JP2009083010A - Cutting blade detection mechanism of cutter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting blade detection mechanism capable of detecting a range of use of an annular cutting edge of a cutting blade without adjusting a light-emitting body and a light-receiving body stepwise in a radial direction of the cutting blade. <P>SOLUTION: The cutting blade detection mechanism of a cutter includes a light-emitting means provided on one of sides of a direction of a rotating axis of the cutting blade including the annular cutting edge, a light-receiving means provided oppositely to the light-emitting means on the other side in the direction of the rotating axis of the cutting blade for receiving emitted light, and a control means for detecting a state of the annular edge based on a light quantity received by the light-receiving means. The light-emitting means includes a plurality of light-emitting bodies having a circular light-emitting surface and emission light sources each emitting the light, and the light-emitting surface is provided to displace in the radial direction of the cutting blade in a range not exceeding the diameter. The light-receiving means includes a plurality of light-receiving bodies having a circular light-emitting surface and a photoelectric converter for outputting voltage corresponding to the light quantity, and the light-receiving surfaces are provided oppositely to one another. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cutting blade detection mechanism for detecting the state of a cutting blade provided in a cutting apparatus for cutting a wafer such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of a sapphire substrate are also divided into individual optical devices such as light emitting diodes and laser diodes by cutting along the streets, and are widely used in electrical equipment. ing.

  Cutting along the streets of the above-described semiconductor wafer, optical device wafer or the like is usually performed by a cutting device called a dicer. This cutting apparatus is provided with a cutting blade detection mechanism for detecting the replacement time of an annular cutting edge of a cutting blade whose diameter has been reduced due to wear, and chipping of the annular cutting edge.

The cutting blade detection mechanism includes a blade intrusion portion into which an annular cutting blade of the cutting blade enters, and a light emitter and a light receiver disposed to face the blade entry portion. In this cutting blade detection mechanism, the light emitted from the light emitter is received by the light receiver, and converted into a voltage corresponding to the amount of light received by the light receiver, so that the blade intrusion portion between the light emitter and the light receiver is inserted. The state of the annular cutting edge of the positioned cutting blade is detected. (For example, see Patent Document 1)
Utility Model Registration No. 51370

  The light emitter and the light receiver are configured by bundling a plurality of thin optical fibers. A light emitter configured by bundling a plurality of such thin optical fibers emits circular light having a diameter of about 1 mm. On the other hand, the annular cutting edge of the cutting blade protrudes 1 to 2 mm, and when it is worn about 50 to 70%, it is time to replace it. However, in order to accurately detect the wear of the annular cutting edge of the cutting blade using a light emitting body that emits circular light, a range of 60% (for example, 0.6 mm) is used around the diameter of the light emitting body. Therefore, in order to detect the usage range (for example, 0.5 to 1 mm) of the annular cutting edge of the cutting blade, it is necessary to adjust the light emitter and the light receiver in the radial direction of the cutting blade step by step.

  The present invention has been made in view of the above-mentioned fact, and the main technical problem thereof is the use of an annular cutting edge of the cutting blade without adjusting the light emitter and the light receiver in the radial direction of the cutting blade step by step. An object of the present invention is to provide a cutting blade detection mechanism capable of detecting a range.

In order to solve the above-mentioned main technical problem, according to the present invention, one side in the direction of the rotation axis of a cutting blade provided with an annular cutting edge for cutting the workpiece held on the chuck table holding the workpiece. A light emitting means disposed on the other side in the rotational axis direction of the cutting blade, facing the light emitting means and receiving light emitted by the light emitting means, and from the light emitting means A control means for detecting the state of the annular cutting edge based on the amount of light received by the light receiving means, and a cutting blade detection mechanism of a cutting apparatus comprising:
The light emitting means includes a plurality of light emitters having a circular light emitting surface and a light emitting source that emits light to each of the plurality of light emitters, and the cutting blade within a range in which the light emitting surfaces of the plurality of light emitters do not exceed a diameter. Displaced in the radial direction of
The light receiving means includes a plurality of light receiving bodies having a circular light receiving surface, and a photoelectric converter connected to each of the plurality of light receiving bodies and outputting a voltage corresponding to the amount of light received by the light receiving surface of the light receiving body. The light receiving surfaces of the plurality of light receiving bodies are disposed to face the light emitting surfaces of the plurality of light emitting bodies, respectively.
A cutting blade detection mechanism for a cutting apparatus is provided.

