JP2009034615A - Film forming method and film forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film forming method and a film forming apparatus, wherein the uniformity of thickness of a film formed by drying a liquid film is improved. <P>SOLUTION: A liquid film F continuous in the +X direction is formed by dropping droplets substantially in the same timing on each of a plurality of target points T from each of a plurality of nozzles arranged in the +X direction. Each thermal conductive member 26 is arranged on a position on a heating surface 12a opposed to a high conductive region Rc and calories from the heating surface 12a are supplied to the back surface of a contact substrate S. The liquid film F is dried by forming a temperature distribution on the liquid film F so that the temperature of both end parts having a prescribed width in the +X direction and both end parts of the liquid film F along the +Y direction is lower than that on the middle part. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a film forming method and a film forming apparatus.

  A multilayer substrate made of low temperature co-fired ceramics (LTCC) has excellent high frequency characteristics and high heat resistance, and thus is widely used for a high frequency module substrate, an IC package substrate, and the like. As a method for manufacturing a film pattern such as a wiring used for an LTCC multilayer substrate, an inkjet method has attracted attention in order to improve productivity and reduce costs. The inkjet method uses a droplet discharge head that discharges a liquid containing a wiring material as droplets, and causes the droplet discharge head to discharge droplets while relatively moving the droplet discharge head and the substrate in the main scanning direction. . The plurality of droplets including the wiring material are sequentially united along the main scanning direction of the substrate to form a line-shaped liquid film continuous in the main scanning direction. In the ink jet method, a pattern is formed by drying the line-shaped liquid film.

  In Patent Document 1, a temperature gradient is applied to the surface of the line-shaped liquid film, and a high temperature surface and a low temperature surface are provided on both sides of the main scanning direction, respectively. A liquid film having a temperature gradient forms a distribution of surface tension on its surface and generates Marangoni convection inside. The thermocapillary flow flowing out from the end portion on the high temperature side of the liquid film descends toward the substrate before reaching the end portion on the low temperature side due to the temperature gradient applied to the liquid film. As a result, the wiring material not included in the Marangoni convection channel is deposited at the low temperature side end, and the wet spreading of the liquid film is pinned by the deposited wiring material. On the other hand, since the wiring material continues to be conveyed by convection at the end portion on the high temperature side, the wiring material is difficult to deposit. Therefore, as the drying of the liquid film proceeds, the high temperature side of the liquid film contracts toward the end portion on the low temperature side, and the wiring material is deposited only on the end portion on the low temperature side of the liquid film. As a result, the liquid film forms a wiring pattern having a line width narrower than its own width.

  The inkjet method is also attracting attention as a method for forming an alignment film used in a liquid crystal display device (for example, Patent Document 2). FIGS. 10A and 10B and FIGS. 11A and 11B are a plan view and a side view, respectively, schematically showing the alignment film forming process. In the alignment film forming step, the droplet D is discharged onto the substrate S to form the liquid film F, and the solvent contained in the liquid film F is evaporated to dry the liquid film F. The drying process is performed.

As shown in FIG. 10, in the droplet discharge process, a plurality of discharge regions R extending in the vertical direction are virtually divided in the horizontal direction on the surface of the substrate S (hereinafter simply referred to as the discharge surface Sa). . The droplet discharge head 20 moves in the direction of the arrow in order from the top of the leftmost discharge region R, and discharges a plurality of droplets D including the alignment film material over the entire discharge region R, thereby A strip-shaped liquid film F is formed in each of the discharge regions R. That is, the droplet discharge head 20 forms each liquid film F by multi-scan. Alternatively, as shown in FIG. 11, a plurality of droplet discharge heads 20 arranged in the left-right direction discharge droplets D over the entire discharge regions R, whereby a liquid film is formed in each of the plurality of discharge regions R. F is formed. That is, the plurality of droplet discharge heads 20 form each liquid film F by a single scan. Each of the plurality of liquid films F forms a film over the entire substrate S together with the other adjacent liquid films F as the processing time of the droplet discharge process elapses.
JP 2005-152758 A JP 2006-15271 A

  When a film is formed using the multi-scan method, the timing at which the droplet D lands differs at the boundary between the adjacent liquid films F by one scanning time of the droplet discharge head. Even in the case of using the single scan method, the landing timing of the droplet D differs by the scanning time corresponding to the distance between the droplet discharge heads 20 at the boundary between the adjacent liquid films F.

  At the edge of each liquid film F (for example, both end portions Fe in the left-right direction), the surface area per unit volume increases, so the evaporation probability of the evaporation component increases, and the drying speed of the liquid film F is set to the central portion Fc. Faster than the drying speed. As a result, at both end portions Fe of the liquid film F, the fluid of the alignment material causes a flow of the alignment film material due to the thickening of the liquid, and the concentration of the alignment film material is locally increased. As a result, when the united liquid film F is dried, a film thickness step (shading shown in FIGS. 10 and 11) is formed at both end portions Fe of each liquid film F in the dried film.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a film forming method and a film forming apparatus for improving the film thickness uniformity of a film formed by drying a liquid film. is there.

  In the film forming method of the present invention, a liquid material containing a film material is formed into a plurality of droplets, discharged onto an object, and the liquid material on the object is dried to form a film on the object. A method of forming a liquid film on the point sequence by landing the liquid droplets on each point of the point sequence on the object; and both end portions of a predetermined width in the sequence of the point sequence. Forming a temperature distribution in the liquid film that is lower in temperature than the intermediate portion in the row direction, and drying the liquid film.

  According to the film forming method of the present invention, in the coordinate system along the column direction, the evaporation probability of the liquid material is lowered by the amount at which both end portions of the liquid film are lower in temperature than the central portion. Therefore, it is possible to avoid the unevenness of the film material at both ends of the liquid film. As a result, the film forming method of the present invention can improve the film thickness uniformity of the film formed by drying the liquid film.

  In this film forming method, the step of forming the liquid film includes forming the liquid film by landing the droplets at the same timing from each of the plurality of nozzles arranged in the row direction to each point of the point row. To do.

  According to this film forming method, droplets from a plurality of arranged nozzles land at substantially the same timing to form a liquid film continuous in the column direction. Then, the liquid film continuous in the column direction improves the film thickness uniformity by the amount at which both end portions become low temperature. Therefore, the plurality of arranged nozzles can improve the film thickness uniformity without changing the droplet discharge timing. Therefore, this film forming method can improve the film thickness uniformity under a simpler configuration.

  In this film forming method, the step of forming the liquid film causes the droplets to land at the same timing from each of the plurality of nozzles arranged in the column direction at the same timing, and The step of forming a liquid film continuous in the intersecting direction by relatively moving the object in a direction intersecting the row direction, and drying the liquid film includes both end portions having a predetermined width in the row direction. Preferably, the liquid film is dried by forming a temperature distribution in the liquid film such that both ends of the predetermined width in the intersecting direction are lower than the intermediate part.

