JP2009048869A - Camera module socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera module socket to improve grounding to electronic equipment. <P>SOLUTION: The camera module socket 1 is built in electronic equipment E and inserted into a through hole TH provided beforehand in an electronic circuit board PWB and connected and fixed to the electronic circuit board PWB. At least the bottom part 13c of the camera module socket 1 is formed of a good conductor metal plate and a part of the metal plate is cut out and raised outward to form a case shield part 13b having a spring force, and the case shield part 13b can contact by the spring force the inner face E1 of the case of the electronic equipment E in the electronic equipment E. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a camera module socket used when a camera module used in an electronic device is attached to the electronic device.

A camera module incorporating an image sensor is required to be downsized as an electronic device such as a mobile phone is downsized. Naturally, a small camera module is developed while having a high imaging function.
However, the camera module must be provided with functions such as a macro function by taking up as much volume as possible in order to achieve higher functionality.
Therefore, in developing a camera module socket for attaching the camera module to an electronic device or the like, it has been desired to reduce the volume of the socket as much as possible.

Conventional camera module sockets include a surface mount type that is attached to a mounting surface of an electronic circuit board such as an electronic device, and a camera module socket that is inserted through the mounting surface of an electronic circuit board such as an electronic device. There was a through-hole attachment type in which a camera module socket was inserted into the open through hole and the peripheral portion of the socket was fixed to the electronic circuit board.
A conventional through-hole mounting type camera module socket has a connector described in JP-A-2006-140111. A typical example of this through-hole mounting type camera module socket is as shown in FIG.
FIG. 8 is an explanatory perspective view of a conventional camera module socket 100 as viewed obliquely from above. FIG. 9 is a central longitudinal cross-sectional explanatory view for explaining a process of mounting the conventional camera module socket 100 on an electronic circuit board PWB built in an electronic device such as a mobile phone.

The camera module socket 100 inserts and locks the camera module CM from the upper surface opening 104 into a box-shaped casing 101 having an upper surface opened. The bottom surface 101 facing the top surface opening 104 of the camera module socket 100 is pressed and contacted with a contact portion (not shown) provided on the bottom surface (not shown) on the insertion side of the camera module CM to be electrically connected to the camera module CM. A plurality of module contacts 103 are provided side by side. The module contact 103 forms a module contact portion 103 a with one end rising from the bottom surface of the housing 101 to the upper surface opening 104 side, and the intermediate portion 103 b is fixed to the housing 101. The other end of the module contact 103 protrudes outward from the side surface of the housing 101 to form a board connection portion 103c that is connected and fixed to the electronic circuit board PWB by solder or the like.
The housing 101a is substantially formed by a housing 101a formed of an insulator such as a polymer resin. In addition, the housing 101a covers a side wall 101b erected from the four sides of the bottom surface 102 of the housing 101a, and a part of the housing 101a can be locked with a locking recess (not shown) provided in the periphery of the camera module CM. A plurality of locking portions 105 projecting with an urging force from the side wall 101b to the center side are provided.

  As shown in FIG. 9, the electronic circuit board PWB for mounting and fixing the conventional camera module socket 100 is formed with a through hole TH in the rectangular shape of the housing 101, and around the through hole TH, A plurality of attachment contact portions PWB1 fixed to the board connecting portion 103c of the camera module socket 100 are provided in accordance with the board connecting portion 103c. The attachment contact PWB1 transmits predetermined information from the camera module CM to the electronic circuit board PWB through the module contact 103 of the camera module socket 100 when the camera module CM is inserted and connected and fixed.

  The board connection portions 103 c of the module contacts 103 that protrude from the camera module socket 100 protrude outward from the opposing side walls 101 b of the housing 101. In addition, on a pair of side walls from which the module contact portion 103a does not protrude, a ground terminal GND connected to and fixed to the electronic circuit board PWB is projected in the same manner as the board connection portion 103c so as to be provided in advance on the electronic circuit board PWB ( (Not shown) and fixed.

