JP2009058281A - Energy beam irradiator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an energy beam irradiator which can prevent a pinhole from being heated and reduce a load applied on an exhaust pump of a differential exhaust unit. <P>SOLUTION: The energy beam irradiator includes a generation unit 11 for generating an energy beam EB, a plurality of through holes 21, 22, 23 opened opposite to an irradiation object and permitting the energy beam EB to pass through the inside thereof, an irradiation section 12 having the through holes 21, 22, 23 integrally formed and a differential exhaust section 4 communicating with the through holes 21, 22, 23 and having a pressure gradient formed inside the through holes 21, 22, 23 by exhausting. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an energy beam irradiating apparatus, and more particularly to an energy beam irradiating apparatus that irradiates a metal large structure with energy rays and performs a process such as quenching on the surface of the structure.

  An energy beam, for example, an electron beam, generated in a high vacuum region in the energy beam irradiation apparatus is irradiated to an irradiation object arranged in a low vacuum region or an atmospheric pressure region. At this time, since the energy beam has very high energy, it travels substantially straight and irradiates the irradiated object.

  Between the high vacuum region and the low vacuum region or the atmospheric pressure region in the energy beam irradiation apparatus, a pinhole that allows the energy beam to pass is formed. In the high vacuum region, the degree of vacuum is maintained by a known differential exhaust device provided in the pinhole. The diameter of the pinhole is preferably set narrow to ensure differential exhaust performance (see, for example, Patent Document 1).

  On the other hand, the energy rays have a density distribution in a direction perpendicular to the irradiation direction, and if the pinhole diameter is narrow, the energy rays corresponding to a part of the energy rays, that is, the skirt of the density distribution, are on the wall surface of the pinhole. There is a problem that the pinhole is heated. In order to avoid this problem, a method is known in which the pinhole diameter is set to be sufficiently large compared to the beam diameter of the irradiated energy beam, and the energy beam is prevented from being irradiated to the wall surface of the pinhole. ing.

In addition, by forming a medium vacuum region between the high vacuum region and the atmospheric pressure region, the pressure difference in the pinholes disposed between the regions can be reduced, ensuring differential pumping performance. Also known is a technique for achieving both pinhole heating prevention (see, for example, Patent Document 2).
JP 2001-33599 A European Patent Application No. 0924019

The technique described in Patent Document 1 described above has a problem that it is difficult to set a pinhole diameter that ensures both differential exhaust performance and prevention of pinhole heating.
That is, if the priority is given to preventing the heating of the pinholes, the pinhole diameter increases, so that there is a problem that the load on the differential exhaust pump increases in order to ensure the differential exhaust performance. On the other hand, if priority is given to ensuring differential pumping performance, the pinhole diameter is reduced, so that the ratio of energy rays irradiated to the wall surface of the pinhole is increased and the pinhole is deformed by heating. When the pinhole is deformed in this way, there is a problem that the rate of energy rays applied to the wall surface further increases, and a vicious circle occurs in which the deformation of the pinhole becomes larger.

In the technique described in Patent Document 2 described above, it is difficult to arrange a plurality of pinholes formed on different members on the same axis, and when pinhole placement accuracy cannot be ensured, heating the pinholes There was a problem that it could not be prevented.
That is, when the pinhole arrangement accuracy is deteriorated and the pinhole arrangement position deviates from the same axis, the ratio of the portion irradiated to the wall surface of the pinhole in the energy beam irradiated along the same axis increases. . Thus, when the ratio of the energy rays irradiated becomes high, the pinhole is easily heated, and there is a problem that the prevention of heating cannot be achieved.

  The present invention has been made to solve the above-described problems, and provides an energy beam irradiation device that can prevent the pinhole from being heated and reduce the load on the exhaust pump in the differential exhaust device. The purpose is to do.

In order to achieve the above object, the present invention provides the following means.
The energy beam irradiation apparatus of the present invention includes a generator that generates energy beams, a plurality of through holes that open toward the irradiated body, and through which the energy beams pass, and the plurality of through holes are integrated. There is provided an irradiation portion formed and a differential exhaust portion that communicates with the plurality of through holes and forms a pressure gradient inside the plurality of through holes by exhausting.

  According to the present invention, it is easy to ensure the arrangement accuracy of the plurality of through holes by integrally forming the plurality of through holes in the irradiation unit. Therefore, the displacement of the arrangement position of the through hole can prevent the irradiation of a part of the energy beam to the wall surface of the through hole, and the heating of the through hole can be prevented.