  According to this film forming method, the entire periphery of the liquid film becomes lower in temperature than the central portion. Therefore, the liquid film can avoid the bias of the film material over the entire periphery. As a result, this film forming method can further improve the film thickness uniformity of the film formed by drying the liquid film.

In this film forming method, in the step of drying the liquid film, the temperature distribution between the both end portions and the intermediate portion is higher than that of the intermediate portion. The structure which dries is preferable.

  According to this film forming method, the evaporation probability is increased by the amount that is higher in the vicinity of both end portions of the liquid film than in the central portion. Therefore, the film material in the vicinity of both end portions is difficult to flow to both end portions. Therefore, this film forming method can further improve the film thickness uniformity of the film formed by drying the liquid film.

  In the film forming method of the present invention, a liquid material containing a film material is formed into a plurality of droplets, discharged onto an object, and the liquid material on the object is dried to form a film on the object. In this method, a first liquid film is formed on the first point sequence by landing the droplet on each point of the first point sequence on the object, and the first liquid film is dried at a predetermined temperature. Forming the first film, measuring the thickness distribution of the first film in the coordinate system of the first point sequence, and applying the droplets to each point of the second point sequence on the object The step of forming a second liquid film on the second point sequence by landing and the film thickness of the first film by converting the coordinate system of the first point sequence to the coordinate system of the second point sequence The distribution is converted into a film thickness distribution in the coordinate system of the second point sequence, and the film thickness value of the relatively thick film value in the coordinate system of the second point sequence is changed. Mark a, and a step of drying said than a predetermined temperature to form a temperature distribution in the cold to the second liquid film the second liquid film.

  According to the film forming method of the present invention, the second liquid film corrects the temperature of coordinates that can be a relatively thick film by drying at a predetermined temperature to a relatively low temperature. Therefore, the second liquid film can reduce the evaporation probability of the portion that can be relatively thick, and can avoid the unevenness of the film material. Therefore, the film forming method of the present invention can improve the film thickness uniformity of the film formed by drying the liquid film.

  In the film forming method of the present invention, a liquid material containing a film material is formed into a plurality of droplets, discharged onto an object, and the liquid material on the object is dried to form a film on the object. In this method, a first liquid film is formed on the first point sequence by landing the droplet on each point of the first point sequence on the object, and the first liquid film is dried at a predetermined temperature. Forming the first film, measuring the thickness distribution of the first film in the coordinate system of the first point sequence, and applying the droplets to each point of the second point sequence on the object The step of forming a second liquid film on the second point sequence by landing and the film thickness of the first film by converting the coordinate system of the first point sequence to the coordinate system of the second point sequence The distribution is converted into a film thickness distribution in the coordinate system of the second point sequence, and the film thickness value in the coordinate system of the second point sequence is relatively thin. Mark a, and a step of drying said than the predetermined temperature the temperature distribution in the high temperature to form the second liquid film second liquid film.

  According to the film forming method of the present invention, the temperature of coordinates at which the second liquid film can become a relatively thin film by drying at a predetermined temperature is corrected to a relatively high temperature. Therefore, the second liquid film can lower the evaporation probability of a portion that can be a film relatively, and can avoid unevenness of the film material. Therefore, the film forming method of the present invention can improve the film thickness uniformity of the film formed by drying the liquid film.

  The film forming apparatus of the present invention includes a droplet discharge head that discharges a liquid material containing a film material into a plurality of liquid droplets and discharges the liquid material on the target, and a film on the target by drying the liquid on the target. The liquid droplet ejection head forms a liquid film on the point sequence by landing the liquid droplets on each point of the point sequence on the object. The drying unit forms the film on the object by forming a temperature distribution in the liquid film in which both end portions of the predetermined width in the column direction are lower in temperature than the intermediate portion in the column direction.

According to the film forming apparatus of the present invention, the drying unit lowers the evaporation probability at both end portions by lowering the temperature at both end portions of the liquid film as compared with the central portion. Therefore, it is possible to avoid the unevenness of the film material at both ends of the liquid film. As a result, the film forming apparatus of the present invention can improve the film thickness uniformity of the film formed by drying the liquid film.

  In this film forming apparatus, the drying unit is disposed in a heater having a heating surface facing the object and a region on the heating surface facing the intermediate portion, and comes into contact with the object. A configuration having a heat conducting member that conducts heat received from the heating surface to the intermediate portion may be employed.

  According to this film forming apparatus, the drying unit lowers the temperature of both end portions by heating the central portion via the heat conducting member. Therefore, this film forming apparatus can avoid the unevenness of the film material only by inserting the heat conducting member between the heating surface and the object. Therefore, this film forming apparatus can improve the film thickness uniformity of the film formed by drying the liquid film under a simpler configuration.

In this film forming apparatus, the drying unit includes a plurality of heaters arranged in the row direction and in thermal contact with the object.
According to this film forming apparatus, each of the plurality of heaters arranged in the column direction forms a temperature difference between the both end portions and the intermediate portion. Therefore, since the film forming apparatus forms the temperature difference between the both end portions and the intermediate portion with different heaters, the temperature distribution given to the liquid film can be formed with higher accuracy.

  The film forming apparatus of the present invention includes a droplet discharge head that discharges a liquid material containing a film material into a plurality of liquid droplets and discharges the liquid material on the target, and a film on the target by drying the liquid on the target. And a controller for controlling the droplet discharge head and the drying unit, wherein the controller drives the droplet discharge head to form an object on an object. Forming a first liquid film on the first point array by landing the droplets on each point of the first point array, and driving the drying unit to dry the first liquid film at a predetermined temperature. The first film is formed by the above-described method, and the second liquid film is formed on the second point row by driving the droplet discharge head to land the droplet on each point of the second point row on the object. Then, by converting the coordinate system of the first point sequence to the coordinate system of the second point sequence, the film thickness distribution of the first film is changed to the second point sequence. Convert the film thickness distribution in the coordinate system of the row, drive the drying unit, the coordinates of the film thickness value relatively thick in the film thickness values in the coordinate system of the second point row, than the predetermined temperature A temperature distribution for reducing the temperature is formed in the second liquid film, and the second liquid film is dried.

  According to the film forming apparatus of the present invention, the second liquid film corrects the temperature of coordinates that can be a relatively thick film by drying at a predetermined temperature to a relatively low temperature. Therefore, the second liquid film can reduce the evaporation probability of the portion that can be relatively thick, and can avoid the unevenness of the film material. Therefore, the film forming method of the present invention can improve the film thickness uniformity of the film formed by drying the liquid film.