The control means activates a light emitting source that emits light to the radially outermost light emitter of the cutting blade and a photoelectric converter connected to the outermost light receiver of the cutting blade in the radial direction to reduce the wear amount of the annular cutting blade. If the detected amount of wear of the annular cutting edge exceeds the detection allowable range of the light emitting surface of the light emitting body and the light receiving surface of the light receiving body, a light emitting source and a light receiving device that sequentially emit light to the light emitting body radially inside the cutting blade Switch to a photoelectric converter connected to the body to detect the state of the annular cutting edge.
The detection allowable range is set to a range in which 20 to 80% of the amount of light emitted from the light emitting surface of the light emitter is received by the light receiving surface of the light receiver.
Further, the amount of displacement of the light emitting surfaces of the plurality of light emitters and the light receiving surfaces of the plurality of light receivers in the radial direction of the cutting blade is set to an amount corresponding to the radius of the light emitter and the light receiver, respectively.

  According to the cutting blade detection mechanism of the cutting apparatus according to the present invention, the light emitting source that emits light to the radially outermost light emitter of the cutting blade and the photoelectric converter connected to the radially outermost light receiver of the cutting blade are operated. The amount of wear of the annular cutting edge is detected, and if the amount of wear of the annular cutting edge exceeds the detection allowable range of the light emitting surface and the light receiving surface of the light receiver, Since the amount of wear of the annular cutting edge is detected by switching to the light emitting source that emits light to the light emitting body and the photoelectric converter connected to the light receiving body, detection of the usable range of the annular cutting edge of the cutting blade Is possible. Therefore, if the positions of the plurality of light emitters and the plurality of light receivers are adjusted when the cutting blade is replaced, the plurality of light emitters and the plurality of light receivers until the annular cutting edge of the cutting blade reaches the use limit. There is no need to adjust the position.

  Hereinafter, a preferred embodiment of a cutting blade detection mechanism of a cutting device configured according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a cutting apparatus equipped with a cutting blade detection mechanism constructed according to the present invention. A cutting device 1 shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 31 is provided with a clamp 33 for fixing an annular frame that supports a wafer, which will be described later, as a workpiece through a dicing tape. The chuck table 3 configured as described above can be moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  A cutting apparatus 1 shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is moved in an index feed direction indicated by an arrow Y in FIG. 1 by an index feed means (not shown), and is moved in a cut feed direction indicated by an arrow Z in FIG. 1 by a notch feed means (not shown). ing. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction, and the spindle housing 41 is freely rotatable. And a cutting blade 43 attached to the front end of the rotating spindle 42. For example, as shown in FIG. 2, the cutting blade 43 has a disk-shaped base 431 formed of aluminum, and diamond abrasive grains are hardened by nickel plating on the outer peripheral side surface of the base 431 to a thickness of 15 to 30 μm. It consists of a formed annular cutting edge 432.

  Continuing with reference to FIG. 2, a blade cover 44 covering the upper half of the cutting blade 43 is attached to the front end of the spindle housing 41. The blade cover 44 includes a first cover member 441 mounted on the spindle housing 41 and a second cover member 442 mounted on the first cover member 441 in the illustrated embodiment. A female screw hole 441a and two positioning pins 441b are provided in the side surface of the first cover member 441, and an insertion hole 442a is provided in a position corresponding to the female screw hole 441a in the second cover member 442. It has been. Further, on the surface of the second cover member 442 facing the first cover member 441, two recesses (not shown) into which the two positioning pins 441b are fitted are formed. The first cover member 441 and the second cover member 442 configured in this way are provided with two recesses (not shown) formed in the second cover member 442 provided in the first cover member 441. The positioning is performed by fitting to the positioning pin 441b. Then, the fastening bolt 443 is inserted into the insertion hole 442a of the second cover member 442, and is screwed into the female screw hole 441a provided in the first cover member 441, whereby the second cover member 442 is engaged with the first cover member 442. The cover member 441 is attached.

