JP2009059603A - Image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve on reliability of vacuum sealing of an inside surrounded by an anode substrate, a cathode substrate, and a sealing frame, in an FED (field emission display). <P>SOLUTION: An envelope of the FED is structured of a cathode substrate 1, an anode substrate 2, and a sealing frame 31. The sealing frame 31 is formed by jointing a bar-like short-side part 311 and a bar-like long-side part 312. When the FED is exhausted into a vacuum, stress of the atmosphere in the sealing frame 31 is greatest at the long-side corner parts. A joint part of the short side and the long side with weak mechanical strength is prevented from getting a large stress by being set at a short-side side. Thereby, reliability of sealing can be enhanced. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to the reliability of vacuum sealing in a flat display device in which the inside is evacuated, electron emission sources are arranged in a matrix on the rear substrate, and phosphors corresponding to the front substrate are arranged.

  Development of a so-called field emission display (FED) in which the inside between two glass substrates is evacuated, electron emission sources are arranged in a matrix on one substrate, and phosphors are arranged on the opposite substrate is progressing. Yes. The FED forms an image when electrons from an electron emission source strike a phosphor and emits light. In the future, brightness, contrast, moving image characteristics, etc. can provide excellent performance similar to a cathode ray tube. It is expected as a TV display.

  Since the FED emits light by projecting electrons onto the phosphor, the inside of the FED needs to be kept in a vacuum. The FED is composed of a cathode substrate having an electron source arranged in a matrix and an anode substrate having a phosphor. A sealing frame is disposed around the cathode substrate and the anode substrate, and is generally sealed using a sealing material made of frit glass. After sealing, the air is exhausted through exhaust holes formed in the cathode substrate. The distance between the anode substrate and the cathode substrate is determined by the height of the frame.

  Therefore, the reliability of the sealing portion including the sealing frame and the sealing member for sealing the cathode substrate and the anode substrate is very important. The sealing frame is formed of an insulating material such as glass or ceramic, and is a rectangular frame. In order to improve the yield of the material, the frame is formed by fusing a glass rod-shaped material or by joining glass rods with frit glass or the like.

  When joining rod-shaped members, reliability is very important so that leakage does not occur at the joint. An example of a configuration that does not cause leakage when joining rod-shaped glass materials with frit glass is described in, for example, “Patent Document 1”. In “Patent Document 1”, the reliability against leakage at the joint is improved by using a plurality of types of frit glass having different softening temperatures of the frit glass at the joint.

JP 2006-053021 A

  Since the sealing frame is formed by bonding rod-shaped glass by fusing or frit glass, the mechanical strength of the bonded portion is smaller than that of other portions. Therefore, when mechanical stress is applied to the sealing frame, the joint is easily broken. When the cathode substrate and the anode substrate are joined by a sealing frame and the inside of the FED is evacuated, pressure from the atmosphere is applied to the cathode substrate and the anode substrate. In order to prevent destruction of the cathode substrate and the anode substrate, a spacer is disposed between the cathode substrate and the anode substrate.

  On the other hand, atmospheric pressure is also applied to the sealing frame. This pressure is a force that pushes the sealing frame into the FED. When such stress is applied, since the mechanical strength of the joint portion of the sealing frame is weak, the sealing frame may be broken at the joint portion. If the sealing frame is broken, the inside of the FED cannot be maintained in a vacuum, and the FED itself becomes inoperable.

  As described above, the mechanical strength of the sealing frame is very important for the reliability of the FED. However, conventionally, only the influence on the warpage of the anode substrate or the cathode substrate is considered as the influence due to the atmospheric pressure, and the influence of the atmospheric pressure on the sealing frame is not considered, and the reliability of the FED is sufficient. It was not kept in. The present invention is to improve the reliability of a sealing portion including a sealing frame of an anode substrate and a cathode substrate in an FED.

  In the present invention, the sealing frame for joining the anode substrate and the cathode substrate is formed into a substantially rectangular shape by joining rod-like glass or the like having long and short sides, and the joining portion is set to the short side. The substantially rectangular sealing frame has a curvature shape (hereinafter referred to as R) at the corner portion, the inner corner R has a curvature radius of 1 mm or more, and the outer corner R has a curvature radius of 5 mm or more. . Thereby, the stress at the corner of the sealing frame can be alleviated. The specific configuration is as follows.

