JP2009132095A - Liquid discharge head and liquid discharge device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid discharge head having high reliability even when high-speed recording is carried out by a liquid discharge head having a long length and a high density. <P>SOLUTION: A recording head has a supporting plate H1200. A recording element substrate is disposed on the supporting plate. A supporting plate side ink supply opening H1201 is formed in the supporting plate so as to penetrate from the surface to the rear surface and communicate with a recording element substrate side ink supply opening. A channel formation member H1208 for a cooling medium is disposed so as to abut the supporting plate H1200. A channel H1210 for the cooling medium through which the cooling medium for cooling the recording head is formed in the channel formation member. The channel H1210 for the cooling medium is formed so as to include the space formed by the supporting plate H1200 and the channel formation member H1208 for the cooling medium. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a liquid discharge head capable of discharging a liquid onto a recording medium and a liquid discharge apparatus using such a liquid discharge head.

  2. Description of the Related Art Conventionally, an ink jet recording apparatus as a liquid ejecting apparatus is widely used and commercialized for computer-related output devices because the running cost of color images is low and the apparatus can be miniaturized.

  In recent years, in order to realize high-definition image recording at higher speed, it is also desired to realize a recording head having a longer recording width (discharge port array length). Specifically, a recording head as a liquid discharge head having a length of 4 inches to 13 inches has been required.

  As the recording head becomes longer and faster in this way, the input energy to the recording head increases, and the temperature rise of the recording head during recording increases. As a result, it is necessary to cope with recording reliability such as fluctuation in ejection amount for each page, instability due to ejection from a high temperature state, and continuous recording performance.

  Conventionally, the cooling of the recording head has been performed by methods such as air cooling from the outside of the recording head or mounting a cooling pipe on the recording head. Further, as disclosed in Patent Document 1, a recording head has been proposed in which an external water jacket is disposed on the back surface of a base plate, and cooling water is circulated therein.

JP-A-8-276575

  In the conventional method, since a heat pipe and a heat radiating member are externally attached to the completed recording head, there is a problem that the recording element substrate serving as a heat source and the heat pipe cannot be brought close to each other. In addition, since it is externally attached, the contact area between the heat pipe and the recording head is limited, and the heat exchange efficiency between the recording head and the heat pipe is not high. Even with the configuration of the conventional method, the effect of cooling and soaking may be sufficient depending on the recording execution conditions, but continuous recording is attempted with a longer and higher density recording head. In case. This is because the heat exchange efficiency that suppresses the unfavorable influence on the recording due to the uneven temperature distribution in the recording head due to long time recording or excessive temperature rise is not obtained. Further, in the recording head as disclosed in Patent Document 1, since the external water jacket is disposed on the back surface of the support plate, the distance from the recording element substrate that tends to be high temperature to the flow path of the cooling water is small. Relatively long. Therefore, the cooling efficiency for the recording element substrate may not be sufficient.

  SUMMARY OF THE INVENTION In view of the above-described problems of the prior art, the present invention provides a liquid discharge head and a liquid discharge apparatus that are highly reliable even when high-speed recording is performed with a long and high-density liquid discharge head. With the goal.

  According to the liquid ejection head of the present invention, a recording element substrate having an ejection port for ejecting liquid and a recording element for generating ejection energy for ejecting liquid from the ejection port, and the recording element substrate are disposed. A cooling medium flow path for forming a cooling medium flow path for circulating a cooling medium for cooling the liquid discharge head so as to contact the periphery of the support plate in a liquid discharge head having a support plate A forming member is disposed, and the cooling medium flow path includes a space formed by the support plate and the cooling medium flow path forming member.

  According to the liquid ejection apparatus of the present invention, the ejection port for ejecting the liquid, the recording element for generating ejection energy for ejecting the liquid from the ejection port, and the recording element for supplying the liquid to the ejection port A recording element substrate having a substrate side liquid supply port, and the recording element substrate is disposed, and a support plate side liquid supply port is formed so as to penetrate from the front surface to the back surface and communicate with the recording element substrate side liquid supply port In a recording apparatus having a liquid discharge head having a support plate formed, a cooling medium flow path for circulating a cooling medium for cooling the liquid discharge head is formed so as to contact the periphery of the support plate. A cooling medium flow path forming member is disposed, and energy is added to the cooling medium so that the cooling medium flows so that the cooling medium flows through the cooling medium flow path. And having ghee adding means.

  According to the present invention, the cooling medium flow path is formed so as to include a space formed by the support plate and the cooling medium flow path forming member disposed outside the support plate. A cooling medium can be circulated to a close position. Therefore, it is possible to efficiently cool the recording element substrate that easily rises in temperature.

  Embodiments of the present invention will be described with reference to the drawings.

