JP2009038092A - Electromagnetic wave shield material and manufacturing method thereof, and filter for display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-cost electromagnetic wave shield material which has electromagnetic wave shieldability and near infrared absorptivity, and is free of faults such as wire breaking, a shape defect, and low contactness due to a transfer defect. <P>SOLUTION: The electromagnetic wave shield material has a conductive layer 3 made of a conductive material composition formed in a predetermined pattern on a primer layer 2 formed on a transparent base material 1; and the thickness TA of a part A of the primer layer 2 where the conductive layer 3 is formed is larger than the thickness TB of a part B where the conductive layer 3 is not formed, and the primer layer 2 contains a near infrared absorptive material absorbing near infrared wavelengths in a range of 800 to 1,100 nm. The electromagnetic wave shield material is obtained by pressing the primer layer in a fluidity holding state before hardening and a shaping plate surface of the predetermined pattern charged with the conductive material composition against each other so that the primer layer and conductive material composition come into contact with each other without any gap, and hardening the primer layer or hardening the primer layer and conductive material composition at the same time. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electromagnetic shielding material having electromagnetic shielding properties and near-infrared absorbing properties, a method for producing the same, and a display filter.

  Known display devices such as monitors for televisions and personal computers include, for example, cathode ray tube display devices (CRT), liquid crystal display devices (LCD), plasma display devices (PDP), electroluminescent display devices (EL), and the like. Among these image display devices (hereinafter, also simply referred to as “display devices” or “displays”), plasma display devices that are attracting attention in the field of large-screen display devices use plasma discharge for light emission, and therefore 30 MHz. There is a possibility that unnecessary electromagnetic waves in the ~ 1 GHz band may leak to the outside and affect other devices (for example, remote control devices, information processing devices, etc.). Therefore, it is common to provide a film-like electromagnetic shielding material for shielding electromagnetic waves that leak from the front side (observer side) of the plasma display panel used in the plasma display device.

  In the plasma display device, near infrared rays having a wavelength of 800 nm to 1100 nm generated from the plasma display panel may adversely affect other devices (for example, remote control devices such as DVDs, HDDs, game machines, etc.). It is necessary to shield the radiation from the outside. For such a problem, for example, Patent Document 1 proposes a display film having both electromagnetic shielding properties and near infrared absorption properties. In this display film, an adhesive layer containing a near-infrared absorbing material is formed on a transparent substrate, and then a copper foil whose surface is roughened is dry-laminated and then bonded. The copper foil is formed by photoetching to form a conductive layer having a predetermined pattern. In the display film thus obtained, the surface of the adhesive layer of the opening where the conductive layer is not formed is roughened, so that the image light transmitted through the display film is diffused in the rough surface portion. Problems such as “cloudiness” may occur. Therefore, in the same document 1, a transparent resin is further applied on the roughened adhesive layer to smooth the surface, but there is a problem that man-hours and material costs are increased and the cost is reduced. Also, if the roughening treatment of the bonding surface of the copper foil is eliminated, the fogging of the opening is eliminated, but instead, the adhesiveness between the foil pattern and the adhesive layer is reduced, and the cause of peeling Become. Therefore, it has not been practically possible to solve this problem by eliminating the roughening treatment.

Although there is no near-infrared absorptivity, various studies have been made to reduce the cost by suppressing the occurrence of the above-mentioned “cloudiness”. For example, in Patent Document 2, an adhesive layer is formed by coating. An electromagnetic wave shielding material has been proposed in which a conductive ink composition is directly intaglio-printed with a mesh pattern on the transparent substrate, and a metal layer is electroplated on the mesh pattern. Since this electromagnetic wave shielding material is an adhesive layer in which the surface of the opening other than the mesh pattern is applied and formed, there is no surface unevenness which is a problem in Patent Document 1, and the problem of “cloudiness” does not occur. Therefore, if this adhesive layer is formed by containing the near-infrared absorbing material described in Patent Document 1, it is possible to provide an electromagnetic shielding material having both electromagnetic shielding properties and near infrared absorbing properties. .
Japanese Patent Laid-Open No. 10-75087 Japanese Patent Laid-Open No. 11-174174

  However, the method for producing an electromagnetic shielding material described in Patent Document 2 has the following problems. That is, in the manufacturing method, when transferring from an intaglio to a transfer body or a transparent substrate (also referred to as transfer), an untransferred part may occur or a transfer defect with poor adhesion may occur. . Specifically, as shown in FIG. 9, when the conductive ink composition 103 is applied on the intaglio plate 101 and scraped with a doctor blade 102 to fill the concave ink 104 with the conductive ink composition 103, FIG. As shown to (B), the conductive ink composition 103 in the recessed part 104 after scraping with the doctor blade 102 has the dent 105 in the upper part. The recess 105 is then formed as shown in FIG. 9C when the transparent substrate 106 is pressure-bonded onto the intaglio 101 and the conductive ink composition 103 in the recess 104 is transferred onto the transparent substrate 106. This is a factor that hinders adhesion between the transparent substrate 106 and the conductive ink composition 103. As a result, an untransferred portion of the conductive ink composition is generated on the transparent substrate 106, or a transfer failure inferior in adhesiveness is generated, which causes a decrease in electromagnetic shielding characteristics.

  The present invention has been made in order to solve the above-mentioned problems, and its purpose is to have both electromagnetic shielding properties and near-infrared absorbing properties, and an electromagnetic shielding material produced at low cost, It is providing the film for a display provided with the electromagnetic wave shielding material.

  Another object of the present invention is to provide an electromagnetic shielding material having both electromagnetic shielding properties and near-infrared absorptive properties, pattern disconnection due to poor transfer of the conductive material composition, poor shape, and low adhesion. An object of the present invention is to provide an electromagnetic shielding material manufacturing method that can be manufactured at low cost without causing problems such as these.

  The electromagnetic wave shielding material of the present invention for solving the above problems includes a transparent substrate, a primer layer formed on the transparent substrate, and a conductive material composition formed in a predetermined pattern on the primer layer. An electromagnetic shielding material comprising: a thickness of a portion of the primer layer where the conductive layer is formed is greater than a thickness of a portion where the conductive layer is not formed In addition, the primer layer includes a near-infrared absorbing material that absorbs near-infrared wavelengths in the range of 800 nm to 1100 nm.

  According to this invention, since it has a conductive layer composed of a conductive material composition and a primer layer containing a near-infrared absorbing material, an electromagnetic shielding material having both electromagnetic shielding properties and near-infrared absorbing properties is provided. be able to.

  Further, according to the present invention, the thickness of the portion where the conductive layer is formed in the primer layer provided on the transparent substrate is larger than the thickness of the portion where the conductive layer is not formed. The primer layer is provided so as to fill the dent pointed out in the above problem. The primer layer having such a form is formed by filling the concave portion above the conductive material composition in the concave portion of the shaping plate surface after scraping with a doctor blade at the time of manufacturing the electromagnetic shielding material, As a result, the electromagnetic wave shielding material can be provided at low cost, in which the primer layer adheres to the conductive material composition without voids and does not cause defects such as disconnection, shape failure, and low adhesion due to poor transfer of the conductive material composition. Further, according to the present invention, since the conductive layer is provided with improved transferability of the conductive material composition, compared to a method using an intaglio such as ordinary gravure printing, the conductive layer of the conductive material composition after transfer is provided. The thickness can be increased. As a result, the conductive layer can be increased, and the conductivity necessary for the electromagnetic wave shield can be ensured.

  A preferred embodiment of the electromagnetic wave shielding material of the present invention is configured such that the near infrared absorbing material is a cesium tungsten composite oxide or a phthalocyanine compound. Various materials can be used as the near-infrared absorbing material, and a cesium tungsten composite oxide or a phthalocyanine compound is particularly preferable.

  A preferable aspect of the electromagnetic wave shielding material of the present invention is configured such that the primer layer is a layer made of an ionizing radiation curable resin or a thermoplastic resin.

  The display filter of the present invention for solving the above-described problems has the electromagnetic wave shielding material of the present invention and is provided on the front side of the display.

  According to this invention, since it has a low-cost electromagnetic shielding material having electromagnetic shielding properties and near infrared absorption properties and is provided on the front side of the display, for example, unnecessary electromagnetic waves and near infrared rays generated from a plasma display panel are generated. Leakage or radiation to the outside can be blocked, and other devices (for example, remote control devices such as remote control devices, information processing devices, DVDs, HDDs, game machines, etc.) can be prevented from being affected. .