(1) A cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, an anode voltage is applied, and a phosphor is formed at a location corresponding to the electron emission source, The cathode substrate and the anode substrate are sealed through a sealing frame, and the inside of the display device is held in a vacuum. The sealing frame is a rectangular frame formed by joining a long side and a short side. And a junction between the long side and the short side is formed on the short side.
(2) The corner of the sealing frame after the short side and the long side of the sealing frame are joined has a corner R, and the joint part of the short side and the long side of the corner R part The display device according to (1), wherein the display device is formed on the short side.
(3) The display device according to (1), wherein an end portion of the short side before joining with the long side does not have a curved surface portion forming a corner R.
(4) The display according to (1), wherein the sealing frame is formed of glass, and a joint portion between the long side and the short side is joined by fusing glass. apparatus.
(5) The display device according to (1), wherein the sealing frame is made of glass, and a joint portion between the long side and the short side is joined by frit glass.

(6) a cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, an anode voltage is applied, and a phosphor is formed at a location corresponding to the electron emission source; The cathode substrate and the anode substrate are sealed through a sealing frame, and the inside of the display device is held in a vacuum. The sealing frame is a rectangular frame formed by joining a long side and a short side. The joint part of the long side and the short side is formed on the short side, and the corner of the sealing frame after the short side and the long side of the sealing frame are joined is inside. A display device having a curvature R1, wherein R1 has a radius of curvature larger than 1 mm.
(7) The corner of the sealing frame after the short side and the long side of the sealing frame are joined has a curvature R2 on the outside, and the radius of curvature of R2 is larger than 5 mm. The display device according to 6).
(8) The corner of the sealing frame after joining the short side and the long side of the sealing frame has a curvature R2 on the outside, and the radius of curvature of R2 is larger than 10 mm. The display device according to 6).
(9) The cathode substrate has a through hole in the vicinity of a corner portion, and the through hole and the inside of the corner portion of the sealing frame are spaced by 1 mm or more. Display device.

(10) a cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, an anode voltage is applied, and a phosphor is formed at a location corresponding to the electron emission source; The cathode substrate and the anode substrate are sealed through a sealing frame, and the inside of the display device is held in a vacuum. The sealing frame is a rectangular frame formed by joining a long side and a short side. The width of the long side of the sealing frame is larger than the width of the short side, and the junction between the long side and the short side is formed on the short side. apparatus.
(11) The display device according to (10), wherein the sealing frame is made of glass, and the joining portion is joined by fusing glass.
(12) The display device according to (10), wherein the sealing frame is made of glass, and the joining portion is joined by frit glass.

(13) A cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, an anode voltage is applied, and a phosphor is formed at a location corresponding to the electron emission source, The cathode substrate and the anode substrate are sealed through a sealing frame, and the inside of the display device is held in a vacuum. The sealing frame is a rectangular frame formed by joining a long side and a short side. The width of the long side of the sealing frame is smaller than the width of the short side, and the junction between the long side and the short side is formed on the short side. apparatus.
(14) The display device according to (13), wherein the sealing frame is formed of glass, and the bonding portion is bonded by fusing glass.
(15) The display device according to (13), wherein the sealing frame is made of glass, and the joining portion is joined by frit glass.

(16) A cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, an anode voltage is applied, and a phosphor is formed at a location corresponding to the electron emission source, The cathode substrate and the anode substrate are sealed through a sealing frame, and the inside of the display device is held in a vacuum. The sealing frame is a rectangular frame formed by joining a long side and a short side. The width of the long side of the sealing frame is larger than the width of the short side, and the junction between the long side and the short side is formed on the long side. apparatus.
(17) The display device according to (16), wherein the sealing frame is made of glass, and the joining portion is joined by fusing glass.
(18) The display device according to (16), wherein the sealing frame is made of glass, and the joint is joined by frit glass.

  According to the present invention, since the sealing frame is joined to a rod-shaped glass or the like to form a rectangular sealing frame, the material yield can be increased. By setting the joint portion to the short side, stress at the corner portion on the long side where the stress is greatest can be avoided. As a result, the reliability of sealing is increased, and as a result, the reliability of the FED can be improved.

