JP2009020835A - Radio ic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To constitute a radio IC device of which whole size is reduced and of which radiation property is improved, thus raising the transmission efficiency of a signal to the antenna of a reader/writer. <P>SOLUTION: An electromagnetic coupling module 1 comprises a feeder circuit board 4 and a radio IC chip having it and is connected to a spiral conductor 7 through power feeding conductors 8a, 8b. The spiral conductor 7 and the power feeding conductors 8a, 8b are molded by a mould resin 9 and the electromagnetic coupling module 1 is bonded thereupon, thus constituting the radio IC device 10. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wireless IC device that is applied to an RFID (Radio Frequency Identification) system that performs non-contact data communication using electromagnetic waves.

  2. Description of the Related Art In recent years, RFID systems that perform non-contact communication between a reader / writer that generates an induction electromagnetic field and a wireless IC device that stores predetermined information attached to an article and transmit information are used as article management systems ( Patent Document 1).

  FIG. 1 is a diagram illustrating an example of a non-contact IC tag (wireless IC device) shown in Patent Document 1 in which an IC tag label is attached to an IC tag antenna.

  The wireless IC device T0 includes a pair of left and right main antenna elements 81, 81, an auxiliary antenna element 82, and a pair of left and right matching portions 83, 83 formed on one surface of a dielectric substrate 84.

  The main antenna elements 81, 81 are meander type antennas whose conductor lines are formed in a meander line shape, and are arranged symmetrically on the dielectric substrate 84. The main antenna elements 81, 81 occupy both end areas of the dielectric substrate 84, and an auxiliary antenna element 82 is disposed between the pair of left and right main antenna elements 81, 81.

Each matching part 83, 83 is a conductor wire (inductor) formed in a meander line shape. One end portions of the matching portions 83 and 83 are connected to inner end portions of the main antenna elements 81 and 81, respectively, and a wireless IC chip 86 is mounted on each other end portion of the matching portions 83 and 83.
JP 2005-244778 A

However, the non-contact IC tag of Patent Document 1 has the following problems.
(A) Since the matching portion for impedance matching between the wireless IC and the main antenna is arranged on the same plane as the main antenna, the size of the wireless tag is increased. In addition, since the size of the matching portion also changes depending on the size and shape of the main antenna, it is necessary to change the wireless tag size according to the specifications.

(B) Since the shape is a small dipole, the characteristics are greatly deteriorated as the size is reduced, so that it is difficult to reduce the size.

(C) Since the structure conforms to the dipole antenna, the gain is greatly deteriorated if the conductor is close.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a wireless IC device in which the overall size is reduced and the radiation characteristics are improved, so that the signal transmission efficiency with the reader / writer antenna is increased.

In order to solve the above problems, the wireless IC device of the present invention is configured as follows.
(1) An electromagnetic coupling module that includes a wireless IC chip, an inductance element, and includes a power supply circuit board that is electrically connected to the wireless IC chip and is coupled to an external circuit; And a radiator made of a spiral conductor to be coupled to form a wireless IC device.

(2) A resonant circuit is formed in the feeder circuit board.
(3) A matching circuit is formed in the feeder circuit board.

(4) The electromagnetic coupling module couples the two coupling portions to two places of the radiator that are separated by a predetermined distance.

(5) The radiator includes two separated radiators, and the two coupling portions of the electromagnetic coupling module are coupled to the respective radiators.

(6) The two radiators are arranged in different directions with respect to the central axis of their respective spirals.

(7) The radiator is arranged, for example, on the conductor surface or in the vicinity of the conductor surface.

(8) The conductor is composed of, for example, an electrode pattern formed on a circuit board in an electronic device.

(9) The conductor is formed of a metal plate provided in a component such as a liquid crystal display panel in an electronic device.

(10) The power supply circuit is formed of, for example, a multilayer substrate including a plurality of electrode layers.

(11) The power feeding circuit is constituted by a flexible substrate on which an electrode pattern is formed, for example.

(12) The radiator is composed of, for example, a multilayer substrate having a plurality of electrode layers.

