JP2009031192A5 - - Google Patents

Description

Probe card and probe card manufacturing method

  The present invention relates to a probe card and a method for manufacturing the probe card.

  Probe cards used in recent semiconductor test equipment are equipped with a substrate and a reinforcing plate as standard specifications.

The advanced probe card has a structure including a ceramic substrate (first substrate) for probe mounting, signal fine-out, and the like while leaving the above-described substrate and reinforcing plate.

The advanced probe card having such a structure is composed of a plurality of substrates, and the conventional substrate and the ceramic substrate have the same function. As a result, the probe card has a very redundant and complicated structure. ing.

  In addition, since the ceramic substrate is very expensive and cannot be reused, the cost of the probe card is affected.

  As described above, in the probe card having a structure in which the number of substrates is successively increased in order to satisfy the required performance, there is a problem that the manufacturing process and the manufacturing cost are wasted, and the probe card is complicated and increases in size. is there.

  In addition, although the ceramic substrate is expensive, its versatility is low, so it is difficult to reuse it, and it is necessary to newly manufacture it in accordance with the change in the specification of the probe card.

In view of the above problems, an object of the present invention is to provide a probe card having a structure similar to a conventional cantilever type at a low cost by using a versatile and reusable ceramic substrate. To do.

The probe card of the present invention includes a conductive member in a layer, an anisotropic conductive member that forms a conductive path by being pressed from the front and back, a conductive portion protruding on the surface, and the surface is anisotropic A first substrate attached to one surface of the conductive member, a probe substrate in which an electrode is formed at a predetermined position on the surface, and the surface is attached to the other surface of the anisotropic conductive member, and the probe A probe bonded to the back surface at a predetermined position corresponding to the electrode of the substrate is provided.

The first substrate is provided with a number of conductive parts that cover the maximum number of the same measurements, and the probe board is provided with the electrodes arranged by selecting necessary portions from the conductive parts. It is preferable.

  The probe substrate is preferably divided into a plurality of parts.

The probe card manufacturing method of the present invention is a probe card manufacturing method comprising a probe substrate to which a probe is bonded, a first substrate, and an anisotropic conductive member, and protrudes from the surface of the first substrate. A conductive portion is provided, an electrode is provided at a predetermined position facing the conductive portion on the surface of the probe substrate, and a surface of the first substrate on which the conductive portion is provided and a surface on which the electrode of the probe substrate is provided. Pressure is applied with an anisotropic conductive member sandwiched between the first substrate and the probe substrate with the anisotropic conductive member, and then the probe is mounted on the probe substrate. .

Then, it is preferable that the surface of the probe substrate and / or the first substrate is polished after the first substrate and the probe substrate are joined by the anisotropic conductive member.

  Moreover, it is preferable to set the electrode formation position of the said probe board | substrate based on the pad mask used for electrode formation of the semiconductor device used as a measuring object.

The probe card of the present invention includes a conductive member in a layer, an anisotropic conductive member that forms a conductive path by being pressed from the front and back, a conductive portion protruding on the surface, and the surface is anisotropic A first substrate attached to one surface of the conductive member, a probe substrate in which an electrode is formed at a predetermined position on the surface, and the surface is attached to the other surface of the anisotropic conductive member, and the probe By providing a probe bonded to the back surface at a predetermined position corresponding to the electrode on the substrate, a probe card having a simpler structure becomes possible. Furthermore, the first substrate is used as a general-purpose circuit substrate and can be used for various inspection objects. Therefore, it is possible to reduce the cost of the probe card.

The first substrate is provided with a number of conductive parts that cover the maximum number of the same measurements, and the probe board is provided with the electrodes arranged by selecting necessary portions from the conductive parts. As a result, the versatility of the first substrate is enhanced, the probe substrate can be made a dedicated product that matches the inspection object, and the first substrate can be diverted and reused for various inspection objects. Thus, the manufacturing cost of the probe card can be greatly reduced.

  Further, since the probe board is divided into a plurality of parts, the divided probe boards can be combined as necessary, and a probe board that can handle various inspection objects is possible.

The probe card manufacturing method of the present invention is a probe card manufacturing method comprising a probe substrate to which a probe is bonded, a first substrate, and an anisotropic conductive member, and protrudes from the surface of the first substrate. A conductive portion is provided, an electrode is provided at a predetermined position facing the conductive portion on the surface of the probe substrate, and a surface of the first substrate on which the conductive portion is provided and a surface on which the electrode of the probe substrate is provided. It is easier to press with the anisotropic conductive member sandwiched between the first substrate and the probe substrate with the anisotropic conductive member, and then mount the probe on the probe substrate. A probe card having a simple structure can be manufactured, and a probe card can be manufactured at low cost by eliminating the need for a reinforcing plate.

