JP2009043680A - Wire aligning tool, and soldering device having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To properly: align a wire up to its tip part even if the wire has a reduced diameter, in a wire aligning tool; and a soldering device having the same. <P>SOLUTION: This wire aligning tool 1 is used for aligning, on an aligning surface at a certain alignment pitch, a plurality of coaxial wires 20 arranged in parallel to one another at a longitudinal intermediate part where the length from a tip is set nearly constant, and held to be connectable/separable to/from one another from the arrangement positions toward tip sides. The wire aligning tool includes: an alignment member 7 having a plurality of groove parts 7a arranged in parallel to one another at the alignment pitch for respectively pressing the respective coaxial wires 20 toward the aligning surface; and moving stages 3 and 10 holding the alignment member 7 relatively movably in a direction nearly orthogonal to the aligning surface, and relatively movably in a certain direction along the aligning surface with respect to the aligning surface from the vicinity of the arrangement positions to the tip parts of the respective coaxial wires 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electric wire alignment jig and a soldering apparatus including the same.

Conventionally, for example, many electric wires and printed boards are used in electronic devices such as personal computers and mobile phones. In order to electrically connect these electric wires and the printed circuit board, methods such as connecting with a connector or soldering are used. Wiring on such a printed circuit board is generally performed in parallel with a certain number of wires arranged in parallel at a predetermined arrangement pitch, whether via a connector or directly soldered. For this reason, it is necessary to align a plurality of electric wires at a predetermined alignment pitch prior to the creation of the connector and soldering.
For these alignment operations, various jigs using brushes and grooves have been proposed.
As such an electric wire aligning jig, for example, Patent Document 1 discloses a plurality of extra fine wires in an extra fine dedicated narrow pitch aligning jig that aligns plural extra fine wires at a narrow pitch and holds them at equal intervals. A narrow-pitch wire alignment jig for ultra-fine wires is described in which shims having different thicknesses and widths are alternately arranged and fixed on a guide on which the terminal portion is mounted.
According to this narrow pitch straightening jig for ultra fine wires, the same groove shape as the joining pitch is made using shims with different thicknesses and heights, and the coaxial wire is inserted into this groove to create an aligned state. Yes. And after alignment, a coaxial line is fixed with a film with an adhesive, and a joining operation is performed.
JP 2003-7418 A

However, the conventional electric wire alignment jig as described above has the following problems.
In the technique described in Patent Document 1, since the alignment state is created by inserting the coaxial line into the groove portion, the alignment pitch aligned with the wire-aligning jig is maintained at the tip end portion of the actually joined wire. It is necessary to keep each electric wire extended from the groove straight. However, in recent years, electronic devices have become smaller and thinner, and the wires used for wiring have become extremely thin. Therefore, the waist of the wires is extremely weak and the portion extending from the groove that is not regulated by the groove is kept straight. Has become extremely difficult. In addition, as the diameter of the electric wire is made extremely small, the joining pitch is generally narrowed. Therefore, even if a slight bend occurs, it comes into contact with the adjacent electric wire and the joining operation becomes difficult.
Therefore, there is a problem that the technique described in Patent Document 1 cannot be applied to an electric wire with a small wire diameter.

  The present invention has been made in view of the above-described problems, and includes an electric wire alignment jig that can satisfactorily align even a thin-diameter electric wire up to the tip end portion of the electric wire, and the same. It is to provide a soldering apparatus.

In order to solve the above-described problem, in the invention according to claim 1, the lengths from the tip are arranged in parallel in the middle portion in the length direction, and the length from the tip toward the tip side. An electric wire alignment jig for aligning a plurality of electric wires held so as to be separable between each other on a surface to be aligned at a constant alignment pitch, and for pressing each of the plurality of electric wires toward the surface to be aligned, An alignment member having at one end a plurality of grooves arranged in parallel at the alignment pitch, and the alignment member can be relatively moved in a direction substantially orthogonal to the aligned surface, and from the vicinity of the arranged position. A relative movement mechanism that holds the aligned surfaces so as to be relatively movable in a certain direction along the aligned surfaces is provided between the tip ends of the plurality of electric wires.
According to the present invention, using the relative movement mechanism, the alignment member is relatively moved in the vicinity of the position where the plurality of electric wires are arranged, and the alignment member is further in a state where the plurality of grooves are respectively opposed to the plurality of electric wires. It moves so that it may become, it moves to the to-be-aligned surface side, and it can be relatively moved to the front-end | tip of an electric wire in the fixed direction along an to-be-aligned surface, hold | suppressing a some electric wire with a some groove part. Thereby, a some electric wire is aligned from the vicinity of the arranged position to the front-end | tip of an electric wire following the groove part of the alignment member. Therefore, each front-end | tip part of a some electric wire is hold | maintained in the state pressed by the to-be-aligned surface by the alignment member.

According to a second aspect of the present invention, in the electric wire alignment jig according to the first aspect, the groove portion of the alignment member has a groove width that is reduced in the groove depth direction, and a groove depth substantially at the center in the groove width direction. It is set as the structure provided with the groove | channel top part from which becomes the largest.
According to this invention, since the electric wire pressed by the groove portion of the alignment member is guided to the groove top portion at the substantially center of the groove width along the shape of the groove portion, the pitch in the alignment direction between the electric wires is aligned. It can be easily aligned with the pitch.
Moreover, even if the diameter of the electric wire changes along the extending direction, the electric wire can always be held at the center of the groove width.