(13) The power feeding circuit and the radiator are configured by, for example, one multilayer substrate having a plurality of electrode layers.

(14) A plurality of electromagnetic coupling modules for different communication systems may be coupled to the plurality of radiators.

According to the present invention, the following effects can be obtained.
(1) A dense portion of electromagnetic field distribution can be made in or near a radiator made of a spiral conductor, and a small-sized, broadband and high-gain wireless IC device can be obtained.

(2) By providing a resonance circuit in the power supply circuit board, energy transmission / reception (transmission / reception) of a signal having a frequency used in the RFID system can be performed with high efficiency. In addition, the optimum resonance frequency can be set in consideration of the shape and size of the radiator. As a result, the radiation characteristics of the neutral IC device can be improved.

(3) By providing a matching circuit in the power supply circuit board, energy transmission / reception (transmission / reception) of a signal having a frequency used in the RFID system can be performed with high efficiency.

(4) Since the two coupling parts of the electromagnetic coupling module are coupled to two places separated by a predetermined distance of the radiator, the impedance of the spiral conductor viewed from the two coupling parts becomes inductive, Matching with a capacitive electromagnetic coupling module is facilitated.

(5) Since the two coupling portions of the electromagnetic coupling module are coupled to the two separated radiators, the impedance of the spiral conductor viewed from the two coupling portions becomes capacitive, and therefore inductive It becomes easy to match with the electromagnetic coupling module.

(6) By arranging two radiators in directions in which the central axes of the respective spirals are different, directions having poor directivities can be covered, and a non-directional wireless IC device can be obtained.

(7) By disposing the radiator on the conductor surface or in the vicinity of the conductor surface, the conductor also acts as a radiator, so that a non-directional and high-gain wireless IC device can be obtained.

(8) By making the said conductor into the electrode pattern formed in the circuit board in an electronic device, the circuit board with which an electronic device is equipped can be utilized as it is, and the mounting of an electromagnetic coupling module and a conductor becomes easy.

(9) By using the conductor as a metal plate provided in a component such as a liquid crystal display panel in the electronic device, the component provided in the electronic device can be used as it is, thereby increasing the size and cost. There is nothing.

(10) By configuring the power feeding circuit with a multilayer substrate including a plurality of electrode layers, the area occupied by the matching circuit can be reduced, and the wireless IC device can be downsized.

(11) By configuring the power supply circuit with a flexible substrate on which an electrode pattern is formed, the number of electrode formations can be reduced, and the power supply circuit can be configured at low cost. Moreover, it can be made thin overall.

(12) By configuring the radiator with a multilayer substrate including a plurality of electrode layers, the occupation area and volume of the radiator can be reduced, and the size of the wireless IC device can be reduced.

(13) By configuring the power feeding circuit and the radiator with a single multilayer substrate including a plurality of electrode layers, the entire occupied area and volume can be reduced, and the wireless IC device can be downsized.

(14) By coupling a plurality of electromagnetic coupling modules for different communication systems to the plurality of radiators, the wireless IC device can also be used for a plurality of communication systems, and the entire apparatus to be assembled can be reduced in size.

<< First Embodiment >>
The configuration of the wireless IC device according to the first embodiment will be described with reference to FIGS.
FIG. 2 is a perspective view of the wireless IC device according to the first embodiment. The wireless IC device 10 includes an electromagnetic coupling module 1, a spiral conductor 7, power feeding conductors 8 a and 8 b, and a mold resin 9.

The electromagnetic coupling module 1 includes a power supply circuit board 4 and a wireless IC chip 5 mounted thereon.
The spiral conductor 7 and the power feeding conductors 8 a and 8 b are embedded in the mold resin 9, and the electrodes are not exposed on the outer surface of the mold resin 9. The electromagnetic coupling module 1 is mounted (attached) on the upper surface of the mold resin 9 to be electromagnetically coupled.

