JP2009021365A - Exposure device, device manufacturing method, maintenance method, and film forming device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device capable of suppressing occurrence of an exposure defect. <P>SOLUTION: The exposure device exposes a substrate to exposure light through exposure liquid. The exposure device includes a coating device which coats a predetermined member with first liquid containing a material having water repellency to the exposure liquid and a heating device which heats a film of the first liquid formed on the predetermined member. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate through a liquid, a device manufacturing method, a maintenance method for the exposure apparatus, and a film forming apparatus used in an immersion exposure apparatus.

As an exposure apparatus used in a photolithography process, an immersion exposure apparatus that exposes a substrate through a liquid as disclosed in the following patent document is known.
International Publication No. 99/49504 Pamphlet

  In an immersion exposure apparatus, not only a substrate such as a wafer to be exposed but also various predetermined members and liquid come into contact. If the surface state of the predetermined member is deteriorated, exposure failure may occur. For example, if the state in which the liquid repellency of the surface of the predetermined member with respect to the liquid is lowered is left, the liquid leaks or the liquid (for example, a liquid film or a droplet) remains on the predetermined member. there is a possibility. The environment (temperature, humidity, cleanliness, etc.) in which the exposure apparatus is placed changes due to vaporization of leaked liquid or residual liquid, and predetermined members or peripheral members are thermally deformed. there is a possibility. If such a problem occurs, the performance of the exposure apparatus may deteriorate, and an exposure failure may occur, such as a defect occurring in a pattern formed on the substrate. As a result, the manufactured device may be defective.

  An object of this invention is to provide the exposure apparatus which can suppress generation | occurrence | production of exposure defect. Moreover, an object of this invention is to provide the device manufacturing method which can suppress generation | occurrence | production of a defective device. Another object of the present invention is to provide an exposure apparatus maintenance method capable of suppressing the occurrence of exposure failure. Another object of the present invention is to provide a film forming apparatus capable of suppressing the occurrence of exposure failure.

  According to the first aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the first liquid containing a material having liquid repellency with respect to the exposure liquid applied to a predetermined member An exposure apparatus is provided that includes a coating apparatus that performs heating, and a heating apparatus that heats a film of a first liquid formed on a predetermined member.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus of the above aspect and developing the exposed substrate.

  According to a third aspect of the present invention, there is provided an exposure apparatus maintenance method for exposing a substrate with exposure light through an exposure liquid, wherein the first liquid containing a material having liquid repellency with respect to the exposure liquid is exposed. There is provided a maintenance method including applying to a predetermined member of the apparatus and heating a film of the first liquid formed on the predetermined member.

  According to a fourth aspect of the present invention, there is provided a film forming apparatus used in an immersion exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the film forming apparatus forming at least a part of a surface of a predetermined member. A removing device for removing at least a part, a coating device for applying a first liquid containing a material having liquid repellency to the exposure liquid to a predetermined member, and a film of the first liquid formed on the predetermined member are heated. And a heating device.

  According to the present invention, the occurrence of exposure failure can be suppressed. Moreover, according to the present invention, it is possible to suppress the occurrence of defective devices.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the first embodiment. In the present embodiment, the exposure apparatus EX holds the substrate P as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1,713,113. A case in which the exposure apparatus includes a movable substrate stage 1 and a measurement stage 2 that can move while mounting a measuring instrument and a measurement member that can perform predetermined measurement relating to exposure without holding the substrate P. An example will be described.

  In FIG. 1, the exposure apparatus EX executes a mask stage 3 that can be moved while holding a mask M, a substrate stage 1 that can be moved while holding a substrate P, and a measurement relating to exposure without holding the substrate P. A measuring stage 2 mounted with possible measuring instruments and measuring members, movable independently of the substrate stage 1, a first drive system 4 for moving the mask stage 3, and the substrate stage 1 and the measuring stage 2 are moved. Interferometer system 6 including second drive system 5, laser interferometers 6M and 6P that measure position information of each stage 1, 2, and 3, illumination system IL that illuminates mask M with exposure light EL, and exposure light A projection optical system PL that projects an image of the pattern of the mask M illuminated by EL onto the substrate P, and a control device 7 that controls the operation of the entire exposure apparatus EX are provided.

  In addition, the board | substrate P here is a board | substrate for manufacturing a device, for example, includes what formed the photosensitive film in base materials, such as a semiconductor wafer like a silicon wafer. The photosensitive film is a film of a photosensitive material (photoresist). In addition to the photosensitive film, various films such as a protective film (topcoat film) may be formed on the substrate P. The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. For example, a predetermined pattern is formed on a transparent plate member such as a glass plate using a light shielding film such as chromium. This transmission type mask is not limited to a binary mask in which a pattern is formed by a light shielding film, and includes, for example, a phase shift mask such as a halftone type or a spatial frequency modulation type. In the present embodiment, a transmissive mask is used as the mask M, but a reflective mask may be used.

  The exposure apparatus EX includes a base member (surface plate) BP having a guide surface GF that supports the substrate stage 1 and the measurement stage 2 so as to be movable. Each of the substrate stage 1 and the measurement stage 2 is movable on the guide surface GF. In the present embodiment, the guide surface GF is substantially parallel to the XY plane, and each of the substrate stage 1 and the measurement stage 2 can move in the XY direction (two-dimensional direction) along the guide surface GF.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes the substrate P with the exposure light EL via the exposure liquid LQ, so that at least a part of the optical path space of the exposure light EL is filled with the exposure liquid LQ. Then, an immersion space is formed with the exposure liquid LQ. The optical path space of the exposure light EL is a space including the optical path through which the exposure light EL passes. The immersion space is a space filled with liquid. In the present embodiment, water (pure water) is used as the exposure liquid LQ.

  In the present embodiment, exposure light between the terminal optical element 8 closest to the image plane of the projection optical system PL and a predetermined member facing the terminal optical element 8 among the plurality of optical elements of the projection optical system PL. An immersion space is formed with the exposure liquid LQ so that the EL optical path space is filled with the exposure liquid LQ. The terminal optical element 8 has a lower surface (exit surface) 8A that emits the exposure light EL toward the image plane of the projection optical system PL. The immersion space of the exposure liquid LQ includes the lower surface 8A of the terminal optical element 8 and The optical path space of the exposure light EL between the lower surface 8A of the last optical element 8 and the predetermined member facing it is formed so as to be filled with the exposure liquid LQ. The exposure apparatus EX exposes the substrate P by irradiating the substrate P with the exposure light EL through the exposure liquid LQ.

  The exposure apparatus EX of the present embodiment includes a liquid immersion member 30 that can form an immersion space with the exposure liquid LQ so that the optical path space of the exposure light EL is filled with the exposure liquid LQ. The liquid immersion member 30 is disposed in the vicinity of the last optical element 8. The liquid immersion member 30 has a lower surface (liquid contact surface) 30A that can face a predetermined member disposed at a position facing the lower surface 8A of the last optical element 8. The lower surface 30A can contact the exposure liquid LQ. In the present embodiment, an immersion space is formed by the exposure liquid LQ held between the terminal optical element 8 and the liquid immersion member 30 and a predetermined member facing the terminal optical element 8 and the liquid immersion member 30. .

  The predetermined member that can face the last optical element 8 and the liquid immersion member 30 is movable on the exit side of the last optical element 8 (image surface side of the projection optical system PL), and is ejected from the lower surface 8A of the last optical element 8. A member that can be moved to a position irradiated with exposure light EL.

  In the present embodiment, the predetermined member that can move to the position irradiated with the exposure light EL emitted from the lower surface 8A of the last optical element 8 is the substrate stage 1, the substrate P held on the substrate stage 1, and the measurement stage. At least one of the two. In the present embodiment, the substrate stage 1 includes a plate member T, and the measurement stage 2 includes various optical members such as a reference plate 50, a slit plate 60, and an upper plate 70.

  At the time of exposure of the substrate P, the substrate P held on the substrate stage 1 is disposed so as to face the terminal optical element 8 and the liquid immersion member 30. The liquid immersion member 30 forms an immersion space with the exposure liquid LQ so that the optical path space of the exposure light EL between the last optical element 8 and the substrate P is filled with the exposure liquid LQ at least during exposure of the substrate P.

  Further, the exposure apparatus EX of the present embodiment is formed on the above-described predetermined member and the coating apparatus 80 that applies the first liquid L1 containing a material having liquid repellency to the exposure liquid LQ to the predetermined member. And a heating device 90 for heating the film of the first liquid L1.

  In the present embodiment, the coating device 80 and the heating device 90 are arranged at positions different from the liquid immersion member 30. As an example, in the present embodiment, as shown in FIG. 1, a coating device 80 is disposed on the + Y side of the liquid immersion member 30, and a heating device 90 is disposed on the + Y side of the coating device 80. Further, when the substrate stage 1 is disposed at a position facing the terminal optical element 8 and the liquid immersion member 30, the measurement stage 2 can be disposed at a position facing at least one of the coating device 80 and the heating device 90.

  In the present embodiment, the coating apparatus 80 includes a liquid immersion member 81 that can form an immersion space with the first liquid L1 between the above-described predetermined members. The liquid immersion member 81 has a lower surface (liquid contact surface) 81A that can come into contact with the first liquid L1, and the above-mentioned predetermined member is movable to a position facing the lower surface 81A of the liquid immersion member 81. In the present embodiment, a liquid immersion space is formed by the first liquid L <b> 1 held between the liquid immersion member 81 and a predetermined member facing the liquid immersion member 81. The coating device 80 applies the first liquid L1 to the predetermined member by forming an immersion space with the first liquid L1 between the liquid immersion member 81 and the predetermined member.

  In the present embodiment, the heating device 90 irradiates the film of the first liquid L1 with light. In the present embodiment, the heating device 90 includes a light source device 91 that emits light and a condensing optical system 92 that condenses the light from the light source device 91. The condensing optical system 92 has a lower surface (exiting surface) 92 </ b> A that emits light, and the predetermined member can be moved to a position facing the lower surface 92 </ b> A of the condensing optical system 92.

  Further, the exposure apparatus EX of the present embodiment includes a removing apparatus 100 that removes at least a part of a film that forms at least a part of the surface of a predetermined member. In the present embodiment, the removing device 100 removes at least a part of the film using the second liquid L2 that can dissolve the film that forms at least a part of the surface of the predetermined member. In the present embodiment, the removing device 100 includes the liquid immersion member 81 described above, and the lower surface 81A of the liquid immersion member 81 can contact the second liquid L2. The removing apparatus 100 removes at least a part of the film forming at least a part of the surface of the predetermined member by forming an immersion space with the second liquid L2 between the liquid immersion member 81 and the predetermined member.

  Here, in the following description, the liquid immersion member 30 capable of forming an immersion space with the exposure liquid LQ so as to fill the optical path space of the exposure light EL with the exposure liquid LQ is appropriately referred to as a first liquid immersion member 30. The liquid immersion member 81 capable of forming the liquid immersion space at least one of the first liquid L1 and the second liquid L2 is appropriately referred to as a second liquid immersion member 81. The second liquid immersion member 81 is disposed at a different position from the first liquid immersion member 30.

  In the following description, the immersion space formed with the first liquid L1 is appropriately referred to as a first immersion space LS1, and the immersion space formed with the second liquid L2 is appropriately referred to as a second immersion space. This is referred to as a space LS2, and an immersion space formed with the exposure liquid LQ is appropriately referred to as a third immersion space LS3. The first immersion member 30 can form the third immersion space LS3 with the exposure liquid LQ between the first immersion member 30 and a predetermined member. The second liquid immersion member 81 can form the first liquid immersion space LS1 with the first liquid L1 between the predetermined liquid and the second liquid L2 between the predetermined liquid and the predetermined liquid. Is possible.

  In the present embodiment, the third immersion space LS3 is formed by the first immersion member 30 so that a partial region (local region) on the surface of the predetermined member is covered with the exposure liquid LQ. A gas-liquid interface (meniscus, edge) of the exposure liquid LQ is formed between the surface of the predetermined member and the lower surface 30A of the first liquid immersion member 30. During the exposure of the substrate P, the third immersion space LS3 is formed with the exposure liquid LQ so that a part of the area on the substrate P including the projection area of the projection optical system PL is covered with the exposure liquid LQ. That is, the liquid immersion exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  Further, in the present embodiment, the second liquid immersion member 81 causes the partial region (local region) on the surface of the predetermined member to be covered with the first liquid L1 (or the second liquid L2). A first immersion space LS1 (or second immersion space LS2) is formed, and the first liquid L1 (or second liquid L2) is between the surface of the predetermined member and the lower surface 81A of the second immersion member 81. A gas-liquid interface (meniscus, edge) is formed.