  Cutting water supply pipes 451 and 452 are disposed on the first cover member 441 and the second cover member 442 constituting the blade cover 44, respectively. Cutting water that is disposed on both sides of the annular cutting edge 432 of the cutting blade 43 and sprays cutting water toward both side surfaces of the annular cutting edge 432 at the lower ends of the cutting water supply pipes 451 and 452. Supply nozzles 461 and 462 are connected. The cutting water supply pipes 451 and 452 are connected to a cutting water supply means (not shown).

  The first cover member 441 constituting the blade cover 44 of the spindle unit 4 in the illustrated embodiment has a cutting blade detection mechanism 5 for detecting wear or chipping of the annular cutting edge 432 of the cutting blade 43. It is arranged. The cutting blade detection mechanism 5 will be described with reference to FIGS. The cutting blade detection mechanism 5 in the illustrated embodiment is provided with an attachment member 52 attached to the first cover member 441 by a fastening bolt 51 and slidable in the vertical direction on the attachment member 52 as shown in FIG. And a light emitting means 6 and a light receiving means 7 disposed opposite to each other at the lower end of the support member 53. As shown in FIG. 3, the mounting member 52 is formed with a guide groove 521 having a groove width corresponding to the thickness of the support member 53 and having a lower opening and a vertical direction. A support member 53 is slidably disposed in the guide groove 521 in the vertical direction.

  The support member 53 is formed in a plate shape having a thickness corresponding to the groove width of the guide groove 521 by a metal material such as stainless steel or aluminum, and an annular cutting edge 422 of the cutting blade 43 enters the lower part thereof. A blade entry recess 531 is formed, and a light emitter attachment portion 532 and a light receiver attachment portion 533 are provided on both sides of the blade entry recess 531. The support member 53 configured as described above is slidably disposed in the guide groove 521 formed in the attachment member 52 in the vertical direction, and is moved and adjusted in the vertical direction by the adjustment screw 54 attached to the attachment member 52. It has become so.

  As shown in FIG. 4, the light emitting means 6 includes a first light emitter 60 a and a second light emitter that are disposed on the light emitter attachment portion 532 of the support member 53 with the light emission surface 601 facing the blade entry recess 531. 60b, and a first light source 61a (LED-1) and a second light source 61b (LED-2) that emit light to the first light emitter 60a and the second light emitter 60b, respectively. The first light emitter 60a and the second light emitter 60b are formed in a circular shape having a diameter of about 1 mm by bundling a plurality of optical fibers having a circular cross section, and the light emitting surfaces 601 and 601 are cut within a range not exceeding the diameter. The blade 43 is displaced in the radial direction. The amount of displacement of the light emitting surface 601 of the first light emitter 60a and the light emitting surface 601 of the second light emitter 60b in the radial direction of the cutting blade 43 is such that the first light emitter 60a and the second light emitter 60b are displaced. It is desirable to set the amount corresponding to the radius. The first light emitter 60 a and the second light emitter 60 b configured as described above are attached to the light emitter attachment portion 532 of the support member 53. The first light source 61a (LED-1) and the second light source 61b (LED-2) are, for example, laser light emitting diodes (LEDs), and are controlled by the control means 8.

Next, the light receiving means 7 will be described with reference to FIG.
The light receiving means 7 includes a first light receiving body 70a and a second light receiving body 70b arranged on the light receiving body mounting portion 533 of the support member 53 with the light receiving surface 701 facing the blade intrusion recess portion 531, and the first light receiving body 70b. A first photoelectric converter 71a (PET-1) and a second photoelectric converter 71b (PET-2) for converting the voltage into a voltage corresponding to the amount of light received by the light receiver 70a and the second light receiver 70b; It is made up of. Similar to the first light emitter 60a and the second light emitter 60b, the first light receiver 70a and the second light receiver 70b are formed into a circle having a diameter of about 1 mm by bundling a plurality of optical fibers having a circular cross section. The light receiving surfaces 701 and 701 are disposed so as to be displaced in the radial direction of the cutting blade 43 within a range not exceeding the diameter. The amount of displacement in the radial direction of the cutting blade 43 between the light receiving surface 701 of the first light receiving body 70a and the light receiving surface 701 of the second light receiving body 70b is such that the first light receiving body 70a and the second light receiving body 70b are displaced. It is desirable to set the amount corresponding to the radius. The first light receiving body 70a and the second light receiving body 70b configured as described above are mounted on the light receiving body mounting portion 533 of the support member 53, and the light receiving surface 701 and the second light receiving body of the first light receiving body 70a. The light receiving surface 701 of 70b is disposed opposite to the light emitting surface 601 of the first light emitter 60a and the light emitting surface 601 of the second light emitter 60b of the light emitting means 6, respectively. The first photoelectric converter 71a (PET-1) and the second photoelectric converter 71b (PET-2) respectively change the amount of light received by the first light receiver 70a and the second light receiver 70b. The voltage is converted into a corresponding voltage value and sent to the control means 8.

