JP2009105095A - Device and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a means improving reliability without degrading a high-frequency characteristic of a BGA semiconductor device. <P>SOLUTION: The device 101 mounted on the upper surface of a device mounting board 2, and electrically connected to a plurality of electrodes 21 on the device mounting board includes: a component mounting board 1 having an electronic component 41 mounted thereon, and having, on the undersurface, a plurality of electrodes 14 to be respectively electrically connected to corresponding electrodes on the device mounting board; one or more intermediate boards 3 at least one of which is stacked and arranged between the component mounting board and the device mounting board, and which have a plurality of electrodes 31 and 33 on the upper surface and the lower surface, respectively, wherein the corresponding electrodes on the upper surface and the lower surface are electrically connected to each other; and a plurality of terminal balls 51a respectively connecting the corresponding electrodes between the respective boards such as the component mounting board, the intermediate board and the device mounting board. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a device and an apparatus. In particular, the present invention relates to a device mounted on the upper surface of a device mounting board and electrically connected to a plurality of electrodes on the device mounting board, and an apparatus including the device and the device mounting board.

  A semiconductor device mounted on a device mounting board (for example, a printed wiring board) by a BGA (Ball Grid Array) is electrically and mechanically connected to a plurality of electrodes on the upper surface of the device mounting board (printed wiring board) by, for example, terminal balls. Connected to. When the temperature rises due to heat generated when a BGA semiconductor device or the like operates, the BGA semiconductor device itself expands, but the device mounting substrate on which the BGA semiconductor device is mounted also expands.

  When the thermal expansion coefficients of the BGA semiconductor device and the device mounting substrate are different and the temperature rises, the terminal ball connection portion has a difference in position change between the BGA semiconductor device side and the device mounting substrate due to the difference in the thermal expansion coefficient. A stress (stress) is generated that tries to eliminate this. If this stress exceeds the limit that can be absorbed by the terminal ball connecting portion, cracks may occur in the terminal ball connecting portion.

In order to suppress the occurrence of this crack, it is conceivable to increase the diameter of the terminal ball. When the diameter of the terminal ball of the BGA semiconductor device is increased, the distance between the BGA semiconductor device and the device mounting substrate is increased, so that it is easier to absorb the misalignment between the two, and the generation of cracks can be suppressed. Thus, when the diameter of the terminal ball of the BGA semiconductor device is increased, the reliability of the BGA semiconductor device is improved. Patent Document 1 describes that an intermediate layer is provided between a semiconductor chip and a substrate.
JP 2000-77479 A

  However, when the diameter of the terminal ball of the BGA semiconductor device is increased, the capacitance component between adjacent terminal balls increases. As a result, the high frequency component of the signal input / output to / from the BGA semiconductor device may be attenuated, and the high frequency characteristics of the BGA semiconductor device may be deteriorated.

  In order to solve the above problems, according to a first aspect of the present invention, there is provided a device mounted on an upper surface of a device mounting board and electrically connected to a plurality of electrodes on the device mounting board, wherein the electronic component A component mounting board having a plurality of electrodes on the lower surface, each of which is to be electrically connected to a corresponding electrode on the device mounting board, and at least one between the component mounting board and the device mounting board. An intermediate board that is provided in an overlapping manner and has a plurality of electrodes on each of the upper surface and the lower surface, and the corresponding electrodes on the upper surface and the lower surface are electrically connected, the component mounting board, the intermediate board, and the device mounting Provided is a device comprising a plurality of terminal balls for connecting corresponding electrodes between substrates.

  According to a second aspect of the present invention, there is provided a device mounting substrate, and a device mounted on an upper surface of the device mounting substrate and electrically connected to a plurality of electrodes on the device mounting substrate. Is a component mounting board having a plurality of electrodes on the lower surface, each of which is mounted with an electronic component and each of which should be electrically connected to a corresponding electrode on the device mounting board, and between the component mounting board and the device mounting board At least one of the intermediate board having a plurality of electrodes on each of the upper surface and the lower surface, and the corresponding electrodes on the upper surface and the lower surface are electrically connected, the component mounting substrate, the intermediate substrate, And a device having a plurality of terminal balls respectively connecting corresponding electrodes between the substrates of the device mounting substrate.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 shows an example of the configuration of the device 101 according to the present embodiment. According to one embodiment of the present invention, a terminal ball connection device that improves the reliability of the device 101 and does not deteriorate the high-frequency characteristics of the device 101 and an apparatus using the device are provided.