The illumination system IL illuminates a predetermined illumination area on the mask M with exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, Vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 3 is movable in three directions of the X axis, the Y axis, and the θZ direction while holding the mask M by the first drive system 4 including an actuator such as a linear motor. Position information of the mask stage 3 (mask M) is measured by the laser interferometer 6M of the interferometer system 6. The laser interferometer 6M measures position information regarding the X axis, the Y axis, and the θZ direction of the mask stage 3 using a measurement mirror 3R provided on the mask stage 3. The control device 7 drives the first drive system 4 based on the measurement result of the interferometer system 6 including the laser interferometer 6M, and executes the position control of the mask M held on the mask stage 3.

  The projection optical system PL projects an image of the pattern of the mask M onto the substrate P at a predetermined projection magnification. The projection optical system PL has a plurality of optical elements, and these optical elements are held by a lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, 1/8 or the like. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z-axis direction. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 1 includes a stage main body 11 and a substrate table 12 mounted on the stage main body 11 and capable of holding the substrate P. The substrate table 12 has an upper surface 1T that can face the lower surface 8A of the last optical element 8, the lower surface 30A of the first liquid immersion member 30, the lower surface 81A of the second liquid immersion member 81, and the lower surface 92A of the condensing optical system 92. . The upper surface 1T of the substrate table 12 is flat and substantially parallel to the XY plane. The stage main body 11 is supported by the gas bearing in a non-contact manner on the guide surface GF, and can move on the guide surface GF in the XY directions. The substrate stage 1 holds the substrate P, and on the light emission side of the terminal optical element 8 (the image plane side of the projection optical system PL), a position facing the terminal optical element 8 and the first liquid immersion member 30, It can move within a predetermined region on the guide surface GF including a position facing the two liquid immersion member 81 and a position facing the condensing optical system 92.

  The measurement stage 2 includes a stage main body 21 and a measurement table 22 mounted on the stage main body 21 and capable of mounting a measuring instrument and a measurement member. The measurement table 22 has a lower surface 8A of the last optical element 8, a lower surface 30A of the first liquid immersion member 30, a lower surface 81A of the second liquid immersion member 81, and an upper surface 2T that can face the lower surface 92A of the condensing optical system 92. . The upper surface 2T of the measurement table 22 is flat and substantially parallel to the XY plane. The stage body 21 is supported by the gas bearing in a non-contact manner on the guide surface GF, and can move in the XY directions on the guide surface GF. The measurement stage 2 is mounted with a measuring instrument, on the light exit side of the final optical element 8 (on the image plane side of the projection optical system PL), at a position facing the final optical element 8 and the first liquid immersion member 30, It can move independently of the substrate stage 1 within a predetermined region on the guide surface GF including the position facing the two liquid immersion member 81 and the position facing the condensing optical system 92.

  The second drive system 5 includes an actuator such as a linear motor, and moves the stage main body 11 and the stage main body 21 on the guide surface GF in the X-axis, Y-axis, and θZ directions. Including a coarse motion system 5A capable of moving the substrate table 12 and the measurement table 22 on the stage main body 21 in the X-axis, Y-axis, and θZ directions, and an actuator such as a voice coil motor. A fine movement system 5B capable of moving the substrate table 12 in the Z-axis, θX, and θY directions, and a fine movement system 5C capable of moving the measurement table 22 in the Z-axis, θX, and θY directions relative to the stage body 21. ing. The second drive system 5 including the coarse motion system 5A and the fine motion systems 5B and 5C has six directions of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions for the substrate table 12 and the measurement table 22, respectively. Can be moved to. The control device 7 controls the second drive system 5 to control the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions of the substrate table 12 (substrate P) and the measurement table 22 (measuring instrument). Position control in one direction can be performed.

  Position information on the substrate table 12 and the measurement table 22 (position information regarding the X-axis, Y-axis, and θZ directions) is measured by the laser interferometer 6P of the interferometer system 6. The laser interferometer 6P uses the measurement mirrors 12R and 22R provided on the substrate table 12 and the measurement table 22, respectively, to obtain positional information regarding the X-axis, Y-axis, and θZ directions of the substrate table 12 and the measurement table 22, respectively. measure.

  Further, the exposure apparatus EX includes an oblique incidence type focus / leveling detection system (not shown). Surface position information (position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P held on the substrate table 12, surface position information of the upper surface 2T of the measurement table 22, and the like are detected by a focus / leveling detection system. Is done. The measurement result of the laser interferometer 6P of the interferometer system 6 and the detection result of the focus / leveling detection system are output to the control device 7. The control device 7 drives the second drive system 5 based on the measurement result of the laser interferometer 6P and the detection result of the focus / leveling detection system, and performs position control of the substrate P and the like held on the substrate table 12. To do.

  In addition, the exposure apparatus EX of the present embodiment detects the alignment mark on the mask M, the first reference mark FM1 on the reference plate 50 provided on the measurement stage 2, and the like using TTR (exposure wavelength light). Through the Reticle) type first alignment system RA is provided. At least a part of the first alignment system RA is disposed above the mask stage 3. The first alignment system RA is a conjugate image of the alignment mark on the mask M and the first reference mark FM1 on the reference plate 50 provided on the measurement stage 2 corresponding to the alignment mark via the projection optical system PL. And observe at the same time. The first alignment system RA of the present embodiment includes an object mark (an alignment mark on the mask M and a first reference mark FM1 on the reference plate 50 as disclosed in, for example, US Pat. No. 5,646,413). VRA (Visual Reticle Alignment) method is employed in which the mark position is detected by irradiating light to the image and processing the image data of the mark imaged by a CCD camera or the like.

  Further, the exposure apparatus EX of the present embodiment detects an alignment mark on the substrate P, a second reference mark FM2 on the reference plate 50 provided on the measurement stage 2, and the like. It has. At least a part of the second alignment system ALG is disposed in the vicinity of the tip of the projection optical system PL. The second alignment system ALG of the present embodiment uses, for example, broadband detection light that does not sensitize the photosensitive material on the substrate P as disclosed in US Pat. No. 5,493,403 or the like (on the substrate P). The alignment mark and the second reference mark FM2 on the reference plate 50) and the target mark image and the index formed on the light receiving surface by the reflected light from the target mark (provided in the second alignment system ARG) FIA (Field Image Alignment) type alignment system that measures an image of an index mark on the index plate) using an image sensor such as a CCD and measures the image signal of the image signal. Is adopted.

  FIG. 2 is an enlarged side sectional view of a part of the exposure apparatus EX according to the present embodiment. In FIG. 2, the first liquid immersion member 30 is an annular member and is disposed around the last optical element 8. The first liquid immersion member 30 has an opening 30 </ b> K disposed at a position facing the lower surface 8 </ b> A of the last optical element 8. The first liquid immersion member 30 includes a first supply port 31 that can supply the exposure liquid LQ and a first recovery port 32 that can recover the exposure liquid LQ.

  The first supply port 31 can supply the exposure liquid LQ to the optical path space of the exposure light EL in order to form the third immersion space LS3. The first supply port 31 is disposed at a predetermined position of the first immersion member 30 facing the optical path space of the exposure light EL in the vicinity of the optical path space of the exposure light EL. In addition, the exposure apparatus EX includes an exposure liquid supply device 36. The exposure liquid supply device 36 can deliver exposure liquid LQ that is clean, temperature-adjusted, and sufficiently deaerated. The first supply port 31 and the exposure liquid supply device 36 are connected via a supply flow path 35. The supply flow path 35 includes a flow path 35A formed inside the first liquid immersion member 30, and a flow path 35B formed by a supply pipe connecting the flow path 35A and the exposure liquid supply device 36. The exposure liquid LQ delivered from the exposure liquid supply device 36 is supplied to the first supply port 31 via the supply flow path 35. The first supply port 31 supplies the exposure liquid LQ from the exposure liquid supply device 36 to the optical path space of the exposure light EL.

  The first recovery port 32 can recover at least a part of the exposure liquid LQ on a predetermined member facing the lower surface 30 </ b> A of the first liquid immersion member 30. In the present embodiment, the first recovery port 32 is disposed around the optical path of the exposure light EL. The first recovery port 32 is disposed at a predetermined position of the first liquid immersion member 30 that faces the surface of the predetermined member. The exposure apparatus EX also includes an exposure liquid recovery apparatus 38 that can recover the exposure liquid LQ. The exposure liquid recovery apparatus 38 includes a vacuum system and can recover the exposure liquid LQ by suction. The first recovery port 32 and the exposure liquid recovery device 38 are connected via a recovery flow path 37. The recovery flow path 37 includes a flow path 37A formed inside the first liquid immersion member 30 and a flow path 37B formed of a recovery pipe that connects the flow path 37A and the exposure liquid recovery apparatus 38. The exposure liquid LQ recovered from the first recovery port 32 is recovered by the exposure liquid recovery device 38 via the flow path 37.

  In the present embodiment, the control device 7 executes the liquid recovery operation using the first recovery port 32 in parallel with the liquid supply operation using the first supply port 31, so that the last optical element 8 and the first liquid A third immersion space LS3 can be formed with the exposure liquid LQ between the immersion member 30 and a predetermined member facing the last optical element 8 and the first immersion member 30. At least when exposing the substrate P, the control device 7 forms the third immersion space LS3 so that the optical path space of the exposure light EL is filled with the exposure liquid LQ.

  Next, the substrate table 12 will be described. The substrate table 12 includes a first holding part PH1 that detachably holds the substrate P, and a second holding part PH2 that is disposed on at least a part of the periphery of the first holding part PH1 and holds the plate member T detachably. Have The substrate table 12 has a base material 13, and the first holding part PH <b> 1 and the second holding part PH <b> 2 are provided on the base material 13. In the present embodiment, the second holding part PH2 is arranged around the first holding part PH1. In the present embodiment, the upper surface 1T of the substrate table 12 (substrate stage 1) includes the surface of the plate member T held by the second holding part PH2.

  The plate member T is a member different from the substrate table 12, and is detachably held by the second holding portion PH2 of the substrate table 12. A substantially circular opening TH in which the substrate P can be placed is formed in the center of the plate member T. The plate member T held by the second holding part PH2 is disposed around the substrate P held by the first holding part PH1. The outer edge (side surface) of the substrate P held by the first holding portion PH1 and the inner edge (opening TH side) of the plate member T arranged outside the substrate P and held by the second holding portion PH2. A predetermined gap is formed between the inner surface and the inner surface.

  In the present embodiment, the first holding unit PH1 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The second holding portion PH2 holds the plate member T so that the surface of the plate member T and the XY plane are substantially parallel. In the present embodiment, the surface of the substrate P and the surface of the plate member T are flat. In the present embodiment, the surface of the substrate P held by the first holding part PH1 and the surface of the plate member T held by the second holding part PH2 are arranged in the same plane (in the XY plane). (It is the same). The plate member T forms a flat portion around the substrate P held by the first holding portion PH1 of the substrate stage 1.

The substrate P includes a base material W such as a semiconductor wafer and a photosensitive film Rg formed on the base material W.

  The plate member T has a liquid repellent surface with respect to the exposure liquid LQ. In the present embodiment, the surface of the plate member T is formed of a film Tf of a material containing fluorine. Specifically, the plate member T has a base material Tb formed of a metal such as stainless steel, and a film Tf of a material containing fluorine formed on the surface of the base material Tb. In this embodiment, the material for forming the film Tf includes, for example, PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer) and Teflon (registered trademark).

  The first holding portion PH <b> 1 includes a so-called pin chuck mechanism, is formed on the base material 13, and includes a plurality of pin-shaped support members 14 that support the back surface of the substrate P, and a base material that surrounds the plurality of support members 14. 13 and a first peripheral wall 15 formed on the top 13. The first peripheral wall 15 is formed in an annular shape that is substantially the same shape as the outer shape of the substrate P, and the upper surface of the first peripheral wall 15 faces a peripheral region (edge region) on the back surface of the substrate P. A plurality of first suction ports 16 capable of sucking gas are provided on the base material 13 inside the first peripheral wall 15. Each of the first suction ports 16 is connected to a suction device including a vacuum system or the like. The control device 7 uses the suction device to suck the gas in the first space surrounded by the back surface of the substrate P, the first peripheral wall 15, and the base material 13 through the first suction port 16, and thereby the first space. By making the pressure negative, the back surface of the substrate P is sucked and held by the support member 14. Further, by stopping the suction operation by the suction device connected to the first suction port 16, the substrate P can be removed from the first holding part PH1.

  The second holding portion PH <b> 2 includes a so-called pin chuck mechanism, and is formed on the base material 13 so as to surround the second peripheral wall 17 and the second peripheral wall 17 formed on the base material 13 so as to surround the first peripheral wall 15. And a plurality of pin-shaped support members 19 that are formed on the base member 13 between the second peripheral wall 17 and the third peripheral wall 18 and support the back surface of the plate member T. . The upper surface of the second peripheral wall 17 faces the inner edge region (inner edge region) on the back surface of the plate member T in the vicinity of the opening TH. The upper surface of the third peripheral wall 18 faces the outer edge region (outer edge region) of the back surface of the plate member T.