  1 to 5 are explanatory diagrams for explaining a recording head as a liquid ejection head and an ink jet recording apparatus as a liquid ejection apparatus in which the present invention is implemented. As shown in FIGS. 1 to 5, the recording head used here has a plurality of recording element substrates each having an ejection port array composed of a plurality of ejection ports for ejecting ink. Are arranged along the column direction.

  Hereinafter, the entire recording head according to the present invention will be described with reference to these drawings while describing the configuration of each part. The recording head H1000 shown in FIG. 1 performs recording using an electrothermal transducer that generates thermal energy for causing film boiling to the ink in accordance with an electrical signal. As shown in the exploded perspective view of FIG. 2, the recording head H1000 includes a recording element unit H1001 and an ink supply member H1500 of an ink supply unit H1002. Further, as shown in the exploded perspective view of FIG. 3, the recording element unit H1001 includes a recording element substrate H1100, a support plate H1200, an electric wiring substrate H1300, a plate H1400, and a filter member H1600.

  4A is a perspective view for explaining the configuration of the recording element substrate H1100, and FIG. 4B is a cross-sectional view taken along the line AA shown in FIG. 4A. The recording element substrate H1100 includes an ejection port H1105 that ejects ink as a liquid, and an electrothermal conversion element H1102 as a recording element that generates ejection energy to eject ink from the ejection port H1105. The recording element substrate H1100 also has a recording element substrate side ink supply port H1101 as a recording element substrate side liquid supply port that supplies ink to the ejection port H1105. The recording element substrate H1100 is formed of a thin film such as a Si substrate H1108 having a thickness of 0.5 to 1 mm, for example. In addition, a recording element substrate side ink supply port H1101 including a long groove-like through-hole is formed as an ink flow path, and the electrothermal conversion elements H1102 are opposed to both sides of the recording element substrate side ink supply port H1101. One row is arranged in a staggered pattern. The electrothermal transducer H1102 and electric wiring such as Al are formed by a film forming technique. An electrode H1103 is provided to supply power to the electrical wiring. The recording element substrate side ink supply port H1101 is formed by performing anisotropic etching using the crystal orientation of the Si substrate H1108. Further, a flow path forming member H1110 is provided on the Si substrate H1108, and an ink flow path H1104, a discharge port H1105, and a foaming chamber H1107 corresponding to the electrothermal conversion element H1102 are formed by photolithography. The ejection port H1105 is provided so as to face the electrothermal conversion element H1102, and the ink supplied from the recording element substrate side ink supply port H1101 generates bubbles by the electrothermal conversion element H1102 to eject the ink. Is.

The support plate H1200 is, for example, a plate shape having a thickness of 0.5 to 10 mm and is formed of an alumina (Al ₂ O ₃ ) material. The material of the support plate is not limited to alumina, and has a linear expansion coefficient equivalent to the linear expansion coefficient of the material of the recording element substrate H1100 and is equivalent to the thermal conductivity of the material of the recording element substrate H1100 or It may be made of a material having an equivalent or higher thermal conductivity. Examples of the material of the support plate H1200 include, in addition to alumina, silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), tungsten (W ) May be used. As shown in FIG. 3, a recording element substrate H1100 is disposed on the support plate H1200. In the present embodiment, a plurality of recording element substrates H1100 are arranged on the support plate H1200. The support plate H1200 is formed with a support plate side ink supply port H1201 as a support plate side liquid supply port so as to penetrate from the front surface to the back surface and communicate with the recording element substrate side ink supply port H1101. Further, the recording element substrate H1100 is bonded and fixed to the support plate H1200 with high positional accuracy. Further, the support plate H1200 has an X-direction reference H1204, a Y-direction reference H1205, and a Z-direction reference H1206 that serve as positioning references. Here, the surface of the support plate H1200 refers to the surface of the support plate H1200 facing the recording medium, and the back surface refers to the opposite surface.

  As shown in FIG. 1, the recording element substrates H1100 are arranged in a staggered manner on the support plate H1200 to enable wide recording with the same color. For example, four recording element substrates H1100a, H1100b, H1100c, and H1100d, each having a discharge port group having a length of at least 1 inch, are arranged in a staggered manner to enable recording with a width of 4 inches.

  Further, at the end portion of the ejection port group of each recording element substrate, the ejection port groups of the recording element substrates adjacent in a staggered pattern have overlapping regions (L) in the recording direction, and each recording element substrate Prevents a gap from being generated between recording areas. For example, overlapping regions H1109a and H1109b are provided in the discharge port group H1106a and the discharge port group H1106b.

  The electrical wiring substrate H1300 applies an electrical signal for ejecting ink to the recording element substrate H1100, and has an opening for incorporating the recording element substrate H1100. A plate H1400 is bonded and fixed to the back surface of the electrical wiring board H1300 as shown in FIG. The electric wiring board H1300 has an electrode terminal H1302 corresponding to the electrode H1103 of the recording element board H1100, and an external signal input terminal H1301 for receiving an electric signal from the recording apparatus main body located at the end of the wiring. Yes. The electrical wiring board H1300 and the recording element board H1100 are electrically connected. As the connection method, for example, the electrode H1103 of the recording element substrate H1100 and the electrode terminal H1302 of the electric wiring substrate H1300 are electrically connected by a wire bonding technique using a gold wire (not shown). As a material of the electrical wiring board H1300, for example, a flexible wiring board having a two-layer structure is used, and a surface layer is covered with a polyimide film.

