562930 i '發明說明（1) 【發明領域 本發明係有關於一種彈性探針之製造方法 係供裝設於適用於測試積體電路之探測卡， 一種立體彈性微探針之微機電 針 於 ，其中該探 特別係有關 〔Micro-electro-mechanirQi c 丄 cnanical System， MEMS 〕製造方法 Μ及利用該方法製造之立妒强料％ a t ^ 立體每性微探針與基板之組合構 【先前技術】562930 i 'Explanation of the invention (1) [FIELD OF THE INVENTION The present invention relates to a method for manufacturing an elastic probe, which is provided for a probe card suitable for testing integrated circuits, a micro-electromechanical needle for a three-dimensional elastic microprobe, The probe is particularly related to [Micro-electro-mechanirQ c 丄 cnanical System, MEMS] manufacturing method M and the jealous strength material manufactured by the method% at ^ the combined structure of the stereoscopic microprobe and substrate [prior technology]
Ik著積體電路之局度密集化’用以測試積體電路之裝 置亦需要微小化’而積體電路習知地係以晶圓〔wafer〕 型態製造，用以測觸晶圓之探測卡〔pr〇be card〕係纟且配 於一測試設備，以電性連接至一測試頭〔test head〕， 在探測卡上係形成有複數個探針〔pr〇be needie〕或 凸塊〔bump〕。 習知地，美國專利第6,084,42 0號「測試用探針組人 件」係揭不一種具有立體彈性微探針之組合構造〔以下 稱探針組合件〕，如第9圖所示，該探針組合件丨6係包 有一銅材質之基底構件36〔base meinber〕，其係結合於 陶瓷基板，基底構件36上提供有多個鎢材質之支持構件^ 〔support member〕，該些支持構件34共同支撐一橋接 件32〔bridge member〕，該橋接構件32係為一種合金 質之三臂式結構，以提供彈性，而橋接構件32上固定沾入 有一鎢材質之探測端30〔probe tip〕，用以彈性接觸° 0 體電路之接觸塾〔contact pad〕’然而在上述之專利案 562930 五、發明說明（2) 中並未揭露該探針組合件16之製造方法，若此一探針組合 件1 6需要結合於探測卡之陶瓷基板之連接墊〔即將上述i 基底構件36視為一連接墊〕，習知連接墊之尺寸係為數 微米，故探針組合件16之製造精度有可能要求至奈米級， 就探針組合件1 6之尺寸與複雜結構而論，如何製造微小 構造更為簡單之立體微探針顯然成為業界更需要克服 之課題。 凡 【發明目的及概要】 她Φ ί發明之主要目的在於提供一種立體彈性微探針之微 —造方法，藉由微機電技術在基板上形成模穴，並在 f f底部蝕刻出微孔，以利在基板上形成倒置之立體彈Ik's focus on the density of integrated circuits 'devices used to test integrated circuits also need to be miniaturized', and integrated circuits are conventionally manufactured in wafer type to detect the touch of wafers A card [pr〇be card] is equipped with a test device and is electrically connected to a test head. A plurality of probes [pr〇be needie] or bumps [] are formed on the probe card. bump]. Conventionally, U.S. Patent No. 6,084,420 "Personnel Set for Testing Probes" does not disclose a combined structure with a three-dimensional elastic microprobe [hereinafter referred to as a probe assembly]. As shown in FIG. 9, the The probe assembly 6 includes a copper base member 36 [base meinber], which is combined with a ceramic substrate. The base member 36 is provided with a plurality of support members made of tungsten ^ [support members], these support members 34 jointly supports a bridge member 32. The bridge member 32 is an alloy three-arm structure to provide elasticity. The bridge member 32 is fixed with a tungsten tip 30 probe tip. The contact pad for elastic contact ° 0 body circuit [contact pad] 'However, the manufacturing method of the probe assembly 16 is not disclosed in the above-mentioned patent case 562930 V. Invention description (2), if this probe The assembly 16 needs to be connected to the ceramic substrate of the detection card (i.e., the above i base member 36 is regarded as a connection pad). The size of the conventional connection pad is several micrometers, so the manufacturing accuracy of the probe assembly 16 is possible. Seeking to nanoscale, on the size of the probe assembly 16 in terms of the complex structure, how to make easier the minute structures perspective microprobe apparently become the industry need to overcome the problem. [Objective and Summary of the Invention] The main purpose of her invention is to provide a micro-fabrication method of three-dimensional elastic microprobes. Micro-electromechanical technology is used to form mold cavities on the substrate, and micro-holes are etched at the bottom of ff. Facilitates the formation of an inverted three-dimensional bomb on the substrate