  Further, a plurality of second suction ports 20 capable of sucking gas are provided on the base material 13 between the second peripheral wall 17 and the third peripheral wall 18. Each of the second suction ports 20 is connected to a suction device including a vacuum system and the like. The control device 7 sucks the gas in the second space surrounded by the back surface of the plate member T, the second peripheral wall 17, the third peripheral wall 18, and the base material 13 through the second suction port 20 using the suction device. Then, the back surface of the plate member T is sucked and held by the support member 19 by setting the second space to a negative pressure. Moreover, the plate member T can be removed from the second holding portion PH2 by stopping the suction operation by the suction device connected to the second suction port 20.

  As shown in FIG. 2, for example, when the exposure light EL is irradiated to the peripheral area (edge shot) of the surface of the substrate P, a part of the plate member T is exposed to the exposure liquid LQ in the third immersion space LS3. Contact. In this case, the third immersion space LS3 is formed by the exposure liquid LQ held between the terminal optical element 8 and the first immersion member 30, and the substrate P and the plate member T.

  Next, the measurement stage 2 will be described. FIG. 3 is a schematic perspective view showing the substrate stage 1 and the measurement stage 2, and FIG. 4 is a plan view showing the substrate stage 1 and the measurement stage 2. The measurement stage 2 includes a plurality of measuring instruments and measurement members (optical members) for performing various measurements related to exposure. At a predetermined position on the upper surface 2T of the measurement table 22 of the measurement stage 2, a reference plate 50 on which a plurality of reference marks FM1 and FM2 are formed is provided as a measurement member (optical member). In the present embodiment, the reference plate 50 is detachably held by a third holding part PH3 provided on the measurement table 22. In addition, a slit plate 60 capable of transmitting light on which the slit portion 61 is formed is provided as a measurement member (optical member) at a predetermined position on the upper surface 2T of the measurement table 22. In the present embodiment, the slit plate 60 is detachably held by a fourth holding portion PH4 provided on the measurement table 22. Further, an upper plate 70 capable of transmitting light on which an opening pattern 71 is formed is provided as a measurement member (optical member) at a predetermined position on the upper surface of the measurement table 22. In the present embodiment, the upper plate 70 is detachably held by a fifth holding portion PH5 provided on the measurement table 22.

  In the present embodiment, the surface of the reference plate 50 held by the third holding portion PH3, the surface of the slit plate 60 held by the fourth holding portion PH4, and the upper plate 70 held by the fifth holding portion PH5. And the upper surface 2T of the measurement table 12 are arranged in substantially the same plane (in the XY plane) (they are flush).

  The reference plate 50 is formed on the base material 51 made of a low thermal expansion material, the first reference mark FM1 formed on the base material 51 and measured by the first alignment system RA, and the second alignment. And a second reference mark FM2 measured by the system ALG. The first and second fiducial marks FM1, FM2 are made of a metal such as Cr (chrome).

  The reference plate 50 has a liquid repellent surface with respect to the exposure liquid LQ. In the present embodiment, the surface of the reference plate 50 is formed of a film 50f of a material containing fluorine. In the present embodiment, the film 50f forming the surface of the reference plate 50 is formed of a transparent material containing fluorine that can transmit light (exposure light EL).

  The slit plate 60 includes a light shielding film 62 made of Cr (chromium) or the like provided at the center of the upper surface of the glass plate member 64, and a portion other than the light shielding film 62 around the light shielding film 62, that is, the upper surface of the glass plate member 64 And a slit film 61 that is an opening pattern formed in a part of the light-shielding film 62. In the slit part 61, the glass plate member 64 which is a transparent member is exposed, and light can pass through the slit part 61. As a material for forming the glass plate member 64, synthetic quartz, meteorite, or the like having good transparency to the exposure light EL is used. The slit portion 61 can be formed by etching the light shielding film 62, for example. The slit plate 60 constitutes a part of an aerial image measurement system 60S as disclosed in, for example, US Patent Application Publication No. 2002/0041377. Below the slit plate 60, a light receiving element constituting a part of the aerial image measurement system 60S is arranged.

  The slit plate 60 has a liquid repellent surface with respect to the exposure liquid LQ. In the present embodiment, the surface of the slit plate 60 is formed of a film 60f of a material containing fluorine.

  The upper plate 70 includes a light shielding film 72 made of Cr (chromium) or the like provided on the upper surface of the glass plate member 74, and an opening pattern 71 formed in a part of the light shielding film 72. In the opening pattern 71, the glass plate member 74 that is a transparent member is exposed, and light can pass through the opening pattern 71. As a material for forming the glass plate member 74, synthetic quartz or meteorite having good transparency to the exposure light EL is used. The opening pattern 71 can be formed by etching the light shielding film 72, for example. The upper plate 70 measures information on the exposure energy of the exposure light EL (light quantity, illuminance, illuminance unevenness, etc.), and can measure illuminance unevenness as disclosed in, for example, US Pat. No. 4,465,368. A measuring instrument, for example, an unevenness measuring instrument for measuring a variation in the transmittance of the exposure light EL of the projection optical system PL as disclosed in Japanese Patent Application Laid-Open No. 2001-267239, for example, US Patent Application Publication No. 2002/0061469. It constitutes a part of an irradiation amount measuring device (illuminance measuring device) as disclosed in the specification and the like. Alternatively, the upper plate 70 constitutes a part of a wavefront aberration measuring instrument as disclosed in, for example, International Publication No. 99/60361 pamphlet (corresponding to European Patent No. 1,079,223). It may be. A light receiving element constituting a part of these measuring instruments is disposed below the upper plate 70.

  The upper plate 70 has a liquid repellent surface with respect to the exposure liquid LQ. In the present embodiment, the surface of the upper plate 70 is formed of a film 70 f of a material containing fluorine, like the reference plate 50 and the slit plate 60.

  As the transparent material containing fluorine for forming the film 50f, the film 60f, and the film 70f, “EGC” series manufactured by Sumitomo 3M Co., “Cytop” manufactured by Asahi Glass Co., Ltd., “manufactured by Tokyo Ohka Kogyo Co., Ltd.” TSP-3A (resist protective film material) "can be used.

  In the present embodiment, the upper surface 2T of the measurement table 22 other than the surfaces of the measurement members 50, 60, and 70 is formed of a film of a material containing fluorine such as PFA and repels the exposure liquid LQ. It has liquidity.

  Next, the second liquid immersion member 81 will be described with reference to FIGS. 5 and 6. FIG. 5 is a side sectional view showing the vicinity of the second liquid immersion member 81, and FIG. 6 is a view of the second liquid immersion member 81 as viewed from below. As shown in FIGS. 5 and 6, the second liquid immersion member 81 can form the first liquid immersion space LS1 with the first liquid L1 between the lower surface 81A of the second liquid immersion member 81 and a predetermined member facing it. It is. The second liquid immersion member 81 can form the second liquid immersion space LS2 with the second liquid L2 between the lower surface 81A of the second liquid immersion member 81 and a predetermined member facing it. 5 shows a state in which the substrate table 12 (plate member T) is disposed as a predetermined member at a position facing the lower surface 81A of the second liquid immersion member 81.

  The second liquid immersion member 81 has a second supply port 82 capable of supplying a liquid (at least one of the first liquid L1 and the second liquid L2) and a liquid (at least one of the first liquid L1 and the second liquid L2). A second recovery port 83 that can be recovered is provided. The second supply port 82 can supply the first liquid L1 in order to form the first immersion space LS1. The second supply port 82 can supply the second liquid L2 in order to form the second immersion space LS2. The second supply port 82 is disposed substantially at the center of the lower surface 81 </ b> A of the second liquid immersion member 81.

  The second recovery port 83 can recover at least a part of the liquid (at least one of the first liquid L1 and the second liquid L2) on a predetermined member facing the lower surface 81A of the second liquid immersion member 81. In the present embodiment, the second recovery port 83 is disposed around the second supply port 82 on the lower surface 81 </ b> A of the second liquid immersion member 81.

  The exposure apparatus EX includes a first liquid supply device 84 that generates the first liquid L1, a second liquid supply device 85 that generates the second liquid L2, and a liquid (at least one of the first liquid L1 and the second liquid L2). And a liquid recovery device 86 capable of recovering. The first liquid supply device 84, the second liquid supply device 85, and the liquid recovery device 86 are controlled by the control device 7. The first liquid supply device 84 and the second supply port 82 are connected via a supply flow path 87. The supply flow path 87 includes a flow path 87 </ b> A formed inside the second liquid immersion member 81 and a flow path 87 </ b> B formed by a supply pipe connecting the flow path 87 </ b> A and the first liquid supply device 84. The second liquid supply device 85 is connected to the supply channel 87 via the channel switching mechanism 88. The flow path switching mechanism 88 is controlled by the control device 7.

  The first liquid supply device 84 can deliver the first liquid L1 toward the second supply port 82. The second liquid supply device 85 can send the second liquid L2 toward the second supply port 82.

  The liquid recovery device 86 includes a vacuum system and can recover the first liquid L1 and the second liquid L2. The liquid recovery device 86 and the second recovery port 83 are connected via a recovery flow path 89. The recovery flow path 89 includes a flow path 89A formed inside the second liquid immersion member 81 and a flow path 89B formed by a recovery pipe that connects the flow path 89A and the liquid recovery device 86. The liquid recovered from the second recovery port 83 (including at least one of the first liquid L1 and the second liquid L2) is recovered by the liquid recovery device 86 via the recovery flow path 89.

  In the present embodiment, the control device 7 controls the flow path switching mechanism 88, the first liquid supply device 84, and the second liquid supply device 85 so that the first liquid L1 delivered from the first liquid supply device 84 is When supplied to the second supply port 82, the supply of the second liquid L2 from the second liquid supply device 85 to the second supply port 82 can be stopped. In addition, when the second liquid L <b> 2 delivered from the second liquid supply device 85 is supplied to the second supply port 82, the control device 7 controls the first liquid from the first liquid supply device 84 to the second supply port 82. The supply of L1 can be stopped.

  For example, in order to form the first immersion space LS1 with the first liquid L1, the control device 7 stops the supply of the second liquid L2 from the second liquid supply device 85 to the second supply port 82, and first The first liquid L1 is delivered from the liquid supply device 84. The first liquid L <b> 1 delivered from the first liquid supply device 84 flows through the supply flow path 87 and is then supplied to the second supply port 82. The second supply port 82 uses the first liquid L1 to form the first liquid immersion space LS1, the first liquid L1 from the first liquid supply device 84, the lower surface 81A of the second liquid immersion member 81, and the lower surface It supplies between 81A and the predetermined member which opposes. Further, the first liquid L1 recovered from the second recovery port 83 is recovered by the liquid recovery device 86 through the recovery flow path 89 by the operation of the liquid recovery device 86. In parallel with the supply operation of the first liquid L1 using the second supply port 82, the control device 7 executes the recovery operation of the first liquid L1 using the second recovery port 83, so that the first liquid L1 is the first liquid L1. One immersion space LS1 is formed.

  Further, in order to form the second immersion space LS2 with the second liquid LC, the control device 7 stops the supply of the first liquid L1 from the first liquid supply device 84 to the second supply port 82, and the second liquid LC. The second liquid L2 is delivered from the liquid supply device 85. The second liquid L <b> 2 delivered from the second liquid supply device 85 flows through the supply flow path 87 and is then supplied to the second supply port 82. The second supply port 82 uses the second liquid L2 to form the second immersion space LS2, and the second liquid L2 from the second liquid supply device 85 is supplied to the lower surface 81A of the second liquid immersion member 81 and the lower surface. It supplies between 81A and the predetermined member which opposes. Further, the second liquid L <b> 2 recovered from the second recovery port 83 is recovered by the liquid recovery apparatus 86 through the recovery flow path 89 by the operation of the liquid recovery apparatus 86. In parallel with the supply operation of the second liquid L2 using the second supply port 82, the control device 7 executes the recovery operation of the second liquid L2 using the second recovery port 83, so that the second liquid L2 is used as the second liquid L2. A two-immersion space LS2 is formed.

  Thus, in this embodiment, the 2nd supply port 82 can supply each of the 1st liquid L1 and the 2nd liquid L2. The second recovery port 83 can recover each of the first liquid L1 and the second liquid L2.

  In the following description, the state in which the first liquid L1 is supplied from the first liquid supply device 84 to the second supply port 82 is appropriately referred to as a first supply mode, and the second liquid supply device 85 supplies the second supply port. The state in which the second liquid L2 is supplied to 82 is appropriately referred to as a second supply mode.

  FIG. 7 is a cross-sectional view showing the slit plate 60 held by the fourth holding portion PH4. As shown in FIG. 7, an opening is formed in a part of the upper surface 2 </ b> T of the measurement table 22, and an internal space connected to the opening is formed in the measurement table 22. The slit plate 60 is detachably held by a fourth holding portion PH4 disposed near the opening of the measurement table 22. The fourth holding portion PH4 includes a so-called pin chuck mechanism, and a base material 67 formed in an annular shape so as not to block the exposure light EL transmitted through the slit portion 61, and a base material 67 along the inner edge of the base material 67. The inner peripheral wall 67A formed above, the outer peripheral wall 67B formed on the base material 67 so as to surround the inner peripheral wall 67A, and the inner peripheral wall 67A and the outer peripheral wall 67B are formed. A plurality of pin-shaped support members 68 to be supported, and a suction port 69 that is disposed between the inner peripheral wall 67A and the outer peripheral wall 67B and capable of sucking a gas. The surface of the slit plate 60 held by the fourth holding part PH4 and the upper surface 2T of the measurement table 22 are substantially flush.

