JP2009039674A - Method and apparatus for forming film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a film, with which thickness uniformity of the film to be formed by drying a liquid film is improved. <P>SOLUTION: An apparatus for discharging a liquid droplet is characterized in that the liquid droplets are landed on target points continuous along the +X direction substantially at the same timing to form the partially-liquid film on each of target points and appearance frequency of a heater block HB of an off state is decentralized in both ends of the partially-liquid droplet in the +X direction, namely, in a low temperature area RL by using a dithering method or an error diffusion method when the partially-liquid film is dried by driving the heater block HB. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a film forming method and a film forming apparatus.

Multi-layer substrates made of Low Temperature Co-fired Ceramics (LTCC) have excellent high-frequency characteristics and high heat resistance, so high-frequency module substrates and ICs
Widely used for package substrates. As a method for manufacturing a film pattern such as a wiring used for an LTCC multilayer substrate, an inkjet method has attracted attention in order to improve productivity and reduce costs. The inkjet method uses a droplet discharge head that discharges a liquid containing a wiring material as droplets, and causes the droplet discharge head to discharge droplets while relatively moving the droplet discharge head and the substrate in the main scanning direction. . The plurality of droplets including the wiring material are sequentially united along the main scanning direction of the substrate to form a line-shaped liquid film continuous in the main scanning direction. In the ink jet method, a pattern is formed by drying the line-shaped liquid film.

In Patent Document 1, a temperature gradient is applied to the surface of the line-shaped liquid film, and a high temperature surface and a low temperature surface are provided on both sides of the main scanning direction, respectively. A liquid film having a temperature gradient forms a distribution of surface tension on its surface and generates Marangoni convection inside. The thermocapillary flow flowing out from the end portion on the high temperature side of the liquid film descends toward the substrate before reaching the end portion on the low temperature side due to the temperature gradient applied to the liquid film. As a result, the wiring material not included in the Marangoni convection channel is deposited at the low temperature side end, and the wet spreading of the liquid film is pinned by the deposited wiring material. On the other hand, since the wiring material continues to be conveyed by convection at the end portion on the high temperature side, the wiring material is difficult to deposit. Therefore, as the drying of the liquid film proceeds, the high temperature side of the liquid film contracts toward the end portion on the low temperature side, and the wiring material is deposited only on the end portion on the low temperature side of the liquid film. As a result, the liquid film forms a wiring pattern having a line width narrower than its own width.

The inkjet method is also attracting attention as a method for forming an alignment film used in a liquid crystal display device (for example, Patent Document 2). FIGS. 10A and 10B and FIGS. 11A and 11B are a plan view and a side view, respectively, schematically showing the alignment film forming process. In the alignment film forming step, the droplet D is discharged onto the substrate S to form the liquid film F0, and the solvent contained in the liquid film F0 is evaporated to dry the liquid film F0. The drying process is performed.

As shown in FIG. 10, in the droplet discharge process, the surface of the substrate S (hereinafter simply referred to as discharge surface Sa).
That's it. ), A plurality of ejection regions R extending in the vertical direction are virtually divided continuously in the horizontal direction. The droplet discharge head H moves along the direction of the arrow in order from the top of the leftmost discharge region R, and discharges a plurality of droplets D including the alignment film material over the entire discharge region R. A strip-shaped partial liquid film F is formed in each of the discharge regions R. That is, the droplet discharge head H forms the liquid film F0 by multi-scan. Alternatively, as shown in FIG. 11, a plurality of droplet discharge heads H arranged in the left-right direction discharge droplets D over the entire discharge region R, and thereby a partial liquid is discharged into each of the plurality of discharge regions R. A film F is formed. That is, a plurality of droplet discharge heads H
Forms the liquid film F0 by a single scan. Each of the plurality of partial liquid films F is united with other adjacent partial liquid films F to form a liquid film F0 over the entire substrate S as the processing time of the droplet discharge process elapses.
JP 2005-152758 A JP 2006-15271 A

When forming a film using the multi-scan method, at the boundary between adjacent partial liquid films F,
The landing timing of the droplet D is different by one scanning time of the droplet discharge head. Also,
Even in the case of using the single scan method, the landing timing of the droplet D differs by the scanning time at the distance between the droplet discharge heads H at the boundary between the adjacent partial liquid films F.

At the edge portion of the partial liquid film F (for example, both end portions Fe in the left-right direction), the surface area per unit volume increases, so the evaporation probability of the evaporation component increases, and the drying rate is higher than the drying rate of the central portion Fc. Get faster. Therefore, at both end portions Fe of the partial liquid film F, the flow of the alignment film material is generated inside due to the thickening of the liquid, and the concentration of the alignment film material is locally increased. As a result, when the liquid film F0 is dried, the liquid film F0 after the drying process is formed with a film thickness step (shading shown in FIGS. 10 and 11) at each end portion Fe.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a film forming method and a film forming apparatus for improving the film thickness uniformity of a film formed by drying a liquid film. is there.

In the film forming method of the present invention, a liquid material containing a film material is formed into a plurality of droplets, discharged onto an object, and the liquid material on the object is dried to form a film on the object. A method,
A step of forming a liquid film along the row direction of the point sequence by landing the droplets on each point of the point sequence on the object, and random temperature data regarding the temperature for drying the liquid film And a step of generating correction data by synthesizing noise and drying the liquid film by forming a temperature distribution based on the correction data on the liquid film.

According to this film forming method, the temperature of the liquid film is randomly distributed by the synthesis of random noise. Therefore, since the evaporation probability of the liquid film is randomly distributed in the column direction, the bias of the film material is randomized in the column direction. As a result, this film forming method can reduce the unevenness of the film thickness as viewed from the whole film by the amount of randomizing the unevenness of the film material in the column direction. Therefore, this film forming method can improve the film thickness uniformity of the film formed by drying the liquid film.

In this film forming method, the step of drying the liquid film may be configured to generate the correction data by synthesizing random noise and binarizing the temperature data.
According to this film forming method, the correction data is binarized data. Therefore, according to this film forming method, the temperature control of the liquid film can be simplified.

In this film forming method, it is preferable that the step of drying the liquid film generates the correction data by synthesizing random noise with temperature data related to both end portions of the liquid film in a predetermined width in the column direction.

According to this film forming method, the temperatures at both ends of the liquid film are randomly distributed. Therefore,
Both ends of the liquid film can suppress the unevenness of the film material. Therefore, this film forming method can more effectively improve the film thickness uniformity of the film formed by drying the liquid film.