  The plate H1400 is formed of, for example, a SUS plate having a thickness of 0.5 to 1 mm. The material of the plate is not limited to SUS, and may be made of a material having ink resistance and good flatness. The plate H1400 has a recording element substrate H1100 that is adhesively fixed to the support plate H1200 and an opening for taking in the recording element substrate, and is adhesively fixed to the support plate.

  A groove formed between the opening H1402 of the plate and the side surface of the recording element substrate H1100 is filled with a first sealing agent (not shown) to seal the electrical mounting portion of the electrical wiring substrate H1300. Yes. Further, the electrode H1103 of the recording element substrate H1100 is sealed with a second sealant (not shown), and the electrical connection portion is protected from ink corrosion and external impact. Further, a filter member H1600 for removing foreign matter mixed in the ink is formed by being bonded and fixed to the support plate at the support plate side ink supply port H1201 of the support plate H1200.

  The ink supply member H1500 in FIG. 2 is formed by resin molding, for example, and includes a common liquid chamber H1501 and a Z-direction reference surface H1502. The Z reference plane H1502 positions and fixes the recording element unit and serves as the Z reference for the recording head H1000.

  As shown in FIG. 2, the recording head H1000 is formed by coupling a recording element unit H1001 to an ink supply member H1500.

  The coupling is performed as follows.

  The opening of the ink supply member H1500 and the recording element unit H1001 are sealed with a third sealant (not shown), and the common liquid chamber H1501 is sealed. Then, the Z reference H1502 of the recording element unit H1001 is positioned and fixed to the Z reference H1502 of the ink supply member by, for example, a screw H1900. The third sealant is preferably a sealant that has ink resistance, is cured at room temperature, and is flexible enough to withstand the difference in linear expansion between different materials. Further, the external signal input terminal H1301 portion of the recording element unit H1001 is positioned and fixed on, for example, the back surface of the ink supply member H1500.

  As shown in FIG. 5, an inkjet recording apparatus M4000 according to an embodiment of the present invention includes, for example, a recording head for six colors corresponding to photographic image quality recording. Here, H1800Bk is black ink, H1800C is cyan ink, H1800M is magenta ink, H1800Y is yellow ink, H1800LC is light cyan ink, and H1800LM is an ink tank of light magenta ink. Among these recording heads, the recording head H1000Bk is a recording head for black ink, the recording head H1000C is for cyan ink, the recording head H1000M is for magenta ink, and the recording head H1000Y is for yellow ink. Further, the recording head H1000LC is for light cyan ink, and the recording head H1000LM is for light magenta ink. Reference numeral H1802 denotes an ink supply tube for supplying ink from each ink tank to the corresponding recording head. These recording heads H1000 are fixedly supported by positioning means and electrical contacts M4002 of the head mounting portion M4001 mounted on the recording apparatus main body M4000.

  These recording heads are controlled by a drive circuit (not shown) to perform recording on the recording medium K1000. In the recording apparatus of FIG. 5, the recording head is a full line type having ejection openings corresponding to the width of the recording medium, the recording head is fixed, and recording is performed by scanning the recording medium in the direction of the arrow. .

  Next, the structure of the characteristic part of the present invention will be described in detail.

(First embodiment)
FIG. 6 is a diagram schematically showing a plan view and a cross-sectional view of the support plate H1200 and the cooling medium flow path forming member H1208 used in the recording head H1000 in the first embodiment of the present invention. FIG. 7 is a view schematically showing a cross section of a support plate used in a recording head of a comparative example with respect to the recording head of the first embodiment. FIG. 8 is a diagram schematically showing a cross section of a support plate used in a recording head of a modification of the recording head of the first embodiment.

  As shown in FIG. 6A, a cooling medium flow for forming a cooling medium flow path H1210 for circulating a cooling medium for cooling the recording head H1000 so as to contact the periphery of the support plate H1200. A path forming member H1208 is disposed. In this embodiment, as shown in FIG. 6B, the cooling medium flow path forming member H1208 is disposed so as to abut on the periphery of the support plate H1200 so as to surround the three outer sides of the support plate H1200. . The cooling medium flow path H1210 is formed to include a space formed by the support plate H1200 and the cooling medium flow path forming member H1208. A support plate side groove H1207 is formed on the side surface of the support plate H1200, and a cooling medium flow path forming member side groove H1209 is formed on the side surface of the cooling medium flow path forming member H1208. Then, when the cooling medium flow path forming member H1208 is disposed outside the support plate H1200, the grooves are formed so that the support plate side groove H1207 and the cooling medium flow path forming member side groove H1209 face each other. ing. The support plate side groove H1207 and the cooling medium flow path forming member side groove H1209 are combined to form a cooling medium flow path H1210. In the present embodiment, the cooling medium flow path forming member H1208 is disposed outside the support plate H1200, and the support member H2000 is formed by being joined to each other.