  The film forming apparatus of the present invention includes a droplet discharge head that discharges a liquid material containing a film material into a plurality of liquid droplets and discharges the liquid material on the target, and a film on the target by drying the liquid on the target. And a controller for controlling the droplet discharge head and the drying unit, wherein the control unit drives the droplet discharge head on an object. Forming a first liquid film on the first point array by landing the droplets on each point of the first point array, and driving the drying unit to dry the first liquid film at a predetermined temperature. The first film is formed by the above-described method, and the second liquid film is formed on the second point row by driving the droplet discharge head to land the droplet on each point of the second point row on the object. Then, by converting the coordinate system of the first point sequence to the coordinate system of the second point sequence, the film thickness distribution of the first film is changed to the second point sequence. The film thickness distribution in the coordinate system of the column is converted, and the drying unit is driven to change the coordinates of the relatively thin film thickness value among the film thickness values in the coordinate system of the second point sequence from the predetermined temperature. A temperature distribution for increasing the temperature is formed in the second liquid film, and the second liquid film is dried.

  According to the film forming apparatus of the present invention, the second liquid film corrects the temperature of coordinates that can be a relatively thin film by drying at a predetermined temperature to a relatively low temperature. Therefore, the second liquid film can reduce the evaporation probability of the portion that can be relatively thick, and can avoid the unevenness of the film material. Therefore, the film forming method of the present invention can improve the film thickness uniformity of the film formed by drying the liquid film.

(First embodiment)
Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a droplet discharge apparatus 10 as a film forming apparatus.

  In FIG. 1, the droplet discharge device 10 includes a base 11 extending in one direction, and a substrate stage 12 mounted on the base 11 and placing a substrate S thereon. The substrate stage 12 positions and fixes the substrate S with one surface of the substrate S facing upward, and transports the substrate S along the longitudinal direction of the base 11. As the substrate S, a substrate such as a green sheet, a glass substrate, a silicon substrate, a ceramic substrate, or a resin film is used.

  In the present embodiment, the upper surface of the substrate S is referred to as a discharge surface Sa. The ejection surface Sa is a surface for forming a desired film, and has a position for landing a droplet as a target point. The direction in which the substrate S is transported and directed in the upper left direction in FIG. 1 is referred to as a + Y direction. Further, a direction orthogonal to the + Y direction and directed in the upper right direction in FIG. 1 is referred to as a + X direction, and a normal direction of the substrate S is referred to as a Z direction.

The droplet discharge device 10 includes a gate-shaped guide member 13 straddling the base 11 and an ink tank 14 disposed on the upper side of the guide member 13. The ink tank 14 stores the ink Ik as a liquid material and derives the stored ink Ik at a predetermined pressure. As the ink Ik, an alignment film ink in which an alignment film material as a film material is dispersed, ITO (Indium Tin Oxide)
) An ink such as ITO ink in which fine particles are dispersed is used.

  The guide member 13 supports the carriage 15 so as to be movable along the + X direction and the direction opposite to the + X direction (−X direction). The carriage 15 carries the droplet discharge head 20 and moves along the + X direction and the −X direction. The carriage 15 moves in the + X direction or the −X direction when the substrate S is transported in the + Y direction, and places the droplet discharge head 20 on the transport path of the target point. The operation of transporting the substrate S in the + Y direction and the −Y direction is called main scanning. An operation in which the droplet discharge head 20 is transported in the + X direction and the −X direction and is disposed on the transport path of the target point is referred to as sub-scanning.

  Next, the droplet discharge head 20 will be described below. FIG. 2 is a perspective view of the droplet discharge head 20 as viewed from the substrate stage 12. FIG. 3 is a diagram schematically showing the inside of the droplet discharge head 20. FIG. 4 is a plan view showing the ejection position of the droplet D ejected using the droplet ejection head 20.

  In FIG. 2, the droplet discharge head 20 includes a head substrate 21 extending in the + X direction and a head body 22 mounted on the head substrate 21. The head substrate 21 is positioned and fixed on the carriage 15 and moves along the + X direction and the −X direction with respect to the substrate S. The head substrate 21 has an input terminal 21 a at one end thereof, and outputs various drive signals input to the input terminal 21 a to the head body 22.

The head main body 22 has i (i is an integer of 1 or more) nozzles N over substantially the entire width in the + X direction of the side surface facing the substrate S. Each nozzle N is a circular hole extending in the Z direction, and is formed at a predetermined pitch along the + X direction. The head main body 22 has 180 nozzles N arranged at a pitch of 141 μm along the + X direction, for example. In this embodiment, the formation pitch of the nozzles N is the nozzle pitch Dx, and the width of the nozzle row composed of each nozzle N is called the nozzle row width Rw. In FIG. 2, the number of nozzles N is shown in a simplified manner in order to explain the arrangement of the nozzles N.

  In FIG. 3, the head body 22 has one cavity 24 for each nozzle N and one pressure generating element 25 that applies pressure to the inside of the cavity 24. That is, the head body 22 has i cavities 24 that are the same as the number of nozzles N and i pressure generating elements 25. The cavities 24 and the pressure generating elements 25 are associated with the nozzles N by being disposed immediately above the nozzles N, respectively. Each cavity 24 is connected to a common ink tank 14 to store the ink Ik from the ink tank 14, and supplies the ink Ik to the communicating nozzle N. Each nozzle N receives the ink Ik from the communicating cavity 24 and forms a gas-liquid interface (hereinafter simply referred to as a meniscus) M in its own opening.

  Each pressure generating element 25 applies a predetermined pressure to the inside of the cavity 24 connected thereto, and increases and decreases the pressure inside the cavity 24, thereby vibrating the meniscus M of the nozzle N communicating with the cavity 24. Let As the pressure generating element 25, for example, a piezoelectric element that mechanically expands and contracts the volume of the cavity 24, or a resistance heating element that locally increases and decreases the temperature of the cavity 24 can be used.

  When the target point T on the ejection surface Sa is located immediately below the selected nozzle N (hereinafter simply referred to as the selected nozzle), the cavity 24 communicating with the selected nozzle receives the driving force of the corresponding pressure generating element 25. As a result, the meniscus M of the selected nozzle is vibrated, and a part of the ink Ik is changed to a droplet D having a predetermined weight and ejected from the selected nozzle. The droplet D ejected from the nozzle N flies along the normal line of the ejection surface Sa and lands on the target point T.

  In FIG. 4, the discharge surface Sa of the substrate S has a plurality of discharge regions R extending in the + Y direction, as indicated by a dashed line. Each ejection region R is a region having a width of the nozzle row width Rw in the + X direction, and is virtually divided by the dot pattern grid SL. In each dot pattern lattice SL, the lattice interval in the + Y direction and the lattice interval in the + X direction are respectively defined by the ejection interval of the droplets D. For example, the grid interval in the + Y direction of each dot pattern grid SL is defined by the product of the ejection cycle of the droplet ejection head 20 and the main scanning speed of the substrate S, respectively. The grid spacing in the + X direction of each dot pattern grid SL is defined by the nozzle pitch Dx.

  The selection of whether or not to discharge the droplet D is defined for each grid point of each dot pattern grid SL. In the present embodiment, all grid points in each ejection region R are selected as target points T. In FIG. 4, in order to explain the position of the dot pattern lattice SL, the lattice interval of the dot pattern lattice SL is enlarged.