  Further, according to the present invention, the corner R of the sealing frame after joining can be provided with a corner R, and the stress at the corner can be reduced by setting the radius of curvature of the inner corner R to 1 mm or more. The reliability of sealing can be improved. Further, when the through hole is formed in the cathode substrate, the stress due to the interference between the through hole and the sealing frame can be reduced by setting the distance between the through hole and the sealing frame to 1 mm or more.

  The best mode of the present invention will be described below in detail with reference to the drawings of the embodiments.

  FIG. 1 is a plan view showing a first embodiment of the present invention. In FIG. 1, an anode substrate 2 is installed on a cathode substrate 1 via a sealing portion 3. On the cathode substrate, scanning lines extend in the horizontal direction and data signals extend in the vertical direction. A signal is supplied to the scanning line and the data signal line from the outside via the terminal 5. An electron emission source is disposed near the intersection of the scanning line and the signal line. Therefore, a large number of electron emission sources are arranged in a matrix. Various electron emission sources such as the so-called MIM method, SED method, and Spindt method have been developed. Any electron emission source can be applied to the present invention.

  The inside of the sealing part 3 surrounding the cathode substrate 1 and the anode substrate 2 and the periphery is kept in a vacuum. Therefore, the anode substrate 2 and the cathode substrate 1 are bent by the atmospheric pressure, and the interval between the cathode substrate 1 and the anode substrate 2 cannot be secured. Alternatively, the cathode substrate 1 or the anode substrate 2 is destroyed. In order to avoid this, a spacer 4 is provided between the cathode substrate 1 and the anode substrate 2. The spacer 4 is made of ceramic or glass and is generally installed on the scanning line so as not to hinder image formation.

  On the anode substrate, red, green, and blue phosphors that emit light by the impact of an electron beam are formed corresponding to the electron emission source. A black matrix (BM) is formed around the phosphor to improve image contrast. A metal backing made of Al is formed covering the black matrix. A high voltage is applied to the metal back, and the electron beam emitted from the cathode is accelerated and projected onto the phosphor 21.

  In order to generate light from the phosphor by the electron beam, the electron beam must have a certain amount of energy, so that a high voltage of 8 KV to 10 KV is applied to the metal back of the anode substrate 2. In this embodiment, the external high voltage introduction terminal 60 is provided on the cathode substrate side, and a high voltage is supplied to the anode substrate 2 via the contact spring 50. In FIG. 1, an anode terminal 24 where the contact spring 50 and the anode substrate 2 are in contact is formed at a corner portion of the display device. Since the inside of the display device must be kept in a vacuum, exhaust holes 81 for exhaust are formed at the corners of the display device in FIG.

  FIG. 2 is a side view of FIG. 1 viewed from the C direction. In FIG. 2, the cathode substrate 1 and the anode substrate 2 face each other with a predetermined distance through the sealing portion 3. The cathode substrate 1 is formed larger as the terminals 5 and the like are installed. Under the cathode substrate 1, an exhaust substrate 6 for attaching the exhaust pipe 8 and the high voltage introduction terminal 60 is attached. The exhaust substrate 6 is attached to the cathode substrate 1 via an exhaust substrate sealing portion 7. In FIG. 2, an exhaust pipe 8 for evacuating the inside of the display device is drawn on the exhaust substrate 6 in a state where the chip is turned off. A high voltage introduction terminal 60 is attached near the exhaust pipe 8 of the exhaust substrate 6.

3 is a cross-sectional view taken along the line AA in FIG. In FIG. 3, the data signal line 12 extends in a direction perpendicular to the paper surface. In this embodiment, an electron emission source 13 is formed on the data signal line 12. The scanning line 11 is formed in a direction perpendicular to the data signal line 12 through the insulating film 14. In FIG. 3, the scanning line 11 extends outside the sealing portion 3. A spacer 4 for maintaining the distance between the cathode substrate 1 and the anode substrate 2 is provided on the scanning line 11. The spacer 4 is fixed to the scanning line on the cathode substrate side and to the metal back 23 on the anode substrate side by the fixing material 41. The spacer 4 is given a conductivity of about 10 ⁹ to 10 ¹¹ Ω, and the spacer 4 is prevented from being charged by passing a slight current between the cathode and the anode.