  At least a part of the aerial image measurement system 60S is arranged in the internal space of the measurement table 22. The aerial image measurement system 60S includes a slit plate 60, an optical system 65 disposed below the slit portion 61 in the internal space of the measurement table 22, and light reception that can receive light (exposure light EL) via the optical system 65. An element 66 is provided.

  As shown in FIG. 7, when executing the measurement process using the slit plate 60, the control device 7 arranges the slit plate 60 at a position facing the lower surface 8 </ b> A of the final optical element 8, and the final optical element 8 and the slit are arranged. In the state where the third immersion space LS3 is formed with the exposure liquid LQ so that the optical path space of the exposure light EL with the plate 60 is filled with the exposure liquid LQ, the exposure light EL is irradiated onto the slit plate 60. The surface of the slit plate 60 is irradiated with the exposure light EL while being in contact with the exposure liquid LQ. The light receiving element 66 receives the exposure light EL transmitted through the slit plate 60 (slit portion 61) through the optical system 65, and executes a spatial image measurement.

  Although not shown, the measurement table 22 is provided with a third holding portion PH3 having a pin chuck mechanism that detachably holds the reference plate 50. When executing the measurement process using the reference plate 50, the control device 7 arranges the reference plate 50 at a position facing the lower surface 8 </ b> A of the last optical element 8, and exposes between the last optical element 8 and the reference plate 50. In a state where the third immersion space LS3 is formed with the exposure liquid LQ so that the optical path space of the light EL is filled with the exposure liquid LQ, the exposure light EL or light (ultraviolet light) having substantially the same wavelength as the exposure light EL is used as the reference plate. 50 is irradiated. The surface of the reference plate 50 is irradiated with light (ultraviolet light) having substantially the same wavelength as the exposure light EL or the exposure light EL while being in contact with the exposure liquid LQ.

  Although not shown, the measurement table 22 is provided with a fifth holding portion PH5 having a pin chuck mechanism that detachably holds the upper plate 70. When executing the measurement process using the upper plate 70, the control device 7 arranges the upper plate 70 at a position facing the lower surface 8 </ b> A of the last optical element 8, and exposes between the last optical element 8 and the upper plate 70. In the state where the third immersion space LS3 is formed with the exposure liquid LQ so that the optical path space of the light EL is filled with the exposure liquid LQ, the exposure light EL is irradiated onto the upper plate 70. The surface of the upper plate 70 is irradiated with the exposure light EL while being in contact with the exposure liquid LQ. The light receiving element disposed below the upper plate 70 receives the exposure light EL that has passed through the upper plate 70 and performs a predetermined measurement.

  As described above, when the measurement process is performed using the measurement table 22, the measurement table 22, the last optical element 8, and the first optical element 8 disposed at positions facing the last optical element 8 and the first liquid immersion member 30, and the like. A third immersion space LS3 is formed between the one immersion member 30 and the exposure liquid LQ.

  In this embodiment, as disclosed in, for example, European Patent Application Publication No. 1,713,113, US Patent Publication No. 2006/0023186, etc., the control device 7 includes the substrate table 12 and the measurement device. The upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22 are formed so that at least one of the tables 22 continues to form a space capable of holding the exposure liquid LQ between the last optical element 8 and the first liquid immersion member 30. In the state where the substrate surface 12 is approached or brought into contact, at least one of the upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22 and the lower surface 8A of the terminal optical element 8 and the lower surface 30A of the first liquid immersion member 30 are opposed to each other. The substrate table 12 and the measurement table 22 are synchronously moved in the XY directions with respect to the optical element 8 and the first liquid immersion member 30. Thereby, the control device 7 can move the third immersion space LS3 of the exposure liquid LQ between the upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22 while suppressing leakage of the exposure liquid LQ. . When the third immersion space LS3 of the exposure liquid LQ is moved between the upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22, the upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22 are It is adjusted so that it is almost the same height (level).

  Similarly, the control device 7 controls the upper surface of the substrate table 12 so that at least one of the substrate table 12 and the measurement table 22 continues to form a space capable of holding the first liquid L1 with the second liquid immersion member 81. With 1T and the upper surface 2T of the measurement table 22 approaching or contacting each other, at least one of the upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22 and the lower surface 81A of the second immersion member 81 are opposed to each other. The substrate table 12 and the measurement table 22 can be synchronously moved in the XY direction with respect to the second liquid immersion member 81. Thereby, the control device 7 can move the first immersion space LS1 of the first liquid L1 between the upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22 while suppressing leakage of the first liquid L1. It is.

  Similarly, the control device 7 controls the upper surface of the substrate table 12 so that at least one of the substrate table 12 and the measurement table 22 continues to form a space capable of holding the second liquid L2 with the second liquid immersion member 81. With 1T and the upper surface 2T of the measurement table 22 approaching or contacting each other, at least one of the upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22 and the lower surface 81A of the second immersion member 81 are opposed to each other. The substrate table 12 and the measurement table 22 can be synchronously moved in the XY direction with respect to the second liquid immersion member 81. Accordingly, the control device 7 can move the second immersion space LS2 of the second liquid L2 between the upper surface 1T of the substrate table 12 and the upper surface 2T of the measurement table 22 while suppressing leakage of the second liquid L2. It is.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  First, in the state where the last optical element 8 and the first liquid immersion member 30 and the measurement stage 2 are opposed to each other, the control device 7 uses the exposure liquid LQ to fill the optical path space of the exposure light EL with the exposure liquid LQ. A liquid immersion space LS3 is formed. Of course, the third immersion space LS3 may be formed with the exposure liquid LQ in a state where the terminal optical element 8 and the first immersion member 30 and the substrate stage 1 are opposed to each other.

  Next, before exposing the substrate P, the control device 7 performs various measurements using at least one of a measuring instrument and a measuring member mounted on the measuring stage 2. For example, as described with reference to FIG. 7, the control device 7 measures the imaging characteristics of the projection optical system PL using the aerial image measurement system 60S.

  And the control apparatus 7 performs various adjustments (calibration) based on the measurement result. For example, the image formation characteristic of the projection optical system PL is adjusted based on the measurement result of the aerial image measurement system 60S.

  After the measurement using the measurement stage 2 is completed, the control device 7 moves the substrate stage 1 and the measurement stage 2 synchronously as described above, and moves the third immersion space LS3 of the exposure liquid LQ from the measurement stage 2. Move to the substrate stage 1. Next, the control device 7 starts an alignment process for the substrate P on the substrate stage 1. The control device 7 moves the substrate stage 1 in the X and Y directions, and sequentially arranges a plurality of alignment marks provided so as to correspond to the respective shot regions on the substrate P in the detection region of the second alignment system ALG. Then, the control device 7 measures the position information of the substrate stage 1 using the interferometer system 6 including the laser interferometer 6P, and uses the second alignment system ALG to mark a plurality of alignment marks on the substrate P. Then, the detection is sequentially performed without using the exposure liquid LQ. Thereby, the control apparatus 7 can obtain | require the positional information on the alignment mark on the board | substrate P within the coordinate system prescribed | regulated by the interferometer system 6 containing the laser interferometer 6P.

  Then, the control device 7 controls the position of the substrate P on the substrate stage 1 based on the position information of the alignment marks on the substrate P, and starts exposure on a plurality of shot areas on the substrate P. In order to expose the shot area on the substrate P, the control device 7 emits exposure light EL from the illumination system IL. The exposure light EL emitted from the illumination system IL illuminates the mask M. The exposure light EL that has passed through the mask M is irradiated onto the substrate P via the projection optical system PL and the exposure liquid LQ in the third immersion space LS3. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL. The control device 7 forms the third immersion space LS3 with the exposure liquid LQ so as to fill the optical path space of the exposure light EL with the exposure liquid LQ at least while the pattern image of the mask M is projected onto the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The exposure apparatus EX moves the substrate P in the Y-axis direction with respect to the projection area of the projection optical system PL, and synchronizes with the movement of the substrate P in the Y-axis direction with respect to the illumination area of the illumination system IL. While moving the mask M in the Y-axis direction, the substrate P is irradiated with the exposure light EL via the projection optical system PL and the exposure liquid LQ to expose the substrate P.

  By the way, there is a possibility that the surface state of predetermined members including the reference plate 50, the slit plate 60, the upper plate 70, the plate member T, the substrate table 12, and the measurement table 22 may be deteriorated. Here, in the following description, the reference plate 50, the slit plate 60, the upper plate 70, the plate member T, the substrate table 12, the measurement table 22, and the like positions facing the terminal optical element 8 and the first liquid immersion member 30 ( The members that can be moved (positioned) to the position where the exposure light EL can be irradiated are collectively referred to as a predetermined member S as appropriate. The surface of the predetermined member S is at least one of the surface of the reference plate 50, the surface of the slit plate 60, the surface of the upper plate 70, the surface of the plate member T (the upper surface 1T of the substrate table 12), and the upper surface 2T of the measurement table 22. including. A liquid repellent film of a material containing fluorine that forms the surface of the predetermined member S is appropriately referred to as a film Sf. The film Sf includes at least one of the above-described films 50f, 60f, 70f, and Tf.

  For example, the exposure of the exposure light EL (ultraviolet light) to the surface of the predetermined member S may reduce the liquid repellency of the surface of the predetermined member S (film Sf forming the surface of the predetermined member S) with respect to the exposure liquid LQ. is there. For example, when the exposure light EL is irradiated to the film Sf in the initial state as shown in FIG. 8, the physical properties (properties, material characteristics) of the surface layer of the film Sf change as shown in FIG. There is a possibility that the region Sc is formed. The initial state includes a state before irradiation with the exposure light EL, before contact with the exposure liquid LQ, or before exposure with the exposure light EL in contact with the exposure liquid LQ. On the other hand, it has a desired level of liquid repellency (for example, a contact angle with the exposure liquid LQ of 90 degrees or more).

  If the state in which the liquid repellency of the surface of the predetermined member S (film Sf) with respect to the exposure liquid LQ is lowered is left as it is, the lower surface 8A of the last optical element 8, the lower surface 30A of the first liquid immersion member 30, and the predetermined member S There is a possibility that the exposure liquid LQ cannot be satisfactorily held between the surface and the third immersion space LS3 cannot be formed satisfactorily. Further, there is a high possibility that the droplet of the exposure liquid LQ will remain on the predetermined member S.

  For example, as described above, after the measurement process using the slit plate 60 is completed, the control device 7 performs the final optical element 8 and the first liquid immersion member 30 (the third liquid immersion space LS3 of the exposure liquid LQ). The measurement stage 2 is moved under predetermined movement conditions (including speed, acceleration, and movement direction), and the slit plate 60 is moved to a position not facing the last optical element 8 and the first liquid immersion member 30. When the slit plate 60 is moved to a position not facing the last optical element 8 and the first liquid immersion member 30, if the liquid repellency of the surface of the slit plate 60 with respect to the exposure liquid LQ is reduced, the surface of the slit plate 60 There is a possibility that the exposure liquid LQ (for example, a droplet of the exposure liquid LQ, a film, etc.) remains on the surface. Further, when the slit plate 60 (measurement stage 2) is moved in the XY direction under a predetermined movement condition with respect to the last optical element 8 and the first immersion member 30 (the third immersion space LS3 of the exposure liquid LQ), When the liquid repellency of the surface of the slit plate 60 with respect to the exposure liquid LQ is lowered, the third immersion space LS3 of the exposure liquid LQ (the shape of the third immersion space LS3 of the exposure liquid LQ, etc.) is maintained in a desired state. The exposure liquid LQ may leak out. In particular, when the moving speed of the slit plate 60 (measurement stage 2) is increased for the purpose of improving throughput or the like, there is a high possibility that the exposure liquid LQ remains or the exposure liquid LQ leaks.

  Similarly, when the liquid repellency of the surfaces of the reference plate 50 and the upper plate 70 with respect to the exposure liquid LQ is lowered, the exposure liquid LQ remains on the surfaces of the reference plate 50 and the upper plate 70, or the exposure liquid LQ is changed to the second level. The three immersion space LS3 cannot be maintained in a desired state, and the exposure liquid LQ may leak out.

  Further, as described above, when the exposure light EL is irradiated to the peripheral area (edge shot) on the surface of the substrate P, at least a part of the plate member T comes into contact with the exposure liquid LQ in the third immersion space LS3. . If the liquid repellency of the surface of the plate member T with respect to the exposure liquid LQ is lowered, the exposure liquid LQ remains on the surface of the plate member T, or the third immersion space LS3 of the exposure liquid LQ can be maintained in a desired state. Therefore, the exposure liquid LQ may leak out.

