JP2009114268A - Remover for polyimide - Google Patents
Remover for polyimide Download PDFInfo
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- JP2009114268A JP2009114268A JP2007286781A JP2007286781A JP2009114268A JP 2009114268 A JP2009114268 A JP 2009114268A JP 2007286781 A JP2007286781 A JP 2007286781A JP 2007286781 A JP2007286781 A JP 2007286781A JP 2009114268 A JP2009114268 A JP 2009114268A
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- JP
- Japan
- Prior art keywords
- weight
- polyimide
- release agent
- water
- polyhydric alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 52
- 239000004642 Polyimide Substances 0.000 title claims abstract description 49
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 41
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910000077 silane Inorganic materials 0.000 claims abstract description 13
- 239000003960 organic solvent Substances 0.000 claims abstract description 11
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 239000001257 hydrogen Substances 0.000 claims abstract description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 24
- -1 silane compound Chemical class 0.000 claims description 16
- 239000000908 ammonium hydroxide Substances 0.000 claims description 11
- 238000009835 boiling Methods 0.000 claims description 11
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 11
- 239000003513 alkali Substances 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 22
- 239000011733 molybdenum Substances 0.000 abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 abstract description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 20
- 230000007797 corrosion Effects 0.000 abstract description 17
- 238000005260 corrosion Methods 0.000 abstract description 17
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 13
- 150000001875 compounds Chemical class 0.000 abstract description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 1
- 230000003113 alkalizing effect Effects 0.000 abstract 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 3
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002798 polar solvent Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000600 sorbitol Substances 0.000 description 3
- 235000010356 sorbitol Nutrition 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 2
- LYCAIKOWRPUZTN-NMQOAUCRSA-N 1,2-dideuteriooxyethane Chemical compound [2H]OCCO[2H] LYCAIKOWRPUZTN-NMQOAUCRSA-N 0.000 description 1
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- FVRSWMRVYMPTBU-UHFFFAOYSA-M 1-hydroxypropyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CCC(O)[N+](C)(C)C FVRSWMRVYMPTBU-UHFFFAOYSA-M 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- BDLXTDLGTWNUFM-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxy]ethanol Chemical compound CC(C)(C)OCCO BDLXTDLGTWNUFM-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 1
- ZFDNAYFXBJPPEB-UHFFFAOYSA-M 2-hydroxyethyl(tripropyl)azanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCO ZFDNAYFXBJPPEB-UHFFFAOYSA-M 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 1
- JTXUAHIMULPXKY-UHFFFAOYSA-N 3-trihydroxysilylpropan-1-amine Chemical compound NCCC[Si](O)(O)O JTXUAHIMULPXKY-UHFFFAOYSA-N 0.000 description 1
- ZOTKGMAKADCEDH-UHFFFAOYSA-N 5-triethoxysilylpentane-1,3-diamine Chemical compound CCO[Si](OCC)(OCC)CCC(N)CCN ZOTKGMAKADCEDH-UHFFFAOYSA-N 0.000 description 1
- OPACOAHIHQCHSR-UHFFFAOYSA-N 6-trimethoxysilylhexane-1,4-diamine Chemical compound NCCCC(CC[Si](OC)(OC)OC)N OPACOAHIHQCHSR-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 150000002169 ethanolamines Chemical class 0.000 description 1
- KVFVBPYVNUCWJX-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)C KVFVBPYVNUCWJX-UHFFFAOYSA-M 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229940102253 isopropanolamine Drugs 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 1
- 239000000811 xylitol Substances 0.000 description 1
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 description 1
- 235000010447 xylitol Nutrition 0.000 description 1
- 229960002675 xylitol Drugs 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C41/00—Preparation of ethers; Preparation of compounds having groups, groups or groups
- C07C41/01—Preparation of ethers
- C07C41/05—Preparation of ethers by addition of compounds to unsaturated compounds
- C07C41/06—Preparation of ethers by addition of compounds to unsaturated compounds by addition of organic compounds only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Emergency Medicine (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Paints Or Removers (AREA)
Abstract
Description
本発明は金属配線(特にアルミニウムおよびモリブデン)を有する液晶基板や半導体基板上のポリイミド配向膜や半導体素子回路の製造に用いられるポリイミド系フォトレジスト等を剥離する際に使用されるポリイミド用剥離剤に関する。 TECHNICAL FIELD The present invention relates to a release agent for polyimide used for peeling a polyimide-based photoresist or the like used for manufacturing a liquid crystal substrate having metal wiring (particularly aluminum and molybdenum), a polyimide alignment film on a semiconductor substrate, and a semiconductor element circuit. .