In this film forming method, the step of drying the liquid film includes combining the random data with the temperature data related to the intermediate portion of the predetermined width in the column direction and the both end portions of the liquid film to generate the correction data. The structure to generate is preferable.

According to this film forming method, the temperature is randomly distributed in the vicinity of both end portions of the liquid film. Therefore, the bias of the film material can be randomized in the vicinity of both end portions of the liquid film. Therefore, this film forming method can more effectively improve the film thickness uniformity of the film formed by drying the liquid film.

In this film forming method, the step of forming the liquid film includes forming the liquid film by landing the droplets at the same timing from each of the plurality of nozzles arranged in the row direction to each point of the point row. You may do it.

According to this film forming method, droplets from a plurality of arranged nozzles land at substantially the same timing to form a liquid film continuous in the column direction. The liquid film continuous in the column direction improves the film thickness uniformity by the amount that the temperature is randomly distributed. Therefore, the plurality of arranged nozzles can improve the film thickness uniformity without changing the droplet discharge timing.
Therefore, this film forming method can improve the film thickness uniformity under a simpler configuration.

In this film forming method, the step of forming the liquid film includes causing the droplets to land at the same timing from each of the plurality of nozzles arranged in the row direction at the same timing. The step of forming a liquid film continuous in the intersecting direction by relatively moving the object in a direction intersecting the row direction, and drying the liquid film includes: both end portions having a predetermined width in the row direction; The correction data may be generated by synthesizing random noise with temperature data related to both end portions of a predetermined width in the intersecting direction.

According to this film forming method, the temperature is randomly distributed around the entire periphery of the liquid film. Therefore, this film forming method can disperse the unevenness of the film material over the entire periphery of the liquid film. Therefore, this film forming method can further improve the film thickness uniformity of the film formed by drying the liquid film.

In the film forming method of the present invention, a liquid material containing a film material is formed into a plurality of droplets, discharged onto an object, and the liquid material on the object is dried to form a film on the object. A method,
A first liquid film is formed on the first point sequence by landing the liquid droplets on each point of the first point sequence on the object, and the first liquid film is dried at a predetermined temperature to form the first film. A step of measuring the film thickness distribution of the first film in the coordinate system of the first point sequence, and landing the droplet on each point of the second point sequence on the object Forming a second liquid film on the second point sequence; and converting the coordinate system of the first point sequence to the coordinate system of the second point sequence, thereby obtaining the film thickness distribution data of the first film. The correction data is generated by converting the film thickness distribution data in the coordinate system of the two-point sequence into binary data by synthesizing random noise to the film thickness distribution data in the coordinate system of the second point sequence, and generating the correction data. Drying the second liquid film by forming a temperature distribution based on the correction data in the two liquid film; A.

According to the film forming method of the present invention, the temperature distribution of the second liquid film is randomized based on the unevenness of the film thickness caused by drying at a predetermined temperature. Therefore, the film forming method of the present invention can more reliably improve the film thickness uniformity of the film formed by drying the liquid film.

The film forming apparatus of the present invention includes a droplet discharge head that discharges a liquid material containing a film material into a plurality of liquid droplets and discharges the liquid material on the target, and a film on the target by drying the liquid on the target. And a controller for controlling the droplet discharge head and the drying unit, wherein the controller drives the droplet discharge head on the object. A liquid film is formed along the line direction of the point sequence by landing the droplets on each point of the point sequence, and random noise is combined with the temperature data related to the temperature for drying the liquid film and corrected Data is generated, and the drying unit is driven to form a temperature distribution based on the correction data in the liquid film.

According to the film forming apparatus of the present invention, the temperature of the liquid film is randomly distributed by the synthesis of random noise. Therefore, since the evaporation probability of the liquid film is randomly distributed in the column direction, the bias of the film material is randomized in the column direction. As a result, this film forming apparatus can reduce the unevenness of the film thickness as viewed from the entire film by the amount of randomization of the unevenness of the film material in the column direction. Therefore, this film forming apparatus can improve the film thickness uniformity of the film formed by drying the liquid film.

In this film forming apparatus, the control unit generates the correction data by synthesizing and binarizing random noise with temperature data related to the temperature for drying the liquid film, and drives the drying unit. The temperature distribution based on the correction data may be formed on the liquid film.

According to this film forming apparatus, the correction data is binarized data. Therefore, according to this film forming method, the temperature control of the liquid film can be simplified.
The film forming apparatus of the present invention includes a droplet discharge head that discharges a liquid material containing a film material into a plurality of liquid droplets and discharges the liquid material on the target, and a film on the target by drying the liquid on the target. And a controller for controlling the droplet discharge head and the drying unit, wherein the controller drives the droplet discharge head to form an object on an object. A first liquid film is formed along the direction of the first point by landing the liquid droplets on each point of the first point line, and the drying unit is driven to bring the first liquid film to a predetermined temperature. A first film is formed by drying, and the droplet discharge head is driven to land the droplet on each point of the second point row on the object, thereby along the row direction of the second point. Forming the second liquid film and converting the coordinate system of the first point sequence to the coordinate system of the second point sequence, The correction is performed by converting the film thickness distribution data into film thickness distribution data in the coordinate system of the second point sequence, and binarizing the film thickness distribution data in the coordinate system of the second point sequence by combining random noise. Data is generated, and the drying unit is driven to form a temperature distribution based on the correction data in the second liquid film.

According to the film forming apparatus, the temperature distribution of the second liquid film is randomized based on the unevenness of the film thickness caused by drying at a predetermined temperature. Therefore, the film forming method of the present invention can more reliably improve the film thickness uniformity of the film formed by drying the liquid film.

In this film forming apparatus, the drying unit includes a plurality of heaters arranged in the row direction and in thermal contact with the object, and the control unit drives each of the plurality of heaters to A configuration in which a temperature distribution is formed in the liquid film is preferable.

According to this film forming apparatus, the plurality of heaters arranged in the column direction form a temperature distribution in the liquid film. Therefore, the film forming apparatus can form the temperature distribution given to the liquid film with higher accuracy.

(First embodiment)
Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a droplet discharge apparatus 10 as a film forming apparatus.

In FIG. 1, the droplet discharge device 10 includes a base 11 extending in one direction, and a substrate stage 12 mounted on the base 11 and placing a substrate S thereon. Substrate stage 12 is substrate S
The substrate S is positioned and fixed with one surface of the substrate 1 facing upward, and the substrate S is transported along the longitudinal direction of the base 11. As the substrate S, a substrate such as a green sheet, a glass substrate, a silicon substrate, a ceramic substrate, or a resin film can be used.