  Further, when the liquid repellency of the surface of the predetermined member S is lowered, the surface of the predetermined member S can be recovered even if all the exposure liquid LQ is recovered using the first recovery port 32 of the first liquid immersion member 30. Exposure liquid LQ may remain on the surface.

  Therefore, in the present embodiment, in order to make the surface state of the predetermined member S a desired state, specifically, in order to make the liquid repellency of the surface of the predetermined member S with respect to the exposure liquid LQ a desired level, exposure is performed. A process of applying the first liquid L1 containing a material having liquid repellency to the liquid LQ to the predetermined member S using the applying device 80, and a heating device 90 for the film of the first liquid L1 formed on the predetermined member S The maintenance process including the process of heating using is performed.

  Hereinafter, an example of the maintenance method according to the present embodiment will be described with reference to the flowchart of FIG. 10 and the schematic diagrams of FIGS. As shown in FIG. 10, in the present embodiment, at least a part of the film Sf that forms the surface of the predetermined member S and has reduced liquid repellency with respect to the exposure liquid LQ is removed using the removing device 100. A process (step S1), a process (step S2) of applying the first liquid L1 to at least a part of the predetermined member S from which the film Sf has been removed, using the coating device 80, and a first formed on the predetermined member S A process of heating the film of the liquid L1 using the heating device 90 (step S3) is performed.

  In the following description, as an example of the predetermined member S, a case where the slit plate 60 is maintained will be described as an example.

  First, the control device 7 uses the removal device 100 to start a process of removing at least a part of the film 60f (film Sf) (step S1).

  FIG. 11 is a schematic diagram showing a state in which the removal apparatus 100 removes at least a part of the film 60f (film Sf). The control device 7 uses the removing device 100 to remove at least a part of the film 60f having reduced liquid repellency with respect to the exposure liquid LQ. The removing device 100 supplies the second liquid L2 to the surface of the slit plate 60, and forms the second immersion space LS2 with the second liquid L2 on the slit plate 60, thereby forming the surface of the slit plate 60. The film 60f can be dissolved and removed.

  The control device 7 sets the flow path switching mechanism 88 to the second supply mode in order to dissolve the film 60f that forms the surface of the slit plate 60. As a result, the second liquid L <b> 2 delivered from the second liquid supply device 85 is supplied to the second supply port 82 via the supply channel 87. By supplying the second liquid L2 from the second supply port 82, a second liquid immersion space LS2 is formed by the second liquid L2 between the second liquid immersion member 81 and the slit plate 60.

  In addition, the control device 7 executes the recovery operation of the second liquid L2 using the second recovery port 83 in parallel with the supply operation of the second liquid L2 using the second supply port 82.

  Further, the control device 7 moves the slit plate 60 (measurement stage 2) in the XY directions with respect to the second liquid immersion member 82 in a state where the second liquid immersion space LS2 is formed with the second liquid L2.

  In the present embodiment, the second liquid L2 is obtained by dissolving a substance capable of dissolving the film 60f in a predetermined liquid. As described above, the surface of the slit plate 60 is formed of the film 60f made of a material containing fluorine. The second liquid L2 includes a solvent containing fluorine and can dissolve the film 60f. That is, in the present embodiment, a solvent containing fluorine is used as a substance that can dissolve the film 60f. In the following description, a solvent containing fluorine is appropriately referred to as a fluorine-based solvent.

  Examples of the fluorine-based solvent include hydrofluorocarbon ether (HFE) and hydrofluorocarbon (HFC). Examples of the hydrofluorocarbon include “Bertrel XF” manufactured by Mitsui DuPont Fluorochemical Co., Ltd. Examples of the fluorine-based solvent also include “Fluorinert FC-77” manufactured by Sumitomo 3M Limited.

  Further, the second liquid L2 of the present embodiment is obtained by dissolving the above-described fluorine-based solvent in alcohol. That is, in this embodiment, alcohol is used as the predetermined liquid for dissolving the substance (fluorine-based solvent) that can dissolve the film 60f. In other words, the second liquid L2 of the present embodiment is a solution in which the solute is a fluorinated solvent and the solvent is alcohol. Examples of the alcohol for dissolving the fluorinated solvent include ethanol, isopropyl alcohol (IPA), and pentanol.

  As the solvent of the second liquid L2, it is desirable to use a solvent that is soluble in both the exposure liquid LQ and the solute of the second liquid L2. As described above, in the present embodiment, the solvent of the second liquid L2 is alcohol, the exposure liquid LQ is pure water, and the solute of the second liquid L2 is a fluorinated solvent, which is pure water. And the fluorine-based solvent are each soluble in alcohol.

  Further, the second liquid supply device 85 of the present embodiment can dissolve the fluorinated solvent in the alcohol and send out the second liquid L2 containing the fluorinated solvent at a predetermined concentration, and only the alcohol (solvent). It can also be sent out.

  In addition, the 2nd liquid L2 does not contain a fluorine-type solvent and may be formed only with alcohol. For example, the second liquid L2 may be methyl alcohol, ethyl alcohol, or isopropyl alcohol. Moreover, the 2nd liquid L2 may be formed only with the fluorine-type solvent, without containing alcohol. For example, the second liquid L2 may be hydrofluorocarbon ether (HFE) or hydrofluorocarbon (HFC). Further, the second liquid L2 may be a hydrogen peroxide solution.

  FIG. 12 is a schematic diagram showing how the surface state of the slit plate 60 is changed by the maintenance method according to the present embodiment. FIG. 12A shows a state immediately after the supply of the second liquid L2 to the slit plate 60 is started. The second liquid L <b> 2 supplied from the second supply port 82 contacts the surface of the slit plate 60.

  FIG. 12B shows a state after the first time has elapsed since the supply of the second liquid L2 to the slit plate 60 was started. As shown in FIG. 12B, the altered region Sc of the film 60f is gradually removed from the slit plate 60 by the contact between the slit plate 60 (film 60f) and the second liquid L2.

  In the present embodiment, when the maintenance of the slit plate 60 is executed, the control device 7 uses the second recovery port 83 in parallel with the operation of supplying the second liquid L2 using the second supply port 82. The recovery operation of L2 is executed, and the second liquid L2 supplied onto the slit plate 60 from the second supply port 82 is recovered from the second recovery port 83. Therefore, a part of the film 60f including the altered region Sc removed from the slit plate 60 by the second liquid L2 is recovered from the second recovery port 83 together with the second liquid L2. Therefore, it is possible to suppress a part of the film 60f removed from the slit plate 60 or the second liquid L2 including the dissolved film 60f from adhering (reattaching) to the slit plate 60.

  Further, the control device 7 moves the second liquid immersion member 81 and the slit plate 60 between the second liquid immersion member 81 and the slit plate 60 in a state where the second liquid immersion space LS2 is formed with the second liquid L2. Since it moves relatively, the second liquid L2 can be uniformly brought into contact with a wide area of the surface of the slit plate 60, and the film 60f can be uniformly dissolved and removed.

  FIG. 12C shows a state after the second time has elapsed since the supply of the second liquid L2 to the slit plate 60 was started. As shown in FIG. 12C, when the slit plate 60 (film 60f) and the second liquid L2 are kept in contact with each other, the entire surface layer of the film 60f whose physical properties have changed, that is, the altered region Sc is removed. .

  In the present embodiment, the control device 7 keeps the slit plate 60 and the second liquid L2 in contact until all of the film 60f is removed. Thereby, as shown in FIG. 12D, all of the film 60f is removed, and the light shielding film 62 (or the reflective film 63) of the slit plate 60 is exposed. Thus, in the present embodiment, the control device 7 uses the removal device 100 to remove all the film 60f of the slit plate 60.

  After the removal process of the film 60f is completed, the control device 7 starts the process of applying the first liquid L1 to the portion where the film 60f has been removed by the removal apparatus 100 using the application device 80 (step S2). .

  FIG. 13 is a schematic diagram illustrating a state where the coating apparatus 80 is coating the first liquid L1 on the slit plate 60. As illustrated in FIG. The control device 7 applies the first liquid L <b> 1 to the slit plate 60 using the application device 80.

  In the present embodiment, the coating device 80 includes a second liquid immersion member 81, and the control device 7 includes a first liquid L 1 and a first liquid immersion space LS 1 between the second liquid immersion member 81 and the slit plate 60. The first liquid L1 is applied to the slit plate 60 by forming.

  In order to apply the first liquid L1 to the slit plate 60, the control device 7 sets the flow path switching mechanism 88 to the first supply mode. As a result, the first liquid L <b> 1 delivered from the first liquid supply device 84 is supplied to the second supply port 82 via the supply channel 87. By supplying the first liquid L <b> 1 from the second supply port 82, the first liquid immersion space LS <b> 1 is formed with the first liquid L <b> 1 between the second liquid immersion member 81 and the slit plate 60.

  In addition, when the controller 7 applies the first liquid L1 to the slit plate 60, the first liquid L1 using the second recovery port 83 is performed in parallel with the supply operation of the first liquid L1 using the second supply port 82. The collection operation is executed.

  Further, the control device 7 moves the slit plate 60 (measurement stage 2) in the XY directions with respect to the second liquid immersion member 81 in a state where the first liquid immersion space LS1 is formed with the first liquid L1. By relatively moving the second immersion member 81 and the slit plate 60 in a state where the first immersion space LS1 is formed with the first liquid L1 between the second immersion member 81 and the slit plate 60. The first liquid L1 can be uniformly applied to a wide area on the surface of the slit plate 60.

  In the present embodiment, the first liquid L1 contains fluorine. As an example, the first liquid L1 is obtained by dissolving the above-mentioned Cytop in a predetermined fluorine-based solvent. The first liquid L1 may be one in which PFA is dissolved in a predetermined solvent.

  Note that when the second supply mode is changed to the first supply mode, the control device 7 controls the flow path switching mechanism 88, the second liquid supply device 85, and the like so that the second liquid L2 from the second supply port 82 is obtained. Stop supplying. Further, the control device 7 uses the second recovery port 83 to recover all the second liquid L2 in the second immersion space LS2. Next, the control device 7 controls the flow path switching mechanism 88, the first liquid supply device 84, and the like, and sends the first liquid L1 from the first liquid supply device 84. As a result, the second supply mode is changed to the first supply mode. When the second supply mode is changed to the first supply mode, the second liquid supply device 85 supplies the second supply port 82 for a predetermined time before the first liquid L1 is sent from the first liquid supply device 84. Alternatively, only an alcohol may be supplied, and an immersion space may be formed with the alcohol between the second immersion member 81 and the slit plate 60 (predetermined member S). By doing so, the supply channel 87, the lower surface 81A of the second liquid immersion member 81, and the surface of the slit plate 60 (predetermined member S) can be cleaned with alcohol. After the cleaning using the alcohol is completed and all the alcohol in the immersion space is recovered, the first liquid L1 is supplied from the first liquid supply device 84, and the first liquid is supplied to the slit plate 60 (predetermined member S). The process of applying L1 is started.

  The control device 7 stops the supply of the first liquid L1 from the second supply port 82 after finishing the process of applying the first liquid L1 to the slit plate 60, and uses the second recovery port 83 to stop the first liquid L1. All the first liquid L1 in the immersion space LS1 is recovered. In addition, in order to remove the first immersion space LS1 of the first liquid L1 from the slit plate 60, the slit plate 60 (measurement stage) with respect to the second immersion member 81 in a state where the first immersion space LS1 is formed. 2) may be moved in the XY directions.

  Next, the control device 7 starts a process of heating (baking) the film of the first liquid L1 formed on the slit plate 60 using the heating device 90 (step S3).

  FIG. 14 is a schematic diagram showing a state in which the heating device 90 is heating the film of the first liquid L1 formed on the slit plate 60. In the present embodiment, the heating device 90 heats the film of the first liquid L1 by irradiating the film of the first liquid L1 with light.

  As shown in FIG. 14, the heating device 90 of the present embodiment includes a light source device 91 that emits light and a condensing optical system 92 that collects light from the light source device 91. The light source device 91 includes, for example, a halogen lamp and a mercury lamp. The light emitted from the light source device 91 is condensed by the condensing optical system 92 and is emitted from the exit surface 92A of the condensing optical system 92. In the present embodiment, the exit surface 92 </ b> A of the condensing optical system 92 faces the −Z direction and can face the slit plate 60.

  In the present embodiment, when the film of the first liquid L1 is heated, the control device 7 causes the exit surface 92A of the condensing optical system 92 and the film of the first liquid L1 formed on the slit plate 60 to face each other. As described above, the position of the slit plate 60 in the XY directions is adjusted by moving the measurement stage 2. Thereby, the light emitted from the exit surface 92 </ b> A of the condensing optical system 92 can irradiate the film of the first liquid L <b> 1 formed on the slit plate 60. A driving device that can move the heating device 90 is provided, and the heating device 90 is arranged so that the exit surface 92A of the condensing optical system 92 of the heating device 90 faces the film of the first liquid L1 formed on the slit plate 60. You may move and you may move both the heating apparatus 90 and the slit board 60. FIG.