  The apparatus 100 of this embodiment is a semiconductor package, for example, and includes a device 101 and a device mounting board 2. The device 101 is, for example, a BGA semiconductor device, and includes a component mounting portion 91, the intermediate substrate 3, and a plurality of terminal balls 51. The device 101 is electrically connected to the plurality of electrodes 21 on the device mounting substrate 2 by a plurality of terminal balls 51b in the lowermost layer while being mounted on the upper surface of the device mounting substrate 2.

  The component mounting portion 91 includes a component mounting substrate 1 having a plurality of electrodes 14 on the lower surface, each of which is to be electrically connected to a corresponding electrode 21 on the device mounting substrate 2, and a plurality of components mounted on the component mounting substrate 1. Including parts. Details of the component mounting portion 91 will be described later.

  The intermediate substrate 3 is provided between the component mounting substrate 1 and the device mounting substrate 2 in parallel with the lower surface of the component mounting substrate 1 and the upper surface of the device mounting substrate 2. The intermediate board 3 absorbs a difference in position change due to a difference in thermal expansion coefficient between the component mounting board 1 and the device mounting board 2. The intermediate substrate 3 may be a flexible substrate using, for example, a flexible polyimide film. Instead, the intermediate substrate 3 may have a coefficient of thermal expansion between the component mounting substrate 1 and the device mounting substrate 2.

  For example, the intermediate substrate 3 may include a plurality of electrodes 31 disposed on the upper surface and a plurality of electrodes 33 disposed on the lower surface. The electrodes 31 and 33 corresponding to each other are electrically connected by, for example, conductive vias 34 penetrating the intermediate substrate 3.

  Further, the electrodes 31 and 33 are provided at positions where the corresponding electrodes overlap each other in the surface direction A of the substrate, and further correspond to the corresponding electrodes 21 on the upper surface of the device mounting substrate 2 and the lower surface of the component mounting substrate 1. The electrode 14 to be formed may be provided at a position overlapping in the surface direction A of the substrate. In that case, the corresponding electrode 14, terminal ball 51 a, electrode 31, electrode 33, terminal ball 51 b and electrode 21 are all arranged in a line in the vertical direction of the substrate.

  The plurality of terminal balls 51a provided on the upper side of the intermediate substrate 3 electrically and mechanically connect the corresponding electrodes 14 and electrodes 31 between the component mounting substrate 1 and the intermediate substrate 3, respectively. The plurality of terminal balls 51b provided on the lower side of the intermediate substrate 3 electrically and mechanically connect the corresponding electrodes 33 and the electrodes 21 between the intermediate substrate 3 and the device mounting substrate 2 respectively. Accordingly, the corresponding combinations of the plurality of electrodes 14, terminal balls 51 a, electrodes 31, electrodes 33, terminal balls 51 b, and electrodes 21 are all electrically connected.

  Here, details of the component mounting portion 91 in the present embodiment will be described. The component mounting substrate 1 is a substrate in which a dielectric low temperature co-fired ceramic (LTCC) or other types of ceramics are used as an example, and wiring patterns of various electric circuits (particularly high frequency circuits) are formed on the upper surface thereof. (Ceramic substrate) may be used. The component mounting substrate 1 has a plurality of input / output electrodes 14 arranged on the lower surface. Each electrode 14 is electrically connected to a corresponding electrode 21.

  Further, the component mounting board 1 has a pattern wiring 44a formed on the upper surface side, and the mounting component 43 is connected to the pattern wiring 44a. The mounting component 43 may be, for example, an electronic component such as a transistor, a diode, a resistor, a capacitor, or a coil, a semiconductor integrated circuit chip 41 on which the electronic component or the like is integrated, or a mechanical component such as a heat sink. The mounting component 43 is electrically and mechanically connected to the corresponding pattern wiring 44a by solder or the like. The pattern wiring 44a disposed on the upper surface of the component mounting substrate 1 and the electrode 14 disposed on the lower surface are electrically connected by vias 15a penetrating all the component mounting substrates as necessary. The via 15a may be a through hole formed so as to penetrate the component mounting board 1 with a conductive material, for example.

  Further, the component mounting substrate 1 may be a multilayer substrate in which a plurality of substrates such as a ceramic upper layer substrate 11, a middle layer substrate 12, and a lower layer substrate 13 are laminated. In that case, a pattern wiring 44 b may be formed between the upper layer substrate 11 and the middle layer substrate 12, and a pattern wiring 44 c may be formed between the middle layer substrate 12 and the lower layer substrate 13. In this case, the pattern wiring 44a disposed on the upper surface of the upper layer substrate 11 and the electrode 14 disposed on the lower surface of the lower layer substrate 13 include the pattern wiring 44b or the pattern wiring 44c and, if necessary, an individual substrate of a component mounting substrate. They may be electrically connected by vias 15b penetrating through them. For example, the via 15b penetrates at least one layer of the upper layer substrate 11, the middle layer substrate 12, and the lower layer substrate 13 to electrically connect the corresponding upper and lower electrodes such as the pattern wiring 44b and the pattern wiring 44c. Provided.