従来から、アルカリ洗浄液は、油脂類、樹脂、微粒子、樹脂などを除去する能力に優れているので、電子部品、金属部品などの洗浄に多く使用されている。しかし、一般のアルカリ洗浄液はアルミニウムおよびモリブデンを溶解する作用が強く、アルミニウムおよびモリブデンを使用している電子部品などの洗浄には適用しにくいのが現状である。例えばTFT側液晶パネルのポリイミド配向膜を剥離しようとした場合、TFT回路のモリブデン/アルミの積層配線が溶解してしまう。そこで配線部分をワックス等で保護して洗浄し、炭化水素などの溶剤でワックスを除去してガラス基板を再生させる方法等が取られているが、工程が煩雑である。 Conventionally, alkaline cleaning liquids are excellent in the ability to remove oils and fats, resins, fine particles, resins, and the like, and are therefore often used for cleaning electronic parts, metal parts, and the like. However, a general alkaline cleaning solution has a strong action of dissolving aluminum and molybdenum, and is currently difficult to apply to cleaning of electronic parts using aluminum and molybdenum. For example, when the polyimide alignment film of the TFT side liquid crystal panel is to be peeled off, the molybdenum / aluminum laminated wiring of the TFT circuit is dissolved. Therefore, a method of protecting the wiring portion with wax or the like and cleaning it and removing the wax with a solvent such as hydrocarbon to regenerate the glass substrate is taken, but the process is complicated.
また、アルカリ洗浄剤の一種として、半導体素子回路等の製造工程において、フォトレジスト残渣を除去する目的で従来よりアルカリ系剥離剤が使用されてきた。アルカリ系剥離剤には無水のものと含水のものがあり、剥離性の観点から、含水のものが好ましい。しかし、含水アルカリ系剥離剤は基板上の金属配線を溶解するという問題があった。この問題を解決し金属配線などを溶解しないレジスト剥離剤として、第4級アンモニウム水酸化物に各種アルコールを含有する水溶液等が提案されている(例えば、特許文献1参照)。また、金属防食性を向上させる目的で、Si原子を含む化合物を含有するレジスト用剥離剤が知られている(特許文献2参照)。しかし、これらのレジスト剥離剤は、ポリイミドに対する剥離性が不十分である。
このように、これら従来技術を用いてもポリイミド配向膜の剥離性及び金属(特にアルミニウムおよびモリブデン)の防食性を両立できていないのが現状であり、これらの諸問題の改善が要望されていた。 Thus, even if these conventional techniques are used, the present situation is that both the peelability of the polyimide alignment film and the anticorrosion properties of metals (especially aluminum and molybdenum) are not compatible, and improvement of these problems has been demanded. .
したがって、本発明は、金属(特にアルミニウムおよびモリブデン)の腐食を抑えつつ、優れた洗浄性を有するポリイミド用剥離剤を提供することを目的とする。 Accordingly, an object of the present invention is to provide a polyimide release agent having excellent cleaning properties while suppressing corrosion of metals (particularly aluminum and molybdenum).
本発明は、水、アルカリ剤[B]、多価アルコールを除く水溶性有機溶剤[C]、多価アルコール[D]、及び、下記一般式(1)で表わされるシラン系化合物[A]を含有し、前記[C]成分の含有量が30〜95重量%であるポリイミド用剥離剤である。
[(X2N−(CH2)l−)mNH2−m−(CH2)k−]nSi(OR)4−n (1)
但し、式中k、lは1〜4の整数、mは0〜2の整数、nは1〜3の整数を表す。Rは水素又は炭素数1〜4のアルキル基、Xは水素又は炭素1〜4のアルキル基である。
The present invention comprises water, an alkali agent [B], a water-soluble organic solvent excluding polyhydric alcohol [C], polyhydric alcohol [D], and a silane compound [A] represented by the following general formula (1). And a release agent for polyimide having a content of the [C] component of 30 to 95% by weight.
[(X 2 N- (CH 2 ) l -) m NH 2-m - (CH 2) k -] n Si (OR) 4-n (1)
In the formula, k and l are integers of 1 to 4, m is an integer of 0 to 2, and n is an integer of 1 to 3. R is hydrogen or an alkyl group having 1 to 4 carbon atoms, and X is hydrogen or an alkyl group having 1 to 4 carbon atoms.
本発明のポリイミド用剥離剤はポリイミド剥離性に優れ、かつ、金属(特にアルミニウムおよびモリブデン)防食性に優れている。そのため液晶パネル用ガラス基板のTFT側の金属配線にダメージを与えず、ポリイミド配向膜を容易に剥離洗浄することが出来る。また、本発明のポリイミド用剥離剤はカラーフィルターに損傷を与えず、カラーフィルター側のポリイミド配向膜も同様に剥離洗浄できる。さらに、本発明のポリイミド用剥離剤は油分、指紋、樹脂及び微粒子の洗浄性にも優れている。 The polyimide release agent of the present invention is excellent in polyimide peelability and excellent in metal (particularly aluminum and molybdenum) corrosion resistance. Therefore, the polyimide alignment film can be easily peeled and cleaned without damaging the metal wiring on the TFT side of the liquid crystal panel glass substrate. Further, the polyimide release agent of the present invention does not damage the color filter, and the polyimide alignment film on the color filter side can be similarly peeled and washed. Furthermore, the polyimide release agent of the present invention is also excellent in oil, fingerprint, resin and fine particle detergency.