Then, after the first substrate and the probe substrate are joined by the anisotropic conductive member, the surface of the probe substrate and / or the first substrate is polished to smooth the probe substrate and the first substrate. It is possible to improve the performance, improve the workability of the subsequent process, and improve the accuracy of the probe card.

  In addition, the manufacturing cost can be further reduced by setting the electrode formation position of the probe substrate based on the pad mask used for forming the electrode of the semiconductor device to be measured.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, the probe card 1 and the method for manufacturing the probe card 1 of the present invention will be described in detail with reference to the drawings. First, the probe card 1 will be described.

  FIG. 1 is a schematic cross-sectional view of the probe card 1 according to the first embodiment of the present invention. In each drawing, in order to make the structure of the probe card 1 easy to understand, the scale in the thickness direction is ignored, and in particular, the thickness of the anisotropic conductive member 4 is expressed thicker than the ceramic substrate 2 and the probe substrate 3. is doing.

  The probe card 1 of the present invention includes a probe substrate 3, a ceramic substrate 2, and an anisotropic conductive member 4 to which a probe 5 is bonded. The ceramic substrate 2 and the probe substrate 3 are joined by the anisotropic conductive member 4.

  The ceramic substrate 2 is provided with a conductive portion 6 that protrudes from a joint surface with the probe substrate 3 and is electrically connected to an external connection electrode 11 provided on a surface opposite to the joint surface of the ceramic substrate 2. ing. The conductive part 6 uses bumps formed of gold, solder or the like.

  An electrode 7 is provided at a predetermined position on the joint surface of the probe substrate 3 with the ceramic substrate 2 facing the conductive portion 6, and the probe 5 is provided on the back surface of the probe substrate 3 at a predetermined position corresponding to the electrode 7. It is joined. The electrode 7 is electrically connected to the probe 5 by a through electrode 8 and a pattern wiring 9.

  The ceramic substrate 2 and the probe substrate 3 are joined by the anisotropic conductive member 4. The ceramic substrate 2 and the probe substrate 3 are pressed with the anisotropic conductive member 4 sandwiched therebetween. To join.

  The anisotropic conductive member 4 includes a conductive member in a layer and forms a conductive path by being pressed from the front and back sides. The anisotropic conductive member 4 is sandwiched between the ceramic substrate 2 and the probe substrate 3. When the anisotropic conductive member 4 is pressurized, the anisotropic conductive member 4 includes the protruding conductive portion 6 provided on the ceramic substrate 2 and the electrode 7 provided on the probe substrate 3. When the portion sandwiched between the electrodes is compressed by receiving pressure from the surroundings, the pressurized portion acts as the conductive path 10 and allows the conductive portion 6 and the electrode 7 to conduct.

  Thus, in the probe card 1 of the present invention, the anisotropic conductive member 4 has a structure that allows not only the bonding of the ceramic substrate 2 and the probe substrate 3 but also the conduction, and such a structure is adopted. Thus, a probe card having a simpler structure than that of the prior art is possible.

  Next, the probe card 1 according to the second embodiment shown in FIG. 2 will be described.

  The probe card 1 according to the second embodiment is provided with the same number of protruding conductive portions 6 as the maximum number of simultaneous measurements in consideration of the maximum number of types of semiconductor devices assumed as inspection targets of the probe card 1. Keep it.

  Further, the probe substrate 3 is provided with a number of electrodes 7 required for a device to be measured at a predetermined position. At this time, the electrode 7 is provided at a position facing one of the conductive portions 6. Then, similarly to the first embodiment, the ceramic substrate 2 and the probe substrate 3 are pressed by pressing the anisotropic conductive member 4 between the ceramic substrate 2 and the probe substrate 3. Bonding is performed by the anisotropic conductive member 4.

  In the probe card 1 of the present embodiment, as shown in FIG. 2, in the anisotropic conductive member 4, the portion where the electrode 7 facing the conductive portion 6 is present is the same as in the first embodiment. A conductive path 10 is formed in a portion pressed by the conductive portion 6 and the electrode 7, and the conductive portion 6 and the electrode 7 are electrically connected, but there is no portion where the electrode 7 facing the conductive portion 6 is present. Then, the conductive path 10 is not formed and is not conducted to the unnecessary conductive portion 6.

