JP2009039725A - Method for heating heat board of heating type pressurizing device, and heat board of the heating type pressurizing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for heating a heat board of a heating type pressurizing device by which the heat board which is used in a vacuum atmosphere and incorporates a heating element, can be relatively easily produced, and further, the heat board used in a vacuum atmosphere can be speedily heated to a required temperature without using a cartridge heater, a sheathed heater or the like. <P>SOLUTION: In this heating method, a near infrared heater 10 is piercingly provided in a through-hole 9 formed at heat board s6, 7, and the inside face of the through-hole is irradiated with near infrared rays radiated from a halogen lamp in the near infrared heater, thereby heating the heat board. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for heating a thermal platen in a heating type pressurizing apparatus such as a heating type press equipped with a heated thermal platen that is used in a vacuum environment, and a heating type heating heated by this heating method. The present invention relates to a thermal surface plate of a pressure device.

2. Description of the Related Art Conventionally, as a device used for nanoimprinting or semiconductor wafer bonding / inboss molding, there is a heating type pressurizing device provided with a heated thermal platen. As a heating means for the heat platen, a cartridge heater that is inserted in a through hole formed in the heat platen and conducts heat to the heat platen via a heat conductive material such as the atmosphere, or a heat generator is used. There are sheathed heaters and ceramic heaters that are embedded in the surface plate and heat the heat surface plate by their own heat.
In addition, since the heating means of these thermal surface plates has been used empirically and in the field for many years, the technical literature could not be found.

By the way, when the heating means of the conventional heat platen configured as described above is used in a vacuum environment, the former cartridge heater has no heat transfer material such as air around the cartridge heater. However, the temperature rise rate of the heat platen becomes very slow. In order to improve this, it is necessary to bring the cartridge heater into close contact with the thermal surface plate. For this reason, it is necessary to increase the dimensional accuracy of the through holes formed in the thermal surface plate and the surface accuracy of the inner surface. However, considering the assembly of the cartridge heater to the heat platen and the replacement of the cartridge heater, the fitting gap between the through hole and the cartridge heater cannot be reduced unnecessarily. Adhesion will deteriorate. As a result, the temperature rise rate of the thermal platen slows down, and furthermore, only the cartridge heater itself overheats and shortens the service life, or causes a shortage of temperature rise of the thermal platen. Yes.

In addition, in the case of the latter sheathed heater / ceramic heater, after the heating element and heater wire are embedded in the metal material of the heat platen, the heat platen material is processed into the heat platen. In addition, since a ceramic surface heater is manufactured by making a prototype and confirming and determining the heat distribution, it takes a lot of time to manufacture the heat surface plate. Because the heat generation amount per unit cannot be increased, the thermal platen cannot be heated to the required high temperature. In addition, the ceramic heater itself is brittle and cannot apply a high load to the thermal platen. In addition, there were problems such as becoming expensive.

The present invention has been made in view of the above circumstances, and its purpose is to make it possible to relatively easily manufacture a thermal surface plate that is used in a vacuum environment and has a built-in heating element. Provided is a heating method of a heating surface plate of a heating type pressurizing apparatus capable of quickly heating a heat surface plate used in a vacuum environment to a required temperature without using a sheathed heater or the like, and the heat surface plate. There is.

In order to achieve the above object, the heating method of the heating platen of the heating type pressurizing apparatus according to the present invention is used in a heating type pressurizing apparatus provided with a heating platen that is used in a vacuum environment and is heated. A near-infrared heater is inserted into a through-hole formed in the thermal platen, and near-infrared radiation emitted from the near-infrared heater is applied to the inner surface of the through-hole to heat the constant temperature. The board is heated.

As is apparent from the above description, the present invention is a method of heating a thermal platen in a heating type pressurizer equipped with a thermal platen that is used in a vacuum environment and is heated. A near-infrared heater is inserted into the formed through-hole, and the thermal platen is heated by irradiating the inner surface of the through-hole with the near-infrared ray emitted from the near-infrared heater, so it is used in a vacuum environment. The heat platen can be manufactured relatively easily, and the heat platen used in a vacuum environment can be quickly heated to the required temperature without using a cartridge heater or a sheathed heater. Excellent practical effects such as

