JP2009114412A - Conductive flame-retardant adhesive tape - Google Patents
Conductive flame-retardant adhesive tape Download PDFInfo
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- JP2009114412A JP2009114412A JP2007292148A JP2007292148A JP2009114412A JP 2009114412 A JP2009114412 A JP 2009114412A JP 2007292148 A JP2007292148 A JP 2007292148A JP 2007292148 A JP2007292148 A JP 2007292148A JP 2009114412 A JP2009114412 A JP 2009114412A
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- Prior art keywords
- flame
- flame retardant
- adhesive tape
- conductive
- fiber
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- 239000003063 flame retardant Substances 0.000 title claims abstract description 56
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 18
- 239000000835 fiber Substances 0.000 claims abstract description 49
- -1 nitrogen-containing phosphate compound Chemical class 0.000 claims abstract description 31
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 26
- 239000010452 phosphate Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000006258 conductive agent Substances 0.000 claims description 11
- 238000012360 testing method Methods 0.000 claims description 9
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- 150000002367 halogens Chemical class 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 description 29
- 238000000034 method Methods 0.000 description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
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- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000004114 Ammonium polyphosphate Substances 0.000 description 4
- 229920000388 Polyphosphate Polymers 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 4
- 229920001276 ammonium polyphosphate Polymers 0.000 description 4
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- 239000003208 petroleum Substances 0.000 description 4
- 239000001205 polyphosphate Substances 0.000 description 4
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- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
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- 229910045601 alloy Inorganic materials 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
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- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical group FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- YZEZMSPGIPTEBA-UHFFFAOYSA-N 2-n-(4,6-diamino-1,3,5-triazin-2-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(NC=2N=C(N)N=C(N)N=2)=N1 YZEZMSPGIPTEBA-UHFFFAOYSA-N 0.000 description 1
- SERIZWCPINYSDI-UHFFFAOYSA-N 5-hydroxy-2-methylidenepentanamide Chemical compound NC(=O)C(=C)CCCO SERIZWCPINYSDI-UHFFFAOYSA-N 0.000 description 1
- NQSLZEHVGKWKAY-UHFFFAOYSA-N 6-methylheptyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C(C)=C NQSLZEHVGKWKAY-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 244000241257 Cucumis melo Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920002821 Modacrylic Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical group CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 239000004067 bulking agent Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- CEDDGDWODCGBFQ-UHFFFAOYSA-N carbamimidoylazanium;hydron;phosphate Chemical compound NC(N)=N.OP(O)(O)=O CEDDGDWODCGBFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical group C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Chemical group 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- YSRVJVDFHZYRPA-UHFFFAOYSA-N melem Chemical compound NC1=NC(N23)=NC(N)=NC2=NC(N)=NC3=N1 YSRVJVDFHZYRPA-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Chemical group OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- LKEDKQWWISEKSW-UHFFFAOYSA-N nonyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCOC(=O)C(C)=C LKEDKQWWISEKSW-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- QVJYHZQHDMNONA-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1.NC1=NC(N)=NC(N)=N1 QVJYHZQHDMNONA-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920006376 polybenzimidazole fiber Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
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- 229920002215 polytrimethylene terephthalate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
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- 229910052718 tin Inorganic materials 0.000 description 1
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Chemical group OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- 229910052725 zinc Inorganic materials 0.000 description 1
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Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
本発明は、ハロゲン系難燃剤を使用することなく、優れた難燃性と粘着性基材の厚み方向の導電性、接着性を有した難燃粘着テープであり、かつ、経時での難燃性低下の少ない導電性を有する難燃粘着テープに関する。 The present invention is a flame retardant pressure-sensitive adhesive tape having excellent flame retardancy, electrical conductivity in the thickness direction of an adhesive substrate, and adhesion without using a halogen-based flame retardant, and flame retardant over time The present invention relates to a flame retardant pressure-sensitive adhesive tape having conductivity with little deterioration in property.
近年、電気・電子分野の各業界では、それを構成する電子部品等で、高い難燃性が求められるようになってきており、その中で、UL規格合格を求められることが多くなってきている。例えば、電子部品などに使用される電気絶縁テープのUL規格としてUL510があり、本規格に合格する高い難燃特性が求められている。また、他の難燃性規格に関しても同様である。 In recent years, in the electric and electronic fields, high flame resistance has been demanded for electronic components and the like constituting the same, and in many cases, UL standards have been demanded. Yes. For example, UL 510 is an UL standard for electrical insulating tapes used for electronic parts and the like, and high flame retardant properties that pass this standard are required. The same applies to other flame retardant standards.