  In the manufacturing method of the electromagnetic wave shielding material according to the first aspect of the present invention for solving the above-described problem, a conductive layer is formed in a predetermined pattern on one surface of the transparent substrate, and the range of 800 nm to 1100 nm. A method for producing an electromagnetic shielding material having near-infrared absorptivity that absorbs near-infrared wavelengths, and includes a near-infrared absorbing material on one surface of a transparent substrate and can maintain fluidity until cured. After applying a primer layer coating step for coating and forming a primer layer, and applying a conductive material composition capable of forming a conductive layer after curing on a plate-like or cylindrical plate surface having a recess formed in a predetermined pattern, the inside of the recess A conductive material composition filling step of scraping off the conductive material composition adhering to the inside and filling the concave portion with the conductive material composition, and a primer layer of the transparent substrate after the primer layer coating step And the concave side of the plate surface after the conductive material composition filling step, and a pressure bonding step for closely adhering the primer layer and the conductive material composition in the concave portion without a gap, and the primer after the pressure bonding step A primer layer curing step for curing the layer, and a transfer step for removing the transparent base material and the primer layer from the plate surface after the primer layer curing step and transferring the conductive material composition in the recesses onto the primer layer; And a conductive material composition curing step of curing the conductive material composition formed in a predetermined pattern on the primer layer to form a conductive layer after the transfer step.

  In a preferred aspect of the method for producing an electromagnetic wave shielding material according to the first aspect of the present invention, in the conductive material composition filling step, the conductive material composition is a composition capable of forming a conductive layer that can be electroplated after curing. And having a plating step of electroplating a metal layer on the conductive layer formed in a predetermined pattern on the primer layer after the conductive material composition curing step.

  In the method for producing an electromagnetic wave shielding material according to the second aspect of the present invention for solving the above-described problem, a conductive layer is formed in a predetermined pattern on one surface of a transparent substrate, and the range of 800 nm to 1100 nm is provided. A method for producing an electromagnetic shielding material having near-infrared absorptivity that absorbs near-infrared wavelengths, and includes a near-infrared absorbing material on one surface of a transparent substrate and can maintain fluidity until cured. After applying a primer layer coating step for coating and forming a primer layer, and applying a conductive material composition capable of forming a conductive layer after curing on a plate-like or cylindrical plate surface having a recess formed in a predetermined pattern, the inside of the recess A conductive material composition filling step of scraping off the conductive material composition adhering to the inside and filling the concave portion with the conductive material composition, and a primer layer of the transparent substrate after the primer layer coating step And the concave side of the plate surface after the conductive material composition filling step, and a pressure bonding step for closely adhering the primer layer and the conductive material composition in the concave portion without a gap, and the primer after the pressure bonding step A simultaneous curing step of simultaneously curing the layer and the conductive material composition; and after the simultaneous curing step, the transparent substrate and the primer layer are peeled off from the plate surface, and the conductive material composition in the recess is used as the conductive layer. And a transfer step of transferring onto the layer.

  In the method for producing an electromagnetic wave shielding material according to the second aspect of the present invention, in the conductive material composition filling step, the conductive material composition is a composition capable of forming a conductive layer that can be electroplated after curing, You may comprise so that it may have a plating process of electroplating a metal layer on the conductive layer formed in the predetermined pattern on the said primer layer after a transfer process.

  According to the first and second aspects of the invention, the primer layer side of the transparent base material on which the primer layer retaining fluidity is formed and the concave side of the plate surface after the conductive material composition filling step are pressure bonded. Therefore, a fluid primer layer is filled in the recess that is likely to be formed above the conductive material composition in the recess. As a result, the primer layer adheres to the conductive material composition without any gaps, so that the conductive material composition in the recess can be accurately transferred without an untransferred portion on the transparent substrate side. In this way, an electromagnetic shielding material having both electromagnetic shielding properties and near-infrared absorptive properties that does not cause defects such as disconnection, shape failure, and low adhesion due to poor transfer of the conductive material composition can be produced at low cost. can do.

  In a preferred embodiment of the method for producing an electromagnetic wave shielding material according to the first and second aspects of the present invention, the primer layer is a layer made of an ionizing radiation curable resin or a thermoplastic resin, and the fluidity of the primer layer is maintained. It is configured to be performed by non-irradiation with ionizing radiation or heating.

  In a preferred aspect of the method for producing an electromagnetic wave shielding material according to the first and second aspects of the present invention, the conductive material composition includes a conductive powder and a resin, and the resin is a thermoplastic resin or an ionizing radiation curable resin. Or it is comprised so that it may be a thermosetting resin. The conductive material composition includes a solvent that dissolves the resin as necessary, and is a composition that can form a conductive layer by a curing means such as drying or ionizing radiation irradiation, and the conductive material composition filling step It is preferable that the resin has fluidity capable of filling the concave portions of the plate surface.

  In a preferred aspect of the method for producing an electromagnetic wave shielding material according to the first and second aspects of the present invention, the thickness of the portion of the primer layer to which the conductive material composition is transferred after the transfer step is as described above. The conductive material composition is configured to be larger than the thickness of the portion where the conductive material composition is not transferred.

  According to this invention, the conductive layer in the concave portion is bonded by pressure bonding the primer layer side of the transparent substrate on which the primer layer retaining fluidity is formed and the concave side of the plate surface after the conductive material composition filling step. Since the primer layer with fluidity is filled in the dent that is likely to be formed on the upper part of the conductive material composition and then the primer layer is cured, the finally obtained form is the conductive layer of the primer layer provided on the transparent substrate. The thickness of the portion where the layer is formed is larger than the thickness of the portion where the conductive layer is not formed (that is, a bite shape). Since the obtained electromagnetic shielding material has such a form, problems such as disconnection, shape failure, and low adhesion due to poor transfer of the conductive layer do not occur.

  According to the electromagnetic wave shielding material of the present invention, the primer layer having near-infrared absorptivity is provided so as to fill the dent pointed out in the above problem. An electromagnetic shielding material that does not cause defects such as adhesion can be provided at low cost. In particular, instead of providing a new layer as a near-infrared absorbing layer, the primer layer is used as a near-infrared absorbing layer, so that near-infrared absorptivity can be imparted without increasing the number of layers, resulting in cost reduction. Can be achieved.

  According to the display filter of the present invention, for example, unnecessary electromagnetic waves and near infrared rays generated from a plasma display panel can be shielded from leaking or radiating to the outside, and other devices (for example, remote control devices, information processing, etc.) It is possible to prevent the remote control device (device, DVD, HDD, game machine, etc.) from being affected.

  According to the method for producing an electromagnetic wave shield of the present invention, since the fluid primer layer is filled in the recess that is likely to be formed on the conductive material composition in the recess, the primer layer has no gap in the conductive material composition. In close contact. As a result, the conductive material composition in the recesses can be accurately transferred without any untransferred portions on the transparent substrate side. In this way, an electromagnetic shielding material having both electromagnetic shielding properties and near-infrared absorptive properties that does not cause defects such as disconnection, shape failure, and low adhesion due to poor transfer of the conductive material composition can be produced at low cost. can do. In addition, since the transition rate of the conductive material composition in the recess is also improved, a thicker conductive layer pattern can be formed than in the case where no primer is used, and the conductivity necessary for the electromagnetic wave shield can be increased. Also, instead of providing a new layer as a near-infrared absorbing layer, the primer layer is used as a near-infrared absorbing layer, providing near-infrared absorptivity without increasing the number of steps for forming a new layer. Cost reduction.

  Next, embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments, and various modifications can be made within the scope of the gist of the present invention.

[Electromagnetic wave shielding material]
FIG. 1 is a schematic plan view showing an example of the electromagnetic wave shielding material of the present invention, and FIG. 2 is an enlarged view of the AA ′ cross section in FIG. FIG. 3 is a schematic cross-sectional view showing a part of FIG. 2 further enlarged. (A) is an example in which a metal layer is not provided on the conductive layer, and (B) is on the conductive layer. Furthermore, this is an example in which a metal layer is provided. The electromagnetic wave shielding material 10 of the present invention has a transparent base material 1, a primer layer 2 formed on the transparent base material 1, and a conductive layer 3 formed in a predetermined pattern on the primer layer 2. Layer 2 includes a near infrared absorbing material. The electromagnetic wave shielding material 10 includes a metal layer 4 formed on the conductive layer 3 as necessary, and further includes a protective layer 9 as necessary. In FIG. 1, reference numeral 7 is an electromagnetic shielding pattern portion that is located in the center and faces the image display area of the display device, and reference numeral 8 is present at least at a part of the peripheral edge of the electromagnetic shielding pattern portion. It is a grounding part. In the grounding portion 8, the grounding capability is preferably as shown in FIG. 1 so as to surround the entire periphery of the peripheral portion of the electromagnetic wave shielding pattern portion 7. Further, the grounding portion 8 may be formed in a pattern shape having openings such as a mesh, but more preferably, as shown in FIG. Conductive layer and metallized layer). In addition, the “predetermined pattern” is a mesh or stripe pattern that is common as an electromagnetic wave shielding pattern of the electromagnetic wave shielding material 10. Hereinafter, the configuration of the present invention will be described in detail.

