JP2009129976A5 - - Google Patents

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JP2009129976A5
JP2009129976A5 JP2007300703A JP2007300703A JP2009129976A5 JP 2009129976 A5 JP2009129976 A5 JP 2009129976A5 JP 2007300703 A JP2007300703 A JP 2007300703A JP 2007300703 A JP2007300703 A JP 2007300703A JP 2009129976 A5 JP2009129976 A5 JP 2009129976A5
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JP
Japan
Prior art keywords
resist film
nanobubbles
small
substrate
surface tension
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JP2007300703A
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Japanese (ja)
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JP5153305B2 (en
JP2009129976A (en
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Priority to JP2007300703A priority Critical patent/JP5153305B2/en
Priority claimed from JP2007300703A external-priority patent/JP5153305B2/en
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Publication of JP2009129976A5 publication Critical patent/JP2009129976A5/ja
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Publication of JP5153305B2 publication Critical patent/JP5153305B2/en
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この発明によれば、レジスト膜を膨潤させるための剥離液にナノバブルを混合させるようにした。微小なナノバブルが混合された剥離液は表面張力を非常に小さくできるため、高い浸透性を発揮するから、基板を急激に温度上昇させることなく、レジスト膜に迅速かつ確実に浸透してレジスト膜を膨潤させることができ、レジスト膜の剥離作業の効率向上を図ることが可能となる。 According to this invention, the nanobubbles are mixed with the stripping solution for swelling the resist film. For small nanobubbles are mixed stripping solution is very small surface tension Kudekiru, from high to exhibit permeability rapidly without raising the temperature of the substrate, quickly and reliably penetrate the resist film on the resist film As a result, it is possible to improve the efficiency of the resist film peeling work.

ナノバブルは直径が１μｍ以下の微細な気泡であって、その気泡がイオンの核に守られて液中に存在するもので、液体の表面張力を非常に小さくさせ、浸透力を高くするという性質を持つ。それによって、基板Ｗに付着残留するレジスト膜に対して高い浸透力を呈するから、そのレジスト膜を短時間で確実に膨潤させることが可能となる。
Nanobubbles a less fine bubbles 1μm in diameter, in which the bubbles are present which are in the liquid kept in the nucleus of the ions, the surface tension of the liquid is very small, nature and penetration high Kusuru have. As a result, a high penetrating force is exerted on the resist film adhering and remaining on the substrate W, so that the resist film can be reliably swollen in a short time.

JP2007300703A 2007-11-20 2007-11-20 Resist film peeling apparatus and peeling method Expired - Fee Related JP5153305B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007300703A JP5153305B2 (en) 2007-11-20 2007-11-20 Resist film peeling apparatus and peeling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007300703A JP5153305B2 (en) 2007-11-20 2007-11-20 Resist film peeling apparatus and peeling method

Publications (3)

Publication Number Publication Date
JP2009129976A JP2009129976A (en) 2009-06-11
JP2009129976A5 true JP2009129976A5 (en) 2012-11-15
JP5153305B2 JP5153305B2 (en) 2013-02-27

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Family Applications (1)

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JP2007300703A Expired - Fee Related JP5153305B2 (en) 2007-11-20 2007-11-20 Resist film peeling apparatus and peeling method

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JP (1) JP5153305B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5373656B2 (en) * 2010-02-08 2013-12-18 株式会社テラミクロス Method for forming conductor layer and method for manufacturing semiconductor device
JP5469507B2 (en) * 2010-03-31 2014-04-16 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP5656245B2 (en) * 2010-06-17 2015-01-21 芝浦メカトロニクス株式会社 Cleaning method and cleaning device
JP5994736B2 (en) * 2013-06-10 2016-09-21 東京エレクトロン株式会社 Substrate processing method, substrate processing apparatus, and storage medium
WO2016037073A2 (en) 2014-09-05 2016-03-10 Tennant Company Systems and methods for supplying treatment liquids having nanobubbles
JP2015062249A (en) * 2014-11-20 2015-04-02 芝浦メカトロニクス株式会社 Cleaning method and cleaning device
JP6501191B2 (en) 2014-12-02 2019-04-17 シグマテクノロジー有限会社 Micro-nano bubble cleaning method and apparatus
JP7402392B2 (en) 2022-04-28 2023-12-21 株式会社Sosui Water, its production method and production system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3949815B2 (en) * 1998-04-13 2007-07-25 大日本スクリーン製造株式会社 Resist film peeling method and peeling apparatus
JP2004121962A (en) * 2002-10-01 2004-04-22 National Institute Of Advanced Industrial & Technology Method and apparatus for using nanometer-bubble
JP2005093873A (en) * 2003-09-19 2005-04-07 Ebara Corp Substrate treating device
JP2005030649A (en) * 2003-07-10 2005-02-03 I D:Kk Drier for sheet
JP2006087876A (en) * 2004-09-27 2006-04-06 Saburo Ishiguro Decomposition method of organochlorine compound
JP4542448B2 (en) * 2005-03-07 2010-09-15 株式会社フューチャービジョン Resist stripping and removing device
JP2006310456A (en) * 2005-04-27 2006-11-09 Dainippon Screen Mfg Co Ltd Particle removing method and substrate processing equipment
JP2006344848A (en) * 2005-06-10 2006-12-21 Casio Comput Co Ltd Resist separating method and device thereof

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