  In this manner, the cooling medium flow path H1210 for flowing the cooling medium is formed at a position close to the recording element substrate H1100 by bonding and fixing the support plate H1200 and the cooling medium flow path forming member H1208. Then, when the cooling medium flows through the cooling medium flow path H1210, heat exchange is performed between the cooling medium flowing through the cooling medium flow path H1210 and the recording head H1000. At this time, since the temperature of the cooling medium is lower than the temperature of the recording head H1000, the cooling medium absorbs the heat of the recording head H1000, whereby the recording head H1000 is cooled. In the present embodiment, the cooling medium is a liquid different from the liquid such as the ink discharged from the discharge port H1105.

  According to the recording head H1000 of the present embodiment, the cooling medium flow path through which the cooling medium flows can be formed at a position relatively close to the recording element substrate H1100. Accordingly, heat exchange is performed between the cooling medium and the recording element substrate H1100 at a position relatively close to the recording element substrate H1100 that tends to be high in temperature, so that the recording element substrate H1100 is efficiently cooled by the cooling medium. Can do. Since the recording element substrate H1100 can be efficiently cooled, it is possible to suppress the recording head H1000 from becoming excessively high in temperature, thereby suppressing the reliability of the recording head H1000 from being lowered. Further, since it is possible to suppress the recording element substrate H1100 from becoming excessively high in temperature, it is possible to prevent the ink flowing through the recording element substrate H1100 from becoming high in temperature so that the characteristics of the ink are altered. Further, it is possible to suppress the increase in the viscosity of the ink by the recording element substrate H1100, and it is possible to suppress the clogging of the ejection port and the occurrence of the non-ejection of the ink due to this.

  Further, it is possible to cool the support plate side ink supply port H1201 on the support plate H1200, the ink flowing in the ink flow path H1104 on the recording element substrate H1100, and the support plate H1200 and the recording element substrate H1100 itself. In this embodiment, since the cooling medium flow path H1210 is formed at a position close to the support plate side ink supply port H1201, the wall surface defining the support plate side ink supply port H1201 and the ink flowing therethrough are cooled. can do. Therefore, it is possible to efficiently suppress the temperature rise of the ink flowing through the support plate H1200, and it is possible to suppress the deterioration of the ink characteristics due to the excessive increase in the ink temperature.

  Further, when forming the cooling medium flow path H1210, the support plate side groove H1207 is formed on the side surface of the support plate H1200, and the cooling medium flow path forming member side groove H1209 is formed on the side surface of the cooling medium flow path forming member H1208. By forming, the cooling medium flow path H1210 is formed. Therefore, since the cooling medium flow path H1210 is formed by forming a groove in a portion that can be easily processed, the recording head H1000 is efficiently manufactured.

  Here, as a method of forming the cooling medium flow path H1210 inside the support plate H1200, it is conceivable to divide the support plate H1200 in the thickness direction as shown in FIG. In that case, a groove is formed on the surface of each plate material constituting the support plate H1200 to form the cooling medium flow path H1210. However, when the support plate H1200 divided in the thickness direction is bonded and fixed, the thickness of each plate material constituting the divided H1200 decreases, and the rigidity of the support plate H1200 may be weakened. Further, when the support plate H1200 divided in the thickness direction is bonded and fixed, a step may be formed on the wall surface defining the support plate-side ink supply port H1201. Due to this level difference, when the ink flows through the support plate side ink supply port H1201, the flow of the ink is disturbed, and further, bubbles are generated or a bubble reservoir is formed. This may affect the supply of ink to the recording element substrate H1100. Further, when the support plate H1200 divided in the thickness direction is assembled by being bonded and fixed, there is a possibility that the thickness of the support plate H1200 varies due to the presence of an adhesive used for bonding and fixing. As a result, the distance between the recording element substrate H1100 and the recording medium is not constant, and the recording element substrate H1100 disposed on the support plate H1200 may be inclined. Therefore, the ink landing accuracy from the ejection port is lowered, and there is a possibility that the image formation becomes unstable.