(Transparent substrate)
The transparent base material 1 is a base material for the electromagnetic wave shielding material 10 and has various thicknesses of various materials in consideration of required transparency such as desired transparency, mechanical strength, adhesion to the primer layer 2, and the like. Just choose. The material of the transparent substrate 1 may be a resin substrate or an inorganic material such as a glass substrate. Further, the thickness form may be film, sheet or plate. Usually, a resin transparent film is preferably used. Such a transparent film is preferably a film based on acrylic (or methacrylic) resin, polyester resin or the like, but is not limited thereto. Specific examples of resin materials used for the film include cellulose resins such as triacetyl cellulose, diacetyl cellulose, and acetate butyrate cellulose, polymethyl methacrylate, methyl methacrylate-butyl acrylate, methyl methacrylate-styrene copolymer Acrylic resins such as coalescence, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyolefin resins such as polyethylene, polypropylene, trimethylpentene and cyclic polyolefin, and halogen-containing resins such as polyvinyl chloride and polyvinylidene chloride , Polyethersulfone, polyurethane resin, polycarbonate resin, styrene resin such as polystyrene, polyamide resin, polyimide resin, polysulfone resin, polyether resin, Li ether ketone, (meth) acrylonitrile and the like can be used. Among them, the biaxially stretched PET film is preferable in that it has excellent transparency and durability, and has heat resistance that does not cause thermal deformation even when subjected to ultraviolet irradiation treatment or heat treatment in the subsequent steps.

  Further, as the material used for the plate, as the resin, the resin exemplified in the resin film can be used, and as the inorganic material, glass such as soda glass, potassium glass, borosilicate glass, or the like can be used.

  The transparent substrate 1 may be a roll-to-roll long belt-like film, or may be a sheet film having a predetermined size. The thickness of the transparent substrate 1 is usually preferably about 8 μm to 300 μm in the case of a film, and preferably about 500 μm to 5000 μm in the case of a plate, but is not limited thereto. The light transmittance of the transparent substrate 1 is ideally 100%, but it is preferable to select a light transmittance of 80% or more. If necessary, an easy-adhesion layer is provided on the surface of the transparent substrate 1 to improve the adhesion between the primer layer 2 and the transparent substrate 1, which will be described later, or corona discharge treatment, plasma treatment, flame treatment, etc. The surface treatment may be performed. The easy adhesion layer is made of a resin having adhesiveness to both the transparent substrate 1 and the primer layer 2. The resin of the easy adhesion layer is appropriately selected from resins such as urethane resin, epoxy resin, polyester resin, acrylic resin, and chlorinated polypropylene.

(Primer layer)
The primer layer 2 contains a near-infrared absorbing material and is provided on the transparent substrate 1 with good adhesion. A conductive layer 3 is provided on the primer layer 2 with good adhesion. Therefore, the primer layer 2 preferably has good adhesion to both the transparent substrate 1 and the conductive layer 3 and, of course, is preferably transparent to visible light. For example, a layer formed by applying an ionizing radiation curable resin or a thermoplastic resin is preferable. Various additives and modified resins may be used to improve adhesion, durability, and impart various physical properties.

  Examples of the thermoplastic resin include acrylic resins such as polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), polyester resins, and polyolefin resins.

  As the ionizing radiation curable resin, a monomer (monomer) that is polymerized and cured by a reaction such as crosslinking with ionizing radiation, or a prepolymer or an oligomer is used. Examples of the monomer include radically polymerizable monomers, specifically 1,6-hexanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate and the like (meta ) Acrylates. Examples of the prepolymer (or oligomer) include radically polymerizable prepolymers, specifically, various (meth) acrylate prepolymers such as urethane (meth) acrylate, epoxy (meth) acrylate, and polyester (meth) acrylate. Examples thereof include polymers and unsaturated polyester prepolymers. Other examples include cationically polymerizable prepolymers such as novolac epoxy resin prepolymers and aromatic vinyl ether resin prepolymers. Here, the notation (meth) acrylate means acrylate or methacrylate.

  These monomers or prepolymers may be used alone or in combination of two or more types of monomers, two or more types of prepolymers, or one type of monomer, depending on the required performance, coating suitability, etc. A mixture of the above and one or more prepolymers can be used.

  As the photopolymerization initiator, in the case of a radical polymerizable monomer or prepolymer, a compound such as benzophenone, thioxanthone, or benzoin is used, and in the case of a cationic polymerization monomer or prepolymer, a metallocene is used. , Aromatic sulfonium-based and aromatic iodonium-based compounds are used. These photopolymerization initiators are added in an amount of about 0.1 to 5 parts by weight with respect to 100 parts by weight of the composition comprising the monomer and / or prepolymer.

  The ionizing radiation is typically ultraviolet rays or electron beams, but other than these, electromagnetic waves such as visible rays, X-rays and γ rays, or charged particle beams such as α rays can also be used.

  The near-infrared absorbing material is included in the primer layer 2. The primer layer 2 containing such a near-infrared absorbing material can absorb near-infrared light, and can make the near-infrared wavelength in the range of 800 nm to 1100 nm 30% or less, more preferably 10% or less. The near-infrared absorbing material is not particularly limited as long as it has such a near-infrared transmittance and is transparent in the visible light region, and various materials can be used, but at least included in the primer layer 2. Even so, the primer layer 2 needs to have a material and content that can maintain transparency.

As such a near-infrared absorbing material, for example, organic dyes and inorganic pigments can be used. Specifically, examples of organic dyes include imonium compounds, diimonium compounds, aminium compounds, cyanine compounds, and phthalocyanines. Compounds, naphthalocyanine compounds, polymethine compounds, naphthoquinone compounds, anthraquinone compounds, dithiol compounds, pyrylium compounds, cerium compounds, squarylium compounds, copper complexes, nickel complexes, dithiol metal complexes, etc. As the inorganic pigment, cesium tungsten composite oxides (typically composed of Cs _0.33 WO ₃ ), ITO (indium tin oxide), ATO (antimony), and the like described in WO 2005/037932 Doped tin oxide), hexachloride Use particles such as ngsten, iron oxide, tin oxide, antimony oxide, indium oxide, magnesium oxide, titanium oxide, chromium oxide, zirconium oxide, nickel oxide, aluminum oxide, zinc oxide, lead oxide, bismuth oxide, lanthanum oxide, etc. it can. Among these, the cesium tungsten composite oxide has a large absorption in the near infrared region, a wide absorption region, high transmittance in the visible region, and high stability and durability of the near infrared absorbing material during the manufacturing process. And phthalocyanine compounds can be preferably used.

  The near-infrared absorbing material is usually in the form of particles (primary particles), and a resin composition for forming a primer layer is selected with an arbitrary particle size in consideration of near-infrared absorption characteristics. The If the particle diameter is too larger than the near-infrared wavelength, the near-infrared shielding efficiency is improved, but irregular reflection occurs on the particle surface, haze increases, and transparency may decrease. On the other hand, if the particle diameter is too short compared to the wavelength of near infrared rays, the shielding effect of near infrared rays tends to decrease. As a preferable particle diameter, it is 0.01 micrometer-5 micrometers in an average particle diameter, Preferably it is 0.1 micrometer-0.8 micrometer.

  The content of the near-infrared absorbing material contained in the primer layer 2 is set so that the transmittance of the near-infrared wavelength of the primer layer 2 is 30% or less in the range of 800 nm to 1100 nm. 2 in the range of 0.5% to 10% by weight. If the content of the near-infrared absorbing material is less than 0.5% by weight, the amount of the near-infrared absorbing material may be too small to satisfy the desired transmittance, whereas the content of the near-infrared absorbing material If it exceeds 10% by weight, the adhesion between the primer layer 2 and the transparent substrate 1 and the adhesion between the primer layer 2 and the conductive layer 3 may be inferior, or the transmittance in the visible region may be lowered.

  In addition, as for the primer layer 2 containing a near-infrared absorptive material, it is desirable that it is transparent in the visible light region of 380 nm-780 nm. Here, “transparent” means a case where the transmittance is 40% or more in visible light of 380 nm to 780 nm.

  Moreover, in this invention, the primer layer 2 containing the above near-infrared absorptive materials has the characteristics that it can hold | maintain two states, a fluid state and a hardening state. Specifically, the primer layer 2 is provided on the transparent substrate 1 in a state where fluidity can be maintained after coating, and then the conductive material composition layer 3 ′ (see FIG. 4) is required to be able to change from a fluidized state to a cured state in a short time. By forming such a primer layer 2 on the transparent substrate 1, when the conductive material composition layer 3 ′ is transferred onto the primer layer 2, the conductive material composition layer 3 ′ and the primer layer 2 Since the transfer can be performed with no gap between them, it is possible to eliminate the occurrence of a gap between the conductive material composition layer 3 ′ and the primer layer 2, which may have occurred in the past. The problem of poor transfer and poor adhesion does not occur.