  Further, since the arrangement accuracy of the plurality of through holes can be ensured, the diameter of each through hole can be reduced as compared with the case where the arrangement accuracy cannot be ensured. Therefore, it becomes easy to form a pressure gradient inside the plurality of through holes, and exhaust performance required for the differential exhaust section can be reduced.

  In the said invention, it is desirable that the said irradiation part is formed from the material with high heat conductivity.

  According to the present invention, even if a part of the energy rays is irradiated on the wall surfaces of the plurality of pinholes and heat is generated on the wall surfaces, the irradiated portion is formed from a material having low thermal conductivity. The generated heat is easily diffused. Then, it is prevented that the irradiation part thermally expands locally, and the deformation of the irradiation part, that is, the deformation of the through hole, and the deterioration of the arrangement accuracy of the plurality of through holes are prevented.

  In the above invention, it is desirable that the diameter of the plurality of through holes is a diameter corresponding to 3σ related to the density distribution or the intensity distribution in the energy beam passing through the plurality of through holes even if the diameter is small.

  According to the present invention, by setting the diameter of the through-hole to a diameter corresponding to 3σ related to the density distribution or the intensity distribution of the energy beam even if it is small, most of the energy beam, that is, about 99% or more is irradiated to the wall surface of the through-hole. Without passing through the through hole. In other words, only less than about 1% of the energy rays are irradiated on the wall surface of the through hole. Therefore, heat generation on the wall surface of the through hole can be suppressed.

  In the said invention, it is desirable to provide the cooling part which cools the said irradiation part.

  According to the present invention, the irradiation part is cooled by the cooling part and the heat generated on the wall surface of the through hole is removed, so that local thermal expansion in the irradiation part is prevented. The deterioration of the arrangement accuracy of the through holes is prevented.

According to the energy beam irradiation apparatus of the present invention, by forming a plurality of through holes integrally in the irradiation part, it becomes easy to ensure the arrangement accuracy of the plurality of through holes, and the irradiation of the energy beam to the wall surface of the through holes is prevented. As a result, it is possible to prevent the pinhole from being heated.
Furthermore, since the arrangement accuracy of the plurality of through holes can be ensured, the diameter of each through hole is reduced, and the load on the exhaust pump in the differential exhaust device can be reduced.

[First Embodiment]
Hereinafter, an electron beam irradiation apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2.
FIG. 1 is a schematic diagram illustrating a schematic configuration of an electron beam irradiation apparatus according to the present embodiment.
In the present embodiment, the present invention is an apparatus that emits an electron beam out of particle beams included in an energy beam, and the surface of a mold (irradiated body) M is irradiated with an electron beam and quenched. Description will be made by applying to an electron beam irradiation apparatus (energy beam irradiation apparatus) 1 that performs processing.

  As shown in FIG. 1, the electron beam irradiation apparatus 1 includes an irradiation unit 2 that irradiates the mold M with an electron beam, a support unit 3 that movably supports the irradiation unit 2, a differential exhaust unit 4, A control unit 5 that controls the irradiation unit 2 and the support unit 3, and a shield 6 that houses the mold M, the irradiation unit 2, and the support unit 3 therein are provided.

FIG. 2 is a schematic diagram illustrating the configuration of the irradiation unit in FIG.
The irradiation unit 2 irradiates the mold M disposed on the irradiation stage 7 with an electron beam and performs surface treatment such as quenching on the mold M. As shown in FIG. 1, the irradiating unit 2 has an X direction (left and right direction in FIG. 1) that is the left and right direction and a Z direction (up and down direction in FIG. 1) that is the up and down direction. Is supported so as to be movable.

As shown in FIG. 2, the irradiation unit 2 includes an electron beam generation unit (generation unit) 11 that generates an electron beam, and an emission unit (irradiation unit) that guides and emits the generated electron beam toward a mold. 12 are provided.
The electron beam generator 11 is a container whose interior is maintained in a high vacuum state (for example, 10 ⁻³ Pa) by a vacuum pump or the like, and a filament (hot cathode) (not shown) is disposed inside. The filament is supplied with an acceleration voltage for generating an electron beam.

