JP2009105326A5 - - Google Patents

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Publication number
JP2009105326A5
JP2009105326A5 JP2007277827A JP2007277827A JP2009105326A5 JP 2009105326 A5 JP2009105326 A5 JP 2009105326A5 JP 2007277827 A JP2007277827 A JP 2007277827A JP 2007277827 A JP2007277827 A JP 2007277827A JP 2009105326 A5 JP2009105326 A5 JP 2009105326A5
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JP
Japan
Prior art keywords
substrate
support plate
substrates
hole
obtaining
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Application number
JP2007277827A
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English (en)
Japanese (ja)
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JP5230992B2 (ja
JP2009105326A (ja
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Priority to JP2007277827A priority Critical patent/JP5230992B2/ja
Priority claimed from JP2007277827A external-priority patent/JP5230992B2/ja
Publication of JP2009105326A publication Critical patent/JP2009105326A/ja
Publication of JP2009105326A5 publication Critical patent/JP2009105326A5/ja
Application granted granted Critical
Publication of JP5230992B2 publication Critical patent/JP5230992B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007277827A 2007-10-25 2007-10-25 貫通電極付き基板の製造方法 Expired - Fee Related JP5230992B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007277827A JP5230992B2 (ja) 2007-10-25 2007-10-25 貫通電極付き基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007277827A JP5230992B2 (ja) 2007-10-25 2007-10-25 貫通電極付き基板の製造方法

Publications (3)

Publication Number Publication Date
JP2009105326A JP2009105326A (ja) 2009-05-14
JP2009105326A5 true JP2009105326A5 (https=) 2010-08-05
JP5230992B2 JP5230992B2 (ja) 2013-07-10

Family

ID=40706704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007277827A Expired - Fee Related JP5230992B2 (ja) 2007-10-25 2007-10-25 貫通電極付き基板の製造方法

Country Status (1)

Country Link
JP (1) JP5230992B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5547566B2 (ja) * 2010-06-29 2014-07-16 株式会社アドバンテスト 貫通配線基板の製造方法
JP5877932B1 (ja) 2014-02-26 2016-03-08 日本碍子株式会社 貫通孔を有する絶縁基板
FR3042308B1 (fr) * 2015-10-13 2018-02-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Boitier pour composants microelectroniques

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
JP2006287211A (ja) * 2005-03-08 2006-10-19 Sharp Corp 半導体装置、積層半導体装置およびそれらの製造方法

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