JP2009016528A - Mounting machine and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting machine in which a conveying means does not directly contact a wafer when mounting the wafer onto a ring frame. <P>SOLUTION: The mounting machine 10 integrates a semiconductor wafer W onto a ring frame RF through an adhesive sheet S, the semiconductor wafer W on which back grinding is done using a grinder 11, wherein the grinder 11 includes an accessible conveying means 12 within its region. This conveying means 12 has an absorption arm 23 equipped with an absorption pad 23A for absorbing the ring frame RF and a press roller 25 for pushing the adhesive sheet S to the wafer W such that the wafer W ground by the grinder 11 is integrated onto the ring frame RF through the adhesive sheet S at a position where it is delivered to a processed position P3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting apparatus and a mounting method, and more particularly to a mounting apparatus that can be mounted on a ring frame without directly contacting a semiconductor wafer.

A semiconductor wafer (hereinafter simply referred to as “wafer”) is integrated (mounted) on a ring frame via an adhesive sheet in consideration of handling properties when performing various processes, particularly dicing. It has been broken.
Patent Document 1 discloses a configuration in which a wafer is transferred onto a table, and after the wafer is ground on the back surface, the wafer is stored in a wafer stocker via a transfer unit.
Further, Patent Document 2 discloses a configuration in which a ground wafer is taken out from a wafer stocker via a conveying unit, and the wafer is mounted on a ring frame via an adhesive sheet.

JP-A-10-284449 JP 2006-278630 A

The apparatus shown in Patent Documents 1 and 2 is a process that is continuously performed before dicing a wafer, but at least twice when a ground wafer is stored in the stocker and when it is taken out from the stocker. The wafer is transferred in direct contact with the transfer means. For this reason, in the case of a wafer ground to several tens of μm, there arises a problem that the wafer is broken due to an impact when the transfer means comes into contact with the holding force.
Moreover, it is difficult for the mounting method by transfer or transfer as disclosed in Patent Documents 1 and 2 to cope with the current situation in which the diameter of the wafer is increased. That is, even when the wafer can be prevented from being cracked due to the suction force when the wafer is sucked and held, the problem of causing the crack due to the sag (warping) on the outer peripheral side of the wafer is still not solved.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the object of the present invention is to integrate the ring frame without directly contacting the wafer by a transfer means or the like, so that the wafer is cracked. It is an object of the present invention to provide a mounting apparatus and a mounting method that do not cause damage.

  In order to achieve the above object, the present invention provides a mounting apparatus that integrates a workpiece, which has been subjected to predetermined processing by an external processing means, into a frame via an adhesive sheet, in the region of the external processing means. The conveying means includes a holding means for holding the frame and a pressing means for pressing the adhesive sheet against the work piece, and is covered within the area of the external processing means. The construction is such that an adhesive sheet is attached to the workpiece and integrated into the frame.

  In this invention, the structure of including the sticking means which sticks an adhesive sheet to the said flame | frame, and integrating the flame | frame with the said adhesive sheet stuck and the said to-be-processed object is employable.

Further, the external processing means includes a moving means capable of moving the workpiece between a machining position and a non-machining position, and a grinding means for grinding the workpiece moved to the machining position.
It is preferable that the conveying means adopt a configuration in which the adhesive sheet is attached to the workpiece moved to the non-processing position and integrated with the frame.

Furthermore, the present invention provides a mounting apparatus in which a semiconductor wafer whose circuit surface is protected by a protective sheet and whose back side is ground by a grinding apparatus is integrated with a ring frame via an adhesive sheet.
A sticking means for sticking an adhesive sheet to the ring frame; and a transport means accessible in an area of the grinding apparatus, the transport means holding a ring frame to which the adhesive sheet is stuck; A pressing means for pressing the adhesive sheet against the semiconductor wafer may be provided, and the adhesive sheet may be attached to the semiconductor wafer and integrated with the ring frame within the region of the grinding apparatus.

  Moreover, it is good also as a structure containing the peeling means which peels a protective sheet from the said semiconductor wafer.

