JP2009064590A - Method for manufacturing organic el display panel - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 239000003566 sealing material Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 92
- 238000000605 extraction Methods 0.000 claims description 22
- 239000012044 organic layer Substances 0.000 claims description 4
- 238000005401 electroluminescence Methods 0.000 description 55
- 238000007789 sealing Methods 0.000 description 21
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- 230000005525 hole transport Effects 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 4
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- 238000000059 patterning Methods 0.000 description 3
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- 238000007740 vapor deposition Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000010405 anode material Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
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- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
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Abstract
Description
本発明は、有機ＥＬ表示パネルの製造方法に関する。 The present invention relates to a method for manufacturing an organic EL display panel.
液晶表示装置等のディスプレイに比べて高速応答及び広視野角化が可能な自己発光型のディスプレイとしてエレクトロルミネセンス（ＥＬ：electroluminescence）表示装置の開発が盛んに行われている。有機ＥＬ表示装置は、有機ＥＬ表示パネルと有機ＥＬ表示パネルを駆動する駆動回路とから構成される。 Development of an electroluminescence (EL) display device has been actively conducted as a self-luminous display capable of high-speed response and wide viewing angle compared to a display such as a liquid crystal display device. The organic EL display device includes an organic EL display panel and a drive circuit that drives the organic EL display panel.
有機ＥＬ表示パネルは、ガラス等の支持基板上に、表示画素をマトリクス状に配置して構成される表示部と、表示部を囲む外周部とを有するアレイ基板と、アレイ基板と対向して配置される封止基板とを備えている。 An organic EL display panel is disposed on a support substrate such as glass, with an array substrate having a display portion configured by arranging display pixels in a matrix and an outer peripheral portion surrounding the display portion, and facing the array substrate. And a sealing substrate.
有機ＥＬ表示パネルは水分による劣化が激しいため、従来、アレイ基板と封止基板との間に透湿性の低い充填材を用いることで有機ＥＬ素子への水分の浸透を抑制する固体封止方式の有機ＥＬ表示パネルが提案されている（特許文献１参照）。 Since the organic EL display panel is severely deteriorated by moisture, conventionally, a solid sealing method that suppresses the penetration of moisture into the organic EL element by using a filler having low moisture permeability between the array substrate and the sealing substrate. An organic EL display panel has been proposed (see Patent Document 1).
固体封止方式で封止を行なう有機ＥＬパネルの場合、絶縁性基板に下側電極（陽極）を成膜し、陽極上に正孔注入層、正孔輸送層、発光層、電子輸送層、電子注入層等の有機層、更に、これらの有機層上に上側電極（陰極）を成膜して、マトリクス状に配置された表示画素からなる表示部を備えたアレイ基板を形成する。このアレイ基板と封止材を成膜した透明の対向基板とを所定の位置で貼り合わせて有機ＥＬパネルを形成する方法がある。 In the case of an organic EL panel that is sealed by a solid sealing method, a lower electrode (anode) is formed on an insulating substrate, and a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, An organic layer such as an electron injection layer, and an upper electrode (cathode) are formed on these organic layers to form an array substrate having a display unit composed of display pixels arranged in a matrix. There is a method of forming an organic EL panel by bonding the array substrate and a transparent counter substrate on which a sealing material is formed at a predetermined position.
上記の有機ＥＬ表示パネルのアレイ基板を形成する過程において、表示画素に駆動信号を供給する引き出し電極を、表示部からアレイ基板の端部に延びるように形成する。アレイ基板と対向基板との貼り合わせ後に、引き出し電極が配置された領域と対向する対向基板片を割断することによって引き出し電極の駆動信号入力端子が取り出される。 In the process of forming the array substrate of the organic EL display panel, a lead electrode for supplying a drive signal to the display pixel is formed so as to extend from the display portion to the end portion of the array substrate. After the array substrate and the counter substrate are bonded to each other, the drive signal input terminal of the lead electrode is taken out by cleaving the counter substrate piece facing the region where the lead electrode is disposed.