  As used herein, “fluidity” or “fluid state” refers to a property or state that flows (deforms) by pressure when the primer layer 2 is pressure-bonded to a plate surface filled with a conductive material composition. It is not necessary to have a low viscosity. When the primer layer 2 is a thermoplastic resin after being adjusted to a viscosity suitable for coating and applied on the transparent substrate 1, it may flow (deform) when it is pressure-bonded to the plate surface. It is sufficient that the temperature is such that it flows (deforms) at the time of pressure bonding. In this case, it may be paraphrased as a softened state.

  Such a fluid state of the primer layer 2 can be obtained by simply applying an ionizing radiation curable ink on the transparent substrate 1 when an ionizing radiation curable resin is used as the resin composition for the primer layer. . The ionizing radiation curable ink is generally composed of monomers and oligomers having ionizing radiation curable properties as described above, and, if necessary, further includes a photopolymerization initiator (in the case of ultraviolet curing or photocuring), various additives, and the like. It is fluid until it is cured with ionizing radiation. This ink may contain a solvent, but in this case, since a drying step is required after coating, the ink is preferably of a type that does not contain a solvent (so-called non-solvent type).

  Moreover, when a thermoplastic resin composition is used as the primer layer resin composition, the thermoplastic resin composition is applied on the transparent substrate 1 and becomes fluid (eg, 50 ° C. to 200 ° C.). The fluidity state can be generated by heating at a degree. If the primer layer 2 in such a fluid state is pressure-bonded to a plate surface filled with a conductive material composition as will be described later and then cured and transferred by cooling, the conductive material composition layer 3 ′ and Transfer can be performed without any gap between the primer layer 2 and the primer layer 2. Here, as a method of applying the thermoplastic resin composition on the transparent substrate 1, there are a method of drying after applying a solution of the thermoplastic resin composition, and a method of applying a resin in a hot melt state. The thermoplastic resin composition coated on the transparent substrate 1 may be heated before contacting the plate surface filled with the conductive material composition, and a heating roll or the like may be used for pressure bonding to the plate surface. However, in any case, when the conductive material composition layer 3 ′ is transferred to the primer layer 2, the primer layer 2 must be cooled to such an extent that the fluidity of the primer layer is lost. is there.

Although the thickness of the primer layer 2 is not particularly limited, the primer layer 2 is usually formed to have a thickness after curing of about 1 μm to 100 μm, preferably about 1 μm to 10 μm. In addition, although it explains in full detail in the description column of a later manufacturing method, electroconductive material composition layer 3 'is transcribe | transferred on the primer layer 2, and also the electroconductive material composition layer 3' is hardened, and electromagnetic wave shielding material is used. the primer layer 2 in after manufacturing, as shown in FIG. 3, the thickness T _a of the portion a conductive layer 3 is formed, than the thickness T _B of the portion B of the conductive layer 3 is not formed large. In the primer layer 2, the side edges 5 and 5 of the portion A having a large thickness are in a form in which the conductive layer 3 wraps around the portion B having a small thickness.

  In the form shown in FIG. 3, after the primer layer 2 in a fluid holding state before being cured is pressure-bonded to the conductive material composition provided in the intaglio, the primer layer 2 is cured, and the conductive material composition is After pressure-bonding the filled shaped plate surface with a predetermined pattern, the primer layer 2 and the conductive material composition are adhered without gaps, and then the primer layer 2 is cured, or the primer layer 2 and the conductive material composition Is caused by simultaneous curing and subsequent transfer. Specifically, as shown in the manufacturing process diagram of FIG. 4 to be described later, the form shown in FIG. 3 makes the primer layer 2 formed on the transparent substrate 1 in a fluid state, and the primer layer 2 is made of a conductive material. It is produced by pressure-bonding the composition 15 to the plate surface filled in the recesses, curing the primer layer 2 and then transferring it. Excess conductive material composition other than the inside of the concave portion is scraped off by the doctor blade on the plate surface. At this time, a dent 6 is easily formed on the upper portion of the conductive material composition in the concave portion. In this state, the primer layer 2 is pressure-bonded to the plate surface, whereby the primer layer 2 having fluidity is filled in the recess 6 and has a form as shown in FIG.

  The primer layer 2 has additives such as a heat stabilizer, a radical scavenger, a plasticizer, a surfactant, an antioxidant, an ultraviolet absorber, a dye (colored dye, colored) pigment, and an extender. May be included.

(Conductive layer)
The conductive layer 3 is provided on the primer layer 2 in a predetermined electromagnetic shielding pattern such as a mesh or stripe. The conductive material composition forming the conductive layer 3 is mainly composed of conductive powder and a binder resin. The electromagnetic shielding pattern may be a mesh shape or a stripe shape that is usually employed for the electromagnetic wave shielding material, and the line width and the pitch between the lines may be dimensions that are usually employed. For example, the line width can be 5 μm to 30 μm, and the line-to-line pitch can be 100 μm to 500 μm. In addition to the electromagnetic shielding pattern having a mesh or stripe shape, there may be a case where a grounding pattern such as all adjacent solids is provided while maintaining electrical continuity therewith.

  The conductive material composition is a fluid ink or paste-like material containing a conductive powder and a resin, and further containing a solvent for dissolving the resin as necessary. From this conductive material composition The conductive layer is a coating film made of a solid after the conductive material composition is dried or cured.

  As the binder resin constituting the conductive material composition, any of thermosetting resin, ionizing radiation curable resin, and thermoplastic resin can be used. Examples of the thermosetting resin include resins such as melamine resin, polyester-melamine resin, epoxy-melamine resin, phenol resin, polyimide resin, thermosetting acrylic resin, thermosetting polyurethane resin, and ionizing radiation. Examples of the curable resin include those described above as the material for the primer layer, and examples of the thermoplastic resin include resins such as polyester resin, polyvinyl butyral, acrylic resin, and thermoplastic polyurethane resin. In addition, when using a thermosetting resin, you may add a curing catalyst as needed. When using an ionizing radiation curable resin such as a photocurable resin, a polymerization initiator may be added as necessary.

  Further, in order to obtain fluidity suitable for filling the concave portion of the plate, these resins are usually used as a varnish dissolved in a solvent. There is no restriction | limiting in particular in the kind of solvent, The solvent generally used for printing ink can be used. The content of the solvent is usually about 10% to 70% by weight, but is preferably as small as possible within a range where necessary fluidity can be obtained. In addition, when an ionizing radiation curable resin such as a photo-curable resin is used, a solvent is not necessarily required because it originally has fluidity.

  In addition, as the conductive powder constituting the conductive material composition, low resistivity metal powder such as gold, silver, platinum, copper, tin, palladium nickel, aluminum, etc., and the surface is a low resistivity metal such as gold or silver. Preferable examples include plated powders (metal powders other than the above low resistivity metals, resin powders such as acrylic resin and melamine resin, inorganic powders such as silica, alumina, barium sulfate, and zeolite), graphite powder, and carbon black powder. The shape can also be selected from spherical, spheroid, polyhedral, scaly, disc, and fibrous. These materials and shapes may be appropriately mixed and used. Since the size of the conductive powder is arbitrarily selected depending on the type, it cannot be specified unconditionally. For example, in the case of a flaky silver powder, the powder having an average particle diameter of about 0.1 μm to 10 μm is used. In the case of carbon black powder, those having an average particle diameter of about 0.01 μm to 1 μm can be used.

  The content of the conductive powder in the conductive material composition is arbitrarily selected according to the conductivity of the conductive powder and the form of the powder. For example, among 100 parts by weight of the solid content of the conductive material composition, The conductive powder can be contained in the range of 40 to 99 parts by weight. In the present application, the average particle diameter refers to a particle size distribution diameter or a value measured by TEM observation.

In addition, an appropriate additive may be added to the conductive material composition for the purpose of improving the quality. For example, carbon black is not necessary because it is black in itself, but by adding a predetermined amount of black pigment or black dye as necessary, the contrast when an electromagnetic wave shield panel is constructed is improved and visibility is improved. Can be made. Further, in order to prevent reflection on the back surface of the transparent substrate due to the metallic luster of the metal plating layer, which will be described later, and to suppress color unevenness, metal color, etc., it is desirable to contain such a black pigment or black dye. Examples of black pigments include carbon black, Fe ₃ O ₄ , CuO—Cr ₂ O ₃ , CuO—Fe ₃ O ₄ —Mn ₂ O ₃ , and CoO—Fe ₂ O ₃ —Cr ₂ O ₃ that also function as conductive powder. The type and shape are not particularly limited, and a black pigment or black dye having a large coloring power with an average particle diameter of 0.1 μm or less that can be easily dispersed in the binder resin is preferable. In addition, when using carbon black, carbon black for coloring materials such as channel black, furnace black or lamp black, conductive carbon black, acetylene black and the like can be mentioned, and among them, the average particle diameter is 20 nm or less. Is preferably used. As the black dye, a dye such as aniline black can be used. Also, in order to improve the fluidity and stability of the conductive material composition, as long as it does not adversely affect the conductivity and adhesion to the primer layer, fillers, thickeners, surfactants, antioxidants as appropriate An agent or the like may be added.