  Further, when the component mounting board 1 is a multilayer board, a recess 40 in which a part of the upper layer board 11 is cut out may be provided. A lid 45 may be disposed on the upper side of the recess 40 so as to close the recess 40. The pattern wiring 44 a connected to the lid 45 is electrically connected to the ground electrode of the electrodes 14 formed on the lower surface of the component mounting board 1 through, for example, a plurality of vias 15 a provided in the component mounting board 1. May be. Thereby, the cover part 45 can be made into a grounding potential.

  The device mounting board 2 may be a glass epoxy board or the like. Moreover, wiring patterns of various electric circuits may be formed on the upper surface of the device mounting substrate 2. In addition, the device mounting substrate 2 may be formed with, for example, a plurality of electrodes 21 with a wiring pattern.

  The electrode 21 is an electrode that is solder-connected to the terminal ball 51, and may be formed in a shape such as a circle having a diameter similar to the diameter of the terminal ball 51, or a square circumscribing the circle. The terminal ball 51 is formed by forming a conductive bonding material such as solder into a minute spherical shape, and is also referred to as a solder ball.

  In the present embodiment, the distance L1 between the component mounting board 1 and the device mounting board 2 is, for example, the distance L2 between the component mounting board 1 and the intermediate board 3 and the intermediate board 3 and the device mounting board when the thickness dimension of each electrode is ignored. 2 is the sum of the interval L3 and the thickness L4 of the intermediate substrate 3. For example, when the interval L2 and the interval L3 are substantially the same, the interval L2 and the interval L3 are each smaller than approximately ½ of the interval L1. In the present embodiment, the values of the interval L2 and the interval L3 are substantially the same, but the present invention is not limited to this. For example, the values of both are set such that the upper interval L2 is smaller than the lower interval L3. Even when the values are different, the same effect as in the present embodiment can be obtained.

  On the other hand, when the distance L2 and the distance L3 are substantially the same, the diameter D1 of the terminal ball 51a and the diameter D2 of the terminal ball 51b may be substantially the same. Since the upper and lower ends of the terminal ball 51a and the terminal ball 51b are crushed and deformed, they can be regarded as substantially spherical. Therefore, when ignoring the thickness of each electrode, the distance L2, the distance L3, the diameter D1, and the diameter D2 Are substantially similar (or approximate) values. In this case, the diameter D1 and the diameter D2 are values smaller than approximately ½ of the distance L1.

  Thereby, according to the apparatus 100, compared with the case where the single-layer terminal ball 51a is used without using the intermediate substrate 3, the interval between the component mounting substrate 1 and the device mounting substrate 2 can be increased. Can be absorbed better. Further, when the diameter of the terminal ball 51 is doubled without using the intermediate substrate 3, the stress can be absorbed better, but the capacitance component between the terminal balls 51 is increased, and the high frequency component of the signal is further attenuated. End up.

  On the other hand, according to the apparatus 100, the distance L1 between the component mounting board 1 and the device mounting board 2 can be kept large to improve the reliability of the device 101. Further, the diameter D1 of the terminal ball 51a and the terminal ball 51b Since the diameter D2 is not increased, the high frequency characteristics are not deteriorated. Therefore, according to the apparatus 100, it is possible to increase the device mounting density and improve the reliability without deteriorating the high frequency characteristics.

  In the device 101 of the present embodiment, the difference in position change due to the coefficient of thermal expansion between the component mounting substrate 1 and the device mounting substrate 2 increases as the distance from the central portion to the peripheral portion increases. Therefore, the stress generated in the terminal ball connection is also greater in the peripheral portion than in the central portion of the device 101. For the purpose of alleviating the stress in the peripheral portion, it may be formed as a set of a plurality of intermediate partial substrates separated from each other. In that case, the intermediate substrate 3 may be separated into an intermediate partial substrate in the central portion and an intermediate partial substrate in the peripheral portion, and the intermediate partial substrate in the peripheral portion is made smaller than the intermediate partial substrate in the central portion. May be. When the intermediate partial substrate is made smaller, the number of electrodes 31 on the surface is reduced.

  FIG. 2 shows an example in which the structure in which the intermediate substrate 3 is divided into a plurality of intermediate partial substrates 3c to 3g is viewed from above. For example, reference numeral 3 in FIG. 1 corresponds to the BB cross section in FIG. In the following description, the left front side, right front side, center, left rear side, right rear side, etc. are for the purpose of discriminating a plurality of substrates, and are the front, rear, left and right when applied to actual products etc. May be different.

