JP2009037232A5 - - Google Patents

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Publication number
JP2009037232A5
JP2009037232A5 JP2008177748A JP2008177748A JP2009037232A5 JP 2009037232 A5 JP2009037232 A5 JP 2009037232A5 JP 2008177748 A JP2008177748 A JP 2008177748A JP 2008177748 A JP2008177748 A JP 2008177748A JP 2009037232 A5 JP2009037232 A5 JP 2009037232A5
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JP
Japan
Prior art keywords
photosensitive paste
paste composition
composition according
alkali
pattern
Prior art date
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Application number
JP2008177748A
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Japanese (ja)
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JP4640460B2 (en
JP2009037232A (en
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Publication date
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Priority to JP2008177748A priority Critical patent/JP4640460B2/en
Priority claimed from JP2008177748A external-priority patent/JP4640460B2/en
Publication of JP2009037232A publication Critical patent/JP2009037232A/en
Publication of JP2009037232A5 publication Critical patent/JP2009037232A5/ja
Application granted granted Critical
Publication of JP4640460B2 publication Critical patent/JP4640460B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (7)

５０重量％粒子径（Ｄ５０）が２．０〜２０．０μｍであるアルミニウム粉末（Ａ）、
アルカリ可溶性樹脂（Ｃ）、
多官能（メタ）アクリレート（Ｄ）、および
光重合開始剤（Ｅ）を含有することを特徴とする感光性ペースト組成物。 Aluminum powder (A) having a 50 wt% particle size (D50) of 2.0 to 20.0 µm,
Alkali-soluble resin (C),
A photosensitive paste composition comprising a polyfunctional (meth) acrylate (D) and a photopolymerization initiator (E). 前記アルミニウム粉末（Ａ）の含有量が、感光性ペースト組成物全体に対して、１５〜７０重量％であることを特徴とする請求項１に記載の感光性ペースト組成物。2. The photosensitive paste composition according to claim 1, wherein the content of the aluminum powder (A) is 15 to 70 wt% with respect to the entire photosensitive paste composition. 前記アルカリ可溶性樹脂（Ｃ）が、その全構成単位中、カルボキシル基含有モノマー類、水酸基含有モノマー類およびフェノール性水酸基含有モノマー類から選択される少なくとも１種のアルカリ可溶性官能基含有モノマー（Ｃ１）由来の構成単位を５〜９０重量％含有する樹脂であることを特徴とする請求項１または２に記載の感光性ペースト組成物。The alkali-soluble resin (C) is derived from at least one alkali-soluble functional group-containing monomer (C1) selected from carboxyl group-containing monomers, hydroxyl group-containing monomers, and phenolic hydroxyl group-containing monomers in all the structural units. The photosensitive paste composition according to claim 1, which is a resin containing 5 to 90% by weight of the structural unit. 前記アルカリ可溶性樹脂（Ｃ）の酸価が、２０〜２００ｍｇＫＯＨ／ｇであることを特徴とする請求項１〜３の何れか一項に記載の感光性ペースト組成物。The photosensitive paste composition according to any one of claims 1 to 3, wherein the acid value of the alkali-soluble resin (C) is 20 to 200 mgKOH / g. さらに５０重量％粒子径（Ｄ５０）が０．２〜４．０μｍであるガラス粉末（Ｂ）を含有することを特徴とする請求項１〜４の何れか一項に記載の感光性ペースト組成物。 The photosensitive paste composition according to any one of claims 1 to 4, further comprising glass powder (B) having a 50 wt% particle size (D50) of 0.2 to 4.0 µm. . 前記ガラス粉末（Ｂ）として、軟化点が３５０〜７００℃であるガラス粉末を、感光性ペースト組成物全体に対して０．５〜１５重量％の割合で含有することを特徴とする請求項５に記載の感光性ペースト組成物。 As the glass powder (B), claim softening point of the glass powder is 350 to 700 ° C., characterized in that it contains a proportion of 0.5 to 15 wt% based on the total photosensitive paste composition 5 The photosensitive paste composition described in 1. 請求項１〜６の何れか一項に記載の感光性ペースト組成物からなる感光性ペースト層を基板上に形成する工程、
該ペースト層を露光処理してパターンの潜像を形成する工程、
該ペースト層を現像処理してパターンを形成する工程、および
該パターンを焼成処理する工程
をこの順で含むことを特徴とするパターン形成方法。 Forming a photosensitive paste layer comprising the photosensitive paste composition according to any one of claims 1 to 6 on a substrate;
A step of exposing the paste layer to form a latent image of a pattern;
A pattern forming method comprising: a step of developing the paste layer to form a pattern; and a step of baking the pattern in this order .
JP2008177748A 2007-07-09 2008-07-08 Photosensitive paste composition and pattern forming method Expired - Fee Related JP4640460B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008177748A JP4640460B2 (en) 2007-07-09 2008-07-08 Photosensitive paste composition and pattern forming method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007179179 2007-07-09
JP2008177748A JP4640460B2 (en) 2007-07-09 2008-07-08 Photosensitive paste composition and pattern forming method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010228531A Division JP4645774B1 (en) 2007-07-09 2010-10-08 Photosensitive paste composition and pattern forming method

