JP2009006638A - Recording head and recording device equipped with recording head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a recording head which can form a good image and a recording device equipped with the recording head. <P>SOLUTION: A thermal head 10 of this invention is provided with a substrate 111 having a plurality of exothermic parts 113 arranged in the longitudinal directions D2 and D3, a driving IC 12 controlling the drive of the exothermic parts 113, a conductive layer 114 connected electrically to the exothermic parts 113, and a connection layer 115 connected electrically to the driving IC 12, a flexible wiring member 13 which is connected to the conductive layer 114 or the connection layer 115 and has a wiring part 132 extending in the arrow direction D1 and a thermal expansion coefficient different from that of the substrate 111, and a multilayer wiring substrate 14 which is connected electrically to the wiring part 132 and has a wiring part 142 partially extending in the longitudinal directions D2 and D3 and a thermal expansion coefficient different from that of the substrate 111. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a recording head that constitutes a thermal head, an inkjet head, and the like and a recording apparatus including the recording head.

  As a printer such as a facsimile or a register, for example, a small and inexpensive thermal printer is used. The thermal printer includes a thermal head and a platen roller. The thermal head has a plurality of heat generating sections arranged and a control element for controlling them, and is configured to generate heat with a desired heat distribution by controlling the plurality of heat generating sections with the control element. Has been. The platen roller is for pressing the recording medium against the plurality of heat generating portions. In the thermal printer having such a configuration, the control element controls the driving of the plurality of heat generating units to generate heat with a heat distribution corresponding to a desired image, and the recording medium is applied to the plurality of heat generating units with a platen roller. The heat generated by the plurality of heating portions is transmitted to the recording medium by pressing evenly. Desired image formation on the recording medium is performed by repeating this process.

As a thermal head mounted on such a thermal printer, there is a thermal head that supplies power to a plurality of heating units and control elements and inputs image information to the control elements via an FPC (Flexible Printed Circuit). It is disclosed in Patent Document 1.
JP-A-2-3343

  In the thermal head described in Patent Document 1, driving signals of a heating resistor formed on a substrate and a plurality of ICs (Integrated Circuits) for driving the heating resistor are input from a connector through an FPC. However, in order to input drive signals to a plurality of ICs arranged in a wider range than the connector formation region in the arrangement direction of the heating resistors (hereinafter referred to as “first direction”), the FPC It is necessary to route not only the first direction but also a direction orthogonal to the first direction (hereinafter referred to as “second direction”). Therefore, in the thermal head described in Patent Document 1, when heat generated by driving the heating resistor is transmitted to the wiring that constitutes the FPC, the FPC thermally expands according to the direction in which the wiring is routed. In some cases, an excessive stress due to the difference in thermal expansion coefficient is applied to the substrate. In particular, the stress caused by the thermal expansion in the first direction among the stresses has a large force acting on the substrate from the FPC in the thickness direction of the substrate, which may cause the substrate to bend. As described above, when the substrate is curved, the contact state between the heating resistor and the platen roller is different at each position. Therefore, the thermal head described in Patent Document 1 may not be able to form a good image. It was.

  The present invention has been conceived under such circumstances, and an object thereof is to provide a recording head capable of forming a good image and a recording apparatus including the recording head. .

  The recording head of the present invention is electrically connected to at least one of the plurality of heat generating units arranged in the first direction, a control element that controls driving of the plurality of heat generating units, and the plurality of heat generating units and the control element. A head substrate having a plurality of first wirings, and a second wiring electrically connected to the first wiring and extending in a second direction intersecting the first direction, A flexible wiring member having a thermal expansion coefficient different from that of the head substrate; and a third wiring that is electrically connected to the second wiring and extends in a third direction at least partially intersecting the second direction. And a multilayer wiring board having a thermal expansion coefficient different from that of the head substrate. Here, the first direction and the third direction may be the same direction.

  In the recording head of the present invention, the flexible wiring member includes a plurality of the second wirings, and the plurality of second wirings are arranged in the first direction so as to be separated from each other in plan view. Is preferred.