  On the other hand, in this embodiment, the cooling medium flow path forming member H1208 is bonded and fixed so as to come into contact with the periphery of the support plate H1200, whereby the support member H2000 is arranged in the direction in which the discharge ports are arranged and the direction perpendicular thereto. It is divided into. By dividing the support member H2000 in these directions, the thickness of the support plate H1200 does not decrease, and the rigidity of the support plate H1200 is ensured. Further, the thickness of the support plate H1200 does not vary, and the accuracy of the recording element substrate H1100, such as the height and inclination, is increased. Therefore, since the distance from the ejection port of the recording element substrate H1100 disposed on the support plate H1200 to the recording medium is kept constant, the ink landing accuracy is improved. Therefore, the quality of the image obtained by recording is enhanced. In addition, since the occurrence of a step or the like at the support plate side ink supply port H1201 is suppressed, the ink is smoothly supplied to the recording element substrate H1100. Therefore, the image obtained by recording is further stabilized.

  In addition, as a material of the support plate H1200 and the cooling medium flow path forming member H1208, these may be formed of the same material or different materials. When the support plate H1200 and the cooling medium flow path forming member H1208 are formed of different materials, the material of the cooling medium flow path forming member H1208 is made better than the thermal conductivity of the material of the support plate H1200. It is preferable. By doing so, heat can be radiated well from the support plate H1200 to the outside through the cooling medium flow path forming member H1208, and a structure in which heat can be easily released to the outside can be obtained.

  As shown in FIG. 6B, the cooling medium flow path H1210 is formed so as to surround the outer three sides of the support plate H1200. The cross section of the cooling medium flow path H1210 has a rectangular shape with a width of 2 mm and a depth of 1.5 mm in this embodiment. However, the cross section of the cooling medium flow path H1210 may be other than a rectangular shape, or may be a circle or the like. The flow rate of the cooling medium was about 20 ml / min to 100 ml / min. Needless to say, the flow rate may satisfy the conditions depending on the recording conditions and the head specifications.

  Further, as shown in FIG. 8, a sealing member H1212 for sealing the contact surface is provided outside the cooling medium flow channel H1210 in the contact surface between the support plate H1200 and the cooling medium flow channel forming member H1208. It may be arranged. In the present embodiment, a seal member groove H1211 is formed in the vicinity of the support plate side groove H1207 and in the vicinity of the cooling medium flow path forming member side groove H1209 outside the grooves, and the seal member H1212 is placed therein. It is going to be included. By doing so, liquid leakage from the cooling medium cooling medium flow path H1210 to the outside of the recording head H1000 is prevented. In this case, the seal member groove H1211 for inserting the seal member H1212 may be formed only on the support plate H1200 or only on the cooling medium flow path forming member H1208.

  FIG. 9 is a schematic explanatory diagram illustrating a configuration of a cooling system of a recording apparatus including the recording head according to the present embodiment. A pump C1002 is provided as energy adding means for adding energy for flowing the cooling medium to the cooling medium so that the cooling medium flows through the cooling medium flow path H1210.

  A print head cooling apparatus C1000 that is a print head cooling system according to the present embodiment includes a thermostatic chamber C1001. The cooling medium stored in the thermostat C1001 is kept at a constant temperature there. Then, the cooling medium is sent to the cooling medium inlet H1505 provided in the ink supply member H1500 of the recording head H1000 by the pump C1002 and enters the inside of the recording head H1000. Then, the cooling medium is sent into the cooling medium flow path H1210 connected to the cooling medium inlet H1505. The cooling medium that has passed through the cooling medium flow path H1210 is discharged from the recording head H1000 at a cooling medium outlet H1506 provided in the ink supply member H1500, and returns to the thermostatic chamber C1001 again. The flow rate of the cooling medium is measured by a flow meter C1003, and the cooling medium inlet temperature, the cooling medium outlet temperature, and the head temperature are measured by respective sensors. Based on data such as the recording conditions and environmental temperature obtained in this way, it is possible to control the flow rate adjustment, the temperature adjustment of the thermostatic chamber C1001, and the like.

  FIG. 10 shows a graph comparing the temperature rises of the recording head H1000 in the first embodiment of the present invention and the recording head having a conventional structure when cooling is not performed by the cooling medium.

  In the case of using a conventional recording head that is not cooled by a cooling medium, the recording head reaches a high temperature after recording about 50 sheets, and the temperature of the recording head continues to rise, eventually causing undischarge. did. On the other hand, in the recording head of this embodiment, the temperature of the recording head becomes constant when about 50 sheets are recorded, and the temperature of the recording head does not increase even if recording is continued thereafter. Since the temperature rise varies depending on the shape of the cooling groove, the flow rate of the cooling water, and the temperature, it is desirable that the liquid amount of the cooling medium is set to an optimum condition in consideration of the specifications of the recording head to be used and the temperature condition.

  In the present embodiment, a cooling medium that is a liquid different from the liquid such as ink discharged from the discharge port H1105 circulates in the cooling medium flow path H1210, thereby cooling the recording head H1000. It is said. However, the present invention is not limited to this, and liquid such as ink to be ejected from the ejection port H1105 may be formed to be able to circulate inside the cooling medium flow path H1210. Then, the ink may flow through the cooling medium flow path H1210, and the print head H1000 may be cooled by exchanging heat with the print head H1000.