When executing the discharge process of the droplet D, each nozzle N of the droplet discharge head 20 is arranged on an extension line of a group of target points T that are continuous in the + Y direction. When the substrate S is main-scanned, each nozzle N of the droplet discharge head 20 faces the i target points T arranged in the + X direction at the same timing. That is, the droplets D land on the i target points T arranged in the + X direction at substantially the same timing. The i droplets D that land are united along the + X direction as the column direction to form a liquid film F continuous in the + X direction. Note that substantially the same timing is a timing at which i droplets D that land on the i target points T arranged in the + X direction form a liquid film that continues in the + X direction, and are adjacent liquids. This is the timing when there is no film thickness difference between the droplets D due to the difference in landing timing between the droplets D.

  A group of liquid droplets D (i liquid droplets D) that land at substantially the same timing is a band-shaped liquid that extends along the + Y direction by the subsequent group of liquid droplets D landing in the −Y direction in order. A film F is formed.

Next, the substrate stage 12 will be described below. FIGS. 5A and 5B are a plan view and a side cross section showing the substrate stage 12 on which the substrate S is placed, respectively.
In FIG. 5, the substrate stage 12 has a heater H that heats the entire substrate stage 12. When the discharge process of the droplet D is executed, the heater H receives a predetermined drive signal and raises the temperature of the entire upper surface of the substrate stage 12 (hereinafter simply referred to as a heating surface 12a) to maintain the predetermined temperature. The substrate stage 12 has a plurality of heat conducting members 26 on the heating surface 12a. In the present embodiment, a drying unit is configured by the substrate stage 12, the heater H, and the heat conducting member 26.

  Each heat conducting member 26 is a plate member made of a metal material having high heat conductivity, and has a strip shape extending in the + Y direction. Each heat conducting member 26 is positioned so as to be capable of changing the arrangement with respect to the heating surface 12a. The upper surface of each heat conductive member 26 (hereinafter simply referred to as the conductive surface 26a) is a smooth surface having a high thermal bond with the back surface of the substrate S. Each heat conducting member 26 transmits the thermal energy received from the heating surface 12a to the region of the substrate S in contact with its own conducting surface 26a. The width in the + X direction of the heat conductive member 26 has a width slightly smaller than the nozzle row width Rw (hereinafter simply referred to as a conductive width Cw). Each of the heat conducting members 26 is disposed inside each discharge region R when viewed from the Z direction when the substrate S is placed, whereby both end portions of each discharge region R in the + X direction and the −X direction are arranged. Regions separated from the conductive surface 26a are formed at both end portions in the + Y direction and the −Y direction, respectively.

  In the present embodiment, the region that is the discharge region R and overlaps the conductive surface 26a when viewed from the Z direction is referred to as a high conductive region Rc as an intermediate portion. A region that is the discharge region R excluding the high conductivity region Rc, that is, a region that surrounds the entire outer periphery of the high conductivity region Rc is referred to as a low conductivity region Re. Among i target points T continuous in the + X direction, j target points T (j is an integer of 1 or more) are respectively arranged in the high-conductivity region Rc. Of the i target points T that are continuous in the + X direction, i−j target points T are arranged in the low-conductivity region Re.

  When executing the discharge process of the droplet D, the heating surface 12 a supplies the heat energy from the heater H to each heat conducting member 26. Each heat conducting member 26 supplies the heat energy from the heating surface 12a to the substrate S in contact with the conducting surface 26a. The substrate S is heated by absorbing heat energy from the conductive surface 26a. In FIG. 5B, the high temperature region is shown with a thin gradation, and the low temperature region is shown with a dark gradation.

  At this time, the temperature of the substrate S increases as the distance from the conductive surface 26a increases, and conversely decreases as the distance from the conductive surface 26a increases. In each discharge region R, the high conductivity region Rc close to the conduction surface 26a is relatively high in temperature, and the low conductivity region Re far from the conduction surface 26a is relatively low in temperature. Each highly conductive region Rc receives thermal energy from the conductive surface 26a, and supplies relatively high thermal energy to the ink Ik on itself. On the contrary, each low conduction region Re supplies relatively low thermal energy to the ink Ik on its own.

When the substrate S is main-scanned, the droplet discharge head 20 is at i target points T continuous in the + X direction, that is, j target points T in the high conductivity region Rc, and in the low conductivity region Re. The droplets D are landed on the ij target points T at the same timing. The i droplets D that land at the same timing are united along the + X direction to form a liquid film F continuous in the + X direction. At this time, in the liquid film F formed by the ij droplets D, both end portions in the + X direction have a smaller surface area per unit volume than the central portion. On the other hand, both ends of the liquid film F are lowered in temperature in order to reduce the thermal energy received from the substrate S compared to the central part of the liquid film F.

  As a result, the evaporation probability of the evaporation component is substantially the same at both end portions and the central portion of the liquid film F, and the flow of the film material is suppressed at both end portions of the liquid film F. Therefore, the liquid film F can make the density | concentration of the film | membrane material uniform, and the liquid film F after drying exhibits a uniform film thickness by the part which suppresses the flow of the film | membrane material in both ends.

  In the present invention, the sizes of the high conductivity region Rc and the low conductivity region Re are appropriately selected according to the material of the ink Ik, the surface state of the ejection surface Sa, the output of the heater H, and the like. That is, the sizes of the high conduction region Rc and the low conduction region Re are appropriately selected so that the evaporation probabilities are substantially the same at both end portions and the central portion of the liquid film F along the + X direction.

Next, the electrical configuration of the droplet discharge device 10 configured as described above will be described with reference to FIG. FIG. 5 is an electric block circuit diagram showing an electrical configuration of the droplet discharge device 10.
In FIG. 5, the control unit 30 includes a CPU, a ROM, a RAM, and the like. The control unit 30 performs main scanning of the substrate S using the substrate stage 12, sub-scanning of the droplet discharge head 20 using the carriage 15, and the droplet discharge head 20 according to various control programs and various data stored in the ROM and RAM. A droplet discharge process to be used and a drying process of the liquid film F using the heater H are executed.

  The control unit 30 is connected to an input / output device 31 having various operation switches and a display, and receives various signals input from the input / output device 31. For example, the control unit 30 receives process data Ip in a predetermined format for executing the droplet discharge process and the drying process from the input / output device 31.

  When receiving the process data Ip from the input / output device 31, the control unit 30 performs a predetermined development process on the process data Ip to generate dot pattern data DPD. The dot pattern data DPD is data having the same bit length as the number of grid points of the dot pattern grid SL, and is data defining whether or not the droplet D is ejected for each grid point of the dot pattern grid SL. That is, the dot pattern data DPD is data that defines whether the pressure generating element 25 is turned on or off in accordance with the value of each bit (“0” or “1”).