  3 is an exploded perspective view of the wireless IC device shown in FIG. The spiral conductor 7 is an aggregate of conductors extending in the horizontal direction and the vertical direction. The power feeding conductors 8a and 8b are electrically connected to two portions of the spiral conductor 7 that are separated by a predetermined distance. The electromagnetic coupling module 1 is capacitively coupled to the power supply conductors 8a and 8b.

  FIG. 4 is an exploded perspective view of the electromagnetic coupling module 1. The feeder circuit board 4 is constituted by a multilayer board formed by laminating dielectric layers each having an electrode pattern. Radio IC chip mounting lands 35a to 35d are formed on the dielectric layer 41A. Inductor electrodes 43a and 44e are formed on the dielectric layer 41B. Inductor electrodes 43b and 44d are formed on the dielectric layer 41C. Inductor electrodes 43c, 42a, and 44c are formed on the dielectric layer 41D. Inductor electrodes 43d, 42b, and 44b are formed on the dielectric layer 41E. Inductor electrodes 43e, 42c, and 44a are formed on the dielectric layer 41F. An inductor electrode 42d is formed on the dielectric layer 41G. Further, capacitor electrodes 51 and 52 are formed on the dielectric layer 41H.

Between the electrodes of each dielectric layer, as shown in the figure, predetermined portions are connected by via holes.
Resin such as ceramic or liquid crystal polymer (LCP) can be used as the material of the multilayer substrate.
The wireless IC chip 5 is mounted on the wireless IC chip mounting lands 35a to 35d.

  FIG. 5 is an equivalent circuit diagram of the power feeding circuit board 4 including a portion formed between the power feeding conductors 8a and 8b. Here, the inductor L1 is an inductor formed by the inductor electrodes 43a to 43e shown in FIG. 4, the inductor L2 is an inductor made up of the inductor electrodes 42a to 42d shown in FIG. 4, and the inductor L3 is made up of the inductor electrodes 44a to 44e shown in FIG. It is an inductor. Capacitors C1 and C2 are capacitors generated between the capacitor electrodes 51 and 52 shown in FIG. 4 and the power supply conductors 8a and 8b arranged below the capacitor electrodes 51 and 52, respectively.

  The resonance circuit in the feeder circuit board 4 by the inductors L1, L2, L3 and the capacitors C1, C2 is electromagnetically coupled to the spiral conductor 7 serving as a radiator.

  Note that an inductance element alone may be used as an element formed in the feeder circuit board 4. In that case, the inductance element and the helical conductor 7 may be directly coupled or may be insulated. The inductance element has an impedance matching function between the wireless IC chip and the spiral conductor. Even when only the inductance element is provided as a pattern in the power supply circuit board 4, self-resonance due to the inductance and the capacitance of the stray capacitance may be used.

  In this way, impedance matching between the wireless IC chip 5 and the spiral conductor 7 is achieved by the power supply circuit board 4, and the resonance frequency for the spiral conductor 7 to act as a radiator is set to a desired value. At this time, the resonance frequency may be set in consideration of the shape and size of the spiral conductor 7. In that case, the radiation characteristics of the wireless IC device can be improved.

  The wireless IC device 1 in which the wireless IC chip 5 is mounted on the power supply circuit board 4 receives a high-frequency signal (for example, UHF frequency band) radiated from a reader / writer (not shown) by the spiral conductor 7, and The resonance circuit in 4 is resonated, and only a reception signal in a predetermined frequency band is supplied to the wireless IC chip 5. On the other hand, a predetermined energy is taken out from the received signal, and information stored in the wireless IC chip 5 with this energy as a driving source is matched with a predetermined frequency by the resonance circuit, and then transmitted to the spiral conductor 7. Transmission / transfer is performed from the spiral conductor 7 to the reader / writer.

  In the feeder circuit board 4, the resonance frequency is determined by a resonance circuit composed of inductance elements L 1, L 2, L 3 and capacitance elements C 1, C 2. The frequency of the signal radiated from the spiral conductor 7 is substantially determined by the self-resonant frequency of the resonant circuit.