上記シラン系化合物[A]としては、上記一般式(1)で表される化合物であれば特に限定されず、具体的には、例えば、γ−アミノプロピルトリヒドロキシシランおよびその縮合物、γ−(2−アミノエチル)アミノプロピルトリメトキシシラン、γ−(2−アミノエチル)アミノプロピルトリエトキシシラン、γ−(3−アミノプロピル)アミノプロピルトリメトキシシラン等を挙げることができる。その中でも特に好ましいのはγ−(2−アミノエチル)アミノプロピルトリメトキシシランである。上記シラン系化合物[A]は1種を使用してもよく又は2種以上を併用してもよい。 The silane compound [A] is not particularly limited as long as it is a compound represented by the above general formula (1). Specifically, for example, γ-aminopropyltrihydroxysilane and its condensate, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ- (2-aminoethyl) aminopropyltriethoxysilane, γ- (3-aminopropyl) aminopropyltrimethoxysilane and the like can be mentioned. Of these, γ- (2-aminoethyl) aminopropyltrimethoxysilane is particularly preferred. The silane compound [A] may be used alone or in combination of two or more.
本発明においては、上記シラン系化合物[A]の含有量は、0.1〜10重量%が好ましい。シラン系化合物[A]の含有量が0.1重量%未満ではアルミニウムおよびモリブデン防食性が不十分となるおそれがあり、10重量%を超えるとポリイミド剥離性が低下するおそれがある。より好ましくは0.2〜5重量%である。 In the present invention, the content of the silane compound [A] is preferably 0.1 to 10% by weight. If the content of the silane compound [A] is less than 0.1% by weight, the corrosion resistance of aluminum and molybdenum may be insufficient, and if it exceeds 10% by weight, the polyimide peelability may be lowered. More preferably, it is 0.2 to 5% by weight.
本発明で使用されるアルカリ剤[B]としては、アルカリ洗浄に使用可能なものであれば特に限定はなく、公知のアルカリ剤を使用可能であるが、第4級アンモニウム水酸化物[B1]、沸点150℃以上のアルカノールアミン[B2]が好適な例として挙げられる。上記第4級アンモニウム水酸化物[B1]及び沸点150℃以上のアルカノールアミン[B2]は、それぞれ単独でも、又は、両方を併用してもよい。上記第4級アンモニウム水酸化物[B1]は下記一般式(2)で表される。 The alkali agent [B] used in the present invention is not particularly limited as long as it can be used for alkali cleaning, and a known alkali agent can be used, but a quaternary ammonium hydroxide [B1]. Suitable examples include alkanolamines [B2] having a boiling point of 150 ° C. or higher. The quaternary ammonium hydroxide [B1] and the alkanolamine [B2] having a boiling point of 150 ° C. or higher may be used alone or in combination. The quaternary ammonium hydroxide [B1] is represented by the following general formula (2).
式中Rは炭素数1〜3のアルキル基、または炭素数1〜3のヒドロキシ置換アルキル基を表し、R1、R2、R3は、同一又は異なった、炭素数1〜3のアルキル基を表す。第4級アンモニウム水酸化物[B1]としては、具体的には、テトラメチルアンモニウムヒドロキシド、テトラエチルアンモニウムヒドロキシド、テトラプロピルアンモニウムヒドロキシド、トリメチルエチルアンモニウムヒドロキシド、トリメチル(2−ヒドロキシエチル)アンモニウムヒドロキシド、トリプロピル(2−ヒドロキシエチル)アンモニウムヒドロキシド、トリメチル(1−ヒドロキシプロピル)アンモニウムヒドロキシド等が例示できる。これらの中で特に好ましいのはテトラメチルアンモニウムヒドロキシド(以下TMAHと略称する)、テトラエチルアンモニウムヒドロキシド、トリメチル(2−ヒドロキシエチル)アンモニウムヒドロキシドである。上記第4級アンモニウム水酸化物[B1]は1種を使用してもよく又は2種以上を併用してもよい。 In the formula, R represents an alkyl group having 1 to 3 carbon atoms or a hydroxy-substituted alkyl group having 1 to 3 carbon atoms, and R 1 , R 2 , and R 3 are the same or different alkyl groups having 1 to 3 carbon atoms. Represents. Specific examples of the quaternary ammonium hydroxide [B1] include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, trimethylethylammonium hydroxide, and trimethyl (2-hydroxyethyl) ammonium hydroxy. And tripropyl (2-hydroxyethyl) ammonium hydroxide, trimethyl (1-hydroxypropyl) ammonium hydroxide, and the like. Among these, tetramethylammonium hydroxide (hereinafter abbreviated as TMAH), tetraethylammonium hydroxide, and trimethyl (2-hydroxyethyl) ammonium hydroxide are particularly preferable. The quaternary ammonium hydroxide [B1] may be used alone or in combination of two or more.