  The first light-emitting body 60a and the second light-emitting body 60b constituting the light-emitting means 6 of the cutting blade detection mechanism 5 configured as described above, and the first light-receiving body 70a and the second light-receiving means constituting the light-receiving means 7. The body 70b is positioned on both sides of the annular cutting edge 432 of the cutting blade 43 as shown in FIG. Then, as shown in FIG. 4, the light emitting surface 601 of the first light emitter 60a located on the upper side of the light emitting means 6 (the outermost radial direction of the cutting blade 43) and the upper side of the light receiving means 7 (the outermost radial direction of the cutting blade 43). The adjusting screw so that, for example, a position one-half above the radius from the center of the light receiving surface 701 of the first light receiving body 70a located on the outer side is positioned on the outer peripheral edge of the annular cutting edge 432 of the cutting blade 43. 54 adjusts the vertical position of the support member 53 that supports the first light emitter 60a, the second light emitter 60b, and the first light receiver 70a and the second light receiver 70b. The first light emitter 60 a and the second light emitter 60 b and the first light receiver 70 a and the second light receiver 70 b positioned in this way are at least usable in the annular cutting edge 432 of the cutting blade 43. It comes to cover. Therefore, when the cutting blade 43 is replaced, the support that supports the first light emitter 60a and the second light emitter 60b and the first light receiver 70a and the second light receiver 70b by the adjusting screw 54 as described above. If the vertical position of the member 53 is adjusted, the first light emitter 60a, the second light emitter 60b, the first light receiver 70a, and the first light emitter 60a until the annular cutting edge 432 of the cutting blade 43 reaches the use limit. There is no need to adjust the position of the second photoreceptor 70b. In the illustrated embodiment, each of the light emitting means 6 and the light receiving means 7 includes two light emitters (first light emitter 60a and second light emitter 60b) and two light receivers (first light receiver 70a). In addition, although an example using the second light receiving body 70b) is shown, three or more each may be used depending on the usage range of the annular cutting edge 432 of the cutting blade 43.

The cutting blade detection mechanism 5 in the illustrated embodiment is configured as described above, and the operation thereof will be described below with reference to the flowchart shown in FIG.
In a state where the cutting blade 43 is rotating, the control means 8 energizes (ON) the first light source 61a (LED-1) of the light emitting means 6 and turns on the first photoelectric converter of the light receiving means 7 in step S1. 71a (PET-1) is energized (ON). As a result, light is emitted from the light emitting surface 601 of the first light emitter 60a constituting the light emitting means 6 toward the light receiving surface 701 of the first light receiver 70a constituting the light receiving means 7. The light received by the light receiving surface 701 of the first light receiving body 70a is transmitted to the first photoelectric converter 71a (PET-1), and the first photoelectric converter 71a (PET-1) receives the first light receiving light. A voltage signal corresponding to the amount of light received by the light receiving surface 701 of the body 70a is output to the control means 8. The amount of light received by the light receiving surface 701 of the first light receiving body 70a is small when the annular cutting edge 432 of the cutting blade 43 is not worn, and increases as it wears. Therefore, when cutting is performed by the cutting blade 43, the first photoelectric converter 71a (PET-1) outputs a voltage signal as shown in FIG. 6 as time elapses.