  By using the configuration as in this embodiment, the versatility of the ceramic substrate 2 is increased, and the ceramic substrate 2 can be made a general-purpose product that can be used for various semiconductor devices. It can be a dedicated product tailored to the semiconductor device.

  As a result, conventionally, when the semiconductor device to be inspected is changed, it is necessary to replace the probe substrate 3 and the ceramic substrate 2 with a new structure. In the probe card 1 of the present invention, It is possible to replace only the probe substrate 3 and reuse the ceramic substrate 2 used so far.

  As a method of reusing the ceramic substrate 2, the probe substrate 3 that is no longer needed is removed from the probe card 1 by polishing or the like, and the anisotropic conductive member 4 remaining on the surface of the ceramic substrate 2 is removed by chemicals or the like. To remove. As a result, the ceramic substrate 2 and the conductive portion 6 disposed on the surface thereof remain. A new probe substrate 3 having a different electrode 7 arrangement from the probe substrate 3 used so far is joined to the ceramic substrate 2 in such a state again using a new anisotropic conductive member 4.

  By such a method, the ceramic substrate 2 in the present invention can be reused any number of times. Thus, it becomes possible to reduce the manufacturing cost of the probe card 1 of the present invention by increasing the versatility of the expensive ceramic substrate and making it reusable.

  Although the probe substrate 3 used in the probe card 1 of the first embodiment and the second embodiment has been described as a single substrate, a substrate obtained by dividing the probe substrate 3 into a plurality of substrates can be used. .

  Next, the manufacturing method of the probe card 1 of this invention is demonstrated using figures.

  First, as shown in FIG. 3, a conductive portion 6 protruding from the joint surface of the ceramic substrate 2 to the probe substrate 3 is provided, and the conductive portion 6 is electrically connected to the surface opposite to the joint surface of the ceramic substrate 2. An external connection electrode 11 to be connected is provided. At this time, the conductive portion 6 is provided with the same number of the conductive portions 6 as the maximum number of simultaneous measurements in consideration of the maximum number of types of semiconductor devices assumed as inspection objects of the probe card 1. . The conductive part 6 is formed of gold, solder or the like.

Further, as shown in FIG. 4, the number of electrodes 7 necessary for the device to be measured is provided on the bonding surface of the probe substrate 3. At this time, the electrode 7 is disposed at a predetermined position facing one of the conductive portions 6. Further, the probe substrate 3 is provided with a through electrode 8 and a pattern wiring 9. The through electrode 8 is formed by filling a through hole with plating or a conductive paste.

The ceramic substrate 2 and the probe substrate 3 obtained in this way are joined using an anisotropic conductive member 4. As shown in FIG. 5, pressure is applied with the anisotropic conductive member 4 sandwiched between the ceramic substrate 2 and the probe substrate 3. Thereby, as shown in FIG. 6, the ceramic substrate 2 and the probe substrate 3 are joined by the anisotropic conductive member 4.

Since the anisotropic conductive member 4 includes a conductive member in a layer and forms a conductive path by being pressed from the front and back, the anisotropy between the ceramic substrate 2 and the probe substrate 3 is formed. When the conductive member 4 is pressurized, the anisotropic conductive member 4 is sandwiched between the protruding conductive portion 6 provided on the ceramic substrate 2 and the electrode 7 provided on the probe substrate 3. As a result, the conductive path 10 is formed by compressing the portion that receives pressure from the surroundings, and the conductive path 10 allows the conductive portion 6 and the electrode 7 to be electrically connected.

Further, the surface of each substrate in which the ceramic substrate 2 and the probe substrate 3 are joined by the anisotropic conductive member 4 is uneven at the portion where the conductive portion 6 or the electrode 7 is disposed. In particular, since the surface of the probe substrate 3 is required to have a high degree of flatness, the surface of the probe substrate 3 with the unevenness is polished and finished smooth. In some cases, the surface of the ceramic substrate 2 is also polished and finished smooth.

The probe 5 is joined by soldering to the back surface of the probe substrate 3 polished in this way at a predetermined position corresponding to the electrode 7. And the probe card 1 of this invention is completed.