  In the recording head according to the aspect of the invention, the flexible wiring member includes a plurality of the second wirings, and a center portion of each second wiring in a cross section along the first direction is along the first direction. Are preferably arranged.

  In the recording head of the present invention, the multilayer wiring board is electrically connected to the flexible wiring member at a second end located opposite to the first end located on the head substrate side. Is preferred.

  In the recording head of the present invention, it is preferable that the multilayer wiring board is connected to the flexible wiring member via an adhesive member at a first end located on the head substrate side.

  In the recording head according to the aspect of the invention, it is preferable that the flexible wiring member has a slit portion that houses an electrical connection member for electrical connection with the first wiring.

  The recording apparatus of the present invention includes the recording head according to the present invention, and a transport mechanism for transporting a recording medium toward a plurality of heat generating portions in the recording head.

  In the recording head of the present invention, the second wiring constituting the flexible wiring member extends in the second direction. For this reason, in this recording head, for example, even if heat from a plurality of heat generating parts is transmitted to the second wiring that constitutes the flexible wiring member, the flexible wiring member is directed to the head substrate due to the thermal expansion. The stress acting in the thickness direction of the head substrate can be sufficiently reduced. Therefore, in the present recording head, it is possible to suppress the contact state between the recording medium and each heat generating portion from being different due to the curvature of the head substrate.

  In the recording head, the head substrate and the multilayer wiring substrate are connected via a flexible wiring member. For this reason, in this recording head, even if a stress acting in the thickness direction of the head substrate is generated in the multilayer wiring board due to thermal expansion, the stress can be relaxed in the flexible wiring member. Therefore, in the present recording head, it is possible to suppress the contact state between the recording medium and each heat generating portion from being different due to the curvature of the head substrate.

  Further, in the present recording head, the recording head is electrically connected to the second wiring constituting the flexible wiring member, and at least a part of the recording head extends in the third direction (a direction intersecting the second direction). Yes. For this reason, in this recording head, the external connection region is narrower than the connection region in which the second wiring constituting the flexible wiring member and the third wiring constituting the multilayer wiring board are electrically connected. Even if there is, it can be properly routed.

  From the above, this recording head is suitable not only for forming a good image, but also for maintaining the degree of freedom of wiring.

  In the recording head of the present invention, when the flexible wiring member has a plurality of second wirings and the plurality of second wirings are arranged in the first direction so as to be separated from each other in plan view, the head substrate The flexibility of the flexible wiring member in the thickness direction can be increased. Therefore, in the recording head of this configuration, even if a stress acting in the thickness direction of the head substrate is generated in the multilayer wiring board due to thermal expansion, the stress can be relaxed in the flexible wiring member. Therefore, in the recording head of this configuration, it is possible to prevent the contact state between the recording medium and each heat generating portion from being different due to the curvature of the head substrate, and as a result, a better image can be formed. It can be done.

  In the recording head of the present invention, the flexible wiring member has a plurality of second wirings, and the center portions of the cross sections along the first direction of the respective second wirings are arranged along the first direction. In this case, the flexibility of the flexible wiring member in the thickness direction of the head substrate can be further increased. Therefore, in the recording head of this configuration, it is possible to further suppress the contact state between the recording medium and each heat generating portion due to the curvature of the head substrate, and thereby form a better image. Can do it.

  In the recording head of the present invention, when the multilayer wiring board is electrically connected to the flexible wiring member at the second end located on the side opposite to the first end located on the head board side, the flexibility Even if a stress acting in the thickness direction of the head substrate is generated in the multilayer wiring board due to thermal expansion by increasing the wiring length in the second direction of the wiring member, the stress is more increased in the flexible wiring member. Can be relaxed. Therefore, in the recording head of this configuration, it is possible to suppress the contact state between the recording medium and each heat generating portion due to the curvature of the head substrate, and as a result, a better image can be formed. It can be done.