  Further, when the process data Ip from the input / output device 31 is received, the control unit 30 performs a predetermined development process on the process data Ip, and data relating to the target temperature of the heating surface 12a (hereinafter simply referred to as target temperature data HCD). ).

  The control unit 30 is connected to the substrate detection device 32. The substrate detection device 32 has an imaging function for detecting an edge of the substrate S. In response to the detection signal from the substrate detection device 32, the control unit 30 calculates the relative position of the substrate S with respect to the droplet discharge head 20, that is, the relative position of each target point T with respect to the droplet discharge head 20.

The control unit 30 is connected to the substrate stage drive circuit 33 and inputs a control signal corresponding to the substrate stage drive circuit 33 to the substrate stage drive circuit 33. In response to the control signal from the control unit 30, the substrate stage drive circuit 33 rotates the stage motor MS for moving the substrate stage 12 in the forward or reverse direction. The substrate stage drive circuit 33 receives the detection signal from the stage motor encoder ES and calculates the rotation direction and the rotation speed of the stage motor MS. The control unit 30 calculates the moving direction and moving amount of the substrate stage 12 using the calculation result from the substrate stage drive circuit 33, and determines whether or not the target point T on the ejection surface Sa is located directly below the nozzle N. To do. The control unit 30 generates a timing signal LT every time each target point T is located immediately below the nozzle N, and outputs the timing signal LT to the ejection head drive circuit 35.

  The control unit 30 is connected to the carriage drive circuit 34 and inputs a control signal corresponding to the carriage drive circuit 34 to the carriage drive circuit 34. In response to a control signal from the control unit 30, the carriage drive circuit 34 rotates the carriage motor MC for moving the carriage 15 in the forward or reverse direction. The carriage drive circuit 34 receives the detection signal from the carriage motor encoder EC and calculates the rotation direction and the rotation speed of the carriage motor MC. The control unit 30 calculates the movement direction and movement amount of the carriage 15 using the calculation result from the carriage drive circuit 34 and arranges each nozzle N on the main scanning path of each target point T.

  The control unit 30 is connected to the ejection head drive circuit 35 and inputs a timing signal LT and a drive waveform signal COM for driving the pressure generating element 25 to the ejection head drive circuit 35. The control unit 30 also generates serial pattern data SI for serial transfer of the dot pattern data DPD, and serially transfers the serial pattern data SI to the ejection head drive circuit 35. The ejection head drive circuit 35 receives the serial pattern data SI from the control unit 30 and performs serial / parallel conversion, and the dot pattern data DPD of each of the i nozzles N, i.e., the i pressure generating elements 25, is converted. Parallel pattern data corresponding to each bit value is generated. When the ejection head drive circuit 35 receives the timing signal LT from the control unit 30, the ejection head drive circuit 35 supplies the drive waveform signal COM to the pressure generating element 25 selected for the ejection operation based on the parallel pattern data. In the present embodiment, the ejection head drive circuit 35 supplies the drive waveform signal COM to all the pressure generating elements 25 when receiving the timing signal LT. As a result, the control unit 30 causes the droplet D to land on each target point T continuous along the + X direction at substantially the same timing.

  The control unit 30 is connected to the heater drive circuit 36. The controller 30 refers to the target temperature data HCD, generates a heater drive signal SH for setting the temperature of the heating surface 12a to the target temperature, and outputs the heater drive signal SH to the heater drive circuit 36. The heater drive circuit 36 energizes and drives the heater H in response to the heater drive signal SH from the control unit 30, thereby heating the heating surface 12a and maintaining it at a predetermined temperature.

Next, a method for forming a film using the droplet discharge device 10 will be described.
First, as shown in FIG. 1, the substrate S with the discharge surface Sa on the upper side is placed on the substrate stage 12. At this time, the end of the substrate S in the + Y direction is arranged in the −Y direction (the direction opposite to the + Y direction) of the guide member 13. When receiving the process data Ip from the input / output device 31, the control unit 30 generates and stores the dot pattern data DPD and the target temperature data HCD using the process data Ip. Then, the control unit 30 refers to the target temperature data HCD, generates a heater drive signal SH, drives the heater H via the heater drive circuit 36, that is, maintains the temperature of the heating surface 12a at the target temperature. As a result, in the ejection region R, the high conductivity region Rc close to the conduction surface 26a has a relatively high temperature, and the low conductivity region Re far from the conduction surface 26a has a relatively low temperature.

  When the temperature of the heating surface 12a reaches the target temperature, the control unit 30 drives the carriage motor MC via the carriage drive circuit 34 and arranges each nozzle N on the main scanning path of each target point T. Then, the control unit 30 drives the stage motor MS via the substrate stage drive circuit 33 to start main scanning of the substrate S.

  The control unit 30 receives the detection signal from the substrate detection device 32, calculates the relative position of each target point T with respect to the droplet discharge head 20, and uses the calculation result from the substrate stage drive circuit to calculate the subsequent relative position. Calculate. Based on the relative position of each target point T with respect to the droplet discharge head 20, the control unit 30 determines whether each target point T is directly below the nozzle N, and each target point T is directly below the nozzle N. A timing signal LT is generated every time it is positioned, and the timing signal LT is output to the ejection head drive circuit 35. That is, each time i target points T consecutive in the + X direction are located immediately below i nozzles N, the control unit 30 performs substantially the same timing with respect to the i target points T. To land the droplet D. The i droplets D that land at the same timing are united along the + X direction to form a liquid film F continuous in the + X direction.

  At this time, both end portions and the central portion along the + X direction of the liquid film F receive thermal energy from the low conduction region Re and the high conduction region Rc, respectively, that is, relatively low temperature and high temperature regions. As a result, in the liquid film F, since the evaporation probability along the + X direction becomes uniform, the concentration of the film material along the + X direction becomes uniform, and as a result, the film thickness value after drying becomes uniform.

  Thereafter, similarly, the control unit 30 repeats the main scanning of the substrate S, and each time i target points T consecutive in the + X direction are located immediately below the i nozzles N, the i target points T The droplets D are landed simultaneously. As a result, the control unit 30 can make the film material uniform in each liquid film F, and as a result, can improve the film thickness uniformity of the film made of the united liquid film F.

Next, the effect of 1st embodiment comprised as mentioned above is described below.
(1) In the first embodiment, a liquid film F continuous to + X is formed by landing droplets D on each of a plurality of target points T arranged along the + X direction on the substrate S. Then, a temperature distribution in which both end portions of the predetermined width in the + X direction are lower in temperature than the intermediate portion in the + X direction is formed in the liquid film F, and the liquid film F is dried.

  Therefore, in the coordinate system along the + X direction, the evaporation probability of the ink Ik is lowered by the amount at which both end portions of the liquid film F are lower in temperature than the central portion. As a result, both ends of the liquid film F can avoid the unevenness of the film material. Therefore, the film forming method of the above embodiment can improve the film thickness uniformity of the film formed by drying the liquid film F.