  In step S1, if the first light source 61a (LED-1) of the light emitting means 6 is energized (ON) and the first photoelectric converter 71a (PET-1) of the light receiving means 7 is energized (ON). Then, the control means 8 proceeds to step S2 and checks whether or not the output value of the first photoelectric converter 71a (PET-1) has reached a predetermined voltage value V2. The predetermined voltage value V2 is, for example, the first light receiving body in a state where the annular cutting edge 432 of the cutting blade 43 is worn from the center of the first light receiving body 70a to a position half lower than the radius. The voltage value output by the first photoelectric converter 71a (PET-1) is set corresponding to the amount of light received by the light receiving surface 701 of 70a. If the output value of the first photoelectric converter 71a (PET-1) does not reach the predetermined voltage value V2 in step S2, the control means 8 receives the light receiving surfaces of the first light emitting body 60a and the first light receiving body 70a. It is determined that it is within the permissible detection range by 701, and the process returns to step S1 to repeatedly execute step S1 and step S2. In the illustrated embodiment, the allowable range of detection by the light-emitting surface 601 of the first light-emitting body 60a and the light-receiving surface 701 of the first light-receiving body 70a is above and below the center of the light-receiving surface 701 of the first light-receiving body 70a. In the example shown in FIG. 1, the range of half the radius is set. However, within the allowable detection range, 20 to 80% of the amount of light emitted from the light emitting surface 601 of the first light emitter 60a is the first light reception. It may be a range received by the light receiving surface 701 of the body 70a. If the output value of the first photoelectric converter 71a (PET-1) reaches the predetermined voltage value V2 in step S2, the control means 8 receives the light receiving surfaces of the first light emitting body 60a and the first light receiving body 70a. In step S3, the first light source 61a (LED-1) is de-energized (OFF) and the first photoelectric converter 71a (PET-1) is de-energized (step S3). OFF). Then, the control means 8 proceeds to step S4 to energize (ON) the second light source 61b (LED-2) and energize (ON) the second photoelectric converter 71b (PET-2). As a result, light is irradiated from the light emitting surface 601 constituting the light emitting means 6 toward the light receiving surface 701 of the second light receiving body 70b constituting the light receiving means 7. The light received by the light receiving surface 701 of the second light receiving body 70b is transmitted to the second photoelectric converter 71b (PET-2), and the second photoelectric converter 71b (PET-2) receives the second light receiving light. A voltage signal corresponding to the amount of light received by the light receiving surface 701 of the body 70 b is output to the control means 8. The amount of light received by the light receiving surface 701 of the second light receiving body 70b increases as the annular cutting edge 432 of the cutting blade 43 wears in the same manner as the light receiving surface 701 of the first light receiving body 70a. Therefore, when cutting is performed by the cutting blade 43, the second photoelectric converter 71b (PET-2) outputs a voltage signal as shown in FIG. 6 as time elapses. Note that the voltage values, which are output values of the first photoelectric converter 71a (PET-1) and the second photoelectric converter 71b (PET-2) shown in FIG.

  If the second light source (LED-2) is energized (ON) and the second photoelectric converter 71b (PET-2) is energized (ON) in step S4, the control means 8 proceeds to step S5. Thus, it is checked whether or not the output value of the second photoelectric converter 71b (PET-2) has reached a predetermined voltage value V1. The predetermined voltage value V1 is the second light receiving body in a state where the wear amount of the annular cutting edge 432 detected by the second light emitting body 60b and the second light receiving body 70b has reached a predetermined value. The voltage value output from the second photoelectric converter 71b (PET-2) is set corresponding to the amount of light received by the light receiving surface 701 of 70b. That is, in the illustrated embodiment, the wear amount of the annular cutting edge 432 detected by the light emitting surface 601 of the first light emitter 60a and the light receiving surface 701 of the first light receiver 70a and the second light emitter. A value obtained by adding the wear amount of the annular cutting edge 432 detected by the light emitting surface 601 of 60b and the light receiving surface 701 of the second light receiving body 70b is the use limit of the annular cutting edge 432. If the output value of the second photoelectric converter 71b (PET-2) does not reach the predetermined voltage value V1 in step S5, the control means 8 has not reached the use limit of the wear amount of the annular cutting edge 432. It returns to step S4 and repeats step S4 and step S5. If the output value of the second photoelectric converter 71b (PET-2) reaches the predetermined voltage value V1 in step S5, the control means 8 determines that the wear amount of the annular cutting edge 432 has reached the use limit. The process proceeds to step S6, where the display means 12 is warned that the wear amount of the annular cutting edge 432 has reached the use limit. The output values of the first photoelectric converter 71a (PET-1) and the second photoelectric converter 71b (PET-2) are as shown in FIG. 6, but the control means 8 is as shown in FIG. The output value (voltage value) of the first photoelectric converter 71a (PET-1) and the output value (voltage value) of the second photoelectric converter 71b (PET-2) are added to the display means 12 together with the use limit. It is desirable to display.