  In the recording head of the present invention, when the multilayer wiring substrate is connected to the flexible wiring member via the adhesive member at the first end located on the head substrate side, the head substrate of the flexible wiring member with respect to the head substrate The positioning accuracy of the side end can be increased. Therefore, in the recording head of this configuration, for example, even if the connection position between the flexible wiring member and the multilayer wiring board is separated from the head substrate, the second wiring constituting the flexible wiring member and the first wiring included in the head substrate are provided. It is possible to improve the connection reliability.

  In the recording head of the present invention, when the flexible wiring member has a slit portion that houses an electrical connection member for electrical connection with the first wiring, an excess of solder or the like used as the electrical connection member Can be accommodated in the slit portion. Therefore, in the recording head of this configuration, the thickness uniformity of the electrical connection member interposed between the head substrate and the flexible wiring member is improved, and the thickness direction of the head substrate is caused by the variation in the thickness of the electrical connection member. In this case, it is possible to suppress variation in the force acting on the head substrate from the flexible wiring member. Therefore, in the recording head of this configuration, it is possible to suppress the bending of the arrangement of the heat generating portions due to the variation in stress at the connection portion between the head substrate and the flexible wiring member, thereby forming a good image. Can do it.

  Since the recording apparatus of the present invention includes the recording head according to the present invention, the recording head according to the present invention can enjoy the effects. Therefore, the recording apparatus can form a good image.

  FIG. 1 is an overall view showing a schematic configuration of a thermal printer X according to the present embodiment.

  The thermal printer X includes a thermal head 10, a transport mechanism 20, and a driving unit 30, and performs printing on a recording medium P that is transported in the direction of arrow D1. Here, as the recording medium P, a thermal paper or a thermal film whose surface density varies by heating, an ink film that forms an image by transferring an ink component melted by heat conduction, a transfer paper, or the like is used.

  2A and 2B are diagrams illustrating a schematic configuration of the thermal head 10 according to the embodiment of the present invention, in which FIG. 2A is a plan view thereof, and FIG. 2B is a side view of FIG.

  The thermal head 10 includes a base 11, a driving IC 12, a flexible wiring member 13, a multilayer wiring board 14, an external connection member 15, a heat radiator 16, a conductive connection member 17, and an adhesive member 18, and includes an external connection member. 15 generates heat corresponding to the image information supplied from the driving means 30 via 15.

  3 is a diagram illustrating a schematic configuration of the base body 11 illustrated in FIG. 2, (a) is a plan view thereof, and (b) is a cross-sectional view taken along line IIIb-IIIb illustrated in (a). .

  The base 11 includes a substrate 111, a heat storage layer 112, a heat generating portion 113, a conductive layer 114, a connection layer 115, and a protective layer 116. In FIG. 3A, the protective layer 116 is omitted.

The substrate 111 functions as a support base material for the heat storage layer 112, the heat generating portion 113, the conductive layer 114, the connection layer 115, the protective layer 116, and the drive IC 12. Examples of the constituent material of the substrate 111 include ceramics such as alumina ceramics, resin materials such as epoxy resins and silicon resins, and insulating materials such as silicon materials and glass materials. In the present embodiment, the substrate 111 is made of alumina ceramic, and its thermal expansion coefficient is about 7.3 × 10 ⁻⁶ [K ⁻¹ ]. Note that the thermal expansion coefficient of the base body 11 of the present embodiment is substantially equal to the thermal expansion coefficient of the constituent material of the substrate 111 due to the influence of the thermal expansion coefficient of the substrate 111.

  The heat storage layer 112 has a function of accumulating a part of the Joule heat generated in the heat generating unit 113 described later and maintaining the thermal response characteristics of the thermal head 10 in a favorable manner. That is, the heat storage layer 112 is for raising the temperature of the heat generating portion 113 to a predetermined temperature necessary for printing in a short time.

  The heat generating portion 113 generates heat when energized in order to apply heat energy to the recording medium P, and is formed of an electric resistance material. Examples of the electric resistance material include TaN, TaSiO, TaSiNO, TiSiO, TiSiCO, and NbSiO. The heat generating part 113 generates Joule heat by applying a voltage using the conductive layer 114 and generates heat to a predetermined temperature (for example, 200 ° C. or higher and 350 ° C. or lower) necessary for forming an image on the recording medium P. In addition, the heat generating part 113 of this embodiment is pattern-formed so that it may be located on the thermal storage layer 112, and the several heat generating part 113 is arranged at substantially equal intervals in the longitudinal directions D2 and D3.