Publications (3)

Publication Number Publication Date
JP2009037232A JP2009037232A (en) 2009-02-19
JP2009037232A5 true JP2009037232A5 (en) 2010-08-26
JP4640460B2 JP4640460B2 (en) 2011-03-02

Family

ID=40307395

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008177748A Expired - Fee Related JP4640460B2 (en) 2007-07-09 2008-07-08 Photosensitive paste composition and pattern forming method
JP2010228531A Expired - Fee Related JP4645774B1 (en) 2007-07-09 2010-10-08 Photosensitive paste composition and pattern forming method

Family Applications After (1)

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JP2010228531A Expired - Fee Related JP4645774B1 (en) 2007-07-09 2010-10-08 Photosensitive paste composition and pattern forming method

Country Status (3)

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JP (2) JP4640460B2 (en)
KR (1) KR101106921B1 (en)
CN (1) CN101354533B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120119B2 (en) * 2008-07-10 2013-01-16 Ｊｓｒ株式会社 Photosensitive paste composition and pattern forming method
JP5120120B2 (en) * 2008-07-15 2013-01-16 Ｊｓｒ株式会社 Photosensitive paste composition and pattern forming method
JP2010102200A (en) * 2008-10-24 2010-05-06 Jsr Corp Photosensitive paste composition and pattern forming method
KR101138795B1 (en) * 2008-12-23 2012-04-24 제일모직주식회사 Photosensitive composition and plasma display electrode fabricated using the same
JP5287397B2 (en) * 2009-03-18 2013-09-11 Ｊｓｒ株式会社 Aluminum-containing photosensitive resin composition and pattern forming method
JP5347665B2 (en) * 2009-04-07 2013-11-20 Ｊｓｒ株式会社 Aluminum-containing photosensitive composition and method for producing electrode
JP2011007864A (en) * 2009-06-23 2011-01-13 Jsr Corp Photosensitive paste composition and pattern forming method
CN103295659B (en) * 2012-02-24 2016-03-30 比亚迪股份有限公司 Conductive paste for solar cell and preparation method thereof
JP5884556B2 (en) * 2012-03-02 2016-03-15 東レ株式会社 Photosensitive conductive paste
WO2013165223A1 (en) * 2012-05-03 2013-11-07 주식회사 엘지화학 Ink composition capable of being used in manufacturing solar cells and pattern formation method using same
KR101431485B1 (en) * 2012-05-03 2014-08-26 주식회사 엘지화학 Ink composition for use in manufacturing of solar cell and pattern forming process using the composition
KR101765707B1 (en) 2012-06-15 2017-08-07 가부시키가이샤 무라타 세이사쿠쇼 Conductive paste, and laminated ceramic electronic component and method for producing same
CN113196170A (en) * 2018-10-03 2021-07-30 艾曲迪微系统股份有限公司 Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component
JP7238316B2 (en) * 2018-10-03 2023-03-14 Ｈｄマイクロシステムズ株式会社 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENTS

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3510761B2 (en) * 1997-03-26 2004-03-29 太陽インキ製造株式会社 Alkali-developing photocurable conductive paste composition and plasma display panel formed with electrodes using the same
KR100669725B1 (en) * 2004-09-09 2007-01-16 삼성에스디아이 주식회사 A photosensitive paste composition
JP2006126354A (en) * 2004-10-27 2006-05-18 Sumitomo Bakelite Co Ltd Photosensitive resin composition and method for producing pattern forming resin layer, and semiconductor device and display element containing photosensitive resin composition
JP2006219660A (en) * 2005-01-11 2006-08-24 Jsr Corp Inorganic powder-containing resin composition, transfer film, and method for producing plasma display panel
JP4253306B2 (en) * 2005-03-01 2009-04-08 太陽インキ製造株式会社 Photosensitive paste and fired product pattern formed using the same

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