  By configuring the wireless IC device in this manner, a dense portion of the electromagnetic field distribution can be formed in or near the radiator made of the spiral conductor 7, and a small, wideband and high gain wireless IC device can be obtained. can get.

  In addition, since the two coupling portions of the electromagnetic coupling module are coupled to two places separated by a predetermined distance of the radiator, the impedance when the spiral conductor is viewed from the two coupling portions becomes inductive. Matching is facilitated when the coupling part of the coupling module is capacitive.

  In addition, by configuring the power feeding circuit board with a multilayer board including a plurality of electrode layers, the area occupied by the matching circuit can be reduced, and the wireless IC device can be downsized.

  Moreover, since the electromagnetic coupling module is galvanically insulated from the radiator made of the spiral conductor, the wireless IC chip can be improved in resistance to static electricity without being electrostatically destroyed.

  FIG. 6 is a perspective view showing a state in which the wireless IC device shown in FIG. 2 is mounted on a conductor plate. The conductor plate 20 is a metal plate extending over a predetermined range, and in this example, the wireless IC device 10 is attached to the approximate center thereof. The conductor plate 20 and the spiral conductor 7 shown in FIG. 2 do not need to be electrically connected, and are adhered to the upper surface of the conductor plate 20 while being molded by the mold resin 9.

  Since the helical conductor 7 shown in FIG. 2 acts as a helical antenna that is fed through the feeding conductors 8a and 8b, a magnetic field is generated that draws a loop that passes through the inside of the helical conductor 7 and goes outside. When this magnetic field passes perpendicularly to the conductor plate 20, an electric field is induced in the in-plane direction of the conductor plate 20, and this conductor plate 20 also acts as an antenna radiator. Since the conductor plate 20 has a wider area than the wireless IC device 10, the radiation gain can be significantly increased as compared with the case of the wireless IC device 10 alone.

<< Second Embodiment >>
FIG. 7 is a perspective view of the wireless IC device according to the second embodiment. What is different from the wireless IC device shown in FIG. 2 is the shape of the spiral conductor 7 and the direction of the electromagnetic coupling module 1 relative to the shape. The wireless IC device 11 includes an electromagnetic coupling module 1 in which a wireless IC chip 5 is mounted on a power supply circuit board 4, a spiral conductor 7, and power supply conductors 8 a and 8 b for supplying power to the spiral conductor 7. I have. The spiral conductor 7 and the power feeding conductors 8 a and 8 b are resin-molded with a molding resin 9. The electromagnetic coupling module 1 is capacitively coupled to the top surface of the power supply conductors 8a and 8b by sticking to the upper surface of the mold resin 9 in the figure.

  Thus, the spiral conductor 7 may literally have a spiral shape so as to be circular in a plan view of the central axis direction. Further, the lead-out direction of the power feeding conductors 8a and 8b with respect to the spiral conductor 7 may be a direction along the central axis direction of the spiral conductor as shown in FIG.

<< Third Embodiment >>
FIG. 8 is a perspective view of a wireless IC device according to the third embodiment. The wireless IC device 12 includes an electromagnetic coupling module 1, spiral conductors 7a and 7b, and power feeding conductors 8a and 8b. In this example, the spiral conductor is composed of two spiral conductors 7a and 7b, which are discontinuous. However, the direction of the spiral is the same.

  Even in such a configuration, the spiral conductors 7a and 7b act as radiators, and a high gain wireless IC device can be obtained.

  In this way, when two coupling parts of the electromagnetic coupling module (electromagnetic coupling module) are coupled to the two separated radiators, the impedance of the spiral conductor viewed from the two coupling parts is capacitive. Therefore, when the coupling part of the electromagnetic coupling module is inductive, matching is easily achieved.

  As shown in FIG. 2, the periphery of the spiral conductors 7a and 7b and the power feeding conductors 8a and 8b may be resin-molded with a molding resin.