この粘着テープに難燃性を付与するために、従来よりハロゲン系難燃剤が使用されているが、ハロゲン系難燃剤はハロゲン系ガスを発生し、それが機器等を腐食させる原因になることがあるため、非ハロゲン系難燃剤の検討が進められている。たとえば、特許文献1では、難燃剤にポリリン酸アンモニウムを用いその粒径と比表面積を規定することで高い難燃性の難燃粘着テープが提案されている。しかしながら、基材の厚み方向の導電性を有したテープではなく、さらに、我々の研究によれば経時により難燃性が低下する問題があることがわかった。 Halogen flame retardants have been used in the past to impart flame retardancy to this adhesive tape, but halogen flame retardants generate halogen gases, which can cause corrosion of equipment and the like. For this reason, studies on non-halogen flame retardants are in progress. For example, Patent Document 1 proposes a highly flame-retardant flame-retardant adhesive tape by using ammonium polyphosphate as a flame retardant and defining its particle size and specific surface area. However, it is not a tape having conductivity in the thickness direction of the base material, and according to our research, it has been found that there is a problem that the flame retardancy decreases with time.
一方、特許文献2には、基材の厚み方向の導電性及び難燃性を有した電磁波シールド材が提案され、無電解メッキを施した有機繊維布帛に、導電フィラーと難燃剤を配合した粘着層を設けることが記載されている。しかしながら、我々の研究によれば、難燃剤の種類によっては、厚み方向の導電性が不十分となったり、粘着性が低下したりする問題があることがわかった。また、かかる理由等から上記電磁波シールド材を、そのまま粘着テープとして応用することは困難である。 On the other hand, Patent Document 2 proposes an electromagnetic wave shielding material having conductivity and flame retardancy in the thickness direction of the base material, and an adhesive in which a conductive filler and a flame retardant are blended in an organic fiber fabric subjected to electroless plating. It is described that a layer is provided. However, according to our research, it has been found that depending on the type of flame retardant, there is a problem that the conductivity in the thickness direction becomes insufficient or the adhesiveness is lowered. Moreover, it is difficult to apply the electromagnetic shielding material as an adhesive tape as it is for such reasons.
よって、今日、電子機器のコネクター端末部やケーブル等のシールド、グランド強化などのノイズ対策に、導電性を有した難燃粘着テープの要求があるが、従来技術を見渡しても、経時的に低下することのない安定した難燃性、粘着性、基材の厚み方向の導電性を同時に満足させるようなテープは開発されていないのが実情である。 Therefore, today, there is a demand for conductive flame-retardant adhesive tapes for noise countermeasures such as connector terminal parts of electronic devices, shields for cables, ground reinforcement, etc. In fact, no tape has been developed that simultaneously satisfies the stable flame retardancy, adhesiveness, and conductivity in the thickness direction of the substrate.
本発明の目的は、ハロゲン系難燃剤を使用することのなく、優れた難燃性と粘着性基材の厚み方向の導電性を有し、かつ、経時での難燃性低下の少ない難燃粘着テープを提供することを目的とする。 The object of the present invention is to provide a flame retardant having excellent flame retardancy and electrical conductivity in the thickness direction of the adhesive substrate without using a halogen-based flame retardant, and having little decrease in flame retardance over time. An object is to provide an adhesive tape.
本発明者は、導電性を有する粘着テープの粘着層に含有させる難燃剤について検討したところ、異なるリン系難燃剤を特定の配合割合で粘着層に含有させたところ、粘着性や厚み方向の導電性が低下することなく、優れた難燃性を発揮するだけでなく、高温高湿度下に粘着テープが放置されても経時的な難燃性の低下が少なく、安定した高い難燃性が維持されることを見出した。 The present inventor examined the flame retardant contained in the adhesive layer of the adhesive tape having conductivity, and when different phosphorus-based flame retardants were contained in the adhesive layer at a specific blending ratio, the adhesive property and the conductivity in the thickness direction were determined. In addition to exhibiting excellent flame retardancy without deterioration, the flame retardance does not decrease over time even when the adhesive tape is left under high temperature and high humidity, and stable high flame retardancy is maintained. I found out that
かくして本発明によれば、導電性を有する有機繊維からなる基材の少なくとも片面に粘着層を設けた導電性を有する難燃粘着テープであって、該粘着層が、粘着剤、難燃剤、導電剤から構成され、かつ、該難燃剤が、窒素含有リン酸塩化合物(A)と有機リン酸塩化合物(B)からなることを特徴とする導電性を有する難燃粘着テープ提供される。 Thus, according to the present invention, there is provided a conductive flame retardant pressure-sensitive adhesive tape in which an adhesive layer is provided on at least one side of a base material made of conductive organic fiber, and the adhesive layer is a pressure-sensitive adhesive, a flame retardant, a conductive material. There is provided a flame retardant pressure-sensitive adhesive tape having electrical conductivity, characterized in that the flame retardant comprises a nitrogen-containing phosphate compound (A) and an organic phosphate compound (B).
本発明の導電性を有する難燃粘着テープを用いることで、経時での難燃性低下が無く導電性、接着性に優れたテープとなり、シールディングやグランディングに優れた効果が発揮できる。 By using the conductive flame retardant adhesive tape of the present invention, there is no deterioration in flame retardant with time, and the tape has excellent conductivity and adhesiveness, and can exhibit excellent effects in shielding and grounding.