Furthermore, the present invention relates to a mounting method in which a workpiece that has been subjected to predetermined processing by an external processing means is integrated into a frame via an adhesive sheet.
Holding the frame to which the adhesive sheet is bonded and accessing the area of the external processing means;
Pressing the adhesive sheet against a workpiece;
And a step of transferring a workpiece onto the adhesive sheet and integrating the workpiece into the frame.

  The mounting method may include a step of attaching an adhesive sheet to the frame at a stage prior to accessing the area of the external processing means.

  The mounting method may further include a step of peeling the protective sheet from the integrated workpiece.

  The present invention is configured such that the conveying means is accessible in the area of the external processing means, and the adhesive sheet is attached to a workpiece such as a wafer in the area of the external processing means so as to be integrated with the frame. Therefore, in this integration process, the conveying means or the like does not come into direct contact with the workpiece or directly adsorbs and conveys it, so that the workpiece can be effectively prevented from being damaged. In addition, since the workpiece is transferred to the adhesive sheet, when the workpiece is a plate-shaped member such as a large-diameter wafer, damage caused by sagging on the outer peripheral side of the wafer Can also be avoided.

  Further, by including an attaching means for attaching the adhesive sheet to the frame, the frame with the adhesive sheet can be prepared before the conveying means accesses the external processing means, and the work efficiency is improved.

  Further, since the wafer can be moved between the processing position and the non-processing position in the external processing means, the wafer can be mounted on the frame at the non-processing position, and the transfer means can interfere with the processing means. Can be prevented.

  Furthermore, by having a peeling means for peeling the protective sheet from the wafer, it is not necessary to separately prepare a remover for peeling the protective sheet in the downstream process of the mounting apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a schematic front view of the main part of the mounting apparatus according to this embodiment, and FIG. 2 shows a schematic plan view of the mounting apparatus. In these drawings, the mounting apparatus 10 includes a conveying means 12 accessible within the region of the grinding apparatus 11 as an external processing means, an attaching means 13 for attaching the adhesive sheet S to the ring frame RF, and a workpiece. The reversing device 14 for the wafer W and the peeling means 15 for peeling the protective sheet PS attached to the circuit surface of the wafer W are provided.
The term “inside the area of the external processing means” means an area including the upper space with reference to the installation surface occupied by an apparatus or processing means other than the mounting apparatus of the present invention.

  The grinding apparatus 11 is a grinding means for grinding a circular index table 16 that supports a wafer W having a protective sheet PS affixed to a circuit surface (lower surface in FIG. 1), and a back surface (upper surface in FIG. 1) of the wafer W. And the grindstone 17. The index table 16 is provided with a support table 16A that sucks and supports the wafer W via the protective sheet PS, and is provided so as to be rotatable in the XY plane in the direction of arrow a in FIG. The support table 16A has a center on a virtual circle C centered on the rotation axis of the index table 16, and is provided at three positions at intervals of 120 degrees, and the wafer W is processed at the processing position P1 by the rotation of the index table 16. , P2 and a non-processing position P3 are provided so as to be movable. Here, the processing positions P1, P2 and the non-processing position P3 are arranged on the virtual circle C at intervals of 120 degrees in accordance with the intermittent rotation of the index table 16, and the primary grinding of the wafer W at the processing position P1. On the other hand, secondary grinding (finish grinding) of the wafer W is performed at the processing position P2, and then the wafer W is moved to the non-processing position P3. The grindstone 17 includes a first grindstone 17A and a second grindstone 17B corresponding to the processing positions P1 and P2, respectively. As shown in FIG. 2, the inside of the frame E (inside the two-dotted line frame) is an installation surface occupied by the grinding device 11, and the region including the space in the Z-axis direction of the frame E is the grinding device. 11 areas.

  As shown in FIG. 1, the transfer means 12 is fixed to a transfer robot 20 extending in the Y-axis direction supported by a base frame BF via a frame (not shown), and a slider 20A of the transfer robot 20. Wafer is attached to the adhesive sheet S via a vertical robot 21, a suction arm 23 having a suction pad 23A as a holding means supported so as to be movable in the Z-axis direction via the vertical robot 21, and a single-axis robot 25A. And a press roller 25 as pressing means for pressing against W. The conveying means 12 sucks and holds the ring frame RF to which the adhesive sheet S is stuck by the sticking means 13, accesses the area of the grinding apparatus 11, and sticks the adhesive sheet S to the wafer W to attach the ring frame RF. The wafer W integrated with RF is transferred to the reversing device 14.