The emission part 12 is a member formed with a pinhole or the like through which the electron beam EB passes, and is a member formed of a material having high thermal conductivity such as copper, for example.
As shown in FIG. 2, the emitting portion 12 includes a high vacuum pinhole (through hole) 21 through which the electron beam EB passes, a medium vacuum pinhole (through hole) 22, and a low vacuum pinhole (through hole) 23, A medium vacuum exhaust pipe 25 and a low vacuum exhaust pipe 26 connected to the differential exhaust section 4, a cooling flow path (cooling section) 32 connected to a cooling section 31 for supplying a refrigerant for cooling the emitting section 12, Is provided.

The high vacuum pinhole 21, the medium vacuum pinhole 22 and the low vacuum pinhole 23 are through holes formed integrally in the emission part 12, and are through holes arranged in series on the same axis. is there.
Specifically, the high vacuum pinhole 21 is a through hole that communicates the electron beam generator 11 and the intermediate vacuum exhaust pipe 25, and the intermediate vacuum pinhole 22 is the intermediate vacuum exhaust pipe 25 and the low vacuum exhaust pipe 26. The low vacuum pinhole 23 is a through hole that communicates the low vacuum exhaust pipe 26 and the opening formed in the surface of the emitting portion 12 facing the mold M.

  The minimum value of the hole diameter in the high vacuum pinhole 21, the medium vacuum pinhole 22 and the low vacuum pinhole 23 is determined based on the density distribution of the electron beam EB. Specifically, the hole diameter is set to be larger than the diameter corresponding to 3σ related to the density distribution in the direction perpendicular to the irradiation direction of the electron beam EB.

As shown in FIG. 2, the middle vacuum exhaust pipe 25 and the low vacuum exhaust pipe 26 are exhaust pipes that communicate with the differential exhaust section 4 formed in the emission section 12, and each pinhole 21, 22, 23. It extends in the direction that intersects.
The medium vacuum exhaust pipe 25 is an exhaust pipe disposed between the electron beam generator 11 and the low vacuum exhaust pipe 26 and communicating with the high vacuum pinhole 21 and the medium vacuum pinhole 22. The inside of the middle vacuum exhaust pipe 25 is maintained in a middle vacuum state, for example, about 10 Pa.
The low vacuum exhaust pipe 26 is an exhaust pipe that is disposed on the mold M side (lower side in FIG. 2) with respect to the middle vacuum exhaust pipe 25 and communicated with the middle vacuum pinhole 22 and the low vacuum pinhole 23. . The inside of the low vacuum exhaust pipe 26 is kept in a low vacuum state, for example, about 1000 Pa.

The cooling flow path 32 is a flow path that extends along the pinholes 21, 22, and 23 inside the emission part 12, and is a flow path through which a refrigerant that cools the emission part 12 flows. Further, as shown in FIG. 2, the cooling flow path 32 is connected to the cooling section 31 provided outside the emitting section 12 so as to form a path through which the refrigerant circulates.
The cooling unit 31 takes heat from the refrigerant that has absorbed heat in the emission unit 12 and releases the heat to the outside. As the configuration of the cooling unit 31 and the refrigerant, known configurations and substances can be used, and are not particularly limited.

As shown in FIG. 1, the support unit 3 supports the irradiation unit 2 with respect to the mold M so as to be movable in a three-dimensional direction.
The support unit 3 is provided with a portal drive unit 41 that supports the irradiation unit 2 and a traveling unit 42 on which the portal drive unit 41 moves.

The portal drive unit 41 includes a column part 43 extending along the Z direction, which is arranged with the irradiation stage 7 and the mold M interposed therebetween, and a beam part 44 extending along the X direction connecting the upper ends of the column parts 43. And are provided. The irradiation unit 2 is attached to a lower surface, which is a surface facing the mold M in the beam portion 44, so as to be movable in a direction along the beam portion 44, that is, in the X direction and the Z direction.
The configuration of the connecting portion between the beam portion 44 and the irradiation unit 2 can be a known configuration as long as the irradiation unit 2 can move in the X direction and the Z direction, and is not particularly limited.

  The traveling unit 42 is a member extending along the Y direction, which is the front-rear direction, in a region adjacent to the irradiation stage 7, on which the portal drive unit 41 travels. For example, a known member such as a rail can be used as the traveling unit 42.

  The portal drive unit 41 may travel along the traveling unit 42 and move in the Y direction as described above, or may have other known mechanisms that move in the Y direction. It is not limited.

