JP2009115467A - Contact and contact unit, and method of manufacturing them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a minute linear contact made up of a single member and a contact unit equipped with the contact, by making its member have an elastic force in its axial direction and be expandable and shrinkable due to a cylindrical structure. <P>SOLUTION: The contact unit 7 includes a circuit board 8 having a connecting terminal 9 on its surface, and the contact 1 which stands erect on the circuit board 8 with one end 12 joined to the connecting terminal 9 of the circuit board 8, and brings the other end 14 into contact with an electric component 16 to connect the electric component 16 to the circuit board 8. The contact 1 has a contacting member 2 which is composed of conductive material, is formed into the shape of a cylinder expandable and shrinkable in its axial direction, and generates an elastic force in the axial direction, and by the elastic force of this contacting member 2 the other end 14 is brought into contact with the electric component 16. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides a contact that electrically connects the first electrical component and the second electrical component by bringing one end and the other end into contact with the first electrical component and the second electrical component, respectively. More specifically, the contact unit and the contact unit, which are formed in a fine linear shape made of a single member by being elastic and elastic in the axial direction by a cylindrical structure, It relates to their manufacturing method.

  A conventional contact is formed by a solid rod-like member having a multilayer structure including a core portion made of a resin material and a surface layer made of a metal material that covers the surface of the core portion, and is made of this single rod-like member. Using three rod-like members, one is placed horizontally, and the other two are joined vertically extending from both ends of the horizontally-arranged rod-like members in a direction away from each other, and the elastic force is increased. There was a crank-shaped one configured to exert. Further, the conventional contact unit has the above-described contact standing on the upper surface of the printed circuit board, and an elastic body such as a spring or rubber is provided on the lower surface of the printed circuit board. Is formed to be movable up and down (see, for example, Patent Document 1).

In addition, the other contactor is formed of a needle-like body having a curved intermediate portion in the longitudinal direction, and can be expanded and contracted by exhibiting an elastic force in the longitudinal direction by the curved shape of the intermediate portion. Further, a contact unit using other contacts includes a plurality of probing blocks corresponding to tens to hundreds of individual chips formed on a wafer on a wiring board on which a circuit pattern is formed. In each of the probing blocks, a plurality of the above-described contacts corresponding to a plurality of pads formed on the individual chip are erected (for example, see Patent Document 2).
Japanese Patent No. 2001-147240 (FIGS. 1, 3, 4, and 9) Japanese Patent Laying-Open No. 2007-49161 (FIGS. 1, 2 and 3)

  However, since the conventional contact shown in Patent Document 1 is formed of a solid bar-like member, the contact itself cannot be provided with an elastic force that can expand and contract in the axial direction. For this reason, when a plurality of contacts are arranged in the contact unit and the contact unit is pressed against the semiconductor integrated circuit and electrically connected to the pads arranged in the semiconductor integrated circuit, each contact is arranged. It was difficult to press the corresponding pad with uniform pressure, and it was difficult to obtain a stable electrical connection. In addition, in the case of the contact formed in a crank shape, the contact itself can be given elastic force that can expand and contract in the pressing direction, but the contact becomes large, and the printed circuit board has a high density and two-dimensionality. It is difficult to dispose the pad pitch of the area array type semiconductor integrated circuit.

  Moreover, in the conventional contact shown in the above-mentioned Patent Document 2, since the needle-like body is formed with a curved shape, the contact itself can be provided with an elastic force capable of expanding and contracting in the longitudinal direction. The contact becomes larger by the amount of the curved shape, and it is difficult to arrange the probe in a high density and two-dimensional manner on the probing block, and it has not been possible to cope with the miniaturization of the pad pitch of the area array type semiconductor integrated circuit.

  Therefore, the present invention addresses such problems and makes it possible to expand and contract with an elastic force in the axial direction by a cylindrical structure, so that the contact formed in a fine linear shape made of a single member. It is an object of the present invention to provide a child and contact unit and a method for manufacturing them.

  In order to achieve the above object, the contact according to the first invention has a contact member made of a conductive material, formed in a cylindrical shape that can be expanded and contracted in the axial direction, and exhibiting elastic force in the axial direction, The first electric component and the second electric component are electrically connected by bringing one end and the other end into contact with the first electric component and the second electric component, respectively, by the elastic force of the contact member. To do.

  With such a configuration, one end portion and the other end portion of the contact member are formed of a conductive material and formed into a cylindrical shape that can be expanded and contracted in the axial direction and the elastic force of the contact member that exhibits elastic force in the axial direction. Are brought into contact with the first electrical component and the second electrical component, respectively, to electrically connect the first electrical component and the second electrical component.

  Here, the contact member has a cross-sectional shape of the outer peripheral wall parallel to the axial direction formed by arranging a plurality of curved portions at predetermined intervals in the axial direction. Accordingly, the contact member can be expanded and contracted in the axial direction by the structure of the outer peripheral wall formed by arranging a plurality of curved portions in the axial direction at a predetermined interval in a cross-sectional shape parallel to the axial direction, thereby exerting an elastic force in the axial direction.

  Further, the contact member is formed by arranging a plurality of outward arcuate portions in the axial direction in a cross-sectional shape of the outer peripheral wall parallel to the axial direction. Accordingly, the contact member can be expanded and contracted in the axial direction by the structure of the outer peripheral wall formed by continuously arranging a plurality of arc-shaped portions having an outward cross-sectional shape parallel to the axial direction in the axial direction, and the elastic force in the axial direction. To demonstrate.

  Further, the contact member is formed such that the cross-sectional shape of the outer peripheral wall parallel to the axial direction is a wavy shape extending in the axial direction. Thereby, the contact member can be expanded and contracted in the axial direction by the structure of the outer peripheral wall formed in a corrugated shape in which a cross-sectional shape parallel to the axial direction extends in the axial direction, and an elastic force is exerted in the axial direction.