  The control device 7 emits light from the light source device 91 in a state where the emission surface 92A of the condensing optical system 92 and the film of the first liquid L1 formed on the slit plate 60 are opposed to each other. Light emitted from the light source device 91 is applied to the slit plate 60 via the condensing optical system 92. Thereby, the film | membrane of the 1st liquid L1 currently formed in the slit board 60 is heated. The film of the first liquid L1 is heated to be solidified and converted into a film 60f having liquid repellency with respect to the exposure liquid LQ. Thereby, a film 60f having a desired level of liquid repellency with respect to the exposure liquid LQ is newly formed on the slit plate 60.

  In the present embodiment, the heating device 90 includes a condensing optical system 92 that condenses the light emitted from the light source device 91, and a part of the slit plate 60 on which the film of the first liquid L1 is formed. It is possible to irradiate light to a local area. Therefore, the heating device 90 can locally heat a partial region on the slit plate 60.

  In this embodiment, since a part of area | region on the slit plate 60 is heated locally, it can suppress that the apparatus and member of the periphery of the slit plate 60 are heated unnecessarily. The influence can be suppressed.

  Further, the control device 7 moves the slit plate 60 (measurement stage 2) in the XY directions with respect to the heating device 90 in a state where light is emitted from the heating device 90. Note that the heating device 90 may be moved in the X and Y directions while light is emitted from the heating device 90, or both the heating device 90 and the slit plate 60 may be moved. By relatively moving the heating device 90 and the slit plate 60 in a state where light is emitted from the heating device 90, a wide area of the slit plate 60 (the film of the first liquid L1) can be favorably heated. .

  In the present embodiment, the maintenance process for the predetermined member S using the film forming apparatus including the removing apparatus 100, the coating apparatus 80, and the heating apparatus 90 is periodically performed. The maintenance process using the film forming apparatus can be executed, for example, every time a predetermined number of substrates P are exposed, every lot, every predetermined time interval, or the like.

  In the above description, the case where the slit plate 60 is mainly maintained has been described as an example. However, the control device 7 is not limited to the slit plate 60 but the reference plate 50, the upper plate 70, the plate member T, and the substrate. The table 12, the measurement table 22, etc. can be moved (positioned) to a position facing the lower surface 8 </ b> A of the terminal optical element 8, that is, a position where the exposure light EL from the terminal optical element 8 can be irradiated. In addition, a member capable of forming the third immersion space LS3 of the exposure liquid LQ between the first immersion member 30 and the first immersion member 30 can be maintained.

  As described above, according to the present embodiment, even if the liquid repellency with respect to the exposure liquid LQ on the surface of the predetermined member S is reduced by, for example, irradiation with the exposure light EL, the removal device 100, the coating device 80, and By maintaining the predetermined member S using the film forming apparatus including the heating device 90, a new film Sf is formed (re-formed) on the predetermined member S, and the liquid repellency of the surface of the predetermined member S with respect to the exposure liquid LQ Sex can be restored to the desired level. Therefore, when performing the immersion exposure process or the measurement process for the immersion exposure process, the exposure liquid LQ is prevented from remaining on the predetermined member S, and the third immersion space LS3 of the exposure liquid LQ is desired. Can be maintained in a state. Therefore, the performance of the exposure apparatus EX can be maintained, and the device having the desired performance can be manufactured by satisfactorily exposing the substrate P while suppressing the occurrence of exposure failure.

  In the present embodiment, maintenance processing for the predetermined member S including processing for forming a new film Sf (re-forming processing) can be performed in the exposure apparatus EX. Therefore, unlike the conventional case, the predetermined member S with reduced liquid repellency can be replaced without replacing the predetermined member S with reduced liquid repellency or without stopping the operation of the exposure apparatus EX for a long time. The surface liquid repellency can be recovered. Moreover, even if it becomes necessary to replace the predetermined member S having lowered liquid repellency, the frequency of replacement can be suppressed. Therefore, it is possible to expose the substrate P satisfactorily while suppressing a decrease in the operating rate of the exposure apparatus EX and suppressing the occurrence of exposure failure.

  Further, there is a possibility that the surface state of the film Sf is deteriorated such that the film Sf of the predetermined member S is contaminated, foreign matter adheres to the film Sf, or a part of the film Sf is damaged. For example, when exposing the substrate P, the exposure liquid LQ in the third immersion space LS3 contacts the surface of the substrate P and contacts the surfaces of the last optical element 8, the first immersion member 30, and the predetermined member S. To do. When, for example, a part of the substance (for example, part of the photosensitive material) of the substrate P is mixed (eluted) into the exposure liquid LQ in contact with the substrate P, the substance adheres to the surface of the predetermined member S, and the predetermined member S May contaminate the surface. Further, the surface of the predetermined member S may be contaminated not only by the substance generated from the substrate P but also by, for example, a substance (foreign matter) floating in the space where the exposure apparatus EX is placed. Further, since the surface of the predetermined member S is repeatedly contacted with the exposure liquid LQ, the film Sf may be damaged and a part thereof may be peeled off. If the surface state of the predetermined member S is deteriorated, exposure failure may occur and the performance of the exposure apparatus EX may deteriorate. For example, if the state in which the contaminants are attached to the surface of the predetermined member S is left unattended, the contaminants adhere to the surface of the substrate P, causing a defect in the pattern formed on the substrate P, for example. Defects may occur. Further, if the state where the surface of the measuring instrument (optical member) is contaminated is left, an exposure failure occurs due to a decrease in measurement accuracy using the measuring instrument, and the performance of the exposure apparatus EX is reduced. May be reduced.

  According to the present embodiment, since the film Sf whose surface condition has deteriorated is removed by the removing device 100 and a new film Sf is formed, the surface condition of the film Sf can be recovered to a desired state. Therefore, it is possible to suppress a decrease in performance of the exposure apparatus EX.

  In the present embodiment, since the heating device 90 locally heats a part of the region on the predetermined member S on which the film of the first liquid L1 is formed, peripheral devices and members are unnecessarily heated. It is possible to suppress the deterioration of the performance of the exposure apparatus EX.

  In the present embodiment, the case where the removing device 100 removes all the film Sf of the predetermined member S (slit plate 60) has been described as an example. However, it is not necessary to remove all the film Sf. For example, as described with reference to FIG. 12C, only the altered region Sc is removed, the first liquid L1 is applied on the film Sf remaining on the predetermined member S, and the first liquid L1 is removed. A film may be formed. That is, after removing a part of the film Sf in the thickness direction (Z-axis direction) using the removing device 100, the first liquid L1 may be applied to the removed part. Alternatively, after removing a part of the film Sf in the direction parallel to the surface (XY direction) using the removing device 100, the first liquid L1 may be applied to the removed part. For example, in the film 60 f formed on the slit plate 60, the decrease in liquid repellency of the film 60 f in the region near the slit portion 61 is significant, and the liquid repellency of the film 60 f in the region away from the slit portion 61 is significant. If the film is maintained at a desired level, the removal device 100 removes only a part of the film 60f in the region in the vicinity of the slit part 61 without removing the film 60f in the region away from the slit part 61. You may make it apply | coat the 1st liquid L1 to the removed part.

  In the present embodiment, the first immersion member 30 forms the third immersion space LS3 with the exposure liquid LQ, and the second immersion member 81 forms the first immersion space LS1 with the first liquid L1. In addition, the second liquid immersion space LS2 is formed by the second liquid L2. For example, the first liquid immersion member 30 forms the third liquid immersion space LS3 by the exposure liquid LQ and the first liquid L1 is the first liquid immersion space LS2. The one liquid immersion space LS1 may be formed, and the second liquid immersion member 81 may form the second liquid immersion space LS2 with the second liquid L2. Further, the first immersion member 30 forms the third immersion space LS3 with the exposure liquid LQ, the second immersion space LS2 with the second liquid L2, and the second immersion member 81 forms the first liquid L1. Thus, the first immersion space LS1 may be formed. Further, the second immersion member 81 is omitted, and the first immersion member 30 forms the third immersion space LS3 with the exposure liquid LQ, and forms the first immersion space LS1 with the first liquid L1, The second immersion space LS2 may be formed with the second liquid L2.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  A characteristic part of the second embodiment is that the second liquid immersion member 81B for forming the first liquid immersion space LS1 with the first liquid L1 between the predetermined member S and the predetermined member S The third liquid immersion member 101B for forming the second liquid immersion space LS2 with the two liquids L2 is provided separately.

  As shown in FIG. 15, the exposure apparatus EX of the present embodiment includes a second liquid immersion member 81B for forming the first liquid immersion space LS1 with the first liquid L1 between the predetermined member S and the predetermined member S. And a third liquid immersion member 101B for forming the second liquid immersion space LS2 with the second liquid L2. Although not shown in FIG. 15, the exposure apparatus EX of the present embodiment fills the optical path space of the exposure light EL with the exposure liquid LQ separately from the second liquid immersion member 81B and the third liquid immersion member 101B. The first immersion member 30 capable of forming the third immersion space LS3 with the exposure liquid LQ is provided.

  The second liquid immersion member 81B has a second supply port 82B for supplying the first liquid L1, and a second recovery port 83B for recovering the first liquid L1, and the first liquid L1 using the second supply port 82B. In parallel with this supply operation, the first liquid L1 is formed between the first liquid L1 and the predetermined member S by executing the recovery operation of the first liquid L1 using the second recovery port 83B. Thereby, the second liquid immersion member 81B can apply the first liquid L1 to the predetermined member S.

  The third liquid immersion member 101B has a third supply port 102B that supplies the second liquid L2, and a third recovery port 103B that recovers the second liquid L2, and the second liquid L2 that uses the third supply port 102B. In parallel with the supply operation, a second liquid L2 recovery operation using the second recovery port 103B is performed to form the second liquid immersion space LS2 with the second liquid L2 between the predetermined member S and the second liquid L2. Thereby, the third liquid immersion member 101B can remove the film of the predetermined member.

  When maintenance of the predetermined member S is performed, the control device 7 makes the third liquid immersion member 101B and the predetermined member S face each other, and the second liquid L2 is used between the third liquid immersion member 101B and the predetermined member S. A two-immersion space LS2 is formed. Thereby, the film Sf forming the surface of the predetermined member S is removed. After the film Sf is removed, the control device 7 makes the second liquid immersion member 81B and the predetermined member S face each other, and the first liquid L1 is first between the second liquid immersion member 81B and the predetermined member S. A liquid immersion space LS1 is formed. As a result, a film of the first liquid L1 is formed on the predetermined member S. Thereafter, the control device 7 uses the heating device 90 to heat the film of the first liquid L1 as in the first embodiment described above. As a result, a new film Sf is formed on the predetermined member S.

  In FIG. 15, the first immersion space LS1 and the second immersion space LS2 are simultaneously formed on the surface of the predetermined member S. However, after the film Sf is removed, all of the second liquid L2 is recovered. After that, the first liquid immersion space LS1 may be formed on the surface of the predetermined member S, and the film of the first liquid L1 may be formed on the predetermined member S.

<Third Embodiment>
Next, a third embodiment will be described. In the third embodiment, a modification of the heating device will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 16 is a diagram illustrating a heating device 90C according to the third embodiment. In FIG. 16, the heating device 90 </ b> C includes a light source device 91 that emits light, and a diaphragm member 94 having an opening 93 for defining a region on the predetermined member S to which the light from the light source device 91 is irradiated. ing. The light emitted from the light source device 91 passes through the opening 93 of the diaphragm member 94 and is irradiated to the predetermined member S.

  According to this embodiment, by providing the throttle member 94, a partial region of the predetermined member S can be locally heated. Therefore, it is possible to suppress unnecessary heating of peripheral devices and members.

  Further, the condensing optical system 92 as described with reference to FIG. 14 and the diaphragm member 94 as described with reference to FIG. 16 may be combined. For example, the condensing optical system 92 is disposed at a position where the light emitted from the light source device 91 is incident, and the diaphragm member 94 is disposed between the exit surface 92A of the condensing optical system 92 and the predetermined member S. Good.

  In order to suppress, for example, a temperature rise of the diaphragm member 94 due to light from the light source device 91, a temperature adjusting device (cooling device) for maintaining the diaphragm member 94 at a predetermined temperature can be provided.

  In the first and second embodiments described above, the case where the heating device 90 (90C) irradiates the film of the first liquid L1 has been described as an example. However, for example, infrared light, microwaves, and the like The film of the first liquid L1 may be irradiated with electromagnetic waves other than visible light. Moreover, you may heat the film | membrane of the 1st liquid L1 using the heater apparatus containing a heating wire etc. In this case, the heater device is desirably arranged at a position away from the projection optical system PL. Further, a chamber mechanism capable of accommodating at least one of the substrate stage 1 and the measurement stage 2 is provided, and the substrate stage 1 or the measurement stage 2 accommodated in the chamber mechanism can be heated by a heater device.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the fourth embodiment, a modification of the removing device will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 17 is a diagram illustrating a removing device 100D according to the fourth embodiment. In FIG. 17, the removing apparatus 100 </ b> D includes a polishing apparatus 110 that polishes the surface of the predetermined member S. Also by polishing the surface of the predetermined member S, the film Sf having reduced liquid repellency with respect to the exposure liquid LQ can be removed. Then, the first liquid L1 is applied to the portion where the film Sf has been removed by the polishing apparatus 110.