上記アルカノールアミン[B2]は沸点150℃以上のものが好ましい。沸点150℃未満では使用温度条件40〜80℃で飛散しやすく、臭気の点で好ましくない。沸点150℃以上のアルカノールアミン[B2]としては、例えば、同一分子中にアミノ基とアルコール性水酸基を持つ化合物でモノ、ジ、トリ等のエタノールアミン、イソプロパノールアミン等が挙げられる。これらの中でモノエタノールアミン、ジエタノールアミン、トリエタノールアミンが特に好ましい。上記アルカノールアミン[B2]は1種を使用してもよく又は2種以上を併用してもよい。 The alkanolamine [B2] preferably has a boiling point of 150 ° C. or higher. If the boiling point is less than 150 ° C., it is likely to scatter in the operating temperature condition of 40 to 80 ° C., which is not preferable in terms of odor. Examples of the alkanolamine [B2] having a boiling point of 150 ° C. or higher include compounds having an amino group and an alcoholic hydroxyl group in the same molecule, ethanolamines such as mono, di, and tri, and isopropanolamine. Of these, monoethanolamine, diethanolamine, and triethanolamine are particularly preferable. 1 type may be used for the said alkanolamine [B2], or 2 or more types may be used together.
本発明において、アルカリ剤[B]の含有量は、0.1〜60重量%が好ましく、より好ましくは0.2〜50重量%である。アルカリ剤の含有量が0.1重量%未満ではポリイミド剥離性が不十分である場合があり、60重量%を超えると、粘度が上がり作業性が低下する場合がある。第4級アンモニウム水酸化物[B1]の含有量は、0.1〜10重量%、より好ましくは0.2〜5重量%、沸点150℃以上のアルカノールアミン[B2]の含有量は、5〜55重量%、より好ましくは10〜50重量%である。第4級アンモニウム水酸化物[B1]の含有量が10重量%を超えると、金属腐食性が抑えられない、第4級アンモニウム水酸化物が溶解しない場合がある。 In the present invention, the content of the alkaline agent [B] is preferably 0.1 to 60% by weight, more preferably 0.2 to 50% by weight. When the content of the alkali agent is less than 0.1% by weight, the polyimide peelability may be insufficient, and when it exceeds 60% by weight, the viscosity may increase and the workability may decrease. The content of quaternary ammonium hydroxide [B1] is 0.1 to 10% by weight, more preferably 0.2 to 5% by weight, and the content of alkanolamine [B2] having a boiling point of 150 ° C. or higher is 5%. It is -55 weight%, More preferably, it is 10-50 weight%. When the content of the quaternary ammonium hydroxide [B1] exceeds 10% by weight, the metal corrosivity cannot be suppressed and the quaternary ammonium hydroxide may not be dissolved.
本発明において、水の含有量は、1〜50重量%が好ましく、より好ましくは5〜30重量%である。水の含有量が1重量%未満では第4級アンモニウム水酸化物が溶解せず、50重量%を超えると金属防食性が不十分となるおそれがある。 In the present invention, the water content is preferably 1 to 50% by weight, more preferably 5 to 30% by weight. If the water content is less than 1% by weight, the quaternary ammonium hydroxide does not dissolve, and if it exceeds 50% by weight, the metal anticorrosion property may be insufficient.
本発明における多価アルコールを除く水溶性有機溶剤[C]としては、水溶性有機溶剤であって多価アルコール(2価以上のアルコール)でないものであれば特に限定されないが、25℃の水に対する溶解度(g/100gH2O)が100以上であり、沸点が150℃以上のものが好適に利用できる。沸点150℃未満では使用温度条件(40〜80℃)で飛散しやすく、臭気、安全性の点で好ましくない。具体的にはグリコールエーテル、極性溶剤等が挙げられる。グリコールエーテルとしてはエチルセロソルブ、ブチルセロソルブ、エチレングリコールモノターシャルブチルエーテル、ジエチレングリコールモノブチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル等、極性溶剤としてはジメチルスルホキシド(以下DMSOと略す)、スルホラン、N−メチル−2ピロリドン、γ−ブチロラクタム、フルフラール等が挙げられる。これらの中で、3−メトキシ−3−メチル−1−ブタノール、プロピレングリコール、ジエチレングリコールモノブチルエーテル、DMSO等が好ましく使用できる。これら水溶性有機溶剤は単独または混合して用いてもよい。 The water-soluble organic solvent [C] excluding the polyhydric alcohol in the present invention is not particularly limited as long as it is a water-soluble organic solvent and is not a polyhydric alcohol (dihydric or higher alcohol). Those having a solubility (g / 100 g H 2 O) of 100 or more and a boiling point of 150 ° C. or more can be suitably used. If the boiling point is less than 150 ° C., it tends to scatter under the operating temperature conditions (40 to 80 ° C.), which is not preferable in terms of odor and safety. Specific examples include glycol ethers and polar solvents. As glycol ethers, ethyl cellosolve, butyl cellosolve, ethylene glycol monotertiary butyl ether, diethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, etc. as polar solvents Dimethyl sulfoxide (hereinafter abbreviated as DMSO), sulfolane, N-methyl-2pyrrolidone, γ-butyrolactam, furfural and the like. Among these, 3-methoxy-3-methyl-1-butanol, propylene glycol, diethylene glycol monobutyl ether, DMSO and the like can be preferably used. These water-soluble organic solvents may be used alone or in combination.