The differential evacuation unit 4 forms a pressure gradient inside the emission unit 12 described above, and keeps the inside of the electron beam generation unit 11 communicated with the outside in a vacuum state. The main body of the differential exhaust section 4 is disposed outside the shield 6, and a middle vacuum exhaust pipe 25 and a low vacuum exhaust pipe 26 extending from the main body are connected to the emitting section 12 disposed inside the shield 6.
In addition, as a structure of the differential exhaust part 4, a well-known structure can be used and it does not specifically limit.

The control unit 5 irradiates a predetermined region of the mold M with an electron beam by controlling the movement of the irradiation unit 2 and the support unit 3 and the irradiation of the electron beam.
The control unit 5 is disposed outside the shield 6, and a signal line 45 extending from the control unit 5 is connected to the support unit 3 and the irradiation unit 2 disposed inside the shield 6.
In addition, about the movement control method of the irradiation part 2 grade | etc., By the control part 5, it demonstrates together in description of the hardening method of the metal mold | die M in the electron beam irradiation apparatus 1 of this embodiment.

As shown in FIG. 1, the shield 6 houses therein an irradiation stage 7, a mold M, a support unit 3 and an irradiation unit 2, and X-rays generated from the mold M irradiated with the electron beam EB. It shields electromagnetic waves. Examples of the material constituting the shield 6 include lead.
The size of the shield 6 may be any size as long as it can secure a space in which the support unit 3 can move after the mold M is placed inside the irradiation stage 7. There is no need to secure space to move in the direction.

  An opening 46 for carrying in and out the mold M is formed on the upper surface of the shield 6, and a lid 47 for closing the opening 46 is disposed in the opening 46. Furthermore, an observation camera 51 for confirming the operation status of the support unit 3 and the irradiation unit 2 and the quenching status of the mold M is disposed inside the shield 6. An image photographed by the observation camera 51 is displayed on a monitor (not shown) arranged outside the shield 6.

Next, the operation of the electron beam irradiation apparatus 1 having the above configuration will be described.
First, as shown in FIG. 1, a mold M for performing a surface treatment such as quenching is carried into the shield 6. Specifically, the lid 47 disposed on the upper surface of the shield 6 is removed, and the portal drive unit 41 is moved in the Y direction to form a space for carrying the mold M above the irradiation stage 7. After the mold M is carried into the shield 6 from the opening 46, the opening 46 is closed by the lid 47.

Then, an acceleration voltage etc. are supplied to the filament provided in the electron beam generation part 11 in the irradiation part 2, and an electron beam is produced | generated.
As shown in FIG. 2, the generated electron beam EB passes through the high vacuum pinhole 21, the medium vacuum pinhole, and the low vacuum pinhole 23 in this order, and is emitted from the emission unit 12 toward the mold M. .
In the region irradiated with the electron beam EB in the mold M, the energy of the electron beam EB is converted into heat, so that a quenching process is performed.

Here, the differential exhaust in each pinhole 21, 22, and 23 of the irradiation part 2 and the cooling of the irradiation part 2 are demonstrated.
As shown in FIG. 2, the differential exhaust unit 4 keeps the inside of the middle vacuum exhaust pipe 25 at a pressure of about 10 Pa and the inside of the low vacuum exhaust pipe 26 at a pressure of about 1000 Pa by performing exhaust.

Then, a pressure gradient is formed inside the low vacuum pinhole 23 such that the end on the mold M side is at atmospheric pressure (about 100,000 Pa) and the end on the low vacuum exhaust pipe 26 side is at low vacuum (about 1000 Pa). The On the other hand, a pressure gradient is formed inside the intermediate vacuum pinhole 22 such that the end on the low vacuum exhaust pipe 26 side is low vacuum and the end on the intermediate vacuum exhaust pipe 25 side is medium vacuum (about 10 Pa). Further, a pressure gradient is formed inside the high vacuum pinhole 21 so that the end on the medium vacuum exhaust pipe 25 side is in a medium vacuum and the end on the electron beam generating unit 11 side is in a high vacuum (about 10 ⁻³ Pa). Is done.

  On the other hand, since the inner diameter of each pinhole 21, 22, 23 is set to a larger hole diameter than the diameter corresponding to 3σ related to the density distribution of the electron beam EB, the electrons passing through each pinhole 21, 22, 23 About 99% or more of the line EB passes through the inner wall surfaces of the pinholes 21, 22, and 23 without being irradiated. In other words, an electron beam EB of less than about 1% is irradiated on the inner wall surface of each pinhole 21, 22, 23, and heat is generated on the inner wall surface.