In the present embodiment, the upper surface of the substrate S is referred to as a discharge surface Sa. The ejection surface Sa is a surface for forming a desired film, and has a position for landing a droplet as a target point. The direction in which the substrate S is transported and directed in the upper left direction in FIG. 1 is referred to as a + Y direction. Also,
A direction perpendicular to the + Y direction and directed to the upper right direction in FIG.
The normal direction of the substrate S is referred to as the Z direction.

The droplet discharge device 10 includes a gate-shaped guide member 13 straddling the base 11 and an ink tank 14 disposed on the upper side of the guide member 13. The ink tank 14 stores the ink Ik as a liquid material and derives the stored ink Ik at a predetermined pressure. As the ink Ik, an alignment film ink in which an alignment film material as a film material is dispersed, ITO (Indium Tin Oxide)
Ink such as ITO ink in which fine particles are dispersed and silver ink in which silver fine particles are dispersed can be used.

As the alignment film ink, for example, an alignment film prepared by dissolving polyimide or polyamic acid as an alignment film material in a mixed solvent obtained by mixing γ-butyrolactone, butyl cellosolve, and N-methyl-2-pyrrolidone can be used ( The solid concentration is 8% by weight based on the total mass of the ink). As the composition ratio of the mixed solvent, for example, γ-butyrolactone, butyl cellosolve, and N-methyl-2-pyrrolidone are 93% by weight, 2% by weight, and 5% by weight, respectively.
Can be used as

As the silver ink, for example, an ink prepared by dispersing silver fine particles having a particle diameter of 30 nm using trisodium citrate as a dispersion aid in a mixed solvent in which water and xylitol are mixed can be used. As the composition ratio of the silver ink, for example, water, xylitol, and silver fine particles can be used at 40 wt%, 20 wt%, and 40 wt%, respectively.

The guide member 13 supports the carriage 15 so as to be movable along the + X direction and the direction opposite to the + X direction (−X direction). The carriage 15 carries the droplet discharge head H and moves along the + X direction and the −X direction. The carriage 15 moves in the + X direction or the −X direction when the substrate S is transported in the + Y direction, and places the droplet discharge head H on the transport path of the target point. The operation of transporting the substrate S in the + Y direction and the −Y direction is called main scanning. An operation in which the droplet discharge head H is transported in the + X direction and the −X direction and is disposed on the transport path of the target point is referred to as sub-scanning.

Next, the droplet discharge head H will be described below. FIG. 2 is a perspective view of the droplet discharge head H as viewed from the substrate stage 12. FIG. 3 is a diagram schematically showing the inside of the droplet discharge head H. As shown in FIG. FIG. 4 is a plan view showing the ejection position of the droplet D ejected using the droplet ejection head H. FIG.

In FIG. 2, the droplet discharge head H includes a head substrate 21 extending in the + X direction and a head body 22 mounted on the head substrate 21. The head substrate 21 is positioned and fixed on the carriage 15 and moves along the + X direction and the −X direction with respect to the substrate S. Head substrate 2
1 has an input terminal 21 a at one end thereof, and outputs various drive signals input to the input terminal 21 a to the head body 22.

The head main body 22 has k (k is an integer of 1 or more) nozzles N over substantially the entire width in the + X direction of the side surface facing the substrate S. Each nozzle N is a circular hole extending in the Z direction, and is formed at a predetermined pitch along the + X direction. The head main body 22 has 180 nozzles N arranged at a pitch of 141 μm along the + X direction, for example. In this embodiment, the formation pitch of the nozzles N is the nozzle pitch Dx, and the width of the nozzle row composed of each nozzle N is called the nozzle row width Rw. In FIG. 2, the number of nozzles N is shown in a simplified manner in order to explain the arrangement of the nozzles N.

In FIG. 3, the head main body 22 includes, for each nozzle N, one cavity 23 and one pressure generating element 24 that applies pressure to the inside of the cavity 23. That is, the head body 22 includes k cavities 23 equal to the number of nozzles N and k pressure generating elements 24. The cavities 23 and the pressure generating elements 24 are associated with the nozzles N by being disposed immediately above the nozzles N, respectively. Each cavity 23 is connected to a common ink tank 14 to store the ink Ik from the ink tank 14, and supplies the ink Ik to the communicating nozzle N. Each nozzle N receives the ink Ik from the communicating cavity 23 and forms a gas-liquid interface (hereinafter simply referred to as a meniscus M) at its own opening.

Each pressure generating element 24 applies a predetermined pressure to the cavity 23 to which it is connected, and increases and decreases the pressure inside the cavity 23, thereby vibrating the meniscus M of the nozzle N communicating with the cavity 23. Let As the pressure generating element 24, for example, a piezoelectric element that mechanically expands and contracts the volume of the cavity 23, or a resistance heating element that locally increases and decreases the temperature of the cavity 23 can be used.

When the target point T of the discharge surface Sa is located immediately below the selected nozzle N (hereinafter simply referred to as the selected nozzle), the cavity 23 communicating with the selected nozzle is a corresponding pressure generating element 24.
By receiving this driving force, the meniscus M of the selected nozzle is vibrated, and a part of the ink Ik is made a droplet D having a predetermined weight and ejected from the selected nozzle. Droplet D ejected from nozzle N
Flies along the normal line of the ejection surface Sa and lands on the target point T.

In FIG. 4, the discharge surface Sa of the substrate S has a plurality of discharge regions R extending in the + Y direction, as indicated by a dashed line. Each ejection region R is a region having a width of the nozzle row width Rw in the + X direction, and is virtually divided by the dot pattern grid SL. In each dot pattern lattice SL, the lattice interval in the + Y direction and the lattice interval in the + X direction are respectively defined by the ejection interval of the droplets D. For example, the lattice spacing in the + Y direction of each dot pattern lattice SL is defined by the product of the ejection period of the droplet ejection head H and the main scanning speed of the substrate S, respectively. The grid spacing in the + X direction of each dot pattern grid SL is defined by the nozzle pitch Dx.

The selection of whether or not to discharge the droplet D is defined for each grid point of each dot pattern grid SL. In the present embodiment, in order to form the partial liquid film F over the entire discharge region R,
All grid points in each discharge region R are selected as target points T. In FIG. 4, in order to explain the lattice points of the dot pattern lattice SL, the lattice spacing of the dot pattern lattice SL is enlarged.