  As described above, the annular shape of the cutting blade 43 is formed by the first light source 61a (LED-1), the first light emitter 60a, the first light receiver 70a, and the second photoelectric converter 71a (PET-2). The amount of wear of the cutting edge 432 is detected, and detection is permitted by the first light source 61a (LED-1), the first light emitter 60a, the first light receiver 70a, and the first photoelectric converter 71a (PET-1). If the range is exceeded, an annular cutting edge is formed by the second light source 61b (LED-2), the second light emitter 60b, the second light receiver 70b, and the second photoelectric converter 71b (PET-2). Since the wear amount of 432 is detected, the usable range of the cutting blade 43 in the annular cutting edge 432 can be covered. Therefore, when the cutting blade 43 is replaced, the support that supports the first light emitter 60a and the second light emitter 60b and the first light receiver 70a and the second light receiver 70b by the adjusting screw 54 as described above. If the vertical position of the member 53 is adjusted, the first luminous body group 61, the second luminous body group 62, and the first photosensitive body group until the annular cutting edge 432 of the cutting blade 43 reaches the use limit. It is not necessary to adjust the positions of 71 and the second photoreceptor group 72.

  Next, a case where a chip 432a is generated in a part of the annular cutting edge 432 of the cutting blade 43 as shown in FIG. 8 when cutting is performed by the cutting blade 43 will be described. That is, when a chip 432a occurs in a part of the annular cutting edge 432 of the cutting blade 43, the light receiving surface 701 of the first light receiver 70a or the light receiving surface of the second light receiver 70b passes through the region of the chip 432a. The amount of light received by 701 increases. Accordingly, the first photoelectric converter 71a (PET-1) that outputs a voltage signal corresponding to the amount of light received by the light receiving surface 701 of the first light receiving body 70a or the light receiving surface 701 of the second light receiving body 70b. Alternatively, the second photoelectric converter 71b (PET-2) intermittently outputs a voltage signal having a peak value as shown in FIG. The control means 8 to which this voltage signal is input displays it on the display means 12. Therefore, the operator can confirm that a chip has occurred in the annular cutting edge 432 of the cutting blade 43.

  Referring back to FIG. 1, the description will be continued. The cutting device 1 captures an image of the surface of the workpiece held on the chuck table 3 and detects an area to be cut by the cutting blade 43. It has. The imaging means 11 is composed of optical means such as a microscope and a CCD camera. Further, the cutting apparatus 1 includes a display unit 12 that displays an image captured by the imaging unit 11, a determination result by the control unit 8, and the like.

  In the cassette mounting area 13a of the apparatus housing 2, a cassette mounting table 13 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 13 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 13, a cassette 14 that houses the semiconductor wafer 10 as a workpiece is placed. The semiconductor wafer 10 accommodated in the cassette 14 has a grid-like street formed on the surface, and devices such as ICs and LSIs are formed in a plurality of rectangular regions partitioned by the grid-like street. The semiconductor wafer 10 thus formed is accommodated in the cassette 14 with the back surface adhered to the front surface of the dicing tape T mounted on the annular support frame F.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer 10 accommodated in a cassette 14 placed on a cassette placement table 13 (a state in which the wafer is supported on an annular frame F via a dicing tape T). The unloading / loading means 16 for unloading the semiconductor wafer 10 to the temporary table 15, the first transport means 17 for transporting the semiconductor wafer 10 unloaded to the temporary table 15 onto the chuck table 3, and cutting on the chuck table 3. A cleaning means 18 for cleaning the semiconductor wafer 10 is provided, and a second transport means 19 for transporting the semiconductor wafer 10 cut on the chuck table 3 to the cleaning means 18 is provided.