  A contact unit according to a second aspect of the invention is a circuit board having a connection terminal on the surface, and one end of the circuit board is joined to the connection terminal of the circuit board, and the other end is brought into contact with an electrical component. A contact unit that electrically connects the circuit board and the electrical component, and the contact unit is made of a conductive material and is formed in a cylindrical shape that can expand and contract in the axial direction. A contact member that exhibits an elastic force in the axial direction is provided, and the other end is brought into contact with the electrical component by the elastic force of the contact member.

  With such a configuration, the contact is installed on the circuit board, and is provided with a contact that electrically connects the circuit board and the electrical component by bringing the other end into contact with the electrical component. The other end of the contact member is brought into contact with the electrical component by the elastic force of the contact member that is formed in a cylindrical shape that can be expanded and contracted in the axial direction and that exerts an elastic force in the axial direction.

  Here, the contact member of the contactor has a cross-sectional shape of the outer peripheral wall parallel to the axial direction formed by arranging a plurality of curved portions at predetermined intervals in the axial direction. Accordingly, the contact member of the contactor can be expanded and contracted in the axial direction by the structure of the outer peripheral wall formed by arranging a plurality of curved portions at predetermined intervals in the axial direction in a cross-sectional shape parallel to the axial direction. Make it work.

  Further, the contact member of the contactor is formed by arranging a plurality of outward arcuate portions in the axial direction in a cross-sectional shape of the outer peripheral wall parallel to the axial direction. As a result, the contact member of the contact can be expanded and contracted in the axial direction by the structure of the outer peripheral wall formed by continuously arranging a plurality of arc-shaped portions having an outward cross-sectional shape parallel to the axial direction in the axial direction. To exert elastic force.

  Furthermore, the contact member of the contact is formed such that the cross-sectional shape of the outer peripheral wall parallel to the axial direction is a corrugated shape extending in the axial direction. Thereby, the contact member of the contactor can be expanded and contracted in the axial direction by the structure of the outer peripheral wall formed in a corrugated shape in which the cross-sectional shape parallel to the axial direction extends in the axial direction, and an elastic force is exerted in the axial direction.

  According to a third aspect of the present invention, there is provided a contactor manufacturing method comprising: forming a predetermined mask pattern by photolithography on a thin film mask layer formed on an upper surface or a lower surface of a substrate; and the substrate on which the mask pattern is formed. Forming a hole penetrating the substrate in accordance with the mask pattern by directional chemical etching; injecting a predetermined semiconductor or metal into the inner surface of the hole; Forming a layer, forming a second thin film layer by plating a surface of the first thin film layer formed on the inner surface of the hole with a predetermined metal, and forming a second thin film layer on the inner surface of the hole of the substrate. Leaving a thin film layer and a second thin film layer, removing a portion other than the first thin film layer and the second thin film layer by etching, and plating a predetermined metal on the surfaces of the first thin film layer and the second thin film layer And third thin By performing a step of forming a layer, and is intended for producing a contact according to the first invention.

  With this method, a predetermined mask pattern is formed by photolithography on the mask layer of the thin film formed on the upper surface or the lower surface of the substrate, and the mask pattern is formed by directional chemical etching on the substrate on which the mask pattern is formed. Are formed on the inner surface of the hole by forming a first thin film layer by injecting a predetermined semiconductor or metal into the inner surface of the hole and making the inner surface of the hole conductive. The surface of the first thin film layer is plated with a predetermined metal to form a second thin film layer, leaving the first thin film layer and the second thin film layer formed on the inner surface of the hole of the substrate, The contact according to the first invention is formed by removing portions other than the second thin film layer by etching and plating a predetermined metal on the surfaces of the first thin film layer and the second thin film layer to form a third thin film layer. Manufacturing.

  According to a fourth aspect of the present invention, there is provided a contactor manufacturing method comprising: forming a predetermined mask pattern by photolithography on a thin film mask layer formed on an upper surface or a lower surface of a substrate; and the substrate on which the mask pattern is formed. Forming a hole penetrating the substrate in accordance with the mask pattern by directional chemical etching; injecting a predetermined semiconductor or metal into the inner surface of the hole; Forming a layer, forming a second thin film layer by plating a surface of the first thin film layer formed on the inner surface of the hole with a predetermined metal, and forming a second thin film layer on the inner surface of the hole of the substrate. Leaving a thin film layer and a second thin film layer, removing a portion other than the first thin film layer and the second thin film layer by etching, and plating a predetermined metal on the surfaces of the first thin film layer and the second thin film layer And third thin By performing a step of forming a layer, and is intended for producing a contact according to the first invention.

  With this method, a predetermined mask pattern is formed by photolithography on the mask layer of the thin film formed on the upper surface or the lower surface of the substrate, and the mask pattern is formed by directional chemical etching on the substrate on which the mask pattern is formed. Are formed on the inner surface of the hole by forming a first thin film layer by injecting a predetermined semiconductor or metal into the inner surface of the hole and making the inner surface of the hole conductive. The surface of the first thin film layer is plated with a predetermined metal to form a second thin film layer, the second thin film layer formed on the inner surface of the hole of the substrate is left, and the portions other than the second thin film layer are etched. The contact according to the first invention is manufactured by removing and plating a predetermined metal on the surface of the second thin film layer to form a third thin film layer.

  According to a fifth aspect of the present invention, there is provided a contactor unit manufacturing method comprising: forming a predetermined mask pattern by photolithography on a thin film mask layer formed on an upper surface or a lower surface of a substrate; and forming the mask pattern on the substrate on which the mask pattern is formed. On the other hand, a step of forming a hole penetrating the substrate in conformity with the mask pattern by directional chemical etching, and injecting a predetermined semiconductor or metal into the inner surface of the hole to make the inner surface of the hole conductive. A step of forming a thin film layer and a circuit board having a connection terminal on the upper surface or the lower surface of the substrate are disposed, and the first thin film layer formed on the inner surface of the hole is brought into contact with the connection terminal of the circuit board. Bonding the substrate and the circuit board, the surface of the first thin film layer formed on the inner surface of the hole, and the surface of the connection terminal of the circuit board located on the bottom surface of the hole. Plating the second thin film layer, leaving the first thin film layer and the second thin film layer formed on the inner surface of the hole of the substrate and the circuit board, the first thin film layer, the second thin film layer, Performing a step of removing portions other than the circuit board by etching and a step of forming a third thin film layer by plating a predetermined metal on the surfaces of the first thin film layer and the second thin film layer, The contactor unit according to the second invention is manufactured.