  The conductive layer 114 is for applying a voltage to the heat generating portion 113, and includes a common electrode 114a and an individual electrode 114b. The conductive layer 114 is formed using a conductive material containing metal as a main component. Examples of the conductive material include aluminum alloy, gold, silver, and copper. The common electrode 114a is a part for supplying electric power to the heat generating part 113, and is electrically connected to one end of the plurality of heat generating parts 113 at one end and to a power source (not shown) at the other end. Are electrically connected to each other. The individual electrode 114b is a part for electrically connecting each heat generating part 113 to the drive IC 12 that controls the power supply state (ON or OFF), and is connected to the other end of the heat generating part 113 at one end. And electrically connected to the driving IC 12 at the other end.

  The connection layer 115 is a part for electrically connecting the driving IC 12 and the flexible wiring member 13 and is formed of a conductive material containing metal as a main component. Examples of the conductive material include aluminum alloy, gold, silver, and copper. The connection layer 115 is electrically connected to the drive IC 12 at one end and is electrically connected to the flexible wiring member 13 at the other end.

The protective layer 116 is for protecting the heat generating portion 113, the conductive layer 114, and the connection layer 115. More specifically, the protective layer 116 prevents the heat generating portion 113, the conductive layer 114, and the connection layer 115 from coming into contact with the atmosphere and prevents corrosion due to moisture in the air. This is to protect the conductive layer 114 and the connection layer 115 from external force, or to prevent the heat generating portion 113 and the individual electrode 114b from being short-circuited. Examples of the constituent material of the protective layer 116 include Si—N inorganic materials such as SiO ₂ and silicon nitride (Si ₃ N ₄ ), and Si—N—O inorganic materials such as sialon (Si · Al · O · N). Etc.

  The drive IC 12 is for controlling the power supply state (ON or OFF) of each of the heat generating portions 113, and is a drive means via the external connection member 15, the multilayer wiring board 14, and the flexible wiring member 13. 30 is for causing the heat generating portion 113 to selectively generate Joule heat based on image information supplied from 30. That is, the drive IC 12 controls the power supply state (ON or OFF) of the heat generating unit 113 electrically connected via the individual electrode 114b based on the image data. The drive IC 12 is electrically connected to the individual electrode 114 b of the conductive layer 114 and the connection layer 115.

  4A and 4B are diagrams illustrating a schematic configuration of the flexible wiring member 13, wherein FIG. 4A is a plan view thereof, and FIG. 4B is a cross-sectional view taken along line IVb-IVb illustrated in FIG. .

The flexible wiring member 13 has a main body part 131 and a wiring part 132, and transmits an electric signal for driving the heat generating part 113 to the common electrode 114a and the driving IC 12. Examples of the electrical signal include power supplied to the heat generating unit 113 and the driving IC 12 and image information for selectively controlling the power supply state of the heat generating unit 113. Here, the flexibility means that the flexural modulus specified in JIS standard K7171 is, for example, 2.5 × 10 ³ [N / mm ² ] or more and 4.5 × 10 ³ [N / mm ² ] or less. Say.

The main body 131 supports the plurality of wiring parts 132 and ensures their electrical insulation. Examples of the constituent material of the main body 131 include flexible resin materials such as polyimide resins, epoxy resins, and acrylic resins. In the present embodiment, the main body 131 is made of a polyimide resin, and its thermal expansion coefficient is about 10 × 10 ⁻⁶ [K ⁻¹ ]. In addition, the main body 131 is provided with a slit 131 for accommodating the conductive connecting member 17 at the end on the substrate side.