As shown in FIG. 9, the camera module socket 100 formed in this way is inserted in the through hole TH and provided around the casing 101 in a state of penetrating from one surface of the electronic circuit board PWB to the other surface side. The board connecting portion 103c and the ground terminal GND are connected and fixed to the electronic circuit board PWB by soldering or the like.
JP 2006-140111 A

However, in the conventional camera module socket 100, the shield of the camera module socket 100 has the ground terminal GND connected to the electronic circuit board PWB by soldering, and the ground shield with the case C of the electronic device is shown in FIG. As described above, since the earth terminal ET provided on the electronic circuit board PWB is only brought into contact with the case C, there is a problem that sufficient shielding cannot be performed.
When the camera module CM mounted in the camera module socket 100 is inserted into the case C of the electronic device, the camera is normally attached to the camera module CM by a barrier lens (not shown) and a rubber seal (not shown) from the upper surface side of the camera module CM. The module CM is fixed. In this case, since a barrier lens (not shown) and a rubber seal (not shown) generate stress on the side that pressurizes the camera module CM, the camera module CM is attached. The camera module socket 100 is subjected to stress on the side where it is peeled off from the electronic circuit board PWB, and the camera module socket 100 is partially peeled off from the electronic circuit board PWB due to vibrations applied to the electronic device. There was a problem that the connection could not be made.

  SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a camera module socket that can more reliably shield the through-hole mounting type camera module socket and prevent the substrate connection portion from peeling off.

  In this invention, in order to support the camera module socket on the bottom side of the camera module socket of the through-hole mounting type to the case of the electronic device to which the camera module socket is mounted,

A camera module socket that is built in an electronic device, is inserted into a through-hole previously drilled in an electronic circuit board, and is fixedly connected to the electronic circuit board.
At least the bottom of the camera module socket is formed from a good conductor metal plate, and a part of the metal plate is cut and raised outward to form a case shield portion having a spring force,
A camera module socket characterized in that the case shield part can contact the inner surface of the electronic device with spring force in the electronic device,

  and,

A camera module socket that is built in an electronic device, is inserted into a through-hole previously drilled in an electronic circuit board, and is fixedly connected to the electronic circuit board.
A housing in which one side is formed as a top opening, and a housing is formed by standing a housing side wall from four sides of the bottom facing the top opening to the top opening;
One end is positioned on the bottom surface of the housing to form a module contact portion, the other end is projected from the side wall of the housing to the outside to form a board connection portion, and an intermediate portion is fixed to the housing. A plurality of contacts for projecting the board connecting portion from the side wall of the housing so as to electrically connect the inside and the outside of the housing;
A metal plate-like body made of a good conductor is formed in a concave shape that can be fitted to the bottom of the housing, and at least a ground terminal portion that protrudes in a bowl shape from a side wall of the housing that does not protrude a contact from the periphery of the concave opening end, and A shield member that forms a case shield part having a spring force by cutting and raising a part of the metal plate-like body on the outer surface of the bottom part facing the concave opening;
It is made of a metal plate made of a good conductor, bent into a U-shape that can be fitted to the housing side wall from the top opening side, and fitted to the housing side wall. A module ground terminal part is formed to connect with the camera module by projecting with spring force and making contact with the camera module inserted in the housing. The other part is directly connected to the shield member or around the through hole. A module shield member that forms a substrate-side ground terminal portion electrically connected to the shield member via
The camera module socket pre-drilled in the electronic circuit board is inserted into the rectangular through hole, and the mounting contact part provided in advance in the peripheral part of the through hole and the board connecting part of the contact are connected and fixed, and the peripheral part of the through hole A camera is characterized in that a ground mounting portion provided in advance and a ground terminal portion are connected and fixed to be attached to the electronic circuit board, and the case shield portion of the shield member is brought into contact with the case of the electronic device to which the electronic circuit board is attached. Module socket,

I will provide a. Therefore, the camera module socket is electrically connected to the module contact portion of the contact by inserting and fixing the camera module from the upper surface opening of the housing. On the other hand, the substrate connection portion of the contact is electrically connected to an attachment contact portion provided around the through hole. At this time, the board connecting portion is also mechanically fixed to the electronic circuit board by soldering or the like. On the other hand, the ground terminal portion of the shield member is electrically connected to a ground attachment portion provided around the through hole. At this time, the ground terminal portion is also mechanically fixed to the electronic circuit board by soldering or the like.
When the camera module socket is built in the electronic device while being connected and fixed to the electronic circuit board, a case shield portion provided on the shield member protrudes on the bottom surface side of the camera module socket, An earth shield is formed directly on the inner surface of the case by pressing against the inner surface of the case.

