JP2009076721A5 - - Google Patents

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Publication number
JP2009076721A5
JP2009076721A5 JP2007244878A JP2007244878A JP2009076721A5 JP 2009076721 A5 JP2009076721 A5 JP 2009076721A5 JP 2007244878 A JP2007244878 A JP 2007244878A JP 2007244878 A JP2007244878 A JP 2007244878A JP 2009076721 A5 JP2009076721 A5 JP 2009076721A5
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JP
Japan
Prior art keywords
multilayer wiring
ground plane
pieces
power plane
wiring board
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Application number
JP2007244878A
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Japanese (ja)
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JP2009076721A (en
JP5049717B2 (en
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Priority to JP2007244878A priority Critical patent/JP5049717B2/en
Priority claimed from JP2007244878A external-priority patent/JP5049717B2/en
Publication of JP2009076721A publication Critical patent/JP2009076721A/en
Publication of JP2009076721A5 publication Critical patent/JP2009076721A5/ja
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Publication of JP5049717B2 publication Critical patent/JP5049717B2/en
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Claims (9)

電源プレーン及び／又はグランドプレーンが形成された配線層を含む多層配線基板であって、
前記電源プレーン及び／又は前記グランドプレーンは、所定の切断ラインで切断され、複数の電源プレーン片及び／又はグランドプレーン片に分割されていることを特徴とする多層配線基板。 A multilayer wiring board including a wiring layer in which a power plane and / or a ground plane is formed,
The multilayer wiring board, wherein the power plane and / or the ground plane is cut at a predetermined cutting line and divided into a plurality of power plane pieces and / or ground plane pieces. 前記所定の切断ラインは、ジグザグのラインを含んでいることを特徴とする請求項１に記載の多層配線基板。 The predetermined cutting line, the multilayer wiring board according to claim 1, characterized in Rukoto comprise zigzag line. 前記所定の切断ラインは、隣接する前記電源プレーン片及び／又は前記グランドプレーン片を略線対称に分割するラインを含むことを特徴とする請求項１又は２に記載の多層配線基板。   3. The multilayer wiring board according to claim 1, wherein the predetermined cutting line includes a line that divides the adjacent power plane piece and / or the ground plane piece into substantially line symmetry. 4. 前記複数の電源プレーン片及び／又はグランドプレーン片は、略合同であることを特徴とする請求項１乃至３のいずれか一項に記載の多層配線基板。   The multilayer wiring board according to claim 1, wherein the plurality of power plane pieces and / or ground plane pieces are substantially congruent. 前記複数の電源プレーン片及び／又はグランドプレーン片のうち、所定の電源プレーン片同士及び／又はグランドプレーン片同士を電気的に接続する電気接続手段を更に有することを特徴とする請求項１乃至４のいずれか一項に記載の多層配線基板。   5. The apparatus further comprises electrical connection means for electrically connecting predetermined power plane pieces and / or ground plane pieces among the plurality of power plane pieces and / or ground plane pieces. The multilayer wiring board according to any one of the above. 前記電気接続手段は、前記配線層とは異なる配線層を含むことを特徴とする請求項５に記載の多層配線基板。 6. The multilayer wiring board according to claim 5, wherein the electrical connection means includes a wiring layer different from the wiring layer. 配列された複数の多層配線基板と、該複数の多層配線基板を囲む枠部を備えた基板であって、
該枠部の表面には金属部材が被着されており、
該金属部材は、所定の切断ラインにより切断されて分割されていることを特徴とする基板。 A plurality of multilayer wiring boards arranged, and a board having a frame portion surrounding the plurality of multilayer wiring boards,
A metal member is attached to the surface of the frame portion,
The metal member is cut and divided by a predetermined cutting line. 前記所定の切断ラインは、前記基板の配列ラインを外側に延長したものであることを特徴とする請求項７に記載の基板。 The substrate according to claim 7 , wherein the predetermined cutting line is an extension of an array line of the substrate. 前記複数の多層配線基板の各々は、電源プレーン及び／又はグランドプレーンが形成された配線層を含み、Each of the plurality of multilayer wiring boards includes a wiring layer in which a power plane and / or a ground plane is formed,
前記電源プレーン及び／又は前記グランドプレーンは、ジグザグのラインを含む所定の切断ラインで切断され、複数の電源プレーン片及び／又はグランドプレーン片に分割されていることを特徴とする請求項７又は８に記載の基板。9. The power plane and / or the ground plane is cut by a predetermined cutting line including a zigzag line and divided into a plurality of power plane pieces and / or ground plane pieces. The substrate described in 1.
JP2007244878A 2007-09-21 2007-09-21 Multilayer wiring board Active JP5049717B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244878A JP5049717B2 (en) 2007-09-21 2007-09-21 Multilayer wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244878A JP5049717B2 (en) 2007-09-21 2007-09-21 Multilayer wiring board

Publications (3)

Publication Number Publication Date
JP2009076721A JP2009076721A (en) 2009-04-09
JP2009076721A5 true JP2009076721A5 (en) 2010-09-30
JP5049717B2 JP5049717B2 (en) 2012-10-17

Family

ID=40611411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007244878A Active JP5049717B2 (en) 2007-09-21 2007-09-21 Multilayer wiring board

Country Status (1)

Country Link
JP (1) JP5049717B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5129783B2 (en) * 2009-06-02 2013-01-30 日本特殊陶業株式会社 Wiring board with reinforcing material and method for manufacturing the same
JP2011124549A (en) * 2009-11-11 2011-06-23 Canon Inc Semiconductor apparatus
JP5696549B2 (en) 2011-03-22 2015-04-08 富士通セミコンダクター株式会社 Wiring board
US9818682B2 (en) * 2014-12-03 2017-11-14 International Business Machines Corporation Laminate substrates having radial cut metallic planes
JP6105773B2 (en) * 2016-02-19 2017-03-29 ルネサスエレクトロニクス株式会社 Semiconductor device
JP6613991B2 (en) 2016-03-30 2019-12-04 富士通株式会社 Wiring board manufacturing method
JP7005186B2 (en) * 2017-06-28 2022-01-21 京セラ株式会社 Substrate for mounting electronic devices, electronic devices and electronic modules

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114676A (en) * 1998-10-05 2000-04-21 Hitachi Media Electoronics Co Ltd High-frequency module
JP2001015638A (en) * 1999-06-30 2001-01-19 Mitsumi Electric Co Ltd Substrate of ic package
JP2001237505A (en) * 2000-02-22 2001-08-31 Oki Electric Ind Co Ltd Multilayer printed circuit board
JP2002111145A (en) * 2000-09-29 2002-04-12 Kyocera Corp Circuit board
JP2003110203A (en) * 2001-09-28 2003-04-11 Kyocera Corp Wiring board for multiple pattern and method of manufacturing the same
JP2006114623A (en) * 2004-10-13 2006-04-27 Nec Toppan Circuit Solutions Inc Substrate module, printed circuit board and electronic device employing it
JP4566046B2 (en) * 2005-03-30 2010-10-20 京セラ株式会社 Multiple wiring board

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