When the discharge process of the droplet D is executed, each nozzle N of the droplet discharge head H is arranged on an extension line of a group of target points T that are continuous in the + Y direction. When the substrate S is main-scanned, each nozzle N of the droplet discharge head H faces the k target points T arranged in the + X direction at the same timing. That is, the droplets D land on the k target points T arranged in the + X direction at substantially the same timing. The k droplets D that land are +
A liquid film F0 is formed which is united along the X direction and continuous in the + X direction. Note that substantially the same timing means that k droplets D that land at + k target points T arranged in the + X direction are +
This is the timing at which a liquid film continuous in the X direction is formed, and is a timing at which there is no film thickness step between the droplets D due to the difference in landing timing between adjacent droplets D. A group of droplets D (k droplets D) that land at substantially the same timing are a band-shaped portion that extends along the + Y direction by the subsequent group of droplets D sequentially landing in the -Y direction. A liquid film F is formed.
Then, each droplet discharge head H forms a plurality of partial liquid films F extending in the + Y direction along the + X direction, and unites a plurality of adjacent partial liquid films F together so that the entire discharge surface Sa is formed. One liquid film F0 is formed.

When forming an alignment film having a film thickness of 3 μm using the alignment film ink, for example, the liquid film F0 is formed using the alignment film ink, and the liquid film F0 is dried at room temperature for 50 minutes. Alternatively, the liquid film F0 is heated to 40 ° C. and dried for 30 minutes. Alternatively, the liquid film F0 is heated to 100 ° C. and temporarily dried for 1 minute, and then heated to 200 ° C. and dried for 10 to 30 minutes. During these drying processes, in the alignment film ink, butyl cellosolve, which is relatively easy to evaporate, evaporates first, and a solvent component having a high surface tension remains in the liquid film F0. Therefore, when a uniform amount of heat is applied to the liquid film F0, leveling proceeds at the partial liquid film F and the central portion of the liquid film F0, and a film thickness step starts to be formed at the edge. The present invention gives a predetermined temperature distribution to the liquid film F0 during these drying processes.

When forming a wiring with a film thickness of 10 μm using the silver ink, for example, a liquid film F0 is formed with silver ink, and the liquid film F0 is dried at 60 ° C. and then baked at 900 ° C. In the present invention, before the liquid film F0 is dried at 60 ° C., a predetermined temperature distribution is given to the liquid film F0.

Next, the substrate stage 12 will be described below. FIGS. 5A and 5B are a plan view and a side cross section showing the substrate stage 12 on which the substrate S is placed, respectively.
In FIG. 5, the upper surface of the substrate stage 12 (hereinafter simply referred to as the heating surface 12a) has a plurality of heater blocks HB. The plurality of heater blocks HB are respectively in the + X direction and +
Arranged in a matrix of i × j along the Y direction, the heating surface 12a is filled in the closest packing throughout the + X direction and the + Y direction. Upper surface (contact surface Ha) of each heater block HB
Are smooth surfaces each having a high thermal bond with the back surface of the substrate S, and are sufficiently small in size for one ejection region R. Each heater block HB is a heat source that is independently driven in response to a predetermined drive signal, and heat energy corresponding to the drive signal is applied to the substrate S.
To supply.

When executing the discharge process of the droplet D, each heater block HB receives a predetermined drive signal and supplies thermal energy corresponding to the drive signal to the region of the substrate S that is in contact with its upper surface. The substrate S absorbs heat energy from each heater block HB, thereby forming a temperature distribution on the discharge surface Sa according to the amount of heat generated by each heater block HB. That is, each heater block HB forms a desired temperature distribution along the surface direction of the discharge surface Sa.

Next, the temperature distribution formed on the ejection surface Sa will be described below. FIGS. 6A and 6B are plan views schematically showing gradation values assigned to the respective heater blocks HB and temperature patterns formed on the heating surface 12a using the gradation values. is there.

In FIG. 6A, each heater block HB is assigned a gradation value constituting temperature data. The gradation value assigned to each heater block HB is a value relating to the output of the heater block HB, and is represented by an integer from 0 to 9, for example. In the present embodiment, the gradation values assigned to each heater block HB are classified into two types based on design data related to the discharge region R, that is, the coordinates of each discharge region R.

More specifically, a relatively high gradation value (for example, gradation value “9”) is assigned to the inside of the ejection region R and excluding the inner edge portion of the ejection region R. On the other hand, a relatively low gradation value (for example, gradation value “4”) is assigned to the inner edge portion of the ejection region R and the outside of the ejection region R. In the present embodiment, a region to which a relatively high gradation value is assigned is referred to as a high temperature region RH. A region to which a relatively low gradation value is assigned is referred to as a low temperature region RL. The sizes of the high temperature region RH and the low temperature region RL are the material of the ink Ik, the surface state of the ejection surface Sa,
It is appropriately selected according to the output of each heater block HB. That is, the sizes of the high temperature region RH and the low temperature region RL are appropriately selected so that the evaporation probabilities are substantially the same at both end portions and the central portion of the partial liquid film F along the + X direction.

The gradation value as the temperature data may be one type regardless of the coordinates of each ejection region R, or may be three or more types according to the coordinates of the ejection region R. For example, when an alignment film having a film thickness of 3 μm is formed using the alignment film ink, the gradation value is about 4 for the liquid film F0.
It may be 0 ° C. or one value for heating the liquid film F 0 to about 100 ° C. Further, when a wiring having a film thickness of 10 μm is formed using the silver ink, the gradation value may be one kind of value for heating the liquid film F0 to about 60 ° C.

In FIG. 6B, binarization data (“0” or “1”) constituting correction data is assigned to each heater block HB. In FIG. 6B, gradation is added to the heater block HB to which “1” is assigned as binarized data, and “0” is added.
The heater block HB to which is assigned is shown in white.

The binarized data is data representing the on or off state of the heater block HB, and is generated by binarizing by combining random noise with each gradation value of the gradation pattern. For example, the binarized data is generated by using a random dither method in which the threshold is determined by a random number. Random noise satisfies the properties of equi-establishment and irregularity.

The gradation value of the high temperature region RH is converted into binary data “1” indicating an ON state by the binarization process. On the other hand, the gradation values in the low temperature region RL are converted into binarized data “1” indicating the on state and binarized data “0” indicating the off state, respectively, by the binarization process. Thereby, as shown in FIG. 6B, the binarized data “0” is randomly distributed in the low temperature region RL.

When the discharge process of the droplet D is executed and when the drying process of the liquid film F0 is executed, each heater block HB is turned on or off according to the binarized data. The region of the discharge surface Sa that faces the high temperature region RH is relatively hot because all the heater blocks HB are turned on. On the other hand, the region of the discharge surface Sa facing the low temperature region RL becomes low in temperature by the distribution of the heater blocks HB in the off state. In each low temperature part, ink I
Since the evaporation probability of k becomes low, the film material easily flows. As a result, the inner edge portion of the partial liquid film F can suppress the increase in the concentration of the film material and can disperse the unevenness of the film material as much as the low-temperature portion is randomly distributed. Therefore, the partial liquid film F can reduce the thickening of the inner edge portion, and can improve the film thickness uniformity by the amount of the thick film portion being dispersed.