すなわち、封止材が引き出し電極上に触れると封止基板片を取り除くことが困難となるため、封止材を引き出し電極に触れないようパターニングされる必要がある。そのため、封止材は、スクリーン印刷法やディスペンサー法によって成膜され、アレイ基板と貼り合わせてから加熱や紫外線照射によって硬化される。
しかし、上記構成の場合、対向基板を形成する際に、封止材はディスペンサー法などによって成膜されるので、パターニング形成や位置合わせ用のアライメントマークなどが必要となり、有機ＥＬ表示パネルを安価に製造することが困難であった。また、封止材の成膜時やアレイ基板と対向基板との貼り合わせ時には高精度な位置精度が要求され、製造歩留まりが低下する場合があった。 However, in the case of the above configuration, since the sealing material is formed by a dispenser method or the like when forming the counter substrate, patterning formation or alignment marks for alignment are necessary, and the organic EL display panel is made inexpensive. It was difficult to manufacture. In addition, when the sealing material is formed or when the array substrate and the counter substrate are bonded together, a high positional accuracy is required, and the manufacturing yield may be reduced.
本発明は上記問題点に鑑みて成されたものであって、安価で、かつ、製造歩留まりを改善する有機ＥＬ表示装置の製造方法を提供することを目的とする。 The present invention has been made in view of the above problems, and an object thereof is to provide a method for manufacturing an organic EL display device which is inexpensive and improves the manufacturing yield.
本発明の態様による有機ＥＬ表示パネルの製造方法は、第１絶縁基板の主面上に複数の表示画素からなる表示部と、前記表示部から延びた引き出し電極と、前記引き出し電極上に配置された剥離層とを形成する第１基板形成工程と、第２絶縁基板の主面に封止材を成膜する第２基板形成工程と、前記第１絶縁基板と前記第２絶縁基板とをそれぞれの主面が対向するように配置し、前記封止材を硬化させて前記第１基板と前記第２基板とを一体とするパネル形成工程と、前記パネルの前記表示部を含む第１領域と前記引き出し電極および前記剥離層が配置された領域を含む第２領域との境界で、前記第２絶縁基板を割断する工程と、前記第２領域に配置された前記第２絶縁性基板、前記封止材、および前記剥離層を取り除く工程とを有する。 An organic EL display panel manufacturing method according to an aspect of the present invention is arranged on a main surface of a first insulating substrate, a display unit including a plurality of display pixels, an extraction electrode extending from the display unit, and the extraction electrode. A first substrate forming step for forming the release layer, a second substrate forming step for forming a sealing material on the main surface of the second insulating substrate, and the first insulating substrate and the second insulating substrate, respectively. A panel forming step of integrating the first substrate and the second substrate by curing the sealing material, and a first region including the display portion of the panel; Cleaving the second insulating substrate at a boundary with the second region including the region where the extraction electrode and the release layer are disposed, the second insulating substrate disposed in the second region, and the sealing And a step of removing the release material and the release layer.
本発明によれば、安価で、かつ、製造歩留まりを改善する有機ＥＬ表示装置の製造方法を提供することができる。 According to the present invention, it is possible to provide a method for manufacturing an organic EL display device that is inexpensive and improves the manufacturing yield.
以下に、本発明の一実施形態に係る有機ＥＬ表示パネルの製造方法について、図面を参照して説明する。本実施形態に係る製造方法では、４００ｍｍ×５００ｍｍの大きさのマザーパネルを形成し、このマザーパネル１枚から、図１および図２に示すような有機ＥＬ表示パネルＰＮＬを４８枚製造する。 Below, the manufacturing method of the organic electroluminescent display panel which concerns on one Embodiment of this invention is demonstrated with reference to drawings. In the manufacturing method according to the present embodiment, a mother panel having a size of 400 mm × 500 mm is formed, and 48 organic EL display panels PNL as shown in FIGS. 1 and 2 are manufactured from one mother panel.
図１および図２に示すように、本実施形態に係る製造方法で形成される有機ＥＬ表示パネルＰＮＬは、アレイ基板ＰＬ１と、アレイ基板ＰＬ１に対向して配置された対向基板ＰＬ２とを有している。図１に示すように、有機ＥＬ表示パネルＰＮＬは、アレイ基板ＰＬ１上にマトリクス状に配置された表示画素（図示せず）からなる表示部ＤＹＰを含む第１領域Ａ１と、表示部ＤＹＰから延びる引き出し電極（図示せず）を含む第２領域Ａ２とを有している。 As shown in FIGS. 1 and 2, the organic EL display panel PNL formed by the manufacturing method according to the present embodiment has an array substrate PL1 and a counter substrate PL2 arranged to face the array substrate PL1. ing. As shown in FIG. 1, the organic EL display panel PNL extends from the display unit DYP, a first region A1 including a display unit DYP composed of display pixels (not shown) arranged in a matrix on the array substrate PL1. And a second region A2 including an extraction electrode (not shown).