According to a third aspect of the present invention, in the electric wire alignment jig according to the second aspect, the change in the groove width in the groove depth direction of the groove portion of the alignment member includes a step-like change.
According to the present invention, since the groove width of the groove portion of the electric wire changes stepwise in the groove depth direction, the groove width gradually decreases in the groove depth direction. Therefore, the position of the electric wire is reliably fixed at the groove width portion narrower than the electric wire diameter, and the position in the groove width direction can be stabilized.

According to a fourth aspect of the present invention, in the electric wire alignment jig according to any one of the first to third aspects, the alignment member is elastically supported in a direction in which the electric wire is pressed.
According to this invention, since the alignment member is elastically supported with respect to the electric wires in the direction of pressing the electric wires, the alignment members are elastically biased against the electric wires. Therefore, even if there are irregularities or changes in the wire diameter in the direction of extension of the wire, it is possible to maintain the state of pressing the wire following the change, thus preventing an excessive load from being generated on the wire. be able to.

According to a fifth aspect of the present invention, there is provided a soldering apparatus that aligns a plurality of electric wires on a substrate at a constant alignment pitch and solders the electric wires to the substrate. The arrangement jig is provided.
According to this invention, since the electric wire alignment jig according to any one of claims 1 to 4 is provided, the same effect as the invention according to claims 1 to 4 is provided.

According to a sixth aspect of the invention, in the soldering apparatus according to the fifth aspect, the alignment jig includes a heating unit that heats the alignment jig to a temperature equal to or higher than a solder melting temperature in at least the plurality of groove portions of the alignment member; To do.
According to the present invention, since the heating means for heating at least the solder melting temperature in at least the plurality of grooves of the alignment member is provided, soldering can be performed while pressing the wires on the substrate in a state where the wires are arranged by the alignment member. .

According to a seventh aspect of the present invention, in the soldering apparatus according to the sixth aspect of the present invention, the heating means is configured to cause the alignment member to generate heat.
According to the present invention, since the heating means generates heat in the alignment member, the apparatus configuration is simplified, and the alignment member can be efficiently heated and soldered.

  According to the electric wire alignment jig and the soldering apparatus including the same according to the present invention, the alignment member is relatively moved in a certain direction along the aligned surface in a state where the electric wire is pressed by the groove portion of the alignment member. Even if it is the done electric wire, there exists an effect that it can align favorably to the front-end | tip part of an electric wire.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In all the drawings, even if the embodiments are different, the same or corresponding members are denoted by the same reference numerals, and common description is omitted. Further, the XYZ coordinate system described in the figure is provided in a common direction in each figure for the convenience of direction reference, and the horizontal plane is the XY plane and the vertical upper direction is the Z-axis positive direction.

[First Embodiment]
The electric wire alignment jig according to the first embodiment of the present invention will be described.
FIG. 1 is a schematic perspective view showing a schematic configuration of an electric wire alignment jig according to the first embodiment of the present invention. FIG. 2 is a partial plan view as viewed from A in FIG. FIG. 3 is a partial side view as seen from B in FIG. FIG. 4 is a partially enlarged view of a portion C in FIG.

The alignment jig 1 according to the present embodiment aligns a plurality of electric wires that can be brought into contact with and separated from each other at least at the tip portion with a constant alignment pitch on the surface to be aligned. The presence / absence of the coating on the tip is not particularly limited.
For example, a plurality of loose wires may be arranged at an equal pitch in the middle in the length direction, and the individual loose wires from the arranged position to the tip may be aligned. For example, for connector wiring Like a lead wire, a plurality of electric wires may be bundled or integrated and arranged in parallel at the intermediate portion in the length direction, and each electric wire may be branched from the arrangement position to the tip end side. Such an alignment jig 1 can be suitably used, for example, as a wiring jig in a soldering apparatus or a connector manufacturing apparatus.
In the following, an example will be described in which a coaxial line made up of a plurality of loose wires is used as an electric wire and the tip portion thereof is soldered to a printed board.

1-4, as shown in FIGS. 1 to 4, a plurality of coaxial wires 20 (electric wires) are arranged on a moving stage 3 provided on a base 2 so as to be movable in a uniaxial direction (Y-axis direction). Are arranged in parallel on a predetermined plane and held, and a flexible substrate 6 (substrate, aligned surface) for soldering the tip of each coaxial line 20 in the Y-axis direction of the arrangement portion 4 in the figure. The substrate mounting table 5 to be mounted is provided. Further, the coaxial line 20 is aligned on the flexible substrate 6 and the alignment member 7 is pressed against the flexible substrate 6, and the alignment member 7 is positioned above the substrate mounting table 5 ( And an alignment member holding portion 8 that is held so as to be movable back and forth toward the flexible substrate 6 on the Z-axis positive direction side).
In the following, as an example of the alignment jig 1, five coaxial wires 20 having an outer diameter D _a at the intermediate portion and from which the coating of the tip has been removed are arranged at equal pitch p ₀ = D _{a at} the intermediate portion in the length direction. An example will be described in which the tips are aligned at the same pitch even at the tip.
The structure of the coaxial line 20, as shown in FIG. 2, from the outside, the outer coating 20a of the outer diameter _{D a,} the shield portion 20b of the outer diameter _{D b,} the outer diameter _{D c} insulator portion 20c, the outer diameter _{D d} The case where the core wire portions 20d are coaxially laminated is described (however, D _a > D _b > D _c > D _d ).