當基板結合至一探測卡之陶免基板，使得2 弹性臧探針係能穩固並定點地結合於探測卡。 杯夕f ί明之再一目的在於提供一種立體彈性微探針與美 之立：i ΐ造，利用微機電技術在基板上形成複數個倒i 之立體弹性微探針，立體彈性 〗置 基板之模穴，s二乂木針之韌性兀件係形成於 邱之n力 立體彈性破楝針之探測端係形成於模穴底 點於;;=數個立體彈性微探針係同時能穩固4 第- ί i ΐ ϋ之立體彈性微探針之微機電製造方法，首先 後第二使基板形成有複數個模穴，之 再姓刻該2 :ί板：以覆蓋該模穴並填充於該微孔， "之金屬層後，在微孔之金屬層構成微探針之When the substrate is bonded to the ceramic-free substrate of a detection card, the 2 elastic probes can be firmly and fixedly bonded to the detection card. The purpose of the cup evening f is to provide a three-dimensional elastic microprobe and beauty: i made, using micro-electromechanical technology to form a plurality of inverted i three-dimensional elastic microprobes on the substrate, three-dimensional elasticity Mold cavity, s two cypress needle toughness element system is formed in Qiu Zhin force three-dimensional elastic breakage needle detection end system is formed at the bottom of the mold cavity;; = several three-dimensional elastic micro-probe system can be stable at the same time 4 The first-electromechanical manufacturing method of the three-dimensional elastic microprobe of i ΐ ϋ, firstly and secondly, the substrate is formed with a plurality of mold cavities, and then the last name is engraved 2: the plate: to cover the mold cavity and fill the cavity After the metal layer of the micropores, the microprobe is formed in the metal layer of the micropores.
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五、發明說明（3) 之韌性元件，因此在 量之呈倒置狀立體微 探測端，在模穴之金屬層構成微探針 一基板之適當位置上係形成有預定數 採針’以供同時結合至探測卡。 【發明詳細說明】 請參閱所附圖式，本發明將列舉 依本發明之一具體實施例，本發 之微機電製造方法之製造流程係如第 如後： 以下之實施例說明 明之立體彈性微探 1至7圖所示，其詳 針 述 I先\如第1圖所示，提供一基板40 ,該基板40之熱 膨脹係數係與微探針欲結合之基材相匹配，如 反、、 石夕基板、塑膠基板或捲帶等，較佳地，基板4〇係為； 圓，以供執行「第一次選擇性敍刻」。 「第一次選擇性蝕刻」之步驟係如第2圖所示， 係在基板40之一表面以沉積〔dep〇siti〇n〕或氧化 〔oxidation〕技術形成第一絕緣層51，如二氧化 化矽等，之後，以乾蝕刻或濕蝕刻圖案化該第一絕^舞氮 51，而形成開口，故第一絕緣層51係作為形成模穴“二 一硬罩幕〔first hard mask〕，再將基板浸入—餘 〔如氫氧化鈉〕，使得基板40之顯露開口蝕刻形 41，以供執行「第二次選擇性蝕刻」。 乂 、八 「第二次選擇性蝕刻」之步驟係如第3圖所示， 板40之具有模穴41之表面以氧化〔oxidation〕土 〔deposition〕技術形成第二絕緣層52，如-氧儿 、 —乳化石夕戎备 化矽等，第二絕緣層52係覆蓋於該模穴41，之饴 乳 俊，以乾蝕V. Description of the invention (3) The ductile element (3), therefore, a predetermined number of needles are formed at the appropriate positions of the three-dimensional micro-detection end in an inverted shape, and the metal layer of the mold cavity constitutes a micro-probe and a substrate. Coupled to the probe card. [Detailed description of the invention] Please refer to the attached drawings. The present invention will list a specific embodiment of the present invention. The manufacturing process of the micro-electro-mechanical manufacturing method of the present invention is as follows: The following examples illustrate the three-dimensional elasticity. Probes 1 to 7 are shown in detail. First, as shown in Figure 1, a substrate 40 is provided. The thermal expansion coefficient of the substrate 40 is matched with the substrate to which the microprobe is to be bonded. Shi Xi substrate, plastic substrate or tape, etc., preferably, the substrate 40 is round; it is used for the "first selective engraving". The step of “first selective etching” is shown in FIG. 2, and a first insulating layer 51 is formed on one surface of the substrate 40 by a deposition technique such as oxidization. Silicon, etc., and then pattern the first insulating nitrogen 51 by dry etching or wet etching to form an opening, so the first insulating layer 51 serves as a first hard mask for forming a cavity, Then the substrate is immersed in the residue [such as sodium hydroxide], so that the exposed openings of the substrate 40 are etched into shape 41 for performing the "second selective etching". (8) The step of "second selective etching" is shown in Fig. 3. The second insulating layer 52 is formed on the surface of the plate 40 having the cavity 41 by oxidation technology, such as -oxygen. The second insulating layer 52 covers the mold cavity 41. The second insulating layer 52 covers the mold cavity 41, and is dry-etched.