  A polishing apparatus 110 illustrated in FIG. 17 includes a polishing member 112, a support member 113 that can support the polishing member 112, and a drive device 114 that can move the support member 113. In the present embodiment, the lower surface (polishing surface) 111 of the polishing member 112 is substantially parallel to the XY plane. In the present embodiment, the lower surface 111 of the polishing member 112 has an annular shape in the XY plane.

In the present embodiment, the polishing member 112 includes a grindstone. The grindstone is made of a porous member (for example, alumina (AL ₂ O ₃ ), white ceramics, alkane stone, TiO ₂ , ZrO ₂ , ruby, Altech, etc.). In the present embodiment, the polishing member 112 has a cylindrical side plate portion 112A and an upper plate portion 112B connected to the upper end of the side plate portion 112A. An opening 112C is formed at the center of the upper plate portion 112B. The lower surface (polishing surface) 111 is disposed at the lower end of the side plate portion 112A.

  The support member 113 includes a rod portion 113A that is long in the Z-axis direction and a flange portion 113B that is connected to the lower end of the rod portion 113A. The flange portion 113B is disposed in an internal space formed by the side plate portion 112A and the upper plate portion 112B of the polishing member 112. A part of the lot portion 113A is disposed inside the opening 112C of the upper plate portion 112B. The outer shape of the flange portion 113B in the XY plane is larger than the opening 112C. Further, the outer shape of the rod portion 113A in the XY plane (the diameter of the rod portion 113A) is smaller than the opening 112C. The rod portion 113A is movable (movable up and down) in the Z-axis direction with respect to the polishing member 112 inside the opening 112C.

  The drive device 114 can move the support member 113 in the Z-axis direction. In the present embodiment, the driving device 114 includes a cylinder portion 114A, and the rod portion 113A of the support member 113 is disposed inside the cylinder portion 114A. The drive device 114 can move the rod portion 113A disposed inside the cylinder portion 114A in the Z-axis direction. As the rod portion 113A moves in the Z-axis direction by the driving device 114, the upper surface 113T of the flange portion 113B and the lower surface 112U of the upper plate portion 112B come into contact with or separate from each other. The driving device 114 moves (raises) the rod portion 113A in the + Z direction in a state where the upper surface 113T of the flange portion 113B and the lower surface 112U of the upper plate portion 112B are in contact with each other. Can be moved (increased) in the + Z direction.

  When the film Sf of the predetermined member S is removed using the polishing apparatus 110, the control apparatus 7 performs polishing in a state where the lower surface 111 of the polishing member 112 and the surface of the predetermined member S are in contact with each other, as shown in FIG. The predetermined member S is moved so that the member 112 and the surface of the predetermined member S move relatively in the XY directions substantially parallel to the lower surface 111. As a result, the film Sf that forms the surface of the predetermined member S is polished and removed by the polishing member 112. In the present embodiment, since the rod portion 113A of the support member 113 is disposed inside the opening 112C of the polishing member 112 during the polishing process using the polishing member 112, the predetermined member S is moved in the XY direction. With this movement, the polishing member 112 can be prevented from greatly moving in the XY direction.

  In the present embodiment, after the polishing process using the polishing member 112 is completed and the polishing member 112 is separated from the predetermined member S, the control device 7 separates the predetermined member S and the second liquid as shown in FIG. The immersion member 81D is opposed. Then, the control device 7 forms a fourth immersion space LS4 with the fourth liquid L4 between the second liquid immersion member 81D and the predetermined member S. The second liquid immersion member 81D performs the recovery operation of the fourth liquid L4 using the second recovery port 83D in parallel with the supply operation of the fourth liquid L4 using the second supply port 82D.

  In parallel with the supply operation of the fourth liquid L4 using the second supply port 82D, the recovery operation of the fourth liquid L4 using the second recovery port 83D is executed, so that the predetermined member S generated by the polishing process is applied. The foreign matter (polishing residue) is recovered from the second recovery port 83D together with the fourth liquid L4 and removed from the predetermined member S. Since the foreign matter on the surface of the predetermined member S can be easily removed by the polishing process using the polishing member 112, the fourth immersion space LS4 is formed on the surface of the predetermined member S, thereby Together with the four liquids L4, it can be easily recovered from the second recovery port 83D. Further, since a new (clean) fourth liquid L4 is continuously supplied from the second supply port 82D onto the predetermined member S, the surface of the predetermined member S can be cleaned with the fourth liquid L4. .

  After the process of removing at least a part of the film Sf is completed, the control device 7 applies the first liquid L1 to the predetermined member S and the first liquid formed on the predetermined member S, as in the above-described embodiments. Heat L1.

  Note that as a process for removing at least part of the film Sf, ultraviolet rays may be irradiated.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the fifth embodiment, a modification of the coating apparatus will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 19 is a diagram illustrating an example of a coating apparatus 80E according to the fifth embodiment. The coating device 80E according to the present embodiment includes a spray device 150 that applies pressure to the first liquid L1 and ejects the first liquid L1 in a mist form. The spray device 150 includes a spray head 152 having an ejection port 151 capable of ejecting the first liquid L1 in the form of a mist. The ejection port 151 can face the surface of the predetermined member S, and the coating device 80E can supply the first liquid L1 ejected from the ejection port 151 to the surface of the predetermined member S. The first liquid L <b> 1 is applied to the predetermined member S by the first liquid L <b> 1 ejected from the ejection port 151.

  FIG. 20 is a diagram illustrating an example of a coating apparatus 80F. A coating apparatus 80F illustrated in FIG. 20 includes an inkjet apparatus 160 that ejects droplets of the first liquid L1. The inkjet device 160 includes an inkjet head 162 having an ejection port 161 that ejects a droplet of the first liquid L1. The ejection port 161 can face the surface of the predetermined member S, and the coating device 80F can supply the droplet of the first liquid L1 ejected from the ejection port 161 to the surface of the predetermined member S. The first liquid L1 is applied to the predetermined member S by the first liquid L1 discharged from the discharge port 161.

  The application device that applies the first liquid L1 to the predetermined member S is not limited to the spray device 150 and the inkjet device 160. For example, while supplying the first liquid L1 from the slit-like opening, the slit-like opening is provided. The first liquid L1 is applied to the predetermined member S by using various coating methods such as slit coating, in which the first liquid L1 is applied on the predetermined member S by relatively moving between the predetermined member S and the predetermined member S. be able to.

  In each of the above-described embodiments, for example, an exhaust device for exhausting gas generated from the first liquid L1 (a solvent or the like of the first liquid L1) can be disposed in the vicinity of the coating device. Thereby, when apply | coating the 1st liquid L1 to the predetermined member S, it can suppress that the gas emitted from the 1st liquid L1 diffuses in the exposure apparatus EX.

  In each of the above-described embodiments, the maintenance process for re-forming a new film Sf on the predetermined member S such as the slit plate 60 has been described as being periodically performed. Can be detected (whether or not the liquid repellency of the surface of the predetermined member S is reduced), and the timing for executing the maintenance process can be determined based on the detection result. For example, the second alignment system ALG acquires an image (optical image) of the surface of the predetermined member S, and determines whether to perform maintenance processing for re-forming the film Sf based on the acquired image information. You may make it do. As described above, the second alignment system ALG of the present embodiment has an image sensor such as a CCD, and can acquire an image of the predetermined member S. When the surface energy of the predetermined member S is increased (when the liquid repellency of the surface of the predetermined member S is deteriorated), the operation of removing the exposure liquid LQ from the surface of the predetermined member S is executed. There is a high possibility that the exposure liquid LQ (droplet) remains on the surface of the predetermined member S. Therefore, the control device 7 determines that the exposure liquid LQ (droplet) remains on the surface of the predetermined member S based on the image information of the surface of the predetermined member S acquired using the second alignment system ALG. In this case, it is determined (estimated) that the liquid repellency of the surface of the predetermined member S has deteriorated, and a maintenance process for re-forming the film Sf on the predetermined member S is executed. Further, a measurement device that measures the contact angle of the droplet of the exposure liquid LQ on the surface of the predetermined member S may be mounted on the exposure device EX, and it may be determined whether or not to perform maintenance processing based on the measurement result.

  In addition, a temperature sensor capable of detecting the temperature of the surface of the predetermined member S is provided in the predetermined member S, and whether or not to perform a maintenance process for forming the film Sf based on the detection result of the temperature sensor. It may be determined. When the surface energy of the predetermined member S is increased (when the liquid repellency of the surface of the predetermined member S is deteriorated), there is a possibility that the exposure liquid LQ (droplet) remains on the surface of the predetermined member S. The temperature of the surface of the predetermined member S may change (decrease) greatly due to vaporization of the remaining exposure liquid LQ. Therefore, when the control device 7 detects that the temperature of the surface of the predetermined member S has greatly changed based on the detection result of the temperature sensor, the liquid repellency of the surface of the predetermined member S deteriorates, It is determined (estimated) that the exposure liquid LQ (droplet) is likely to remain on the surface of the predetermined member S, and a surface treatment operation for reducing the surface energy of the predetermined member S is executed.

  In each of the above-described embodiments, an example is given in which a maintenance process is performed on the predetermined member S in order to re-form the film Sf whose liquid repellency has been lowered mainly by irradiation with the exposure light EL. However, the predetermined member S to be maintained may be a member that is not irradiated with the exposure light EL. Even in a member that is not irradiated with the exposure light EL, the liquid repellency of the surface of the member may deteriorate over time, for example. Even in such a case, the liquid repellency of the surface of the predetermined member S can be recovered by forming a new liquid repellant film on the surface of the member.

  In the above-described embodiments, the surface of the predetermined member S is formed of a material containing fluorine. However, the surface of the predetermined member S is formed of a material other than fluorine, such as silicon or acrylic. It may be. By forming the surface of the predetermined member S with a material containing silicon, acrylic, etc., the surface of the predetermined member S has liquid repellency. In this case, the second liquid L2 to be used is appropriately selected according to the material forming the surface of the predetermined member S. That is, a substance capable of dissolving the surface (film) of the predetermined member S is appropriately selected according to the material forming the surface of the predetermined member S.

  Further, in the above-described embodiment, the predetermined member S that can be moved (placed) to a position (position where the exposure light EL can be irradiated) facing the terminal optical element 8 and the first liquid immersion member 30 is a maintenance target. However, at least a part (a side surface or the like) of the surface of a part of the optical elements (for example, the terminal optical element 8) of the projection optical system PL and a part of the surface of the first immersion member 30 (a side surface of the terminal optical element 8) When a liquid-repellent film is formed, at least one of these may be a maintenance target. In this case as well, a removing device that removes a film having reduced liquid repellency, a coating device that applies a new film, and a heating device that solidifies the film may be provided at predetermined positions.

  In each of the above-described embodiments, when a new film is formed on the predetermined member S or the like, depending on the type (material) of the film, at least one of removal of the film and heating of the new film may be omitted.

Although exposure liquid LQ of the embodiments discussed above is water, a liquid other than water may be, for example, when the light source of exposure light EL is an F ₂ laser, the F ₂ laser beam is water Since it does not transmit, the exposure liquid LQ may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F ₂ laser light. In addition, as the exposure liquid LQ, the exposure liquid EL has transparency to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, (Cedar oil) can also be used. Further, as the exposure liquid LQ, one having a refractive index of about 1.6 to 1.8 may be used. Further, an optical element (such as a terminal optical element) of the projection optical system PL that is in contact with the exposure liquid LQ may be formed of a material having a refractive index higher than that of quartz and fluorite (for example, 1.6 or more). As the exposure liquid LQ, various fluids such as a supercritical fluid can be used.

  In the projection optical system of each of the above-described embodiments, the optical path space on the image surface (exit surface) side of the last optical element 8 is filled with liquid, but as disclosed in WO 2004/019128. In addition, a projection optical system in which the optical path space on the object surface (incident surface) side of the last optical element 8 is also filled with liquid can be employed.

  In each of the above-described embodiments, an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed. However, this is disclosed in US Pat. No. 5,825,043 and the like. It is possible to employ an immersion exposure apparatus that performs exposure while the entire surface of the substrate to be exposed is immersed in the liquid.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P It is possible to employ a step-and-repeat type projection exposure apparatus (stepper) that collectively exposes the pattern of the mask M in a stationary state and moves the substrate P in steps.

  Further, as exposure apparatus EX, in a step-and-repeat exposure, a reduced image of the first pattern was transferred onto substrate P using the projection optical system while the first pattern and substrate P were substantially stationary. After that, with the second pattern and the substrate P being substantially stationary, a batch-type exposure of the stitch method in which a reduced image of the second pattern is partially overlapped with the first pattern using the projection optical system and is collectively exposed on the substrate P. An apparatus may be employed. Further, as the stitch type exposure apparatus, a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred onto the substrate P and transferred, and the substrate P is sequentially moved can be adopted.