  As shown in the manufacturing process diagram of FIG. 4 to be described later, the conductive layer 3 is first formed of a conductive material composition on a plate-like or cylindrical plate surface in which concave portions are formed in a predetermined mesh-like or stripe-like pattern. After the material is applied, the conductive material composition adhering to the portion other than the inside of the recess is scraped to fill the recess with the conductive material composition. Next, on one surface S1 of the transparent substrate 1, a primer layer 2 that includes a near-infrared absorbing material and can maintain fluidity until cured is applied and formed, and the primer layer 2 side of the transparent substrate 1 and Then, the conductive material composition and the primer layer 2 are brought into intimate contact with each other by crimping the plate surface filled with the conductive material composition in the recesses, and the fluidity of the primer layer 2 is lost in this state (curing) After that, the conductive material composition is transferred onto the primer layer 2 to form a conductive material composition layer 3 ′ having a pattern such as a predetermined mesh shape or stripe shape. After the conductive material composition layer 3 ′ is transferred onto the primer layer 2, the conductive layer 3 is subjected to a curing process (for example, a drying process, an ultraviolet / electron beam irradiation process, a heating process, a cooling process, etc.). Is formed.

  In the present invention, as described above, when the conductive material composition other than the inside of the recess is scraped off by the doctor blade, the fluidity is contained in the recess 6 formed above the conductive material composition in the recess. Since the primer layer 2 is cured in a state where the primer layer 2 holding the filler is filled and the conductive material composition and the primer layer 2 are in close contact with each other without gaps, the conductive material composition is transferred onto the primer layer 2 without defective transfer. can do.

(Metal layer)
The metal layer 4 is formed as necessary in order to further improve the conductivity when the desired conductivity is insufficient with only the conductive layer 3. Usually, it is formed on the conductive layer 3 by plating. As plating methods, there are methods such as electroplating and electroless plating. However, electroplating can increase the plating rate several times by increasing the amount of electricity compared to electroless plating, which significantly improves productivity. It is preferable because it can be used.

  In the case of electroplating, power is supplied to the conductive layer 3 from an electrode such as a current-carrying roll brought into contact with the surface on which the conductive layer 3 is formed. Therefore, electroplating can be performed without any problem. Examples of the material constituting the metal layer 4 include copper, silver, gold, chromium, and nickel, which are highly conductive and can be easily plated. Since the metal layer 4 generally has a volume resistivity smaller than that of the conductive layer 3 by one digit or more, there is an advantage that the amount of the conductive material required can be reduced as compared with the case where the electromagnetic wave shielding property is ensured by the conductive layer alone. is there.

  Note that after the metal layer 4 is formed, the metal layer 4 may be blackened or a protective layer 9 as shown in FIG. 2 may be provided as necessary. Examples of the blackening treatment include blackening nickel plating and copper-cobalt alloy plating, and the protective layer 9 can be formed using, for example, an acrylic photocurable resin.

As mentioned above, although the structure of the electromagnetic wave shielding material 10 of this invention was demonstrated, the electromagnetic wave shielding material 10 of this invention is the part A in which the conductive layer 3 is formed among the primer layers 2 provided on the transparent base material 1. FIG. since the thickness T _a of which is a larger form than the thickness T _B of the portion B of the conductive layer 3 is not formed to fill the depressions 6 noted above problem (see also reference numeral 105 in FIG. 9) Thus, the primer layer 2 is provided. The primer layer 2 having such a form is formed by filling the recess 6 above the conductive material composition in the recess after scraping with a doctor blade when the electromagnetic shielding material 10 is manufactured, and as a result. The conductive material composition is pressure-bonded to the primer layer 2 having near-infrared absorptivity, resulting in problems such as disconnection, shape failure, and low adhesion due to poor transfer of the conductive material composition layer 3 ′. There is an effect that the non-electromagnetic wave shielding material 10 can be provided at low cost. In particular, since a new layer is not provided as a near infrared absorption layer, but the primer layer 2 is used as a near infrared absorption layer, near infrared absorptivity can be imparted without increasing the number of layers. Reduction can be achieved.

[Method of manufacturing electromagnetic shielding material]
FIG. 4 is a process diagram showing an example of the method for producing an electromagnetic wave shield of the present invention. FIG. 5 is a schematic configuration diagram of an apparatus for performing the manufacturing method of the present invention, and FIG. 6 is a schematic configuration diagram of an apparatus for performing a transfer process for transferring a conductive material composition onto a primer layer. .

  As shown in FIGS. 4 to 6, the method for producing an electromagnetic wave shield according to the present invention includes a conductive layer 3 formed in a predetermined pattern on one surface of a transparent substrate 1 and a range of 800 nm to 1100 nm. It is a manufacturing method of the electromagnetic wave shielding material 10 (refer FIG. 2) which has the near-infrared absorptivity which makes an infrared wavelength the transmittance | permeability 30% or less.

  The manufacturing method according to the first aspect includes a primer layer application step of applying and forming a primer layer 2 that includes a near-infrared absorbing material and can maintain fluidity until cured on one surface S1 of the transparent substrate 1, After applying the conductive material composition 15 capable of forming the conductive layer 3 after curing to the plate-like or cylindrical plate surface 63 in which the concave portions 64 are formed in a predetermined pattern, the conductive material composition adhered to the portions other than the concave portions. The conductive material composition filling step (see FIG. 4B) for scraping off the object and filling the concave portion 64 with the conductive material composition 15, and the primer layer 2 side of the transparent substrate 1 after the primer layer coating step And the concave part 64 side of the plate surface 63 after the conductive material composition filling step are pressure-bonded, and the primer layer 2 and the conductive material composition 15 in the concave portion 64 are brought into close contact with each other without a gap (FIG. 4C). And primer after the crimping process A primer layer curing step for curing the layer 2, and a transfer step for peeling the transparent base material 1 and the primer layer 2 from the plate surface 63 after the primer layer curing step and transferring the conductive material composition 15 in the recesses onto the primer layer 2 ( 4 (d)), and a conductive material composition curing step for curing the conductive composition layer 3 ′ formed in a predetermined pattern on the primer layer 2 to form the conductive layer 3 after the transfer step, , At least.

  Moreover, the manufacturing method which concerns on a 2nd aspect is the primer layer application | coating process which apply | coats and forms the primer layer 2 which can hold | maintain fluidity until it hardens | cures on one surface S1 of the transparent base material 1 while it contains a near-infrared absorptive material. Then, after applying the conductive material composition 15 capable of forming the conductive layer 3 after curing to the plate-like or cylindrical plate surface 63 in which the concave portions 64 are formed in a predetermined pattern, the conductive material adhered outside the concave portions. A conductive material composition filling step (see FIG. 4B) for scraping the material composition and filling the concave portion 64 with the conductive material composition 15, and a primer layer of the transparent substrate 1 after the primer layer coating step The crimping process (FIG. 4 (FIG. 4 ()) is performed by crimping the two sides and the concave part 64 side of the plate surface 63 after the conductive material composition filling process without gaps between the primer layer 2 and the conductive material composition 15 in the concave part 64. c)) and after the crimping process A simultaneous curing step (see FIG. 4 (c)) for simultaneously curing the immer layer 2 and the conductive material composition 15, and after the simultaneous curing step, the transparent substrate 1 and the primer layer 2 are peeled off from the plate surface 64 to be cured in the recesses. And a transfer step (see FIG. 4D) for transferring the conductive material composition 15 as the conductive layer 3 onto the primer layer 2.

  In the manufacturing method of the electromagnetic wave shielding material according to the first and second aspects, the conductive material composition 15 may be a conductive material composition capable of forming a conductive layer that can be electroplated after curing. In the said 1st aspect, the electroplating process of electroplating the metal layer 4 on the conductive layer 3 formed in the predetermined pattern on the primer layer 2 after a conductive material composition hardening process (refer FIG.4 (e)). You may comprise so that it may have further. Moreover, in the said 2nd aspect, you may comprise so that it may further have the plating process of electroplating the metal layer 4 on the conductive layer 3 formed in the predetermined pattern on the primer layer 2 after a transfer process.

  Hereinafter, each step will be described with reference to the drawings.

(Primer layer application process)
The primer layer coating step is a step of coating and forming on one surface S1 of the transparent substrate 1 a primer layer 2 that contains a near-infrared absorbing material and can maintain fluidity until it is cured. The primer layer 2 is formed by applying a primer layer resin composition on the transparent substrate 1, and since the primer layer resin composition is as described above, the description thereof is omitted here. The transparent substrate 1 having the primer layer 2 is formed by a coating method as shown in FIG. 5, and the primer layer 2 needs to maintain fluidity at the time of the press-bonding process described later.