  (2) In the first embodiment, the droplet D is landed at substantially the same timing on each of the plurality of target points T facing each other from each of the plurality of nozzles N arranged in the + X direction. Accordingly, the droplets D from the plurality of nozzles N land on each target point T at substantially the same timing, and form a liquid film F continuous in the + X direction. The liquid film F continuous in the + X direction can improve the film thickness uniformity by the amount that both end portions thereof receive the thermal energy from the low conduction region Re and become low temperature. As a result, the plurality of nozzles N can improve the film thickness uniformity without changing the discharge timing of the droplets D. Therefore, the film forming method of the above embodiment can improve the film thickness uniformity under a simpler configuration.

  (3) In the first embodiment, the liquid film F continuous in the + Y direction is formed by relatively moving the plurality of nozzles N and the substrate S along the + Y direction. When the liquid film F is dried, both end portions of the liquid film F along the + X direction and both end portions of the liquid film F along the + Y direction become lower in temperature than the intermediate portions. Accordingly, since the entire periphery of the liquid film F is at a lower temperature than the central portion, the liquid film F can avoid the bias of the film material over the entire periphery. Therefore, the film forming method of the above embodiment can further improve the film thickness uniformity of the film formed by drying the liquid film F.

(4) In the first embodiment, each heat conducting member 26 is disposed at a position on the heating surface 12a facing the high conduction region Rc, and the amount of heat from the heating surface 12a is changed to the back surface of the substrate S that abuts. To supply. Therefore, the droplet discharge device 10 can avoid the bias of the film material only by inserting the heat conducting member 26 between the heating surface 12a and the substrate S. Therefore, the droplet discharge device 10 can improve the film thickness uniformity of the film formed by drying the liquid film F under a simpler configuration. In addition, since the droplet discharge device 10 detachably disposes each heat conducting member 26, the position of the high conducting region Rc and the low conducting region Re can be changed only by changing the position of each heat conducting member 26. be able to. Therefore, the droplet discharge device 10 can flexibly cope with the design change of the discharge region R.

(Second embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, a test film forming process is executed before the main film forming process, and the temperature distribution given to the substrate S is changed based on the processing result of the test film forming process. Since the temperature distribution given to S is changed, this change will be described in detail below. FIG. 7A is a side sectional view showing the substrate stage 12.

  In FIG. 7A, the heating surface 12a of the substrate stage 12 has a plurality of heater blocks HB. Each of the plurality of heater blocks HB is disposed closest to the entire heating surface 12a in the + X direction and the + Y direction (direction orthogonal to the paper surface). Each heater block HB is a heat source that is independently driven in response to a predetermined drive signal, and supplies heat energy according to the drive signal. The upper surface of each heater block HB is a smooth surface having a high thermal bond with the back surface of the substrate S.

  When executing the discharge process of the droplet D, each heater block HB receives a predetermined drive signal and supplies thermal energy corresponding to the drive signal to the region of the substrate S that is in contact with its upper surface. The substrate S absorbs heat energy from each heater block HB, thereby forming a temperature distribution on the discharge surface Sa according to the amount of heat generated by each heater block HB. That is, each heater block HB forms a desired temperature distribution along the surface direction of the discharge surface Sa. The temperature distribution in this embodiment is set based on the test film formation process.

  Next, the temperature distribution formed on the ejection surface Sa will be described below. FIG. 7B shows the temperature distribution of the test film forming process and the main film forming process. FIG. 7C shows the film thickness distribution obtained by the test film forming process and the main film forming process.

  In the test film formation process, the droplet discharge device 10 first places the test film formation substrate S on the heating surface 12a. Next, the droplet discharge device 10 drives each heater block HB to form a predetermined test temperature distribution TB on the discharge surface Sa. The test temperature distribution TB is a temperature distribution associated with the drive signal of each heater block HB, and is formed at a uniform temperature over substantially the entire discharge surface Sa, for example, as shown by a broken line in FIG. Temperature distribution.

  When the test temperature distribution TB is formed on the ejection surface Sa, the droplet ejection device 10 ejects the droplet D to each target point T on the ejection surface Sa and the liquid film F in each ejection region R, as in the first embodiment. And dry each liquid film F under the test temperature distribution TB. In the present embodiment, each target point T in the test film formation process is referred to as a test point.

The coordinates of each test point are the coordinates associated with each target point T used for the main film formation process, and the coordinate system of the test film formation point sequence can be converted into the main film formation point sequence coordinate system. Is. That is, each of the test points has a film thickness distribution having the same tendency as the film thickness distribution realized by the film forming process when the droplet D landing on the test point is dried under the temperature distribution in the film forming process. It is a point to realize. In addition, the test point in this embodiment is the same coordinate as the target point T in this film-forming process.

  The droplet discharge device 10 transports the dried liquid film F to a predetermined film thickness measuring device, and measures the film thickness distribution after drying obtained by the test temperature distribution TB, thereby completing the test film forming process. . In the present embodiment, the film thickness distribution obtained by the test film formation process is referred to as a test film thickness distribution KB. The test film thickness distribution KB is a distribution of film thickness values measured in the coordinate system of the test points. For example, as shown by a broken line in FIG. 7B, the test film thickness distribution KB is continuously along the + X direction of the ejection surface Sa. This is a distribution of measured film thickness values.

  In the film formation process, the droplet discharge device 10 first places the film formation substrate S on the heating surface 12a. Next, the droplet discharge device 10 changes the test temperature distribution TB on the discharge surface Sa to the correction temperature distribution TC by driving each heater block HB based on the test film thickness distribution KB.

  That is, the droplet discharge device 10 converts the test film thickness distribution KB into the film thickness distribution in the main film forming coordinate system by converting the test point coordinate system into the main film forming coordinate system. In the present embodiment, since the coordinates of each test point and the coordinates of each target point T are the same, hereinafter, the test film thickness distribution KB is treated as the film thickness distribution in the coordinate system for the main film formation. .

  The droplet discharge device 10 selects a coordinate having a relatively thick film as a thick film point based on the converted test film thickness distribution KB, that is, the film thickness distribution in the coordinate system of the main film formation. The droplet discharge device 10 forms a temperature distribution for making the thick film point relatively cool in the discharge region R. Further, the droplet discharge device 10 selects a coordinate having a relatively thin film in the coordinate system of the target point T as a thin film point based on the test film thickness distribution KB. The droplet discharge device 10 forms a temperature distribution for making the thin film points relatively high in the discharge region R.

  For example, as shown by a broken line in FIG. 7C, the droplet discharge device 10 selects coordinates Xe1 and Xe2 having relatively thick films as thick film points based on the test film thickness distribution KB. Further, the droplet discharge device 10 selects coordinates Xm1, Xm2, and Xm3 having relatively thin films as thin film points based on the test film thickness distribution KB. As shown by the solid line in FIG. 7B, the droplet discharge device 10 forms a temperature distribution for making the thick film points (Xe1, Xe2) relatively low temperature, and the thin film points (Xm1, Xm2). , Xm3) is formed on the discharge surface Sa, that is, a temperature distribution for making the temperature relatively high, that is, a corrected temperature distribution TC.