  With this method, a predetermined mask pattern is formed by photolithography on the mask layer of the thin film formed on the upper surface or the lower surface of the substrate, and the mask pattern is formed by directional chemical etching on the substrate on which the mask pattern is formed. A hole penetrating through the substrate is formed in conformity with the substrate, a predetermined semiconductor or metal is injected into the inner surface of the hole, and the inner surface of the hole is made conductive to form a first thin film layer on the upper or lower surface of the substrate. A circuit board having a connection terminal on the surface is disposed, the first thin film layer formed on the inner surface of the hole is brought into contact with the connection terminal of the circuit board, and the substrate and the circuit board are joined to form the inner surface of the hole. The surface of the formed first thin film layer and the surface of the connection terminal of the circuit board located at the bottom of the hole are plated with a predetermined metal to form a second thin film layer, which is formed on the inner surface of the hole of the board. First A step of leaving the thin film layer, the second thin film layer, and the circuit board, and removing portions other than the first thin film layer, the second thin film layer, and the circuit board by etching; and on the surfaces of the first thin film layer and the second thin film layer A contact unit according to the second invention is manufactured by plating a predetermined metal to form a third thin film layer.

  According to a sixth aspect of the present invention, there is provided a contactor unit manufacturing method comprising: forming a predetermined mask pattern by photolithography on a thin film mask layer formed on an upper surface or a lower surface of a substrate; and forming the mask pattern on the substrate on which the mask pattern is formed. On the other hand, a step of forming a hole penetrating the substrate in conformity with the mask pattern by directional chemical etching, and injecting a predetermined semiconductor or metal into the inner surface of the hole to make the inner surface of the hole conductive. A step of forming a thin film layer and a circuit board having a connection terminal on the upper surface or the lower surface of the substrate are disposed, and the first thin film layer formed on the inner surface of the hole is brought into contact with the connection terminal of the circuit board. Bonding the substrate and the circuit board, the surface of the first thin film layer formed on the inner surface of the hole, and the surface of the connection terminal of the circuit board located on the bottom surface of the hole. The step of plating to form a second thin film layer, the second thin film layer formed on the inner surface of the hole of the substrate and the circuit board are left, and portions other than the second thin film layer and the circuit board are removed by etching. The contact unit according to the second invention is manufactured by performing the steps and the step of forming a third thin film layer by plating a predetermined metal on the surface of the second thin film layer.

  With this method, a predetermined mask pattern is formed by photolithography on the mask layer of the thin film formed on the upper surface or the lower surface of the substrate, and the mask pattern is formed by directional chemical etching on the substrate on which the mask pattern is formed. A hole penetrating through the substrate is formed in conformity with the substrate, a predetermined semiconductor or metal is injected into the inner surface of the hole, and the inner surface of the hole is made conductive to form a first thin film layer on the upper or lower surface of the substrate. A circuit board having a connection terminal on the surface is disposed, the first thin film layer formed on the inner surface of the hole is brought into contact with the connection terminal of the circuit board, and the substrate and the circuit board are joined to form the inner surface of the hole. The surface of the formed first thin film layer and the surface of the connection terminal of the circuit board located at the bottom of the hole are plated with a predetermined metal to form a second thin film layer, which is formed on the inner surface of the hole of the board. First By removing the portions other than the second thin film layer and the circuit board by etching, leaving the thin film layer and the circuit board, and plating a predetermined metal on the surface of the second thin film layer to form a third thin film layer, A contact unit according to the second invention is manufactured.

  According to the contact according to claim 1, one end of the contact member and the other are formed by the elastic force of the contact member that is formed in a conductive cylindrical shape that can be expanded and contracted in the axial direction and that exhibits elastic force in the axial direction. The first electrical component and the second electrical component can be electrically connected by bringing the end portions into contact with the first electrical component and the second electrical component, respectively. Accordingly, the cylindrical structure of the contact member can be expanded and contracted with an elastic force in the axial direction, and a fine linear contact made of a single member can be formed.

  According to the second aspect of the present invention, the contact member can be expanded and contracted in the axial direction by the structure of the outer peripheral wall in which the cross-sectional shape parallel to the axial direction is formed by arranging a plurality of curved portions at predetermined intervals in the axial direction. Elastic force can be exerted in the direction. Therefore, with a simple structure, it is possible to form a fine linear contact made of a single member that has an elastic force in the axial direction and can be expanded and contracted.

  Further, according to the invention of claim 3, the contact member is moved in the axial direction by the structure of the outer peripheral wall formed by continuously arranging a plurality of arcuate portions having an outward cross-sectional shape parallel to the axial direction in the axial direction. The elastic force can be exerted in the axial direction as it can be expanded and contracted. Therefore, with a simple structure, it is possible to form a fine linear contact made of a single member that has an elastic force in the axial direction and maintains a stable direction in the axial direction and can be expanded and contracted.

  According to the fourth aspect of the present invention, the contact member can be expanded and contracted in the axial direction by the structure of the outer peripheral wall formed in a wavy shape in which the cross-sectional shape parallel to the axial direction extends in the axial direction. Can be demonstrated. Therefore, with a simple structure, it is possible to form a fine linear contactor made of a single member that has an elastic force in the axial direction and maintains a flexible direction and can be expanded and contracted.