Next, the electrical configuration of the droplet discharge device 10 configured as described above will be described with reference to FIG.
FIG. 7 is an electric block circuit diagram showing an electrical configuration of the droplet discharge device 10.
In FIG. 7, the control unit 30 includes a CPU, DSP, ROM, RAM, and the like. Control unit 3
0 is a main scan of the substrate S using the substrate stage 12 and a sub-scan of the droplet discharge head H using the carriage 15 according to various control programs and various data stored in the ROM and RAM.
A droplet discharge process using the droplet discharge head H and a drying process of the liquid film F0 using the heater block HB are executed.

The control unit 30 is connected to an input / output device 31 having various operation switches and a display, and receives various signals input from the input / output device 31. For example, the control unit 30 receives process data Ip in a predetermined format for executing the droplet discharge process and the drying process from the input / output device 31.

When receiving the process data Ip from the input / output device 31, the control unit 30 performs a predetermined development process on the process data Ip to generate dot pattern data DPD. The dot pattern data DPD is data having the same bit length as the number of grid points of the dot pattern grid SL, and is data defining whether or not the droplet D is ejected for each grid point of the dot pattern grid SL. That is, the dot pattern data DPD includes a bit value (“0”) that represents whether the pressure generating element 24 is on or off at each lattice point of the dot pattern lattice SL.
Or “1”).

When receiving the process data Ip from the input / output device 31, the control unit 30 performs a predetermined development process on the process data Ip to generate gradation pattern data GPD as temperature data. The gradation pattern data GPD is stored in each heater block H in the coordinate system of the ejection region R.
B is data relating to the high temperature region RH or the low temperature region RL, respectively.

When the control unit 30 generates the gradation pattern data GPD, the gradation pattern data GPD
Is used to generate temperature pattern data TPD as correction data. The temperature pattern data TPD is data for associating the binarized data with each heater block HB, and is generated by binarizing the gradation pattern data GPD synthesized with random noise.

The control unit 30 is connected to the substrate detection device 32. The substrate detection device 32 has an imaging function for detecting an edge of the substrate S. The control unit 30 receives the detection signal from the substrate detection device 32 and calculates the relative position of the substrate S with respect to the droplet discharge head H, that is, the relative position of each target point T with respect to the droplet discharge head H.

The control unit 30 is connected to the substrate stage drive circuit 33 and inputs a control signal corresponding to the substrate stage drive circuit 33 to the substrate stage drive circuit 33. In response to the control signal from the control unit 30, the substrate stage drive circuit 33 rotates the stage motor MS for moving the substrate stage 12 in the forward or reverse direction. The substrate stage drive circuit 33 receives the detection signal from the stage motor encoder ES and calculates the rotation direction and the rotation speed of the stage motor MS. The control unit 30 calculates the moving direction and moving amount of the substrate stage 12 using the calculation result from the substrate stage drive circuit 33, and determines whether or not the target point T on the ejection surface Sa is located directly below the nozzle N. To do. The control unit 30 generates a timing signal LT every time each target point T is located immediately below the nozzle N, and outputs the timing signal LT to the ejection head drive circuit 35.

The control unit 30 is connected to the carriage drive circuit 34 and inputs a control signal corresponding to the carriage drive circuit 34 to the carriage drive circuit 34. The carriage drive circuit 34 responds to a control signal from the control unit 30 to move the carriage 15.
C is rotated forward or reverse. The carriage drive circuit 34 is a carriage motor encoder EC.
The rotation direction and the number of rotations of the carriage motor MC are calculated. The control unit 30 calculates the movement direction and movement amount of the carriage 15 using the calculation result from the carriage drive circuit 34 and arranges each nozzle N on the main scanning path of each target point T.

The control unit 30 is connected to the ejection head drive circuit 35 and inputs a timing signal LT and a drive waveform signal COM for driving the pressure generating element 24 to the ejection head drive circuit 35. Further, the control unit 30 generates serial pattern data SI for serial transfer of the dot pattern data DPD, and sends the serial pattern data SI to the ejection head drive circuit 35.
Is transferred serially. The ejection head drive circuit 35 receives the serial pattern data SI from the control unit 30 and performs serial / parallel conversion, and the dot pattern data DPD for each of the k nozzles N, that is, the k pressure generating elements 24, is converted. Parallel pattern data corresponding to each bit value is generated. When the ejection head drive circuit 35 receives the timing signal LT from the control unit 30, the ejection head drive circuit 35 supplies the drive waveform signal COM to the pressure generating element 24 selected for the ejection operation based on the parallel pattern data. In the present embodiment, when the ejection head drive circuit 35 receives the timing signal LT, the ejection waveform drive circuit 35 outputs the drive waveform signal CO to all the pressure generating elements 24.
M is supplied. As a result, the control unit 30 applies to each target point T continuous along the + X direction.
The droplets D are landed at substantially the same timing.

The control unit 30 is connected to the heater drive circuit 36. The control unit 30 generates a heater drive signal SH for driving each heater block HB based on the temperature pattern data TPD, and outputs the heater drive signal SH to the heater drive circuit 36. The heater drive circuit 36 performs control of the heater block HB based on the binarized data in response to the heater drive signal SH from the control unit 30, thereby randomly distributing the heater block HB in the off state to the low temperature region RL. Let

Next, a method for forming a film using the droplet discharge device 10 will be described.
First, as shown in FIG. 1, on the substrate stage 12, the substrate S with the discharge surface Sa on the upper side.
Is placed. At this time, the end in the + Y direction of the substrate S is in the −Y direction (+ Y of the guide member 13).
In the opposite direction). The control unit 30 receives the process data Ip from the input / output device 31.
Is received, dot pattern data DPD and gradation pattern data GPD are generated using process data Ip.

Next, the control unit 30 binarizes the gradation pattern data GPD to generate temperature pattern data TPD, generates a heater driving signal SH based on the temperature pattern data TPD, and drives each heater block HB. That is, the temperature distribution corresponding to the discharge region R is expressed by the discharge surface S.
a. As a result, the high temperature region RH of the discharge region R becomes relatively high in the discharge region R, and the low temperature region RL of the discharge region R has dispersed low temperature portions.