図２に示すように、アレイ基板ＰＬ１と対向基板ＰＬ２とは、第１領域Ａ１において対向して配置されている。また、図１に示すように、アレイ基板ＰＬ１は、対向基板ＰＬ２の端縁Ｅから延びて配置されている。実装時には、アレイ基板ＰＬ１上若しくは有機ＥＬ表示パネルＰＮＬの外部に配置される駆動回路から引き出し電極に、表示部ＤＹＰへの駆動信号が供給される。 As shown in FIG. 2, the array substrate PL1 and the counter substrate PL2 are disposed to face each other in the first region A1. Further, as shown in FIG. 1, the array substrate PL1 is arranged extending from the edge E of the counter substrate PL2. At the time of mounting, a drive signal to the display unit DYP is supplied from the drive circuit arranged on the array substrate PL1 or outside the organic EL display panel PNL to the extraction electrode.
最初に、４８面分のアレイ基板ＰＬ１となる第１マザー基板を製造する。まず、４００ｍｍ×５００ｍｍの大きさの絶縁性基板ＧＬ１を用意する。絶縁性基板ＧＬ１上に、複数の導電層および絶縁層から成るスイッチング素子層ＬＳＷを形成する。 First, a first mother substrate to be an array substrate PL1 for 48 surfaces is manufactured. First, an insulating substrate GL1 having a size of 400 mm × 500 mm is prepared. A switching element layer LSW composed of a plurality of conductive layers and insulating layers is formed on the insulating substrate GL1.
本実施形態に係る製造方法では、スイッチング素子層ＬＳＷの導電層および絶縁層を所定の形状にパターンニングして、表示部ＤＹＰのそれぞれの表示画素に配置される低温ポリシリコンＴＦＴ（Thin Film Transistor）、および、第２領域Ａ２においてアレイ基板ＰＬ１上に配置される各種配線を形成する。 In the manufacturing method according to the present embodiment, the conductive layer and the insulating layer of the switching element layer LSW are patterned into a predetermined shape, and the low-temperature polysilicon TFT (Thin Film Transistor) disposed in each display pixel of the display unit DYP. And various wirings arranged on the array substrate PL1 in the second region A2.
さらに、このスイッチング素子層ＬＳＷ上に、樹脂製平滑層ＬＲ、反射層（図示せず）、陽極およびその他の配線となる第１導電層ＬＥ１、リブ層（図示せず）をそれぞれ所定の膜厚で成膜し、所定の形状にパターンニングする。なお、本実施形態に係る製造方法では、陽極材料としてＩＴＯ（Indium Tin Oxide）を用いている。 Further, on the switching element layer LSW, a resin-made smooth layer LR, a reflective layer (not shown), a first conductive layer LE1 serving as an anode and other wiring, and a rib layer (not shown) are respectively provided with predetermined thicknesses. To form a film and pattern it into a predetermined shape. In the manufacturing method according to the present embodiment, ITO (Indium Tin Oxide) is used as the anode material.
上記の製造過程において、樹脂製平滑層ＬＲをパターンニングする際にコンタクトホール（図示せず）を形成し、下層に配置されたスイッチング素子層ＬＳＷと、上層に配置される第１導電層ＬＥ１によって形成される陽極とを導通させるようにする。本実施形態に係る製造方法では、樹脂製平滑層ＬＲのコンタクトホールを介して、陽極と低温ポリシリコンＴＦＴのドレイン電極とを導通させている。 In the above manufacturing process, a contact hole (not shown) is formed when patterning the resin smooth layer LR, and the switching element layer LSW disposed in the lower layer and the first conductive layer LE1 disposed in the upper layer The anode to be formed is made conductive. In the manufacturing method according to the present embodiment, the anode and the drain electrode of the low-temperature polysilicon TFT are conducted through the contact hole of the resin smooth layer LR.
また、第２領域Ａ２に配置されたスイッチング素子層ＬＳＷおよび第１導電層ＬＥ１をパターンニングすることによって、第１マザー基板の第２領域Ａ２に配置される引き出し電極を形成する。さらに、引き出し電極の端部には、実装時に駆動回路からの駆動信号が入力される駆動信号入力端子を形成する。 In addition, by patterning the switching element layer LSW and the first conductive layer LE1 disposed in the second region A2, an extraction electrode disposed in the second region A2 of the first mother substrate is formed. Furthermore, a drive signal input terminal to which a drive signal from the drive circuit is input at the time of mounting is formed at the end of the extraction electrode.