(Second embodiment)
Next, the configuration of the recording plate support plate and the cooling medium flow path forming member according to the second embodiment of the present invention will be described with reference to FIG. The same parts as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  In the recording head H1000 according to the first embodiment, the support plate H1200 and the cooling medium flow path forming member H1208 are bonded and fixed to each other. A support plate side groove H1207 is formed on the side surface of the support plate H1200. Further, a cooling medium flow path forming member side groove H1209 is formed at a position corresponding to the support plate side groove H1207 on the side surface of the cooling medium flow path forming member H1208. The cooling medium flow path forming member H1208 and the cooling medium flow path forming member side groove H1209 are combined to form the cooling medium flow path H1210.

  On the other hand, in this embodiment, as shown in FIG. 11, the support plate H1213 is formed in a shape having a step H2110 on the outer edge and a protrusion 2120 protruding from the step 2110. . The step portion 2110 and the protrusion portion 2120 are formed on the surface of the support plate H1213 opposite to the side where the recording element substrate H1100 is bonded, and are convex in the direction opposite to the bonding surface with the recording element substrate H1100. It is formed into a shape. Then, a cooling medium flow path forming member H1215 is arranged on a step portion 2110 formed on the outer edge of the support plate H1213 so as to sandwich the protrusion 2120 of the support plate H1213. Thus, the contact surface between the support plate 1213 and the cooling medium flow path forming member H1215 is formed in an L shape. In this embodiment, a support plate side groove 1214 is formed in the support plate H1213, and a cooling medium flow path forming member side groove H1216 is formed in the cooling medium flow path forming member H1215. Then, when the cooling medium flow path forming member H1215 is disposed so that the protrusion H2120 is sandwiched between the step 2110 of the support plate H1213, the support plate side groove H1214 and the cooling medium flow path forming member side groove H1216 face each other. Thus, each groove is formed. The support plate side groove H1214 and the cooling medium flow path forming member side groove H1216 are combined to form a cooling medium flow path H1210. Thus, by forming the support plate H1213 and the cooling medium flow path forming member H1215, the cooling medium flow path forming member H1215 does not exist on the side of the support plate H1213 joined to the recording element substrate H1100. . As a result, the divided portion does not appear on the bonding surface side of the support plate H1213 with the recording element substrate H1100, and there is no step between the support plate H1213 and the recording element substrate H1100. be able to.

(Third embodiment)
Next, the configuration of the third embodiment of the recording apparatus according to the present invention will be described with reference to FIGS. FIG. 12 is a cross-sectional view of the recording head support plate and the cooling medium flow path forming member according to the present embodiment. FIG. 13 is a cross-sectional view of a support plate and a cooling medium flow path forming member in a modification of the recording head according to the present embodiment.

  Portions that are the same as those described in the above embodiments are given the same reference numerals and description thereof is omitted.

  In the recording head H1000 according to the second embodiment, the support plate H1213 is formed to have a step portion 2110 on the outer edge and a protrusion 2120 protruding from the step portion 2110. Then, a cooling medium flow path forming member H1215 is arranged on a step portion 2110 formed on the outer edge of the support plate H1213 so as to sandwich the protrusion 2120 of the support plate H1213. A groove for forming the cooling medium flow path H1210 is formed in both the support plate H1213 and the cooling medium flow path forming member H1215. Then, when the cooling medium flow path forming member H1215 is disposed in the step 2110 of the support plate H1213, the grooves are formed so that the support plate side groove H1214 and the cooling medium flow path forming member side groove H1216 face each other. Has been.

  In contrast, in the present embodiment, no groove is formed in the support plate H1217, and a groove for forming the cooling medium flow path H1210 is formed only in the cooling medium flow path forming member H1218. Accordingly, it is not necessary to form the cooling medium flow path H1210 by combining the two grooves, and therefore high positional accuracy may not be required for both grooves. Also in the present embodiment, as shown in FIG. 13, a seal member groove 1211 may be formed in both the support plate H1217 and the cooling medium flow path forming member H1218. Alternatively, the seal member groove 1211 may be formed in one of the support plate H1217 and the cooling medium flow path forming member H1218. Then, the seal member 1212 may enter there. By doing so, it is possible to achieve a structure that prevents liquid leakage from the cooling medium flow path H1210, which is effective in improving the reliability of the recording head H1000.

(Fourth embodiment)
Next, the configuration of the recording head according to the fourth embodiment of the invention will be described with reference to FIGS. FIG. 14 is a perspective view of the support plate and the ink supply member of the recording head according to this embodiment. FIG. 15 is a cross-sectional view of the support plate and the ink supply member of the recording head according to this embodiment. In addition, portions that are the same as those in the first embodiment to the third embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the second embodiment and the third embodiment described above, the recording head H1000 is formed in such a shape that the support plate has the step portion 2110 on the outer edge and the protruding portion 2120 protruding from the step portion 2110. . And the cooling medium flow path forming member is arranged on the step portion 2110 formed on the outer edge of the support plate so as to sandwich the protrusion 2120 of the support plate.