  Further, according to the contact unit according to claim 5, the contact unit is installed on the circuit board, and is provided in the contact that electrically connects the circuit board and the electrical component by bringing the other end into contact with the electrical component. The other end of the contact member is brought into contact with the electrical component by the elastic force of the contact member that is made of a conductive material and is formed in a cylindrical shape that can expand and contract in the axial direction and exerts an elastic force in the axial direction. Accordingly, the cylindrical structure of the contact member can be expanded and contracted with an elastic force in the axial direction, and a fine linear contact made of a single member can be formed. Further, the contacts can be arranged in high density and two-dimensionally, and it is possible to cope with the miniaturization of the pad pitch of the area array type semiconductor integrated circuit. Furthermore, when each contactor is electrically connected to a plurality of pads arranged in this semiconductor integrated circuit, each contactor can be pressed against the corresponding pad with a uniform pressure, and stable electrical A connection can be obtained.

  Furthermore, according to the sixth aspect of the invention, the contact member of the contactor is arranged in the axial direction by the structure of the outer peripheral wall in which the cross-sectional shape parallel to the axial direction is formed by arranging a plurality of curved portions at predetermined intervals in the axial direction. The elastic force can be exerted in the axial direction as it can be expanded and contracted. Therefore, it is possible to form a contact unit including a minute linear contact member made of a single member having an elastic force in the axial direction and capable of expanding and contracting with a simple structure.

  Further, according to the invention of claim 7, the contact member of the contact is formed by the structure of the outer peripheral wall formed by continuously arranging a plurality of arc-shaped portions having an outward cross-sectional shape parallel to the axial direction in the axial direction. It can be expanded and contracted in the axial direction and can exert an elastic force in the axial direction. Therefore, a contact unit having a fine linear contact made of a single member that has an elastic force in the axial direction and maintains a stable direction in the axial direction and can be expanded and contracted with a simple structure. Can be formed.

  Furthermore, according to the invention which concerns on Claim 8, the contact member of a contactor can be expanded-contracted to an axial direction by the structure of the outer peripheral wall in which the cross-sectional shape parallel to an axial direction was formed in the corrugated shape extended to an axial direction. Can exert elastic force. Therefore, it is possible to form a contact unit including a minute linear contact member made of a single member that has an elastic force in the axial direction and maintains a flexible directionality and can be expanded and contracted with a simple structure. it can.

  Furthermore, according to the method for manufacturing a contact according to claim 9, a predetermined mask pattern is formed by photolithography on a mask layer of a thin film formed on the upper surface or the lower surface of the substrate, and the substrate on which the mask pattern is formed is formed. On the other hand, a hole penetrating the substrate is formed by matching the mask pattern by directional chemical etching, a predetermined semiconductor or metal is injected into the inner surface of the hole, and the inner surface of the hole is made conductive to form a first thin film layer. The surface of the first thin film layer formed on the inner surface of the hole is plated with a predetermined metal to form the second thin film layer, leaving the first thin film layer and the second thin film layer formed on the inner surface of the hole of the substrate. A part other than the first thin film layer and the second thin film layer is removed by etching, and a predetermined metal is plated on the surfaces of the first thin film layer and the second thin film layer to form a third thin film layer. Manufacture the contact described in 1. It is possible. Accordingly, it is possible to manufacture a contact that has an outer wall having a plurality of layer structures, has conductivity, and is formed in a cylindrical shape that can be expanded and contracted in the axial direction and exerts an elastic force in the axial direction.

  According to the method for manufacturing a contact according to claim 10, a predetermined mask pattern is formed by photolithography on a thin film mask layer formed on the upper surface or the lower surface of the substrate, and the mask pattern is formed on the substrate. Forming a hole penetrating the substrate in accordance with the mask pattern by directional chemical etching, injecting a predetermined semiconductor or metal into the inner surface of the hole to make the inner surface of the hole conductive, and forming a first thin film layer; The surface of the first thin film layer formed on the inner surface of the hole is plated with a predetermined metal to form a second thin film layer, and the second thin film layer formed on the inner surface of the hole of the substrate is left and other than the second thin film layer The contact according to claim 1 can be manufactured by removing the portion by etching and plating a predetermined metal on the surface of the second thin film layer to form the third thin film layer. Accordingly, it is possible to manufacture a contact that has an outer wall having a plurality of layer structures, has conductivity, and is formed in a cylindrical shape that can be expanded and contracted in the axial direction and exerts an elastic force in the axial direction.

  Furthermore, according to the manufacturing method of the contact unit according to claim 11, a predetermined mask pattern is formed by photolithography on the mask layer of the thin film formed on the upper surface or the lower surface of the substrate, and the substrate on which the mask pattern is formed is formed. On the other hand, a hole penetrating the substrate is formed by matching the mask pattern by directional chemical etching, a predetermined semiconductor or metal is injected into the inner surface of the hole, and the inner surface of the hole is made conductive to form a first thin film layer. The circuit board having the connection terminal on the upper surface or the lower surface of the substrate is disposed, the first thin film layer formed on the inner surface of the hole and the connection terminal of the circuit board are brought into contact with each other, the substrate and the circuit board are joined, and the hole The second thin film layer is formed by plating the surface of the first thin film layer formed on the inner surface of the substrate and the surface of the connection terminal of the circuit board located at the bottom of the hole with a predetermined metal, and is formed on the inner surface of the hole of the substrate. First thin A step of leaving the first thin film layer, the second thin film layer and the circuit board by etching while leaving the layer, the second thin film layer and the circuit board, and a predetermined metal on the surfaces of the first thin film layer and the second thin film layer The contactor unit according to claim 5 can be manufactured by forming a third thin film layer by plating. Therefore, it is possible to manufacture a contact unit having a contact that has an outer wall having a plurality of layer structures, has conductivity, is formed in a cylindrical shape that can be expanded and contracted in the axial direction, and exhibits elastic force in the axial direction. it can.