The wiring part 132 is for transmitting an electric signal for driving the heat generating part 113 to the common electrode 114a and the driving IC 12, and is electrically conductive at one end of the common electrode 114a or the other end of the connection layer 115. It is electrically connected via a connecting member 17 and is electrically connected to the multilayer wiring board 14 at the other end. Examples of the constituent material of the wiring part 132 include platinum, gold, silver, copper, aluminum, and alloys thereof. In the present embodiment, the wiring part 132 is made of copper, and its thermal expansion coefficient is about 17 × 10 ⁻⁶ [K ⁻¹ ]. In the present embodiment, the wiring portions 132 extend in the direction of the arrow D1 and are spaced apart from each other in plan view. In addition, each wiring portion 132 has a central portion in a cross section along the longitudinal directions D2 and D3 arranged along the longitudinal directions D2 and D3. For this reason, the thermal expansion coefficient with respect to the longitudinal directions D2 and D3 of the flexible wiring member 13 of the present embodiment is substantially equal to the thermal expansion coefficient of the constituent material of the wiring part 132 due to the influence of the thermal expansion coefficient of the wiring part 132. Become. On the other hand, the coefficient of thermal expansion of the flexible wiring member 13 in the direction of arrow D1 is substantially equal to the coefficient of thermal expansion of the constituent material of the main body due to the influence of the thermal expansion coefficient of the main body 131. That is, the flexible wiring member 13 of the present embodiment has different thermal expansion coefficients in the arrow D1 direction and the longitudinal directions D2 and D3.

  FIG. 5 is an enlarged view of a main part showing a schematic configuration of the multilayer wiring board 14, (a) is a cross-sectional view along the longitudinal directions D 2 and D 3, and (b) is Vb− shown in (a). It is a top view along the Vb line.

  The multilayer wiring board 14 has a main body portion 141 and a wiring portion 142, and is used to transmit an electric signal for driving the heat generating portion 113 to the common electrode 114a and the driving IC 12. The multilayer wiring board 14 is configured as a laminated body of a plurality of wiring boards.

The main body 141 is for supporting the wiring part 142 and ensuring its electrical insulation. Examples of the constituent material of the main body 141 include ceramics, resins, and composite materials of ceramics and resins. Here, ceramics are alumina ceramics, aluminum nitride ceramics, silicon carbide ceramics, silicon nitride ceramics, glass ceramics, mullite sintered bodies, etc., and resins are epoxy resins, polyimide resins, acrylic resins, It is a thermosetting or ultraviolet curable resin such as a phenol resin or a polyester resin. In the present embodiment, the main body 141 is formed of glass fiber containing an epoxy resin, and its thermal expansion coefficient is about 14 × 10 ⁻⁶ [K ⁻¹ ]. Note that the thermal expansion coefficient of the multilayer wiring board 14 of the present embodiment is substantially equal to the thermal expansion coefficient of the constituent material of the main body 141 due to the influence of the thermal expansion coefficient of the main body 141. In the present embodiment, the main body 141 of the multilayer wiring board 14 is connected to the flexible wiring member 13 via the adhesive member 18 at one end located on the substrate 111 side in the arrow D1 direction.

  The wiring part 142 transmits an electric signal for driving the heat generating part 113 to the wiring part 132 constituting the flexible wiring member 13, and at the end thereof, the other end of the wiring part 132 or the external connection member 15. Are electrically connected. Examples of the constituent material of the wiring part 142 include platinum, gold, silver, copper, aluminum, and alloys thereof. In the present embodiment, the wiring portion 142 is formed on the main body portion 141 so as to extend in the arrow D1 direction and the longitudinal directions D2 and D3, and is possible at the other end portion located on the opposite side of the substrate 111 in the arrow D1 direction. The wiring part 132 constituting the flexible wiring member 13 is electrically connected via the conductive connection member 17. In addition, in this embodiment, a part of the plurality of wiring sections 142 branches an electric signal (for example, power supply power of the driving IC 12 or a reference operation signal of the driving IC 12) that is transmitted in common to a plurality of targets. The flexible wiring member 13 is electrically connected to the plurality of wiring parts 132.

  The external connection member 15 is for inputting an electric signal for driving the heat generating portion 113 and is electrically connected to each wiring portion 142 constituting the multilayer wiring board 14.