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of a heating type pressurizing apparatus to which the present invention is applied will be described in detail with reference to FIG. 1 and FIG. As shown in FIG. 2, in this heating type pressurizing apparatus, four guide rods 2 are erected on both the left and right sides of the machine base 1, and a ceiling frame is provided between the upper ends of the four guide rods 2. 3 is installed. A lift frame 4 is slidably mounted on the four guide rods 2, and the lower end of the piston rod of the downward electric cylinder 5 is connected to the center of the upper surface of the lift frame 4. 14 is connected. The electric cylinder 5 has a piston rod penetrating through the center of the ceiling frame 3, and the elevating frame 4 is moved up and down by the contraction operation of the electric cylinder 5. . Further, two thermal surface plates 6 and 7 are attached to the upper surface of the machine base 1 and the lower surface of the elevating frame 4 with a heat insulating material 8 interposed therebetween, respectively. Each has a steel or copper plate shape with a thickness of 30 mm, and the parallel accuracy of the upper and lower surfaces is high. In addition, on the machine base 1, an enclosing means (not shown) capable of airtightly surrounding the two heat surface plates 6 and 7 and communicating with a vacuum source via a flexible conduit is fixed. It is mounted in a movable or movable manner.

Each of the two thermal surface plates 6 and 7 is provided with a plurality of through holes 9 having a diameter of 17 to 18 mm penetrating left and right. As shown in FIG. A near-infrared heater (made by USHIO INC., Near-infrared halogen heater, QIR 200V vacuum use) 10 is provided. Unlike the through hole for the cartridge heater, the through hole 9 may have a relatively low dimensional accuracy and may have a rough finish on the inner surface. Each near infrared heater 10 is supported by a support member (not shown). In addition, two shielding plates 11 having a function as a reflecting plate are provided on the side surfaces of the front end portions of the through holes 9 in the thermal surface plates 6 and 7, respectively, to allow a gap with the through holes formed therein. The near-infrared heater 10 is inserted so as to be as small as possible. The near-infrared heater 10 includes a halogen lamp 12 and two electrode portions 13 attached to both ends of the halogen lamp 12. Further, the inner surface of each through-hole 9 is blackened to enhance near infrared absorption.

In the state shown in FIG. 2, after the nanoimprint or semiconductor wafer is set on the thermal surface plate 6 in the state shown in FIG. 2, the thermal surface plates 6 and 7 are surrounded by the surrounding means by surrounding the thermal surface plates 6 and 7. In the vacuum environment, the electric cylinder 5 is extended to lower the thermal surface plate 7 via the lifting frame 4, and when the nanoimprint or the like is pressed and bonded / invoked, a plurality of near-infrared heaters 10 are provided. Electricity is supplied to the halogen lamp 12 through the plurality of electrode portions 13, and near infrared rays are emitted from the plurality of halogen lamps 12 in all directions of 360 degrees to irradiate the inner surfaces of the respective through holes 9. Of the emitted near-infrared rays, those near the both ends of each through hole 9 are reflected by the two support members 11 toward the central axis of each through hole 9. Further, in a vacuum environment, almost all of 20 W / cm ² , which is about twice the heat capacity of the conventional cartridge heater, is used for heating, and the heat plates 6 and 7 are heated. As a result, the heat platens 6 and 7 reach a temperature of 400 ° C. in 15 minutes, and are heated at a speed four times faster than the heating of the cartridge heater with poor heat transfer.

It is a longitudinal cross-sectional view of one Example of the thermal surface plate to which this invention is applied. It is a front view of the heating type pressurization apparatus using the thermal surface plate of this invention.

Explanation of symbols

6; 7 Thermal surface plate 9 Through hole 10 Near infrared heater

Claims (4)

A method of heating a thermal platen in a heating type pressurizer equipped with a thermal platen that is used and heated in a vacuum environment,
A near-infrared heater is inserted into a through hole formed in the thermal platen, and the thermal platen is heated by irradiating the inner surface of the through-hole with a near infrared ray emitted from the near-infrared heater. A heating method for a heat platen of a heating type pressurizing apparatus. In the thermal platen in the heating type pressurizer equipped with a thermal platen that is used and heated in a vacuum environment,
A thermal surface plate in a heating type pressurizing apparatus, wherein a through hole is formed in the thermal surface plate, and a near infrared heater is inserted through the through hole. The two shielding plates having a function as a reflecting plate are respectively attached to the side surface of the front end portion of the through hole in the thermal platen so as to penetrate the near infrared heater. The heat platen in the heating type pressure device. The thermal surface plate in the heating type pressurizing apparatus according to claim 2 or 3, wherein the inner surface of the through hole is blackened.