  Furthermore, according to the method for manufacturing a contact unit according to claim 12, a predetermined mask pattern is formed by photolithography on a mask layer of a thin film formed on the upper surface or the lower surface of the substrate, and the substrate on which the mask pattern is formed. The first thin film layer is formed by forming a hole penetrating the substrate in accordance with the mask pattern by directional chemical etching, injecting a predetermined semiconductor or metal into the inner surface of the hole, and making the inner surface of the hole conductive. Then, a circuit board having a connection terminal on the upper surface or the lower surface of the substrate is disposed, the first thin film layer formed on the inner surface of the hole and the connection terminal of the circuit board are brought into contact, and the substrate and the circuit board are joined. The surface of the first thin film layer formed on the inner surface of the hole and the surface of the connection terminal of the circuit board located on the bottom surface of the hole are plated with a predetermined metal to form a second thin film layer, and the inner surface of the hole of the substrate is formed. Formed second A part other than the second thin film layer and the circuit board is removed by etching while leaving the thin film layer and the circuit board, and a predetermined metal is plated on the surface of the second thin film layer to form a third thin film layer. The contact unit according to the invention described in 5 can be manufactured. Therefore, it is possible to manufacture a contact unit having a contact that has an outer wall having a plurality of layer structures, has conductivity, is formed in a cylindrical shape that can be expanded and contracted in the axial direction, and exhibits elastic force in the axial direction. it can.

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a diagram showing a first embodiment of a contact according to the present invention. The contact 1 is interposed between a first electrical component and a second electrical component to electrically connect them, and includes a contact member 2.

  The contact member 2 causes the first electric component and the second electric component to come into contact with the first electric component (not shown) and the second electric component (not shown), respectively, by its elastic force. It is made of a conductive material and is formed into a cylindrical shape having a small diameter that can expand and contract in the axial direction, for example, about 20 μm, and exerts an elastic force in the axial direction. ing. Moreover, the cross-sectional shape of the outer peripheral wall parallel to the axial direction of the contact member 2 formed in a cylindrical shape is formed by arranging a plurality of curved portions at predetermined intervals in the axial direction. Specifically, the cross-section of the outer peripheral wall The shape is formed by arranging a plurality of outward arcuate portions 3 continuously in the axial direction. The arcuate portion 3 bends in the axial direction, so that the contact member 2 expands and contracts in the axial direction so that the contact can be expanded and contracted. Reference numeral 4 denotes a plating layer plated on the surface of the arc-shaped portion 3.

  FIG. 2 is a view showing a second embodiment of the contact according to the present invention. The contact 1 ′ is formed such that the cross-sectional shape of the outer peripheral wall parallel to the axial direction of the contact member 2 ′ is a corrugated shape extending in the axial direction with respect to the contact 1 according to the first embodiment. . In the present embodiment, the cross-sectional shape of the outer peripheral wall is formed by continuously arranging the outwardly curved portion 5 and the inwardly curved portion 6 in the axial direction, and has a bellows shape. Then, the outward bending portion 5 and the inward bending portion 6 are bent in the axial direction, whereby the contact member 2 ′ expands and contracts in the axial direction so that the contact 1 ′ can expand and contract.

  Next, a first embodiment of a contact unit including the contact configured as described above will be described with reference to FIG. The contact unit 7 electrically connects an electrical component and a circuit board via the contact, and includes a contact 1 and a circuit board 8.

  The contact 1 electrically connects the circuit board 8 and an electrical component (see reference numeral 16 shown in FIG. 4). The contact 1 is made of a conductive material and is formed in a cylindrical shape that can expand and contract in the axial direction. It has the contact member 2 which exhibits an elastic force in the direction. Specifically, the contact 1 shown in FIG. 1 is used. One end 12 is joined to the connection terminal 9 of the circuit board 8 and is erected on the circuit board 8. The end 14 is brought into contact with the electrical component.

  The circuit board 8 electrically connects the contact 1 and a tester (not shown), is formed in a plate shape, and has connection terminals 9 on the surface. The connection terminal 9 is a terminal for electrically connecting to the contact 1. A tester terminal 11 that is electrically connected to the connection terminal 9 is exposed on the back surface of the circuit board 8.

  Next, the use state of the contact unit 7 configured as described above will be described with reference to FIG. First, an electrical component 16 having a pad 15 on the surface is placed on the other end 14 side of the contact 1, the pad 15 is directed toward the contact 1, and the position of the pad 15 and the position of the contact 1 are set. Place them together. Next, the other end portion 14 of the contact 1 is pressed against the pad 15 of the electrical component 16 by pressing the contact unit 7 against the electrical component 16. As a result, the contact 1 and the pad 15 are brought into contact with each other with a predetermined pressure by the elastic force acting in the longitudinal direction of the contact 1, and a stable electrical connection can be realized.

  FIG. 5 is a diagram showing a second embodiment of the contact unit according to the present invention. The contact unit 17 is arranged on the surface of the circuit board 19 in accordance with the arrangement of the plurality of pads 15 provided on the surface of the electrical component 18 with respect to the contact unit 7 according to the first embodiment shown in FIG. A plurality of contacts 1 are formed in a matrix at a high density.

  The circuit board 19 is formed on a multi-layer board in which a plurality of layers are laminated, and has a plurality of connection terminals 9 on the surface thereof in a high density matrix form in accordance with the arrangement of the plurality of pads 15 of the electrical component 18. . The contact 1 shown in FIG. 1 is joined to and electrically connected to each connection terminal 9. Further, on the back surface of the circuit board 19, a plurality of tester terminals 11 electrically connected one-to-one with a plurality of connection terminals 9 provided on the front surface by a circuit pattern 21 formed in the circuit board 19. Is formed. The tester terminal 11 is a terminal for electrically connecting to a tester (not shown). The circuit pattern 21 is formed so as to spread outward as the layer of the circuit board 19 advances from the connection terminal 9 side toward the tester terminal 11 side. For this reason, the arrangement pitch of the tester terminals 11 can be increased, and electrical connection to the connection terminals 9 provided in a matrix at a high density is facilitated.