562930 五、發明說明（4) 刻或濕餘刻圖案化该苐二絕緣層5 2，以形成微小之開口， 故第二絕緣層5 2係作為形成微孔4 2之第二硬罩幕〔s e c 0 n d hard mask〕，再將基板浸入一蝕刻液〔如氫氧化鈉〕， 使得在模穴4 1底部之微小開口形成至少一微孔42，以供 「形成金屬層」。 爾後’如第4圖所示，以物理氣相沉積〔pVE)〕、化學 氣相沉積CVD、電漿促進化學氣相沉積〔pECV])〕、電鍍 〔plating〕或上述技術混用之方式形成一金屬層6〇於基 板40上，該金屬層6〇係為鎢、銅、鋁、金、鎳、鐵、鈀、 鉑三鈦或包含上述任一元素之合金層，並且該金屬層β 〇係 覆盍上述模穴41並填充於上述微孔42，之後，利用微影成 像〔Photolithography〕與蝕刻技術蝕刻而圖案化 〔、P,at!erned〕該金屬層60，使得在微孔42之金屬層6〇構 ，，，針之探測端72，且在模穴41之金屬層6〇構 之韌性元件71。 =此，依上述步驟係能在一基板4 〇上預定位置固定形 一複，個倒置型之立體彈性微探針〔如第5及8圖所 ;i測Ϊ 探針係包含有一導電性之韌性元件71以及至 A μ二鳊72，其中該些韌性元件71係設於上述模穴41， Ϊ該韋:性斜：往外延伸，而測觸端72係設於上述微孔42並 興Θ韌性件71 一體成型。 彈性3斜H6圖所示’翻轉該具有多個倒置型之立體 80，其λ 2板4G，並壓合至—探測卡之陶究電路基板 、土板40之探針位置〔即模穴41〕係已預先對應於陶 562930 五、發明說明（5) 瓷電路基板80之電極81，如銅墊〔copper pad〕、金凸塊 〔gold bump〕、焊料凸塊〔solder bump〕或其它導電接 觸端點，經由壓合使得多個立體彈性微探針同時結合於陶 瓷電路基板80之後，以溶劑清洗該基板4〇，以移除2板 40，如第7及8圖所示，多個獨立之立體彈性微探針$能 確並有效率地結合於陶瓷電路基板8〇之電極81。 本發明之立體彈性微探針之微機電製造方法 於利用矽晶圓之基板40，依立體彈性微探針之欲紝人二义 材質，如類似印刷電路板之中繼板或二口基板 性傳輸捲帶，&板40係、能選用熱膨脹係數匹 質之電 :使準碟地同時將多個立體彈針 =料， 件之電極82。 不T、、° 口於各式電子元 故本發明之保護範圍當視後 者為準，任何熟知此項技藝者，，申％專利範圍所界定 範圍内所作之任何變化與^ =脫離本發明之精神和 圍。 、/ =屬於本發明之保護範 562930 圖式簡單說明 【圖式說明】 第1圖：依本發 第2圖 第3圖 第4圖 第5 gj 第6 U 第7圖 第8圖 第9圖：在美國 件」中 【圖號說明】 1 6探針組合件 34支持構件 基板 51第—絕緣層 之 微 機 電 製 造 方 法， 之 微 機 電 製 造 方 法， 圖 J 之 微 機 電 製 造 方 法， 圖 • 之 微 機 電 製 造 方 法， 意 圖 ; 之 微 機 電 製 造 方 法， 之 基 板 截 面 示 意 圖； 之 微 機 電 製 造 方 法， 面 示 意 圖 之 微 機 電 製 造 方 法， 卡 之 截 面 示 意 圖 > 之 微機 電 製 造 方 法， 意 圖 及 一基板截面示意圖 依本發明之立體彈 形成有模穴之基板截面示意圖· 依本發 形成有微孔之基板截面示意圖· 依本發 β 形成有 依本發 形成有 依本發 在結合 依本發 立體彈 依本發 立體 專利第6, 084, 420缺「W人 ’冗υ C「測試用探鈕 ，一測試用探針立體圖 十、、且合 金屬層之基板截面示意圖； 30探觸端 3 6基底構件 41模穴 5 2第二絕緣層 3 2橋接構件 4 2微孔562930 V. Description of the invention (4) The second insulating layer 5 2 is etched or wet-etched to form minute openings, so the second insulating layer 5 2 is used as the second hard cover for forming the micro-holes 4 2 [ sec 0 nd hard mask], and then immerse the substrate in an etching solution [such as sodium hydroxide], so that at least one micro hole 42 is formed in the tiny opening at the bottom of the cavity 41 for "forming a metal layer". Thereafter, as shown in FIG. 4, a physical vapor deposition (pVE)], chemical vapor deposition CVD, plasma-assisted chemical vapor deposition (pECV)), electroplating [plating], or a combination of the above techniques is used to form a A metal layer 60 is on the substrate 40. The metal layer 60 is tungsten, copper, aluminum, gold, nickel, iron, palladium, platinum trititanium, or an alloy layer containing any of the above elements, and the metal layer β 〇 The mold cavity 41 is covered and filled in the micro hole 42, and then, the metal layer 60 is patterned by photolithography and etching technology [, P, at! Erned], so that the metal in the micro hole 42 is The layer 60 has a structure 72, the probe end 72 of the needle, and the metal layer 60 has a ductile element 71 in the mold cavity 41. = This, according to the above steps, can be fixed in a predetermined position on a substrate 40, a plurality of inverted three-dimensional elastic microprobes [as shown in Figures 5 and 8; i test probe contains a conductive Ductile element 71 and A μ2 鳊 72, where the ductile elements 71 are provided in the mold cavity 41, Ϊ the Wei: sexual oblique: extending outward, and the test contact 72 is provided in the micro