本発明において、多価アルコールを除く水溶性有機溶剤[C]の含有量は、30〜95重量%、好ましくは40〜90重量%である。水溶性極性溶剤[C]の含有量が30重量%未満では油脂類、樹脂に対する溶解性が低下し、95重量%を超えると他の成分が少なくなりポリイミド剥離性とアルミニウムおよびモリブデン防食性の両立が困難になるおそれがある。 In the present invention, the content of the water-soluble organic solvent [C] excluding the polyhydric alcohol is 30 to 95% by weight, preferably 40 to 90% by weight. If the content of the water-soluble polar solvent [C] is less than 30% by weight, the solubility in fats and oils and resins decreases, and if it exceeds 95% by weight, other components are reduced and both polyimide peelability and aluminum and molybdenum anticorrosive properties are achieved. May become difficult.
本発明における多価アルコール[D]としては、アルカリ洗浄に使用可能なものであれば特に限定はないが、2〜8価のものが好ましく、具体例としては、エチレングリコール、プロピレングリコール、グリセリン、キシリトール、ソルビトール、マンニトール等が挙げられる。この中で、特に好ましいのはエチレングリコール、グリセリン、ソルビトールである。 The polyhydric alcohol [D] in the present invention is not particularly limited as long as it can be used for alkali cleaning, but is preferably a divalent to octavalent one. Specific examples include ethylene glycol, propylene glycol, glycerin, Examples include xylitol, sorbitol, mannitol and the like. Of these, ethylene glycol, glycerin and sorbitol are particularly preferred.
本発明において、多価アルコール[D]の含有量は、好ましくは1〜50重量%、より好ましくは3〜20重量%である。多価アルコール[D]の含有量が1重量%未満ではアルミニウムおよびモリブデン防食性が不十分となるおそれがあり、50重量%を超えるとポリイミド剥離性が低下するおそれがある。 In the present invention, the content of the polyhydric alcohol [D] is preferably 1 to 50% by weight, more preferably 3 to 20% by weight. If the content of the polyhydric alcohol [D] is less than 1% by weight, the corrosion resistance of aluminum and molybdenum may be insufficient, and if it exceeds 50% by weight, the polyimide peelability may be lowered.
シラン系化合物[A]と2〜8価の多価アルコール[D]は、併用することにより、金属に対する防食性、特にモリブデンに対する防食性が大幅に向上する。 When the silane compound [A] and the divalent to octavalent polyhydric alcohol [D] are used in combination, the corrosion resistance against metals, particularly the corrosion resistance against molybdenum, is greatly improved.
本発明においては、水、上述の[A]、[B1]及び/又は[B2]、25℃の水に対する溶解度(g/100gH2O)が100以上であり、沸点が150℃以上の[C]、並びに、2〜8価の[D]成分の組合せが好ましい。 In the present invention, the solubility (g / 100 gH 2 O) in water, the above-mentioned [A], [B1] and / or [B2], water at 25 ° C. is 100 or more, and the boiling point is 150 ° C. or more [C And combinations of 2 to 8 valent [D] components are preferred.
本発明においては、上述の水、[A]、[B]、[C]、及び[D]成分以外に、本発明の目的を損なわない範囲内で、界面活性剤等一般のアルカリ洗浄液に使用されている添加剤をその他成分[E]として加えることができる。上記成分[E]としては、例えば、炭素数6〜12の分岐脂肪酸石鹸をあげることができる。これら他の成分の配合量は、通常、組成物中、0.01〜10重量%であってよい。 In the present invention, in addition to the above-mentioned water, [A], [B], [C], and [D] components, they are used for general alkaline cleaning liquids such as surfactants within the range not impairing the object of the present invention. Additives that have been added can be added as other components [E]. As said component [E], a C6-C12 branched fatty acid soap can be mention | raise | lifted, for example. The compounding quantity of these other components may be 0.01 to 10 weight% normally in a composition.
本発明のポリイミド用剥離剤は、pH12以上であることが好ましい。pHが11未満の場合、十分なポリイミド剥離性を得られない場合がある。 The polyimide release agent of the present invention preferably has a pH of 12 or more. When pH is less than 11, sufficient polyimide peelability may not be obtained.
本発明のポリイミド用剥離剤は、その粘度が、作業性、剥離性の観点から、20mPa・s(25℃)以下が望ましい。 The viscosity of the release agent for polyimide of the present invention is preferably 20 mPa · s (25 ° C.) or less from the viewpoints of workability and peelability.
本発明のポリイミド用剥離剤は、上記各成分を混合して製造することができる。例えば、[A]、[B1]及び/又は[B2]、[C]、[D]、該当する場合は[E]、並びに水を混合して調製できる。 The release agent for polyimide of the present invention can be produced by mixing the above components. For example, it can be prepared by mixing [A], [B1] and / or [B2], [C], [D], and [E], and water if applicable.