Next, a cutting operation for cutting the semiconductor wafer 10 along a predetermined street using the above-described cutting apparatus 1 will be described.
The semiconductor wafer 10 (supported by the annular frame F via the dicing tape T) accommodated in a predetermined position of the cassette 14 placed on the cassette placing table 13 is moved by the lifting means (not shown). The placement table 13 is positioned at the carry-out position by moving up and down. Next, the carry-out / carry-in means 16 moves forward and backward to carry the semiconductor wafer 10 positioned at the carry-out position onto the temporary placement table 15. The semiconductor wafer 10 transported to the temporary placement table 15 is transported onto the chuck table 3 by the turning motion of the first transport means 17.

  When the semiconductor wafer 10 is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the semiconductor wafer 10 on the chuck table 3. An annular frame F that supports the semiconductor wafer 10 via the dicing tape T is fixed by the clamp 33. In this way, the chuck table 3 holding the semiconductor wafer 10 is moved to a position directly below the imaging means 11. When the chuck table 3 is positioned immediately below the image pickup means 11, the street formed on the semiconductor wafer 10 is detected by the image pickup means 11, and the spindle unit 4 is moved and adjusted in the arrow Y direction as the indexing direction to cut the street and cut. A precision alignment operation with the blade 43 is performed.

  Thereafter, the chuck table 3 is moved to a cutting region below the cutting blade 43, the cutting blade 43 is rotated in a predetermined direction, and a predetermined amount is cut and fed in the direction indicated by the arrow Z. Position it at the position where it reaches the dicing tape T. Then, the chuck table 3 holding the semiconductor wafer 10 by suction is moved at a predetermined cutting feed speed in a direction indicated by an arrow X which is a cutting feed direction. As a result, the semiconductor wafer 10 held on the chuck table 3 is cut along a predetermined street by the cutting blade 43 (cutting process). When performing this cutting process, cutting water is sprayed from the cutting water supply nozzle 462 toward the side surface of the cutting blade 43.

  When the semiconductor wafer 10 is cut along a predetermined street as described above, the chuck table 3 is indexed and fed in the direction indicated by the arrow Y in FIG. 1 to perform the above cutting process. When the cutting process is performed along all the streets extending in the predetermined direction of the semiconductor wafer 10, the chuck table 3 is rotated 90 degrees to extend in a direction orthogonal to the predetermined direction of the semiconductor wafer 10. By performing the cutting process along the streets, all the streets formed in a lattice shape on the semiconductor wafer 10 are cut and divided into individual devices. The divided individual devices are not separated by the action of the dicing tape T, and the state of the wafer supported by the annular frame F is maintained.

  As described above, when the cutting process is completed along the street of the semiconductor wafer 10, the chuck table 3 holding the semiconductor wafer 10 is first returned to the position where the semiconductor wafer 10 is sucked and held. Then, the suction holding of the semiconductor wafer 10 is released. Next, the semiconductor wafer 10 is transferred to the cleaning unit 18 by the second transfer unit 19. The semiconductor wafer 10 conveyed to the cleaning means 18 is cleaned here. The semiconductor wafer 10 thus cleaned is transported to the temporary table 15 by the first transport means 17 after drying. Then, the semiconductor wafer 10 is stored in a predetermined position of the cassette 9 by the unloading / loading means 16.

  The cutting blade detection mechanism 5 is also in operation during the cutting process described above, and the wear state of the annular cutting edge 432 of the cutting blade 43 and the chipping of the annular cutting edge 432 as described above. It can be confirmed that it has occurred.