  On the anode substrate side, phosphors 21 such as red, green, and blue are arranged at locations corresponding to the electron emission sources 13, and the phosphors 21 emit light by being projected by an electron beam, thereby forming an image. Is done. The space between the phosphors 21 is filled with BM 22 and contributes to the improvement of the contrast of the image. For example, the BM 22 has a two-layer structure of chromium and chromium oxide. Chromium oxide is formed on the anode substrate 2 side, and chromium is formed thereon. A metal back 23 made of Al is formed so as to cover the phosphor 21 and the BM 22. A high voltage of about 8 KV to 10 KV is applied to the metal back 23 to accelerate the electron beam. The accelerated electron beam penetrates the metal back 23 and strikes the phosphor 21 to cause the phosphor 21 to emit light.

  In order to keep the inside of the display device in a vacuum, the cathode substrate 1 and the anode substrate 2 are sealed by the sealing frame 31 and the sealing material 32. The thickness of the cathode substrate 1 and the thickness of the anode substrate 2 are about 3 mm. The distance between the cathode substrate 1 and the anode substrate 2 is about 2.8 mm, and the inside of the display device has a high electric field.

  4 is a cross-sectional view taken along the line BB of FIG. In FIG. 4, a through hole 10 is formed in the cathode substrate 1, and the display device is exhausted or a high voltage is supplied through the through hole 10. An exhaust substrate 6 is installed through the exhaust substrate sealing portion 7 so as to cover the through hole 10 of the cathode substrate 1, and the inside of the display device is kept in vacuum. The exhaust substrate sealing portion 7 has the same basic configuration as the cathode substrate 1 and the anode substrate 2 sealing portion 3. That is, the exhaust substrate frame 71 is sealed to the cathode substrate 1 and the anode substrate 2 via the sealing material 32. In this embodiment, the frame 31 for sealing the anode substrate 2 and the cathode substrate 1 and the frame for sealing the cathode substrate 1 and the exhaust substrate 6 have the same thickness, but the thickness of the frame is as required. Can be set freely.

  The high voltage introduction terminal 60 is fused to the exhaust substrate 6 and is kept airtight from the outside. An Fe—Ni alloy is used for the high voltage introduction terminal 60. The component ratio of the Fe—Ni alloy is selected so as to match the thermal expansion coefficient with the sealing material 32. In this embodiment, Fe is 52% and Ni is 48%. The external terminal 63 of the high voltage introduction terminal 60 is a terminal for applying a high voltage to the anode substrate 2 from the outside, and is connected to an external socket. .

  A contact spring 50 is attached to the high voltage introduction terminal 60 by spot welding. The high voltage applied to the high voltage introduction terminal 60 by the contact spring 50 is introduced to the anode substrate side. The contact spring 50 comes into contact with the anode substrate 2 by the appropriate pressing of the contact portion 53 at the tip by the spring force.

  An anode terminal 24 for contacting the contact spring 50 is formed on the anode substrate 2. Since a relatively large current flows through the anode terminal 24, reliability is important. In this embodiment, the structure near the anode terminal 24 is as follows. A BM 22 of chromium and chromium oxide is formed on the anode substrate, and a metal back 23 made of Al is formed covering the BM 22. This is the same configuration as the effective surface of the screen. In this embodiment, a conductive film as the anode terminal 24 is formed on the metal back 23 with a thickness of 10 μm to 30 μm. In this embodiment, the conductive film is formed by applying a silver paste by printing and then baking. There is no need to provide a special process for firing the conductive film. For example, it may be performed simultaneously with the firing process for fixing the spacer 4.

  The silver paste is obtained by dispersing silver particles having a diameter of 1 μm to several μm in an organic solvent having a high viscosity. After firing, the silver particles are connected to each other to have conductivity. In some cases, the conductive film should have some resistance. In such a case, the resistance can be adjusted by further mixing a paste for frit glass with a normal silver paste. Note that the material of the conductive film is not limited to silver paste, and Ni paste in which Ni particles are dispersed, Al paste in which Al particles are dispersed, and the like can also be used. A graphite film bonded with a binder can also be used. The graphite in this case is preferably graphite. The resistance of the graphite film can be adjusted, for example, by mixing bengara (iron oxide) with graphite.