Since the emission part 12 is formed using a material having high thermal conductivity such as copper, the heat generated on the inner wall surface of each pinhole 21, 22, 23 is transferred from the inner wall surface to the entire emission part 12. It spreads quickly toward.
Further, the refrigerant circulated between the cooling section 31 flows in the cooling flow path 32 of the emission section 12, and the heat diffused throughout the emission section 12 is absorbed by the circulating refrigerant. . In other words, the inner wall surfaces of the pinholes 21, 22 and 23 are cooled by the refrigerant circulating in the cooling flow path 32.

  When passing through the cooling flow path 32, the refrigerant that has taken away the heat generated on the inner wall surfaces of the pinholes 21, 22, and 23 releases the heat taken away in the cooling section 31 to the outside, and again flows into the cooling flow. It flows into the path 32 and cools the inner wall surfaces of the pinholes 21, 22 and 23.

The cooling channel 32 has the pinholes 21, 22, 23 formed integrally and is provided in the enlarged emission part 12, so that the heat exchange area is large. Therefore, the cooling performance by the cooling flow path 32 is improved, and restrictions on heat generation on the inner wall surfaces of the pinholes 21, 22, and 23 due to irradiation of the electron beam EB are reduced.
That is, since the deformation of the pinholes 21, 22, and 23 due to heat generation on the inner wall surface can be suppressed, even if it is less than about 1%, the inner wall surface of the pinholes 21, 22, and 23 of the electron beam EB Irradiation can be tolerated.

According to the above configuration, the high vacuum pinhole 21, the medium vacuum pinhole, and the low vacuum pinhole 23 are integrally formed in the irradiating unit 2, thereby making it easy to ensure the placement accuracy of the pinholes 21, 22, and 23. Become. Therefore, the irradiation of a part of the electron beam EB to the wall surfaces of the pinholes 21, 22, 23 can be prevented by the displacement of the arrangement positions of the pinholes 21, 22, 23, and the pinholes 21, 22 can be prevented. , 23 can be prevented.
Furthermore, since the placement accuracy of each pinhole 21, 22, 23 can be ensured, the diameter of each pinhole 21, 22, 23 can be made smaller than when the placement accuracy cannot be secured. Therefore, it becomes easy to form a pressure gradient inside each pinhole 21, 22, 23, and the exhaust performance required for the differential exhaust section 4 can be reduced.

  Even if a part of the electron beam EB is irradiated on the wall surfaces of the high vacuum pinhole 21, the medium vacuum pinhole and the low vacuum pinhole 23 and heat is generated on the wall surfaces, the irradiation part 2 is formed of a material having low thermal conductivity. Compared to the case where the heat is generated, the generated heat is easily diffused. Then, it is prevented that the irradiation part 2 thermally expands locally, and the deformation | transformation of the irradiation part 2, ie, the deformation | transformation of each pinhole 21,22,23, and the deterioration of the arrangement precision of each pinhole 21,22,23 are prevented. Is done.

  By setting the diameters of the high vacuum pinhole 21, the medium vacuum pinhole and the low vacuum pinhole 23 to a diameter corresponding to 3σ related to the density distribution of the electron beam EB, even if it is small, most of the electron beam EB, that is, about 99% or more. Passes through the pinholes 21, 22, 23 without being irradiated on the wall surfaces of the pinholes 21, 22, 23. In other words, only less than about 1% of the electron beam EB is applied to the wall surfaces of the pinholes 21, 22, and 23. Therefore, heat generation on the wall surfaces of the pinholes 21, 22, and 23 can be suppressed.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG.
The basic configuration of the electron beam irradiation apparatus of this embodiment is the same as that of the first embodiment, but the configuration of the irradiation unit is different from that of the first embodiment. Therefore, in the present embodiment, only the configuration of the irradiation unit will be described with reference to FIG. 3, and description of other components and the like will be omitted.
FIG. 3 is a schematic diagram illustrating the configuration of the irradiation unit in the electron beam irradiation apparatus of the present embodiment.
In addition, about the component same as 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

The irradiation unit 102 of the electron beam irradiation apparatus (energy beam irradiation apparatus) 101 irradiates the mold M disposed on the irradiation stage 7 with an electron beam, and performs a surface treatment such as quenching on the mold M. (See FIG. 1).
As shown in FIG. 3, the irradiation unit 102 includes an electron beam generation unit 11 that generates an electron beam, and an emission unit (irradiation unit) 112 that guides and radiates the generated electron beam toward a mold. Is provided.