  Next, the use state of the contact unit 17 configured as described above will be described. First, as shown in FIG. 5, the electric component 18 is arranged with the pad 15 on the surface thereof facing the contact 1 and the position of the pad 15 and the position of the contact 1 are aligned. Next, by pressing the contact unit 17 against the electrical component 18, the other end 14 of each contact 1 is pressed against each pad 15 of the electrical component 18 in a one-to-one correspondence. Thereby, each contactor 1 and the pad 15 are individually brought into contact with each other with a predetermined pressure by the elastic force acting in the longitudinal direction of the contactor 1, and a stable electrical connection can be realized. Further, since the contact 1 has an elastic force in its axial direction and is formed to expand and contract while maintaining a stable direction in this axial direction, it is formed at a high density on the electrical component 18 as described above. Even when the contacts 1 arranged at a high density are connected to the pads 15, the individual contacts 1 can be accurately connected to the corresponding pads 15.

  In the contactor unit 7 shown in FIG. 3 and the contactor unit 17 shown in FIG. 5, the contactor 1 shown in FIG. 1 is used. However, the present invention is not limited to this, and the bellows type contact shown in FIG. Child 1 'may be used.

  Next, a first embodiment of a method for manufacturing a contact configured as described above will be described with reference to FIG.

  First, in the first step shown in FIG. 6A, a thin film mask layer 24 (for example, silicon oxide) formed on the upper surface or the lower surface of the substrate 23 made of, for example, flat silicon is predetermined by photolithography. The mask pattern 25 is formed.

  Next, in the second step shown in FIG. 6B, the substrate 23 on which the mask pattern 25 is formed is penetrated through the substrate 23 so as to coincide with the mask pattern 25 by directional chemical etching using a Bosch process. Hole 26 is formed.

  Here, the second step is performed by deep RIE (Deep Reactive Ion Etching) using a Bosch process, which will be described with reference to FIG.

First, in the step 2-1 shown in FIG. 7A, for example, SF ₆ (sulfur hexafluoride) is sprayed from above the mask pattern 25 formed on the surface of the substrate 23 shown in FIG. 6A. By performing directional chemical etching for a predetermined time, a substantially spherical first hole 27a having a predetermined diameter is formed in accordance with a position where the mask layer 24 is not present on the surface of the substrate 23 on which the mask pattern 25 is formed.

Next, in step 2-2 shown in FIG. 7B, a protective film 29 is formed by spraying, for example, C ₄ F ₈ (octafluorocyclobutane) on the inner surface of the first hole 27a for a predetermined time.

Next, in step 2-3 shown in FIG. 7 (c), SF ₆ is sprayed again on the first hole 27a to perform directional chemical etching for a predetermined time, thereby continuing to the first hole 27a. A second hole 27b having a predetermined diameter is formed below the second hole 27b.

Next, in a 2-4 step shown in FIG. 7D, the protective film 33 is formed by spraying C ₄ F ₈ again on the inner surface of the second hole 27b for a predetermined time.

  Then, the hole 26 shown in FIG. 6B is formed by sequentially executing the 2-3 step shown in FIG. 7C and the 2-4 step shown in FIG. 7D for a predetermined number of times. be able to.

  Next, in the third step shown in FIG. 6C, a predetermined semiconductor or metal (for example, boron) is injected into the inner surface of the hole 26, and the inner surface of the hole 26 is made conductive to form the first thin film layer 34. Form.

  Next, in the fourth step shown in FIG. 6D, the surface of the first thin film layer 34 formed on the inner surface of the hole 26 is selected from, for example, nickel, copper, titanium, palladium, platinum, gold and tungsten. The second thin film layer 35 is formed by plating with one metal to be formed, an alloy thereof, a metal compound thereof, or the like. Here, it is desirable to select a metal to be plated having high strength.

  Next, in a fifth step shown in FIG. 6E, the upper and lower surfaces of the substrate 23 are polished by, for example, CMP (chemical mechanical polishing), by polishing the upper surface 37 and the lower surface 38 of the substrate 23 shown in FIG. The first thin film layer 34 and the second thin film layer 35 are removed.

  Next, in the sixth step shown in FIG. 6F, the first thin film layer 34 and the second thin film layer 35 formed on the inner surface of the hole 26 of the substrate 23 shown in FIG. Portions other than the thin film layer 34 and the second thin film layer 35 are removed by etching.

  Next, in the 7th process shown in Drawing 6 (g), it used in the 4th process shown in Drawing 6 (d) on the surface of the 1st thin film layer 34 and the 2nd thin film layer 35 shown in Drawing 6 (f). The third thin film layer 36 is formed by plating a metal, an alloy thereof, or a metal compound thereof. Here, when the metal used in the fourth step is a metal having high conductivity, a metal having higher strength was selected, and the metal used in the fourth step was high in strength. In that case, it is desirable to select one having higher conductivity.

  Thereby, it has the same appearance as shown in FIG. 1, the outer peripheral wall has a plurality of layer structures, and the cross-sectional shape of the outer peripheral wall parallel to the axial direction is continuous with the outward arc-shaped portion in the axial direction. A plurality of contacts formed side by side can be manufactured.

  Next, a second embodiment of the method for manufacturing a contact configured as described above will be described with reference to FIG.

  First, similarly to the first embodiment of the above-described contactor manufacturing method, the process is executed from the first step shown in FIG. 6A to the fifth step shown in FIG.

  Next, in the sixth step shown in FIG. 8A, the second thin film layer 35 formed on the inner surface of the hole 26 of the substrate 23 shown in FIG. Remove by etching.

  Next, in the seventh step shown in FIG. 8B, the metal used in the fourth step shown in FIG. 6D or an alloy thereof is formed on the surface of the second thin film layer 35 shown in FIG. Alternatively, the third thin film layer 36 is formed by plating the metal compound. Here, as the metal to be plated, if the metal used in the fourth step shown in FIG. 6 (d) is highly conductive, a metal having higher strength is selected, and the metal shown in FIG. 6 (d) is selected. When the metal used in the four steps is high in strength, it is desirable to select a metal having higher conductivity.

  Thereby, it has the same appearance as shown in FIG. 1, the outer peripheral wall has a plurality of layer structures, and the cross-sectional shape of the outer peripheral wall parallel to the axial direction is continuous with the outward arc-shaped portion in the axial direction. A plurality of contacts 1 formed side by side can be manufactured. Here, the second thin film layer 35 corresponds to the arc-shaped portion 3 of the contact 1 shown in FIG. 1, and the third thin film layer 36 corresponds to the plating layer 4.