以下、本発明を詳細に説明する。本発明の導電性を有する有機繊維から構成される基材(以下、導電性布帛と呼ぶことがある)を構成する繊維は有機繊維であれば特に限定はなく、耐熱性、難燃性を考慮すれば、アラミド繊維、ポリベンズイミダゾール繊維、ポリベンズオキサゾール繊維、モダアクリル繊維、ポリテトラフルオロエチレン繊維を用いることが好ましい。また、ポリエチレンテレフタレート繊維、ポリエチレンナフタレート繊維、ポリトリメチレンテレフタレート繊維などのポリエステル系繊維、アクリル繊維、ナイロン繊維などを用いることもできる。 Hereinafter, the present invention will be described in detail. If the fiber which comprises the base material (henceforth a conductive fabric) comprised from the organic fiber which has the electroconductivity of this invention is an organic fiber, there will be no limitation in particular, and heat resistance and a flame retardance are considered. In this case, it is preferable to use an aramid fiber, a polybenzimidazole fiber, a polybenzoxazole fiber, a modacrylic fiber, or a polytetrafluoroethylene fiber. Polyester fibers such as polyethylene terephthalate fiber, polyethylene naphthalate fiber, polytrimethylene terephthalate fiber, acrylic fiber, nylon fiber, and the like can also be used.
また、上記の有機繊維に対しては、金属皮膜と繊維との密着性を向上させるために、エッチングを行って繊維表面に凹凸を付与したり、界面活性剤などによるコンディショナー処理を施すことが好ましい。 Further, for the above-mentioned organic fibers, it is preferable to perform etching to impart unevenness to the fiber surface or conditioner treatment with a surfactant or the like in order to improve the adhesion between the metal film and the fibers. .
上記有機繊維の単繊維繊度は特に限定は無いが、0.33〜5.56dtexの範囲にあるものが好ましく使用される。該単繊維繊度0.33dtex未満の場合、布帛を加工する際の取り扱いが困難となる場合があり、一方、該単繊維繊度が5.56dtexを超える場合は、接触対象物と導電性布帛が接触した際の応力が高いため金属皮膜にクラックが生じてしまう場合がある。 Although the single fiber fineness of the organic fiber is not particularly limited, those having a range of 0.33 to 5.56 dtex are preferably used. When the single fiber fineness is less than 0.33 dtex, handling of the fabric may be difficult. On the other hand, when the single fiber fineness exceeds 5.56 dtex, the contact object and the conductive fabric are in contact with each other. In some cases, the metal film is cracked due to the high stress at the time.
上記有機繊維は、長繊維や短繊維、及びそれらの複合繊維や加工糸、或いは紡績糸などの繊維糸条とされ、該繊維糸条を用いて公知の繊維集合体である織物、編物、不織布などの布帛の形態にして用いられる。
この際、織物の組織として平織、綾織、朱子織、斜子織、及びこれらの変化織が好ましく用いられ、また、編物の組織としては経編物、緯編物のいずれも使用することができる。
The organic fiber is a long fiber or short fiber, and a fiber yarn such as a composite fiber, a processed yarn, or a spun yarn, and a woven fabric, a knitted fabric, or a non-woven fabric that is a known fiber assembly using the fiber yarn. It is used in the form of a fabric such as.
At this time, plain weave, twill, satin weave, oblique weave, and these changed weaves are preferably used, and warp knitted and weft knitted fabrics can be used as the knitted fabric.
また、布帛が不織布の場合には、長繊維、あるいは短繊維からなる不織布が用いられ、これらの不織布はカードウェブ、ニードルパンチ、スパンボンド、エアーレイド、または、これら2種以上の方法を含む複合法により製造される乾式法、或いは繊維を水に分散させてスラリーにしたものを抄紙する湿式法などにより製造される。 When the fabric is a non-woven fabric, a non-woven fabric composed of long fibers or short fibers is used, and these non-woven fabrics are card web, needle punch, spunbond, air raid, or a composite containing two or more of these methods. It is produced by a dry method produced by a method, or a wet method in which a fiber is dispersed in water to form a slurry.
布帛が不織布の場合は、樹脂加工による毛羽落ち防止措置をとることが好ましく、接触対象物との摩擦による毛羽落ちが厳禁となる用途においては、不織布ではなく長繊維織物を使用することが好ましい。 When the fabric is a non-woven fabric, it is preferable to take measures for preventing fluff by resin processing. In applications where fluff due to friction with a contact object is strictly prohibited, it is preferable to use a long-fiber fabric instead of a non-woven fabric.
導電性布帛の厚さは特に限定は無く、使用用途によって好ましい厚さにすることができるが、テープとしての柔軟性を考慮すると、50〜200μm、より好ましくは75〜175μmである。厚みが50μm未満の場合、テープとして充分な力学特性が得られない。また、厚みが200μmを超える場合、テープとしての柔軟性がなくなってしまう。 The thickness of the conductive fabric is not particularly limited and can be set to a preferred thickness depending on the intended use, but considering the flexibility as a tape, it is 50 to 200 μm, more preferably 75 to 175 μm. When the thickness is less than 50 μm, sufficient mechanical properties as a tape cannot be obtained. Moreover, when thickness exceeds 200 micrometers, the softness | flexibility as a tape will be lose | eliminated.
