JP2009130024A - Component fitting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent solder peeling due to scooping of a component to which outside load, such as, a jack fitted to an edge of a printed board, is applied. <P>SOLUTION: First slits 3 are formed on both sides of the component 1 at the edge of the printed board 2; a wiring pattern and a connection terminal land for the component 1 are given as floating substrates, where a fitting part of the component 1 is coupled to the board body, only at a base end side; a second slit 13, formed continuing from the first slit 3 in a direction orthogonal to the first slit 3, is arranged in the floating substrate; a narrow part is constituted in the floating substrate. A chip component 6 is installed, at a position along a side of the component 1 in the floating substrate, and wiring to the chip component 6 is formed in the narrow part, and flexure of the floating substrate is suppressed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to suppression of solder peeling of a terminal portion due to an external load or operation such as a jack component mounted on a printed circuit board.

  Conventionally, a method for increasing the amount of solder of a soldering land of a jack component terminal is known as a countermeasure against the twisting of the jack component on the printed circuit board.

For example, in Patent Document 1, a tact switch is mounted on a printed circuit board, and a substantially U-shaped slit is provided around the printed circuit board to utilize the elasticity of the circuit board. However, the tact switch has insufficient soldering strength. The strength is improved by increasing the amount of solder in the land portion.
Japanese Utility Model Publication No. 63-6632

  However, in the case of the conventional invention as described above, although the connection strength between the jack component terminal and the soldering land of the printed circuit board is improved by increasing the amount of solder, there is a problem that the stress cannot be absorbed against external stress. Was.

  An object of the present invention is to provide a component mounting apparatus that suppresses solder peeling due to the turning of a jack component by absorbing external stress.

  In order to achieve the above object, a component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component, which is subjected to a load from an external load or an operation, to an edge portion of the printed circuit board. A first slit is formed on both sides of the component at the edge, and the mounting portion of the component is a floating substrate connected to the substrate body only at the base end side. In the floating substrate, a wiring pattern for the component and A land for connecting terminals is provided, and the floating substrate has a second slit formed to be continuous from the first slit in a direction orthogonal to the first slit, and is narrower than the floating substrate. A chip part is arranged at a position along the side surface of the part in the floating substrate, and the narrow part is Characterized by configured to suppress deflection of the floating substrate by passing the wire to the chip component.

  The component mounting apparatus according to the above configuration can absorb external stress by the printed circuit board by making the printed circuit board have a floating structure, and can suppress the solder peeling due to the turning of the jack component or the like.

  In order to achieve the above object, the component mounting apparatus according to the present invention is characterized in that the component is mounted by soldering and mounting a wire component to the jack component land.

  The component mounting apparatus according to the above configuration can further increase the effect of suppressing peeling of the jack component against turning by fixing the soldering terminal.

  According to the present invention, since slits are formed on both sides of a jack or other component attached to the edge of the printed circuit board, the load from the outside can be absorbed by the floating structure of the printed circuit board, so that the solder peeling due to the turning of the jack component is suppressed. can do.

  Hereinafter, more specific embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment)
1 to 3 are a top view, a perspective view, and a side view, respectively, of a component mounting device according to an embodiment of the present invention. The jack component 1 is a component that suppresses solder peeling due to the twisting of the present invention. The printed circuit board 2 is a base plate on which the jack component 1 is mounted. The first slit 3 is a groove provided in the printed board 2 for making the floating structure of the printed board 2. The jack component land 4 is for soldering the jack component 1. The jack component terminal 5 is a metal terminal for soldering the jack component 1. The chip component 6 is an electrical component that also serves to fix the jack component 1 in order to suppress the solder peeling of the jack component 1. The chip component land 7 is for soldering the chip component 6. The wire component 8 is a component for fixing the jack component terminal 5 in order to suppress the solder peeling of the jack component 1. The wire component land 9 is for soldering the wire component 8. The pattern 10 is a copper foil for connecting the jack part 1 and other parts. The through hole 11 is a copper foil for layer switching of the pattern 10. The solder 12 is for connecting the jack component 1 to the jack component land 4 and the like.

  The configuration of the component mounting device configured as described above will be described in detail.

  The first slits 3 are provided on both sides of the jack component 1 attached to the edge of the printed circuit board 2 so that the jack mounting location of the printed circuit board 2 has a floating structure. That is, the portion to which the jack component 1 is attached is bent. Furthermore, it has the 2nd slit 13 formed so that it might connect from the said 1st slit in the direction where the 1st slit 3 orthogonally crosses. The first slit 3 alone causes a situation on the printed circuit board due to the bending, but the floating part is divided and the plane part is formed by configuring the second slit 13, thereby suppressing the leaf withering of the jack component 1. It becomes possible to do. In addition, a narrow portion is formed on the floating substrate, and a pattern 10 is formed on the narrow portion on the back surface of the printed circuit board through the through hole 11, thereby enabling the tip portion of the floating substrate to float. , Will also suppress the strength of the floating. The length and width of the first slit 3 at this time may be formed with different dimensions. Further, the shape of the first slit 3 may be a curve or a circular shape having a slit tip portion larger than the slit width, and various shapes of the slit can be applied.

  The chip component 6 was arranged at a position along the side surface of the jack component 1 on the floating substrate to fix the side surface of the jack component 1. Further, the wire component 8 was placed on the soldering terminal of the jack component and soldered on the back surface of the jack terminal surface to fix the terminal of the jack component 1. With the above configuration, external load can be absorbed by the configuration of the first slit, the second slit, the configuration of the wiring pattern between the second slits, and the pressing by the chip component.

  The component mounting device of the present invention can suppress the solder peeling of the terminal portion due to an external load or operation such as a jack component mounted on a printed circuit board.

The top view of the component attachment apparatus in embodiment of this invention The perspective view of the component attachment apparatus in embodiment of this invention The side view of the component attachment apparatus in embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Jack component 2 Printed circuit board 3 1st slit 4 Jack component land 5 Jack component terminal 6 Chip component 7 Chip component land 8 Wire component 9 Wire component land 10 Pattern 11 Through-hole 12 Solder 13 2nd slit

Claims (2)

A component mounting device that attaches a component that is subjected to a load from an external load or operation to the edge of the printed circuit board,
Forming a first slit on both sides of the component at an edge of the printed circuit board, and setting the mounting portion of the component as a floating substrate connected to the substrate body only at the base end;
In the floating substrate, a wiring pattern and a connection terminal land for the component are applied,
Furthermore, the floating substrate has a second slit formed so as to continue from the first slit in a direction orthogonal to the first slit, and constitutes a narrow portion in the floating substrate,
A component in which a chip component is arranged at a position along the side surface of the component in the floating substrate, and the deflection of the floating substrate is suppressed by passing a wiring to the chip component through the narrow portion. Mounting device. 2. The component mounting apparatus according to claim 1, wherein the component is mounted by soldering and mounting a wire component on the jack component land.

Images