  The intermediate partial substrate 3 c is disposed in the central portion of the device 101. The intermediate partial board 3c is provided at a position far from the side of the device mounting board 2 with respect to the intermediate partial board 3g from the intermediate partial board 3d. The intermediate partial substrate 3d to the intermediate partial substrate 3g are provided at positions close to the sides of the device mounting substrate 2 with respect to the intermediate partial substrate 3c.

  The intermediate partial substrate 3d may be an intermediate substrate disposed at the left front end portion of the side ends of the device 101. The intermediate partial substrate 3e may be an intermediate substrate disposed at the right front end portion of the side ends of the device 101. The intermediate partial substrate 3f may be an intermediate substrate disposed at the right rear end portion of the side ends of the device 101. The intermediate partial substrate 3g may be an intermediate substrate disposed at the left rear end portion of the side ends of the device 101.

  The intermediate partial substrate 3d to the intermediate partial substrate 3g have the electrodes 31 closer to the sides of the device mounting substrate 2 than the electrodes 31 of the intermediate partial substrate 3c closest to the sides of the device mounting substrate 2. In other words, the intermediate partial substrate 3c does not have other electrodes 31 provided at positions closer to the side of the component mounting substrate 1 than at least one electrode 31 included in the intermediate partial substrate 3g to the intermediate partial substrate 3g. . Of the intermediate partial boards, the intermediate boards 3d to 3g have a configuration in which the average position of the terminal balls (electrodes 31) is closer to the side of the component mounting board 1 than the intermediate board 3c in the central part. It's okay.

  Further, as in the present example, the intermediate partial substrate 3c has other electrodes provided at positions farther from the center of the component mounting substrate 1 than at least one electrode 31 included in the intermediate partial substrate 3g from the intermediate partial substrate 3d. You may take the structure which does not have 31. FIG. Here, the center of the component mounting board 1 may be the center of gravity of the component mounting board 1 as an example, or may be a position obtained by averaging the positions of the plurality of electrodes 31 on the component mounting board 1. The intermediate partial board 3c is not connected to the electrode 14 provided at a position close to the side of the component mounting board 1.

  The intermediate partial boards 3c, 3d, 3e, 3f, and 3g are separated from each other, and by combining them, the plurality of electrodes 14 provided on the component mounting board 1 and the correspondence provided on the device mounting board 2 Each electrode 21 to be connected is connected. Each of the intermediate partial substrates 3c, 3d, 3e, 3f, and 3g has a pair of an upper electrode 31 and a lower electrode 33, respectively.

  Further, when the intermediate partial substrate 3g is formed smaller than the intermediate partial substrate 3d in the peripheral portion as compared with the intermediate partial substrate 3c in the central portion, the number of the electrodes 31 on the surface is reduced, so the intermediate partial substrates 3d, 3e. 3f and 3g are connected to a smaller number of electrodes 14 than the intermediate partial substrate 3c. As a result, it is possible to relieve the stress generated more greatly with respect to the terminal balls in the peripheral portion of the intermediate substrate.

  FIG. 3 shows another example in which the structure obtained by dividing the intermediate substrate 3 into a plurality of intermediate partial substrates 3c ′ to 3g ′ is viewed from above. The front side, rear side, center, right side, left side, etc. in the following description are for the purpose of discriminating a plurality of substrates, and may be different from the front, back, left and right when applied to actual products. is there.

  The intermediate partial substrate 3c ′ is disposed in the central portion of the device 101. The intermediate partial board 3c ′ is provided at a position far from the side of the device mounting board 2 with respect to the intermediate partial board 3g ′ from the intermediate partial board 3d ′. The intermediate partial substrate 3d ′ to the intermediate partial substrate 3g ′ are provided at a position close to the side of the device mounting substrate 2 with respect to the intermediate partial substrate 3c ′.

  The intermediate partial substrate 3 d ′ may be an intermediate substrate disposed at the front end portion of the side ends of the device 101. The intermediate partial substrate 3e ′ may be an intermediate substrate disposed at the rear end portion of the side ends of the device 101. The intermediate partial substrate 3f ′ may be an intermediate substrate disposed on the right end portion of the side ends of the device 101. The intermediate partial substrate 3g ′ may be an intermediate substrate disposed at the left end portion of the side ends of the device 101. The positional relationship and connection of the electrodes 31 on each partial substrate are the same as in the case of the above-described example of FIG.