導電性布帛の目付は特に限定されず使用用途によって好ましい目付にすることができるが、テープとしての取り扱い性・柔軟性を考慮すると、50〜200g/m2、より好ましくは70〜150g/m2である。目付が50g/m2未満の場合、テープとして充分な力学特性が得られない。また、目付が200m2を超える場合、テープとしての柔軟性がなくなってしまう。 The basis weight of the conductive fabric is not particularly limited, and can be a preferable basis weight depending on the intended use. However, in consideration of handling property and flexibility as a tape, 50 to 200 g / m 2 , more preferably 70 to 150 g / m 2. It is. When the basis weight is less than 50 g / m 2 , sufficient mechanical properties as a tape cannot be obtained. Moreover, when a fabric weight exceeds 200 m < 2 >, the flexibility as a tape will be lost.
本発明においては、上記有機繊維が導電性を有していることが必要である。ここで、有機繊維が導電性を有しているとは、有機繊維の表面又は該繊維の集合体表面に、静電気を除去することが可能な金属皮膜などが形成されていることを言う。 In the present invention, it is necessary that the organic fiber has conductivity. Here, the organic fiber has conductivity means that a metal film or the like capable of removing static electricity is formed on the surface of the organic fiber or the aggregate surface of the fiber.
有機繊維の表面又は該繊維の集合体表面に金属皮膜を形成せしめる方法としては、従来公知の方法が用いられ、繊維や布帛表面に無電解メッキ、電気メッキ、金属蒸着、スパッタリング加工などを施す方法が採用されるが、特に好ましいのは無電解メッキにより布帛の表面に金属皮膜を形成させる方法である。
また、予めその表面に金属皮膜を形成せしめた有機繊維を繊維糸条となし、該繊維糸条を用いて織物、編物などの布帛の形態にしても良い。
As a method for forming a metal film on the surface of the organic fiber or the aggregate of the fibers, a conventionally known method is used, and a method of performing electroless plating, electroplating, metal vapor deposition, sputtering processing or the like on the surface of the fiber or fabric However, a method of forming a metal film on the surface of the fabric by electroless plating is particularly preferable.
Alternatively, an organic fiber having a metal film formed on its surface in advance may be used as a fiber yarn, and the fiber yarn may be used to form a fabric such as a woven fabric or a knitted fabric.
上記の、皮膜を形成する金属としては、金、銀、銅、亜鉛、ニッケル、スズ及びそれらの合金等が挙げられ、その中でも、低コストで汎用性のある銅が望ましい。また、これらの金属により形成される層は1層であっても、2層以上の多層であっても構わない。 Examples of the metal forming the film include gold, silver, copper, zinc, nickel, tin, and alloys thereof, and among them, low-cost and versatile copper is preferable. Further, the layer formed of these metals may be a single layer or a multilayer of two or more layers.
無電解メッキによる銅皮膜の形成方法の1例についてさらに詳しく説明する。先ず、上記布帛を公知の方法で精練処理し、布帛表面にある糊剤、油剤を除去する。ついで、必要に応じてアルカリ性溶液に浸漬して減量加工を行った後、精練処理された布帛に、無為電解メッキの核となるパラジウムを吸着させ、活性化処理をした後、銅メッキ浴に浸漬し、布帛表面に銅皮膜を形成させる。 An example of a method for forming a copper film by electroless plating will be described in more detail. First, the fabric is subjected to a scouring process by a known method to remove the glue and oil on the fabric surface. Next, after reducing the weight by immersing it in an alkaline solution as necessary, the scoured fabric is adsorbed with palladium that is the core of electroless plating, activated, and then immersed in a copper plating bath. Then, a copper film is formed on the fabric surface.
上記処理により形成される銅皮膜の厚さは、平均値で0.1〜2.0μmの範囲にあれ良い。該皮膜の厚さが前記の範囲より大きいと金属皮膜の脱落が起こり易くなるので好ましくない。
上記方法により形成された金属皮膜には、防錆のために、さらにその上にニッケルなどの耐食性のよい金属皮膜を形成させたり、防錆剤を塗布したりすることができる。
The thickness of the copper film formed by the above treatment may be in the range of 0.1 to 2.0 μm on average. If the thickness of the film is larger than the above range, the metal film is likely to fall off, which is not preferable.
In order to prevent rust, a metal film having good corrosion resistance such as nickel can be further formed on the metal film formed by the above method, or a rust inhibitor can be applied.