The perspective view of the cutting device equipped with the cutting blade detection mechanism comprised according to this invention in this invention. The principal part perspective view of the spindle unit with which the cutting apparatus shown in FIG. 1 is equipped. Explanatory drawing which shows the relationship between the cutting blade with which the cutting apparatus shown in FIG. 1 is equipped, and the cutting blade detection mechanism comprised according to this invention. The relationship between the first light-receiving body and the second light-emitting body of the light-emitting means constituting the cutting blade detection mechanism shown in FIG. 3 and the annular cutting edge of the cutting blade, and the first light-receiving body and the second light-receiving body Explanatory drawing which shows the relationship with the annular cutting blade of a cutting blade. The flowchart which shows the operation | movement procedure of the control means which comprises the cutting blade detection mechanism shown in FIG. Explanatory drawing of the voltage signal which the 1st photoelectric converter and 2nd photoelectric converter which comprise the cutting blade detection mechanism shown in FIG. 3 output. Explanatory drawing which shows the example which adds and displays the voltage signal which the 1st photoelectric converter and 2nd photoelectric converter which comprise the cutting blade detection mechanism shown in FIG. 3 output. Explanatory drawing which shows the state which the chip | tip generate | occur | produced in the annular cutting blade of the cutting blade. FIG. 9 is an explanatory diagram of a voltage signal output from the first photoelectric converter or the second photoelectric converter constituting the cutting blade detection mechanism when a chip is generated in the annular cutting edge of the cutting blade shown in FIG. 8.

Explanation of symbols

1: Cutting device 2: Device housing 3: Chuck table 4: Spindle unit 41: Rotating spindle 43: Cutting blade 44: Blade cover 461, 462: Cutting water supply nozzle 5: Cutting blade detection mechanism 52: Mounting member 53: Support member 6: light emitting means 60a: first light emitter 60b: second light emitter 61a: first light source (LED-1)
61b: Second light source (LED-2)
7: light receiving means 70a: first light receiving body 70b: second light receiving body 71a: first photoelectric converter (PET-1)
71b: Second photoelectric converter (PET-2)
8: Control means 10: Semiconductor wafer 11: Imaging means 12: Display means 13: Cassette placement table 14: Cassette 15: Temporary placement table 16: Unloading / carrying means 17: First transport means 18: Cleaning means 19: First 2 transport means

Claims (4)

Luminescent means disposed on one side of the rotation axis direction of the cutting blade having an annular cutting edge for cutting the workpiece held on the chuck table holding the workpiece, and the rotation axis of the cutting blade A light receiving means arranged on the other side of the direction so as to face the light emitting means and receiving the light emitted by the light emitting means, and based on the amount of light received by the light receiving means. A control means for detecting the state of the annular cutting edge, and a cutting blade detection mechanism of a cutting device comprising:
The light emitting means includes a plurality of light emitters having a circular light emitting surface and a light emitting source that emits light to each of the plurality of light emitters, and the cutting blade within a range in which the light emitting surfaces of the plurality of light emitters do not exceed a diameter. Displaced in the radial direction of
The light receiving means includes a plurality of light receiving bodies having a circular light receiving surface, and a photoelectric converter connected to each of the plurality of light receiving bodies and outputting a voltage corresponding to the amount of light received by the light receiving surface of the light receiving body. The light receiving surfaces of the plurality of light receiving bodies are disposed to face the light emitting surfaces of the plurality of light emitting bodies, respectively.
A cutting blade detection mechanism for a cutting apparatus.   The control means operates the photoelectric converter connected to the light emitting source that emits light to the light emitting body at the radially outermost side of the cutting blade and the light receiving body at the radially outermost side of the cutting blade to operate the annular If the amount of wear of the annular cutting edge exceeds the allowable detection range of the light emitting surface of the light emitter and the light receiving surface of the light receiver, the inner edge of the cutting blade in the radial direction is sequentially detected. The cutting blade detection mechanism of the cutting apparatus according to claim 1, wherein the state of the annular cutting edge is detected by switching to the light emitting source that emits light to the light emitter and the photoelectric converter connected to the light receiver.   The cutting permissible range according to claim 1 or 2, wherein the detection allowable range is set to a range in which 20 to 80% of the light amount irradiated from the light emitting surface of the light emitter is received by the light receiving surface of the light receiver. Cutting blade detection mechanism of the device.   The amount of displacement of the light emitting surfaces of the plurality of light emitters and the light receiving surfaces of the plurality of light receivers in the radial direction of the cutting blade is an amount corresponding to the radius of the light emitting surface of the light emitter and the light receiving surface of the light receiver, respectively. The cutting blade detection mechanism of the cutting apparatus according to any one of claims 1 to 3, wherein

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