  By forming the conductive film as thick as 10 μm to 30 μm, the contact spring 50 and the conductive film can be stably contacted. That is, in the case of a metal film, the contact spring 50 and the metal film are in point contact, and there is a great risk that current concentrates on this point contact portion and the conductive film is destroyed. The conductive film and the contact spring 50 can have a large contact area as compared with the case of a metal film, become a state close to surface contact, and stabilize the contact. Further, in the case of the conductive film as in the present embodiment, since the resistance is larger than that of metal, it is possible to prevent a large current from flowing through the contact portion 53. Also from this point, the stability of conduction by contact can be improved.

  FIG. 5 is an exploded perspective view of the anode substrate 2, the sealing frame 31, and the cathode substrate 1 which are main structures of the FED. The sealing frame 31 is sealed to the anode substrate 2 or the cathode substrate 1 by a sealing member. A through hole 10 through which the contact spring 50 is inserted is formed in the cathode substrate 1. The through hole 10 also serves as the exhaust hole 81.

  The sealing frame 31 is obtained by fusing a sealing frame short side 311 and a sealing frame long side 312 which are glass rod-shaped members. The fused part is formed on the short side of the sealing frame 31. After sealing the anode substrate 2 or the cathode substrate 1, the sealing frame 31 receives a pressure from the atmospheric pressure in the direction of the arrow in FIG. The distortion is greatest at the center of the long side. Therefore, the bending stress with respect to the sealing frame 31 is greatest at the long side corner portion.

  The sealing frame 31 is formed by welding a long glass rod and a short glass rod, but the mechanical strength is weak at this welded portion. Therefore, if the welded portion is formed at the long side corner portion of the sealing frame 31 where the stress due to the atmospheric pressure is greatest, there is a risk that the sealing frame 31 is broken at this portion.

  In order to prevent this danger, in the present invention, the fused portion is formed at the short side corner portion of the sealing frame 31. On the other hand, since the material yield decreases as the distance from the corner of the sealing frame 31 decreases, the corner on the short side of the sealing frame 31 is optimal for the fused portion. FIG. 5 shows the case where the glass rod is fused, but the same applies to the case where the glass rod is joined by frit glass.

  FIG. 6 shows a first form of the first embodiment. 6A is a perspective view of the entire sealing frame 31, and FIG. 6B is an enlarged view of the lower right corner. FIG. 6 shows a case where R at the corner portion of the sealing frame 31 is small. If the corner R is small, there is an advantage that the display area can be enlarged. On the other hand, stress due to the atmospheric pressure on the sealing frame 31 is increased.

  In FIG. 6B, the long side of the sealing frame 31 is a single bar shape except that R2 is formed. Further, the short side of the sealing frame 31 is also in the form of a single bar except that R1 is formed. Therefore, the form shown in FIG. 6 is very excellent in terms of the material yield of the sealing frame 31.

  FIG. 7 shows a second mode in this embodiment. FIG. 7A is a perspective view of the entire sealing frame 31, and FIG. 7B is an enlarged view of the lower right corner. FIG. 7 shows a case where the corner R of the sealing frame 31 is large. As the corner R is larger, the display area is smaller, but the stress due to atmospheric pressure at the corner of the sealing frame 31 is smaller.

  In FIG. 7B, the short side and the long side are fused at the corner R. In this structure, the short side is a simple glass rod, whereas the long side is a rod having corner R portions at both ends. In this configuration, since the fused portion is not applied to the corner portion and is fused on the short side, it is very resistant to stress against atmospheric pressure.

  FIG. 8 shows a third mode in this embodiment. FIG. 8A is a perspective view of the entire sealing frame 31, and FIG. 8B is an enlarged view of the lower right corner. FIG. 8 shows a case where the corner R of the sealing frame 31 is large. In FIG. 8B, the fused part is formed on the shorter side than the outer side R of the sealing frame 31, but covers the corner R part. Thus, even when the fused portion is not completely on the short side but on the corner R, the effect of the present invention can be obtained. Further, by forming the fused portion at the corner R portion as in the present embodiment, the material yield of the long side glass can be increased more than that in the second embodiment.

  FIG. 9 shows a fourth mode in the present embodiment. FIG. 9A is a perspective view of the entire sealing frame 31, and FIG. 9B is an enlarged view of the lower right corner. FIG. 9 shows a case where the corner R of the sealing frame 31 is large. In FIG. 9B, the fusion part is formed at the corner R part of the sealing frame 31, but is formed on the shorter side than the diagonal line D in FIG. 9A. Thus, by forming the fused portion in the vicinity of the diagonal line D, the material yield of the glass can be further improved.