When the low temperature portion is dispersed in the low temperature region RL, the control unit 30 drives the carriage motor MC via the carriage drive circuit 34 and arranges each nozzle N on the main scanning path of each target point T. Then, the control unit 30 drives the stage motor MS via the substrate stage drive circuit 33 to start main scanning of the substrate S.

When the main scanning of the substrate S is started, the control unit 30 receives the detection signal from the substrate detection device 32 and calculates the relative position of each target point T with respect to the droplet discharge head H, and the calculation result from the substrate stage driving circuit. Is used to calculate the relative position of each target point T thereafter. Based on the relative position of each target point T with respect to the droplet discharge head H, the control unit 30 determines whether each target point T is directly under the nozzle N, and each target point T is directly under the nozzle N. Timing signal L every time it is positioned
T is generated and a timing signal LT is output to the ejection head drive circuit 35. That is, each time k target points T continuous in the + X direction are located immediately below the k nozzles N, the control unit 30 performs substantially the same timing with respect to the k target points T. To land the droplet D. The k droplets D that land at the same timing are united along the + X direction to form a liquid film F0 continuous in the + X direction.

At this time, both end portions along the + X direction of the partial liquid film F are subjected to thermal energy from the low temperature region RL, respectively, so that the temperature becomes relatively low in the partial liquid film F and are locally distributed at random. It has a typical low temperature part. As a result, at both end portions of the partial liquid film F, the increase in the evaporation probability accompanying the increase in the specific surface area can be mitigated by the local low temperature portion. In addition, at both end portions of the partial liquid film F, the unevenness of the film material can be dispersed by the amount that the local low temperature portions are randomly distributed, and thus the film thickness value after drying can be made uniform.

Thereafter, similarly, the control unit 30 repeats the main scanning of the substrate S, and each time k target points T consecutive in the + X direction are located immediately below the k nozzles N, the k target points T The droplets D are landed simultaneously. Then, the bias of the film material can be dispersed by the random distribution of the local low temperature portion. As a result, the control unit 30 can achieve uniformity of the film material in the partial liquid film F, and consequently improve the film thickness uniformity of the film made of the liquid film F0.

Next, the effect of 1st embodiment comprised as mentioned above is described below.
(1) In the first embodiment, the droplet discharge device 10 causes the droplet D to land on each target point T continuous along the + X direction to form a partial liquid film F continuous in the + X direction. . Then, when drying the liquid film F <b> 0, the droplet discharge device 10 randomly distributes the both ends of the discharge region R in the + X direction, that is, local low temperature portions in the low temperature region RL.

Therefore, the droplet discharge device 10 can randomly distribute the bias of the film material in the partial liquid film F in the + X direction. As a result, the droplet discharge device 10 can reduce the unevenness of the film material in the liquid film F0 by the amount that the unevenness of the film material is randomly distributed in the + X direction. Therefore, the droplet discharge device 10 can improve the film thickness uniformity of the film formed by drying the liquid film F0.

(2) Further, in the first embodiment, the droplet discharge device 10 has the + in the partial liquid film F.
Local low temperature portions are randomly distributed at both end portions in the X direction. In the low temperature portion that is randomly distributed, the evaporation probability of the ink Ik is low. Therefore, at both end portions of the partial liquid film F in the + X direction, the difference in evaporation probability due to the difference in specific surface area is suppressed by the random distribution of the low temperature portion. As a result, the droplet discharge device 10 can more effectively improve the film thickness uniformity of the film formed by drying the liquid film F0.

(3) In the first embodiment, the droplet discharge device 10 randomly disperses the low temperature portion in the entire inner edge portion in the discharge region R, that is, in the low temperature region RL. Therefore,
Between the inner edge portion of the partial liquid film F, the difference in evaporation probability due to the difference in specific surface area is suppressed by the randomly distributed low temperature portion. As a result, the droplet discharge device 10 can more effectively improve the film thickness uniformity of the film formed by drying the liquid film F0.

(4) In the first embodiment, the droplet discharge device 10 causes the droplet D to land on each target point T continuous along the + X direction at substantially the same timing. Therefore, the droplet discharge device 10 can improve the film thickness uniformity without changing the discharge timing of the droplet D. Therefore, the droplet discharge device 10 can improve the film thickness uniformity under a simpler configuration.

(Second embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the test film formation process is executed before the main film formation process, and the temperature distribution formed on the substrate S is changed based on the process result of the test film formation process. This change will be described in detail.

8A and 8B are a side sectional view showing the substrate stage 12 in the test film formation process and a film thickness distribution in the test film formation process, respectively. FIGS. 9A and 9B are plan views schematically showing a gradation value assigned to each heater block HB and a temperature pattern generated using the gradation value.

In FIG. 8, when the test film forming process is executed, the droplet discharge device 10 first starts the heating surface 1.
A substrate S for test film formation is placed on 2a. Next, the droplet discharge device 10 drives each heater block HB to form a predetermined test temperature distribution on the discharge surface Sa. The test temperature distribution is a temperature distribution associated with the drive signal of each heater block HB, and in the present embodiment, the test temperature distribution is a uniform temperature distribution over substantially the entire ejection surface Sa.

When the test temperature distribution is formed on the ejection surface Sa, the droplet ejection device 10 ejects the droplet D to each target point T on the ejection surface Sa to form the liquid film F0 as in the first embodiment, and the test temperature The liquid film F0 is dried under the distribution. In the present embodiment, each target point T in the test film formation process is referred to as a test point. The coordinates of each test point are coordinates associated with the coordinates of each target point T used for the film forming process, and the coordinate system of the point sequence of each test point is converted into the coordinate system of the point sequence of each target point T. It can be a coordinate system. That is, the test point is a coordinate that gives a film thickness distribution having the same tendency as the film thickness distribution obtained by the main film forming process when the landing droplet D is dried under the same temperature distribution as the main film forming process. In addition, the test point in this embodiment is the same coordinate as the target point T in this film-forming process.

When the liquid film F0 is dried under the test temperature distribution, the droplet discharge device 10 causes the dried liquid film F0 to be dried.
Is transported to a predetermined film thickness measuring device, and the film thickness distribution after drying is measured to complete the test film forming process.

In the present embodiment, the film thickness distribution obtained from the test temperature distribution is referred to as film thickness distribution data. The film thickness distribution data is a distribution of film thickness values measured in the coordinate system of the test points. For example, as shown in FIG. 8, the film thickness continuously measured along the + X direction of the ejection surface Sa. It is a distribution of values. In the test film formation process, the average value of the film thickness in the liquid film F0 is defined as the average film thickness T0, and the difference between the average film thickness T0 and the film thickness at each coordinate is referred to as a film thickness difference value δT.