  As shown in FIG. 3, the emission unit 112 includes a central member 113 in which a high vacuum pinhole 21, a medium vacuum pinhole 22, and a low vacuum pinhole 23 through which an electron beam EB passes, and a differential exhaust unit 4. Are connected to the middle vacuum exhaust chamber 125 and the low vacuum exhaust chamber 126.

  The central member 113 is a member formed of a material having high thermal conductivity such as copper, for example. The central member 113 is provided with a cooling flow path 32 connected to the cooling unit 31 that supplies the refrigerant. . Further, the central member 113 includes a through-hole 135 that connects the medium vacuum exhaust chamber 125 to the high vacuum pinhole 21 and the medium vacuum pinhole 22, a low vacuum exhaust chamber 126, the medium vacuum pinhole 22, and the low vacuum pinhole 23. And a through hole 136 for connecting the two.

The middle vacuum exhaust chamber 125 is a space connected to the differential exhaust unit 4, the high vacuum pinhole 21, and the middle vacuum pinhole 22. The middle vacuum exhaust chamber 125 is formed so as to cover the outside of the region of the central member 113 where the high vacuum pinhole 21 is formed.
The low vacuum exhaust chamber 126 is a space connected to the differential exhaust unit 4, the intermediate vacuum pinhole 22, and the low vacuum pinhole 23. The low vacuum evacuation chamber 126 is formed so as to cover the middle vacuum evacuation chamber 125 from the outside and to cover the outside of the region of the central member 113 where the medium vacuum pinhole 22 is formed.

Next, the differential exhaust in each pinhole 21, 22, and 23 of the irradiation part 102 in the electron beam irradiation apparatus 101 having the above configuration and the cooling of the irradiation part 202 will be described.
In addition, the description about the same effect as 1st Embodiment is abbreviate | omitted.

As shown in FIG. 3, the differential exhaust section 4 keeps the inside of the middle vacuum exhaust chamber 125 at a pressure of about 10 Pa and the inside of the low vacuum exhaust chamber 126 at a pressure of about 1000 Pa by performing exhaust.
Then, a pressure gradient is formed inside the low vacuum pinhole 23 such that the end on the mold M side is atmospheric pressure (about 100,000 Pa) and the end on the low vacuum exhaust chamber 126 side is low vacuum (about 1000 Pa). The On the other hand, a pressure gradient is formed inside the intermediate vacuum pinhole 22 such that the end on the low vacuum exhaust chamber 126 side is low vacuum and the end on the intermediate vacuum exhaust chamber 125 side is medium vacuum (about 10 Pa). Furthermore, a pressure gradient is formed inside the high vacuum pinhole 21 so that the end on the medium vacuum exhaust chamber 125 side is in a medium vacuum and the end on the electron beam generating unit 11 side is in a high vacuum (about 10 ⁻³ Pa). Is done.

  On the other hand, since the inner diameter of each pinhole 21, 22, 23 is set to a larger hole diameter than the diameter corresponding to 3σ related to the density distribution of the electron beam EB, the electrons passing through each pinhole 21, 22, 23 About 99% or more of the line EB passes through the inner wall surfaces of the pinholes 21, 22, and 23 without being irradiated. In other words, an electron beam EB of less than about 1% is irradiated on the inner wall surface of each pinhole 21, 22, 23, and heat is generated on the inner wall surface.

Since the central member 113 is formed using a material having high thermal conductivity such as copper, the heat generated on the inner wall surface of each pinhole 21, 22, 23 is transferred from the inner wall surface to the entire central member 113. It spreads quickly toward.
Further, the refrigerant circulated between the cooling section 31 flows in the cooling channel 32 of the central member 113, and the heat diffused throughout the central member 113 is absorbed by the circulating refrigerant. . In other words, the inner wall surfaces of the pinholes 21, 22 and 23 are cooled by the refrigerant circulating in the cooling flow path 32.