  FIG. 10 shows a fifth embodiment in the present embodiment. FIG. 10A is a perspective view of the entire sealing frame 31, and FIG. 10B is an enlarged view of the lower right corner. FIG. 10 differs from FIGS. 6 to 9 in that the rod-shaped glass sealing frame 31 is joined by frit glass rather than fusion. In FIG. 10B, the sealing frame short side 311 and the sealing frame long side 312 are joined by frit glass in the vicinity of the corner portion. The fusing temperature of the frit glass used for joining the sealing frame 31 needs to be higher than the fusing temperature of the frit glass for sealing the sealing frame 31 and the anode substrate 2 or the cathode substrate 1. is there. The advantage of this embodiment is that the sealing frame 31 can be joined in the FED manufacturer because there is no step of fusing glass. Therefore, handling including the transportation of the sealing frame 31 is easy.

  In FIG. 10, the joint portion of the long side and the short side is the short side side where the corner R is completely bent. Therefore, the short side member may be a simple bar-shaped glass. However, in the case of joining with frit glass as in the present embodiment, the same effect can be obtained not only in the case shown in FIG. 10 but also in the joint shown in FIGS. 7, 8, 9 and the like. I can do it.

  As described in the first embodiment, after the FED is evacuated, the sealing frame 31 is subjected to stress due to atmospheric pressure. This stress is greatest at the corner portion of the sealing frame 31. That is, the long side and the short side of the sealing frame 31 are distorted by the atmospheric pressure, and the stress due to the distortion is the largest in the corner portion.

  Conventionally, in order to increase the display area of the FED, the corner R of the sealing frame 31 is configured to be as small as possible. However, it has been clarified by experiments of the inventors that such a conventional configuration causes a problem from the reliability of vacuum sealing. FIG. 11 is a perspective view of the corner portion of the sealing frame 31. In FIG. 11, if R1 which is the inner corner R is small, cracks are likely to enter from this portion. In order to prevent this crack, R1 needs to be 1 mm or more.

  A tensile stress due to atmospheric pressure is applied to the outer corner R in FIG. Since glass is weaker in tensile stress than compressive stress, it is necessary to form R larger than inner corner R. For this reason, R2 which is the outer corner R in FIG. 11 needs to be 5 mm or more. In order to further improve the reliability, R2 is desirably 10 mm or more.

  Incidentally, in FIG. 4 described in the first embodiment, the exhaust pipe 8 and the high voltage introduction terminal 60 are installed on the exhaust substrate 6. On the other hand, as shown in FIG. 12, the exhaust pipe 8 and the high voltage introduction terminal 60 may be installed separately. FIG. 12 is a perspective view of such an FED as seen from the back side. The high voltage introduction terminal 60 is installed in the upper right corner of FIG. 12, and the exhaust pipe 8 is installed in the upper left and lower left corners.

  13 is a cross-sectional view of the high voltage introduction terminal portion of the FED shown in FIG. In FIG. 13, each component is the same as described in FIG. A difference from FIG. 4 is that the exhaust hole 81 and the exhaust pipe 8 are not provided in the exhaust substrate 6. Since the exhaust pipe 8 is not installed on the exhaust substrate 6, the through hole 10 formed in the cathode substrate 1 approaches the sealing frame 31.

  As described above, the corner portion of the sealing frame 31 is heavily stressed by atmospheric pressure. The fact that a large stress is applied to the corner portion of the sealing frame 31 means that a large stress is also applied to the anode substrate 2 or the cathode substrate 1 in the vicinity of the corner of the sealing frame 31 as a reaction. Therefore, if there are scratches or the like near the corners of the sealing frame 31 such as the cathode substrate 1 and the anode substrate 2, glass cracks are likely to occur at those portions.