When forming the electrodes of the probe substrate 3, it is preferable to set the positions where the electrodes 7 are formed based on a pad mask used for forming the electrodes of the semiconductor device to be measured. Thereby, it becomes easy to arrange the electrode 7 at the same position as the device arranged on the semiconductor wafer to be measured, and the manufacturing cost of the probe substrate 3 can be suppressed.

When such a probe substrate 3 is used, the probe substrate 3 is not set so that the semiconductor wafer to be measured and the probe substrate 3 overlap each other, but the beam length of the probe 5 is taken into consideration, and the probe substrate is set by the beam length. 3 needs to be offset.

Next, the case where the divided probe substrate 3 is used will be described. When the probe substrate 3 divided into a plurality of parts is used, the probe substrate 3 in the divided state is joined to the ceramic substrate 2 by the anisotropic conductive member 4.

When the divided probe substrates 3 are bonded, the divided probe substrates 3 are bonded at a predetermined interval. This interval is matched with the width of the scribe line of the semiconductor wafer to be measured. The dividing line of the probe substrate 3 is aligned with any of the scribe lines.

By arranging the dividing lines of the probe substrate 3 as described above and using the anisotropic conductive member 4 having a linear expansion coefficient close to that of the probe substrate 3, a semiconductor wafer to be measured It is possible to follow the thermal expansion.

As described above, the probe card 1 of the present invention can connect a ceramic substrate and a probe substrate using an anisotropic conductive member, so that a reinforcing plate is unnecessary and a probe card having a simpler structure than the conventional one can be realized. Become.

In addition, by using an expensive ceramic substrate as a general-purpose circuit board and a probe substrate as a dedicated product according to the type of semiconductor wafer to be inspected, it becomes possible to handle various inspection objects with a single ceramic substrate. This has a great effect on cost reduction of the card.

Further, since the ceramic substrate can be reused from such a structure, it is possible to cope with a change in the specification of the probe card at a low cost.

Since the size of the probe card of the present invention is slightly larger than the mechanism for holding the card and the mechanism for holding the wafer, the semiconductor inspection apparatus can be miniaturized.

It is a schematic sectional drawing of the probe card of the 1st Embodiment of this invention. It is a schematic sectional drawing of the probe card of the 2nd Embodiment of this invention. It is a schematic sectional drawing of a ceramic substrate. It is a schematic sectional drawing of a probe board | substrate. It is a schematic sectional drawing which shows the state before pressurizing a ceramic substrate, an anisotropic conductive member, and a probe substrate. It is a schematic sectional drawing which shows the state after pressurizing a ceramic substrate, an anisotropic conductive member, and a probe board | substrate.

DESCRIPTION OF SYMBOLS 1 Probe card 2 Ceramic substrate 3 Probe substrate 4 Anisotropic conductive member 5 Probe 6 Conductive part 7 Electrode 8 Through electrode 9 Pattern wiring 10 Conductive part 11 External connection electrode

Claims (6)

An anisotropic conductive member that includes a conductive member in the layer and forms a conductive path by being pressed from the front and back sides,
A first substrate provided with a conductive portion projecting on a surface, wherein the surface is attached to one surface of the anisotropic conductive member;
An electrode is formed at a predetermined position of the surface, and the surface is attached to the other surface of the anisotropic conductive member;
And a probe card having a probe bonded to the back surface at a predetermined position corresponding to the electrode of the probe substrate. The first substrate is provided with a number of conductive parts that cover the maximum number of simultaneous measurements, and the probe board is provided with the electrodes arranged by selecting a necessary portion from the conductive parts. The probe card according to claim 1, wherein:   The probe card according to claim 1 or 2, wherein the probe board is divided into a plurality of parts. Probe substrates the probe is bonded, the first substrate, and a probe card manufacturing method comprising an anisotropic conductive member, a conductive portion protruding on the surface of the first substrate is provided, the surface of the probe substrate An electrode is provided at a predetermined position facing the conductive portion, and an anisotropic conductive member is sandwiched between the surface of the first substrate on which the conductive portion is provided and the surface on which the electrode of the probe substrate is provided. A method of manufacturing a probe card, comprising: applying pressure, joining the first substrate and the probe substrate with the anisotropic conductive member, and then mounting the probe on the probe substrate. 5. The probe card according to claim 4, wherein the surface of the probe substrate and / or the first substrate is polished after the first substrate and the probe substrate are joined by the anisotropic conductive member. Production method.   6. The probe card manufacturing method according to claim 4, wherein the electrode formation position of the probe substrate is set based on a pad mask used for forming an electrode of a semiconductor device to be measured.