Therefore, according to the present invention, when the camera module socket is installed in the electronic device, the case shield portion of the shield member protruding from the bottom surface of the camera module socket directly contacts the inner surface of the case of the electronic device to form an earth shield. Since this is possible, the earth shield can be formed more reliably.
Furthermore, since the case shield part is in contact with the case of the electronic device, in order to fix the camera module socket in the case, an electronic device using a barrier lens or rubber seal provided on the lens side of the camera module attached to the socket is provided. The connection with the circuit board can be resisted against the pressing force acting on the side to be peeled off, and it is possible to prevent a failure such as the connection between the electronic circuit board and the socket being peeled off.

A camera module socket 1 (hereinafter simply referred to as a socket 1) is fitted with a small camera module CM incorporated in the electronic device E. On the other hand, a through hole TH is formed in advance in the electronic circuit board PWB in the electronic device E to which the socket 1 can be attached. The through-hole TH is inserted through the camera module CM and is fixedly connected to the electronic circuit board PWB. A mounting contact portion PWB1 is provided around the through-hole TH so as to match the socket 1. It is fixed by soldering.
The socket 1 includes a housing body having a rectangular box shape with one side opened as an upper opening 11a, a module contact 12 attached to the housing body 11, and a metal plate as a conductive member formed in a concave housing shape. The shield member 13 is fitted to the housing 11 from outside the bottom, and the module shield member 14 is fitted and locked to the housing side wall 11b of the housing 11 to come into contact with the camera module CM and ground the camera module CM. .

  The housing 11 has a housing shape having an upper surface opened by a housing side wall 11b erected from the bottom four sides of the housing 11 to the upper surface opening 11a, and is formed of an insulating member such as a polymer resin.

  The module contact 12 is formed by bending a metal plate of a good conductor having a spring force. The module contact 12 forms a module contact portion 12 a that is erected by bending one end from the bottom surface of the housing 11 toward the upper opening 11, and the intermediate portion 12 b is fixed to the housing 11. The other end of the module contact 12 protrudes outward from the side of the housing side wall 11b of the housing 11 to form a board connecting portion 12c that is connected and fixed to the electronic circuit board PWB by solder or the like. A plurality of module contacts 12 formed in this way are arranged in parallel on the bottom surface of the housing 11. At this time, the parallel connection is made in two rows on the bottom surface so that the board connection portions 12c protrude from the pair of opposite housing side walls 11b. Then, when the camera module CM is inserted into the housing 11, the module contact 12 comes into contact with a contact portion provided at a position facing the module contact portion 12a at the bottom of the camera module CM. Therefore, a plurality of through holes for projecting the module contacts 12 to the outside of the housing are provided on the bottom side surface of the housing 11.

  The shield member 13 has a concave housing shape that can be fitted into the housing 11 from the outer bottom of the housing 11, and is formed by bending a metal member that is a good conductor. And the fitting to the housing 11 maintains a fitting state with the spring force which the bent metal member has. When the housing 11 is fitted, the shield member 13 has a height from the bottom surface side of the housing 11 to about 1/3 of the housing side wall 11b. At this time, the position of about 1/3 is slightly higher on the bottom side than the position where the board connecting portion 12c of the module contact 12 protrudes outward from the housing 11. In addition, the shield member 13 forms a hook-shaped ground terminal portion 13a by bending the periphery of the concave opening outward in a hook shape. The ground terminal portion 13a is formed by bending at a height position where the substrate connecting portion 12c of the contact 12 projects from the tip end side of the concave opening. The shield member 14 is provided with a case shield part 13b. The case shield portion 13b is formed by being cut and raised outward from the bottom surface portion 13c of the shield member that covers the bottom surface of the housing 11 when the housing 11 is attached, and has a spring force. The cut and raised case shield part 13b is bent into a letter shape, and the corner part of the letter shape forms a contact part 13e. When the electronic circuit board PWB in which the socket 1 is fixed to the through hole TH is attached and fixed to the electronic device E, the contact portion 13e comes into contact with the ground terminal GND provided on the inner surface of the electronic device with a spring force. Is directly connected to the electronic equipment.