次に、リブ層形成後の基板を、抵抗加熱方式の有機ＥＬ成膜装置にセットし、正孔注入層、正孔輸送層、発光層、電子輸送層、電子注入層等の複数の有機層を含む有機ＥＬ層Ｌ１を形成する。 Next, the substrate after the rib layer is formed is set in a resistance heating type organic EL film forming apparatus, and a plurality of organic layers such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are provided. An organic EL layer L1 containing is formed.
本実施形態に係る製造方法では、正孔輸送層として、例えば、膜厚２００ｎｍとなるようにα−ＮＰＤを蒸着により成膜し、正孔輸送層上に発光層兼、電子輸送層として、例えば、膜厚が５０ｎｍとなるようにＡｌｑ３を蒸着により成膜し、さらに、電子注入層兼、ＩＴＯダメージバッファ層として、例えば、膜厚が２ｎｍとなるようにＭｇＡｇを蒸着により成膜する。これらの各層を、所定の形状にパターンニングして有機ＥＬ層Ｌ１を形成した。 In the manufacturing method according to the present embodiment, as the hole transport layer, for example, α-NPD is deposited by vapor deposition so as to have a film thickness of 200 nm, and the light emitting layer and electron transport layer are formed on the hole transport layer, for example, Then, Alq3 is deposited by vapor deposition so that the film thickness is 50 nm, and further, for example, MgAg is deposited by vapor deposition so as to have a film thickness of 2 nm as the electron injection layer and ITO damage buffer layer. Each of these layers was patterned into a predetermined shape to form an organic EL layer L1.
ここで、有機ＥＬ層Ｌ１を蒸着する際に、それぞれの第１マザー基板の第１領域と第２領域とに渡って有機ＥＬ層Ｌ１の少なくとも一層が形成されるようなマスクパターンを使用した。すなわち、有機ＥＬ層Ｌ１の少なくとも一層を第１マザー基板の第１領域Ａ１と第２領域Ａ２に渡って形成し、図３に示すように、第２領域Ａ２に配置された剥離層Ｌ２を形成した。したがって、剥離層Ｌ２は、第１マザー基板の第２領域においてスイッチング素子層ＬＳＷおよび第１導電層ＬＥ１によって形成された引き出し電極上に配置される。 Here, when vapor-depositing the organic EL layer L1, a mask pattern was used so that at least one layer of the organic EL layer L1 was formed across the first region and the second region of each first mother substrate. That is, at least one layer of the organic EL layer L1 is formed over the first region A1 and the second region A2 of the first mother substrate, and as shown in FIG. 3, the release layer L2 disposed in the second region A2 is formed. did. Therefore, the release layer L2 is disposed on the extraction electrode formed by the switching element layer LSW and the first conductive layer LE1 in the second region of the first mother substrate.
なお、剥離層Ｌ２は、有機ＥＬ層Ｌ１を構成する、正孔注入層、正孔輸送層、発光層、電子輸送層、電子注入層等の一層で形成されていても良く、これらの層のうちの複数の層が積層されて形成されても良い。 The release layer L2 may be formed of a single layer such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, or an electron injection layer that constitutes the organic EL layer L1. A plurality of these layers may be laminated.
さらに、有機ＥＬ層Ｌ１を成膜済みの基板に、プラズマコーティング法を用いてＩＴＯ成膜を施し、陰極となる第２導電層ＬＥ２を形成し、第１マザー基板を製造した。本実施形態に係る製造方法では、例えば膜厚１００ｎｍでＩＴＯを成膜した。 Further, ITO film formation was performed on the substrate on which the organic EL layer L1 had been formed using a plasma coating method to form a second conductive layer LE2 serving as a cathode, thereby manufacturing a first mother substrate. In the manufacturing method according to the present embodiment, for example, ITO is deposited with a film thickness of 100 nm.
図２に示すように、第２導電層ＬＥ２は、その下層に設けられたコンタクトホールによって、スイッチング素子層ＬＳＷあるいは第１導電層によって形成された電極と導通している。すなわち、第２導電層ＬＥ２によって形成される陰極には、スイッチング素子層ＬＳＷあるいは第１導電層により形成された電極を介して駆動回路から駆動信号が供給される。 As shown in FIG. 2, the second conductive layer LE2 is electrically connected to an electrode formed by the switching element layer LSW or the first conductive layer through a contact hole provided in the lower layer. That is, a drive signal is supplied from the drive circuit to the cathode formed by the second conductive layer LE2 via the switching element layer LSW or the electrode formed by the first conductive layer.