  For example, when an ionizing radiation curable resin composition is used as the primer layer resin composition, only the solvent in the ionizing radiation curable resin composition is removed by drying in an unirradiated state where no ionizing radiation is irradiated. It is preferable to form a primer layer 2 made of a fluidized state on the transparent substrate 1 as a coating film, and to supply to the pressure-bonding step described later in that state. Of course, when the ionizing radiation curable resin composition used here is a so-called non-solvent type that does not contain a solvent, a drying step when forming the primer layer 2 is not necessary.

  Further, when a thermoplastic resin composition is used as the primer layer resin composition, the primer layer 2 may be heated immediately before the pressure bonding step as long as it is in a fluidized state by heating in the pressure bonding step described later. Alternatively, the heating of the primer layer 2 and the pressure bonding to the plate surface 63 may be performed simultaneously with a hot roll or the like.

  In addition, about the method of apply | coating a primer layer, various coating systems can be used, For example, it can select suitably from various systems, such as a gravure coat, a comma coat, a die coat, and a roll coat.

  The coating method shown in FIG. 5 is an example of a gravure reverse coat, and a film-like transparent substrate 1 wound in a roll shape is introduced between a gravure roll 51 and a backup roll 52 to ionize radiation curing for a primer layer. It is the method of apply | coating an adhesive resin composition. In this case, the gravure roll 51 comes into contact with the ionizing radiation curable resin composition filled container 53 at the lower side, and the ionizing radiation curable resin composition is pulled up and applied to one surface of the transparent substrate 1. At this time, excess ionizing radiation curable resin composition is scraped off by the doctor blade 54. After the ionizing radiation curable resin composition is applied on the transparent substrate 1, a drying treatment of the solvent contained in the resin composition is performed as necessary. This drying process is, for example, a process in which only the solvent in the ionizing radiation curable resin composition adjusted to a viscosity suitable for the coating apparatus is dried and removed to form a primer layer 2 in a fluid state for use in the subsequent pressure bonding process. is there. When a non-solvent type ionizing radiation curable resin composition having a viscosity suitable for a coating apparatus is used, a drying apparatus is unnecessary. The transparent substrate 1 having the primer layer 2 that retains fluidity is then supplied to the crimping process.

(Resin filling process)
In the resin filling step, as shown in FIGS. 4A and 4B, the conductive layer 3 is cured after being cured on a plate-like or cylindrical plate surface 63 in which concave portions 64 are formed in a predetermined pattern of mesh shape or stripe shape. In this step, the conductive material composition 15 that can be formed is applied, and then the conductive material composition adhering to the portion other than the inside of the concave portion is scraped to fill the concave portion with the conductive material composition 15. Since the conductive material composition 15 is as described above, the description thereof is omitted here.

  The combination of the conductive material composition with respect to the primer layer resin composition is not particularly limited, and the curing treatment of the primer layer resin composition may be different from the curing treatment of the conductive material composition. When an ionizing radiation curable resin containing conductive powder is employed as the material 15, the primer layer resin composition is also preferably an ionizing radiation curable resin composition. By using such a combination, the primer layer 2 and the conductive material composition layer 3 can be simultaneously cured by the ionizing radiation irradiation treatment in the pressure bonding step after the resin filling step and the subsequent curing step of the primer layer. Can do. At this time, since the conductive powder is generally colored, it can be cured by selecting an appropriate combination of a photopolymerization initiator and a photocurable resin when the ionizing radiation to be irradiated is light or ultraviolet rays. it can. Moreover, when irradiating an electron beam, it is not necessary to consider the color of the conductive powder.

  Note that the coating method shown in FIGS. 5 and 6 is an example of a process performed before the transparent base material 1 having the primer layer 2 is pressure-bonded to the intaglio roll 62. Specifically, the pickup roll 61 is conductive. The material composition filling container 68 is brought into contact with the lower side, and the conductive material composition 15 is pulled up and applied to the plate surface 63 of the intaglio roll 62. At this time, the conductive material composition 15 is scraped off by the doctor blade 65 so that the conductive material composition 15 does not get on the portion other than the concave portion 64 on the plate surface 63.

(Crimping process)
As shown in FIGS. 4C and 6, the pressure bonding process is performed by pressure bonding the concave portion 64 side of the plate surface 63 after the resin filling step and the primer layer 2 side of the transparent substrate 1 after the primer layer application step. In this step, the conductive material composition 15 in the recess 64 and the primer layer 2 are closely adhered without a gap. The pressure bonding is performed by the nip roll 66 and urged against the intaglio roll 62 with a predetermined pressure. The nip roll 66 is provided with a biasing pressure adjusting means, and the biasing pressure is arbitrarily adjusted according to the fluidity of the primer layer 2.

  When the primer layer 2 is a thermoplastic resin, the nip roll 66 is preferably a heatable roll. In this case, the primer layer 2 is softened and flowable by thermocompression bonding.

(Curing process)
The curing step is a step of curing the primer layer 2 after the pressure bonding step by the urging force of the nip roll 66, and the primer layer 2 and the conductive material composition 15 are in close contact with each other by performing a curing process after the pressure bonding. Can be cured. Specifically, when the resin composition for the primer layer is an ionizing radiation curable resin composition, it is irradiated with ionizing radiation in an irradiation zone (described as a UV zone in the example of FIG. 6) and cured. It is processed. In this case, the primer layer 2 is sandwiched between the transparent substrate 1 and the plate surface 63 and is not necessarily inhibited by the oxygen in the air, so that a nitrogen purge device or the like is not necessarily required. The curing treatment is selected in accordance with the types of the primer layer resin composition and the conductive material composition as described above, and is subjected to curing treatment such as ionizing radiation irradiation treatment and cooling treatment.

  As mentioned above, when both the resin composition for the primer layer and the conductive material composition are ionizing radiation curable resins, a simultaneous curing process is performed in which the ionizing radiation irradiation treatment is performed during the curing process following the crimping process. It can also be.

(Transfer process)
In the transfer step, as shown in FIG. 4 (d), after the curing step, the transparent base material 1 and the primer layer 2 are peeled off from the plate surface 63 of the intaglio roll 62, and the conductive material composition 15 in the recess 64 is placed on the primer layer 2. It is the process of transferring to. Since the primer layer 2 is cured in the primer layer curing step before this step, the conductive material composition in close contact with the primer layer 2 is obtained by peeling the transparent substrate 1 and the primer layer 2 from the plate surface 63 of the intaglio roll 62. The object 15 moves away from the inside of the concave portion and is neatly transferred onto the primer layer 2 to become a conductive material composition layer 3 ′. As shown in FIGS. 5 and 6, the peeling is performed by a nip roll 67 provided on the outlet side.

  In the transfer step, the conductive material composition 15 is not necessarily cured, and can be transferred even when the conductive material composition 15 contains a solvent. The reason for this is unknown at present, but the adhesive force between the primer layer 2 cured in a tightly adhered state and the conductive material composition 15 is such that the inner wall of the concave portion 64 of the intaglio roll and the conductive material composition This is presumed to be greater than the adhesion between the object 15 and the object 15.

FIG. 7 is a schematic view showing a form in which the primer layer 2 is filled in the recess 6 of the conductive material composition 15 in the recess 64 and the conductive material composition 15 is transferred. As shown in FIG. 7C, when the form of the primer layer 2 and the form of the conductive material composition layer 3 ′ after the transfer process are observed, the conductive material composition layer 3 ′ of the primer layer 2 is transferred. thickness T _a of the portion a, the conductive material composition layer 3 'is greater than the thickness T _B of the portion B which are not transferred. In the side edges 5 and 5 of the portion A with a large thickness, the conductive material composition layer 3 ′ wraps around the portion B with a small thickness. 7A and 7B show the primer layer 2 side of the transparent base material 1 on which the primer layer 2 retaining fluidity is formed and the concave portion 64 side of the plate surface 63 after the resin filling step. Since the primer layer 2 having fluidity is filled in the recesses 6 that are likely to be formed above the conductive material composition in the recesses 64, the form after the transfer is as shown in FIG. 7C. 'thickness T _a of the conductive material composition layer 3 of the portion a is formed' is not formed partially conductive material composition layer 3 of the primer layer 2 provided on the transparent substrate 1 greater than the thickness T _B of the B, furthermore, a thickness of greater portion a of the side edges 5 and 5 wrapping around conductive material composition layer 3 'on the side of the small portion B thicknesses form .

Usually, the thickness T _A of the primer layer 2 in the portion A of the conductive material composition layer 3 'is formed, as shown in FIG. 3, the thickness becomes thicker enough to go to the center portion of the part. That is, in the cross section of the electromagnetic shielding pattern portion (see, for example, FIG. 3), the cross-sectional shape of the primer layer 2 is a so-called semicircle, semi-ellipse, or the like that is convex toward the direction away from the transparent substrate 1. It has a bell-shaped shape, a triangular shape, a trapezoidal shape, a so-called mountain shape such as a pentagonal shape, or a similar shape.