  The moving stage 3 can move the alignment member 7 relative to the flexible substrate 6 in a certain direction (Y-axis direction) along the flexible substrate 6 from the vicinity of the arrangement portion 4 to the tip of each coaxial line 20. The relative movement mechanism to hold | maintain is comprised. As an apparatus configuration of the moving stage 3, for example, an appropriate uniaxial moving mechanism using a ball screw feeding mechanism, a linear motor, or the like can be employed.

The arrangement | sequence part 4 consists of the arrangement | sequence base 4a and the pressing member 4b.
The array table 4a is a block-like member fixed on the moving stage 3, and includes an array groove 4c extending along the moving direction (Y-axis direction) of the moving stage 3 on the upper surface side.
The arrangement groove 4c can adopt an appropriate shape as long as the middle portion of the coaxial line 20 can be arranged in parallel on a plane according to a predetermined arrangement pitch, but in this embodiment, the groove width is the coaxial arrangement. × number outer diameter of the wire 20, that is, the 5 · D _a, the groove depth is a U-shaped groove having a rectangular cross-section which is a slightly smaller than the outer diameter D _a of the coaxial line 20.
The holding members 4b are arranged in the Y-axis positive direction with the tips of the five coaxial wires 20 being substantially aligned in the Y-axis direction in the arrangement grooves 4c, and then each of the holding members 4b from above the arrangement grooves 4c. The coaxial line 20 is pressed against the arrangement groove 4c of the arrangement table 4a and held in place. Therefore, although not particularly illustrated, the pressing member 4b can be pressed or fixed to the arrangement table 4a by an appropriate pressing means or a fixing screw.

As a result, the coaxial lines 20 arranged in parallel in the X-axis direction without any gap in the arrangement part 4 are extended in the Y-axis direction at the groove bottom of the arrangement groove 4c parallel to the XY plane.
The tip of each coaxial line 20 is disposed above the substrate platform 5 and extends substantially along the moving direction of the moving stage 3. The coaxial lines 20 in the extending portion can be brought into contact with and separated from each other, and can be deformed according to the rigidity of the coaxial line 20.
In the following, each central axis direction when each coaxial line 20 held by the array unit 4 extends straight toward the outside of the array unit 4 is distinguished from the actual extending direction of each coaxial line 20; It may be called the extending direction of the coaxial line 20 from the arrangement part 4. In the present embodiment, the extending direction of each coaxial line 20 is a direction parallel to the Y axis.

In the case of arranging the coaxial line 20 to the wider constant pitch than the outer diameter D _a, the or a groove corresponding to the arrangement pitch in the bottom of the array groove 4c, appropriate shims groove width direction (X axis direction) For example, the coaxial lines 20 may be arranged via the above.

The substrate mounting table 5 is provided at a height at which the upper surface of the flexible substrate 6 is substantially aligned with the groove bottom of the array groove 4 c of the array unit 4 in a state where the flexible substrate 6 is mounted.
The flexible substrate 6 in the present embodiment, an appropriate circuit pattern is formed on a substrate 6a, as the terminal portion of the appropriate interconnection of the circuit pattern, a plurality of land portions 6b are in parallel with the X-axis direction at a pitch p ₁ It has been. A ground portion 6 c is provided between each land portion 6 b and the end surface of the flexible substrate 6 on the array portion 4 side so as to intersect the extending direction of the coaxial line 20 from the array portion 4.
The ground portion 6 c is electrically connected to the common ground pattern of the circuit pattern of the flexible substrate 6. In the present embodiment, the position of the ground portion 6c is provided in the extending direction of each coaxial line 20 so as to overlap the position where the outer coating 20a is removed and the shield portion 20b is exposed on the surface.
Solder may be supplied to the land portion 6b and the ground portion 6c of the flexible substrate 6 by an appropriate solder supply device at the time of soldering, or placed on the substrate mounting table 5 in a state in which a solder paste is applied in advance. It may be.

In this embodiment, the alignment member 7 is a flat plate member extending along a plane orthogonal to the extending direction of the coaxial line 20, as shown in FIG. As shown in FIG. 3, the visual shape is slightly wider than the alignment width of the coaxial line 20 at the lower end side, and is widened symmetrically toward the upper side at the middle portion, and V-shaped when viewed from both sides on the Y-axis direction. A pair of locked portions 7b having a shape are formed, and on the upper side, the side surface portions 7c facing each other in the width direction are extended in parallel to each other upward.
A plurality of groove portions 7 a are formed on the lower end surface, which is one end of the alignment member 7, through which a certain concave cross section along the extending direction of the coaxial line 20 is penetrated.
Further, on the upper end surface that is the other end of the alignment member 7, a pressed portion 7 d that is a plane substantially parallel to the mounting surface of the substrate mounting table 5 and is pressed by a plate spring 9 described later is formed.