次に、４８枚の対向基板ＰＬ２となる第２マザー基板を製造する。まず、第１マザー基板の表示領域全体を覆うことのできるカバーガラスＧＬ２を準備した。このカバーガラスＧＬ２全体に固体封止充填材Ｌ３として紫外線（ＵＶ）硬化型樹脂をスクリーン印刷法によって成膜し第２マザー基板を形成した。 Next, the second mother substrate to be 48 counter substrates PL2 is manufactured. First, a cover glass GL2 capable of covering the entire display area of the first mother substrate was prepared. An ultraviolet (UV) curable resin was formed as a solid sealing filler L3 on the entire cover glass GL2 by screen printing to form a second mother substrate.
その後、第１マザー基板と第２マザー基板との貼りあわせを行い、所定の紫外線を照射することによって、固体封止充填材Ｌ３を硬化し、マザーパネルを製造した。このように形成されたマザーパネルを、有機ＥＬ表示パネルＰＮＬの外形寸法で割断し、図３に示すような４８枚のパネルを形成した。 Thereafter, the first mother substrate and the second mother substrate were bonded to each other, and the solid sealing filler L3 was cured by irradiating predetermined ultraviolet rays to manufacture a mother panel. The mother panel thus formed was cleaved by the outer dimensions of the organic EL display panel PNL to form 48 panels as shown in FIG.
次に、図４に示すように、カバーガラスＧＬ２を第１領域Ａ１と第２領域Ａ２との境界で割断した。さらに、カバーガラスＧＬ２の割断後に、図５に示すように、カバーガラスＧＬ２、固体封止充填材Ｌ３、および剥離層Ｌ２の第２領域Ａ２に配置された部分を取り除いて、第２領域において引き出し電極の駆動信号入力端子を取り出し、有機ＥＬ表示パネルＰＮＬを製造した。 Next, as shown in FIG. 4, the cover glass GL2 was cleaved at the boundary between the first region A1 and the second region A2. Further, after the cover glass GL2 is cleaved, as shown in FIG. 5, the cover glass GL2, the solid sealing filler L3, and the part of the release layer L2 arranged in the second region A2 are removed and pulled out in the second region. The drive signal input terminal of the electrode was taken out, and an organic EL display panel PNL was manufactured.
上記のように製造した有機ＥＬ表示パネルＰＮＬについて、カバーガラスＧＬ２、固体封止充填材Ｌ３、および剥離層Ｌ２の第２領域Ａ２に配置された部分を取り除いた後に、引き出し電極上に固体封止充填材Ｌ３が残っていないか確認した。さらに、固体封止充填材Ｌ３が残渣のなかった有機ＥＬ表示パネルＰＮＬについて、駆動回路を実装して表示確認を行なった。 About organic electroluminescence display panel PNL manufactured as mentioned above, after removing the part arrange | positioned in 2nd area | region A2 of cover glass GL2, solid sealing filler L3, and peeling layer L2, solid sealing is carried out on an extraction electrode. It was confirmed whether the filler L3 remained. Furthermore, the organic EL display panel PNL in which the solid sealing filler L3 had no residue was mounted and a drive circuit was mounted for display confirmation.
その結果、本実施形態に係る製造方法によって製造された有機ＥＬ表示パネルＰＮＬでは、図６に示すように、４８枚の有機ＥＬ表示パネルＰＮＬ中の４０枚のパネルで、引き出し電極上に固体封止充填材Ｌ３が残っていなかった。さらに、その固体封止充填材Ｌ３の残渣がなかった４０枚の有機ＥＬ表示パネルＰＮＬ中で、良好な表示が確認できたものは３７枚であった。 As a result, in the organic EL display panel PNL manufactured by the manufacturing method according to the present embodiment, as shown in FIG. 6, 40 of the 48 organic EL display panels PNL are solid sealed on the extraction electrode. The stop filler L3 did not remain. Furthermore, among the 40 organic EL display panels PNL that had no residue of the solid encapsulating filler L3, 37 were able to confirm good display.