  In addition, the interface between the primer layer 2 and the conductive material composition layer 3 ′ to the conductive layer 3 is not only in a form in which the primer layer 2 is merely physically or chemically bonded, but also in the vicinity of the interface, the materials of both layers are mutually connected. It may be dissolved, permeated or diffused. Either form can be realized by selecting materials for both layers and selecting manufacturing conditions. From the viewpoint of adhesion between the two layers, the latter form (form in which the materials of the two layers are mutually dissolved, permeated or diffused in the vicinity of the interface) is preferable.

  Since the electromagnetic shielding material 10 obtained by the manufacturing method of the present invention has such a form, it is said that there are no problems such as disconnection, shape failure, and adhesion due to poor transfer of the conductive material composition forming the conductive layer 3. There is an effect.

  In addition, after a transfer process, a drying process, a hardening process, etc. are performed as needed. Further, if it is necessary to further reduce the resistance, it is subjected to a subsequent plating step. The plating process may be provided in-line as it is, or may be supplied to a separate plating line after being wound up once.

(Plating process)
As shown in FIG. 4 (e) and FIG. 5, the plating process is performed after the transfer process, on the conductive layer 3 formed in a predetermined pattern on the primer layer 2 (same as the formation pattern of the primer layer 2). In this step, the layer 4 is electroplated. Examples of the metal to be plated include copper, silver, gold and the like, and copper plating having a low price and high conductivity is particularly preferable. A commercially available plating solution can be used as the copper plating solution, and among them, a copper plating solution with improved uniform plating properties is preferably employed. In addition, when subjected to the plating process, a normal pretreatment (for example, a cleaning process) is performed, but it may be supplied in-line from the transfer process as described above, or a separate plating line. May be provided. After the plating step, it is wound as it is after passing through other steps (for example, a blackening treatment step and a rust prevention step of the metal layer 4 and a formation step of the protective layer 9 as shown in FIG. 2) as necessary. Alternatively, it may be cut into a predetermined size to form a sheet.

  In this way, the roll-shaped or sheet-shaped electromagnetic shielding material 10 is manufactured. As described above, according to the method for manufacturing an electromagnetic shielding of the present invention, the primer layer 2 and the conductive layer 3 are in close contact with each other without a gap. Electromagnetic wave with both electromagnetic shielding properties and near-infrared absorption characteristics that does not cause problems such as disconnection, shape failure, and low adhesion due to poor transfer of the conductive layer 3 onto the primer layer 2 The shield material 10 can be manufactured at low cost. Further, since the transfer can be performed at a high transfer rate, the thickness of the conductive layer 3 can be increased, and the electromagnetic wave shielding property can be improved. Also, instead of providing a new layer as a near-infrared absorbing layer, the primer layer is used as a near-infrared absorbing layer, providing near-infrared absorptivity without increasing the number of steps for forming a new layer. Cost reduction.

[Filter for display]
FIG. 8 is a schematic cross-sectional view showing an example of a plasma display device having the display filter of the present invention. As shown in FIG. 8, the display filter 71 of the present invention includes at least the electromagnetic wave shielding material 10 of the present invention described above, and is provided on the front side (viewer side) of the plasma display device 70. That is, the electromagnetic wave shielding material 10 is provided as a part or all of the display filter 71, and may be used alone as the display filter 71. As shown in FIG. You may combine and use a member.

  As the functional member, conventionally known ones can be applied, and examples thereof include a neon light absorbing material, an ultraviolet absorbing material, an antireflection material, a hard coat material, an antifouling material, and an antiglare material. These functional members are one or more materials selected from, for example, a neon light absorbing material, an ultraviolet absorbing material, an antireflection material, a hard coat material, an antifouling material, and an antiglare material on the electromagnetic shielding material 10. May be formed as a coating composition in a layered form, or may be constituted by containing these materials in a transparent substrate.

  In an example shown in FIG. 8, a transparent base material 73 containing an ultraviolet absorbing material is bonded to the surface of the electromagnetic wave shielding material 10 on the conductive layer 3 side via an adhesive layer 72, and further on the transparent base material 73. A display filter 71 formed by coating an AR layer (antireflection layer) 74 is shown. The display filter 71 is bonded to the front side (viewer side) of the plasma display panel 76 via an adhesive layer 75. The display filter of the present invention is not limited to the configuration shown in FIG. 8, and may be in various other forms as long as it has part or all of the electromagnetic shielding material 10.

  According to such a display filter 71, the low-cost electromagnetic shielding material 10 having electromagnetic shielding properties and near infrared absorption properties is provided on the front side, so that unnecessary electromagnetic waves and near infrared rays generated from, for example, the plasma display panel 76 are externally transmitted. Can be shielded from leaking or radiating to other devices (for example, remote control devices such as remote control devices, information processing devices, DVDs, HDDs, game machines, etc.).

  Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples.

(Example 1)
An electromagnetic wave shielding material was manufactured by the apparatus shown in FIGS. First, as the transparent substrate 1, a long roll-wound polyethylene terephthalate (PET) film (Toyobo Co., Ltd., A4100) having a width of 1000 mm and a thickness of 100 μm subjected to easy adhesion treatment on one side was used. The PET film set in the supply part was drawn out, and the photocurable resin composition for the primer layer was applied and formed on the easy adhesion treatment surface so that the dry film thickness was 5 μm. The application method employs a normal gravure reverse method, and the photocurable resin composition includes 35 parts by weight of epoxy acrylate, 12 parts by weight of urethane acrylate, 44 parts by weight of monofunctional monomer, 9 parts by weight of trifunctional monomer, and light. 3 parts by weight of Irgacure 184 (Ciba Specialty Chemicals) as an initiator, and 5.28 parts by weight of a cesium tungsten composite oxide fine particle dispersion (Sumitomo Metal Mining Co., Ltd., YMF-02) as a near infrared absorbing material We used what we did. The viscosity at this time was about 1400 cps (at 25 ° C., B-type viscometer), and the primer layer 2 after application showed fluidity when touched, but did not flow down from the PET film.

  Next, the PET film on which the primer layer 2 in a fluidity maintaining state is formed is provided to an intaglio roll 62 for performing a transfer process. Prior to that, a grid-like mesh having a line width of 20 μm, a line pitch of 300 μm, and a plate depth of 10 μm. A silver paste (Fujikura Kasei Co., Ltd., FA-333), which is the conductive material composition 15, is applied to the plate surface 63 of the intaglio roll 62 on which a concave portion to be a pattern is formed, with the pickup roll 61, and the concave portion 64 with the doctor blade 65. The conductive material composition other than the inside was scraped off, and the conductive material composition 15 was filled only into the recess 64. A nip roll with respect to the intaglio roll 62 is provided by providing a PET film in which the primer layer 2 in a fluidity maintaining state is formed between the intaglio roll 62 filled with the conductive material composition 15 in the recess 64 and the nip roll 66. The primer layer 2 in the fluidity-maintaining state is caused to flow into the recess 6 of the conductive material composition 15 existing in the recess 64 by the pressing force (biasing force) of 66, and the fluidity-maintaining state is in contact with the conductive material composition 15. The primer layer 2 was brought into close contact with no gap.

  Next, the intaglio roll 62 is further rotated to be irradiated with ultraviolet rays from a UV lamp, and the primer layer 2 in a fluidity-holding state made of the photocurable resin composition is cured. Due to the curing of the primer layer 2, the conductive material composition in the recess 64 of the intaglio roll 62 comes into close contact with the cured primer layer 2, and then the film is peeled from the intaglio roll 62 by the nip roll 67 on the outlet side. A conductive material composition layer 3 ′ (see FIG. 4) is transferred and formed thereon. The transfer film thus obtained was passed through a drying zone at 110 ° C. to evaporate the solvent of the silver paste, thereby forming a conductive layer 3 having a mesh pattern on the primer layer 2. The thickness of the conductive layer 3 at this time (thickness difference between the mesh pattern portion on which the conductive layer 3 is formed and the other portions) is about 9 μm, and the silver paste in the concave portion 64 of the plate has a high transition. It was metastasized at a rate. Moreover, neither disconnection nor shape defect was seen.

Subsequently, copper plating was performed with respect to the obtained transfer film. As a copper plating method, the obtained transfer film is immersed in a copper sulfate plating solution, and a current of ² A / dm ² is applied with a mesh-like conductive layer pattern formed on the surface as a cathode and a copper plate as an anode. Electrolytic copper plating was performed. The copper plating film was selectively formed on the conductive layer 3 with a thickness of 2 μm. Thus, the electromagnetic shielding material of Example 1 according to the present invention was produced.