Groove 7a is equal to the coaxial line 20 to align provided with arrangement pitch _{p 2,} in this embodiment, an array pitch _p 2 = _{p 0.}
In the present embodiment, as an example, the cross-sectional shape of the groove portion 7a parallel to the XZ plane is a concave shape curved in an arc shape symmetrical with respect to the center of the groove width m, as shown in FIG. For this reason, the depth of the groove portion 7a gradually increases from the outer side in the groove width direction to the center of the groove width, and the depth is the maximum depth d at the groove top portion 7A at the groove width center. The specific shape of the curved curve in an arc shape is not limited to an arc shape, and may be an ellipse, another curve, or a combination of curves.
The maximum depth d of the groove portion 7a is set to an appropriate dimension that can hold the core wire portion 20d of the coaxial wire 20 on the land portion 6b. For example, the depth d, if d <D _d, when pressing the core part 20d to the plane of the land portion 6b, in a state of pressing without any gap core part 20d in Mizoitadaki portion 7A, noted below the aligning members 7 Since a gap is formed between the end surface and the flat surface of the land portion 6b, the core wire portion 20d can be reliably pressed. However, a solder paste is applied on the land portion 6b, when pressing the core part 20d on the solder paste may be a depth less than the sum of the outer diameter D _d of the solder paste thickness and core part 20d .

  As the material of the alignment member 7, an appropriate synthetic resin material, ceramics, metal material, or the like can be adopted depending on the material of the electric wires to be aligned. From the viewpoint of processing accuracy and wear resistance of the groove 7a, it is preferable to employ, for example, stainless steel.

In this embodiment, the alignment member holding portion 8 is moved in the Z-axis direction by the moving stage 10 which is a relative movement mechanism in the Z-axis direction on the attachment surface 8t on the Y-axis negative direction side as shown in FIG. The movable stage 10 is supported by a support member (not shown) above the substrate platform 5. The moving stage 10 can employ a uniaxial moving mechanism similar to that of the moving stage 3. For example, the moving stage 10 can be driven in a minute amount in the radial direction of the thinned electric wire by using a piezoelectric element actuator or the like together. A fine movement mechanism may be provided.
Further, a plate-like portion 8d parallel to the alignment member 7 is provided on the side opposite to the mounting surface 8t of the alignment member holding portion 8, and on the outer edge portions on both sides in the X-axis direction of the plate-like portion 8d, A pair of side surface guides 8a for guiding each side surface portion 7c of the alignment member 7 so as to be movable in the Z-axis direction and restricting the position in the Y-axis direction, and each locked portion 7b of the alignment member 7 from the lower end side. A pair of locking plates 8b to be locked is provided. Further, a position facing the pressed portion 7d of the alignment member 7 is fixed to the upper end side of the plate-like portion 8d in order to fix the plate spring 9 that elastically presses the pressed portion 7d of the upper end surface of the alignment member 7. A leaf spring fixing portion 8c is provided so as to protrude from the top.
The leaf spring 9 is provided so as to bias each locked portion 7b of the alignment member 7 with respect to each locking plate 8b with a certain elastic force.

  For this reason, in a state where no external force is applied in the positive direction of the Z axis, each groove portion 7a of the alignment member 7 protrudes downward from between each locking plate 8b, and is constant in the Z axis direction with respect to the alignment member holding portion 8. Held in position. On the other hand, when an external force in the positive direction of the Z-axis is applied through each groove 7a, the alignment member 7 moves in the Z-axis direction to a position where the elastic reaction force by the leaf spring 9 and the external force are balanced. .

Next, the operation of the alignment jig 1 will be described.
FIG. 5 is a schematic perspective view showing a state at the start of the alignment operation of the alignment jig according to the first embodiment of the present invention. FIGS. 6A, 6B, 6C, and 6D are operation explanatory views in C view for sequentially explaining the alignment operation of the alignment jig according to the first embodiment of the present invention. FIG. 7 is a schematic front view showing a state at the end of alignment of the alignment jig according to the first embodiment of the present invention.

First, the flexible substrate 6 is mounted on the substrate mounting table 5 so that the land portions 6b are positioned at the preset alignment positions. The height of the land portion 6b in the Z-axis direction is substantially the same as the groove bottom of the array groove 4c.
Next, toward the tip of the coaxial line 20, the shielded part 20b, the insulator part 20c, and the core part 20d are appropriately lengthened, and the five exposed coaxial cables 20 are similarly lengths from the tip. Are arranged in parallel in the arrangement groove 4c of the arrangement table 4a of the arrangement section 4 at the position of the intermediate portion in the length direction where the outer coating 20a is left.
Then, the pressing member 4b is covered from above, and the pressing member 4b is fixed to the array base 4a in a state where the upper surface of the coaxial line 20 is pressed. As a result, the coaxial lines 20 are pressed against the groove bottoms of the array grooves 4c in the Z-axis direction and are pressed toward each other in the X-axis direction. For example, even if there is a bending of the line before the array, They are arranged in the arrangement grooves 4c in a state where they are parallel to the axial diameter of the outer coating 20a in the axial direction and straightly extended in the Z-axis direction.