  The radiator 16 is for radiating the heat generated by driving the heat generating portion 113 to the outside (for example, an external space). In the present embodiment, the radiator 16 functions as a support base material for the base 11 and the multilayer wiring board 14. Examples of the constituent material of the radiator 16 include a metal material such as copper or aluminum, a material obtained by mixing a thermosetting or ultraviolet curable resin material with a material having high thermal conductivity. Here, the material having high thermal conductivity has higher thermal conductivity than the material constituting the substrate 111, and examples thereof include metal materials and carbon nanotubes.

  The conductive connection member 17 includes the common electrode 114a or the connection layer 115 of the conductive layer 114 and the wiring part 132 constituting the flexible wiring member 13, and the wiring part 132 constituting the flexible wiring member 13 and the multilayer wiring board. 14 for electrically connecting the wiring part 142 constituting the circuit 14. Examples of the conductive connection member 17 include solder and anisotropic conductive material. Further, a part of the conductive connection member 17 of this embodiment is accommodated in the slit portion 131 a of the main body portion 131 of the flexible wiring member 13.

  The adhesive member 18 is for sticking the flexible wiring member 13 and the multilayer wiring board 14 together. Examples of the adhesive member 18 include acrylic and silicone adhesives, double-sided adhesive tapes, and the like.

  The transport mechanism 20 is for bringing the recording medium P into contact with the heat generating part 113 of the thermal head 10 while transporting the recording medium P in the direction of the arrow D1, and includes a platen roller 21 and transport rollers 22, 23, 24, 25.

  The platen roller 21 is for pressing the recording medium P against the heat generating part 113 and is rotatably supported in contact with the heat generating part 113. The platen roller 21 has a configuration in which the outer surface of a columnar base is covered with an elastic member. The base is made of metal such as stainless steel, and the elastic member is made of butadiene rubber having a thickness of 3 mm to 15 mm, for example.

  The transport rollers 22, 23, 24, and 25 are for transporting the recording medium P along a predetermined path. That is, the transport rollers 22, 23, 24, and 25 supply the recording medium P between the heat generating portion 113 of the thermal head 10 and the platen roller 21, and between the heat generating portion 113 of the thermal head 10 and the platen roller 21. The recording medium P is extracted from the recording medium P. These transport rollers 22, 23, 24, and 25 may be formed of a metal columnar member, or, like the platen roller 21, have a configuration in which the outer surface of the columnar substrate is covered with an elastic member. Also good.

  The driving means 30 inputs an electric signal for driving the heat generating portion 113 to the external connection member 15 so as to selectively generate Joule heat in the heat generating portion 113, and the flexible wiring member 13 and the multilayer wiring board 14 are input. This is for supplying image information to the driving IC 12 via.

  In the thermal head 10, the wiring part 132 which comprises the flexible wiring member 13 is extended in the arrow D1 direction. Therefore, in the thermal head 10, for example, even if heat from the plurality of heat generating portions 113 is transmitted to the wiring portion 132 that constitutes the flexible wiring member 13, the substrate from the flexible wiring member 13 is caused by the thermal expansion. Of the stresses acting on 111, the stresses acting in the directions of arrows D4 and D5 (thickness direction of substrate 111) can be sufficiently reduced. Therefore, in the thermal head 10, it is possible to suppress the contact state between the recording medium P and each heat generating portion 113 from being different due to the curvature of the substrate 111.

  In the thermal head 10, the substrate 111 and the multilayer wiring substrate 14 are connected via the flexible wiring member 13. Therefore, in the thermal head 10, even if a stress acting in the directions of arrows D 4 and D 5 is generated in the multilayer wiring board 14 due to thermal expansion, the stress can be relaxed in the flexible wiring member 13. Therefore, in the thermal head 10, it is possible to suppress the contact state between the recording medium P and each heat generating portion 113 from being different due to the curvature of the substrate 111.