[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to FIGS.
The basic configuration of the electron beam irradiation apparatus of this embodiment is the same as that of the first embodiment, but the configuration of the irradiation unit is different from that of the first embodiment. Therefore, in the present embodiment, only the configuration of the irradiation unit will be described using FIGS. 4 to 6, and description of other components and the like will be omitted.
FIG. 4 is a schematic diagram illustrating the configuration of the irradiation unit in the electron beam irradiation apparatus of the present embodiment.
In addition, about the component same as 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

The irradiation unit 202 of the electron beam irradiation apparatus (energy beam irradiation apparatus) 201 irradiates the mold M disposed on the irradiation stage 7 with an electron beam and performs surface treatment such as quenching on the mold M. (See FIG. 1).
As shown in FIG. 4, the irradiation unit 202 includes an electron beam generation unit 11 that generates an electron beam, and an emission unit (irradiation unit) 212 that guides and emits the generated electron beam toward a mold. Is provided.

  As shown in FIG. 4, the emission unit 212 includes a central member 213 in which a high vacuum pinhole 21, a medium vacuum pinhole 22, and a low vacuum pinhole 23 through which an electron beam EB passes, and a differential exhaust unit 4. Are provided with a middle vacuum exhaust chamber 225 and a low vacuum exhaust chamber 226.

FIG. 5 is a side view for explaining the configuration of the central member in FIG. 4.
As shown in FIGS. 4 and 5, the central member 213 is a substantially plate-like member formed of a material having high thermal conductivity such as copper, for example, and the central member 213 includes a cooling unit 31 that supplies a refrigerant. And a cooling flow path 242 connected to the. Further, the central member 113 includes a through-hole 235 that connects the medium vacuum exhaust chamber 125 to the high vacuum pinhole 21 and the medium vacuum pinhole 22, a low vacuum exhaust chamber 126, the medium vacuum pinhole 22, and the low vacuum pinhole 23. And a through hole 236 connecting the two.

The middle vacuum exhaust chamber 225 is a space connected to the differential exhaust section 4, the high vacuum pinhole 21, and the middle vacuum pinhole 22. The middle vacuum exhaust chamber 225 is formed on one side surface (the right side surface in FIG. 4) of the central member 213 so as to cover the outside of the region where the high vacuum pinhole 21 is formed.
The low vacuum exhaust chamber 226 is a space connected to the differential exhaust unit 4, the intermediate vacuum pinhole 22, and the low vacuum pinhole 23. The low vacuum evacuation chamber 226 is disposed on the other side surface (the left side surface in FIG. 4) of the central member 213 so as to cover the outside of the region where the high vacuum pinhole 21 and the medium vacuum pinhole 22 are formed. .

FIG. 6 is a schematic diagram illustrating the configuration of the bypass flow path in the cooling flow path of FIG.
As shown in FIG. 5, the cooling flow path 242 is a flow path through which a coolant that cools the central member 213 flows.
As shown in FIGS. 5 and 6, the cooling flow path 242 includes a pair of linear flow paths 243 that sandwich the pinholes 21, 22, and 23 and extend along the pinholes 21, 22, and 23. A bypass channel 244 that bypasses the medium vacuum pinhole 22 and connects the straight channel 243 is provided. Furthermore, the cooling flow path 242 is connected to the cooling unit 31 provided outside the emitting unit 212 so as to form a path through which the refrigerant circulates.

  The cooling unit 31 takes heat from the refrigerant that has absorbed heat in the central member 213 and releases it to the outside. As the configuration of the cooling unit 31 and the refrigerant, known configurations and substances can be used, and are not particularly limited.

Next, the differential exhaust in each pinhole 21, 22, and 23 of the irradiation part 202 in the electron beam irradiation apparatus 201 which consists of said structure, and the cooling of the irradiation part 202 are demonstrated.
In addition, the description about the same effect as 1st Embodiment is abbreviate | omitted.

As shown in FIG. 4, the differential exhaust section 4 keeps the inside of the middle vacuum exhaust chamber 225 at a pressure of about 10 Pa and the inside of the low vacuum exhaust chamber 226 at a pressure of about 1000 Pa by performing exhaust.
Then, a pressure gradient is formed inside the low vacuum pinhole 23 so that the end on the mold M side is at atmospheric pressure (about 100,000 Pa) and the end on the low vacuum exhaust chamber 226 side is at low vacuum (about 1000 Pa). The On the other hand, a pressure gradient is formed inside the intermediate vacuum pinhole 22 so that the end on the low vacuum exhaust chamber 226 side is low vacuum and the end on the intermediate vacuum exhaust chamber 225 side is medium vacuum (about 10 Pa). Furthermore, a pressure gradient is formed inside the high vacuum pinhole 21 so that the end on the medium vacuum exhaust chamber 125 side is in a medium vacuum and the end on the electron beam generating unit 11 side is in a high vacuum (about 10 ⁻³ Pa). Is done.

