or a plurality of dots in a dot shape at equal intervals;
A method of manufacturing an organic light emitting element, comprising: bonding the sealing plate to the substrate through the heat conductive member and bonding the heat conductive members to each other.

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