JP2009053007A - Test method of semiconductor device, relay circuit, and probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a test method of a semiconductor device capable of testing an analog element highly accurately by using a digital tester having wide versatility. <P>SOLUTION: In this test method of the semiconductor device, the digital tester 2 for outputting a digital signal for a test is electrically connected to the analog element 82 of the semiconductor device 8 through a D/A converter 42, and the digital signal outputted from the digital tester 2 is converted into an analog signal by the D/A converter 42, and the analog signal is inputted into the analog element 82 to test the analog element 82. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a test method for a semiconductor device having an analog element, a relay circuit, and a probe card. In particular, the present invention relates to a semiconductor device test method, a relay circuit, and a probe card of a semiconductor device that can test an analog element with high accuracy using a test device for digital elements.

  FIG. 6 is a diagram for explaining a conventional test method for a semiconductor device having an analog element. The semiconductor device 108 has an A / D converter 109. The A / D converter 109 is tested for linearity.

  In the example shown in the figure, the A / D converter 109 is tested using the analog mode of the digital tester 102 manufactured for testing the digital element. The analog signal output from the digital tester 102 is input to the input pad 108 a of the semiconductor device 108 via the probe card 106. The analog signal input to the pad 108a is converted into a digital signal by the A / D converter 109, and this digital signal is output from the output pad 108b. The digital signal output from the pad 108 b is input to the digital tester 102 via the probe card 106 (not shown) and is analyzed by the digital tester 102. A similar technique is described in Patent Document 1.

JP 2001-99808 A

  When testing an analog element such as an A / D converter with high accuracy, high accuracy is required for an analog signal input to the analog element. However, when the analog device is tested using the analog mode of the digital tester, the analog signal input to the analog device may not obtain the required accuracy (or resolution). Although it is conceivable to use a tester for an analog element, the tester for the analog element is expensive, so that the cost becomes high.

  The present invention has been made in consideration of the above-described circumstances, and its purpose is to test a semiconductor device capable of testing an analog element with high accuracy using a highly versatile digital tester, It is to provide a relay circuit and a probe card.

In order to solve the above problems, a first semiconductor device testing method according to the present invention is a semiconductor device testing method for testing a semiconductor device having an analog element,
A digital tester that outputs a test digital signal is electrically connected to the analog element of the semiconductor device via a D / A converter,
The D / A converter converts the digital signal output from the digital tester into an analog signal, and the analog signal is input to the analog element, thereby testing the analog element.

  According to this semiconductor device test method, the test analog signal is generated from the digital signal output from the digital tester. The resolution of the digital signal output from the digital tester is high. For this reason, the resolution, that is, the accuracy of the analog signal is increased, and as a result, the analog element can be tested with high accuracy by using a versatile digital tester.

A second semiconductor device testing method according to the present invention is a semiconductor device testing method for testing a first semiconductor device having a digital element and for testing a second semiconductor device having an analog element. ,
An input terminal electrically connected to a digital tester for outputting a test digital signal, an output electrically connected to the digital element of the first semiconductor device or the analog element of the second semiconductor device A terminal, a D / A converter, a first wiring for inputting a digital signal input to the input terminal to the D / A converter, and a second for transmitting an analog signal output from the D / A converter to the output terminal. Wiring, a third wiring for transmitting a digital signal input to the input terminal to the output terminal, a first switch provided in the first wiring or the second wiring, and the third wiring Preparing a relay circuit including each of the second switches provided in
Connecting the input terminal to the digital tester;
When testing the digital element of the first semiconductor device, the output terminal is connected to the first semiconductor device, the first switch is turned OFF, and the second switch is turned ON, Input a digital signal from the digital tester to the input terminal,
When testing the analog element of the second semiconductor device, connect the output terminal to the second semiconductor device, turn on the first switch, and turn off the second switch, A digital signal is input from the digital tester to the input terminal.

  According to this semiconductor device test method, the same effect as the first semiconductor device test method can be obtained. In addition, both the first semiconductor device and the second semiconductor device can be tested without removing the relay circuit.

  The relay circuit may be provided with a plurality of the input terminals and the output terminals. The first wiring and the third wiring may be provided for each of the plurality of input terminals, and the second switch element may be provided for each of the plurality of third wirings. .

  In this case, the relay circuit may be provided with a plurality of the second wirings. Each of the plurality of second wirings may include the second switch element, and the analog signal output from the D / A converter may be transmitted to different output terminals. In this way, the analog signal can be transmitted to any of the output terminals. As a result, the structure of the second semiconductor device is changed and the analog element is connected to another output terminal. Even if this happens, there is no need to change the configuration of the relay circuit.