  FIG. 4 shows a modification of the connection portion of the device 101 according to the present embodiment. The device 101 according to this modification includes a plurality of intermediate substrates 3a and 3b. A plurality of terminal balls 51c are provided between the intermediate substrates 3a and 3b. Similarly to the above-described intermediate substrate 3, the intermediate substrate 3 a and the intermediate substrate 3 b are arranged so as to be parallel to the upper surface of the component mounting substrate 1 and the upper surface of the device mounting substrate 2, and to be overlapped vertically. Other configurations of the intermediate substrates 3a and 3b are the same as those of the intermediate substrate 3 shown in FIGS.

  In the case of this modification, the distance L1 between the component mounting board 1 and the device mounting board 2 can be further increased. In the case of this modification, the diameters of the terminal ball 51a, the terminal ball 51b, and the terminal ball 51c can be decreased. That is, in this modification, the interval for absorbing the stress generated in the terminal ball can be increased and the capacitance component that deteriorates the high-frequency characteristics can be reduced. Therefore, in the component mounting board 1 according to this modification, the high frequency characteristics of the device are not further deteriorated, and the reliability can be improved.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

An example of a structure of the apparatus 100 which concerns on this embodiment is shown. An example in which the structure obtained by dividing the intermediate substrate 3 of FIG. 1 into a plurality of intermediate partial substrates 3c to 3g is viewed from above is shown. The other example which looked at the structure which divided | segmented the intermediate | middle board | substrate 3 of FIG. 1 into several intermediate | middle partial board | substrates 3c 'from 3g' from the upper surface is shown. The modification of the connection part of the device 101 which concerns on this embodiment is shown.

Explanation of symbols

1 component mounting board 2 device mounting board 3 intermediate board 3a intermediate board 3b intermediate board 3c, 3c ′ intermediate partial board 3d, 3d ′ intermediate partial board 3e, 3e ′ intermediate partial board 3f, 3f ′ intermediate partial board 3g, 3g ′ intermediate Partial substrate 11 Upper layer substrate 12 Middle layer substrate 13 Lower layer substrate 14 Electrode 15 Via 15a Via 15b Via 21 Electrode 31 Electrode 33 Electrode 34 Via 34a Via 34b Via 40 Recess 41 Chip 42 Wire bonding 43 Mounting component 44 Pattern wiring 45 Lid 51 Terminal ball 51a terminal ball 51b terminal ball 51c terminal ball 91 component mounting part 100 device 101 device L1 interval L2 interval L3 interval L4 thickness D1 diameter D2 diameter

Claims (7)

A device mounted on an upper surface of a device mounting board and electrically connected to a plurality of electrodes on the device mounting board,
A component mounting board on which electronic components are mounted, each having a plurality of electrodes to be electrically connected to corresponding electrodes on the device mounting board; and
An intermediate substrate in which at least one is provided overlapping between the component mounting substrate and the device mounting substrate, has a plurality of electrodes on each of the upper surface and the lower surface, and the corresponding electrodes on the upper surface and the lower surface are electrically connected When,
A device comprising a plurality of terminal balls respectively connecting corresponding electrodes between the component mounting substrate, the intermediate substrate, and the device mounting substrate.   The device according to claim 1, wherein electrodes that are provided on the component mounting board, the intermediate board, and the device mounting board and that are electrically connected to each other are provided at positions that overlap each other in the surface direction of the board.   The device according to claim 2, wherein the at least one intermediate substrate is a flexible substrate that absorbs a difference in coefficient of thermal expansion between the component mounting substrate and the device mounting substrate.   4. The device of claim 3, wherein at least one of the intermediate substrates has a plurality of separate sets of intermediate partial substrates each having a corresponding set of upper and lower electrodes.   The one intermediate partial board connected to one electrode of the component mounting board is not connected to another electrode provided closer to the side of the component mounting board than the one electrode. The device according to claim 4, wherein the device is connected to a smaller number of electrodes of the component mounting board than the board.   The device according to claim 4, comprising one intermediate substrate between the component mounting substrate and the device mounting substrate. A device mounting board,
A device mounted on an upper surface of the device mounting substrate and electrically connected to a plurality of electrodes on the device mounting substrate;
The device is
A component mounting board on which electronic components are mounted, each having a plurality of electrodes to be electrically connected to corresponding electrodes on the device mounting board; and
An intermediate substrate in which at least one is provided overlapping between the component mounting substrate and the device mounting substrate, has a plurality of electrodes on each of the upper surface and the lower surface, and the corresponding electrodes on the upper surface and the lower surface are electrically connected When,
And a plurality of terminal balls respectively connecting corresponding electrodes between the component mounting substrate, the intermediate substrate, and the device mounting substrate.

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