本発明の粘着テープは、上記の導電性布帛の少なくとも片面に粘着層を設けた粘着テープであり、該粘着層は、粘着剤、導電剤、難燃剤で構成される。
粘着層を形成する粘着剤は、特に限定されることは無いが、一般的に用いられる公知のアクリル系粘着剤やゴム系粘着剤がベースポリマーとして用いられる。例えば、アクリル系粘着剤としては、メタアクリル酸メチル、メタアクリル酸エチル、メタアクリル酸プロピル、メタアクリル酸n−ブチル、メタアクリル酸2−エチルヘキシル、メタアクリル酸イソオクチル、メタアクリル酸ノニル、メタアクリル酸イソノニル等のメタアクリル酸エステモノマーを主成分とし、これにメタアクリル酸、クロトン酸、フマル酸、イタコン酸、無水マレイン酸等の官能基を含むモノマーや酢酸ビニル、アクリロニトリル、スチレン、メタアクリル酸2−ヒドロキシエチル、2−メチロールエチルアクリルアミド等を必要に応じて共重合させることによって得られる公知のアクリル系粘着剤である。
The pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape provided with a pressure-sensitive adhesive layer on at least one surface of the conductive fabric, and the pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive, a conductive agent, and a flame retardant.
Although the adhesive which forms an adhesion layer is not specifically limited, The well-known acrylic adhesive and rubber adhesive which are generally used are used as a base polymer. For example, acrylic adhesives include methyl methacrylate, ethyl methacrylate, propyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate, isooctyl methacrylate, nonyl methacrylate, and methacrylate. Mainly composed of methacrylic acid ester monomers such as isononyl acid, monomers containing functional groups such as methacrylic acid, crotonic acid, fumaric acid, itaconic acid, maleic anhydride, vinyl acetate, acrylonitrile, styrene, methacrylic acid It is a publicly known acrylic pressure-sensitive adhesive obtained by copolymerizing 2-hydroxyethyl, 2-methylolethylacrylamide or the like as necessary.
ゴム系粘着剤としては、特に限定されないが、例えば、天然ゴム、スチレンブタジエンゴム、ブチルゴム、イソプレンゴム、ブタジエンゴム、及びスチレンイソプレンブロックコポリマー等のエラストマー成分を1種、又は2種以上の組合わせに対して、ロジン系樹脂、テルペン系樹脂、脂肪族系石油樹脂、芳香族系石油樹脂、共重合系石油樹脂、脂環族系石油樹脂、クマロン・インデン樹脂、ピュア・モノマー系樹脂、フェノール系樹脂、キシレン樹脂等を混合することによりなる、公知のゴム系粘着剤である。 The rubber-based pressure-sensitive adhesive is not particularly limited. For example, an elastomer component such as natural rubber, styrene butadiene rubber, butyl rubber, isoprene rubber, butadiene rubber, and styrene isoprene block copolymer is used alone or in combination of two or more. In contrast, rosin resin, terpene resin, aliphatic petroleum resin, aromatic petroleum resin, copolymer petroleum resin, alicyclic petroleum resin, coumarone / indene resin, pure monomer resin, phenol resin It is a known rubber-based pressure-sensitive adhesive made by mixing xylene resin and the like.
本発明においては、粘着層を構成する難燃剤が、窒素含有リン酸塩化合物(A)と有機リン酸塩化合物(B)の2種類からなることが肝要である。本発明者らは、かかるリン系化合物の組合せとしたとき、高温高湿度下でも経時的に難燃性が低下することなく、安定した難燃性を維持することができることを見出した。さらに、かかる難燃剤の組合せを選んだとき、接着性や厚み方向の導電性の低下が少ないことがわかった。 In this invention, it is important that the flame retardant which comprises an adhesion layer consists of two types, a nitrogen-containing phosphate compound (A) and an organic phosphate compound (B). The present inventors have found that when such a combination of phosphorus compounds is used, stable flame retardancy can be maintained without decreasing flame retardance over time even under high temperature and high humidity. Furthermore, it has been found that when such a combination of flame retardants is selected, there is little decrease in adhesion and electrical conductivity in the thickness direction.
上記の窒素含有リン酸塩化合物(A)としては、ポリリン酸アンモニウム、リン酸メラミン、リン酸ジメラミン、ピロリン酸メラミン、ポリリン酸メラミン、ポリリン酸メラム、ポリリン酸メレム、ポリリン酸メロン、リン酸エステルアミド、リン酸グアニジン等が好ましく挙げられる。また、これらの窒素含有リン系難燃剤(A)はマイクロカプセル化したものであっても良い。
一方、有機リン酸塩化合物(B)の具体例としては、「PEKOFLAM STC POWDER(商品名)」(クラリアントジャパン株式会社製)を好ましく挙げることができる。
Examples of the nitrogen-containing phosphate compound (A) include ammonium polyphosphate, melamine phosphate, dimelamine phosphate, melamine pyrophosphate, melamine polyphosphate, melam polyphosphate, melem polyphosphate, melon polyphosphate, phosphate ester amide Preferred examples include guanidine phosphate. These nitrogen-containing phosphorus flame retardants (A) may be microencapsulated.
On the other hand, a specific example of the organic phosphate compound (B) is preferably “PEKOFLAM STC POWDER (trade name)” (manufactured by Clariant Japan Co., Ltd.).