  Further, as an exposure apparatus EX, for example, as disclosed in US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and a single scanning exposure is performed. An exposure apparatus that double exposes one shot area on the substrate almost simultaneously can be employed. Further, as the exposure apparatus EX, a proximity type exposure apparatus, a mirror projection aligner, or the like can be adopted.

  Further, as the exposure apparatus EX, US Pat. No. 6,341,007, US Pat. No. 6,400,441, US Pat. No. 6,549,269, US Pat. No. 6,590,634, US Pat. No. 6,208, It is also possible to employ a twin stage type exposure apparatus provided with a plurality of substrate stages as disclosed in US Pat. No. 407, US Pat. No. 6,262,796, and the like.

  Further, as disclosed in US Pat. No. 6,897,963, European Patent Application Publication No. 1,713,113, etc., a substrate stage for holding a substrate and a reference member on which a reference mark is formed The present invention can also be applied to an exposure apparatus including a measurement stage equipped with various photoelectric sensors. An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.

  The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  In each of the above-described embodiments, the position information of the mask stage, the substrate stage, and the measurement stage is measured using an interferometer system including a laser interferometer. You may use the encoder system which detects the scale (diffraction grating) provided in this. In this case, it is preferable that a hybrid system including both the interferometer system and the encoder system is used, and the measurement result of the encoder system is calibrated using the measurement result of the interferometer system. Further, the position of the stage may be controlled by switching between the interferometer system and the encoder system or using both.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. In addition, a harmonic generation apparatus that includes a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like and outputs pulsed light with a wavelength of 193 nm may be used. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaping mask (an electronic mask, an active mask, or an image) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. (Also called a generator) may be used. The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). The variable shaping mask is not limited to DMD, and a non-light emitting image display element described below may be used instead of DMD. Here, the non-light-emitting image display element is an element that spatially modulates the amplitude (intensity), phase, or polarization state of light traveling in a predetermined direction, and a transmissive liquid crystal modulator is a transmissive liquid crystal modulator. An electrochromic display (ECD) etc. are mentioned as an example other than a display element (LCD: Liquid Crystal Display). In addition to the DMD described above, the reflective spatial light modulator includes a reflective mirror array, a reflective liquid crystal display element, an electrophoretic display (EPD), electronic paper (or electronic ink), and a light diffraction type. An example is a light valve (Grating Light Valve).

  Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. In this case, no illumination optical system is required. Here, as a self-luminous image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission) Display), plasma display (PDP: Plasma Display Panel), and the like. Further, as a self-luminous image display element provided in the pattern forming apparatus, a solid light source chip having a plurality of light emitting points, a solid light source chip array in which a plurality of chips are arranged in an array, or a plurality of light emitting points on a single substrate A built-in type or the like may be used to form a pattern by electrically controlling the solid-state light source chip. The solid light source element may be inorganic or organic.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the exposure apparatus and the exposure method that do not use the projection optical system PL can be employed. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as the exposure apparatus EX, for example, as disclosed in International Publication No. 2001/035168 pamphlet, an exposure pattern for exposing a line and space pattern on the substrate P is formed by forming interference fringes on the substrate P. An apparatus (lithography system) can be employed.

  The exposure apparatus EX of the present embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. The In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 21, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with exposure light from a mask and developing the exposed substrate according to the above-described embodiment, device assembly step (dicing process, bonding process, package) (Including processing processes such as processes) 205, inspection step 206, and the like. The maintenance method in the exposure apparatus EX described in each of the above-described embodiments is included in the substrate processing step 204, and the substrate P is exposed using the exposure apparatus EX maintained by the maintenance method.

  Although the embodiments of the present invention have been described as described above, the present invention can be used by appropriately combining all the above-described constituent elements, and some constituent elements may not be used.

  It should be noted that the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in each of the above embodiments and modifications is incorporated herein by reference.

It is a schematic block diagram which shows the exposure apparatus which concerns on 1st Embodiment. It is the sectional side view which expanded a part of FIG. It is a perspective view which shows a substrate stage and a measurement stage. It is the top view which looked at the substrate stage and the measurement stage from the upper part. FIG. 5 is an enlarged side sectional view of the vicinity of a second liquid immersion member according to the first embodiment. It is the figure which looked at the 2nd liquid immersion member from the lower part. It is a sectional side view which shows the vicinity of a slit board. It is a schematic diagram for demonstrating an example of the predetermined member which has a liquid repellent film | membrane. It is a mimetic diagram for explaining a predetermined member in the state where surface energy increased. It is a flowchart which shows an example of the maintenance method which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of the maintenance method which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of the maintenance method which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of the maintenance method which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of the maintenance method which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of the exposure apparatus which concerns on 2nd Embodiment. It is a figure which shows an example of the heating apparatus which concerns on 3rd Embodiment. It is a figure which shows an example of the removal apparatus which concerns on 4th Embodiment. It is a schematic diagram for demonstrating an example of the maintenance method which concerns on 4th Embodiment. It is a figure which shows an example of the coating device which concerns on 5th Embodiment. It is a figure which shows an example of the coating device which concerns on 5th Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate stage, 2 ... Measurement stage, 5 ... 2nd drive system, 8 ... Terminal optical element, 30 ... 1st liquid immersion member, 31 ... 1st supply port, 32 ... 1st collection | recovery port, 50 ... Reference | standard board, 50f ... membrane, 60 ... slit plate, 60f ... membrane, 70 ... upper plate, 70f ... membrane, 80 ... coating apparatus, 81 ... second immersion member, 82 ... second supply port, 83 ... second recovery port, 90 DESCRIPTION OF SYMBOLS ... Heating device 91 ... Light source device 92 ... Condensing optical system 93 ... Aperture 94 ... Diaphragm member 100 ... Removal device 110 ... Polishing device EL ... Exposure light EX ... Exposure device IL ... Illumination system L1 ... first liquid, L2 ... second liquid, LQ ... exposure liquid, LS1 ... first immersion space, LS2 ... second immersion space, LS3 ... third immersion space, P ... substrate, PH1 ... first holding Part, PH2 ... second holding part, S ... predetermined member, Sf ... film, T ... plate member, Tf ... film

Claims (44)

An exposure apparatus that exposes a substrate with exposure light through an exposure liquid,
An application device that applies a first liquid containing a material having liquid repellency to the exposure liquid to a predetermined member;
An exposure apparatus comprising: a heating device that heats the first liquid film formed on the predetermined member.   The exposure apparatus according to claim 1, wherein the first liquid contains fluorine.   The exposure apparatus according to claim 1, wherein the heating device irradiates the film with light. The heating device includes a light source device that emits the light;
The exposure apparatus according to claim 3, further comprising a condensing optical system that condenses light from the light source device. The heating device includes a light source device that emits the light;
The exposure apparatus according to claim 3, further comprising: a diaphragm member having an opening for defining a region on the predetermined member to which light from the light source device is irradiated.   The exposure apparatus according to claim 1, wherein the heating device locally heats a partial region on the predetermined member on which the film is formed.   The said coating device has a 1st liquid immersion member, and forms the 1st liquid immersion space with the said 1st liquid between the said 1st liquid immersion member and the said predetermined member. The exposure apparatus according to item.   The exposure apparatus according to claim 7, wherein the first liquid immersion member has a first supply port for supplying the first liquid.   The exposure apparatus according to claim 7 or 8, wherein the first liquid immersion member has a first recovery port for recovering the first liquid. Forming a second immersion space with a second liquid capable of dissolving at least a part of a film forming at least a part of the surface of the predetermined member between the first liquid immersion member and the predetermined member;
The exposure apparatus according to claim 7, wherein the coating apparatus applies the first liquid to a portion where the film is removed using the second liquid. A removing device for removing at least part of the film forming at least part of the surface of the predetermined member;
The exposure apparatus according to claim 1, wherein the coating apparatus applies the first liquid to a portion where the film is removed by the removing apparatus.   The exposure apparatus according to claim 11, wherein the film removed by the removing apparatus includes a liquid repellent film having reduced liquid repellency with respect to the exposure liquid.   The exposure apparatus according to claim 11 or 12, wherein the removing apparatus removes at least a part of the film using a second liquid capable of dissolving the film forming at least a part of the surface of the predetermined member.   The exposure apparatus according to claim 13, wherein the removing device includes the second liquid immersion member, and a second liquid immersion space is formed with the second liquid between the second liquid immersion member and the predetermined member.   The exposure apparatus according to claim 14, wherein the second liquid immersion member has a second supply port for supplying the second liquid.   16. The exposure apparatus according to claim 14, wherein the second liquid immersion member has a second recovery port for recovering the second liquid.   The exposure apparatus according to claim 11, wherein the removing apparatus includes a polishing apparatus that polishes a surface of the predetermined member.   The exposure apparatus according to claim 1, wherein the predetermined member is in contact with the exposure liquid.   The exposure apparatus according to claim 1, wherein the predetermined member is irradiated with the exposure light in a state of being in contact with the exposure liquid.   The exposure apparatus according to claim 1, wherein the predetermined member is movable to a position where the exposure light is irradiated. A third immersion member capable of forming a third immersion space with the exposure liquid so as to fill an optical path of the exposure light with the exposure liquid;
21. The exposure apparatus according to claim 20, wherein the coating device and the heating device are arranged at positions different from the third liquid immersion member.   The exposure apparatus according to claim 1, wherein the predetermined member includes a first movable member that is movable while holding the substrate. The first movable member includes a first holding part that holds the substrate, and a second holding part that is disposed at least at a part of the periphery of the first holding part and holds the plate member in a removable manner.
The exposure apparatus according to claim 22, wherein the predetermined member includes the plate member.   The exposure apparatus according to any one of claims 1 to 23, wherein the predetermined member includes a second movable member that is movable while mounting a measuring instrument without holding the substrate. The measuring instrument has an optical member capable of transmitting light,
The exposure apparatus according to claim 24, wherein the predetermined member includes the optical member. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 25;
Developing the exposed substrate; and a device manufacturing method. An exposure apparatus maintenance method for exposing a substrate with exposure light through an exposure liquid,
Applying a first liquid containing a material having liquid repellency to the exposure liquid to a predetermined member of the exposure apparatus;
Heating the first liquid film formed on the predetermined member.   28. The maintenance method according to claim 27, wherein the application includes forming a first immersion space with the first liquid on the predetermined member.   The maintenance method according to claim 27 or 28, wherein a part of the region on the predetermined member on which the film is formed is locally heated.   30. The maintenance method according to claim 27, wherein the heating includes irradiating the film with light. Removing at least part of the film forming at least part of the surface of the predetermined member,
The maintenance method according to any one of claims 27 to 30, wherein the first liquid is applied to a portion where the film is removed.   32. The maintenance method according to claim 31, wherein the film forming at least a part of the surface of the predetermined member includes a liquid repellent film having reduced liquid repellency with respect to the exposure liquid.   The maintenance method according to claim 31 or 32, wherein the removing includes forming a second immersion space on the predetermined member with a second liquid capable of dissolving a film forming at least a part of the surface of the predetermined member. .   The maintenance method according to any one of claims 31 to 33, wherein the removing includes polishing a surface of the predetermined member.   The maintenance method according to any one of claims 27 to 34, wherein the predetermined member is in contact with the exposure liquid.   36. The maintenance method according to any one of claims 27 to 35, wherein the predetermined member is irradiated with the exposure light while being in contact with the exposure liquid.   The maintenance method according to any one of claims 27 to 36, wherein the predetermined member is movable to a position where the exposure light is irradiated.   The maintenance method according to any one of claims 27 to 37, wherein the predetermined member includes a first movable member that is movable while holding the substrate. The first movable member includes a first holding part that holds the substrate, and a second holding part that is disposed at least at a part of the periphery of the first holding part and holds the plate member in a removable manner.
The maintenance method according to claim 38, wherein the predetermined member includes the plate member.   The maintenance method according to any one of claims 27 to 39, wherein the predetermined member includes a second movable member that is movable while mounting a measuring instrument without holding the substrate. The measuring instrument has an optical member capable of transmitting light,
41. The maintenance method according to claim 40, wherein the predetermined member includes the optical member. A film forming apparatus used in an immersion exposure apparatus that exposes a substrate with exposure light through an exposure liquid,
A removing device for removing at least a part of a film forming at least a part of the surface of the predetermined member;
An applicator for applying a first liquid containing a material having liquid repellency to the exposure liquid to the predetermined member;
And a heating device that heats the first liquid film formed on the predetermined member.   43. The film forming apparatus according to claim 42, wherein the removing apparatus removes at least a part of the film using a second liquid capable of dissolving the film forming at least a part of the surface of the predetermined member.   44. The film forming apparatus according to claim 42, wherein the heating device irradiates light onto the film of the first liquid.

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