The liquid film F0 formed on the discharge surface Sa forms a relatively thick portion at the inner edge portion of the discharge region R in order to increase the specific surface area at the inner edge portion of the partial liquid film F. For example, the liquid film F0 forms a relatively thick part on the heater block HB at the coordinates X3 and X14. In addition, the liquid film F0 formed on the ejection surface Sa causes a film material to flow toward the edge of the partial liquid film F, and thus forms a relatively thin part in the vicinity of the inner edge part. For example, the liquid film F0 forms a relatively thin portion immediately above the heater block HB at the coordinates X5, X12, and X16.

In FIG. 9, when performing the film forming process, the droplet discharge device 10 first starts with the input / output device 3.
1 receives data relating the film thickness difference value δT and the coordinates of the heater block HB, and generates gradation pattern data GPD for compensating the film thickness difference value δT.

That is, the droplet discharge device 10 assigns a relatively high gradation value (for example, gradation value “9”) to the heater block HB associated with the positive film thickness difference value δT larger than the predetermined value. . Further, the droplet discharge device 10 assigns a relatively low gradation value (for example, gradation value “4”) to the heater block HB associated with the negative film thickness difference value δT larger than the predetermined value. . Further, the droplet discharge device 10 assigns an intermediate gradation value (for example, gradation value “7”) to the heater block HB associated with the film thickness difference value δT smaller than the predetermined value.

For example, as shown in FIG. 9A, the droplet discharge device 10 assigns the gradation value “9” to the heater block HB at coordinates X5, X12, and X16, and the heater block HB at coordinates X3 and X14. Is assigned the gradation value “4”, and the gradation value “7” is assigned to the heater block HB between the coordinates X5 and X12.

Next, as in the first embodiment, the droplet discharge device 10 performs binarization processing on the gradation pattern data GPD to generate temperature pattern data TPD, and generates a heater drive signal SH based on the temperature pattern data TPD. Then, each heater block HB is driven.

For example, as shown in FIG. 9B, the droplet discharge device 10 assigns binarized data “1” to the heater block HB at the coordinates X5, X12, and X16, and thereby coordinates X5, The heater block HB at X12 and X16 is turned on. Further, the droplet discharge device 10 randomly distributes the binarized data “0” to the heater block HB at the coordinates X3 and X14, and thereby the heater in the off state with respect to the coordinates X3 and X14 of the discharge region R. Distribute the block HB. Further, the droplet discharge device 10 randomly outputs the binary data “0” to the heater block HB between the coordinates X5 and X12 at a lower frequency than the heater block HB at the coordinates X3 and X14. Distribute. Then, the droplet discharge device 10 distributes the heater blocks HB in the off state between the coordinates X5 and the coordinates X12 of the discharge region R at a frequency lower than the coordinates X3 and X14.

As a result, the droplet discharge device 10 can randomly distribute more low temperature portions in the region where the film thickness is thicker under the test temperature distribution, and conversely, the film thickness is lower under the test temperature distribution. More high temperature portions can be randomly distributed in the thinned region.

Next, the effect of 2nd embodiment comprised as mentioned above is described below.
(5) In the second embodiment, the droplet discharge device 10 performs a test film formation process before performing the main film formation process, and dries the liquid film F0 under the test temperature distribution to perform a test. A film thickness difference value δT corresponding to the temperature distribution is obtained. Then, when performing the film forming process, the droplet discharge device 10 generates temperature pattern data TPD based on the film thickness difference value δT, and under the temperature distribution based on the temperature pattern data TPD, the liquid film F0. To dry.

Therefore, the temperature distribution in the film forming process can correct the coordinates that can be a relatively thick film by drying under the test temperature distribution to a relatively low temperature. In addition, coordinates that can become a relatively thin film by drying under the test temperature distribution can be corrected to a relatively high temperature. And the temperature distribution in this film-forming process can suppress the flow of the film material by the amount of local high-temperature portions or low-temperature portions distributed randomly. As a result, the droplet discharge device 10 can more reliably improve the film thickness uniformity of the film made of the droplets D.

(6) In the second embodiment, the temperatures between the end portions and the intermediate portion of the partial liquid film F in the + X direction, that is, the temperatures of the coordinates X5 and the coordinates X12 are respectively higher than the intermediate portions.
Therefore, the vicinity of both end portions (inner edge portions) of the partial liquid film F increases the evaporation probability by the amount that is higher than the central portion. Therefore, since the film material in the vicinity of both end portions hardly flows to both end portions, the droplet discharge device 10 can further improve the film thickness uniformity of the film formed by drying the liquid film F0. .

In addition, you may change the said embodiment as follows.
In the first embodiment, the gradation value assigned to the heater block HB is divided into two regions based on design data related to the discharge region R. Not limited to this, the gradation value assigned to the heater block HB may be the same gradation value over the entire heating surface 12a regardless of the ejection region R. According to this configuration, the droplet discharge device 10 can perform the binarization processing of the gradation pattern at a higher speed.

In the second embodiment, the test temperature distribution is a temperature distribution that gives a uniform temperature over substantially the entire discharge surface Sa. However, the test temperature distribution is not limited to this, and the test temperature distribution is relative to a predetermined region of the discharge surface Sa. Alternatively, the temperature distribution may be low or high.

In the above embodiment, the output of the heater block HB is expressed as binarized data, that is, an on state or an off state, by binarization processing of gradation data. Not limited to this, the output of the heater block HB may be multi-valued by synthesizing random noise with gradation data and performing multi-value processing. According to this configuration, the droplet discharge device 10 is
A temperature distribution can be formed in the liquid film F0 with higher accuracy.

In the above embodiment, the droplet discharge device 10 disperses the heater blocks HB in the off state in the low temperature region RL by the binarization processing of the gradation data. Not limited to this, the droplet discharge device 1
0 expresses the output of the heater block HB in multiple gradations by synthesizing random noise to gradation data and applying multilevel processing, and the heater block H having a relatively high output is displayed in the high temperature region RH.
A configuration may be adopted in which B is distributed randomly. In the high temperature portion, the evaporation probability of the ink Ik is high, so that the film material is difficult to flow. As a result, in the central part of the liquid film F0,
As the high temperature portion is randomly distributed, the concentration of the film material is suppressed, and the unevenness of the film material is dispersed. As a result, the thickening of the both end portions of the partial liquid film F can be suppressed by the amount that the central portion of the liquid film F0 increases the concentration of the film material. Accordingly, the droplet discharge device 1
0 can improve the film thickness uniformity of the film formed by drying the liquid film.