  The module shield member 14 is fitted and locked to the housing side wall 11 b of the housing 11. The module shield member 14 is made of a metal member having a good conductor so that a ground can be formed by contacting the camera module CM. The module shield member 14 is a module in which the surface positioned inside the housing 11 in a state of being locked to the housing side wall 11b has a biasing force from the housing side wall 11b to which the module shield member 14 is attached. The ground contact portion 14a is formed in a spring shape. Therefore, when the camera module CM is inserted into the socket 1, the side surface of the camera module CM is pressed against the module ground contact portion 14 a of the module shield member 14 to form a ground. Further, a board-side ground terminal portion formed by bending a part of the module shield member 14 on the side facing the module ground contact portion 14a, that is, on the outer side of the housing side wall 11b, at a substantially right angle. 14b is formed. When the board-side ground terminal portion 14b is attached to the through hole TH, it contacts the ground terminal GND provided around the through hole TH to ground the camera module CM.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing the entirety of an embodiment of the present invention, (a) is a perspective assembly diagram illustrating the entire embodiment of the present invention, and (b) is a perspective diagram illustrating the entire embodiment of the present invention. 2 is a front explanatory view showing the embodiment, FIG. 3 is a right side view showing the embodiment, FIG. 4 is a plan view showing the embodiment, and FIG. 5 is the same embodiment. FIG. 6 is a bottom cross-sectional explanatory view showing an example, FIG. 6 is a vertical cross-sectional explanatory view showing a state where the central portion of FIG. 4 is cut in the horizontal direction, and FIG. is there.

Reference numeral 1 denotes a camera module socket. The camera module socket 1 (hereinafter simply referred to as the socket 1) has a housing shape with an upper opening, and is attached to the electronic circuit board PWB with the camera module CM inserted through the opening and fixed inside. The socket 1 is attached to the electronic circuit board PWB through the through hole TH drilled in the electronic circuit board PWB, and a ground terminal GND provided around the through hole TH at the center of the side of the socket 1 The mounting contact part PEB1 is connected and fixed by soldering or the like.
The socket 1 forms a housing shape by the housing 11. The housing 11 is made of a hard insulating material such as a polymer resin, and has a concave housing whose upper portion is opened as a top opening 11a and whose upper portion is opened by a housing side wall 11b erected from the bottom four sides to the upper opening 11a. Make a shape. Then, contact mounting holes 11c are formed in one row at a position about 1/3 from the bottom of the pair of opposite housing side walls 11b.

  Reference numeral 12 denotes a module contact 12. The module contact 12 is formed by bending a metal plate of a good conductor. The module contact 12 is attached so that one end is located on the inner bottom surface of the housing 11 and the middle part is inserted through the contact attachment hole 11c formed in the housing side wall 11b and the other end is located outside the housing. . The module contact 12 mounted in this way is formed so that the intermediate portion 12b is bent into a U shape with the lower portion opened at the position of the contact mounting hole 11c and can be locked in the mounting hole 11c. Then, one end bent from the intermediate portion 12b to the bottom surface side of the housing 11 is raised from the bottom surface of the housing 11 to the upper opening 11 side and is erected to form a module contact portion 12a. The other end of the module contact 12 protrudes outward from the side of the housing side wall 11b of the housing 11 to form a board connecting portion 12c that is connected and fixed to the electronic circuit board PWB by solder or the like. A plurality of module contacts 12 formed in this manner are arranged in two rows on the bottom surface of the housing 11. That is, the board connecting portion 12c is provided so as to protrude from the pair of opposite housing side walls 11b of the housing 11, and the module contact portion 12a is provided opposite to the bottom surface inside the housing 11. When the camera module CM is inserted into the housing 11, the module contact 12 is brought into contact with a contact terminal portion capable of transmitting and receiving signals provided at a position facing the module contact portion 12 a at the bottom of the camera module CM. .

  Reference numeral 13 denotes a shield member. The shield member 13 is formed by bending a metal plate of a good conductor into a concave housing shape. The concave portion of the shield member 13 is formed so that the concave inner surface shape is substantially the same as the bottom outer shape of the housing 11 so as to be fitted to the bottom surface side of the housing 11. At this time, the side surface forming the concave opening is bent so as to have an inward spring force, and the fitting to the housing 11 is performed by the spring force of the bent metal member. Maintain the mating state. And the recessed part height of the shield member 13 is formed so that it may become about 1/3 of the housing | casing side wall 11b from the bottom face side of the housing 11 at the time of housing 11 fitting. At this time, the tip end position of the concave opening is below the position where the board connecting portion 12c of the module contact 12 protrudes outward of the housing 11. In addition, the shield member 13 forms a hook-shaped ground terminal portion 13a by bending the periphery of the concave opening tip outward in a hook shape. The ground terminal portion 13a bent in a bowl shape is further extended from the end of the concave opening and is bent at the same level as the board connection portion 12c of the module contact 12, and is connected to the other pair of housing side walls. In 11b, it is bent and formed with a width of about 1/3 of the width of the housing side wall 11b which is the central portion of the housing side wall 11b. A flange portion 13d is formed on the pair of side walls of the shield portion 13 where the ground terminal portion 13a is not provided. The flange portion 13d is bent in a bowl shape from the substrate connection portion 12c of the module contact 12 on the bottom surface side of the housing 11. The flange portion 13d is formed so as to cover the board connecting portion 12c of the module contact 12, thereby preventing the module contact 12 from coming into contact with other portions and short-circuiting, and also providing a shielding effect for the module contact 12. I can expect.