  For this reason, the front-end | tip part of each coaxial line 20 is extended with the same length from the arrangement | sequence part 4 to the surface of the flexible substrate 6, or the surface vicinity. However, the coaxial lines 20 in the extending portion can be brought into contact with and separated from each other, and as shown in FIG.

Next, the moving stage 3 is driven, and each groove portion 7a of the alignment member 7 is moved to a position (first position) where the groove portion 7a is positioned above each coaxial line 20 having the outer coating 20a in the vicinity of the arrangement portion 4. . At this time, the alignment member 7 is urged in the negative Z-axis direction by the plate spring 9, and each locked portion 7 b is locked to the locking plate 8 b of the alignment member holding portion 8. Among them, it is located closest to the Z-axis negative direction side.
The positions of the alignment member holding portion 8 and the moving stage 3 in the X-axis direction are adjusted in advance so that the axis of each coaxial line 20 arranged in the arrangement portion 4 and the groove width center of each groove portion 7a coincide. deep.
Then, the moving stage 10 is driven to move the alignment member holding portion 8 in the negative Z-axis direction and lower the alignment member 7 (see FIG. 6A).
Thereby, for example, even if the position of the coaxial line 20 extended from the arrangement part 4 to the outside of the arrangement part 4 varies, the coaxial line 20 comes into contact with the groove part 7a sequentially from the upper side (Z-axis positive direction side). In accordance with the change of the groove depth in 7a, it is pushed downward while being gradually guided to the groove top portion 7A side. Therefore, the top of the outer coating 20a in the positive direction of the Z-axis is substantially aligned with the groove top 7A.
At this time, since the alignment member 7 is disposed in the vicinity of the arrangement portion 4 with little deviation from the extending direction of the coaxial line 20, all the coaxial lines 20 are surely pushed down by the corresponding groove portions 7a.
Then, the moving stage 10 is configured so that the alignment member holding portion 8 has the Z-axis direction position of each coaxial line 20 by the groove portion 7a of the alignment member 7 in a state where each locked portion 7b is locked to each locking plate 8b. The outer coating 20a is stopped at a position further lowered than the position where the outer coating 20a is just brought into contact with the flexible substrate 6. Thereby, the alignment member 7 elastically supported by the leaf spring 9 receives the reaction force from the outer cover 20a and moves in the positive direction of the Z axis, and the outer cover 20a is urged toward the negative direction of the Z axis.

Next, the moving stage 3 is moved to the Y axis negative direction side. Thereby, the alignment member 7 is relatively moved to the tip end side on each coaxial line 20. As a result of this movement, each coaxial line 20 is sequentially pressed by the groove portion 7a on the flexible substrate 6 in the Z-axis direction, even if the central axis of the coaxial line 20 is displaced from the extending direction, and in the X-axis direction. The groove 7a is moved to the center of the groove width, and the central axis of the coaxial line 20 is aligned in the X-axis direction.
When the alignment member 7 moves to the position of the shield part 20b (second position), the alignment member 7 is urged by the leaf spring 9 and supported so as to be movable in the Z-axis negative direction side with respect to the alignment member holding part 8. Therefore, as shown in FIG. 6 (b), it descends according to the decrease in the height of the shield part 20b.

Since the ground portion 6c is provided on the lower surface of the shield portion 20b, the height of the shield portion 20b from the base material 6a is a height including the thickness of the ground portion 6c. For example, when a solder paste is disposed on the ground portion 6c, the height of the shield portion 20b also changes due to the change in the solder layer height.
In this embodiment, since the alignment member 7 is elastically supported, even if there is such a height change, it can easily follow. For this reason, an excessive pressing load is not generated on the coaxial wire 20, and surface damage or scraping can be prevented.
Further, since the groove portion 7a has a groove top portion 7A in which the groove width is reduced in the groove depth direction and the groove depth is maximum at the approximate center in the groove width direction, the central axis of the portion of the shield portion 20b is Even if it is displaced in the X-axis direction, the shield portion 20b is pressed and moved to the groove top portion 7A side along the groove surface of the groove portion 7a. Therefore, the top of the shield part 20b on the Z axis positive direction side is guided by the groove top part 7A, and the coaxial line 20 can be aligned with the approximate center of the groove part 7a.