  On the other hand, in the fourth embodiment, as shown in FIGS. 14 and 15, a liquid supply for supplying ink as a liquid is provided on the opposite side of the support plate H1219 from the side where the recording element substrate is disposed. An ink supply member H1507 as a member is attached. A cooling medium flow path H1210 is formed so as to include a space formed by the support plate H1219 and the ink supply member H1507.

  The support plate H1219 is formed in a shape having a step portion 2110 on the outer edge and a protrusion portion 2120 protruding from the step portion 2110, and the ink supply member H1507 is disposed so as to sandwich the protrusion portion 2120 from both sides. Has been. The ink supply member H1507 can temporarily store ink therein. In the ink supply member H1507, a cooling medium flow path H1210 is formed so as to include a space formed between the ink supply member H1507 and the support plate H1219. In this embodiment, a groove for forming the cooling medium flow path H1210 is formed only in the ink supply member H1507, and no groove is formed in the support plate H1219. The groove for forming the cooling medium flow path H1210 is not limited to the ink supply member H1507, but is formed on both side surfaces of the support plate H1219 and the ink supply member H1507. Also good. In the present embodiment, the ink supply member H1507 is provided with a groove for forming the cooling medium flow path H1210, so that the ink supply member H1507 is the cooling medium flow path in the first to third embodiments. It also has a function as a forming member.

  By forming the support plate H1219 and the ink supply member H1507 in this manner, the cooling medium flow path H1210 is formed when the support plate H1219 and the ink supply member H1507 are coupled, and the recording head H1000 can have a simple configuration. it can.

  In this embodiment, a groove for inserting the seal member 1212 may be formed in one or both of the support plate H1219 and the ink supply member H1507, and the seal member 1212 may be inserted. By doing so, it is possible to achieve a structure that prevents liquid leakage from the cooling medium flow path H1210, which is effective in improving the reliability of the recording head H1000.

(Fifth embodiment)
Next, the configuration of a recording head according to a fifth embodiment of the invention will be described with reference to FIG. FIG. 16 is a plan view of a recording plate support plate and a cooling medium flow path forming member according to the present embodiment.

  Portions that are the same as those in the first embodiment to the fourth embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the recording head according to the first embodiment to the fourth embodiment, one cooling medium flow path is formed so as to surround the support plate. On the other hand, in the present embodiment, as shown in FIG. 16, the cooling medium flow path forming members H1221a and H1221b are bonded to both sides of the support plate H1220 to flow the cooling medium flow path H1222 and the cooling medium flow. A path H1223 is formed. In the present embodiment, the cooling medium flow path H1222 and the cooling medium flow path H1223 are formed to be independent flow paths. As described above, a plurality of cooling medium flow paths may be formed on the support member in which the support plate and the cooling medium flow path forming member are joined. By doing so, the direction and flow rate of the cooling medium flowing in each cooling medium flow path can be controlled independently for each flow path, and the temperature of the recording head can be controlled more finely. The cooling medium flow path may have a plurality of independent cooling medium flow paths formed on one joint surface. The cooling medium flow path may pass back and forth in the longitudinal direction of the support plate inside the support plate or the cooling medium flow path forming member.

(Other embodiments)
In the first embodiment to the fifth embodiment, the cooling medium flow path is formed in a straight line, but the cooling medium flow path may not be formed in a straight line. It may be formed by meandering in the direction. By forming the cooling medium flow path in this way, the length of the flow path for heat exchange can be gained, and the amount of heat absorbed by the cooling medium can be increased.

  Further, “ink” or “liquid” should be interpreted widely, and when applied on a recording medium, formation of an image, pattern, pattern, etc., processing of the recording medium, or ink or recording medium It shall mean the liquid that is subjected to the treatment. Here, as the treatment of the ink or the recording medium, for example, the fixing property is improved by coagulation or insolubilization of the coloring material in the ink applied to the recording medium, the recording quality or coloring property is improved, and the image durability is improved. Say that.

  In the first to fifth embodiments, the cooling medium flow path includes a groove formed in both the support plate and the cooling medium flow path forming member, and a cooling medium flow path forming member. Only the case where a groove is formed has been described. However, in addition to this, this invention is good also as a groove | channel being formed only in the support plate. That is, the cooling medium flow path only needs to be formed in at least one of the support plate and the cooling medium member.