<< Fourth Embodiment >>
FIG. 9 is a perspective view of a wireless IC device according to the fourth embodiment. The difference from the one shown in FIG. 8 is that the directions of the central axes of the two helical conductors 7a and 7b are different from each other. Other configurations are the same as those shown in FIG. Thus, by setting the central axes of the two spiral conductors 7a and 7b in different directions, setting of directivity becomes easy. That is, since the directivity characteristic by the spiral conductor 7a and the directivity characteristic by the spiral conductor 7b are effective, respectively, almost non-directivity can be obtained by combining them.

  Similar to the one shown in FIG. 2, the range including the helical conductors 7a and 7b and the power feeding conductors 8a and 8b may be resin-molded.

<< Fifth Embodiment >>
A wireless IC device according to a fifth embodiment will be described with reference to FIGS.
FIG. 10A is an external perspective view of a wireless IC device according to the fifth embodiment, and FIG. 10B is a perspective view thereof. The wireless IC device 14 includes an antenna module 21 and a wireless IC chip 5 attached to the antenna module 21 as shown in FIG.

  As shown in FIG. 10B, the antenna module 21 includes a helical conductor 7 and a power feeding circuit unit 6 that performs impedance matching, resonance frequency setting, and the like between the helical conductor 7 and the wireless IC chip 5. I have.

  FIG. 11 is an exploded perspective view of the wireless IC device shown in FIG. The power feeding circuit unit 6 includes radio IC chip mounting lands 35 to 35d and inductor electrodes 42a to 42d, 43a to 43e, and 44a to 44e. The equivalent circuit of the feeder circuit unit 6 is equivalent to the circuit without the capacitors C1 and C2 in the circuit shown in FIG. That is, one of the two terminals of the T-shaped circuit including the inductors L1, L2, and L3 is conducted to the wireless IC chip mounting lands 35a and 35b, and the other two terminals are conducted to two locations of the spiral conductor 7 that are separated by a predetermined distance. ing.

  However, unlike the first to fourth embodiments, the wireless IC chip 5 is directly connected to the spiral conductor 7. A stray capacitance is generated between the electrodes of the inductors L1, L2, and L3, and the stray capacitance and the inductor allow the power feeding circuit unit 6 to perform impedance matching between the wireless IC chip 5 and the spiral conductor 7 and spirally. The resonance frequency of the conductor 7 is adjusted to the frequency used in the wireless IC device.

  In this embodiment, the feeder circuit unit 6 and the spiral conductor 7 are directly connected. However, a capacitor electrode may be disposed between the inductor electrode 42d and the spiral conductor 7 as in the first embodiment. I do not care.

  Both the feeder circuit section 6 and the spiral conductor 7 are formed on a multilayer substrate. That is, the antenna module 21 is configured by laminating and firing a dielectric layer having an electrode pattern formed on each layer.

  In this way, by configuring the radiator with a multilayer substrate and further configuring the feeder circuit unit with the multilayer substrate, the occupied area and volume of the radiator can be reduced, and the wireless IC device can be reduced in size. Can be achieved.

  Further, when the wireless IC chip is galvanically insulated from the radiator made of the spiral conductor, the wireless IC chip can be improved in resistance to static electricity without being electrostatically destroyed.

  FIG. 12 is a perspective view showing an example in which the wireless IC device according to the fifth embodiment is attached to a conductor plate. The conductor plate 20 is a metal plate or a sheet or plate provided with a metal film extending over a predetermined range, and in this example, the wireless IC device 14 is attached to the vicinity of the end thereof.

<< Sixth Embodiment >>
FIG. 13A is an external perspective view of a wireless IC device according to the sixth embodiment, and FIG. 13B is a perspective view thereof. As shown in FIG. 13A, the wireless IC device 15 includes an antenna module 21 and a wireless IC chip 5 attached thereto.

  As shown in FIG. 13B, the antenna module 21 includes a spiral conductor 7 and a power feeding circuit unit 6 that performs impedance matching between the spiral conductor 7 and the wireless IC chip 5, setting of a resonance frequency, and the like. These are molded with a mold resin 9.