Next, when the alignment member 7 is moved to the position (third position) on the insulator portion 20c by moving the moving stage 3 in the negative Y-axis direction, the same as shown in FIG. 6C. Thus, the alignment member 7 urged by the leaf spring 9 is lowered in accordance with a change in height corresponding to a change in diameter in the portion of the insulator 20c, a change in unevenness on the flexible substrate 6, and the like. The parts 20c are aligned.
When the alignment member 7 is moved to the position (fourth position) on the core wire portion 20d by further moving the moving stage 3 in the Y-axis direction, as shown in FIG. The alignment member 7 biased by the leaf spring 9 descends in response to a change in height corresponding to a change in diameter at the portion of the core wire portion 20d or a change in unevenness on the flexible substrate 6, and the portion of the core wire portion 20d is lowered. Aligned. At this time, the land portions 6b are respectively positioned below the respective core wire portions 20d, and when the core wire portions 20d are aligned with the groove top portions 7A in the X-axis direction, the land portions 6b are aligned approximately at the centers of the land portions 6b. ing.
Then, as shown in FIG. 7, the moving stage 3 is stopped at an appropriate position (fifth position) in the Y-axis direction on the core wire portion 20d. Thereby, each coaxial line 20 has a pitch p of the groove portion 7a along the extending direction in the X-axis direction from the proximal end portion in the vicinity of the arrangement portion 4 to the distal end portion pressed by the alignment member 7. ₂ are aligned in parallel with each other on the land portion 6b (aligned surface) of the flexible substrate 6, and the alignment is completed.
Next, if necessary, the work after alignment can be performed. For example, the core wire portion 20d and the shield portion 20b can be soldered to the land portion 6b and the ground portion 6c, respectively, using a soldering device (not shown).

In the process of moving the alignment member 7 in the Y-axis direction in order to align the coaxial lines 20, the moving amount of the moving stage 10 is changed, and the height of the alignment member holding portion 8 in the Z-axis direction is changed continuously or in steps. May be changed. For example, by changing the position of the alignment member holding portion 8 according to the height change amount of the alignment member 7 on the coaxial line 20 in the Z-axis direction, the pressing force of the alignment member 7 on the coaxial line 20 is made constant. Can keep. Further, the pressing force can be appropriately changed according to a difference in surface state and strength at a portion where the coaxial line 20 is pressed, a surface state on the flexible substrate 6 to be pressed, or the like.
6A to 6D and FIG. 7, the moving stage 3 is described as being stopped at each position from the first position to the fifth position. Each part may be aligned while continuously passing through. The fourth position and the fifth position may be the same position.

  As described above, according to the alignment jig 1 of the present embodiment, the alignment member 7 is moved in the extending direction of the coaxial line 20 while the outer peripheral side of the coaxial line 20 is pressed by the groove portion 7a of the alignment member 7. Even when the diameter of the wire 20 is small, or when the diameter gradually decreases toward the tip, the tip of the coaxial wire 20 can be well aligned.

Next, a modification of this embodiment will be described.
FIGS. 8A and 8B are partially enlarged views showing the groove shapes according to the first and second modifications of the embodiment of the present invention, respectively.
In the first embodiment, the example in which the cross section of the groove portion 7a is a concave shape curved in a circular arc symmetrical to the center of the groove width m has been described. However, the cross section parallel to the ZX plane of the groove portion is described. The groove width is reduced in the groove depth direction, and can be transformed into another shape having a groove top portion where the groove depth is maximized at the approximate center in the groove width direction.
As shown in FIG. 8 (a), the alignment member 70 of the first modification has an isosceles triangular cross section with the groove portion 7a of the alignment member 7 of the first embodiment having an apex angle at the center of the groove width. It replaces with the groove part 70a which has. In other words, this is an example in which the groove depth changes linearly along the width direction.

Further, as shown in FIG. 8B, the alignment member 71 of the second modification is different from the groove portion 7a of the alignment member 7 of the first embodiment in that the groove width changes in multiple steps in the depth direction. It is changed to 71a.
As the shape of the groove portion 71a, for example, a groove having a width w ₂ and a depth d ₂ (where w ₁ > w ₂ ) is formed in the center in the width direction of the groove having a width w ₁ and a depth d _1. it can be adopted a shape which includes a step change which stepped portion 71b is formed in the opening of the groove of w _2. Here, the groove bottom width w ₂ constitutes a Mizoitadaki portion 71A.
In this case, for example, the width w ₁ is equal to or smaller than the width in the X-axis direction of the land portion 6 _b and satisfies D _b > w ₁ > D _c . The width w ₂ is set as D _c > w ₂ > D _d . Thereby, the outer cover 20a and the shield part 20b are locked by the opening of the groove part 71a, the axial center of the outer cover 20a or the shield part 20b is positioned, and the insulator part 20c is formed by the stepped part 71b. The axial center of the insulator part 20c can be positioned by being locked by. It can be suppressed by the position regulating the core part 20d in the width w ₂ of Mizoitadaki portion 71A.
This modification is an example in which the core wire portion 20d is aligned within a certain range from the extending direction, and is suitable, for example, when soldering to the land portion 6b. The reason why w ₂ > D _d is to form a sufficient gap through which the solder spreads on the side surface of the core wire portion 20d.
In order to perform soldering, the core wire portion 20d is only required to be held on at least the land portion 6b. However, in this modification, the core wire portion 20d is aligned with the approximate center of the land portion 6b at the start of soldering. Therefore, the position variation on the land portion 6b can be reduced, which is suitable for soldering at a fine pitch.

These modifications may be implemented in combination with each other or with the first embodiment as appropriate. For example, the stepped portion may be an inclined portion or a curved shape. The groove bottom width w ₂ may be curved, such as an arc shape.