  When the correction temperature distribution TC is formed on the discharge surface Sa, the droplet discharge device 10 discharges the droplet D to each target point T on the discharge surface Sa and the liquid film F in each discharge region R as in the first embodiment. And the respective liquid films F are dried under the corrected temperature distribution TC. Thereby, the droplet discharge device 10 can reflect the relationship between the film thickness distribution and the temperature distribution obtained based on the test film forming process in the film forming process. Therefore, as shown by the solid line in FIG. 7C, the droplet discharge device 10 can make the film thickness distribution after drying (this film thickness distribution KC) more uniform.

Next, the electrical configuration of the droplet discharge device 10 of the second embodiment configured as described above will be described with reference to FIG.
In FIG. 8, the input / output device 31 has a selection switch for selecting a test film forming process and a main film forming process. The control unit 30 executes the test film formation process when a selection signal for selecting the test film formation process is input from the input / output device 31. Further, the control unit 30 executes the main film forming process when a selection signal for selecting the main film forming process is input from the input / output device 31.

The control unit 30 receives process data Ip in a predetermined format from the input / output device 31. When executing the test film formation process, the process data Ip includes data on the test temperature distribution TB and the test points. Further, when executing the film forming process, the process data Ip includes data relating to the test temperature distribution TB and the test film thickness distribution KB.

  When executing the test film formation process, the control unit 30 performs a predetermined development process on the process data Ip from the input / output device 31 to obtain data relating to the output of each heater block HB for forming the test temperature distribution TB. The target temperature data HCD is generated. The controller 30 refers to the target temperature data HCD, generates a heater drive signal SH for forming the test temperature distribution TB, and outputs the heater drive signal SH to the heater drive circuit 36. The heater drive circuit 36 drives each heater block HB in response to the heater drive signal SH from the control unit 30, thereby forming a test temperature distribution TB on the discharge surface Sa.

  When executing the test film formation process, the control unit 30 performs a predetermined development process on the process data Ip from the input / output device 31 to generate dot pattern data DPD for ejecting the droplet D to each test point. To do. As in the first embodiment, the control unit 30 causes the droplet D to land on each test point using the dot pattern data DPD.

  When executing the film forming process, the control unit 30 performs a predetermined development process on the process data Ip from the input / output device 31 to select a thick film point and a thin film point, and sets the data regarding the corrected temperature distribution TC as the target temperature. Data is generated as HCD. That is, the control unit 30 generates data regarding the output of each heater block HB for forming the corrected temperature distribution TC as the target temperature data HCD.

  The control unit 30 refers to the target temperature data HCD, generates a heater drive signal SH for forming the corrected temperature distribution TC, and outputs the heater drive signal SH to the heater drive circuit 36. The heater drive circuit 36 drives each heater block HB in response to the heater drive signal SH from the control unit 30, thereby forming a corrected temperature distribution TC on the ejection surface Sa.

Next, the effect of 2nd embodiment comprised as mentioned above is described below.
(5) In the second embodiment, the liquid film F is formed by landing the droplets D on each of the test points, and the liquid film F is dried under the test temperature distribution TB, whereby the test film thickness is obtained. A distribution KB is obtained, that is, a test film formation process is executed. When this film forming process is executed, a liquid film F is formed by landing droplets D on each point of the target point T, and the liquid film F is based on the test film thickness distribution KB and the test temperature distribution TB. And dried under a corrected temperature distribution TC formed in the above manner.

  Therefore, the correction temperature distribution TC in the film formation process can correct coordinates that can be a relatively thick film by drying under the test temperature distribution TB to a relatively low temperature. In addition, coordinates that can become a relatively thin film by drying under the test temperature distribution TB can be corrected to a relatively high temperature. Therefore, the liquid film F in this film forming process can reduce the evaporation probability of a portion that can be a relatively thick film, and can increase the evaporation probability of a portion that can be a relatively thin film. it can. As a result, the liquid film F in the film forming process can more reliably improve the film thickness uniformity of the film formed of the droplets D.

  (6) In the second embodiment, the temperature between the both end portions and the intermediate portion of the liquid film F in the + X direction becomes higher than the intermediate portion due to the corrected temperature distribution TC. Therefore, the vicinity of both end portions of the liquid film F increases the evaporation probability by the amount higher than the central portion. Therefore, the film material in the vicinity of both end portions hardly flows to both end portions. Therefore, according to the film forming method of the second embodiment, the film thickness uniformity of the film formed by drying the liquid film F can be further improved.

In addition, you may change the said embodiment as follows.
In the first embodiment, the heat conducting member 26 is sandwiched between the heating surface 12a and the substrate S. For example, the heating surface 12a may have a concavo-convex shape, and the concave portion may be a low conductive region Re.

  In the first embodiment, the conductive surface 26a is a flat surface. However, the conductive surface 26a may be curved as shown in FIG. According to this, a steep temperature change on the discharge surface Sa can be suppressed.

  In the first embodiment, the space between the adjacent heat conducting members 26 is hollow. For example, the space between the adjacent heat conducting members 26 may be configured to lower the temperature of the low conduction region Re by the flow of a refrigerant such as air or cooling water. Further, the space between the adjacent heat conductive members 26 may be configured to reduce the temperature of the low conductive region Re by including a member having low heat conductivity. Or the structure which arrange | positions the heating part of a Peltier element in the area | region of the conduction surface 26a, and arrange | positions the cooling part of this Peltier element in the area | region of the said space may be sufficient. According to these, the droplet discharge device 10 can expand the temperature range of the low conduction region Re.

In the above embodiment, the number of nozzle rows is one, but the number is not limited to this, and the number of nozzle rows may be two or more.
In the above embodiment, the number of droplet discharge heads 20 is one. However, the number is not limited to this, and the number of droplet discharge heads 20 may be two or more.

  In the above embodiment, the heater H or the heater block HB heats the ejection region R when ejecting the droplet D. For example, the heater H or the heater block HB may be configured to heat the discharge region R after the liquid film F is formed in the discharge region R.

  In the above embodiment, the droplet discharge device 10 includes both the droplet discharge head 20 and the drying unit. However, the present invention is not limited thereto, and the droplet discharge device 10 may have a configuration that does not include a drying unit. In this case, the drying unit (the substrate stage 12, the heater H, and the heat conduction member 26) is separately configured as a drying device. You may do it.