(Example 2)
In Example 1, as a near-infrared absorbing material, instead of the cesium tungsten composite oxide dispersion, phthalocyanine-based near-infrared absorbing dye eXcolor IR-12 (Nippon Shokubai Co., Ltd.), 0.63 parts by mass, IR Electromagnetic wave shield of Example 2 except that 0.36 parts by mass of -14 (Nippon Catalysts Co., Ltd.) and 0.88 parts by mass of IR-910 (Nippon Catalysts Co., Ltd.) were used. A material was prepared. The viscosity at this time was about 700 cps (at 25 ° C., B-type viscometer), and the primer layer 2 after application showed fluidity when touched, but did not flow down from the PET film. In the obtained electromagnetic shielding material, the thickness of the conductive layer was about 9 μm, and the silver paste in the concave portion 64 of the plate was transferred with a high transition rate. Moreover, neither disconnection nor shape defect was seen.

(Comparative Example 1)
In Example 1, an intaglio roll that preliminarily coats and forms a cured primer layer containing a near-infrared absorbing material on the easy-adhesion treated surface of the PET film, and performs a transfer process on the PET film on which the cured primer layer 2 is formed. The conductive material composition was transferred in the same manner as in Example 1 except that it was subjected to No. 62. However, at that time, the transfer of the conductive material composition onto the PET film was not sufficient, and disconnection and pattern loss occurred frequently. Further, the pattern thickness after drying was about 1 μm, and the transfer rate was extremely poor. Subsequent electrolytic copper plating could not be uniformly plated. The reason for this is that when the conductive material composition other than the recess 64 is removed by the doctor blade 65, the conductive material composition 15 is scraped out from the recess 64, and the conductive material composition in the recess 64. The object 15 has a dent 6, which is considered to be because the conductive material composition 15 is not transferred onto the PET film with good adhesion due to the presence of the dent 6.

(Evaluation results)
About the electromagnetic wave shielding material produced in Examples 1, 2 and Comparative Example 1, the near-infrared absorptivity and electromagnetic wave shielding property were evaluated. Near-infrared absorptivity uses a spectrophotometer (manufactured by Shimadzu Corporation, UV-3100PC) to measure the transmittance of near-infrared wavelengths in the range of 800 nm to 1100 nm, and uses the average value of the obtained transmittance. It was. As a result, the transmittance of the electromagnetic shielding material of Example 1 was 7%, and the transmittance of the electromagnetic shielding material of Example 2 was 5%. Moreover, the electromagnetic wave shielding property was measured using a shielding material evaluator (manufactured by Advantest Corporation, TR17301A). As a result, the electromagnetic shielding materials of Examples 1 and 2 had good shielding characteristics of about −30 dB or less in the range of 200 to 600 MHz.

It is a typical top view which shows an example of the electromagnetic wave shielding material of this invention. It is an enlarged view of the A-A 'cross section in FIG. It is typical sectional drawing which expands and shows a part of FIG. It is process drawing which shows an example of the manufacturing method of the electromagnetic wave shield of this invention. It is a schematic block diagram of the apparatus which enforces the manufacturing method of this invention. It is a schematic block diagram of the apparatus which implements the transfer process which transcribe | transfers an electroconductive material composition on a primer layer. It is a schematic diagram which shows the form which fills the dent of the electroconductive material composition in a recessed part with a primer layer, and the electroconductive material composition transfers. It is typical sectional drawing which shows an example of the plasma display apparatus which has the filter for displays of this invention. It is explanatory drawing of the conventional phenomenon which the non-transfer part of an electroconductive ink composition generate | occur | produces on a transparent base material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transparent base material 2 Primer layer 3 Conductive layer 3 'Conductive material composition layer 4 Metal layer 5 Side edge 6 Recess 7 Electromagnetic wave shielding pattern part 8 Grounding part 9 Protective layer 10 Electromagnetic wave shield material 15 Conductive material composition 51 Gravure roll 52 Backup Roll 53 Resin Composition Filling Container 54 Doctor Blade 61 Pickup Roll 62 Intaglio Roll 63 Plate Surface 64 Recess 65 Doctor Blade 66 Nip Roll 67 Nip Roll 68 Filling Container 70 Plasma Display Device 71 Display Filter 72 Adhesive Layer 73 Transparent Substrate 74 AR Layer 75 Adhesive layer 76 Plasma display panel A A portion where a conductive layer is formed T _A A thickness B A portion where a conductive layer is not formed T _B B thickness

Claims (11)

An electromagnetic shielding material having a transparent substrate, a primer layer formed on the transparent substrate, and a conductive layer made of a conductive material composition formed in a predetermined pattern on the primer layer,
The thickness of the portion where the conductive layer is formed in the primer layer is larger than the thickness of the portion where the conductive layer is not formed,
The electromagnetic wave shielding material, wherein the primer layer contains a near-infrared absorbing material that absorbs near-infrared wavelengths in the range of 800 nm to 1100 nm.   The electromagnetic shielding material according to claim 1, wherein the near-infrared absorbing material is a cesium tungsten composite oxide or a phthalocyanine compound.   The electromagnetic wave shielding material according to claim 1 or 2, wherein the primer layer is a layer made of an ionizing radiation curable resin or a thermoplastic resin.   A display filter comprising the electromagnetic wave shielding material according to claim 1, and provided on the front side of the display. A method for producing an electromagnetic wave shielding material having near infrared absorptivity in which a conductive layer is formed in a predetermined pattern on one surface of a transparent substrate and absorbs near infrared wavelengths in the range of 800 nm to 1100 nm. ,
A primer layer coating step for coating and forming a primer layer that contains a near-infrared absorbing material and can maintain fluidity until cured on one surface of the transparent substrate;
After applying a conductive material composition capable of forming a conductive layer after curing on a plate-like or cylindrical plate surface in which concave portions are formed in a predetermined pattern, the conductive material composition adhering outside the concave portions is scraped. A conductive material composition filling step of taking and filling the conductive material composition in the recess;
The primer layer side of the transparent substrate after the primer layer coating step and the concave side of the plate surface after the conductive material composition filling step are pressure-bonded, and the primer layer and the conductive material composition in the concave portion are A crimping process that adheres without gaps;
A primer layer curing step of curing the primer layer after the crimping step;
A transfer step of peeling off the transparent base material and the primer layer from the plate surface after the primer layer curing step, and transferring the conductive material composition in the recesses onto the primer layer;
A conductive material composition curing step of curing a conductive material composition formed in a predetermined pattern on the primer layer to form a conductive layer after the transfer step; Manufacturing method. In the conductive material composition filling step, the conductive material composition is a composition that can form a conductive layer that can be electroplated after curing,
The manufacturing method of the electromagnetic wave shielding material of Claim 5 which has a plating process of electroplating a metal layer on the conductive layer formed in the predetermined pattern on the said primer layer after the said conductive material composition hardening process. A method for producing an electromagnetic wave shielding material having near infrared absorptivity in which a conductive layer is formed in a predetermined pattern on one surface of a transparent substrate and absorbs near infrared wavelengths in the range of 800 nm to 1100 nm. ,
A primer layer coating step for coating and forming a primer layer that contains a near-infrared absorbing material and can maintain fluidity until cured on one surface of the transparent substrate;
After applying a conductive material composition capable of forming a conductive layer after curing on a plate-like or cylindrical plate surface in which concave portions are formed in a predetermined pattern, the conductive material composition adhering outside the concave portions is scraped. A conductive material composition filling step of taking and filling the conductive material composition in the recess;
The primer layer side of the transparent substrate after the primer layer coating step and the concave side of the plate surface after the conductive material composition filling step are pressure-bonded, and the primer layer and the conductive material composition in the concave portion are A crimping process that adheres without gaps;
A simultaneous curing step of simultaneously curing the primer layer and the conductive material composition after the crimping step;
A transfer step of peeling off the transparent base material and the primer layer from the plate surface after the simultaneous curing step and transferring the conductive material composition in the recess as a conductive layer onto the primer layer. Manufacturing method of electromagnetic shielding material. In the conductive material composition filling step, the conductive material composition is a composition that can form a conductive layer that can be electroplated after curing,
The manufacturing method of the electromagnetic wave shielding material of Claim 7 which has the plating process of electroplating a metal layer on the conductive layer formed in the predetermined pattern on the said primer layer after the said transfer process.   The electromagnetic wave according to claim 5, wherein the primer layer is a layer made of an ionizing radiation curable resin or a thermoplastic resin, and the fluidity of the primer layer is maintained by non-irradiation of ionizing radiation or heating. A method for manufacturing a shield material.   The electromagnetic shielding material according to any one of claims 5 to 8, wherein the conductive material composition comprises a conductive powder and a resin, and the resin is a thermoplastic resin, an ionizing radiation curable resin, or a thermosetting resin. Manufacturing method.   The thickness of the portion of the primer layer to which the conductive material composition has been transferred after the transfer step is greater than the thickness of the portion to which the conductive material composition has not been transferred. The manufacturing method of the electromagnetic wave shielding material in any one of.

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