  In the cathode substrate 1, as shown in FIG. 13, through holes 10 are formed at the corners of the sealing frame. Therefore, the position of the through hole 10 becomes a problem. In particular, since a small glass crack is likely to be formed in the through-hole portion, the risk of cracking due to stress is even greater. FIG. 14 is an enlarged view of a corner portion of the cathode substrate 1 in this embodiment. In FIG. 14, a sealing frame 31 is formed near the corner portion of the cathode substrate 1. R1 which is the inner side R of the sealing frame 31 is 1 mm or more. Moreover, R2 which is the outer side R of the sealing frame 31 is 5 mm or more. The distance d between the through hole 10 and the sealing frame 31 is set to 1 mm or more. By setting this value to 1 mm or more, cracks in the cathode substrate 1 or cracks in the sealing frame 31 due to interference between the through holes 10 and the sealing frame 31 can be prevented.

  Since FIG. 14 shows a case where R1 which is an inner corner R of the sealing frame 31 is larger than the radius of the through hole 10, the distance d between the through hole 10 and the sealing frame 31 is the smallest at the corner portion. On the other hand, when the radius of the through hole 10 is larger than R1 of the sealing frame 31, the shortest distance d between the through hole 10 and the sealing frame 31 is two places other than the corner portion. In this case, d needs to be 1 mm or more in two places. Since the radius of the through hole 10 is about 5 mm, the shortest distance d between the sealing frame 31 and the through hole 10 is often two places other than the corner portion.

  In the first and second embodiments, the description has been given on the premise that the short side width WS and the long side width WL of the sealing frame 31 are the same. In this case, as described in the first embodiment, as a first mode, as shown in FIG. 15, it is preferable that the glass is fused or bonded by frit glass on the short side. 15 to 18, the corner R of the sealing frame 31 is omitted.

  On the other hand, it may be necessary to change the width of the sealing frame 31 between the short side width WS and the long side WL. In this case, as shown in FIG. 16, the stress at the corner portion can be minimized by making the long side width WL larger than the short side width WS, as shown in FIG. That is, the difficulty of bending the frame member due to the atmospheric pressure is proportional to the third power of the width, whereas the stress due to strain is proportional to the second power of the width. Further, the reliability can be further improved by fusing on the short side of the sealing frame 31 or bonding with frit glass.

  On the other hand, there is a case where the width WL on the long side needs to be smaller than the width WS on the short side due to a request for a display area or the like. In this case, as a third embodiment, as shown in FIG. 17, the sealing frame 31 needs to be welded on the short side or joined by frit glass.

  Furthermore, due to structural requirements and the like, the sealing frame 31 may have to be welded or joined on the long side. In this case, as shown in FIG. 18, in order to relieve the stress of the sealing frame 31 at the corner, the long side width WL is set to be larger than the short side width WS as a fourth embodiment. To do. By doing so, stress at the corner of the sealing frame can be reduced, and the reliability of sealing can be improved.

It is a top view which shows Example 1 of this invention. It is a side view of FIG. It is AA sectional drawing of FIG. 2 is a cross-sectional view taken along the line BB of Example 1. FIG. It is a disassembled perspective view of the main components of FED. It is a 1st form of the corner part of the sealing frame of Example 1. FIG. It is a 2nd form of the corner part of the sealing frame of Example 1. FIG. It is a 3rd form of the corner part of the sealing frame of Example 1. FIG. It is a 4th form of the corner part of the sealing frame of Example 1. FIG. It is a 5th form of the corner part of the sealing frame of Example 1. FIG. It is a perspective view of the corner part of the sealing frame of Example 2. FIG. 6 is a rear view of the FED of Example 2. FIG. 4 is a cross-sectional view of a corner portion of the FED of Example 2. FIG. It is a perspective view of the corner part of FED of Example 2. FIG. It is the 1st form of Example 3. FIG. It is the 2nd form of Example 3. FIG. It is the 3rd form of Example 3. FIG. It is the 4th form of Example 3. FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Cathode substrate, 2 ... Anode substrate, 3 ... Sealing part, 4 ... Spacer, 5 ... Terminal, 6 ... Exhaust board, 7 ... Exhaust board sealing part , 8 ... exhaust pipe, 10 ... through hole, 11 ... scanning line, 12 ... data signal line, 13 ... electron emission source, 14 ... insulating film, 21 ... fluorescence Body, 22 ... black matrix, 23 ... metal back (anode electrode), 24 ... anode terminal, 31 ... sealing frame, 50 ... contact spring, 51 ... contact spring base 52, contact spring arm part, 53 ... contact spring contact part, 60 ... high voltage introduction terminal, 311 ... short side of sealing frame, 312 ... sealing frame The long side.