  Further, the shield member 13 is provided with a case shield part 13b. The case shield portion 13b is formed by being cut and raised outward from the bottom surface portion 13c of the shield member that covers the bottom surface of the housing 11 when the housing 11 is attached, and has a spring force. The cut and raised case shield part 13b is bent into a letter shape, and the corner part of the letter shape forms a contact part 13e. When the electronic circuit board PWB in which the socket 1 is fixed to the through hole TH is attached and fixed to the electronic device E, the contact portion 13e comes into contact with the ground terminal GND provided on the inner surface of the electronic device with a spring force. Is directly connected to the electronic equipment. Although the position on the bottom surface where the contact portion 13e is provided is not particularly specified, in this embodiment, two portions are cut and raised on the bottom surface on the side of the housing side wall 11b where the contact mounting hole 11c is not formed.

  Reference numeral 14 denotes a module shield member. The module shield member 14 is formed by bending a metal plate of a good conductor into a U shape, and a U-shaped opening is inserted from the upper opening 11a side of the housing side wall 11b of the housing 11 to engage with the housing side wall 11b. Stop. The module earth contact 14a is spring-like on both sides of the surface located inside the socket 1 when the module shield member 14 is attached so as to have a biasing force from the attached housing side wall 11b toward the center in the housing 11. The camera module CM is grounded by coming into contact with the side of the camera module CM inserted into the forming socket 1. Furthermore, between the module ground contact portions 14a, there is provided a module locking portion 14c having a spring force capable of locking with the locking projection CM1 provided on the side of the camera module CM inserted into the socket 1. Accordingly, when the camera module CM is inserted into the socket 1, the side surface of the camera module CM is in press contact with the module ground contact portion 14 a of the module shield member 14, and further, the module locking portion 14 c and the locking protrusion CM 1 are connected. The ground is formed between the camera module CM and the socket 1.

Further, the module shield member 14 is formed with a substrate-side ground terminal portion 14b by bending the outer surface of the attached housing side wall 11b outward. The board-side ground terminal portion 14b is outwardly connected to the outside of the board connecting portion 12c of the contacts 12 arranged in parallel on the pair of housing side walls 11b to which the module contacts 12 are attached. It is formed in a protruding state. The board-side ground terminal part 14b is fixed to the electronic circuit board PWB by soldering or the like, similarly to the board connecting part 12c of the module contact 12.
The module shield member 14 attached to the pair of housing side walls 11b to which the module contacts 12 are not attached has a substrate that is also bent outward in a bowl shape on the surface located outside the housing side walls 11b. A connecting portion 12c is formed. In the module shield member 14 attached to the housing side wall 11b to which the module contact 12 is not attached, the board connecting portions 14b are disposed so as to be located on both sides of the ground terminal portion 13a of the shield member 13 located on the housing side wall 11b. Provide. The board connecting portion 14b can be provided wider than the board connecting portion 14b of the module shield member 14 provided on the housing side wall 11b to which the module contact 12 is attached.

As shown in FIG. 7, the socket 1 to which the camera module CM formed as described above is attached is inserted into the through hole TH of the electronic circuit board PWB, and soldered to the attachment contact portion PWB1 of the electronic circuit board PWB. It is fixed. When the electronic circuit board PWB to which the socket 1 is attached is attached to the electronic device E, the case shield portion 13b provided on the bottom surface of the shield member 13 has a spring force on the device shield member E1 installed inside the casing B of the electronic device E. To form a ground circuit between the camera module CM and the electronic device E.
When the case shield part 13b is pressed into contact with the housing B of the electronic device E, the case shield part is pressed when the camera module CM attached to the socket 1 is pressed from the side opposite to the case shield part 13b. 13b will support the pressing force. As a result, the case shield portion 13b supports the stress generated in the direction in which the ground terminal portion 13a of the shield member 13 and the module shield member 14 substrate-side ground terminal portion 14b are peeled from the mounting contact PWB1 of the electronic circuit board PWB. it can.