粘着層中の難燃剤の配合量は、粘着剤100部に対して60〜200部、より好ましくは、100〜150部である。難燃剤の配合量が60部未満の場合、UL510難燃試験に合格することが難しい。また、難燃剤の配合量が200部を超える場合、粘着剤中の難燃剤が2次凝集を起こし、例えば難燃剤を含有した粘着剤を導電性布帛にコーティングした場合、経筋が発生したり、粘着性能が低下したりする。 The compounding quantity of the flame retardant in an adhesion layer is 60-200 parts with respect to 100 parts of adhesives, More preferably, it is 100-150 parts. When the blending amount of the flame retardant is less than 60 parts, it is difficult to pass the UL 510 flame retardant test. Further, when the amount of the flame retardant exceeds 200 parts, the flame retardant in the pressure-sensitive adhesive causes secondary aggregation. For example, when a pressure-sensitive adhesive containing a flame retardant is coated on a conductive fabric, warps are generated. Adhesive performance is reduced.
窒素含有リン酸塩化合物(A)と有機リン酸塩化合物(B)の配合比率は重量を基準として(A):(B)=95:5〜40:60の間で任意に調整すれば良いが、より好ましくは、(A):(B)=90:10〜50:50である。有機リン酸塩化合物(B)が5重量%未満の場合は、窒素含有リン酸化合物(A)の経時での分解を有機リン酸塩化合物(B)で抑制することができず、難燃性が徐々に低下し、UL510燃焼試験に合格しなくなる傾向にある。また、有機リン酸塩化合物(B)が60重量%を超える場合は、2次凝集を起こし易く、例えば難燃剤を含有した粘着剤を導電性布帛にコーティングした場合、経筋が発生したり、粘着性能が低下したりする傾向にある。 The blending ratio of the nitrogen-containing phosphate compound (A) and the organic phosphate compound (B) may be arbitrarily adjusted between (A) :( B) = 95: 5-40: 60 based on the weight. However, More preferably, it is (A) :( B) = 90: 10-50: 50. When the organic phosphate compound (B) is less than 5% by weight, decomposition of the nitrogen-containing phosphate compound (A) over time cannot be suppressed by the organic phosphate compound (B), and flame retardancy Gradually decreases and does not pass the UL510 combustion test. Further, when the organic phosphate compound (B) exceeds 60% by weight, secondary aggregation is likely to occur. For example, when a pressure-sensitive adhesive containing a flame retardant is coated on a conductive fabric, warps are generated, There exists a tendency for adhesive performance to fall.
粘着層を構成する導電剤は、厚み方向の導電性を持たせるために添加される。該導電剤としては、銅、ニッケル、銀、金及び/またはこれらの金属の合金粒子、導電性カーボン粒子などが例示され、無機物などに銅、ニッケル、銀などを被覆した材料も用いられる。また、導電剤の配合量は、粘着剤100部に対して、好ましくは2〜30部、より好ましくは3〜20部である。導電剤の量が2部より少ないと厚み方向に充分な導電性を得ることが難しくなる傾向にある。また、導電剤の量が30部を超えると、難燃性が低下する傾向にある。 The conductive agent constituting the adhesive layer is added to provide conductivity in the thickness direction. Examples of the conductive agent include copper, nickel, silver, gold and / or alloy particles of these metals, conductive carbon particles, and the like, and a material obtained by coating an inorganic substance with copper, nickel, silver, or the like is also used. Moreover, the compounding quantity of a electrically conductive agent becomes like this. Preferably it is 2-30 parts with respect to 100 parts of adhesives, More preferably, it is 3-20 parts. If the amount of the conductive agent is less than 2 parts, it tends to be difficult to obtain sufficient conductivity in the thickness direction. Moreover, when the amount of the conductive agent exceeds 30 parts, the flame retardancy tends to decrease.
また、粘着層中には、本発明の難燃効果を損なわない範囲で、必要に応じて、酸化防止剤、耐候剤、軟化剤、安定剤、充填剤、増量剤、補強剤等の各種添加剤を1種、又は2種以上を組合せて加えることができる。 Further, in the adhesive layer, various additives such as an antioxidant, a weathering agent, a softening agent, a stabilizer, a filler, a bulking agent, and a reinforcing agent are added as necessary within a range not impairing the flame retardant effect of the present invention. An agent can be added 1 type or in combination of 2 or more types.
本発明の粘着テープを製造する方法とてしては、例えば、次の方法を挙げることができる。すなわち、難燃剤及び導電剤の粘着剤であるポリマーへ分散させる。この際、分散方法としては、一般に知られる機械的混練分散法の他に、必要に応じて溶剤分散法、超音波分散法等の公知の方法を用いることができる。このようにして形成された難燃粘着導電剤組成物の塗工方法は、特に限定されるものではないが、例えば、ロールコーターやリバースコーター等で上記導電性布帛の少なくとも片面に1層、又は2層以上塗布され、必要に応じて加熱することにより本発明のテープが得られる。また、シート状、或いはフィルム状の粘着層を導電性布帛にラミネートすることもできる。 Examples of the method for producing the pressure-sensitive adhesive tape of the present invention include the following methods. That is, it is dispersed in a polymer that is an adhesive for the flame retardant and the conductive agent. At this time, as a dispersion method, in addition to a generally known mechanical kneading dispersion method, a known method such as a solvent dispersion method or an ultrasonic dispersion method can be used as necessary. The coating method of the flame retardant adhesive conductive agent composition thus formed is not particularly limited. For example, one layer on at least one surface of the conductive fabric using a roll coater or a reverse coater, or Two or more layers are applied, and the tape of the present invention is obtained by heating as necessary. Further, a sheet-like or film-like adhesive layer can be laminated on the conductive fabric.