The configurations of the wireless IC chip 5 and the power feeding circuit unit 6 are the same as those in the fifth embodiment. The fifth embodiment differs from the fifth embodiment in that the shape of the spiral conductor 7 is a spiral shape that is circular in a plan view of the central axis direction, and that the feeding circuit unit 6 for the spiral conductor 7 The direction formed by the surface direction is perpendicular to the central axis of the spiral conductor.
Even with such a configuration, a wireless IC device having a small size, a wide band and a high gain can be obtained.

  Note that the bottom surface of the wireless IC device 15 shown in FIG. 13 faces the conductor plate in the state shown in FIG. 13 with respect to a conductor plate made of a metal plate or a sheet or plate provided with a metal film extending over a predetermined range. With this arrangement, since the magnetic flux generated by the spiral conductor 7 passes perpendicularly to the conductor surface, coupling with the conductor plate is performed efficiently, and a high gain wireless IC device can be obtained.

<< Seventh Embodiment >>
FIG. 14 is a perspective view of two wireless IC devices according to the seventh embodiment.
Each of the wireless IC devices 16 and 17 includes the electromagnetic coupling module 1, the spiral conductor 7, and the power feeding conductors 8a and 8b. The electromagnetic coupling module 1 includes a power supply circuit board 4 and a wireless IC chip 5 mounted thereon.

  The electromagnetic coupling module 1 includes a power supply circuit board 4 and a wireless IC chip 5. Unlike the one shown in FIG. 2, the feeder circuit board 4 is composed of a flexible board having an electrode pattern formed on the surface thereof. A PET film can be used for this flexible substrate.

  In the example of FIG. 14A, two capacitor electrodes that are electrically connected to the wireless IC chip are formed on the upper surface of the flexible substrate. The capacitor electrode forms a capacitance between the power supply conductors 8a and 8b and is capacitively coupled.

  In the power supply circuit board 4 having the structure of FIG. 14A, impedance matching between the wireless IC chip 5 and the spiral conductor 7 is achieved by the capacitance between the power supply conductors 8a and 8b and the capacitor electrode and the inductance of the capacitor electrode. Is going.

  In the example of FIG. 14B, two inductor electrodes that are electrically connected to the wireless IC chip are formed on the upper surface of the flexible substrate. The inductor electrode is electromagnetically coupled to the power supply conductors 8a and 8b.

  In any configuration, the number of electrode formations can be reduced by configuring the feeder circuit substrate with a flexible substrate on which an electrode pattern is formed. Moreover, it can be made thin overall.

<< Eighth Embodiment >>
FIG. 15A is a perspective view of a mobile phone terminal provided with a wireless IC device, and FIG. 15B is a cross-sectional view of a main part of an internal circuit board. A wireless IC device 18 including the wireless IC chip 5 and the antenna module 21 is attached to the circuit board 31 in the mobile phone terminal together with the electronic components 33 and 34. An electrode pattern 32 extending over a predetermined area is formed on the upper surface of the circuit board 31. The electrode pattern 32 is combined with the spiral conductor in the antenna module 21 to act as a radiator. Therefore, a non-directional and high gain wireless IC device can be obtained.

  Thus, by using the electrode pattern formed on the circuit board in the electronic device as a conductor acting as a radiator, the circuit board provided in the electronic device can be used as it is, and the electromagnetic coupling module and the conductor can be mounted. It becomes easy.

  As another example, a wireless IC device is attached to a metal panel provided on the back surface of the liquid crystal panel inside the mobile phone terminal shown in FIG. 15A, and the metal panel is used as an antenna radiator. You may make it act. As a result, components provided in the electronic device can be used as they are, and there is no increase in size and cost.

  In addition, since the helical conductor with which the wireless IC device shown in each embodiment is provided can act as a helical antenna, it may be used as a communication antenna for purposes other than wireless IC device applications. For example, it may be used as a GPS antenna that receives circularly polarized electromagnetic waves. In that case, it can implement | achieve by providing so that the electromagnetic coupling module for another communication system may be separately couple | bonded with two places of predetermined distance distance of the helical conductor.