Claims (18)

A cathode substrate having an electron emission source formed in a matrix; and an anode substrate facing the cathode substrate, to which an anode voltage is applied, and having a phosphor formed at a location corresponding to the electron emission source. And the anode substrate is sealed through a sealing frame, and the inside is maintained in a vacuum,
The said sealing frame forms the rectangular frame by joining a long side and a short side, The junction part of the said long side and the said short side is formed in the said short side side, The display characterized by the above-mentioned. apparatus.   The corner of the sealing frame after the short side and the long side of the sealing frame are joined has a corner R, and the joint of the short side and the long side is the short side of the corner R part. The display device according to claim 1, wherein the display device is formed on a side.   The display device according to claim 1, wherein an end portion of the short side before joining with the long side does not have a curved surface portion forming a corner R.   The display device according to claim 1, wherein the sealing frame is made of glass, and a joint portion between the long side and the short side is joined by fusing glass.   The display device according to claim 1, wherein the sealing frame is made of glass, and a joint between the long side and the short side is joined by frit glass. A cathode substrate having an electron emission source formed in a matrix; and an anode substrate facing the cathode substrate, to which an anode voltage is applied, and having a phosphor formed at a location corresponding to the electron emission source, the cathode substrate And the anode substrate is sealed through a sealing frame, and the inside is maintained in a vacuum,
The sealing frame forms a rectangular frame by joining the long side and the short side, the joint part of the long side and the short side is formed on the short side,
The display device according to claim 1, wherein a corner of the sealing frame after the short side and the long side of the sealing frame are joined has a curvature R1 inside, and the radius of curvature of R1 is larger than 1 mm.   The corner of the sealing frame after the short side and the long side of the sealing frame are joined has a curvature R2 on the outside, and the R2 has a curvature half-period gain larger than 5 mm. The display device described in 1.   The corner of the sealing frame after the short side and the long side of the sealing frame are joined has a curvature R2 on the outside, and the radius of curvature of R2 is larger than 10 mm. The display device described.   The display device according to claim 6, wherein the cathode substrate has a through hole in the vicinity of a corner portion, and the through hole and an inner side of the corner portion of the sealing frame have an interval of 1 mm or more. . A cathode substrate having an electron emission source formed in a matrix; and an anode substrate facing the cathode substrate, to which an anode voltage is applied, and having a phosphor formed at a location corresponding to the electron emission source. And the anode substrate is sealed through a sealing frame, and the inside is maintained in a vacuum,
The sealing frame forms a rectangular frame by joining a long side and a short side, and the width of the long side of the sealing frame is larger than the width of the short side, and the long side and the short side The display device characterized in that the joint is formed on the short side.   The display device according to claim 10, wherein the sealing frame is formed of glass, and the bonding portion is bonded by fusing glass.   The display device according to claim 10, wherein the sealing frame is made of glass, and the joining portion is joined by frit glass. A cathode substrate having an electron emission source formed in a matrix; and an anode substrate facing the cathode substrate, to which an anode voltage is applied, and having a phosphor formed at a location corresponding to the electron emission source, the cathode substrate And the anode substrate is sealed through a sealing frame, and the inside is maintained in a vacuum,
The sealing frame forms a rectangular frame by joining a long side and a short side, the width of the long side of the sealing frame is smaller than the width of the short side, and the long side and the short side The display device characterized in that the joint is formed on the short side.   The display device according to claim 13, wherein the sealing frame is formed of glass, and the bonding portion is bonded by fusing glass.   The display device according to claim 13, wherein the sealing frame is made of glass, and the joining portion is joined by frit glass. A cathode substrate having an electron emission source formed in a matrix; and an anode substrate facing the cathode substrate, to which an anode voltage is applied, and having a phosphor formed at a location corresponding to the electron emission source, the cathode substrate And the anode substrate is sealed through a sealing frame, and the inside is maintained in a vacuum,
The sealing frame forms a rectangular frame by joining a long side and a short side, and the width of the long side of the sealing frame is larger than the width of the short side, and the long side and the short side The display device according to claim 1, wherein the joint is formed on the long side.   The display device according to claim 16, wherein the sealing frame is formed of glass, and the bonding portion is bonded by fusing glass.   The display device according to claim 16, wherein the sealing frame is made of glass, and the joining portion is joined by frit glass.

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