本発明のポリイミド用剥離剤の使用方法を以下に例示する。ただし、本発明はこの例に限定されるものではない。まず、ポリイミド配向膜が形成された基板(ガラス等の基板)を用意する。上記ポリイミド配向膜の材料としては、例えば、ポリイミド樹脂、カップリング剤、エチレングリコールモノブチルエーテル及びN−メチル−2−ピロリドン(NMP)を主成分とするポリイミド配向膜材料等のポリイミド系材料であってよい。次に、この基板のポリイミド配向膜を本発明のポリイミド用剥離剤中に、例えば室温〜80℃、1〜10分間浸せきする。このとき、必要により剥離剤を攪拌するか、又は基板を振動してもよい。または、本発明の剥離剤を基板にシャワーやスプレー等で吹き付けることもできる。この際、ブラシ洗浄を併用することにより、ポリイミド配向膜除去性を向上させることもできる。ポリイミド配向膜を溶解又は剥離した後、好ましくは純水で、溶解したポリイミド配向膜を含む剥離剤を洗浄除去し、ポリイミド配向膜を基板上から除去する。その後、エアナイフ等で、基板上の液体を吹き飛ばし、基板を乾燥させる。 The usage method of the release agent for polyimides of this invention is illustrated below. However, the present invention is not limited to this example. First, a substrate (substrate such as glass) on which a polyimide alignment film is formed is prepared. Examples of the material for the polyimide alignment film include polyimide materials such as a polyimide alignment film material mainly composed of a polyimide resin, a coupling agent, ethylene glycol monobutyl ether, and N-methyl-2-pyrrolidone (NMP). Good. Next, the polyimide alignment film of this substrate is immersed in the release agent for polyimide of the present invention, for example, at room temperature to 80 ° C. for 1 to 10 minutes. At this time, if necessary, the release agent may be stirred or the substrate may be vibrated. Alternatively, the release agent of the present invention can be sprayed onto the substrate with a shower or spray. At this time, the polyimide alignment film removability can be improved by using brush cleaning together. After dissolving or peeling the polyimide alignment film, the release agent containing the dissolved polyimide alignment film is preferably washed away with pure water, and the polyimide alignment film is removed from the substrate. Thereafter, the liquid on the substrate is blown off with an air knife or the like, and the substrate is dried.
次に本発明を実施例により具体的に説明するが、本発明はこれら実施例により限定されるものではない。 EXAMPLES Next, although an Example demonstrates this invention concretely, this invention is not limited by these Examples.
実施例1〜7、比較例1〜10
表1記載の各成分部数(重量部)(純分表示)を1Lビーカー中に入れ、室温で充分攪拌して実施例及び比較例のポリイミド用剥離剤を調製した。
表1中の略号は以下の通りである。
A成分(シラン系化合物)
A1:γ−(2−アミノエチル)アミノプロピルトリメトキシシラン
A2:1,6−ビス(トリメトキシシリル)ヘキサン
B成分(アルカリ剤)
B1:テトラメチルアンモニウムヒドロキシド
B2a:エタノールアミン
B2b:トリエタノールアミン
C成分(水溶性有機溶剤)
C1:DMSO
C2:ジエチレングリコールモノメチルエーテル
D成分(多価アルコール)
D1:エチレングリコール
D2:グリセリン
D3:ソルビトール
Examples 1-7, Comparative Examples 1-10
The component parts (parts by weight) shown in Table 1 (parts expressed by weight) were put in a 1 L beaker and sufficiently stirred at room temperature to prepare polyimide release agents for Examples and Comparative Examples.
Abbreviations in Table 1 are as follows.
A component (silane compound)
A1: γ- (2-aminoethyl) aminopropyltrimethoxysilane A2: 1,6-bis (trimethoxysilyl) hexane B component (alkali agent)
B1: Tetramethylammonium hydroxide B2a: Ethanolamine B2b: Triethanolamine C component (water-soluble organic solvent)
C1: DMSO
C2: Diethylene glycol monomethyl ether D component (polyhydric alcohol)
D1: Ethylene glycol D2: Glycerin D3: Sorbitol
実施例及び比較例で得られたポリイミド用剥離剤の評価試験方法を以下に示し、評価結果を表1に示す。
1.ポリイミド配向膜(以下、単に配向膜)剥離性
ポリイミド樹脂、カップリング剤、エチレングリコールモノブチルエーテル及びNMPを主成分とする配向膜材料をガラス基板上に塗布し、120℃で60分間焼成した1μmのポリイミド膜を剥離対象物とした。この1×4cmに切断した基板の塗布面を上にしてアルカリ洗浄液中に40℃で所定時間(1分、2分)、浸漬した。その後、取り出し、純水で洗浄し、N2ガスを用いたエアーガンで純水を吹き飛ばし、自然乾燥させた。それぞれ、処理後の基板を顕微鏡で観察し配向膜剥離性を次の5段階で評価した。
<評価基準>
5:ガラス基板上に配向膜が全くなし
4:ガラス基板上に配向膜が痕跡程度残っている
3:ガラス基板上の一部に配向膜が少し残っている
2:ガラス基板上の大部分に配向膜が残っている
1:ガラス基板上の全面に配向膜が残っている
The evaluation test method of the release agent for polyimides obtained in Examples and Comparative Examples is shown below, and the evaluation results are shown in Table 1.