  Next, a first embodiment of a method for manufacturing a contact unit configured as described above will be described with reference to FIG.

  First, the steps shown in FIGS. 9A to 9C are the same as the steps shown in FIGS. 6A to 6C in the first embodiment of the contactor manufacturing method described above, and similarly. Execute.

  Next, in the fourth step shown in FIG. 9D, the upper surface 37 and the lower surface 38 of the substrate 23 shown in FIG. 9C are polished on the upper and lower surfaces of the substrate 23 by, for example, CMP. One thin film layer 34 is removed.

  Next, in the fifth step shown in FIG. 9E, the circuit board 8 having the connection terminals 9 on the surface is arranged on the upper surface or the lower surface of the substrate 23 shown in FIG. The substrate 23 and the circuit board 8 are joined by bringing the first thin film layer 34 and the connection terminal 9 of the circuit board 8 into contact with each other.

  Next, in a sixth step shown in FIG. 9 (f), the surface of the first thin film layer 34 formed on the inner surface of the hole 26 shown in FIG. 9 (e) and the circuit board 8 positioned on the bottom surface of the hole 26. The surface of the connection terminal 9 is plated with, for example, one metal selected from nickel, copper, titanium, palladium, platinum, gold, tungsten, or the like, or an alloy thereof, or a metal compound thereof, and the second thin film layer 35. Form.

  Next, in the seventh step shown in FIG. 9G, the first thin film layer 34 and the second thin film layer 35 formed on the inner surface of the hole 26 of the substrate 23 shown in FIG. The portions other than the first thin film layer 34, the second thin film layer 35, and the circuit board 8 are removed by etching.

  Next, in the eighth step shown in FIG. 9 (h), the surfaces of the first thin film layer 34 and the second thin film layer 35 shown in FIG. 9 (g) were used in the third step shown in FIG. 9 (c). The third thin film layer 36 is formed by plating a metal, an alloy thereof, or a metal compound thereof. Here, as the metal to be plated, if the metal used in the third step shown in FIG. 9 (c) is highly conductive, select a metal having higher strength than that shown in FIG. 9 (c). When the metal used in the three steps is high in strength, it is desirable to select a metal having higher conductivity.

  Thereby, it has the same appearance as shown in FIG. 3, the outer peripheral wall has a plurality of layer structures, and the cross-sectional shape of the outer peripheral wall parallel to the axial direction is continuous with the outward arc-shaped portion in the axial direction. A contact unit having a plurality of contacts formed side by side can be manufactured.

  Next, a second embodiment of the method of manufacturing the contact unit configured as described above will be described with reference to FIG.

  First, similarly to the first embodiment of the method for manufacturing a contact unit described above, the first step shown in FIG. 9A to the sixth step shown in FIG. 9F are executed.

  Next, in the seventh step shown in FIG. 10A, the second thin film layer 35 and the circuit board 8 formed on the inner surface of the hole 26 of the substrate 23 shown in FIG. Parts other than 35 and the circuit board 8 are removed by etching.

  Next, in an eighth step shown in FIG. 10B, the third thin film layer 36 is formed by plating a predetermined metal on the surface of the second thin film layer 35 shown in FIG. At this time, as the metal to be plated, if the metal used in the third step shown in FIG. 9 (c) is highly conductive, select a metal having higher strength than that shown in FIG. 9 (c). When the metal used in the three steps is high in strength, it is desirable to select a metal having higher conductivity.

  Thereby, it has the same appearance as shown in FIG. 3, the outer peripheral wall has a plurality of layer structures, and the cross-sectional shape of the outer peripheral wall parallel to the axial direction is continuous with the outward arc-shaped portion in the axial direction. A contact unit 7 having a plurality of contacts 1 formed side by side can be manufactured. Here, the second thin film layer 35 corresponds to the arc-shaped portion 3 of the contact 1 of the contact unit 7 shown in FIG. 3, and the third thin film layer 36 corresponds to the plating layer 4 of the contact 1.

  In the above description, the second thin film layer 35 is formed of a metal, an alloy thereof, a metal compound thereof, or the like. However, the present invention is not limited to this and may be formed of an insulator. In the manufacturing method of the contact 1 and the contact unit 7, the first thin film layer 34 and the second thin film layer 35 are formed on the inner surface of the hole 26 provided in the substrate 23 and the peripheral surface of the substrate 23. However, it may be formed only on the inner surface of the hole 26 provided in the substrate.

It is sectional drawing which shows 1st embodiment of the contactor by this invention. It is sectional drawing which shows 2nd embodiment of the contactor by this invention. It is sectional drawing which shows 1st embodiment of the contactor unit by this invention. It is sectional drawing which shows the use condition of the contactor unit by said 1st embodiment. It is sectional drawing which shows 2nd embodiment of the contactor unit by this invention. It is process drawing which shows 1st embodiment of the manufacturing method of the contactor by this invention. It is process drawing which shows the manufacturing method of the hole with respect to a board | substrate by the directional chemical etching using a Bosch process. It is process drawing which shows 2nd embodiment of the manufacturing method of the contactor by this invention. It is process drawing which shows 1st embodiment of the manufacturing method of the contact unit by this invention. It is process drawing which shows 2nd embodiment of the manufacturing method of the contactor unit by this invention.