FIG. 3 is a perspective view illustrating an example of a recording head according to the present invention. FIG. 2 is an exploded perspective view illustrating a part of the recording head illustrated in FIG. 1. FIG. 3 is an exploded perspective view showing a recording element unit of the recording head shown in FIG. 2. (A) is a perspective view of the recording element substrate of the recording element unit shown in FIG. 3, and (b) is a cross-sectional view taken along line BB of (a). FIG. 2 is a perspective view of an ink jet recording apparatus using the recording head shown in FIG. 1 for six colors. (B) is a top view of the support plate and cooling medium flow path forming member used in the recording head according to the first embodiment of the present invention, and (a) is along the AA line of (b). It is sectional drawing. It is sectional drawing of the support plate used for the recording head of the comparative example about 1st embodiment of this invention. FIG. 6 is a cross-sectional view of a support plate and a cooling medium flow path forming member used in a recording head of a modification of the recording head according to the first embodiment of the present invention. It is explanatory drawing which shows the structure of the cooling system used with respect to the recording head which concerns on 1st embodiment of this invention. 6 is a graph comparing temperature rises of the recording head according to the first embodiment of the present invention and a recording head of a comparative example. It is sectional drawing of the support plate used for the recording head which concerns on 2nd embodiment of this invention, and the flow-path formation member for cooling media. It is sectional drawing of the support plate used for the recording head which concerns on 3rd embodiment of this invention, and the flow-path formation member for cooling media. It is sectional drawing of the support plate used for the modification of the recording head which concerns on 3rd embodiment of this invention, and the flow-path formation member for cooling media. FIG. 10 is a perspective view of a support plate and a cooling medium flow path forming member used in a recording head according to a fourth embodiment of the invention. It is sectional drawing of the support plate used for the recording head which concerns on 4th embodiment of this invention, and the flow-path formation member for cooling media. FIG. 10 is a plan view of a support plate and a cooling medium flow path forming member used in a recording head according to a fifth embodiment of the present invention.

Explanation of symbols

H1000 recording head H1100 recording element substrate H1101 recording element substrate side ink supply port H1102 electrothermal conversion element H1105 ejection port H1200, H1213, H1217, H1219, H1220 support plate H1201 support plate side ink supply port H1208, H1215, H1218, H1221a, H1221b Cooling medium flow path forming member H1210, H1222, H1223 Cooling medium flow path H1212 Seal member H1507 Ink supply member H2000 Support member H2110 Stepped portion H2120 Projection portion C1002 Pump

Claims (11)

A recording element substrate having an ejection port for ejecting liquid and a recording element for generating ejection energy for ejecting liquid from the ejection port;
In a liquid ejection head having a support plate on which the recording element substrate is disposed,
A cooling medium flow path forming member for forming a cooling medium flow path for circulating a cooling medium for cooling the liquid discharge head is disposed so as to contact the periphery of the support plate;
The liquid discharge head, wherein the cooling medium flow path includes a space formed by the support plate and the cooling medium flow path forming member.   The liquid discharge head according to claim 1, wherein the cooling medium flow path has a groove formed on a side surface of the cooling medium flow path forming member.   The liquid discharge head according to claim 1, wherein the cooling medium flow path is formed in at least one of the support plate and the cooling medium flow path forming member.   The seal member that seals the contact surface is disposed outside the cooling medium flow channel in a contact surface between the support plate and the cooling medium flow channel forming member. The liquid discharge head according to any one of 1 to 3. A liquid supply member for storing liquid is attached to the side of the support plate opposite to the side on which the recording element substrate is disposed,
5. The liquid ejection head according to claim 1, wherein the cooling medium flow path includes a space formed by the support plate and the liquid supply member.   The liquid ejection head according to claim 1, wherein a plurality of the recording element substrates are arranged on the support plate.   The liquid according to any one of claims 1 to 6, wherein a plurality of the cooling medium flow paths are formed in a support member in which the support plate and the cooling medium flow path forming member are joined. Discharge head.   The support plate is formed in a shape having a stepped portion on the outer edge and a protruding portion protruding from the stepped portion, and the cooling medium flow path forming member is formed in the stepped portion so as to sandwich the protruding portion. The liquid discharge head according to claim 1, wherein the liquid discharge head is disposed.   9. The liquid discharge head according to claim 1, wherein the liquid to be discharged from the discharge port is formed to be able to flow through the cooling medium flow path. A recording element substrate having an ejection port for ejecting liquid, a recording element for generating ejection energy for ejecting liquid from the ejection port, and a recording element substrate-side liquid supply port for supplying liquid to the ejection port; ,
The recording element substrate is disposed, and a liquid ejection head having a support plate on which a support plate side liquid supply port is formed so as to penetrate from the front surface to the back surface and communicate with the recording element substrate side liquid supply port is provided. In the recording device,
A cooling medium flow path forming member for forming a cooling medium flow path for circulating a cooling medium for cooling the liquid discharge head is disposed so as to contact the periphery of the support plate;
A liquid ejecting apparatus comprising: energy adding means for adding energy for flowing the cooling medium to the cooling medium so that the cooling medium flows through the flow path for the cooling medium.   The liquid ejection apparatus according to claim 10, wherein the liquid to be ejected from the ejection port is formed to be able to flow through the cooling medium flow path.

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