In the above embodiment, the number of nozzle rows is one, but the number is not limited to this, and the number of nozzle rows may be two or more.
In the above embodiment, the droplet discharge device 10 executes the film forming process using the single scan method, but the present invention is not limited to this, and the film forming process using the multi scan method may be executed.

In the above-described embodiment, the heater block HB discharges the droplet D when the discharge surface Sa
Heat. However, the heater block HB is not limited to this, for example, after the liquid film F0 is formed.
The structure which heats the discharge surface Sa may be sufficient.

The perspective view which shows the droplet discharge apparatus of 1st embodiment. Similarly, a perspective view showing a droplet discharge head. Similarly, the side view which shows the inside of a droplet discharge head typically. Similarly, the top view which shows the discharge position of a droplet. Similarly, (a) and (b) are a plan view and a side sectional view schematically showing a heater block, respectively. Similarly, (a) and (b) are plan views schematically showing a gradation pattern and a temperature pattern, respectively. Similarly, the electric block circuit diagram which shows the electric constitution of a droplet discharge apparatus. (A), (b) is a figure which shows the film thickness distribution obtained by the test film-forming process and test film-forming process of the droplet discharge apparatus in 2nd embodiment, respectively. (A), (b) is a top view which shows typically the gradation pattern and temperature pattern in 2nd embodiment, respectively. (A), (b) is the top view and sectional side view which respectively show the droplet discharge process of a prior art example. (A), (b) is the top view and sectional side view which respectively show the droplet discharge process of a prior art example.

Explanation of symbols

D ... droplet, F0 ... liquid film, H ... droplet ejection head, HB ... heater block constituting the drying unit, Ik ... ink in liquid state, N ... nozzle, R ... ejection area, S ... as object substrate,
TPD: temperature pattern data as correction data, GPD: gradation pattern data, 10:
Droplet ejection device, 30... Control unit.

Claims (11)

A film forming method for forming a film on an object by discharging a liquid containing a film material into a plurality of droplets and discharging the liquid onto the object, and drying the liquid on the object,
Forming a liquid film along the row direction of the point sequence by landing the droplet on each point of the point sequence on the object; and
Generating random correction data by synthesizing random noise to temperature data related to the temperature for drying the liquid film, and drying the liquid film by forming a temperature distribution on the liquid film based on the correction data;
A film forming method comprising: The film forming method according to claim 1,
The step of drying the liquid film includes
The film forming method, wherein the correction data is generated by synthesizing and binarizing random noise with the temperature data. The film forming method according to claim 1 or 2,
The step of drying the liquid film includes
A film forming method, wherein the correction data is generated by synthesizing random noise with temperature data relating to both end portions of the liquid film in a predetermined width in the column direction. The film forming method according to claim 3,
The step of drying the liquid film includes
A method of forming a film, wherein the correction data is generated by synthesizing random noise with temperature data related to an intermediate portion having a predetermined width in the column direction and both end portions of the liquid film. It is the film-forming method as described in any one of Claims 1-4,
The step of forming the liquid film includes
The liquid film is formed by causing the droplets to land at the same timing from each of the plurality of nozzles arranged in the row direction at the same timing. The film forming method according to claim 5,
The step of forming the liquid film includes
The droplets are landed at the same timing from each of the plurality of nozzles arranged in the row direction at the same timing, and the plurality of nozzles and the object are relatively moved in a direction intersecting the row direction. To form a continuous liquid film in the intersecting direction,
The step of drying the liquid film includes
A film forming method, wherein the correction data is generated by synthesizing random noise with temperature data relating to both end portions of the predetermined width in the column direction and both end portions of the predetermined width in the intersecting direction. A film forming method for forming a film on an object by discharging a liquid containing a film material into a plurality of droplets and discharging the liquid onto the object, and drying the liquid on the object,
A first liquid film is formed on the first point sequence by landing the liquid droplets on each point of the first point sequence on the object, and the first liquid film is dried at a predetermined temperature to form the first film. Forming a step;
Measuring the film thickness distribution of the first film in the coordinate system of the first point sequence;
Forming a second liquid film on the second point sequence by landing the droplet on each point of the second point sequence on the object;
By converting the coordinate system of the first point sequence to the coordinate system of the second point sequence, the film thickness distribution data of the first film is converted into the film thickness distribution data in the coordinate system of the second point sequence, By generating random correction data by synthesizing and binarizing random noise with the film thickness distribution data in the coordinate system of the second point sequence, and forming a temperature distribution based on the correction data in the second liquid film Drying the second liquid film;
A film forming method comprising: A droplet discharge head for discharging a liquid material containing a film material into a plurality of droplets and discharging the liquid material to a target; a drying unit that forms a film on the target by drying the liquid on the target; A film forming apparatus having a droplet discharge head and a control unit that controls the drying unit,
The controller is
Forming a liquid film along the row direction of the point sequence by driving the droplet discharge head to land the droplets on each point of the point sequence on the object;
Random noise is synthesized with temperature data related to the temperature for drying the liquid film to generate correction data, and the drying unit is driven to form a temperature distribution based on the correction data in the liquid film. A film forming apparatus. The film forming apparatus according to claim 8,
The controller is
The correction data is generated by synthesizing and binarizing random noise with temperature data related to the temperature for drying the liquid film, and the temperature distribution based on the correction data is generated by driving the drying unit. A film forming apparatus characterized in that the film forming device is formed. A droplet discharge head for discharging a liquid material containing a film material into a plurality of droplets and discharging the liquid material to a target; a drying unit that forms a film on the target by drying the liquid on the target; A film forming apparatus having a droplet discharge head and a control unit that controls the drying unit,
The controller is
A first liquid film is formed along the row direction of the first point by driving the droplet discharge head to land the droplet on each point of the first point row on the object, and the drying unit To form a first film by drying the first liquid film at a predetermined temperature,
Forming a second liquid film along the row direction of the second point by driving the droplet discharge head to land the droplet on each point of the second point row on the object;
By converting the coordinate system of the first point sequence to the coordinate system of the second point sequence, the film thickness distribution data of the first film is converted into the film thickness distribution data in the coordinate system of the second point sequence, The correction data is generated by synthesizing and binarizing random noise with the film thickness distribution data in the coordinate system of the second point sequence, and the drying unit is driven and the second liquid film is based on the correction data A film forming apparatus that forms a temperature distribution. It is the film-forming apparatus as described in any one of Claims 8-10,
The drying unit has a plurality of heaters arranged in the row direction and in thermal contact with the object,
The control unit drives each of the plurality of heaters to form a temperature distribution in the liquid film.

Images