1 is a diagram illustrating a configuration of a wireless IC device disclosed in Patent Document 1. FIG. 1 is a perspective view of a wireless IC device according to a first embodiment. It is a disassembled perspective view of the same wireless IC device. It is a disassembled perspective view which shows the structure of the electric power feeding circuit board of the radio | wireless IC device, and the relationship with a radio | wireless IC chip. FIG. 3 is an equivalent circuit diagram of a power supply circuit board. It is a perspective view which shows the mounting state of the radio | wireless IC device with respect to a conductor board. It is a see-through | perspective perspective view of the radio | wireless IC device which concerns on 2nd Embodiment. It is a perspective view of the radio | wireless IC device which concerns on 3rd Embodiment. It is a perspective view of the radio | wireless IC device which concerns on 4th Embodiment. FIG. 9 is an external perspective view and a perspective view of a wireless IC device according to a fifth embodiment. It is a disassembled perspective view of the same wireless IC device. It is a perspective view which shows the example which attached the radio | wireless IC device to the conductor board. It is the external appearance perspective view and transparent perspective view of the radio | wireless IC device which concern on 6th Embodiment. It is a perspective view of the radio | wireless IC device which concerns on 7th Embodiment. It is the perspective view of the mobile telephone terminal provided with the radio | wireless IC device which concerns on 8th Embodiment, and sectional drawing of the principal part of an internal circuit board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electromagnetic coupling module 4 ... Feeding circuit board 5 ... Wireless IC chip 6 ... Feeding circuit part 7 ... Spiral conductors 8a and 8b ... Feeding conductor 9 ... Mold resin 10-18 ... Wireless IC device 20 ... Conductor plate 21 ... Antenna Module 31 ... Circuit board 32 ... Electrode patterns 33, 34 ... Electronic components 35a-35d ... Wireless IC chip mounting lands 36a, 36b ... Capacitor electrodes 41A-41H ... Dielectric layers 42-44 ... Inductor electrodes 51, 52 ... Capacitor electrodes

Claims (14)

An electromagnetic coupling module comprising a wireless IC chip and a power supply circuit board that includes an inductance element and is electrically connected to the wireless IC chip and coupled to an external circuit;
A radiator comprising a helical conductor mounted with the electromagnetic coupling module and coupled to the electromagnetic coupling module;
A wireless IC device comprising:   The wireless IC device according to claim 1, further comprising a resonance circuit in the power supply circuit board.   The wireless IC device according to claim 1, further comprising a matching circuit in the power supply circuit board.   The wireless IC device according to claim 1, wherein two coupling portions of the electromagnetic coupling module are coupled to two places of the radiator that are separated by a predetermined distance.   The radio IC device according to claim 1, wherein the radiator includes two separated radiators, and two coupling portions of the electromagnetic coupling module are coupled to the respective radiators.   The wireless IC device according to claim 5, wherein the central axes of the spirals of the two radiators are arranged in different directions.   The wireless IC device according to claim 1, wherein the radiator is disposed on a conductor surface extending in a predetermined range or in the vicinity of the conductor surface.   The wireless IC device according to claim 7, wherein the conductor is an electrode pattern formed on a circuit board in an electronic apparatus.   The wireless IC device according to claim 7, wherein the conductor is a metal plate provided in a component in an electronic apparatus.   The wireless IC device according to claim 1, wherein the power supply circuit board is configured by a multilayer board including a plurality of electrode layers.   The radio | wireless IC device in any one of Claims 1-9 comprised with the flexible substrate in which the said electric power feeding circuit board formed the electrode pattern.   The wireless IC device according to claim 1, wherein the radiator is configured of a multilayer substrate including a plurality of electrode layers.   The radio | wireless IC device in any one of Claims 1-9 comprised with the said electric power feeding circuit board and the said radiator with one multilayer substrate provided with the some electrode layer.   The wireless IC device according to claim 1, wherein a plurality of electromagnetic coupling modules for different communication systems are coupled to the plurality of radiators.

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