  The relay circuit may be a probe card. In this case, the output terminal is a probe terminal.

The relay circuit according to the present invention includes an input terminal electrically connected to a digital tester that outputs a test digital signal;
An output terminal electrically connected to a digital element included in the first semiconductor device or an analog element included in the second semiconductor device;
A D / A converter;
A first wiring for inputting a digital signal input to the input terminal to the D / A converter;
A second wiring for transmitting an analog signal output from the D / A converter to the output terminal;
A third wiring for transmitting a digital signal input to the input terminal to the output terminal;
A first switch element provided in the second wiring;
And a second switch element provided on the third wiring.

The probe card according to the present invention includes an input terminal electrically connected to a digital tester that outputs a test digital signal,
A probe terminal electrically connected to a digital element included in the first semiconductor device or an analog element included in the second semiconductor device;
A D / A converter;
A first wiring for inputting a digital signal input to the input terminal to the D / A converter;
A second wiring for transmitting an analog signal output from the D / A converter to the output terminal;
A third wiring for transmitting a digital signal input to the input terminal to the output terminal;
A first switch element provided in the second wiring;
A second switch element provided in the third wiring;
It comprises.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram for explaining a test method for a semiconductor device according to the first embodiment of the present invention. The method shown in this figure is a method for testing the linearity of the A / D converter 82 included in the semiconductor device 8 using a digital signal output from the digital tester 2 for testing a digital element.

  Between the digital tester 2 and the semiconductor device 8, the relay circuit 4 and the probe card 6 are located. The relay circuit 4 and the probe card 6 are attached to the digital tester 2. Digital signals output from the digital tester 2 are input to a plurality of input terminals 41 included in the relay circuit 4. A signal indicating “0” or “1” is input to each of the input terminals 41, and the signals input to the plurality of input terminals 41 constitute one digital signal. The relay circuit 4 includes a D / A converter 42, and digital signals input to the plurality of input terminals 41 are input to the D / A converter 42 via a plurality of wirings 43. Converted to analog signal. The converted analog signal is transmitted to the output terminal 45 of the relay circuit 4 via the wiring 44. The analog signal transmitted to the output terminal 45 is input to the A / D converter 82 of the semiconductor device 8 through the probe card 6 (including the probe terminal 62) and the input pad 81 of the semiconductor device 8. The analog signal input to the A / D converter 82 is converted into a digital signal and output from the output pad 83 of the semiconductor device 8. Although not shown, the digital signal output from the pad 83 is input to the digital tester 2 via the probe card 6 (including the probe terminal) and analyzed.

  As described above, in this embodiment, the analog signal for testing is generated by converting the digital signal output from the digital tester 2 into an analog signal. The resolution of the digital signal output from the digital tester 2 is high. For this reason, the resolution, that is, the accuracy of the analog signal for testing is increased. As a result, the analog device can be tested with high accuracy by using a highly versatile testing device for digital devices.

  Note that the number of bits of the digital signal output from the digital tester 2 is constant, so that the resolution of the analog signal output from the D / A converter 42 and the voltage width that the analog signal can take are inversely proportional. That is, when the resolution of the analog signal is increased, the voltage width that can be taken by the analog signal is narrowed, and when the analog signal is widened, the resolution of the analog signal is decreased. Since the resolution of the analog signal and the voltage width that the analog signal can take are determined by the characteristics of the D / A converter 42, the resolution of the analog signal and the voltage width that the analog signal can take are changed by replacing the D / A converter 42. The characteristics of the A / D converter 82 included in the semiconductor device 8 can be matched.

  FIG. 2 is a diagram for explaining a test method for a semiconductor device according to the second embodiment of the present invention. The present embodiment is different from the first embodiment except that the relay circuit 4 includes an input terminal 41a to which a digital signal is input from the digital tester 2 and a wiring 43a for connecting the input terminal 41a and the wiring 44. The configuration is the same as that of the embodiment. Hereinafter, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In this embodiment, when the output terminal 45 is electrically connected to the D / A converter of the semiconductor device 8, a digital signal is input to each input terminal 41, but a digital signal is input to the input terminal 41a. Not. On the other hand, when the output terminal 45 is connected to a digital element of another semiconductor device via the probe card 6, a digital signal is input to the input terminal 41a, but a digital signal is input to each of the input terminals 41. Not.