これに対し、第２領域Ａ２において引き出し電極上に剥離層Ｌ２を形成しない以外は上記の実施形態に係る製造方法と同様の製造方法で、比較例としての有機ＥＬ表示パネルを製造した。 On the other hand, an organic EL display panel as a comparative example was manufactured by the same manufacturing method as the manufacturing method according to the above embodiment except that the peeling layer L2 was not formed on the extraction electrode in the second region A2.
この剥離層Ｌ２を形成しなかった有機ＥＬ表示パネルについて、対向基板、および固体封止充填材Ｌ３の第２領域Ａ２に配置された部分取り除いた後に、上記の実施形態に係る製造方法で製造した有機ＥＬ表示パネルＰＮＬと同様に、引き出し電極上に固体封止充填材Ｌ３が残っていないかを確認し、さらに固体封止充填材Ｌ３の残渣がなかった有機ＥＬ表示パネルについて駆動回路を実装して表示確認を行った。 The organic EL display panel in which the release layer L2 was not formed was manufactured by the manufacturing method according to the above-described embodiment after removing the counter substrate and the part disposed in the second region A2 of the solid sealing filler L3. As with the organic EL display panel PNL, it is confirmed whether or not the solid sealing filler L3 remains on the extraction electrode, and a drive circuit is mounted on the organic EL display panel in which there is no residue of the solid sealing filler L3. The display was confirmed.
その結果、剥離層Ｌ２を形成しなかった有機ＥＬ表示パネルでは、図６に示すように、４８枚の有機ＥＬ表示パネル中の１枚のパネルは、剥離層バルクでカバーガラスを剥がすことができたが、その他の４７枚のパネルは引き出し電極上のカバーガラスが剥がれず割れてしまい、良好な表示を確認する事が出来なかった。さらに、カバーガラスを剥がすことが出来た１枚の有機ＥＬ表示パネルについても、良好な表示を確認することは出来なかった。 As a result, in the organic EL display panel in which the release layer L2 is not formed, as shown in FIG. 6, one of the 48 organic EL display panels can peel the cover glass with the release layer bulk. However, in the other 47 panels, the cover glass on the extraction electrode was not peeled off and cracked, and good display could not be confirmed. Furthermore, good display could not be confirmed for one organic EL display panel from which the cover glass could be peeled off.
すなわち、本実施形態に係る製造方法のように、有機ＥＬ表示パネルＰＮＬの第２領域Ａ２において、アレイ基板ＰＬ１の引き出し電極上に剥離層Ｌ２を形成する事で、カバーガラスＧＬ２の全面に固体封止充填材Ｌ３を成膜しても、引き出し電極を傷めることなく固体封止充填材Ｌ３を取り除くことができる。 That is, as in the manufacturing method according to the present embodiment, in the second region A2 of the organic EL display panel PNL, the release layer L2 is formed on the extraction electrode of the array substrate PL1, so that the entire surface of the cover glass GL2 is solid-sealed. Even when the stop filler L3 is formed, the solid sealing filler L3 can be removed without damaging the extraction electrode.
すなわち、本実施形態の製造方法によれば、引き出し電極を取り出すためにスクリーン印刷法やディスペンサー法などによってカバーガラスＧＬ２に固体封止充填材を成膜することなく、駆動回路と引き出し電極との良好な導通状態を確認する事ができ、良好な表示状態を得ることができた。 That is, according to the manufacturing method of the present embodiment, the drive circuit and the extraction electrode are excellent without forming a solid sealing filler on the cover glass GL2 by a screen printing method or a dispenser method in order to take out the extraction electrode. It was possible to confirm a good conduction state and obtain a good display state.
さらに、従来は、固体封止充填材の成膜時や、第１マザー基板と第２マザー基板との貼り合わせ時には高精度な位置精度が要求されたが、本実施形態に係る製造方法によれば、カバーガラスＧＬ２の全面に固体封止充填材が成膜されればよく、従来の方法と比較して位置制度が要求されないため、製造歩留まりを改善することができる。 Furthermore, in the past, a high positional accuracy was required when the solid sealing filler was formed or when the first mother substrate and the second mother substrate were bonded together, but according to the manufacturing method according to the present embodiment. For example, the solid sealing filler only needs to be formed on the entire surface of the cover glass GL2, and since the position system is not required as compared with the conventional method, the manufacturing yield can be improved.