  As shown in FIG. 3, the sticking means 13 includes a slide table 27 for sticking the adhesive sheet S to the ring frame RF, and a sticking unit 28 located above the slide table 27. The slide table 27 is provided so as to be movable along a guide rail 29 arranged in the X-axis direction in FIG. 3, and the upper surface height position is provided so as to be adjustable up and down. In addition, the sticking unit 28 peels the adhesive sheet S from the release sheet RL by feeding out the original fabric R, which is temporarily attached to the release sheet RL, so as to be folded back by the peel plate 30, and then attaches the adhesive sheet S to the ring. It is configured so that it can be attached to the frame RF.

  The reversing device 14 includes a linear motion motor 32 attached to the frame 31, a rotary arm 36 attached to a slider 35 of the linear motion motor 32, and a motor 35 rotatable in the XZ plane. It is configured with. The rotary arm 36 has a bifurcated shape, and is provided with suction holes (not shown) at a plurality of locations in the plane so that the ring frame RF can be sucked and held. Further, the width in the X-axis direction is set so as not to interfere with the suction pad 23A.

  The peeling means 15 peels the protective sheet PS from the circuit surface of the mounted wafer W transferred to the slide table 27 via the reversing device 14, and supplies the peeling tape T onto the protective sheet PS. 3 having a function of welding the peeling tape T to the protective sheet PS and a function of cutting the peeling tape T, with the chuck 38 holding the peeling tape T in FIG. The protective sheet PS can be peeled from the wafer W by moving rightward and the slide table 27 moving leftward along the guide rail 29. Note that the peeling means 15 is provided with a transfer robot 39 oriented in the X-axis direction in FIG. 3, and the transfer arm 40 of the transfer robot 39 sucks and holds the ring frame RF. The wafer W mounted on the ring frame RF can be accommodated in the cassette 41.

  Next, the operation of the wafer processing apparatus 10 in this embodiment will be described.

  When transported by the transport unit 12, the adhesive sheet S is pasted on the ring frame RF on the slide table 27 of the pasting unit 13. When the slide table 27 reaches below the conveying means 12, the ring frame RF is held via the rotary arm 36, and the linear motor 32 is raised to deliver the ring frame RF to the suction arm 23 of the conveying means 12. . At this time, the adhesive layer surface of the adhesive sheet S faces downward.

  In the grinding apparatus 11, the wafer W is ground at the processing positions P1 and P2, and the ground wafer W is moved to the non-processing position P3 in the region and prepared for conveyance. Then, the suction arm 23 transports the ring frame RF with the adhesive sheet S via the transport robot 20 above the non-processing position P3, and the suction arm 23 descends in the Z-axis direction. That is, the suction arm 23 accesses the region of the grinding device 11 and lowers the ring frame RF so that the adhesive sheet S is positioned in the vicinity of the wafer W. Next, the press roller 25 is moved in the Y-axis direction while rotating on the adhesive sheet S by the single-axis robot 25A, whereby the wafer W is transferred to the adhesive sheet S, and thereby the wafer W is attached to the ring frame RF. Integration (mounting) is completed.

  Then, the wafer W mounted on the ring frame RF is transferred again by the suction arm 23 and transferred onto the rotation arm 36. Next, the rotary arm 36 rotates 180 degrees in the direction of arrow b in FIG. 1, the wafer W is positioned on the lower surface side thereof, and is lowered by the linear motor 32, and the wafer W is transferred to the slide table 27.

  The wafer W transferred to the slide table 27 is transported toward the peeling means 15 and a peeling tape T is affixed to the outer peripheral end of the protective sheet PS, and the slide table 27 and the chuck 38 are aligned along the X-axis direction. The protective sheet PS is peeled from the wafer W by relative movement in the separating direction. Then, the wafer W from which the protective sheet PS has been peeled is accommodated in the cassette 41 through the transfer arm 40 together with the ring frame RF.