[Second Embodiment]
A soldering apparatus including an electric wire alignment jig according to a second embodiment of the present invention will be described.
Fig.9 (a) is a typical front view which shows schematic structure of the soldering apparatus provided with the alignment tool of the electric wire which concerns on the 2nd Embodiment of this invention. FIG. 9B is a partially enlarged view of a view D in FIG.

The soldering apparatus 100 of this embodiment includes an alignment jig 12 and a heating power source 11 (heating means).
The alignment jig 12 includes an alignment member 72 instead of the alignment member 7 of the alignment jig 1 of the first embodiment.

The alignment member 72 has an outer shape similar to that of the alignment member 7, and is constituted by a heat generating portion 72B in which the groove portion 7a is formed and an alignment member main body 72C that supports the heat generating portion 72B.
That is, the groove portion 7a of the alignment member 72 includes a heat generating portion 72B that generates heat when a voltage is applied. In this embodiment, tungsten having an appropriate electric resistance is used.
On the other hand, the alignment member main body 72C can be formed of an electric insulator such as a thermosetting resin or ceramic, or a metal such as stainless steel that is electrically insulated at a joint portion with the heat generating portion 72B.

  The heating power supply 11 supplies a current for causing the heat generating portion 72B to generate heat. In the present embodiment, the heating power supply 11 supplies a pulse current to the wiring connected to the heat generating portion 72B, and provides a monitor output by a thermocouple (not shown). Based on this, a pulse heat power source for controlling the heat generation temperature is adopted.

According to such a soldering apparatus 100, as shown in FIG. 9A, the moving stage 3 is moved to the Y-axis negative direction side, and the alignment member 72 is moved as in the first embodiment. After moving to the Z-axis negative direction side, the coaxial lines 20 are aligned by the groove portions 7a, and then stopped in a state where the core wire portions 20d are pressed on the land portions 6b on which solder paste is previously arranged. Then, a pulsed current is supplied from the heating power supply 11 to heat the heat generating portion 72B itself to the solder melting temperature or higher, and the core wire portion 20d is soldered to the land portion 6b.
When the solder is solidified, the moving stage 10 is driven, the alignment member holding portion 8 is moved upward (Z-axis positive direction), the alignment member 72 is pulled upward, and further, the moving stage 3 is driven (Y-axis positive). The shield portion 20b is moved below the alignment member 72. Then, the alignment member holding part 8 is lowered by the moving stage 10, the shield part 20b is pressed by the groove part 7a of the heat generating part 72B, and the shield part 20b is soldered onto the ground part 6c.
In this way, the plurality of coaxial lines 20 can be aligned and soldered on the flexible substrate 6.

  In the soldering apparatus 100, the heating power source 11 causes the heat generating portion 72B (groove portion 7a) of the aligning member 72 that presses the coaxial line 20 to generate heat to perform heating for soldering, so that the wires are aligned and pressed. Since the means and the solder heating means can be used together, the apparatus configuration can be simplified. Therefore, it is possible to efficiently solder a fine circuit pattern. Moreover, since only the vicinity where soldering is performed generates heat, energy consumption can be reduced, and a thermal load on the flexible substrate 6 and the coaxial line 20 can be reduced.

  In the above description, the example in which the groove width of the groove portion of the alignment member changes along the groove depth direction has been described, but depending on the case, a groove portion having a constant groove width in the depth direction may be employed. Also good. For example, when the electric wire has a two-layer structure consisting of a core wire and an outer sheath, the core wires are aligned in the same manner as described above, for example, by a U-shaped groove that is narrower than the outer diameter of the outer sheath and slightly wider than the outer diameter of the core wire. Can be made.

In the above description, the example in which the groove top portion is located at the center of the groove width has been described. However, the position of the groove top portion may be shifted within the range of alignment accuracy.
Further, when the arrangement pitch of the electric wires is equal and the arrangement pitch at the alignment position of the electric wires is non-equal, it is necessary to shift the groove top portion according to the alignment position.

  In the above description, the example in which the arrangement and alignment of the electric wires are performed at an equal pitch has been described. However, the arrangement and alignment can be changed as necessary.

  In the above description, the example has been described in the case where the arrangement position is provided along the extending direction of the electric wires in the arrangement portion, but the electric wires are arranged in a certain direction different from the extending direction from the extension position of the arrangement portion. You may make it align. That is, in the first embodiment, the alignment member 7 is moved from the state perpendicular to the Y-axis direction (indicating the state of the first embodiment) to the inclined direction in the XY plane, and the direction of extension The electric wires may be aligned in an oblique direction.

In the above description, the example in which the alignment member is elastically supported has been described. However, when the alignment member is not likely to damage the electric wire, the alignment member is fixedly supported to the alignment member holding portion. May be.
For example, if the thickness of the wires to be aligned and the support height do not change, if the change is known in advance, or if it is possible to detect the change, the alignment member holding part keeps the height of the alignment member constant. By holding or controlling the height according to changes in thickness or support height, the alignment member can be held at a position close to the electric wire. Therefore, it can hold down, without giving an excessive load to an electric wire.
Moreover, you may enable it to absorb a certain amount of unevenness | corrugations by comprising a groove part with the material elastically deformed to a height direction.