  Also according to this embodiment, the same effect as that of the first embodiment can be obtained. Further, the semiconductor device 8 having the A / D converter 82 and the semiconductor device having a digital element (for example, a transistor) can be tested while the relay circuit 4 is attached to the digital tester 2.

  FIG. 3 is a diagram for explaining a test method for a semiconductor device according to the third embodiment of the present invention. This embodiment is the same as the first embodiment except for the configuration of the relay circuit 4. Hereinafter, the same components as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the present embodiment, the relay circuit 4 has the same number of output terminals 45 as the input terminals 41. Each of the plurality of input terminals 41 is connected to a different output terminal 45 through a wiring 48. Each of the plurality of wirings 48 is provided with a tristate buffer 49 as a switch. A wiring 44 is connected to any one of the output terminals 45. The wiring 44 is also provided with a tristate buffer 46 as a switch.

  The same control signal is input from the input terminal 47 to all of the tristate buffers 46 and 49, but when the tristate buffer 46 is turned on (in the example shown in the figure, the control signal is “0”). The tri-state buffer 49 is turned off, and the tri-state buffer 49 is turned on when the tri-state buffer 46 is turned off (when the control signal is “1” in the example shown in the figure).

  According to this embodiment, both the semiconductor device 8 having the A / D converter 82 and the semiconductor device having a digital element (for example, a transistor) can be tested while the relay circuit 4 is attached to the digital tester 2.

  That is, when testing the semiconductor device 8 having the A / D converter 82, the tristate buffer 46 may be turned on and the tristate buffer 49 may be turned off. In this way, the digital signal input to the input terminal 41 is not transmitted to the output terminal 45, and is converted to an analog signal by the D / A converter 42 before being transmitted to any output terminal 45.

  When testing a semiconductor device having a digital element, the tristate buffer 46 may be turned off and the tristate buffer 49 may be turned on. In this way, the digital signal input to the input terminal 41 is directly transmitted to the output terminal 45, and the analog signal generated by the D / A converter 42 is not transmitted to the output terminal 45.

  As described above, the present embodiment can provide the same effects as those of the first embodiment. Further, the semiconductor device 8 having the A / D converter 82 and the semiconductor device having a digital element (for example, a transistor) can be tested while the relay circuit 4 is attached to the digital tester 2. Further, there is no need to change the design of the semiconductor device and the chip size, and therefore the unit price of the semiconductor device does not increase.

  FIG. 4 is a diagram for explaining a test method for a semiconductor device according to the fourth embodiment of the present invention. The present embodiment is the same as the third embodiment except for the configuration of the relay circuit 4. Hereinafter, the same components as those of the third embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the present embodiment, the wiring 44 of the relay circuit 4 branches into a plurality before connecting to the output terminal 45 and is connected to each of the plurality of output terminals 45. A tristate buffer 46 is provided for each of the plurality of wirings 44 after branching. Control signals for the plurality of tristate buffers 46 are input from different input terminals 46a. Further, the same control signal is input to the plurality of tristate buffers 49 from the input terminal 49a. That is, in the present embodiment, all the tristate buffers 46 are controlled independently from any of the other tristate buffers 46 and the tristate buffers 49, but the plurality of tristate buffers 49 are all turned on or off at the same time. To do.

  According to the present embodiment, the same effect as that of the third embodiment can be obtained. In addition, since an analog signal can be output from any of the output terminals 45 of the relay circuit 4, the A / D converter 82 can be connected to any input pad 81 even if the A / D converter 82 is electrically connected. The converter 82 can be tested. For this reason, even if the structure of the semiconductor device 8 changes and the pad 81 to which the A / D converter 82 is connected changes, it is not necessary to change the configuration of the relay circuit 4.

  FIG. 5 is a diagram for explaining a test method for a semiconductor device according to the fifth embodiment of the present invention. In the present embodiment, the circuit shown as the relay circuit 4 in the third embodiment is built in the probe card 6, and the output terminals 45 are not provided and the wirings 44 and 48 are directly connected to the probe card 6. The third embodiment is the same as the third embodiment except that it is connected to the terminal 62. Hereinafter, the same components as those of the third embodiment are denoted by the same reference numerals, and description thereof is omitted.

  According to this embodiment, the same effect as that of the third embodiment can be obtained. Further, since it is not necessary to provide the relay circuit 4 independently, it is not necessary to make a large change to the digital tester 2 and the devices associated therewith.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in each of the embodiments described above, the semiconductor device 8 may have another analog element instead of the A / D converter 82. In this case, other analog elements are tested.