  Further, in the thermal head 10, it is electrically connected to the wiring part 132 constituting the flexible wiring member 13, and at least a part thereof extends in the longitudinal directions D2 and D3 (direction intersecting the arrow D1 direction). Exist. Therefore, in the thermal head 10, the external connection that is narrower than the connection region in which the wiring part 132 that constitutes the flexible wiring member 13 and the wiring part 142 that constitutes the multilayer wiring board 14 are electrically connected. Even in the connection region that is electrically connected to the member 15, it can be properly routed.

  From the above, the thermal head 10 is suitable not only for forming a good image, but also for maintaining the degree of freedom of wiring.

  In the thermal head 10, the flexible wiring member 13 has a plurality of wiring portions 132, and the plurality of wiring portions 132 are arranged apart from each other in the plan view in the direction of the arrow D <b> 1. The flexibility of the flexible wiring member 13 with respect to the D5 direction can be increased. Therefore, in the thermal head 10, even if a stress acting in the directions of arrows D 4 and D 5 is generated in the multilayer wiring board 14 due to thermal expansion, the stress can be relaxed in the flexible wiring member 13. Therefore, in the thermal head 10, it can suppress that the contact state of the recording medium P and each heat-emitting part 113 resulting from the curvature of the board | substrate 111 differs, and can form a more favorable image by extension. It can be done.

  In the thermal head 10, the flexible wiring member 13 includes a plurality of wiring portions 132, and the central portions of the cross sections along the longitudinal directions D2 and D3 of the wiring portions 132 are arranged along the longitudinal directions D2 and D3. Therefore, the flexibility of the flexible wiring member 13 in the directions of arrows D4 and D5 can be further increased. Therefore, in the thermal head 10, it is possible to further suppress the contact state between the recording medium P and each heat generating portion 113 due to the curvature of the substrate 111, thereby forming a better image. Can do it.

  In the thermal head 10, the multilayer wiring board 14 is electrically connected to the flexible wiring member 13 at the other end located on the opposite side to the one end located on the substrate 111 side. Even if a stress acting in the directions of the arrows D4 and D5 is generated in the multilayer wiring board 14 due to thermal expansion by increasing the wiring length in the direction of the arrow D1, the flexible wiring member 13 Can be relaxed. Therefore, in the thermal head 10, it can suppress that the contact state of the recording medium P and each heat-emitting part 113 resulting from the curvature of the board | substrate 111 differs, and can form a still more favorable image by extension. It can be done.

In the thermal head 10, since it is connected to the multilayer wiring board 14 has one end the flexible wiring member 13 via an adhesive member 18 (end located on the head substrate side), the flexible wiring to the substrate 111 The positioning accuracy of the end portion of the member 13 on the substrate 111 side can be increased. Therefore, in the thermal head 10, even if the connection position between the flexible wiring member 13 and the multilayer wiring substrate 14 is separated from the substrate 111, the wiring portion 132 constituting the flexible wiring member 13 and the conductive layer 114 included in the substrate 111. Connection reliability with the common electrode 114a and the connection layer 115 can be improved.

  In the thermal head 10, since the flexible wiring member 13 has the slit portion 131 a that houses the conductive connection member 17 for electrically connecting to the common electrode 114 a of the conductive layer 114, the conductive connection member 17. Surplus portions such as solder used as can be accommodated in the slit portion 131a. Therefore, in the thermal head 10, the uniformity of the thickness of the conductive connecting member 17 interposed between the substrate 111 and the flexible wiring member 13 is improved, and the arrow D4 is caused by the variation in the thickness of the conductive connecting member 17. , It is possible to suppress variation in the force acting on the substrate 111 from the flexible wiring member 13 in the D5 direction. Therefore, in the thermal head 10, it is possible to suppress the array of the heat generating portions 113 from being curved due to the variation in stress at the connection portion between the substrate 111 and the flexible wiring member 13, and thus to form a good image. Can do it.

  Since the thermal printer X includes the thermal head 10, it can enjoy the effects of the thermal head 10. Therefore, the thermal printer X can form a good image.