1. Polyimide alignment film (hereinafter simply referred to as alignment film) releasability An alignment film material composed mainly of a polyimide resin, a coupling agent, ethylene glycol monobutyl ether and NMP is applied onto a glass substrate, and baked at 120 ° C. for 60 minutes. A polyimide film was an object to be peeled. The substrate was cut into 1 × 4 cm, and the substrate was dipped in an alkali cleaning solution at 40 ° C. for a predetermined time (1 minute, 2 minutes). Then, it took out, washed with pure water, blown off pure water with an air gun using N 2 gas, and naturally dried. Each of the treated substrates was observed with a microscope, and the alignment film peelability was evaluated in the following five stages.
<Evaluation criteria>
5: There is no alignment film on the glass substrate 4: Traces of the alignment film remain on the glass substrate 3: A little alignment film remains on a part of the glass substrate 2: Most of the alignment film on the glass substrate The alignment film remains 1: The alignment film remains on the entire surface of the glass substrate
2.アルミ防食性
3cm×4cmの純アルミ板をポリイミド用剥離剤中に70℃24時間浸せきし、水素ガス発生状況及び重量減少率を測定した。算出方法は以下のとおり。
重量減少率(%)=100×(W0−W1)/W0
[W0:元のアルミ板重量(g)、W1:70℃、24時間浸せき後のアルミ板重量(g)]
また、重量減少率と同時に、水素ガスの発生状況も、下記の評価基準で観察した。
<評価基準>
5:水素ガスの発生が全くない
4:水素ガスの発生が極わずかに認められる
3:水素ガスの発生がやや認められる
2:水素ガスの発生がかなり認められる
1:水素ガスの発生が激しく認められる
2. Aluminum Corrosion Resistance A pure aluminum plate of 3 cm × 4 cm was immersed in a release agent for polyimide at 70 ° C. for 24 hours, and the hydrogen gas generation status and weight reduction rate were measured. The calculation method is as follows.
Weight reduction rate (%) = 100 × (W0−W1) / W0
[W0: Original aluminum plate weight (g), W1: Aluminum plate weight after immersion for 24 hours at 70 ° C. (g)]
In addition to the weight reduction rate, the hydrogen gas generation status was also observed according to the following evaluation criteria.
<Evaluation criteria>
5: No generation of hydrogen gas 4: Little generation of hydrogen gas is observed slightly 3: Generation of hydrogen gas is slightly recognized 2: Generation of hydrogen gas is fairly recognized 1: Generation of hydrogen gas is observed violently Be
3.モリブデン防食性
モリブデンが蒸着されたガラス基板10mm×10mmと、ポリイミド用剥離剤を70mLの広口瓶に入れ、モリブデン蒸着面を上にした状態で70℃に保持した。処理開始から24時間経過後のモリブデン蒸着面の外観変化を下記の評価基準で観察した。
<評価基準>
○:変化なし
△:黒色に変化する
×:モリブデン膜が溶解して消失する。
3. Molybdenum anticorrosive property A glass substrate 10 mm × 10 mm on which molybdenum was vapor-deposited and a polyimide release agent were placed in a 70 mL wide-mouth bottle, and kept at 70 ° C. with the molybdenum vapor-deposited surface facing up. The appearance change of the molybdenum deposition surface after 24 hours from the start of the treatment was observed according to the following evaluation criteria.
<Evaluation criteria>
○: No change Δ: Change to black ×: Molybdenum film dissolves and disappears.
表1の結果から、シラン化合物[A]、アルカリ剤[B]、多価アルコールを除く水溶性有機溶剤[C]、多価アルコール[D]、水を用いた本発明のポリイミド用剥離剤はpHが12以上あるにもかかわらず、アルミニウムおよびモリブデン防食性が極めて良好で、配向膜剥離性/アルミニウムおよびモリブデン防食性を両立することが判る(実施例1〜7)。一方[A]成分と[D]成分を含まない組成物(比較例1)および[A]成分を含まず、[B]成分を大量に含む組成物(比較例8)はアルミ防食性およびモリブデン防食性が劣る。[D]成分を含むが[A]成分を含まない組成物(比較例2)および、[A]成分を含むが[D]成分を含まない組成物(比較例5および7)は、アルミ防食性には優れるものの、モルブデン防食性が劣る。[A]、[B]、[D]の各成分を含むが[C]成分を含まない組成物(比較例3)および[A]、[B]、[C]、[D]の各成分を含むが[C]成分の含有量が少ない組成物(比較例10)、は、アルミ防食性に優れるが、モリブデン防食性に劣り、配向膜の剥離ができない。先行文献1(特開2005−336470号公報)記載の組成物(比較例4)は配向膜剥離性とアルミ防食性が共に不十分である。先行文献2(特許3410369号公報)に記載されているが本発明には該当しないシラン系化合物を含む組成物(比較例6および9)は、モリブデン防食性が劣る。 From the results in Table 1, the release agent for polyimide of the present invention using silane compound [A], alkali agent [B], water-soluble organic solvent excluding polyhydric alcohol [C], polyhydric alcohol [D], and water is as follows. Although the pH is 12 or more, it can be seen that the corrosion resistance of aluminum and molybdenum is extremely good, and both the alignment film peelability / aluminum and molybdenum corrosion resistance are compatible (Examples 1 to 7). On the other hand, the composition containing no [A] component and [D] component (Comparative Example 1) and the composition containing no [A] component and containing a large amount of [B] component (Comparative Example 8) have aluminum corrosion resistance and molybdenum. Corrosion protection is inferior. The composition containing [D] component but not containing [A] component (Comparative Example 2) and the composition containing [A] component but not containing [D] component (Comparative Examples 5 and 7) Although it is excellent in properties, it is inferior in the anti-corrosive properties of Morbden. A composition containing each component of [A], [B] and [D] but not containing the component [C] (Comparative Example 3) and each component of [A], [B], [C] and [D] The composition (Comparative Example 10) containing a small amount of the component [C] is excellent in aluminum corrosion resistance, but is inferior in molybdenum corrosion resistance, and the alignment film cannot be peeled off. The composition (Comparative Example 4) described in Prior Document 1 (Japanese Patent Laid-Open No. 2005-336470) is insufficient in both alignment film peelability and aluminum corrosion resistance. Compositions (Comparative Examples 6 and 9) containing a silane compound which is described in Prior Document 2 (Japanese Patent No. 3410369) but does not fall under the present invention are inferior in molybdenum corrosion resistance.