  In each of the first, second, and fourth embodiments, the circuit shown as the relay circuit 4 is built in the probe card 6 as in the third embodiment, and the wirings 44 and 48 are directly connected to the probe card. 6 probe terminals 62 may be connected. In each of the modified examples and the third to fifth embodiments, the tristate buffer 46 may be provided in the wiring 43 instead of the wiring 44.

The figure for demonstrating the testing method of the semiconductor device which concerns on 1st Embodiment. The figure for demonstrating the testing method of the semiconductor device which concerns on 2nd Embodiment. The figure for demonstrating the testing method of the semiconductor device which concerns on 3rd Embodiment. The figure for demonstrating the testing method of the semiconductor device which concerns on 4th Embodiment. The figure for demonstrating the testing method of the semiconductor device which concerns on 5th Embodiment. The figure for demonstrating the conventional test method of the semiconductor device which has an analog element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2,102 ... Digital tester, 4 ... Relay circuit, 6,106 ... Probe card, 8, 108 ... Semiconductor device, 41, 41a, 46a, 47, 49a ... Input terminal, 42 ... D / A converter, 43, 43a , 44, 48 ... wiring, 45 ... output terminal, 46, 49 ... tristate buffer, 62 ... probe terminal, 81, 83, 108a, 108b ... pad, 82, 109 ... A / D converter

Claims (7)

A test method for a semiconductor device for testing a semiconductor device having an analog element,
A digital tester that outputs a test digital signal is electrically connected to the analog element of the semiconductor device via a D / A converter,
A test method for a semiconductor device, wherein a digital signal output from the digital tester is converted into an analog signal by the D / A converter, and the analog element is tested by inputting the analog signal to the analog element. A test method for a semiconductor device for testing a first semiconductor device having a digital element and testing a second semiconductor device having an analog element,
An input terminal electrically connected to a digital tester for outputting a test digital signal, an output electrically connected to the digital element of the first semiconductor device or the analog element of the second semiconductor device A terminal, a D / A converter, a first wiring for inputting a digital signal input to the input terminal to the D / A converter, and a second for transmitting an analog signal output from the D / A converter to the output terminal. Wiring, a third wiring for transmitting a digital signal input to the input terminal to the output terminal, a first switch provided in the first wiring or the second wiring, and the third wiring Preparing a relay circuit including each of the second switches provided in
Connecting the input terminal to the digital tester;
When testing the digital element of the first semiconductor device, the output terminal is connected to the first semiconductor device, the first switch is turned OFF, and the second switch is turned ON, Input a digital signal from the digital tester to the input terminal,
When testing the analog element of the second semiconductor device, connect the output terminal to the second semiconductor device, turn on the first switch, and turn off the second switch, A test method for a semiconductor device, wherein a digital signal is input to the input terminal from the digital tester. In the relay circuit,
A plurality of the input terminals and the output terminals are provided,
The first wiring and the third wiring are provided for each of the plurality of input terminals,
The semiconductor device testing method according to claim 2, wherein the second switch element is provided in each of the plurality of third wirings. In the relay circuit,
A plurality of the second wirings are provided;
4. The semiconductor device according to claim 3, wherein each of the plurality of second wirings includes the second switch element and transmits an analog signal output from the D / A converter to the different output terminals. Test method. The relay circuit is a probe card;
The method for testing a semiconductor device according to claim 2, wherein the output terminal is a probe terminal. An input terminal electrically connected to a digital tester for outputting a test digital signal;
An output terminal electrically connected to a digital element included in the first semiconductor device or an analog element included in the second semiconductor device;
A D / A converter;
A first wiring for inputting a digital signal input to the input terminal to the D / A converter;
A second wiring for transmitting an analog signal output from the D / A converter to the output terminal;
A third wiring for transmitting a digital signal input to the input terminal to the output terminal;
A first switch element provided in the second wiring;
A second switch element provided in the third wiring;
A relay circuit comprising: An input terminal electrically connected to a digital tester for outputting a test digital signal;
A probe terminal electrically connected to a digital element included in the first semiconductor device or an analog element included in the second semiconductor device;
A D / A converter;
A first wiring for inputting a digital signal input to the input terminal to the D / A converter;
A second wiring for transmitting an analog signal output from the D / A converter to the output terminal;
A third wiring for transmitting a digital signal input to the input terminal to the output terminal;
A first switch element provided in the second wiring;
A second switch element provided in the third wiring;
A probe card comprising:

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