Explanation of symbols

1, 1 '... contact 2, 2' ... contact member 3 ... arc-shaped part (curved part)
5 ... Outward curved part (curved part)
6. Inwardly curved part (curved part)
7 ... contact unit 8, 19 ... circuit board (first electrical component)
9 ... Connection terminal 12 ... One end part 13 and 17 of the contactor ... Contact unit 14 ... The other end part 16 and 18 of the contactor ... Electrical component (second electrical part)
23 ... Substrate 24 ... Mask layer 25 ... Mask pattern 26 ... Hole 34 ... First thin film layer 35 ... Second thin film layer 36 ... Third thin film layer 37 ... Upper surface 38 of substrate ... Lower surface of substrate

Claims (12)

  The contact member is made of a conductive material and is formed in a cylindrical shape that can be expanded and contracted in the axial direction, and has a contact member that exhibits an elastic force in the axial direction. A contactor, wherein the first electrical component and the second electrical component are electrically connected to each other by bringing the electrical component into contact with one electrical component and a second electrical component.   2. The contactor according to claim 1, wherein the contact member has a cross-sectional shape of an outer peripheral wall parallel to the axial direction, and a plurality of curved portions are arranged at predetermined intervals in the axial direction.   3. The contact according to claim 2, wherein the contact member has a cross-sectional shape of an outer peripheral wall parallel to the axial direction, and a plurality of outward arcuate portions are continuously arranged in the axial direction.   3. The contact according to claim 2, wherein the contact member is formed such that a cross-sectional shape of an outer peripheral wall parallel to the axial direction is a wavy shape extending in the axial direction. A circuit board having connection terminals on the surface;
A contact for connecting one end to the connection terminal of the circuit board and standing on the circuit board, contacting the other end with an electrical component to electrically connect the circuit board and the electrical component;
In the contact unit with
The contact is made of a conductive material, and has a contact member that is formed in a cylindrical shape that can be expanded and contracted in the axial direction and exerts an elastic force in the axial direction. The other end is electrically connected by the elastic force of the contact member. A contact unit that is in contact with a component.   6. The contact unit according to claim 5, wherein the contact member of the contact is formed by arranging a plurality of curved portions in the axial direction at a predetermined interval in a cross-sectional shape of the outer peripheral wall parallel to the axial direction.   7. The contactor according to claim 6, wherein the contact member of the contactor has a cross-sectional shape of an outer peripheral wall parallel to the axial direction, wherein a plurality of outward arcuate portions are continuously arranged in the axial direction. unit.   7. The contact unit according to claim 6, wherein the contact member of the contact is formed such that a cross-sectional shape of an outer peripheral wall parallel to the axial direction is a wavy shape extending in the axial direction. Forming a predetermined mask pattern by photolithography on a thin film mask layer formed on the upper or lower surface of the substrate;
Forming a hole penetrating the substrate so as to match the mask pattern by directional chemical etching with respect to the substrate on which the mask pattern is formed;
Injecting a predetermined semiconductor or metal into the inner surface of the hole, making the inner surface of the hole conductive and forming a first thin film layer;
Plating the surface of the first thin film layer formed on the inner surface of the hole with a predetermined metal to form a second thin film layer;
Leaving the first thin film layer and the second thin film layer formed on the inner surface of the hole of the substrate, and removing portions other than the first thin film layer and the second thin film layer by etching;
Forming a third thin film layer by plating a predetermined metal on the surfaces of the first thin film layer and the second thin film layer;
The contactor manufacturing method according to claim 1, wherein the contactor according to claim 1 is manufactured. Forming a predetermined mask pattern by photolithography on a thin film mask layer formed on the upper or lower surface of the substrate;
Forming a hole penetrating the substrate so as to match the mask pattern by directional chemical etching with respect to the substrate on which the mask pattern is formed;
Injecting a predetermined semiconductor or metal into the inner surface of the hole, making the inner surface of the hole conductive and forming a first thin film layer;
Plating the surface of the first thin film layer formed on the inner surface of the hole with a predetermined metal to form a second thin film layer;
Leaving the second thin film layer formed on the inner surface of the hole of the substrate, and removing portions other than the second thin film layer by etching;
Forming a third thin film layer by plating a predetermined metal on the surface of the second thin film layer;
The contactor manufacturing method according to claim 1, wherein the contactor according to claim 1 is manufactured. Forming a predetermined mask pattern by photolithography on a thin film mask layer formed on the upper or lower surface of the substrate;
Forming a hole penetrating the substrate so as to match the mask pattern by directional chemical etching with respect to the substrate on which the mask pattern is formed;
Injecting a predetermined semiconductor or metal into the inner surface of the hole, making the inner surface of the hole conductive and forming a first thin film layer;
A circuit board having a connection terminal on the upper surface or the lower surface of the substrate is disposed, and the first thin film layer formed on the inner surface of the hole and the connection terminal of the circuit board are brought into contact with each other to connect the substrate and the circuit board. Joining, and
Plating the surface of the first thin film layer formed on the inner surface of the hole and the surface of the connection terminal of the circuit board located on the bottom surface of the hole with a predetermined metal to form a second thin film layer;
Leaving the first thin film layer and the second thin film layer formed on the inner surface of the hole of the substrate and the circuit board, and removing portions other than the first thin film layer, the second thin film layer and the circuit board by etching;
Forming a third thin film layer by plating a predetermined metal on the surfaces of the first thin film layer and the second thin film layer;
The contactor unit manufacturing method according to claim 5, wherein the contactor unit according to claim 5 is manufactured. Forming a predetermined mask pattern by photolithography on a thin film mask layer formed on the upper or lower surface of the substrate;
Forming a hole penetrating the substrate so as to match the mask pattern by directional chemical etching with respect to the substrate on which the mask pattern is formed;
Injecting a predetermined semiconductor or metal into the inner surface of the hole, making the inner surface of the hole conductive and forming a first thin film layer;
A circuit board having a connection terminal on the upper surface or the lower surface of the substrate is disposed, and the first thin film layer formed on the inner surface of the hole and the connection terminal of the circuit board are brought into contact with each other to connect the substrate and the circuit board. Joining, and
Plating the surface of the first thin film layer formed on the inner surface of the hole and the surface of the connection terminal of the circuit board located on the bottom surface of the hole with a predetermined metal to form a second thin film layer;
Leaving the second thin film layer formed on the inner surface of the hole of the substrate and the circuit board, and removing portions other than the second thin film layer and the circuit board by etching;
Forming a third thin film layer by plating a predetermined metal on the surface of the second thin film layer;
The contactor unit manufacturing method according to claim 5, wherein the contactor unit according to claim 5 is manufactured.

Images