Claims (6)
[(X2N−(CH2)l−)mNH2−m−(CH2)k−]nSi(OR)4−n (1)
[但し、式中k、lは1〜4の整数、mは0〜2の整数、nは1〜3の整数を表す。Rは水素又は炭素数1〜4のアルキル基、Xは水素又は炭素1〜4のアルキル基である。] Water, alkaline agent [B], water-soluble organic solvent excluding polyhydric alcohol [C], polyhydric alcohol [D], and silane compound [A] represented by the following general formula (1), The release agent for polyimides whose content of [C] component is 30 to 95 weight%.
[(X 2 N- (CH 2 ) l -) m NH 2-m - (CH 2) k -] n Si (OR) 4-n (1)
[Wherein, k and l are integers of 1 to 4, m is an integer of 0 to 2, and n is an integer of 1 to 3. R is hydrogen or an alkyl group having 1 to 4 carbon atoms, and X is hydrogen or an alkyl group having 1 to 4 carbon atoms. ]
Priority Applications (2)
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JP2007286781A JP2009114268A (en) | 2007-11-02 | 2007-11-02 | Remover for polyimide |
KR1020080106459A KR20090045859A (en) | 2007-11-02 | 2008-10-29 | Stripping agent for polyimide |
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JP2007286781A JP2009114268A (en) | 2007-11-02 | 2007-11-02 | Remover for polyimide |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013049753A (en) * | 2011-08-30 | 2013-03-14 | Dongwoo Fine-Chem Co Ltd | Detergent composition and method of using the same to manufacture array substrate for liquid crystal display device |
CN110423202A (en) * | 2019-08-22 | 2019-11-08 | 四川羽玺电子科技有限公司 | A kind of fluorine-containing mould release and preparation method thereof |
WO2022024820A1 (en) * | 2020-07-29 | 2022-02-03 | 東洋紡株式会社 | Production method for flexible electronic device |
WO2023243666A1 (en) * | 2022-06-17 | 2023-12-21 | 花王株式会社 | Production method for semiconductor substrate |
WO2023243661A1 (en) * | 2022-06-17 | 2023-12-21 | 花王株式会社 | Cleaning composition for adhesives |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101880308B1 (en) | 2012-05-24 | 2018-07-19 | 동우 화인켐 주식회사 | A photoresist stripper composition for manufacturing of thin film transistor and method for manufacturing of thin film transistor using the same |
CN113176718B (en) * | 2021-05-06 | 2021-12-14 | 肇庆微纳芯材料科技有限公司 | Polyimide stripping liquid, preparation method thereof and cleaning method of polyimide film |
-
2007
- 2007-11-02 JP JP2007286781A patent/JP2009114268A/en active Pending
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2008
- 2008-10-29 KR KR1020080106459A patent/KR20090045859A/en not_active Application Discontinuation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013049753A (en) * | 2011-08-30 | 2013-03-14 | Dongwoo Fine-Chem Co Ltd | Detergent composition and method of using the same to manufacture array substrate for liquid crystal display device |
CN110423202A (en) * | 2019-08-22 | 2019-11-08 | 四川羽玺电子科技有限公司 | A kind of fluorine-containing mould release and preparation method thereof |
WO2022024820A1 (en) * | 2020-07-29 | 2022-02-03 | 東洋紡株式会社 | Production method for flexible electronic device |
WO2023243666A1 (en) * | 2022-06-17 | 2023-12-21 | 花王株式会社 | Production method for semiconductor substrate |
WO2023243661A1 (en) * | 2022-06-17 | 2023-12-21 | 花王株式会社 | Cleaning composition for adhesives |
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