hole 42 and Xing Θ The toughness 71 is integrally formed. The elastic 3 oblique H6 picture shows' flip the three-dimensional 80 with multiple inverted types, its λ 2 plate 4G, and press-fit it to the probe card's ceramic circuit board, the position of the probe of the soil plate 40 [ie, the cavity 41 ] Corresponds to ceramic 562930 in advance V. Description of the invention (5) Electrode 81 of ceramic circuit board 80, such as copper pad [copper pad], gold bump [solder bump] or other conductive contact After the end points are pressed, the three-dimensional elastic microprobes are simultaneously bonded to the ceramic circuit substrate 80, and then the substrate 40 is washed with a solvent to remove the two plates 40. As shown in Figs. 7 and 8, a plurality of independent The three-dimensional elastic microprobe can be surely and efficiently bonded to the electrode 81 of the ceramic circuit substrate 80. The micro-electro-mechanical manufacturing method of the three-dimensional elastic micro-probe of the present invention uses a substrate 40 of a silicon wafer, according to the desire of the three-dimensional elastic micro-probe, to be ambiguous, such as a relay board or two-port substrate similar to a printed circuit board Conveying tape, & board 40 series, can choose the electricity with the thermal expansion coefficient: make the quasi-disc ground at the same time a plurality of three-dimensional spring needle = material, electrode 82. Because the protection scope of the present invention is subject to the latter, any changes made within the scope defined by the patent scope of %% and ^ = deviate from the scope of the present invention. Spirit and Wai. , / = Belongs to the protection scope of the present invention 562930 Brief description of the drawings [Illustration of the drawings] Figure 1: According to the present invention Figure 2 Figure 3 Figure 4 Figure 5 gj 6 U Figure 7 Figure 8 Figure 9 ： In the United States ”[Illustration of drawing number] 1 6 Probe assembly 34 Support member substrate 51 First insulating layer of MEMS manufacturing method, MEMS manufacturing method, Figure J MEMS manufacturing method, Figure • Micro Electromechanical manufacturing methods, intentions; MEMS manufacturing methods, schematic cross-sections of substrates; MEMS manufacturing methods, schematic MEMS fabrication methods, card cross-section schematics > MEMS manufacturing methods, intentions and a substrate cross-sectional schematic according to Schematic cross-sectional view of a substrate with a mold cavity formed in the three-dimensional bomb of the present invention. Schematic cross-sectional view of a substrate with micro-holes formed according to the hair. Β-formed according to the hair. Formed according to the hair. Stereo Patent No. 6, 084, 420 "W-Man's Redundant C" Test Probe A perspective view of a test probe 10. Cross-section schematic diagram of a substrate with a metal layer; 30 probe ends 3 6 base members 41 mold cavities 5 2 second insulating layer 3 2 bridge members 4 2 micro holes
562930 圖式簡單說明 60金屬層 71韌性元件 72測觸端 8 0 陶瓷電路基板8 1 電極 im·562930 Schematic description 60 metal layer 71 toughness element 72 contact terminal 8 0 ceramic circuit board 8 1 electrode im ·