さらに、本実施形態に係る製造方法では、剥離層Ｌ２は表示画素の構成の一部である有機ＥＬ層Ｌ１の少なくとも一層と同時に形成されるため、剥離層Ｌ２を形成するために製造工程を増加させることがなく、製造歩留まりを低下させることがないとともに、スクリーン印刷法やディスペンサー法によって成膜する必要がなく、さらに、新たな材料を追加することがないため安価に有機ＥＬ表示パネルを製造することができる。 Furthermore, in the manufacturing method according to the present embodiment, the peeling layer L2 is formed at the same time as at least one layer of the organic EL layer L1 that is a part of the configuration of the display pixel. The organic EL display panel can be manufactured at low cost because there is no need to form a film by a screen printing method or a dispenser method, and no new material is added. be able to.
すなわち、本実施形態に係る有機ＥＬ表示装置の製造方法では、安価で、かつ、製造歩留まりを改善する有機ＥＬ表示装置の製造方法を提供することができる。 In other words, the organic EL display device manufacturing method according to the present embodiment can provide an organic EL display device manufacturing method that is inexpensive and improves the manufacturing yield.
なお、この発明は、上記実施形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施形態に開示されている複数の構成要素の適宜な組み合せにより種々の発明を形成できる。例えば、実施形態に示される全構成要素から幾つかの構成要素を削除してもよい。更に、異なる実施形態に亘る構成要素を適宜組み合せてもよい。 Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.
ＰＮＬ…ＥＬ表示パネル、ＤＹＰ…表示部、Ａ１…第１領域、Ａ２…第２領域、Ｌ２…剥離層、Ｌ３…固体封止充填材、ＰＬ１…アレイ基板、ＧＬ１…絶縁性基板（第１絶縁性基板）、ＰＬ２…対向基板ＰＬ、ＧＬ２…カバーガラス（第２絶縁性基板）。 PNL ... EL display panel, DYP ... display unit, A1 ... first region, A2 ... second region, L2 ... release layer, L3 ... solid sealing filler, PL1 ... array substrate, GL1 ... insulating substrate (first insulation) Conductive substrate), PL2... Counter substrate PL, GL2... Cover glass (second insulating substrate).
Claims (2)
第２絶縁基板の主面に封止材を成膜する第２基板形成工程と、
前記第１絶縁基板と前記第２絶縁基板とをそれぞれの主面が対向するように配置し、前記封止材を硬化させて前記第１基板と前記第２基板とを一体とするパネル形成工程と、
前記パネルの前記表示部を含む第１領域と前記引き出し電極および前記剥離層が配置された領域を含む第２領域との境界で、前記第２絶縁基板を割断する工程と、
前記第２領域に配置された前記第２絶縁性基板、前記封止材、および前記剥離層を取り除く工程とを有する有機ＥＬ表示パネルの製造方法。 A first substrate forming step of forming a display unit composed of a plurality of display pixels on a main surface of the first insulating substrate, an extraction electrode extending from the display unit, and a release layer disposed on the extraction electrode;
A second substrate forming step of forming a sealing material on the main surface of the second insulating substrate;
A panel forming step in which the first insulating substrate and the second insulating substrate are arranged so that their main surfaces face each other, the sealing material is cured, and the first substrate and the second substrate are integrated. When,
Cleaving the second insulating substrate at a boundary between a first region including the display portion of the panel and a second region including a region where the extraction electrode and the release layer are disposed;
And a step of removing the second insulating substrate, the sealing material, and the release layer disposed in the second region.
前記剥離層は前記有機ＥＬ層の少なくとも一層と同時に形成される請求項１記載の有機ＥＬ表示パネルの製造方法。 The first substrate forming step includes a step of forming a first conductive layer, a step of forming an organic EL layer including a plurality of organic layers on the first conductive layer, and a second conductive layer on the light emitting layer. And further comprising a step of forming,
The method for manufacturing an organic EL display panel according to claim 1, wherein the release layer is formed simultaneously with at least one layer of the organic EL layer.
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| CN103370985A (en) * | 2011-02-21 | 2013-10-23 | 松下电器产业株式会社 | Organic EL device |
| KR20150107616A (en) * | 2014-03-13 | 2015-09-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing display device and method for manufacturing electronic device |
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| CN103370985A (en) * | 2011-02-21 | 2013-10-23 | 松下电器产业株式会社 | Organic EL device |
| CN103370985B (en) * | 2011-02-21 | 2016-09-28 | 松下知识产权经营株式会社 | Organic electroluminescence device |
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