The perspective view which shows the droplet discharge apparatus of 1st embodiment. Similarly, a perspective view showing a droplet discharge head. Similarly, the side view which shows the inside of a droplet discharge head. Similarly, the top view which shows the discharge position of a droplet. (A), (b) is the top view and side sectional view which respectively show the substrate stage of 1st embodiment. Similarly, the electric block circuit diagram which shows the electric constitution of a droplet discharge apparatus. (A), (b), (c) is the sectional side view which shows the substrate stage of 2nd embodiment, respectively, The figure which shows the temperature profile of a substrate stage, and the figure which shows the film thickness profile of a liquid film. Similarly, the electric block circuit diagram which shows the electric constitution of a droplet discharge apparatus. The sectional side view which shows the substrate stage of the example of a change. (A), (b) is the top view and sectional side view which respectively show the droplet discharge process of a prior art example. (A), (b) is the top view and sectional side view which respectively show the droplet discharge process of a prior art example.

Explanation of symbols

  D ... droplet, F ... liquid film, H ... heater, Ik ... ink, N ... nozzle, R ... discharge area, S ... substrate, Sa ... discharge surface, 10 ... droplet discharge device, 20 ... droplet discharge head, 26 ... heat conducting member, 30 ... control unit.

Claims (11)

A film forming method for forming a film on an object by discharging a liquid containing a film material into a plurality of droplets and discharging the liquid onto the object, and drying the liquid on the object,
Forming a liquid film on the point sequence by landing the droplet on each point of the point sequence on the object; and
Forming a temperature distribution in the liquid film so that both end portions of the predetermined width in the column direction of the point sequence are lower than the intermediate portion in the column direction, and drying the liquid film;
A film forming method comprising: The film forming method according to claim 1,
The step of forming the liquid film includes
The liquid film is formed by causing the droplets to land at the same timing from each of the plurality of nozzles arranged in the row direction at the same timing. The film forming method according to claim 1 or 2,
The step of forming the liquid film includes
The droplets are landed at the same timing from each of the plurality of nozzles arranged in the row direction at the same timing, and the plurality of nozzles and the object are relatively moved in a direction intersecting the row direction. To form a continuous liquid film in the intersecting direction,
The step of drying the liquid film includes
The liquid film is dried by forming a temperature distribution in the liquid film such that both end portions of the predetermined width in the row direction and both end portions of the predetermined width in the intersecting direction are lower in temperature than the intermediate portion. A film forming method. It is the film-forming method as described in any one of Claims 1-3,
The step of drying the liquid film includes
A film forming method, wherein a temperature distribution between the both end portions and the intermediate portion is higher than that of the intermediate portion, and the liquid film is dried. A film forming method for forming a film on an object by discharging a liquid containing a film material into a plurality of droplets and discharging the liquid onto the object, and drying the liquid on the object,
A first liquid film is formed on the first point sequence by landing the liquid droplets on each point of the first point sequence on the object, and the first liquid film is dried at a predetermined temperature to form the first film. Forming a step;
Measuring the film thickness distribution of the first film in the coordinate system of the first point sequence;
Forming a second liquid film on the second point sequence by landing the droplet on each point of the second point sequence on the object;
By converting the coordinate system of the first point sequence to the coordinate system of the second point sequence, the film thickness distribution of the first film is converted to the film thickness distribution in the coordinate system of the second point sequence, The second liquid film is formed by forming a temperature distribution in the second liquid film that makes the coordinates of the relatively thick film thickness value in the coordinate system of the two-point sequence lower than the predetermined temperature. A drying step;
A film forming method comprising: A film forming method for forming a film on an object by discharging a liquid containing a film material into a plurality of droplets and discharging the liquid onto the object, and drying the liquid on the object,
A first liquid film is formed on the first point sequence by landing the liquid droplets on each point of the first point sequence on the object, and the first liquid film is dried at a predetermined temperature to form the first film. Forming a step;
Measuring the film thickness distribution of the first film in the coordinate system of the first point sequence;
Forming a second liquid film on the second point sequence by landing the droplet on each point of the second point sequence on the object;
By converting the coordinate system of the first point sequence to the coordinate system of the second point sequence, the film thickness distribution of the first film is converted to the film thickness distribution in the coordinate system of the second point sequence, The second liquid film is dried by forming a temperature distribution in the second liquid film so that the coordinates of the relatively thin film thickness value in the coordinate system of the two-point sequence are higher than the predetermined temperature. And a process of
A film forming method comprising: A droplet discharge head that discharges a liquid containing a film material into a plurality of droplets and discharges the liquid onto the object, and a drying unit that forms a film on the object by drying the liquid on the object. A film forming apparatus,
The droplet discharge head forms a liquid film on the point sequence by landing the droplet on each point of the point sequence on the object,
The drying unit forms the film on the object by forming a temperature distribution in the liquid film such that both end portions of the predetermined width in the row direction are lower in temperature than the intermediate portion in the row direction. A film forming apparatus. The film forming apparatus according to claim 7,
The drying unit
A heater having a heating surface facing the object;
A heat conducting member that is disposed in a region on the heating surface facing the intermediate portion and conducts heat received from the heating surface to the intermediate portion by contacting the object;
A film forming apparatus comprising: The film forming apparatus according to claim 7,
The drying unit
A film forming apparatus comprising a plurality of heaters arranged in the row direction and in thermal contact with the object. A droplet discharge head for discharging a liquid material containing a film material into a plurality of droplets and discharging the liquid material to a target; a drying unit that forms a film on the target by drying the liquid on the target; A film forming apparatus having a droplet discharge head and a control unit that controls the drying unit,
The controller is
A first liquid film is formed on the first point row by driving the droplet discharge head to land the droplet on each point of the first point row on the object, and driving the drying unit And forming the first film by drying the first liquid film at a predetermined temperature,
A second liquid film is formed on the second point sequence by driving the droplet discharge head to land the droplets on each point of the second point sequence on the object. By converting the coordinate system to the coordinate system of the second point sequence, the film thickness distribution of the first film is converted to the film thickness distribution in the coordinate system of the second point sequence, and the drying unit is driven to The second liquid film is formed by forming a temperature distribution in the second liquid film so that the coordinates of the film thickness value relatively thick among the film thickness values in the coordinate system of the second point sequence are lower than the predetermined temperature. A film forming apparatus for drying the film. A droplet discharge head for discharging a liquid material containing a film material into a plurality of droplets and discharging the liquid material to a target; a drying unit that forms a film on the target by drying the liquid on the target; A film forming apparatus having a droplet discharge head and a control unit that controls the drying unit,
The controller is
A first liquid film is formed on the first point row by driving the droplet discharge head to land the droplet on each point of the first point row on the object, and driving the drying unit And forming the first film by drying the first liquid film at a predetermined temperature,
A second liquid film is formed on the second point sequence by driving the droplet discharge head to land the droplets on each point of the second point sequence on the object. By converting the coordinate system to the coordinate system of the second point sequence, the film thickness distribution of the first film is converted to the film thickness distribution in the coordinate system of the second point sequence, and the drying unit is driven to The second liquid film is formed by forming a temperature distribution in the second liquid film so that a coordinate of a relatively thin film thickness value among the film thickness values in the coordinate system of the second point sequence is higher than the predetermined temperature. A film forming apparatus for drying the film.

Images