  On the other hand, since the inner diameter of each pinhole 21, 22, 23 is set to a larger hole diameter than the diameter corresponding to 3σ related to the density distribution of the electron beam EB, the electrons passing through each pinhole 21, 22, 23 About 99% or more of the line EB passes through the inner wall surfaces of the pinholes 21, 22, and 23 without being irradiated. In other words, an electron beam EB of less than about 1% is irradiated on the inner wall surface of each pinhole 21, 22, 23, and heat is generated on the inner wall surface.

  Since the central member 213 is formed using a material having high thermal conductivity such as copper, the heat generated on the inner wall surface of each pinhole 21, 22, 23 is transferred from the inner wall surface to the entire central member 213. It spreads quickly toward.

  Furthermore, as shown in FIG. 5, the refrigerant circulated between the cooling unit 31 flows in the cooling flow path 242 of the central member 213, and the heat diffused throughout the central member 213 is Absorbed by circulating refrigerant. In other words, the inner wall surfaces of the pinholes 21, 22 and 23 are cooled by the refrigerant circulating in the cooling flow path 242.

  Specifically, the refrigerant supplied from the cooling unit 31 flows into one linear flow path 243 of the cooling flow path 242 and flows from the high vacuum pinhole 21 side toward the low vacuum pinhole 23 side. Thereafter, as shown in FIGS. 5 and 6, the refrigerant flows through the bypass channel 244 and flows into the other straight channel 243. The refrigerant flows through the other straight flow path 243 from the low vacuum pinhole 23 side toward the high vacuum pinhole 21 side, and flows into the cooling unit 31.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the present invention has been described as applied to an electron beam irradiation apparatus that irradiates an electron beam. However, the present invention is not limited to this electron beam irradiation apparatus, and an energy beam such as a laser is irradiated. It can be applied to other various irradiation apparatuses.
Further, although the present invention has been described by applying it to an electron beam irradiation apparatus that irradiates a mold with an electron beam and performs a quenching process, the object to be irradiated with the electron beam is not limited to the mold, and is particularly limited. Not what you want.

It is a schematic diagram explaining schematic structure of the electron beam irradiation apparatus which concerns on the 1st Embodiment of this invention. It is the schematic explaining the structure of the irradiation part of FIG. It is a schematic diagram explaining the structure of the irradiation part in the electron beam irradiation apparatus of the 2nd Embodiment of this invention. It is a schematic diagram explaining the structure of the irradiation part in the electron beam irradiation apparatus of the 3rd Embodiment of this invention. It is a side view explaining the structure of the center member of FIG. It is a schematic diagram explaining the structure of the detour channel in the cooling channel of FIG.

Explanation of symbols

1,101,201 Electron beam irradiation device (energy beam irradiation device)
2,102,202 Irradiation part 4 Differential exhaust part 11 Electron beam generation part (generation part)
12, 112, 212 emitting part (irradiating part)
21 High vacuum pinhole (through hole)
22 Medium vacuum pinhole (through hole)
23 Low vacuum pinhole (through hole)
31 Cooling part 32 Cooling channel (cooling part)
M Mold (Subject to be irradiated)

Claims (4)

A generator for generating energy rays;
A plurality of through holes that open toward the irradiated body and through which the energy rays pass;
An irradiation section in which the plurality of through holes are integrally formed;
A differential exhaust part that communicates with the plurality of through holes and forms a pressure gradient in the plurality of through holes by exhausting; and
An energy beam irradiating apparatus characterized in that is provided.   The energy beam irradiation apparatus according to claim 1, wherein the irradiation unit is made of a material having high thermal conductivity.   3. The diameter according to claim 1, wherein a diameter of the plurality of through-holes is a diameter corresponding to 3σ related to a density distribution or an intensity distribution in an energy beam passing through the plurality of through-holes even if the diameter is small. Energy beam irradiation device.   The energy beam irradiation apparatus according to claim 1, further comprising a cooling unit that cools the irradiation unit.

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