粘着層の厚みは、特に限定されないが、テープとしての使用を考えた場合、好ましくは5〜70μm、より好ましくは10〜50μmである。5μm未満の場合、難燃性が不十分でUL510燃焼試験に合格することが難しくなる傾向にある。また、70μmを超える場合、厚み方向の導電性能が低下する恐れがある。 The thickness of the adhesive layer is not particularly limited, but is preferably 5 to 70 μm, more preferably 10 to 50 μm when considering use as a tape. If it is less than 5 μm, the flame retardancy is insufficient and it tends to be difficult to pass the UL510 combustion test. Moreover, when it exceeds 70 micrometers, there exists a possibility that the electroconductive performance of the thickness direction may fall.
以下、本発明を実施例により更に詳細に説明する。なお、実施例において「部」は重量部を示す。また、実施例中で用いた物性は以下の方法により測定した。
(1)難燃性評価(燃焼性試験)
UL510燃焼試験に準じて、燃焼試験を行った。なお、燃焼試験は、サンプル作製直後と、経時での難燃性を確認するため、サンプルを40℃、60%RH下に1ヶ月放置後、これを50℃で30分間乾燥させた後に燃焼試験を行った。
(2)厚み方向の導電性
JIS K 7194に準じて測定し、0.1Ω以下を合格とした。
(3)接着性
JIS L 1096に準じて測定し、剥離強力を接着強力として判断し、接着強力が9N以上で合格とした。
Hereinafter, the present invention will be described in more detail with reference to examples. In the examples, “parts” represents parts by weight. The physical properties used in the examples were measured by the following methods.
(1) Flame resistance evaluation (flammability test)
A combustion test was performed according to the UL510 combustion test. In addition, in order to confirm the flame retardancy immediately after sample preparation and over time, the combustion test was conducted after leaving the sample to stand at 40 ° C. and 60% RH for one month and then drying it at 50 ° C. for 30 minutes. Went.
(2) Conductivity in the thickness direction Measured according to JIS K 7194, and 0.1Ω or less was accepted.
(3) Adhesiveness Measured according to JIS L 1096, the peel strength was judged as adhesive strength, and the adhesive strength was 9N or more and passed.
[実施例1]
56dtex、フィラメント数36本のポリエステル長繊維(帝人ファイバー社製「シルフィル」)を用い、織密度が経140本/インチ、緯105本/インチの2/1ツイルの織物を織成した。
この織物を精練処理した後、無電解メッキ加工を施して、構成繊維表面に厚さ0.7mmの銅金属皮膜を形成させ、引き続いて無電解メッキ加工処理により該銅金属皮膜の上に更に厚さ0.2mmのニッケル金属皮膜を形成させた。
[Example 1]
A 2/1 twill woven fabric having a weaving density of 140 yarns / inch and a weft density of 105 yarns / inch was woven using 56 dtex polyester long fibers having 36 filaments (“Silfil” manufactured by Teijin Fibers Limited).
After scouring the fabric, electroless plating is applied to form a 0.7 mm thick copper metal film on the surface of the constituent fibers, and then the copper metal film is further thickened by electroless plating. A nickel metal film having a thickness of 0.2 mm was formed.
アクリル系粘着剤と窒素含有リン酸塩化合物(A)であるポリリン酸アンモニウムが配合された難燃粘着剤SKダイン1795G(綜研化学社製)を用いた。以下、SKダイン1795Gに配合されているアクリル系粘着剤を100部として他の剤の配合量を示す。なお、上記SKダイン1795G中の窒素含有リン酸塩化合物(A)(ポリリン酸アンモニウム)の配合量は、アクリル系粘着剤100部に対し、100部である。 A flame retardant adhesive SK Dyne 1795G (manufactured by Soken Chemical Co., Ltd.) in which an acrylic adhesive and ammonium polyphosphate, which is a nitrogen-containing phosphate compound (A), were blended was used. Hereinafter, the blending amount of other agents is shown with 100 parts of the acrylic pressure-sensitive adhesive blended in SK Dyne 1795G. In addition, the compounding quantity of the nitrogen containing phosphate compound (A) (ammonium polyphosphate) in said SK dyne 1795G is 100 parts with respect to 100 parts of acrylic adhesives.