  In the above-described embodiment, the connection form of the camera module CM to the socket 1 is not particularly limited, and may be performed by a conventional usage or a constituent member. As long as the case shield portion 13b of the shield member 13 shown in the embodiment is provided and the case shield portion 13b is configured to be grounded to the camera module CM attached to the socket 1, other members and the configuration method thereof are provided. Is not particularly limited.

  The present invention can be used for a camera module socket for mounting a camera module used in an electronic apparatus.

(a) Perspective assembly explanatory view showing the whole of the embodiment of the present invention (b) Perspective explanatory view showing the whole of the embodiment of the present invention Front explanatory view showing an embodiment of the present invention Right side explanatory view showing an embodiment of the present invention Plane explanatory drawing showing the embodiment of this invention Bottom view illustrating the embodiment of the present invention Vertical section explanatory drawing showing the state which cut | disconnected the center part of FIG. 4 to the horizontal direction Partial sectional explanatory drawing showing the state which attached the Example of this invention to the board | substrate Perspective explanatory view showing a conventional example Center cross-sectional explanatory diagram showing a conventional example Installation state explanatory diagram showing a conventional example

Explanation of symbols

E Electronic equipment E1 Equipment shield member B1 Housing PWB Electronic circuit board PWB1 Mounting contact section GND Ground terminal TH Through hole CM Camera module 1 Camera module socket (socket)
11 Housing 11a Upper opening 11b Housing side wall 11c Contact mounting hole 12 Module contact 12a Module contact portion 12b Intermediate portion 12c Board connection portion 13 Shield member 13a Ground terminal portion 13b Case shield portion 13c Shield member bottom surface portion 13d Flange portion 13e Contact portion 14 Module shield member 14a Module ground contact portion 14b Board side ground terminal portion 14c Module locking portion

Claims (2)

A camera module socket that is built in an electronic device, is inserted into a through-hole previously drilled in an electronic circuit board, and is fixedly connected to the electronic circuit board.
At least the bottom of the camera module socket is formed from a good conductor metal plate, and a part of the metal plate is cut and raised outward to form a case shield portion having a spring force,
A camera module socket, characterized in that the case shield part can contact the inner surface of the electronic device with spring force in the electronic device. A camera module socket that is built in an electronic device, is inserted into a through-hole previously drilled in an electronic circuit board, and is fixedly connected to the electronic circuit board.
A housing in which one side is formed as a top opening, and a housing is formed by standing a housing side wall from four sides of the bottom facing the top opening to the top opening;
One end is positioned on the bottom surface of the housing to form a module contact portion, the other end is projected from the side wall of the housing to the outside to form a board connection portion, and an intermediate portion is fixed to the housing. A plurality of contacts for projecting the board connecting portion from the side wall of the housing so as to electrically connect the inside and the outside of the housing;
A metal plate-like body made of a good conductor is formed in a concave shape that can be fitted to the bottom of the housing, and at least a ground terminal portion that protrudes in a bowl shape from a side wall of the housing that does not protrude a contact from the periphery of the concave opening end, and A shield member that forms a case shield part having a spring force by cutting and raising a part of the metal plate-like body on the outer surface of the bottom part facing the concave opening;
It is made of a metal plate made of a good conductor, bent into a U-shape that can be fitted to the housing side wall from the top opening side, and fitted to the housing side wall. A module ground terminal part is formed to connect with the camera module by projecting with spring force and making contact with the camera module inserted in the housing. The other part is directly connected to the shield member or around the through hole. A module shield member that forms a substrate-side ground terminal portion electrically connected to the shield member via
The camera module socket pre-drilled in the electronic circuit board is inserted into the rectangular through hole, and the mounting contact part provided in advance in the peripheral part of the through hole and the board connecting part of the contact are connected and fixed, and the peripheral part of the through hole A camera is characterized in that a ground mounting portion provided in advance and a ground terminal portion are connected and fixed to be attached to the electronic circuit board, and the case shield portion of the shield member is brought into contact with the case of the electronic device to which the electronic circuit board is attached. Module socket.

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