  In the above description, the relative movement mechanism between the alignment member 7 and the aligned surface is realized by a combination of the movement stage 10 that moves in the Z-axis direction and the movement stage 3 that moves in the Y-axis direction. However, the relative movement mechanism is not limited to this as long as the same relative movement can be performed. For example, the alignment member holding unit 8 may be fixedly supported so that the moving stage 3 can move in the Y-axis direction and the Z-axis direction, or the arrangement unit 4 and the substrate mounting table 5 may be fixedly supported and moved. The alignment member holding unit 8 may be moved in the Y-axis direction and the Z-axis direction by the stage 10.

  In the above description, the alignment member is elastically supported by a leaf spring. However, the elastic support means is not limited to a leaf spring, and an appropriate spring or elastic member can be used.

  Further, in the above description, the example in which the plurality of coaxial wires 20 are arranged using the arrangement unit 4 has been described. However, when the plurality of electric wires are bundled or integrated in advance in parallel. The arrangement portion may be configured to simply hold down the united or integrated portion in the vertical direction.

Further, in the above description, the electric wires are described in an example in which the electric wires are arranged in a flat or flat state by arranging and pressing the flat groove on the flat arrangement groove 4c, but in the vicinity of the arrangement position. As long as the wires are arranged in parallel so that the grooves can be pressed by the grooves of the alignment member, the wires do not necessarily have to be arranged on a strict plane. For example, the height may vary to some extent for each electric wire, or may be juxtaposed on a gently curved surface.
Also, for example, when the aligned surface is curved, such as when a soldering land is formed on the curved surface, the groove arrangement of the aligning member is matched to the curved surface. It is preferable that the electric wires are arranged in a curved shape matching the curvature of the aligned surfaces.

Further, in the description of the second embodiment, the example in which the heating unit supplies current to the alignment member and generates heat by the alignment member as the soldering device has been described. A heater may be provided, and heating may be performed by transferring the heat of the heater to the alignment member.
Further, the heating means may be provided as a separate mechanism in the vicinity of the alignment member.

It is a typical perspective view showing a schematic structure of an electric wire alignment jig concerning a 1st embodiment of the present invention. It is a partial top view of A view in FIG. It is a partial side view of the B view in FIG. It is the elements on larger scale of the C section of FIG. It is a typical perspective view which shows the state at the time of the start of the alignment operation | movement of the alignment jig which concerns on the 1st Embodiment of this invention. It is operation | movement explanatory drawing of C view explaining sequentially the alignment operation | movement of the alignment jig which concerns on the 1st Embodiment of this invention. It is a typical front view which shows the state at the time of completion | finish of alignment of the alignment jig which concerns on the 1st Embodiment of this invention. It is the elements on larger scale which show the groove part shape which concerns on the 1st and 2nd modification of embodiment of this invention, respectively. It is the typical front view which shows schematic structure of the soldering apparatus provided with the alignment tool of the electric wire which concerns on the 2nd Embodiment of this invention, and the elements on larger scale of the D view.

Explanation of symbols

1,12 Alignment jig 3,10 Moving stage (relative moving mechanism)
4 array part 4c array groove 5 substrate mounting table 6 flexible substrate (substrate, aligned surface)
6b Land (aligned surface)
6c Ground part 7, 70, 71, 72 Alignment member 7a, 70a, 71a Groove part 7A, 70A, 71A Groove top part 8 Alignment member holding part 9 Leaf spring 11 Power supply for heating (heating means)
20 Coaxial wire (electric wire)
20a Outer coating 20b Shield part 20c Insulator 20d Core wire part 71b Stepped part 72B Heat generating part

Claims (7)

A plurality of wires arranged in parallel in the middle in the length direction where the length from the tip is substantially constant, and held from the arranged position toward the tip side so as to be able to contact and separate from each other. An electric wire alignment jig that aligns at a constant alignment pitch,
An alignment member having at one end a plurality of grooves arranged in parallel with the alignment pitch in order to hold the plurality of electric wires on the aligned surface side;
The alignment member can be relatively moved in a direction substantially orthogonal to the aligned surface, and between the vicinity of the arrayed positions and the tips of the plurality of electric wires, relative to the aligned surface. An electric wire alignment jig, comprising: a relative movement mechanism that holds the relative alignment in a fixed direction along the aligned surface.   2. The electric wire according to claim 1, wherein the groove portion of the alignment member includes a groove top portion in which the groove width is reduced in the groove depth direction and the groove depth is maximized at a substantially center in the groove width direction. Alignment jig.   The electric wire alignment jig according to claim 2, wherein the change in the groove width in the groove depth direction of the groove portion of the alignment member includes a step-like change.   The electric wire alignment jig according to claim 1, wherein the alignment member is elastically supported in a direction in which the plurality of electric wires are pressed. A soldering device for aligning a plurality of electric wires on a substrate at a constant alignment pitch and soldering to the substrate,
A soldering apparatus comprising the electric wire alignment jig according to claim 1.   The soldering apparatus according to claim 5, further comprising a heating unit configured to heat the alignment jig at a temperature equal to or higher than a solder melting temperature in at least the plurality of groove portions of the alignment member.   The soldering apparatus according to claim 6, wherein the heating unit generates heat from the alignment member.

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