上記SKダイン1795Gに、アクリル系粘着剤100部に対し、触媒1部、トルエン25部、有機リン酸塩化合物(B)であるクラリアントジャパン社製「PEKOFLAM STC POWDER」10部、平均粒径35μmのフィラー状の導電剤(ニッケル粉末:ガラスビーズを銀でコーティングした粉末(ガラスビーズ/銀の重量比は92/8)=4:6(重量比))5部を混合し混練機で練り込んだ。その後、導電性織物の裏面にブレードを接触させながら、フローティングナイフ方式でコーティングし、粘着層を形成した。その際、粘着層の塗工厚が20μmとなるようにした。そして、130℃雰囲気下のオーブンにて3分間乾燥した。結果を表1に示す。 SK Dyne 1795G has 1 part of catalyst, 25 parts of toluene, 10 parts of “PEKOFLAM STC POWDER” made by Clariant Japan Co., which is an organic phosphate compound (B), and an average particle size of 35 μm per 100 parts of acrylic adhesive. 5 parts of a filler-like conductive agent (nickel powder: powder of glass beads coated with silver (glass beads / silver weight ratio 92/8) = 4: 6 (weight ratio)) were mixed and kneaded with a kneader. . Thereafter, coating was carried out by a floating knife method while bringing the blade into contact with the back surface of the conductive fabric, thereby forming an adhesive layer. At that time, the coating thickness of the adhesive layer was set to 20 μm. And it dried for 3 minutes in oven in 130 degreeC atmosphere. The results are shown in Table 1.
[実施例2]
実施例2では、有機リン酸塩化合物(B)の配合量を40部とし、フローティングナイフでの塗工厚を25μmとした以外は実施例1と同様にした。結果を表1に示す。
[Example 2]
Example 2 was the same as Example 1 except that the amount of the organophosphate compound (B) was 40 parts and the coating thickness with a floating knife was 25 μm. The results are shown in Table 1.
[実施例3]
実施例3では、導電剤の配合量を20部とし、フローティングナイフでの塗工厚を30μmとした以外は実施例1と同様にした。結果を表1に示す。
[Example 3]
Example 3 was the same as Example 1 except that the blending amount of the conductive agent was 20 parts and the coating thickness with a floating knife was 30 μm. The results are shown in Table 1.
[実施例4]
実施例4では、フローティングナイフでの塗工厚を10μmとした以外は実施例1と同様にした。結果を表1に示す。
[Example 4]
Example 4 was the same as Example 1 except that the coating thickness with a floating knife was 10 μm. The results are shown in Table 1.
[比較例1]
有機リン酸塩化合物(B)を用いなかった以外は実施例1と同じとした。結果を表1に示す。
[Comparative Example 1]
The same as Example 1 except that the organic phosphate compound (B) was not used. The results are shown in Table 1.
[比較例2]
有機リン酸塩化合物(B)10部の代わりに、リン酸エステル系難燃剤(明成化学社製「ホスコンFR−4936」)10部を用いた以外は、実施例1と同じとした。結果を表1に示す。
[Comparative Example 2]
Instead of 10 parts of the organic phosphate compound (B), the same procedure as in Example 1 was carried out except that 10 parts of a phosphate ester flame retardant (“phoscon FR-4936” manufactured by Meisei Chemical Co., Ltd.) was used. The results are shown in Table 1.
[比較例3]
難燃粘着剤「SKダイン1795G」100部に代えて、難燃剤を含有しないアクリル系粘着剤「SKダイン1717」(綜研化学社製)100部を用い、有機リン酸塩化合物(B)であるクラリアントジャパン社製「PEKOFLAM STC POWDER」の配合量を10部から50部に変更した以外は、実施例1と同じとした。結果を表1に示す。
[Comparative Example 3]
Instead of 100 parts of the flame retardant adhesive “SK Dyne 1795G”, 100 parts of an acrylic adhesive “SK Dyne 1717” (manufactured by Soken Chemical Co., Ltd.) containing no flame retardant is used, and is an organic phosphate compound (B). The same as Example 1 except that the blending amount of “PEKOFLAM STC POWDER” manufactured by Clariant Japan was changed from 10 parts to 50 parts. The results are shown in Table 1.
本発明の導電性を有する難燃粘着テープを用いることで、経時での難燃性低下が無く、導電性、接着性に優れたテープとなり、シールディングやグランディングに優れた効果が発揮できる。 By using the conductive flame-retardant adhesive tape of the present invention, the flame retardancy does not deteriorate with time, and the tape has excellent conductivity and adhesiveness, and can exhibit excellent effects in shielding and grounding.
Claims (5)
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WO2014171387A1 (en) * | 2013-04-19 | 2014-10-23 | Dic株式会社 | Conductive adhesive sheet, method for manufacturing same and electronic terminal obtained by using same |
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WO2014171387A1 (en) * | 2013-04-19 | 2014-10-23 | Dic株式会社 | Conductive adhesive sheet, method for manufacturing same and electronic terminal obtained by using same |
CN105164223A (en) * | 2013-04-19 | 2015-12-16 | Dic株式会社 | Conductive adhesive sheet, method for manufacturing same and electronic terminal obtained by using same |
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