  Although specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  The substrate 11 according to the present embodiment constitutes the thermal head 10, but is not limited to such an application, and may be applied to an inkjet head having a heat generating portion 113. In the ink jet head having such a configuration, the arrangement of the heat generating portions 113 can be suppressed from being curved, so that the accuracy of ink deposition can be increased, and as a result, a good image can be formed. .

  The flexible wiring member 13 according to the present embodiment is configured such that the power supplied to the heat generating portion 113 is transmitted to the common electrode 114a, but is not limited to this configuration, and the driving IC 12 generates heat. The power supplied to the unit 113 may be transmitted. In this case, electric power is supplied to the heat generating portion 113 via the individual electrode 114b.

  A part of the wiring part 132 constituting the flexible wiring member 13 according to the present embodiment may extend in the longitudinal directions D2 and D3.

  The external connection member 15 according to the present embodiment is electrically connected to the multilayer wiring board 14, but is not limited to such a configuration, and is electrically connected to the flexible wiring member 13. Also good.

1 is an overall view illustrating a schematic configuration of a thermal printer X according to an embodiment. It is a figure showing schematic structure of the thermal head 10 concerning this embodiment, (a) is the top view, (b) is a side view of (a). It is a figure showing schematic structure of the base | substrate 11 which concerns on this embodiment, (a) is the top view, (b) is sectional drawing along the IIIb-IIIb line | wire shown to (a). It is a figure showing schematic structure of the flexible wiring member 13, (a) is the top view, (b) is sectional drawing along the IVb-IVb line | wire shown to (a). It is a principal part enlarged view showing schematic structure of the multilayer wiring board 14, (a) is sectional drawing along longitudinal direction D2, D3, (b) is along the Vb-Vb line | wire shown to (a). FIG.

Explanation of symbols

X Thermal printer (recording device)
10 Thermal head (recording head)
11 Substrate 111 Substrate 112 Heat storage layer 113 Heat generating part 114 Conductive layer 114a Common electrode (part of first wiring)
114b Individual electrode 115 connection layer (part of first wiring)
116 Protective layer 12 Drive IC (control element)
13 Flexible Wiring Member 131 Main Body 132 Wiring Portion (Second Wiring)
14 Multilayer Wiring Board 141 Body 142 Wiring (Third Wiring)
15 External Connection Member 16 Heat Dissipator 17 Conductive Connection Member 18 Adhesive Member 20 Transport Mechanism 21 Platen Rollers 22, 23, 24, 25 Transport Roller 30 Drive Unit

Claims (7)

A plurality of heat generating units arranged in a first direction, a control element for controlling driving of the plurality of heat generating units, and a plurality of first wirings electrically connected to at least one of the plurality of heat generating units and the control element And a head substrate having
A flexible wiring member having a second wiring electrically connected to the first wiring and extending in a second direction intersecting the first direction, and having a thermal expansion coefficient different from that of the head substrate;
A multilayer wiring board having a third wiring electrically connected to the second wiring and extending in a third direction at least partially intersecting the second direction and having a thermal expansion coefficient different from that of the head substrate And a recording head. The flexible wiring member includes a plurality of the second wirings, and the plurality of second wirings are arranged apart from each other in the first direction in a plan view. Item 2. The recording head according to Item 1. The flexible wiring member has a plurality of the second wirings, and a central portion of each second wiring in a cross section along the first direction is arranged along the first direction. The recording head according to claim 1, wherein the recording head is characterized. The multilayer wiring board is electrically connected to the flexible wiring member at a second end located opposite to the first end located on the head substrate side. The recording head according to any one of 1 to 3. 5. The multilayer wiring board according to claim 1, wherein the multilayer wiring board is connected to the flexible wiring member via an adhesive member at a first end located on the head substrate side. 6. Recording head. The said flexible wiring member has a slit part which accommodates the electrical connection member for electrically connecting with the said 1st wiring, The one in any one of Claim 1 to 5 characterized by the above-mentioned. Recording head. A recording apparatus comprising: the recording head according to claim 1; and a transport mechanism for transporting a recording medium toward a plurality of heat generating units in the recording head.

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