  Therefore, according to such an embodiment, the wafer W is held on the ring frame RF via the adhesive sheet S without the transfer means being in direct contact with or directly adsorbing and holding the wafer W that has been ground back. Can be mounted. Thereby, even if the wafer W is ground to a thickness of several tens of μm, it is possible to eliminate the inconvenience of breaking the wafer W during mounting. Further, since the ring frame RF is held and transported after the wafer W is mounted, the outer peripheral side of the wafer W does not sag even when the diameter of the wafer W increases. Damage can be effectively avoided.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the grinding device 11 is illustrated and described as an external processing unit, but the present invention is not limited to this and may be other devices. In other words, the external processing means means an apparatus other than the mounting apparatus 10 and has a configuration in which the transfer means can access the area of the external processing means without directly contacting or attracting the wafer surface. I just need it. The ring frame RF may be a frame that does not form a closed loop, and the workpiece includes a plate-like body other than the wafer W.

  In addition, the workpiece in the present invention is not limited to the semiconductor wafer W, and the semiconductor wafer may be a silicon wafer or a compound wafer. Further, the frame is not limited in any way for integrating the workpieces.

  Also, the pressing means is not limited as long as it can press the adhesive sheet S. Examples of the pressing means include blade material and air injection other than the press roller 25.

The principal part schematic front view of the mounting apparatus which concerns on this embodiment. FIG. 3 is a schematic plan view of the mounting device. The side view of FIG. 1 which abbreviate | omitted the grinding device.

Explanation of symbols

10 Mounting device 11 Grinding device (external processing means)
12 Conveying means 13 Sticking means 15 Peeling means 16 Rotary table 17 Grinding wheel (grinding means)
23A Suction pad (holding means)
23 Suction arm (holding means)
25 Press roller (pressing means)
P1, P2 Processing position P3 Non-processing position PS protective sheet RF ring frame S Adhesive sheet W Semiconductor wafer

Claims (8)

In a mounting device that integrates a workpiece, which has been subjected to predetermined processing by an external processing means, into a frame via an adhesive sheet,
A conveying means accessible within the area of the external processing means, the conveying means comprising a holding means for the frame and a pressing means for pressing the adhesive sheet against a workpiece; A mounting apparatus characterized in that an adhesive sheet is attached to a work piece in the region of the processing means and integrated with the frame.   The mounting apparatus according to claim 1, further comprising an attaching unit that attaches an adhesive sheet to the frame, wherein the frame to which the adhesive sheet is attached and the workpiece are integrated. The external processing means includes a moving means capable of moving the workpiece between a machining position and a non-machining position, and a grinding means for grinding the workpiece moved to the machining position,
The mounting apparatus according to claim 1, wherein the transport unit is attached to the frame by attaching the adhesive sheet to the workpiece moved to the non-processing position. In a mounting device that integrates a semiconductor wafer whose circuit surface is protected by a protective sheet while the back side is ground by a grinding device into a ring frame via an adhesive sheet,
A sticking means for sticking an adhesive sheet to the ring frame; and a transport means accessible in an area of the grinding apparatus, the transport means holding a ring frame to which the adhesive sheet is stuck; A mounting device comprising pressing means for pressing the adhesive sheet against the semiconductor wafer, and attaching the adhesive sheet to the semiconductor wafer within the region of the grinding device to be integrated with the ring frame.   The mounting apparatus according to claim 4, further comprising a peeling unit that peels the protective sheet from the semiconductor wafer. In a mounting method in which a workpiece subjected to predetermined processing by an external processing means is integrated into a frame via an adhesive sheet,
Holding the frame to which the adhesive sheet is bonded and accessing the area of the external processing means;
Pressing the adhesive sheet against a workpiece;
And a step of transferring a workpiece onto the adhesive sheet and integrating the workpiece into the frame.   The mounting method according to claim 6, further comprising a step of attaching an adhesive sheet to the frame in a stage before accessing the area of the external processing means.   The mounting method according to claim 6, further comprising a step of peeling the protective sheet from the integrated workpiece.

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